TWI823350B - Flexible circuit board connectors, touch screens and display devices - Google Patents

Abstract

The invention relates to a flexible circuit board (FPC) connector, a touch screen and a display device, including a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer and a third insulating layer. The first circuit The layer is located between the first insulating layer and the second insulating layer, and the front part of the first circuit layer and the front part of the second insulating layer both extend from the front end of the first insulating layer; the first circuit layer includes a plurality of conductive strips; The three insulating layers are located between the first insulating layer and the first circuit layer. The second circuit layer is a plurality of conductive strips on the upper side of the third insulating layer; the ends of the plurality of conductive strips of the second circuit layer pass through the third The insulating layer is connected correspondingly to the plurality of conductive strips on the first circuit layer. The invention can realize the coexistence of multiple interfaces, and the interface is not easily damaged when plugged into the motherboard, and is easy to use.

Description

Flexible circuit board connectors, touch screens and display devices

The present invention relates to the field of connectors, and in particular to a flexible circuit board (FPC) connector, a touch screen and a display device.

Some display devices and touch devices (such as LCD display devices, OLED display devices and capacitive touch screens, etc.) use soldered flexible circuit boards (FPC). Due to process limitations, the pins of such FPC boards The distance is generally above 0.8mm, and its unit width cannot accommodate more pins (for example, the common 37 pins), making it impossible to achieve the coexistence of multiple interfaces. In addition, during the welding process with the motherboard, the interface is easily damaged and cannot be repeated. There is a lot of waste in use, and maintenance is inconvenient.

The purpose of the present invention is to provide a flexible circuit board (FPC) connector and a display device. The technical problems to be solved are: the conventional flexible circuit board cannot realize the coexistence of multiple interfaces, and it is easy to It destroys the interface, cannot be reused, is wasteful, and is inconvenient to repair.

The technical solution of the present invention to solve the above technical problems is as follows: The present invention provides a flexible circuit board connector, which includes a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer and N third insulating layers. layer, the first circuit layer is located between the first insulating layer and the second insulating layer, and the first circuit layer includes a plurality of conductive strips; the third insulating layer is located between the first insulating layer and the first circuit layer, and the second circuit layer are a plurality of conductive strips on the upper side of the third insulating layer; the ends of the plurality of conductive strips on the second circuit layer pass through the N third insulating layers and are correspondingly connected to the plurality of conductive strips on the first circuit layer. The front part of a circuit layer and the front part of the second insulating layer both extend from the front ends of the first insulating layer, N third insulating layers and the second circuit layer; where N≥0.

The beneficial effects of the present invention are: the first insulating layer and the second insulating layer insulate and protect the first circuit layer; the first insulating layer, the first circuit layer, the second insulating layer, the third insulating layer and the second circuit The layer can achieve high-density wiring, is light, thin and easy to bend, and is used in the continuous miniaturization, thinning and flexible use of space in electronic products; the metal layer can increase the conductive strength and increase the circuit hardness; in addition, it can achieve a variety of The interfaces coexist and are plugged into the motherboard. Plugging is easier than soldering, so that the interface is not damaged, making it more convenient to use, saving time, and can be reused.

Further, the flexible circuit board connector includes a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer and N third insulating layers. The first circuit layer is located between the first insulating layer and the second insulating layer. between, the first circuit layer includes a plurality of conductive strips; the third insulating layer is located between the first insulating layer and the first circuit layer, and the second circuit layer is a plurality of conductive strips on the upper side of the third insulating layer; The ends of the plurality of conductive strips on the second circuit layer pass through the N third insulating layers and are correspondingly connected to the plurality of conductive strips on the first circuit layer. Both the front part of the first circuit layer and the front part of the second insulating layer extend Out the front end of the first insulating layer, N third insulating layers and the second circuit layer; where N≥0.

Further, the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes and are connected to the plurality of conductive strips of the first circuit layer. The holes are gold plated or immersed in gold.

