CN105451473A - Multilayer flexible circuit board and manufacturing method thereof - Google Patents
Multilayer flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN105451473A CN105451473A CN201410442125.XA CN201410442125A CN105451473A CN 105451473 A CN105451473 A CN 105451473A CN 201410442125 A CN201410442125 A CN 201410442125A CN 105451473 A CN105451473 A CN 105451473A
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- circuit board
- connection gasket
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- conductive
- conductive paste
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a multilayer flexible circuit board, which comprises a first circuit board, an adhesive layer and a second circuit board which are sequentially laminated, wherein the first circuit board comprises first connecting pads, the second circuit board comprises second connecting pads, the second connecting pads correspond to the first connecting pads, the first connecting pads are coated with a first conductive paste, the adhesive layer comprises openings, and the first connecting pads and the second connecting pads pass through the openings respectively and are electrically connected through the first conductive past. The invention further relates to a manufacturing method of the multilayer flexible circuit board.
Description
Technical field
The present invention relates to a kind of multi-layer soft circuit board and preparation method thereof.
Background technology
Multi-layer soft circuit board is that electronic technology obtains product to high-speed, multi-functional, Large Copacity, small size future development.Along with the development of electronic technology, the application extensively and profoundly of especially extensive and very lagre scale integrated circuit (VLSIC), multi-layer soft circuit board is just being rapidly to high density, high accuracy, do the number of plies talks about future development.At present, when making multi-layer soft circuit board, usually adopting machine drilling to form through hole or utilizing laser-induced thermal etching to form blind hole, re-plating forms via or guide hole, then filled conductive cream in via or guide hole, makes interlayer line conduction, thus makes formation multi-layer soft circuit board.
Summary of the invention
In view of this, the invention provides a kind of multi-layer soft circuit board and preparation method thereof.
A manufacture method for multi-layer soft circuit board, comprises step: provide first circuit board, and described first circuit board comprises the first connection gasket, and described first connection gasket is coated with conductive paste; There is provided second circuit board, described second circuit board comprises the second connection gasket, and described second connection gasket is corresponding with described first connection gasket; There is provided a glue-line, described glue-line comprises an opening, and described opening is corresponding with described first connection gasket and the second connection gasket position; And pressing first circuit board, glue-line and second circuit board successively, described first connection gasket and the second connection gasket be arranged in described opening respectively and be electrically connected by conductive paste, thus forming multi-layer soft circuit board.
A kind of multi-layer soft circuit board, comprise the first circuit board of pressing successively, glue-line and second circuit board, described first circuit board comprises the first connection gasket, described second circuit board comprises the second connection gasket, described second connection gasket is corresponding with described first connection gasket, described the one the first connection gaskets are coated with the first conductive paste, and described glue-line comprises opening, and described first connection gasket and the second connection gasket to be arranged in respectively in described opening and to be electrically connected by the first conductive paste.
Compared to prior art, the manufacture method of the multi-layer soft circuit board that the technical program provides, by forming corresponding connection gasket on the line layer of first circuit board and second circuit board, then on connection gasket, one deck conductive paste is coated with respectively, first circuit board and second circuit board are bonded with glue-line, in bonding processes, corresponding connection gasket is electrically connected by conductive paste again, make circuit interlayer conduction, this method greatly reduces cost of manufacture.The flexible circuit board of the present embodiment can be used for making rigid-flexible combined circuit plate.In addition, in the manufacturing process of the technical program, described first circuit board and second circuit board can make formation simultaneously, and directly carry out pressing working procedure, so, significantly can reduce the time and cost that make circuit board.
Accompanying drawing explanation
Fig. 1 is the generalized section of the flexible copper foil substrate that the embodiment of the present invention provides.
Fig. 2 is the generalized section forming the first connection gasket at the flexible copper foil substrate of Fig. 1.
Fig. 3 is the generalized section forming conductive circuit layer and the first connection gasket on the flexible copper foil substrate of Fig. 2.
Fig. 4 is the generalized section that applying conductive cream forms first circuit board on first connection gasket of Fig. 3.
Fig. 5 is the generalized section of the second circuit board provided in the embodiment of the present invention.
Fig. 6 is the generalized section of the glue-line that the embodiment of the present invention provides.
