TWI725748B - Flexible circuit board connection tail and membrane circuit board - Google Patents

Abstract

A flexible circuit board connection tail includes a carrier plate, a conductive line layer on the carrier plate, a protection layer, and a board-end blocking structure. The protection layer covers the conductive line layer but expose a contact area of the carrier plate and terminal contacts of the conductive line layer on the contact area. The board-end blocking structure is disposed on at least one side fringe of the contact area, so as to reduce external chemical material reacting with the terminal contacts to influence the properties of the circuitry significantly. A membrane circuit board includes a layered plate structure and a blocking structure disposed inside the layered plate structure. The blocking structure can be disposed to surround a through hole, disposed along a ventilation channel, or disposed to surround a structure that connects circuits on different substrates of the layered plate structure, so as to reduce or obstruct external chemical material from entering the layered plate structure to react with internal conductive lines to influence the properties of the circuitry significantly.

Description

Flexible circuit board connection end and film circuit board

The present invention relates to a thin film circuit board, in particular to a thin film circuit board that can be used for keyboards.

The thin-film circuit board of the keyboard has a layered structure. During use, external chemicals may enter the thin-film circuit board from the gap between the structural layers and react with the circuit to affect the circuit characteristics. For example, the sulfur in the external chemical substance and the wires in the thin film circuit board (such as silver wires) produce sulfide. When this reaction is severe, the signal transmission function of the circuit may be affected, and the thin film circuit board may even fail. In addition, the film circuit board usually has a connecting tail extending out for connection with the main board, for example, a flexible printed circuit board connector inserted on the main board. In order for the connection tail to be effectively connected to the connector, a plurality of connection contacts on the connection tail must be kept exposed. Even when the connection tail is inserted into the connector, the connection contacts on the connection tail may still be in contact with the ambient atmosphere, especially the connection contacts close to the side of the connection tail, so that these connection contacts may still react with external chemicals. Affect circuit characteristics.

In view of the problems in the prior art, one of the objectives of the present invention is to provide a flexible circuit board connection terminal, which can react with external chemicals by providing a barrier structure near the exposed contacts to reduce the chance of the contacts reacting with the external chemicals. , Thereby suppressing the degree of influence of external chemical substances on the contacts.

The connecting end of the flexible circuit board according to the present invention includes a carrier board, a wire layer, a protective layer and a board end blocking structure. The carrier board has a carrying surface, and the carrying surface includes a contact area. The wire layer is arranged on the carrying surface and includes a plurality of contacts, and the plurality of contacts are located in the contact area. The protective layer is arranged on the bearing surface and exposes the contact area. The board end blocking structure is arranged at the contact On at least one side edge of the zone. In this way, the plate end barrier structure can react with external chemical substances to reduce the chance of the plurality of contacts reacting with external chemical substances, thereby suppressing the degree of influence of external chemical substances on the contacts.

Another object of the present invention is to provide a thin film circuit board, which is provided with a barrier structure in the structural layer surrounding a through hole to block or inhibit external chemicals from entering the thin film circuit board through the through hole and affecting circuit characteristics.

The thin film circuit board according to the present invention includes a layered board structure and a through hole blocking structure. The layered board structure includes a first circuit substrate, a second circuit substrate, and an insulating layer disposed between the first circuit substrate and the second circuit substrate. The layered board structure has a through hole penetrating the first circuit substrate, the second circuit substrate and the insulating layer. The through hole blocking structure is disposed around the through hole between the first circuit substrate and the insulating layer and between the insulating layer and the second circuit substrate. Thereby, the through-hole barrier structure can block or inhibit external chemical substances from entering the film circuit board, and the through-hole barrier structure can react with external chemical substances to reduce the entry of external chemical substances into the film circuit board to the film circuit The influence of the internal wires of the board.

Another object of the present invention is to provide a thin film circuit board, which is provided with a barrier structure in the structural layer, and is arranged along an inner ventilation channel to block or inhibit external chemicals from entering the thin film circuit board through the ventilation channel. Circuit characteristics.

The thin film circuit board according to the present invention includes a layered board structure, a circuit switch, and an air channel blocking structure. The layered board structure includes a first circuit substrate, a second circuit substrate, and an insulating layer disposed between the first circuit substrate and the second circuit substrate. The layered plate structure has a compressible space and an air passage formed between the first circuit substrate and the second circuit substrate and communicates with the compressible space and the outside of the layered plate structure. The circuit switch is arranged in the compressible space. The air passage blocking structure is arranged between the first circuit substrate and the second circuit substrate along the edge of the air passage. Thereby, the ventilation channel barrier structure can block or inhibit external chemical substances from passing through the ventilation channel. The air channel enters the thin film circuit board, and the air channel blocking structure can react with external chemical substances to reduce the influence of the external chemical substances entering the thin film circuit board on the internal wires of the thin film circuit board.

Another object of the present invention is to provide a thin-film circuit board, which is provided with a barrier structure in the structural layer, and is arranged around the structure connecting the circuits on different substrates, which can inhibit the external chemical substances entering the thin-film circuit board from further reacting with the circuit. Affect circuit characteristics.

