CN112533381A - Method for manufacturing mother board - Google Patents
Method for manufacturing mother board Download PDFInfo
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- CN112533381A CN112533381A CN202011383660.4A CN202011383660A CN112533381A CN 112533381 A CN112533381 A CN 112533381A CN 202011383660 A CN202011383660 A CN 202011383660A CN 112533381 A CN112533381 A CN 112533381A
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- prepreg
- board
- copper
- area
- sub
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 107
- 239000010949 copper Substances 0.000 claims abstract description 63
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
- 238000002788 crimping Methods 0.000 claims abstract description 53
- 239000011889 copper foil Substances 0.000 claims abstract description 48
- 239000000126 substance Substances 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 abstract description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 7
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000003814 drug Substances 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000003755 preservative agent Substances 0.000 description 2
- 230000002335 preservative effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
本发明公开了一种母板制作方法，其包括：提供子板、铜块、半固化片和铜箔，所述铜块的表面形成有有机膜；在所述压接孔区域的周围进行开槽处理，以在所述子板的表面形成辅助槽，所述辅助槽的首尾相接以围成围蔽区域，所述压接孔区域位于所述围蔽区域内；将所述铜块埋入所述辅助槽内；将两块所述子板相互叠置，在每一所述子板的围蔽区域上依次叠放半固化片和铜箔并进行压合处理以形成母板，所述铜箔通过所述半固化片粘结在所述围蔽区域上；对所述母板进行激光开盖处理，以清除压接于所述围蔽区域上方的铜箔；本发明能够增加半固化片与子板之间的化学结合力，有效避免因半固化片脱落而使压接孔受到药水的侵蚀而损坏。
The invention discloses a method for manufacturing a motherboard, which comprises: providing a daughterboard, a copper block, a prepreg and a copper foil, wherein an organic film is formed on the surface of the copper block; performing a grooving process around the crimping hole area to form an auxiliary groove on the surface of the daughterboard, wherein the auxiliary grooves are connected end to end to enclose an enclosed area, and the crimping hole area is located in the enclosed area; burying the copper block in the auxiliary groove; stacking two daughterboards on each other, sequentially stacking a prepreg and a copper foil on the enclosed area of each daughterboard and performing a pressing process to form a motherboard, wherein the copper foil is bonded to the enclosed area through the prepreg; performing a laser cover opening process on the motherboard to remove the copper foil crimped on the enclosed area; the invention can increase the chemical bonding force between the prepreg and the daughterboard, and effectively prevent the crimping hole from being damaged by the erosion of the potion due to the falling of the prepreg.
Description
Technical Field
The invention relates to the field of circuit board processing and manufacturing, in particular to a motherboard manufacturing method.
Background
The circuit board of the current double-sided compression joint process is mainly manufactured in an N + N mode for the asymmetrical design of compression joint holes in two sides of the circuit board, namely two daughter boards with N layers of core boards are pressed to obtain a mother board of the circuit board. When the two daughter boards are pressed into the mother board, the compression joint holes are protected in a copper foil and prepreg mode, and the compression joint holes are prevented from being damaged due to erosion of liquid medicine when wet processes and the like are carried out on the mother board. When the copper foil and the prepreg are used for protecting the crimping holes, the surface treatment is finished in the crimping hole area, and only physical bonding force exists between the prepreg and gold surfaces (tin surfaces, silver surfaces, green oil and the like) in the crimping hole area, so that the bonding force is weak. In the subsequent manufacturing process, a joint surface between the prepreg and the crimping hole area is easy to fall off under the action of external force, so that the protection of the copper foil on the crimping hole is lost, the crimping hole is directly exposed to the external environment, and the prepreg and the crimping hole area are easy to be corroded by liquid medicine and damaged.
Therefore, a solution to the above problem is needed.
Disclosure of Invention
The invention aims to provide a mother board manufacturing method which can increase the chemical bonding force between a prepreg and a daughter board on the basis of the physical bonding force between the prepreg and a crimping hole area, and effectively avoid the problem that the crimping hole is corroded by liquid medicine and damaged due to the falling of the prepreg.