Fig. 7 is the generalized section that pressing first circuit board, glue-line and second circuit board form multi-layer soft circuit board.
Main element symbol description
| Multi-layer soft circuit board | 10 |
| Flexible copper foil substrate | 11 |
| First circuit board | 100 |
| First copper foil layer | 101 |
| Second copper foil layer | 102 |
| First basalis | 110 |
| First conductive circuit layer | 111 |
| Second conductive circuit layer | 112 |
| First through hole | 120 |
| First via | 121 |
| First connection gasket | 130 |
| First conductive paste | 140 |
| Second circuit board | 200 |
| Second basalis | 210 |
| 3rd conductive circuit layer | 211 |
| 4th conductive circuit layer | 212 |
| Second through hole | 220 |
| Second via | 221 |
| Second connection gasket | 230 |
| Second conductive paste | 240 |
| Glue-line | 300 |
| Opening | 320 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of multi-layer soft circuit board, comprises step:
The first step, refers to Fig. 4, provides first circuit board 100.
Described first circuit board 100 comprises the first basalis 110, is formed at the first conductive circuit layer 111 of the first basalis 110 both sides and the second conductive circuit layer 112, is formed at first connection gasket 130 on the first conductive circuit layer 111 surface and is formed at first conductive paste 140 on the first connection gasket 130 surface.Described first circuit board 100 also comprises the first via 121 of described first conductive circuit layer 111 of multiple electrical connection and the second conductive circuit layer 112.
The making step of described first circuit board 100 is:
First, refer to Fig. 1, provide a flexible copper foil substrate 11, described flexible copper foil substrate 11 comprises the first basalis 110 and is formed at the first copper foil layer 101 and the second copper foil layer 102 of the first basalis 110 both sides.Described flexible copper foil substrate 11 also comprises multiple first through hole 120.
In the present embodiment, adopt the mode of boring on described flexible copper foil substrate 11, form described first through hole 120.
Secondly, refer to Fig. 2, the mode of selective electroplating is adopted to form multiple first connection gasket 130 on described first copper foil layer 101, and in the hole wall plating of described through hole 120, described through hole 120 being made multiple first via 121 of formation simultaneously, described first connection gasket 130 protrudes from described first copper foil layer 101.
Again, refer to Fig. 3, described first copper foil layer 101 and the second copper foil layer 102 are etched formation first conductive circuit layer 111 and the second conductive circuit layer 112.
In the present embodiment, in etching process, described first copper foil layer 101 corresponding with the first connection gasket 130 position is not etched.
Finally, refer to Fig. 4, described first connection gasket 130 forms one deck first conductive paste 140, form first circuit board 100.
Second step, refer to Fig. 5, there is provided second circuit board 200, described second circuit board 200 comprises the second basalis 210, is formed at the 3rd conductive circuit layer 211 of the second basalis 210 both sides and the 4th conductive circuit layer 212, is formed at second connection gasket 230 on the 3rd conductive circuit layer 211 surface and is formed at second conductive paste 240 on the second connection gasket 230 surface.Described second circuit board 200 also comprises the second via 221 of described 3rd conductive circuit layer 211 of multiple electrical connection and the 4th conductive circuit layer 212.
The manufacturing process of described second circuit board 200 is similar to the manufacturing process of described first circuit board 100, and described first connection gasket 130 is corresponding, measure-alike with the second connection gasket 230 position.
Be appreciated that and the mode of coating or printing can be adopted to form first and second conductive paste described.
Be appreciated that, described first and second basalises can be flexible resin layer, as polyimides (Polyimide, PI), PETG (PolyethyleneTerephthalate, or PEN (PolythyleneNaphthalate PET), PEN), also can be multilager base plate.Certainly, described second conductive paste can not also be formed.
3rd step, refers to Fig. 6, provides a glue-line 300, and described glue-line 300 comprises opening 320, and described opening 320 is corresponding, measure-alike with described first connection gasket 130 and the second connection gasket 230 position.
In the present embodiment, adopt stamp or boring, the mode of laser pit forms opening 320 on described glue-line 300.
4th step, refer to Fig. 7, superimposed successively and pressing first circuit board 100, glue-line 300 and second circuit board 200, described first connection gasket 130 and the second connection gasket 230 are arranged in described opening 320 respectively and are electrically connected by conductive paste, thus also make the electric connection of first circuit board 100 and second circuit board 200, thus form multi-layer soft circuit board 10.