The thin film circuit board according to the present invention includes a layered board structure, a first wire, a second wire, a conductive material, and a wire connection blocking structure. The layered board structure includes a first circuit substrate, a second circuit substrate, and an insulating layer disposed between the first circuit substrate and the second circuit substrate, and the insulating layer has an opening. The first wire is arranged on a first surface of the first circuit substrate facing the second circuit substrate. The second wire is disposed on a second surface of the second circuit substrate facing the first circuit substrate, and the first wire and the second wire are oppositely disposed through the opening. The conductive material is disposed in the opening and located between the first wire and the second wire, and the first wire and the second wire are electrically connected through the conductive material. The wire connection blocking structure is arranged between the first circuit substrate and the second circuit substrate and surrounds the conductive material. Thereby, the wire connection blocking structure can inhibit the external chemical substances entering the thin film circuit board from further reacting with the wires and conductive materials located in the openings to affect the circuit characteristics.

The advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings.

1: Thin film circuit board

1a, 1b: flexible circuit board connection ends

12: Layered board structure

12a: vertical direction

122: The first circuit board

122a: surface

122b: first surface

1222: carrier board

1222a: bearing surface

1222b: Contact area

1222c: surface

1222d: main body

1222e: Protruding direction

1222f: Insert end

1222g: the first length

1222h: second length

124: second circuit board

124a: Surface

124b: second surface

126: Insulation layer

1262: Switch through hole

1264: protective layer

1264a: side

1264b: Surface

1264c: side edge

1266: opening

128, 128a: Through hole

130: Outer edge of structure

132: Compressible space

134: Ventilation Channel

134a: curved connection section

134b: Buffer tank

134c: Compressible space connection section

14: The first circuit layer

142: switch contact

144: Wire layer

146, 146a: contact

148: first wire

150: third wire

16: The second circuit layer

162: switch contact

164: second wire

166: fourth wire

17: Circuit switch

18: Strengthening film

182: Surface

19: Conductive material

20, 20a: Board end barrier structure

202, 204: extended width

22a, 22b, 22c: auxiliary plate end barrier structure

24: Through hole barrier structure

24a, 24b: ring barrier structure

26: Auxiliary through hole barrier structure

26a, 26b: ring barrier structure

28: The outer edge of the structure barrier structure

28a, 28b: part

30: Auxiliary structure outer edge barrier structure

30a, 30b: part

32: Ventilation channel barrier structure

34: Wire connection barrier structure

34a~i: barrier section

FIG. 1 is a schematic diagram of a thin film circuit board according to an embodiment.

Fig. 2 is an exploded view of the film circuit board in Fig. 1.

Fig. 3 is a cross-sectional view of the thin film circuit board in Fig. 1 along the line X-X.

FIG. 4 is a schematic diagram of the flexible circuit board connection end of the thin film circuit board in FIG. 1. FIG.

FIG. 5 is an exploded view of the connecting end of the flexible circuit board in FIG. 4. FIG.

FIG. 6 is a schematic diagram of a connecting end of a flexible circuit board according to an embodiment.

Fig. 7 is a cross-sectional view of the thin film circuit board in Fig. 1 along the line Y-Y.

Fig. 8 is a cross-sectional view of the thin film circuit board in Fig. 1 along the line Z-Z.

FIG. 9 is a schematic diagram of a circuit in which a hole corresponding to one of the insulating layers in FIG. 2 is opened on the first circuit substrate.

FIG. 10 is a schematic diagram of the circuit corresponding to the aforementioned opening on the second circuit substrate in FIG. 2.

FIG. 11 is a cross-sectional view of the thin film circuit board corresponding to the aforementioned opening, and the position of the cut surface is the line W-W in FIG. 2.

Figure 12 is a top view of the thin film circuit board corresponding to the aforementioned openings.

Please refer to Figure 1 to Figure 3. According to an embodiment, a thin film circuit board 1 can be applied to a keyboard, for example, but not limited to, which includes a layered plate structure 12 and a first circuit layer 14 arranged in the layered plate structure 12 (in FIG. 2 Only a part of the outline is shown in FIG. 2) and a second circuit layer 16 (only a part of the outline is shown in FIG. 2). The layered board structure 12 includes a first circuit substrate 122, a second circuit substrate 124, and an insulating layer 126 disposed between the first circuit substrate 122 and the second circuit substrate 124, the first circuit substrate 122, and the second circuit substrate 124. 124 and the insulating layer 126 are stacked in a vertical direction 12a (indicated by the double arrow in the figure). The first circuit layer 14 forms a circuit (only part of which is schematically shown in the figure) on the first circuit substrate 122 (for example, but not limited to through printing) and is located between the first circuit substrate 122 and the insulating layer 126, and the second circuit The layer 16 forms a circuit (only part of which is schematically shown in the figure) on the second circuit substrate 124 (for example, but not limited to through printing) and is located between the second circuit substrate 124 and the insulating layer 126. In principle, the first circuit substrate 122, the second circuit substrate 124 and the insulating layer 126 are glued together (not shown in the figure), which has a certain degree of sealing effect. The insulating layer 126 has a plurality of switch vias 1262 (an alternative is indicated in the figure), and the first circuit layer 14 and the second circuit layer 16 corresponding to the switch vias 1262 have switch contacts 142 and switch contacts 162 (hidden outlines are shown in the figure). The dotted line is shown in FIG. 2), forming a circuit switch 17 (indicated by the dotted line in FIG. 3). Through the conduction of the corresponding switch contacts 142 and 162 (for example, squeeze the film circuit board 1 to make the switch contacts 142 and 162 contact each other) to trigger the corresponding Circuit switch 17.

