CN112911830A - Method for manufacturing any-layer high-density interconnection flexible printed circuit board - Google Patents
Method for manufacturing any-layer high-density interconnection flexible printed circuit board Download PDFInfo
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- CN112911830A CN112911830A CN202011498103.7A CN202011498103A CN112911830A CN 112911830 A CN112911830 A CN 112911830A CN 202011498103 A CN202011498103 A CN 202011498103A CN 112911830 A CN112911830 A CN 112911830A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing any layer of high-density interconnected flexible printed circuit board, which comprises the following steps: drilling a first blind hole on a double-sided copper-clad flexible substrate, then manufacturing an inner layer circuit on the substrate, and then filling conductive ink in the first blind hole and curing to form a first sub-board; sticking a protective film on the non-copper surface of the single-sided copper-clad flexible substrate, drilling a second blind hole corresponding to the first blind hole on the surface stuck with the protective film, and then manufacturing an inner-layer circuit on the board; filling conductive ink in the second blind hole, curing, and tearing off the protective film to form a second sub-board; sequentially laminating the second sub-board and the first sub-board through PP sheets and then pressing the laminated boards into a production board, and enabling the conductive printing ink in the first sub-board and the conductive printing ink in the second sub-board to be communicated up and down; and then sequentially carrying out post-processes on the production board to obtain the high-density interconnection flexible board. The method realizes one-step pressing of the multi-step blind hole soft board, and solves the problems of high manufacturing difficulty, long manufacturing period, high scrapping risk and the like in the prior art.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a high-density interconnection flexible printed circuit board with any layer.
Background
The flexible printed circuit board is a kind of printed circuit board product which is designed and manufactured by carrying out circuit pattern design on a flexible base material in a printing mode. The high-density interconnection soft board of any layer combines high-density blind buried holes and flexible design, has the characteristics of high wiring density, light weight, thin thickness, good bending property and the like, has wide application in the fields of smart phones, flat panels, wearable electronic equipment and the like, and is a hot PCB product.
The existing arbitrary layer high-density interconnection soft board manufacturing technology uses a double-sided copper-clad flexible substrate (CCL) to be manufactured by repeatedly drilling laser blind holes, electroplating filling holes and pressing, and the specific flow comprises the following steps: cutting → drilling laser positioning hole → laser drilling → Plasma removing glue residue → black shadow → electroplating filling hole → circuit pattern → AOI → pressing → repeating laser blind hole, electroplating filling hole → circuit pattern → silk screen solder resist → silk screen character → surface processing → molding → electric measurement → FQC → FQA → packaging.
In the method, any layer of high-density interconnection soft board manufacturing technology needs to repeat repeated lamination, laser blind hole and electroplating filling process accumulation, and due to the characteristics that the flexible substrate is lighter and thinner, is easy to deform, has weak machinability and the like compared with a common rigid plate, the electroplating filling process has high difficulty, meanwhile, due to the long process flow, the scrapping risks such as product layer deviation and the like are increased, and the manufacturing cost is high.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing any layer of high-density interconnected flexible boards, which is formed by laminating a double-sided copper-clad flexible substrate and a single-sided copper-clad flexible substrate at one time, so that the multi-step blind hole flexible board is laminated at one time, the quality problem caused by repeated laser blind hole, electroplating filling hole and lamination laminating manufacturing in the conventional technology is avoided, the product quality is ensured, and the production cost is reduced.
In order to solve the technical problem, the invention provides a method for manufacturing any layer of high-density interconnected flexible printed circuit board, which comprises the following steps:
s1, drilling a first blind hole communicating an upper layer copper foil and a lower layer copper foil on the double-sided copper-clad flexible substrate in a depth-controlled manner through laser;
s2, manufacturing an inner layer circuit on the double-sided copper-clad flexible substrate through a negative film process;
s3, filling conductive ink in the first blind hole and curing to manufacture and form a first sub-board;
s4, attaching a protective film on the non-copper surface of the single-sided copper-clad flexible substrate, then drilling a second blind hole communicated with the copper foil on the other surface of the single-sided copper-clad flexible substrate in a depth-controlled manner through laser on the surface attached with the protective film, wherein the position of the second blind hole corresponds to the position of the first blind hole up and down;
s5, manufacturing an inner layer circuit on the copper surface of the single-sided copper-clad flexible substrate through a negative film process;
s6, filling conductive ink in the second blind hole, curing, and tearing off the protective film to form a second sub-board;
s7, sequentially stacking the second sub-board and the first sub-board through PP sheets and then pressing the second sub-board and the first sub-board into a production board, wherein the first sub-board is positioned in the middle of the stack, at least one second sub-board is stacked on two surfaces of the first sub-board in an accumulated mode, the non-copper surface in the second sub-board faces the first sub-board, a windowing part is arranged at the position, corresponding to the second blind hole, on the PP sheet, and conductive ink in the second blind hole penetrates through the windowing part and then is communicated with the conductive ink in the first blind hole up and down;
and S8, sequentially manufacturing an outer layer circuit, a solder mask layer, silk-screen characters, surface treatment and molding on the production board to obtain the high-density interconnection flexible printed circuit board.