In order to achieve the purpose, the invention discloses a motherboard manufacturing method, which comprises the following steps:
s1, providing a daughter board, a copper block, a prepreg and copper foil, wherein an organic film is formed on the surface of the copper block, and the organic film and the prepreg can form chemical bonding;
s2, carrying out hole opening treatment on the daughter board to form a crimping hole on the surface of the daughter board, wherein the crimping hole forms a crimping hole area on the surface of the daughter board;
s3, grooving around the crimping hole area to form an auxiliary groove on the surface of the daughter board, wherein the auxiliary groove is connected end to form a shielding area, and the crimping hole area is located in the shielding area;
s4, burying the copper block into the auxiliary groove;
s5, mutually overlapping the two daughter boards, wherein one surface of each daughter board, which is provided with the shielding area, faces outwards, sequentially overlapping a prepreg and a copper foil on the shielding area of each daughter board, and performing pressing treatment to form a mother board, wherein the copper foil is bonded on the shielding area through the prepreg;
s6, carrying out laser uncapping treatment on the motherboard to remove copper foils except the copper foil pressed on the upper part of the shielding area;
s7, making an outer layer pattern of the mother board and milling the shape of the mother board;
and S8, carrying out laser uncapping treatment on the motherboard to remove the copper foil pressed above the shielding area.
Compared with the prior art, the auxiliary groove is arranged around the crimping hole area, the crimping hole area is enclosed in the enclosed area enclosed by the auxiliary groove, the copper block is embedded in the auxiliary groove, and the organic film capable of forming chemical bonding with the prepreg is formed on the surface of the copper block2SO4→CuSO4+H2O and CuSO4+2[R,R’]n→Cu[R,R’]nSO4The chemical reaction of the copper block and the prepreg can generate chemical bonding force, so that the prepreg can be more firmly bonded on the shielding area under the dual actions of the physical bonding force and the chemical bonding force, and the copper foil pressed on the prepreg can be more firmly bonded on the shielding area to protect the crimping hole from being corroded by liquid medicine; on the other hand, the copper block has better heat-conducting property, so that the heat dissipation performance of the whole motherboard can be effectively improved.
Preferably, step (1) is preceded by:
s101, performing brown oxidation treatment on the copper block to form the organic film on the surface of the copper block.
Preferably, the step (4) further comprises:
and S41, injecting an adhesive material into the auxiliary groove to adhere and fix the copper block in the auxiliary groove.
Specifically, the adhesive material is pure glue.
Preferably, the height of the copper block is consistent with the groove height of the auxiliary groove, so that the copper block is flush with the notch of the auxiliary groove.
Preferably, step (3) is preceded by:
s301, performing surface treatment on the crimping hole area.
Preferably, the step (301) specifically includes:
s3011, carrying out copper plating treatment, gold plating treatment or organic solderability preservative treatment on the crimping hole area.
Preferably, step (5) is preceded by:
s501, windowing is carried out at the position, corresponding to the crimping hole, of the prepreg.
Preferably, a plurality of the crimping holes are formed on the surface of the daughter board, and the crimping holes are distributed on the surface of the daughter board in a matrix manner.
Preferably, the daughter board is formed by laminating a plurality of core boards.
Preferably, the inner layer of the core board is printed with circuit patterns in advance.
Drawings
FIG. 1 is a flow chart of a method of making a master plate of the present invention.
Fig. 2 is a plan view of the daughter board of the present invention after a crimp hole is formed.
Fig. 3 is a cross-sectional view of fig. 2.
Fig. 4 is a top view of the daughter board of the present invention after the opening of the auxiliary slot.
Fig. 5 is a cross-sectional view of fig. 4.
Fig. 6 is a plan view of the auxiliary groove of the present invention after the copper block is embedded.
Fig. 7 is a cross-sectional view of fig. 6.
Fig. 8 is a cross-sectional view of two daughter boards according to the present invention after laminating prepreg and copper foil on the corresponding shielding area of each daughter board.
Fig. 9 is a cross-sectional view of the mother substrate of the present invention after removing the copper foil except the copper foil laminated over the enclosed region.