Please also refer to Figures 4 and 5. In this embodiment, the film circuit board 1 has a flexible circuit board connection terminal 1a and is connected to a control circuit board (such as an FFC/FPC connector on it) through the flexible circuit board connection terminal 1a. The flexible circuit board connection terminal 1a includes a carrier board 1222 (e.g., formed by the extension of the first circuit substrate 122), a wire layer 144 (e.g., formed by the extension of the first circuit layer 14), and a protective layer 1264 (e.g., formed by the insulating layer 126). Extending formed) and a reinforcing piece 18. The carrier board 1222 has a bearing surface 1222a, and the bearing surface 1222a includes a contact area 1222b (the range is shown in a dashed frame in FIG. 5). The wire layer 144 is disposed on the carrying surface 1222a and includes a plurality of contacts 146, and the plurality of contacts 146 are located in the contact area 1222b. In this embodiment, the plurality of contacts 146 are equivalent to the ends of the wires formed by the wire layer 144 and are parallel to each other, but the implementation is not limited to this; for example, the plurality of contacts 146 are a plurality of contacts arranged in an array Mat rendering. The protective layer 1264 is disposed on the bearing surface 1222a and exposes the contact area 1222b, that is, the plurality of contacts 146 can be exposed. When the flexible circuit board connection terminal 1a is inserted into the connector, the contact point 146 can contact the terminal in the connector. The reinforcing sheet 18 is fixed to a surface 1222c of the carrier board 1222 opposite to the carrier surface 1222a to strengthen the structure of the carrier board 1222. On the other hand, the carrier board 1222 has a main body portion 1222d and an insertion end portion 1222f extending from the main body portion 1222d in a protruding direction 1222e (indicated by an arrow), and the contact area 1222b is located at the insertion end portion 1222f. The reinforcing piece 18 is attached to the insertion end 1222f and a part of the main body 1222d, which can particularly strengthen the structure of the insertion end 1222f to facilitate the insertion of the connector. In addition, in practice, the flexible circuit board connection terminal 1a may also be formed by extending the second circuit substrate 124, the second circuit layer 16 and the insulating layer 126, which will not be repeated.

In addition, in this embodiment, the flexible circuit board connection end 1a also includes a board end blocking structure 20 (in FIGS. 1 and 2, it is represented by a thick solid line; for ease of drawing, it is not completely attached to the first The structure edge of the circuit substrate 122 is shown), which is disposed on at least one side edge of the contact area 1222b. In this embodiment, the protective layer 1264 has a side edge 1264a (corresponding to the seam between the protective layer 1264 and the carrier board 1222), the contact area 1222b protrudes from the side edge 1264a, and the board end barrier structure 20 is along the third of the contact area 1222b. Two side edge settings. In practice, the wire The layer 144 may easily react with certain external chemical substances, and the material of the plate end barrier structure 20 may include components that can react with these external chemical substances, thereby reducing the chance of the contact 146 reacting with these external chemical substances. In this embodiment, the board end barrier structure 20 and the wire layer 144 (or circuit layers 14, 16) have the same conductive material (for example, but not limited to copper or silver conductive materials), which is beneficial to the board end barrier structure 20 is provided, for example, the board end barrier structure 20 and the wire layer 144 are simultaneously formed on the carrier board 1222 in a printing manner. In addition, in practice, if the board end barrier structure 20 is not conductive, the board end barrier structure 20 must also be disposed between the protective layer 1264 and the carrier board 1222 along the side 1264a.

In addition, in this embodiment, the board-end barrier structure 20 also extends between the carrier board 1222 and the protective layer 1264, so that the board-end barrier structure 20 is also formed between the carrier board 1222 and the protective layer 1264 (or so-called board-end barrier structure). The structure 20 extends along the edge of the structure on the carrier board 1222 and the protective layer 1264), that is, the board end blocking structure 20 here can also block or inhibit the aforementioned external chemicals from entering the flexible circuit board connection end 1a from the joint, thereby The chance of the wire layer 144 reacting with these external chemicals is reduced. In addition, the protective layer 1264 partially covers the plurality of contacts 146, and the plurality of contacts 146 are coated with carbon ink (the range is indicated by hatching in FIG. 5), which protects the contacts 146 and maintains its conductivity The effect of.