Further, in steps S1 and S4, laser positioning holes are drilled in the board before drilling the first blind hole and the second blind hole.
Further, in step S1, the bottom of the first blind via is the inner surface of the copper foil at the non-drilling surface.
Further, in step S4, the bottom of the second blind via is an inner surface of the copper foil at the copper surface.
Further, in step S4, the protective film is a PET film.
Furthermore, the thickness of the protective film is less than or equal to that of the PP sheet.
Further, in steps S3 and S6, the holes are subjected to plasma desmear treatment before the first and second blind holes are filled with conductive ink.
Further, in steps S3 and S6, conductive ink is filled in the first blind via and the second blind via by screen printing and filled up.
Further, in step S7, the size of the window is 50 μm larger than the diameter of the second blind hole.
Further, in step S7, windowing is performed in the PP sheet at a position corresponding to the second blind hole by means of laser cutting.
Compared with the prior art, the invention has the following beneficial effects:
the invention is formed by laminating a double-sided copper-clad flexible substrate and a single-sided copper-clad flexible substrate at one time, blind holes which are communicated up and down after lamination are respectively manufactured on the double-sided copper-clad flexible substrate and the single-sided copper-clad flexible substrate, and the blind holes are filled by conductive ink, so that the one-time lamination of a multi-stage blind hole flexible board is realized, the whole process flow is effectively reduced, the manufacturing period is shortened, the rejection risk is reduced, the quality problem caused by the conventional technology that multiple laser blind holes, electroplating filling holes and lamination manufacturing are used is avoided, the problems of high manufacturing difficulty, long manufacturing period, high rejection risk and the like in the prior art are solved, the manufacturing quality of a product is ensured, and the; the thickness of the protective film is smaller than or equal to that of the PP sheet, so that the height of the conductive ink protruding plate surface filled in the second blind hole is smaller than or equal to that of the PP sheet, the conductive ink in the second blind hole downwards penetrates through the windowing to be communicated with the conductive ink in the first blind hole during pressing, meanwhile, the phenomenon that the pressing quality of a production plate is influenced due to the fact that the second sub-plate is jacked up due to the fact that the height of the conductive ink protruding in the second blind hole is too high can be avoided, and the pressing quality is improved; in addition, the single side of the size of the window is 50 μm larger than the diameter of the second blind hole, and the size can well eliminate the problem of alignment deviation caused by processing errors, so that the conductive ink in the second blind hole can downwards penetrate through the window.
According to the method, at least one second sub-board is cumulatively stacked on two surfaces of the first sub-board, so that the cumulative number of stacked second sub-boards can be determined according to the number of the required circuit layers of the boards, and the manufacturing of the high-density interconnection soft board with any layer is realized.
Drawings
FIG. 1 is a schematic flow chart illustrating the fabrication of a first daughter board according to an embodiment;
FIG. 2 is a schematic flow chart of fabricating a second daughter board according to an embodiment;
fig. 3 is a schematic diagram of the first sub-board and the second sub-board after being pressed in the embodiment.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the high-density interconnection flexible printed circuit board with any layer shown in this embodiment sequentially includes the following processing steps:
(1) and manufacturing a first sub-board: as shown in fig. 1, the method specifically comprises the following steps:
a. opening a double-sided copper-clad flexible substrate according to the size of a jointed board of 520mm multiplied by 620mm, wherein the thickness of the double-sided copper-clad flexible substrate is 0.5mm (excluding the thickness of an outer layer copper), and the thickness of an outer layer copper foil of the double-sided copper-clad flexible substrate is 0.5oz (1oz is approximately equal to 35 mu m);
b. drilling a laser positioning hole on the double-sided copper-clad flexible substrate, and then deeply drilling a first blind hole communicating an upper layer copper foil and a lower layer copper foil on the double-sided copper-clad flexible substrate by laser, wherein the bottom of the first blind hole is the inner surface of the copper foil at a non-drilling surface, so that the effectiveness of connection of the upper layer and the lower layer is ensured, and the copper foil at the non-drilling surface is prevented from being drilled through due to a drilling error;
c. then, manufacturing an inner layer circuit on the double-sided copper-clad flexible substrate by a negative film process; firstly, pasting a film on a double-sided copper-clad flexible substrate, then manufacturing an inner layer circuit on the double-sided copper-clad flexible substrate through exposure, development and etching, and then removing the film;
d. the first blind hole is subjected to plasma degumming treatment to remove glue residues in the first blind hole, then conductive ink is filled in the first blind hole in a screen printing mode and filled and leveled, and then the conductive ink is cured through baking to obtain the first sub-board.