Fig. 10 is a cross-sectional view of the mother substrate of the present invention after removing the copper foil laminated over the enclosed region.
Fig. 11 is a sectional view of the prepreg remaining in fig. 10 after peeling off.
FIG. 12 is a schematic view of the relationship of the crimp hole region and the containment region of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1-12, the present invention discloses a method 100 for manufacturing a mother board, which is suitable for manufacturing a mother board 50 having two-sided crimping holes 11, and the method includes the following steps:
s1, providing the daughter board 10, the copper block 20, the prepreg 30 and the copper foil 40, wherein an organic film is formed on the surface of the copper block 20, and the organic film can be chemically bonded with the prepreg 30.
The daughter board 10 has at least one core board 13, and preferably, the daughter board 10 is formed by laminating multiple layers of core boards 13, so that the mother board 50 made of the daughter board 10 is suitable for performing multiple layers of circuit wiring, so as to improve the circuit integration rate of the mother board 50. Preferably, the inner layer of the core 13 is previously printed with a circuit pattern, and different cores 13 are printed with a specific circuit pattern according to the use requirement, so that the mother board 50 having a multi-layer printed circuit pattern is produced. The embodiment of the daughter board 10 having four layers of core boards 13 is given in this embodiment, and of course, the number of core boards 13 of the daughter board 10 is selected according to actual production requirements, and is not limited herein.
S2, opening the sub-board 10 to form a crimp hole 11 on the surface of the sub-board 10, wherein the crimp hole 11 forms a crimp hole region 1 on the surface of the sub-board 10.
Preferably, the surface of the daughter board 10 of the present invention is provided with a plurality of crimp holes 11, the crimp holes 11 are distributed on the surface of the daughter board 10 in a matrix manner as shown in fig. 2, so as to facilitate flexible insertion of subsequent electronic components, and at this time, the crimp hole region 1 is rectangular. While the present invention shows only an embodiment having one crimp hole region 1 on the sub-board 10, in other embodiments, the sub-board 10 may have more than one crimp hole region 1.
And S3, grooving around the crimping hole area 1 to form an auxiliary groove 12 on the surface of the sub-board 10, wherein the auxiliary groove 12 is connected end to enclose a shielding area 2, and the crimping hole area 1 is positioned in the shielding area 2.
In this step, the groove depth of the auxiliary groove 12 is set according to the thickness of the sub-board 10, and as shown in fig. 5, the groove depth of the auxiliary groove 12 needs to be smaller than the thickness of the sub-board 10 to avoid the influence of the auxiliary groove 12 penetrating the sub-board 10 on the subsequent operation. Since the crimp hole region 1 in step (2) has a rectangular shape, the shielding region 2 here also has a rectangular shape. Fig. 12 schematically shows a relationship between the crimp hole region 1 and the enclosure region 2.
S4, burying the copper block 20 in the auxiliary groove 12.
Preferably, the height of the copper block 20 is consistent with the groove height of the auxiliary groove 12, so that the notches of the copper block 20 and the auxiliary groove 12 are flush with each other as shown in fig. 7, so that in the subsequent pressing operation, the prepreg 30 can be synchronously contacted and pressed with the copper block 20 and the shielding area 2, and the influence on the yield due to the asynchronous contact and pressing between the copper block 20 and the shielding area 2 is avoided.
S5, stacking the two daughter boards 10 with one surface of each daughter board 10 having the shielding region 2 facing outward, sequentially stacking a prepreg 30 and a copper foil 40 on the shielding region 2 of each daughter board 10, and performing a pressing process to form a mother board 50, wherein the copper foil 40 is bonded to the shielding region 2 through the prepreg 30.
In a specific operation, the size of the prepreg 30 is slightly larger than or equal to the size of the shielding region 2, so as to save the material of the prepreg 30 and reduce the difficulty in cleaning the subsequent prepreg 30. The size of the copper foil 40 is generally equal to or slightly larger than that of the daughter board 10, so that all the shielding regions 2 on the daughter board 10 can be covered by a single copper foil 40. Of course, the copper foils 40 with different sizes can be cut according to the areas of the different shielding areas 2 to cover the shielding areas 2 individually, so as to save the usage amount of the copper foils 40. Because the enclosing area 2 is rectangular, the prepreg 30 is also rectangular, the rectangular prepreg 30 is convenient to produce and cut, the preparation difficulty is effectively reduced, and the raw material cost is saved.