In addition, in this embodiment, the flexible circuit board connection end 1a further includes an auxiliary board end blocking structure 22a disposed on the protective layer 1264 opposite to the surface 1264b of the carrier board 1222 and adjacent to at least one side edge of the contact area 1222b ( On the side edge 1264c) including the corresponding side edge 1264a, the auxiliary plate end blocking structure 22a can also react with the aforementioned external chemical substances, which helps to reduce the reaction of the contact 146 (or the wire layer 144) with these external chemical substances. opportunity. In addition, in this embodiment, the flexible circuit board connection end 1a further includes another auxiliary board end blocking structure 22b, which is disposed between the reinforcing sheet 18 and the carrier board 1222. The auxiliary board end blocking structure 22b also helps to reduce the chance of the contact 146 (or the wire layer 144) reacting with these external chemicals. In addition, the flexible circuit board connection end 1a further includes another auxiliary board end blocking structure 22c, which is disposed on a surface 182 of the reinforcing sheet 18 opposite to the carrier board 1222 and adjacent to at least one side edge of the contact area 1222b (for example, including the surface 182). Parallel to the side edge of the board end barrier structure 22); in this embodiment, the auxiliary board end barrier structure 22a is parallel to the board end barrier The structure 20 is extended, but it is not limited to this in practice. The auxiliary board end blocking structure 22c also helps to reduce the chance of the contact 146 (or the wire layer 144) reacting with these external chemicals. In addition, in practice, the materials and forming methods of the auxiliary plate end barrier structures 22a, 22b, 22c are all but not limited to the same as the plate end barrier structure 20, and will not be repeated.

In addition, in this embodiment, the board end blocking structure 20 also provides protection for the adjacent contacts 146 and wires against the reaction of external chemical substances. In practice, if the size of the connection interface of the flexible circuit board connection terminal 1a allows, the outer contact 146a of the plurality of contacts 146 can be insulated from the circuit to serve as a dummy terminal, which is also helpful This reduces the chance of the adjacent contact 146 reacting with the aforementioned external chemical substance. In this example, the part of the board end blocking structure 20 adjacent to the contact 146a (and the wires extending therefrom) can be omitted.

Refer to Figure 6. In one embodiment, one of the flexible circuit board connection ends 1b has a similar structure to the flexible circuit board connection end 1a, and the component symbols of the flexible circuit board connection ends 1a are used. For other descriptions of the flexible circuit board connection end 1b, please refer to the relevant description of the flexible circuit board connection end 1a, and will not be repeated. The main difference between the flexible circuit board connection end 1b and the flexible circuit board connection end 1a is that the main body portion 1222d of the flexible circuit board connection end 1b (partially hidden outline is shown in dashed lines in Figure 6) is wider than the insertion end portion The width of 1222f. That is, the insertion end portion 1222f has a first length 1222g perpendicular to the protruding direction 1222e, the main body portion 1222d has a second length 1222h perpendicular to the protruding direction 1222e, and the second length 1222h is greater than the first length 1222g. On the other hand, the width of the insertion end portion 1222f is usually to match the size of the connector, and the main body portion 1222d can be larger without being limited to the size of the connector to allow the plate end blocking structure 20a (partially hidden outline with a dashed line) (Shown in FIG. 6) the part between the protective layer 1264 and the carrier board 1222 is flexible. In this embodiment, the extension width 202 of the board end barrier structure 20a between the main body portion 1222d and the protective layer 1264 in the protruding direction 1222e is greater than the extension width of the board end barrier structure 20a on the contact area 1222b in the protruding direction 1222e 204. This can increase the protection (reaction to external chemical substances) of the wire layer 144 between the main body portion 1222d and the protective layer 1264 by the plate end blocking structure 20a.

Please refer to Figure 1, Figure 2 and Figure 7. In the thin film circuit board 1, the layered board structure 12 has a plurality of through holes 128 (the range of which is represented by a dashed frame in FIG. 7), which penetrates the first circuit substrate 122, the second circuit substrate 124 and the insulating layer 126, and can For other structures to pass through, such as, but not limited to, a sliding hook on the bottom plate connected to the lifting mechanism of the button (such as but not limited to scissors feet). The film circuit board 1 also includes a through-hole blocking structure 24 (shown as a thick solid line in FIG. 2; for ease of identification, it is not completely attached to the first circuit substrate 122 corresponding to the structure edge of the through-hole 128), which surrounds The through hole 128 is provided between the first circuit substrate 122 and the insulating layer 126 and between the insulating layer 126 and the second circuit substrate 124; in other words, in this embodiment, corresponding to one through hole 128, the through hole blocking structure 24 includes two The two ring-shaped barrier structures 24 a and 24 b are respectively located between the first circuit substrate 122 and the insulating layer 126 and between the insulating layer 126 and the second circuit substrate 124. The through hole blocking structure 24 can block or inhibit the aforementioned external chemical substances from entering the film from the seam of the layered plate structure 12 at the through hole 128 (i.e., the stack of the first circuit substrate 122, the second circuit substrate 124 and the insulating layer 126) The circuit board 1 thereby reduces the chance of the first circuit layer 14 and the second circuit layer 16 (not shown in FIG. 7) reacting with these external chemicals. In addition, in practice, the material and formation of the through-hole barrier structure 24 can also be but not limited to the same as the plate end barrier structure 20, and will not be described again.