(2) And manufacturing a second sub-board: as shown in fig. 2, the method specifically includes the following steps:
a. opening a single-sided copper-clad flexible substrate according to the size of a jointed board of 520mm multiplied by 620mm, wherein the thickness of the single-sided copper-clad flexible substrate is 0.4mm (excluding the thickness of an outer layer copper), and the thickness of an outer layer copper foil of the single-sided copper-clad flexible substrate is 0.5oz (1oz is approximately equal to 35 mu m);
b. sticking a protective film on a non-copper surface (namely a polished surface) of the single-sided copper-clad flexible substrate, protecting the polished surface by using the protective film and enabling conductive ink filled in the second blind hole to protrude out of the surface of the substrate at a later stage, so that the conductive ink is in contact communication with the conductive ink in the first blind hole after being pressed; the protective film is preferably a PET film, and the PET film also has excellent heat resistance and cold resistance and good chemical resistance and oil resistance;
c. drilling a laser positioning hole on a single-sided copper-clad flexible substrate, then drilling a second blind hole communicated with a copper foil on the other side in a depth-controlled manner on the side, to which a protective film is attached, of the laser, wherein the position of the second blind hole corresponds to the position of the first blind hole up and down; the bottom of the second blind hole is the inner surface of the copper foil at the copper surface, so that the effectiveness of connection of the upper layer and the lower layer is ensured, and the copper foil at the copper surface is prevented from being drilled through due to drilling errors;
d. manufacturing an inner layer circuit on the single-sided copper-clad flexible substrate by a negative film process; firstly, pasting a film on the copper surface of a single-sided copper-clad flexible substrate, then manufacturing an inner layer circuit on the copper surface of the single-sided copper-clad flexible substrate through exposure, development and etching, and then removing the film;
e. firstly, carrying out plasma degumming treatment on the second blind hole to remove glue residues in the second blind hole, filling conductive ink in the second blind hole in a screen printing mode and leveling the conductive ink, curing the conductive ink by baking, and tearing off the protective film to obtain a second sub-plate; because of the existence of the protective film, the upper end of the conductive ink in the second blind hole is positioned at the protective film, and the conductive ink protrudes out of the board surface after the protective film is torn off.
(3) And manufacturing a PP sheet: and (3) opening a PP sheet according to the size of the jointed board, namely 520mm multiplied by 620mm, and windowing at the position, corresponding to the second blind hole, in the PP sheet in a laser cutting mode, wherein the size of the windowing is larger than the diameter of the second blind hole by 50 mu m on one side, and the thickness of the PP sheet is larger than or equal to that of the protective film.
(4) And pressing: according to the browning speed, according to the browning of the copper thickness of the bottom copper, the second sub-boards and the first sub-boards are sequentially stacked through PP (polypropylene) sheets and then pressed into a production board, the first sub-board is positioned in the middle of the stack, at least one second sub-board (shown in figure 3) is stacked on two sides of the first sub-board in an accumulated mode, non-copper surfaces in all the second sub-boards face the first sub-board, the first blind holes, the second blind holes and windows on the PP sheets are aligned and superposed up and down, and conductive ink in the second blind holes penetrates through the windows and then is communicated with the conductive ink in the first blind holes up and down; when at least two second daughter boards are stacked on two surfaces of the first daughter board in an accumulated mode, the conductive ink in the second daughter board positioned on the outer side penetrates through the PP board, after the PP board is windowed, the conductive ink is communicated with a circuit layer (namely a copper surface) on the other second daughter board positioned on the inner side of the PP board, and therefore the conductive ink on all the second daughter boards is communicated to the conductive ink on the first daughter board one by one.
(5) And manufacturing an outer layer circuit: transferring an outer layer pattern, coating a photosensitive film on a production plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, completing outer layer line exposure by using 6-8 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine, and forming an outer layer line pattern after development; etching the outer layer, namely etching the exposed and developed production board to form an outer layer circuit, wherein the width of the outer layer circuit is measured to be 3 mil; and (4) performing outer layer AOI, then checking the defects of an outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, performing defective scrapping treatment, and discharging a defect-free product to the next flow.