Wherein, after pressing, described glue-line 300 fills full described first via 121 and the second via 221.
Be appreciated that first circuit board 100 described in the present embodiment and second circuit board 200 can make formation simultaneously.
Refer to Fig. 7, the embodiment of the present invention also provides a kind of multi-layer soft circuit board 10, and it comprises:
First circuit board 100, described first circuit board 100 comprises the first basalis 110, be formed at the first basalis 110 first conductive circuit layer 111 of both sides and the second conductive circuit layer 112 and be formed at first connection gasket 130 on the first conductive circuit layer 111 surface relatively, and described first connection gasket 130 is formed with the first conductive paste 140.Described first circuit board 100 also comprises the first via 121 of described first conductive circuit layer 111 of multiple electrical connection and the second conductive circuit layer 112.
Second circuit board 200, described second circuit board 200 comprises the second basalis 210, be formed at the second basalis 210 the 3rd conductive circuit layer 211 of both sides and the 4th conductive circuit layer 212 and be formed at second connection gasket 230 on the 3rd conductive circuit layer 211 surface relatively, described second connection gasket 230 is formed at the 3rd conductive circuit layer 211 and corresponding with described first connection gasket 130, and described second connection gasket 230 is coated with the second conductive paste 240.Described second circuit board 200 also comprises the second via 221 of described 3rd conductive circuit layer 211 of multiple electrical connection and the 4th conductive circuit layer 212.
Glue-line 300, described glue-line 300 is formed between described first circuit board 100 and second circuit board 200, described glue-line 300 comprises multiple opening 320, described opening 320 is corresponding and measure-alike with described first connection gasket 130, described first connection gasket 130 and the second connection gasket 230 to be arranged in respectively in described opening 320 and to be electrically connected by conductive paste, and described glue-line 300 fills full described first via 121 and the second via 221.
Compared to prior art, the manufacture method of the multi-layer soft circuit board that the technical program provides, by forming corresponding connection gasket on the line layer of first circuit board 100 and second circuit board 200, then on connection gasket, one deck conductive paste 140 is coated with respectively, first circuit board 100 and second circuit board 200 are bonded with glue-line, in bonding processes, corresponding connection gasket is electrically connected by conductive paste 140 again, make circuit interlayer conduction, this method greatly reduces cost of manufacture.In addition, in the manufacturing process of the technical program, described first circuit board 100 and second circuit board 200 can make formation simultaneously, and directly carry out pressing working procedure, so, significantly can reduce the time and cost that make circuit board 100.
Claims (10)
1. a manufacture method for multi-layer soft circuit board, comprises step:
There is provided first circuit board, described first circuit board comprises the first connection gasket, and described first connection gasket is coated with conductive paste;
There is provided second circuit board, described second circuit board comprises the second connection gasket, and described second connection gasket is corresponding with described first connection gasket;
There is provided a glue-line, described glue-line comprises an opening, and described opening is corresponding with described first connection gasket and the second connection gasket position; And
Pressing first circuit board, glue-line and second circuit board successively, is made described first connection gasket and the second connection gasket be arranged in respectively in described opening and is electrically connected by conductive paste, thus forming multi-layer soft circuit board.
2. multi-layer soft circuit board manufacturing method as claimed in claim 1, it is characterized in that, described first circuit board comprises the first basalis and is formed at the first conductive circuit layer and second conductive circuit layer of the first relative both sides of basalis, and described first connection gasket is formed at the first conductive circuit layer surface.
3. multi-layer soft circuit board manufacturing method as claimed in claim 1, it is characterized in that, the manufacture method of described first circuit board comprises step:
There is provided a flexible copper foil substrate, described flexible copper foil substrate comprises the first basalis and is formed at the first copper foil layer and second copper foil layer of the first basalis both sides;
The mode of selective electroplating is adopted to form multiple first connection gasket on described first copper foil layer;
The first copper foil layer and the second copper foil layer that do not form the first connection gasket are etched formation first conductive circuit layer and the second conductive circuit layer; And
Described first connection gasket is coated with one deck conductive paste, forms first circuit board.