In addition, in this embodiment, the thin-film circuit board 1 further includes an auxiliary through-hole blocking structure 26 (shown as a thick solid line in FIGS. 1 and 2; for ease of drawing, it is not completely attached to the second circuit substrate 124 corresponds to the structure edge of the through hole 128), and corresponds to the through hole blocking structure 24 to surround the through hole 128 and is disposed on a surface 122a of the first circuit substrate 122 opposite to the insulating layer 126 and the second circuit substrate 124 opposite to the insulating layer 126 on one surface 124a; wherein, corresponding to a through hole 128, the auxiliary through hole blocking structure 26 also includes two ring-shaped blocking structures 26a, 26b, respectively located on the surface 122a of the first circuit substrate 122 and the second circuit substrate 124 On surface 124a. Thereby, the auxiliary through-hole blocking structure 26 can also react with the aforementioned external chemical substances, which helps to reduce the chance of the first circuit layer 14 and the second circuit layer 16 reacting with these external chemical substances. In addition, in practice, the material and formation of the auxiliary through-hole barrier structure 26 may be, but not limited to, the same as the through-hole barrier structure 24, and will not be described again.

Please refer to Figure 1, Figure 2 and Figure 7. In addition, in this embodiment, the thin film circuit board 1 further includes a structure outer edge barrier structure 28 (shown as a thick solid line in FIG. 2; it is not completely aligned with the structure edge of the first circuit substrate 122 for the sake of easy identification. Illustrated). The layered board structure 12 has a structural outer edge 130, and the structural outer edge blocking structure 28 is disposed between the first circuit substrate 122 and the insulating layer 126 and between the insulating layer 126 and the second circuit substrate 124 along the structural outer edge 130. The outer edge blocking structure 28 is arranged substantially on the entire outer edge of the layered plate structure 12. The portion 28a of the structure outer barrier structure 28 between the first circuit substrate 122 and the insulating layer 126 is structurally integrated with the board end barrier structure 20 to form a ring-shaped barrier structure. The structure outer edge barrier structure 28 is connected to the insulating layer 126 and The portion 28b between the second circuit boards 124 substantially forms a ring-shaped barrier structure. The structure outer edge barrier structure 28 can prevent or inhibit the aforementioned external chemical substances from entering the thin film circuit board 1 from the joints of the structure outer edge 130 (that is, between the first circuit substrate 122, the second circuit substrate 124 and the insulating layer 126). This reduces the chance of the first circuit layer 14 and the second circuit layer 16 (not shown in FIG. 7) reacting with these external chemicals. In addition, in practice, the material and formation of the barrier structure 28 at the outer edge of the structure can also be but not limited to the same as the plate end barrier structure 20, and will not be described again.

In addition, in this embodiment, the thin film circuit board 1 further includes an auxiliary structure outer edge barrier structure 30 (in FIG. 2, it is represented by a thick solid line; for ease of drawing, it is not completely attached to the structure of the second circuit substrate 124 The edge is shown), along the outer edge 130 of the structure, are arranged on the surface 122a of the first circuit substrate 122 opposite to the insulating layer 126 and on the surface 124a of the second circuit substrate 124 opposite to the insulating layer 126. Wherein, the outer edge barrier structure 30 of the auxiliary structure corresponds to the outer edge barrier structure 28 which is arranged substantially on the entire outer edge of the layered plate structure 12, and the outer edge barrier structure 30 of the auxiliary structure is disposed on the surface 122a of the first circuit substrate 122 at a portion 30a and The auxiliary board end barrier structure 22a is integrated to form a ring-shaped barrier structure, and the portion 30b of the auxiliary structure outer edge barrier structure 30 on the surface 124a of the second circuit substrate 124 substantially forms a ring-shaped barrier structure. Thereby, the outer barrier structure 30 of the auxiliary structure can also react with the aforementioned external chemical substances, which helps to reduce the chance of the first circuit layer 14 and the second circuit layer 16 reacting with these external chemical substances. In addition, in practice, the material and formation of the outer barrier structure 30 of the auxiliary structure may also be but not limited to the same as the outer barrier structure 28 of the structure. Go into details.

Please refer to Figure 1 to Figure 3 and Figure 8. In this embodiment, the switch contacts 142 and 162 can be moved relative to each other to trigger the corresponding circuit switch 17. The layered board structure 12 is located between the first circuit substrate 122 and the second circuit substrate 124 and corresponding to the switch through hole 1262. A compressible space 132 (shown in FIG. 3 with a dashed frame) is formed, which logically corresponds to the switch through hole 1262, and the corresponding circuit switch 17 is disposed in the compressible space 132. In addition, the layered plate structure 12 also includes a vent channel 134 connecting the compressible space 132 and the outside of the layered plate structure 12, thereby preventing or inhibiting the structure of the layered plate structure 12 adjacent to the circuit switch 17 from being triggered at the circuit switch 17 The structure is deformed due to changes in air pressure. In this embodiment, the air passage 134 is formed between the first circuit substrate 122 and the second circuit substrate 124 by the hollow structure of the insulating layer 126; wherein, the air passage 134 includes a curved connecting section 134a, a buffer groove 134b, and A plurality of compressible space connecting sections 134c, a buffer groove 134b connecting the curved connecting section 134a and the plurality of compressible space connecting sections 134c, and the air passage 134 is connected to the curved connecting section 134a through one of the through holes 128a (indicated in FIG. 1) The layered board structure 12 is externally connected to a plurality of compressible spaces 132 (corresponding to a plurality of circuit switches 17) by the plurality of compressible space connecting sections 134c.