(6) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(7) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(8) And forming: according to the prior art and according to the design requirement, the shape is milled, the tolerance of the shape is +/-0.05mm, and the high-density interconnection flexible board is manufactured.
(9) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(10) FQC: and (4) according to the customer acceptance standard and the inspection standard of my department, inspecting the appearance of the high-density interconnection flexible printed circuit board, and timely repairing the defects to ensure that excellent quality control is provided for customers.
(11) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the high-density interconnection flexible printed circuit board meet the requirements of customers or not.
(12) And packaging: and hermetically packaging the high-density interconnected flexible boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of any layer of high-density interconnection soft board is characterized by comprising the following steps:
s1, drilling a first blind hole communicating an upper layer copper foil and a lower layer copper foil on the double-sided copper-clad flexible substrate in a depth-controlled manner through laser;
s2, manufacturing an inner layer circuit on the double-sided copper-clad flexible substrate through a negative film process;
s3, filling conductive ink in the first blind hole and curing to manufacture and form a first sub-board;
s4, attaching a protective film on the non-copper surface of the single-sided copper-clad flexible substrate, then drilling a second blind hole communicated with the copper foil on the other surface of the single-sided copper-clad flexible substrate in a depth-controlled manner through laser on the surface attached with the protective film, wherein the position of the second blind hole corresponds to the position of the first blind hole up and down;
s5, manufacturing an inner layer circuit on the copper surface of the single-sided copper-clad flexible substrate through a negative film process;
s6, filling conductive ink in the second blind hole, curing, and tearing off the protective film to form a second sub-board;
s7, sequentially stacking the second sub-board and the first sub-board through PP sheets and then pressing the second sub-board and the first sub-board into a production board, wherein the first sub-board is positioned in the middle of the stack, at least one second sub-board is stacked on two surfaces of the first sub-board in an accumulated mode, the non-copper surface in the second sub-board faces the first sub-board, a windowing part is arranged at the position, corresponding to the second blind hole, on the PP sheet, and conductive ink in the second blind hole penetrates through the windowing part and then is communicated with the conductive ink in the first blind hole up and down;
and S8, sequentially manufacturing an outer layer circuit, a solder mask layer, silk-screen characters, surface treatment and molding on the production board to obtain the high-density interconnection flexible printed circuit board.
2. The method of claim 1, wherein laser positioning holes are drilled in the board before the first blind via and the second blind via are drilled in steps S1 and S4.
3. The method of manufacturing any-layer high-density interconnection flexible printed circuit board according to claim 1, wherein in step S1, the bottom of the first blind via is an inner surface of the copper foil at the non-drilling surface.
4. The method of manufacturing any-layer high-density interconnection flexible printed circuit board as claimed in claim 1, wherein in step S4, the bottom of the second blind via is the inner surface of the copper foil at the copper surface.
5. The method for manufacturing any-layer high-density interconnection flexible printed circuit board as claimed in claim 1, wherein in step S4, the protective film is a PET film.
6. The method for manufacturing any layer of high-density interconnected flexible printed circuit board as claimed in claim 1, wherein the thickness of the protective film is less than or equal to that of the PP sheet.
7. The method of claim 1, wherein the holes are plasma-degummed before the first and second blind vias are filled with conductive ink in steps S3 and S6.
8. The method for manufacturing any-layer high-density interconnection flexible printed circuit board as claimed in claim 7, wherein in steps S3 and S6, the first blind via and the second blind via are filled with conductive ink and leveled by screen printing.
9. The method for manufacturing any-layer high-density interconnection flexible printed circuit board according to claim 1, wherein in step S7, the size of the window is 50 μm larger than the diameter of the second blind hole.
10. The method for manufacturing any-layer high-density interconnection flexible printed circuit board as claimed in claim 9, wherein in step S7, the PP sheet is windowed by laser cutting at a position corresponding to the second blind hole.
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| CN202011498103.7A CN112911830A (en) | 2020-12-17 | 2020-12-17 | Method for manufacturing any-layer high-density interconnection flexible printed circuit board |
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| CN202011498103.7A CN112911830A (en) | 2020-12-17 | 2020-12-17 | Method for manufacturing any-layer high-density interconnection flexible printed circuit board |
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2020
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| JP2001160683A (en) * | 1999-12-02 | 2001-06-12 | Murata Mfg Co Ltd | Multilayer ceramic wiring board and its manufacturing method |
| CN103379750A (en) * | 2012-04-27 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| US20160295707A1 (en) * | 2013-09-20 | 2016-10-06 | Nippon Mektron, Ltd. | Manufacturing method of multilayer printed wiring board and multilayer printed wiring board |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
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Application publication date: 20210604 |