4. multi-layer soft circuit board manufacturing method as claimed in claim 1, it is characterized in that, described first circuit board and second circuit board can make formation simultaneously.
5. multi-layer soft circuit board manufacturing method as claimed in claim 1, is characterized in that, described second connection gasket forms the second conductive paste, and the first connection gasket and the second connection gasket are electrically connected by the first conductive paste and the second conductive paste.
6. multi-layer soft circuit board manufacturing method as claimed in claim 5, is characterized in that, adopts the mode of coating or printing to form first and second conductive paste.
7. multi-layer soft circuit board manufacturing method as claimed in claim 1, it is characterized in that, described first circuit board also draws together multiple first via, and described second circuit board comprises multiple second via, and described glue-line fills full described first via and the second via.
8. multi-layer soft circuit board manufacturing method as claimed in claim 1, it is characterized in that, described second circuit board also comprises the second basalis and is formed at the 3rd conductive circuit layer and the 4th conductive circuit layer of the second relative both sides of basalis.
9. multi-layer soft circuit board manufacturing method as claimed in claim 8, is characterized in that, described opening and described first connection gasket and the second connection gasket measure-alike.
10. a multi-layer soft circuit board, comprise the first circuit board of pressing successively, glue-line and second circuit board, described first circuit board comprises the first connection gasket, described second circuit board comprises the second connection gasket, described second connection gasket is corresponding with described first connection gasket, described the one the first connection gaskets are coated with the first conductive paste, and described glue-line comprises opening, and described first connection gasket and the second connection gasket to be arranged in respectively in described opening and to be electrically connected by the first conductive paste.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410442125.XA CN105451473A (en) | 2014-09-02 | 2014-09-02 | Multilayer flexible circuit board and manufacturing method thereof |
| TW103133401A TW201611700A (en) | 2014-09-02 | 2014-09-26 | Multilayer flexible circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410442125.XA CN105451473A (en) | 2014-09-02 | 2014-09-02 | Multilayer flexible circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105451473A true CN105451473A (en) | 2016-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410442125.XA Pending CN105451473A (en) | 2014-09-02 | 2014-09-02 | Multilayer flexible circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105451473A (en) |
| TW (1) | TW201611700A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030174484A1 (en) * | 2002-03-14 | 2003-09-18 | General Dynamics Advanced Information Systems, Inc | Lamination of high-layer-count substrates |
| CN101184362A (en) * | 2006-11-14 | 2008-05-21 | 安迪克连接科技公司 | Method of making circuitized substrate with solder paste connections |
| CN101336051A (en) * | 2007-01-12 | 2008-12-31 | 安迪克连接科技公司 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| CN101360398A (en) * | 2007-07-31 | 2009-02-04 | 欣兴电子股份有限公司 | Circuit board construction of inner fovea type conductive column and preparation thereof |
| CN201888026U (en) * | 2010-11-15 | 2011-06-29 | 华映视讯（吴江）有限公司 | Structure for connecting two assembly substrates |
| CN202549828U (en) * | 2012-03-30 | 2012-11-21 | 欣兴电子股份有限公司 | Semiconductor package substrate |
-
2014
- 2014-09-02 CN CN201410442125.XA patent/CN105451473A/en active Pending
- 2014-09-26 TW TW103133401A patent/TW201611700A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030174484A1 (en) * | 2002-03-14 | 2003-09-18 | General Dynamics Advanced Information Systems, Inc | Lamination of high-layer-count substrates |
| CN101184362A (en) * | 2006-11-14 | 2008-05-21 | 安迪克连接科技公司 | Method of making circuitized substrate with solder paste connections |
| CN101336051A (en) * | 2007-01-12 | 2008-12-31 | 安迪克连接科技公司 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| CN101360398A (en) * | 2007-07-31 | 2009-02-04 | 欣兴电子股份有限公司 | Circuit board construction of inner fovea type conductive column and preparation thereof |
| CN201888026U (en) * | 2010-11-15 | 2011-06-29 | 华映视讯（吴江）有限公司 | Structure for connecting two assembly substrates |
| CN202549828U (en) * | 2012-03-30 | 2012-11-21 | 欣兴电子股份有限公司 | Semiconductor package substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201611700A (en) | 2016-03-16 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170309 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160330 |