In addition, in this embodiment, the thin film circuit board 1 further includes an air passage blocking structure 32 (shown as a thick solid line in FIG. 2), which is arranged on the first circuit substrate 122 and the second circuit substrate along the edges of the air passage 134 124 between. Wherein, in this embodiment, the air passage blocking structure 32 is formed on the first circuit substrate 122 and the second circuit substrate 124 corresponding to the edges of the air passage 134 (this is beneficial to be formed together with the first circuit layer 14 and the second circuit layer 16). ), but the implementation is not limited to this. The air passage blocking structure 32 can block or inhibit the aforementioned external chemical substances from penetrating into the thin film circuit board 1 from the air passage 134, thereby reducing the first circuit layer 14 and a second circuit layer 16 (not shown in FIG. 7) and these external Opportunities for chemical reactions. In this embodiment, the air passage barrier structure 32 is provided on both sides of the insulating layer 126 and can be connected to the through hole barrier structure 24 (for example, structural integration); if the air passage 134 is connected to the layered plate through the outer edge 130 of the structure Outside the structure 12, the air passage blocking structure 32 can be connected to the outer edge of the structure 28 (for example, structural integration). In addition, in practice, the material and formation of the air passage barrier structure 32 can also be but not limited to the same as the plate end barrier structure 20, and will not be described again.

In the foregoing embodiments, the barrier structures 20, 20a, 22a, 22b, 22c, 24, 26, 28, 30, 32 are mainly used to block or inhibit the entry of external chemical substances of the film circuit board 1, but in practice, the film circuit The board 1 must also include other barrier structures (such as structures with similar materials). For example, please also refer to FIG. 1, FIG. 2, FIG. 9 to FIG. 12. In the thin film circuit board 1, the insulating layer 126 has a plurality of openings 1266 (as shown in FIG. 2), the first circuit layer 14 and the second circuit layer 16 can pass through these openings 1266 to increase the flexibility of the circuit layout of the first circuit layer 14 and the second circuit layer 16. Wherein, as shown in FIG. 9, the corresponding opening 1266 of the first circuit layer 14 includes a first wire 148 and a third wire 150 disposed on a first surface 122b of the first circuit substrate 122 facing the second circuit substrate 124 Wherein, the first circuit layer 14 has hatching for easy identification, and the projection outline of the opening 1266 on the first circuit substrate 122 is drawn with chain lines. As shown in FIG. 10 (the viewing direction is from the insulating layer 126 to the second circuit substrate 124), the second circuit layer 16 corresponding to the opening 1266 includes a second wire 164 and a fourth wire 166, which are disposed on the second circuit substrate 124 faces the second surface 124b of the first circuit substrate 122; wherein, the second circuit layer 16 is hatched for easy identification. In addition, the projection contour of the opening 1266 on the second circuit substrate 124 is a chain line Illustrated. As shown in FIG. 11, the first wire 148 and the second wire 164 are disposed oppositely through the opening 1266, and the third wire 150 and the fourth wire 166 are disposed oppositely through the opening 1266. In FIG. 12, the hidden circuit of the first circuit layer 14 is drawn with a thin dashed line, the hidden circuit of the second circuit layer 16 is drawn with a thick dashed line, and the hidden outline of the opening 1266 is drawn with a chain line; where, the first wire The contours of 148 and the second wire 164 overlap, and the contours of the third wire 150 and the fourth wire 166 partially overlap. As shown in FIG. 11, the thin film circuit board 1 further includes a conductive material 19 (not shown in FIG. 2), which is disposed in the opening 1266 and located between the first wire 148 and the second wire 164. The first wire 148 The second wire 164 and the second wire 164 are electrically connected via the conductive material 19, and the third wire 150 and the fourth wire 166 are also electrically connected via the conductive material 19. In practice, the conductive material 19 can be, but is not limited to, an anisotropic conductive film, which has the functions of unidirectional conduction and bonding and fixing, and can simultaneously and correspondingly electrically connect the first circuit layer 14 and Second circuit layer 16 different connection points (for example, wire 148 and wire 164, wire 150 and wire 166).