It can be understood that all the crimping holes 11 of the two pressed daughter boards 10 are aligned one by one as shown in fig. 8, or only part of the crimping holes 11 may be aligned one by one, and the aligned crimping holes 11 form a communication structure, and the communication structure communicates with the upper and lower surfaces of the motherboard 50, so as to facilitate flexible plugging of subsequent electronic components.
During the pressing treatment, the prepreg 30, the copper block 20 and the daughter board 10 are synchronously contacted and pressed on the surface of the shielding region 2, on one hand, the prepreg 30 and the surface of the daughter board 10 corresponding to the shielding region 2 generate physical bonding force, and on the other hand, the organic film on the surface of the copper block 20 and the high bonding molecules of the prepreg 30 generate CuO + H2SO4→CuSO4+H2O and CuSO4+2[R,R’]n→Cu[R,R’]nSO4So as to generate a chemical bonding force between the copper block 20 and the prepreg 30, so that the prepreg 30 can be more firmly bonded on the enclosed area 2 under the dual actions of the physical bonding force and the chemical bonding force, so that the copper foil 40 pressed on the prepreg 30 can be better bonded on the enclosed area 2, thereby forming a covering protection for the orifices of the respective crimping holes 11, and preventing the chemical liquid from infiltrating from the orifices of the crimping holes 11 to corrode the crimping holes 11.
S6, performing a laser uncapping process on the motherboard 50 to remove the copper foil 40 except the copper foil 40 laminated on the shielding region 2, so that the rest of the motherboard 50 is exposed to the external environment for making an outer layer pattern.
At this time, as shown in fig. 9, each of the crimp holes 11 is covered with a copper foil 40, i.e., each of the crimp holes 11 is protected by the copper foil 40.
S7, manufacturing an outer layer pattern of the mother board 50 and milling the shape of the mother board 50.
In the step (6), the copper foils 40 except the copper foil 40 pressed on the upper portion of the shielding region 2 are removed, so that the upper and lower surfaces of the motherboard 50 are exposed to the external environment except the shielding region 2, and the outer layer pattern manufacturing and the profile milling processing of the motherboard 50 are performed.
In addition, the outer layer pattern making and/or the contour milling treatment in the step may involve a wet process treatment on the mother board 50, and since the copper foil 40 covers the upper portion of each crimping hole 11 at this time, and the copper foil 40 has strong corrosion resistance, the copper foil 40 seals the orifice of the crimping hole 11 under the action of the prepreg 30, and the damage of the crimping hole 11 caused by the liquid medicine in the wet process treatment permeating into the crimping hole 11 from the orifice is avoided.
S8, performing a laser uncapping process on the motherboard 50 to remove the copper foil 40 bonded above the shielding region 2.
Thus, the processing and fabrication of the dual crimp holes 11 of the master 50 are completed, and the finished master 50 shown in fig. 8 is obtained.
Preferably, step (1) is preceded by:
s101, performing brown oxidation treatment on the copper block 20 to form the organic film on the surface of the copper block 20.
Wherein the chemical reaction mechanism of the copper block 20 brown oxidation is 2Cu + H2SO4+H2O2+nR1+nR2→CuSO4+2H2O+Cu(R1+R2) Copper block 20 at H2O2Under the action of the microetching, a thin organic film (which is a metal film) is immediately deposited on the surface of the copper block 20 to increase the bonding force between the prepreg 30 and the surface of the copper block 20. The browning treatment process of the copper block 20 is a common process in the field of circuit board manufacturing, and detailed description of the specific treatment process is omitted here.
Preferably, the step (4) further comprises:
s41, injecting an adhesive material into the auxiliary groove 12 to adhesively fix the copper block 20 in the auxiliary groove 12.