In addition, in this embodiment, the thin film circuit board 1 further includes a wire connection blocking structure 34 disposed between the first circuit substrate 122 and the second circuit substrate 124 and surrounding the conductive material 19; the wire connection blocking structure 34 is thick and solid The line is shown in FIG. 2 and its outline is shown in FIG. 12 with a dashed line; in FIG. 9 and FIG. 10, the wire connection blocking structure 34 is also hatched for easy identification. The material and formation method of the wire connection barrier structure 34 are but not limited to the same as the board end barrier structure 20, and will not be described further; in this embodiment, the wire connection barrier structure 34 is made of material and the first circuit layer 14 and the second circuit The layers 16 are the same and formed together, which can simplify the manufacturing process. In this embodiment, in order to avoid short circuits, the wire connection blocking structure 34 is implemented with a plurality of blocking sections 34a~i. As shown in FIG. 9, on the first circuit substrate 122, part of the barrier sections 34a, 34b are located in the opening 1266, and some of the barrier sections 34c, 34d, 34e are located outside the opening 1266, and the barrier sections 34d, 34e are respectively connected to the first A wire 148 and a third wire 150 are connected. Among them, the barrier sections 34c, 34d, and 34e are located between the first circuit substrate 122 and the insulating layer 126, so they will not touch the second circuit layer 16, even if the barrier sections 34c, 34d and the second wire 164 and the fourth wire 166 In the case where the projections in the vertical direction 12a overlap. As shown in FIG. 10, on the second circuit substrate 124, some blocking sections 34f and 34g are located in the opening 1266, and some blocking sections 34h and 34i are located outside the opening 1266 and are respectively connected to the second wire 164 and the fourth wire 166 . Among them, the barrier sections 34h, 34i are located between the second circuit substrate 124 and the insulating layer 126, so they will not contact the first circuit layer 14, even if the barrier section 34h and the first wire 148 and the third wire 150 are in the vertical direction 12a When the projections overlap.

In this embodiment, the plurality of barrier sections 34a~i overlap the projections perpendicular to the vertical direction 12a from the center of the opening 1266 to the surroundings to form a ring, so that the wire connection barrier structure 34 forms a closed structure in the radial direction as a whole (ie There are wire connection blocking structures 34) in the direction from the center of the opening 1266 to the periphery. Thereby, the wire connection blocking structure 34 can block or suppress the opportunity for the external chemical substance entering the thin film circuit board 1 to further enter the opening 1266 and react with the wires 148, 150, 164, and 166. In addition, in this embodiment, the barrier sections 34a~e are perpendicular to the vertical direction 12a and projected from the center of the opening 1266 to the surroundings. The overlap forms a ring shape, which itself can block or inhibit the opportunity for external chemical substances entering between the first circuit substrate 122 and the insulating layer 126 to further enter the opening 1266 and react with the wires 148, 150, 164, and 166. Similarly, the blocking section 34f~i overlaps the projections perpendicular to the vertical direction 12a from the center of the opening 1266 to the surroundings to form a ring shape, which itself can block or inhibit entry between the second circuit substrate 124 and the insulating layer 126 There is an opportunity for external chemicals to further enter the opening 1266 and react with the wires 148, 150, 164, and 166. But the implementation is not limited to this. In practice, even if the wire connection blocking structure 34 does not completely enclose the conductive material 19 in the radial direction (or the part where the wires 148, 150, 164, 166 are electrically connected via the conductive material 19), it can still interfere with the entry into the thin film circuit board 1. The external chemical substance produces a certain degree of hindering effect, that is, it is beneficial to suppress the opportunity of the external chemical substance to react with the wires 148, 150, 164, and 166.

In addition, in practice, the aforementioned wire connection blocking structure 34 can also be applied to the circuit switch 17 (for example, arranged inside or outside the switch through hole 1262) to block or inhibit the entry of external chemicals into the film circuit board 1 The switch through hole 1262 also has the opportunity to react with the switch contacts 142, 162, thereby achieving the effect of protecting the switch contacts 142, 162; its practical structure can be obtained by referring to the relevant description of the wire connection barrier structure 34 mentioned above, and will not be repeated. .

The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention should fall within the scope of the present invention.

1a: Flexible circuit board connection end

12a: vertical direction

1222: carrier board

1222a: bearing surface

1222b: Contact area

1222c: surface

1222d: main body

1222e: Protruding direction

1222f: Insert end

1264: protective layer

1264a: side

1264b: Surface

1264c: side edge

144: Wire layer

146, 146a: contact

18: Strengthening film

20: Board end barrier structure

22a, 22b, 22c: auxiliary plate end barrier structure

Claims (20)

A flexible circuit board connection end, comprising: a carrier board with a carrying surface, the carrying surface includes a contact area; a wire layer, arranged on the carrying surface and including a plurality of contacts, the plurality of contacts Located in the contact area; a protective layer arranged on the carrying surface to expose the contact area; and a board end blocking structure arranged on at least one side edge of the contact area. The flexible circuit board connection terminal according to claim 1, wherein the protective layer has a side edge, the contact area protrudes from the side edge, and the at least one side edge and the side edge surround the contact area. The flexible circuit board connection end according to claim 1, wherein the carrier board has a main body portion and an insertion end portion extending from the main body portion in a protruding direction, the contact area is located at the insertion end portion, and the insertion end portion The end portion has a first length perpendicular to the protruding direction, the main body portion has a second length perpendicular to the protruding direction, the second length is greater than the first length, and the plate end blocking structure extends to the main portion and the protection Between layers. The flexible circuit board connection end according to claim 3, wherein the extension width of the board end barrier structure between the main body portion and the protective layer in the protruding direction is greater than that of the board end barrier structure on the contact area The extension width in the protruding direction. The flexible circuit board connection end according to claim 1, wherein the board end blocking structure includes a dummy terminal located outside the plurality of contacts and adjacent to and extending parallel to one of the contacts. A thin film circuit board, comprising: a layered board structure, including a first circuit substrate, a second circuit substrate, and an insulating layer arranged between the first circuit substrate and the second circuit substrate, the layered board structure Having a through hole penetrating the first circuit substrate, the second circuit substrate and the insulating layer; a first circuit layer forming a circuit on the first circuit substrate; A second circuit layer forming a circuit on the second circuit substrate; and a through hole blocking structure arranged between the first circuit substrate and the insulating layer and between the insulating layer and the second circuit substrate around the through hole In between, the through hole blocking structure, the first circuit layer and the second circuit layer have the same conductive material. The thin film circuit board according to claim 6, further comprising an auxiliary through-hole blocking structure, and the through-hole is arranged on a surface of the first circuit substrate or the second circuit substrate opposite to the insulating layer. The thin film circuit board according to claim 6, further comprising a structural outer edge barrier structure, wherein the layered plate structure has a structural outer edge, and the structural outer edge barrier structure is disposed on the first circuit substrate along the outer edge of the structure Between the insulating layer and the insulating layer and the second circuit substrate. The thin film circuit board according to claim 8, further comprising an auxiliary structure outer edge barrier structure, which is arranged on a surface of the first circuit substrate or the second circuit substrate opposite to the insulating layer along the outer edge of the structure. The thin film circuit board according to claim 6, further comprising the flexible circuit board connection terminal according to any one of claims 1 to 5, wherein the carrier board is derived from the first circuit substrate or the second circuit The substrate extends. A thin film circuit board, comprising: a layered board structure, including a first circuit substrate, a second circuit substrate, and an insulating layer arranged between the first circuit substrate and the second circuit substrate, the layered board structure It has a compressible space and a vent channel formed between the first circuit substrate and the second circuit substrate and communicates with the compressible space and the outside of the layered plate structure; a circuit switch including a circuit switch arranged on the Two switch contacts in the compressible space; and a vent channel blocking structure arranged between the first circuit substrate and the second circuit substrate along the edge of the vent channel, the vent channel blocking structure and the two switch contacts have Same conductive material quality. The thin film circuit board according to claim 11, further comprising a structural outer edge barrier structure, wherein the layered plate structure has a structural outer edge, and the structural outer edge barrier structure is disposed on the first circuit substrate along the outer edge of the structure Between the insulating layer and the insulating layer and the second circuit substrate. The thin film circuit board according to claim 12, further comprising an auxiliary structure outer edge barrier structure, which is arranged on a surface of the first circuit substrate or the second circuit substrate opposite to the insulating layer along the outer edge of the structure. The thin film circuit board according to claim 11, further comprising the flexible circuit board connection terminal according to any one of claims 1 to 5, wherein the carrier board is derived from the first circuit substrate or the second circuit The substrate extends. The thin film circuit board according to claim 14, wherein the protective layer extends from the insulating layer. A thin film circuit board includes: a layered board structure, including a first circuit substrate, a second circuit substrate, an insulating layer disposed between the first circuit substrate and the second circuit substrate, the insulating layer having a A hole; a first wire disposed on a first surface of the first circuit substrate facing the second circuit substrate; a second wire disposed on the second circuit substrate facing a second surface of the first circuit substrate On the surface, the first wire and the second wire are opposed to each other through the opening; a conductive material is disposed in the opening and located between the first wire and the second wire, the first wire and the second wire Two wires are electrically connected via the conductive material; and a wire connection barrier structure is disposed between the first circuit substrate and the second circuit substrate and surrounds the conductive material, the wire connects the barrier structure, the first wire and the first The two wires have the same conductive material. The thin film circuit board according to claim 16, further comprising a structure outer edge barrier structure, which The layered plate structure has a structure outer edge, and the structure outer edge blocking structure is disposed between the first circuit substrate and the insulating layer and between the insulating layer and the second circuit substrate along the outer edge of the structure. The thin film circuit board according to claim 16, wherein the first circuit substrate, the second circuit substrate, and the insulating layer are stacked in a vertical direction, and the wire-connected blocking structure includes a plurality of blocking sections, and the plurality of blocking sections The projections perpendicular to the vertical direction from the center of the opening to the periphery overlap to form a ring. The thin-film circuit board according to claim 16, further comprising a third wire disposed on the first surface, wherein the wire connection blocking structure includes two blocking sections respectively connected to the first wire and the third wire. The thin film circuit board according to claim 16, further comprising the flexible circuit board connection terminal according to any one of claims 1 to 5, wherein the carrier board is derived from the first circuit substrate or the second circuit The substrate extends.

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