Specifically, the adhesive material is pure glue such as pure resin, which can effectively adhere the copper block 20 in the auxiliary groove 12. The copper block 20 is further fixed in the auxiliary groove 12 by an adhesive material, and the copper block 20 is further prevented from falling off due to shaking. Of course, the adhesive material may be other materials capable of fixing the copper block 20 in the auxiliary groove 12, and the adhesive material is not limited herein.
Preferably, step (3) is preceded by:
and S301, performing surface treatment on the crimping hole area 1.
Preferably, the step (301) specifically includes:
s3011, carrying out copper plating treatment, gold plating treatment or organic solderability preservative film treatment on the pressure welding hole area 1. After the surface treatment of the crimp hole region 1 is completed, the surface of the crimp hole region after the surface treatment has poor adhesion to the prepreg 30, so that the prepreg 30 is easily peeled off naturally or by an external force in step (8) to obtain the mother board 50 shown in fig. 11.
It should be noted that the prepreg 30 according to the present embodiment is preferably a NO-FLOW prepreg 30(NO-FLOW-PP), and certainly, the prepreg 30 may also be a LOW-FLOW prepreg 30(LOW-FLOW-PP) or other materials capable of bonding with the core 13, the copper metal and the browned copper metal, and the prepreg 30 is a conventional material for manufacturing a multilayer circuit board, and details thereof are not described herein.
Preferably, step (5) is preceded by:
and S501, performing windowing processing on the position, corresponding to the crimping hole 11, of the prepreg 30. The purpose of this step is to avoid contamination of the crimp holes 11 due to the prepreg 30 existing above the crimp holes 11, which could cause the prepreg 30 to penetrate into the crimp holes 11 during the press-fitting.
Referring to fig. 1 to 12, in the method 100 for manufacturing a mother board according to the present invention, the auxiliary groove 12 is disposed around the crimping hole region 1, the crimping hole region 1 is enclosed in the enclosed region 2 enclosed by the auxiliary groove 12, and the browned copper block 20 is embedded in the auxiliary groove 12, so that, on one hand, when the prepreg 30 and the copper foil 40 are sequentially stacked on the enclosed region 2 and then subjected to the pressing process, the prepreg 30 and the enclosed region 2 on the surface of the daughter board 10 generate a physical bonding force, and since the prepreg 30 and the copper foil 40 are sequentially stacked on the enclosed region 2 and then subjected to the pressing process, the physical bonding force isThe browned copper block 20 has an organic film on its surface, which can react with the highly bonded molecules of the prepreg 30 to form CuO + H2SO4→CuSO4+H2O and CuSO4+2[R,R’]n→Cu[R,R’]nSO4So as to generate a chemical bonding force between the copper block 20 and the prepreg 30, so that the prepreg 30 can be more firmly bonded to the enclosed area 2 under the dual bonding force of the physical bonding force and the chemical bonding force, so that the copper foil 40 pressed on the prepreg 30 can be more firmly bonded to the enclosed area 2, thereby protecting the crimp holes 11 from the corrosion of the chemical solution; on the other hand, the copper block 20 is embedded in the daughter board 10, and the heat dissipation performance of the motherboard 50 is effectively improved due to the higher thermal conductivity of the copper block 20.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011383660.4A CN112533381B (en) | 2020-12-01 | 2020-12-01 | Motherboard production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011383660.4A CN112533381B (en) | 2020-12-01 | 2020-12-01 | Motherboard production method |
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| CN112533381A true CN112533381A (en) | 2021-03-19 |
| CN112533381B CN112533381B (en) | 2022-02-15 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225940A (en) * | 2021-04-30 | 2021-08-06 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN118175760A (en) * | 2024-03-14 | 2024-06-11 | 四川英创力电子科技股份有限公司 | Processing method of multi-step groove and printed circuit board |
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| CN113225940B (en) * | 2021-04-30 | 2022-06-21 | 生益电子股份有限公司 | How to make PCB |
| CN118175760A (en) * | 2024-03-14 | 2024-06-11 | 四川英创力电子科技股份有限公司 | Processing method of multi-step groove and printed circuit board |
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