Further, the front parts of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm to 1.0 mm.

Further, N fourth insulating layers are provided between the second insulating layer and the first circuit layer, and a third circuit layer composed of a plurality of conductive strips is provided on the lower side of each fourth insulating layer. A plurality of conductive strips pass upward through N fourth insulating layers and are connected to a plurality of conductive strips on the first circuit layer; where N≥0.

Further, each fourth insulating layer is provided with a second via hole corresponding to each conductive strip on the third circuit layer, and the plurality of conductive strips on the third circuit layer pass through the corresponding second via hole and are in contact with the first circuit layer. Connect multiple conductive strips on the second via hole; perform gold plating or gold immersion in the hole of the second via hole.

Further, the conductive strips on the first circuit layer, the second circuit layer and the third circuit layer are all made of gold, nickel, copper, tin, silver, aluminum or graphene.

Further, both the first insulating layer and the second insulating layer are made of polyimide (PI) or polyethylene terephthalate (PET).

Further, a reinforcing plate is provided on the lower side of the second insulating layer, and a metal layer is provided on the upper surface of the front portion of the plurality of conductive strips of the first circuit layer to form a metal finger, and the reinforcing plate is located below the metal finger.

Further, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer, the fourth insulating layer, the third circuit layer, the second insulating layer and the reinforcing plate are laminated by thermosetting glue and hot pressing in sequence. .

Further, the front part of the first circuit layer, the front part of the second insulating layer and the part of the reinforcing plate extending out of the front end of the first insulating layer, the N third insulating layers and the second circuit layer are of equal width and length, and Total overlap.

A flexible circuit board connector includes a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer and a third insulating layer. The first circuit layer is located between the first insulating layer and the second insulating layer. The first circuit layer includes a plurality of conductive strips; the third insulating layer is located between the first insulating layer and the first circuit layer; the second circuit layer is a plurality of conductive strips on the upper side of the third insulating layer; the second circuit layer The ends of the plurality of conductive strips pass through the third insulating layer and are correspondingly connected to the plurality of conductive strips on the first circuit layer. The front part of the first circuit layer, the front part of the third insulating layer and the front part of the first insulating layer The front ends of the second insulating layer are extended out of the first insulating layer. A reinforcing plate is provided on the upper side of the first insulating layer. A metal layer is provided on the lower surface of the front portion of the plurality of conductive strips of the first circuit layer to form a metal finger. The reinforcing plate Above the metal finger.

Further, the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer respectively pass through the corresponding first via holes and are connected to the plurality of conductive strips of the first circuit layer. The via hole is gold plated or immersed in gold.

Further, the front parts of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm to 1.0 mm.

Further, the reinforcing plate, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer and the second insulating layer are sequentially bonded through thermosetting glue and hot-pressed.

Further, the front part of the first circuit layer, the front part of the third insulating layer, the front part of the first insulating layer and the part of the reinforcing plate extending from the front end of the second insulating layer are of the same width and length, and completely overlap.

A touch screen includes the flexible circuit board connector as mentioned above.

Further, the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer respectively pass through the corresponding first via holes and are connected to the plurality of conductive strips of the first circuit layer. The via holes are gold plated or immersed in gold.

Further, the front parts of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm to 1.0 mm.

Further, a reinforcing plate is provided on the lower side of the second insulating layer, and a metal layer is provided on the upper surface of the front portion of the plurality of conductive strips of the first circuit layer to form a metal finger, and the reinforcing plate is located below the metal finger.

Further, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer, the second insulating layer and the reinforcing plate are sequentially bonded through thermosetting glue and hot pressing.

Further, the front part of the first circuit layer, the front part of the second insulating layer and the part of the reinforcing plate extending from the front end of the first insulating layer, the third insulating layer and the second circuit layer are of the same width and length, and completely overlap. .

A touch screen includes the flexible circuit board connector as mentioned above.

Further, the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer respectively pass through the corresponding first via holes and are connected to the plurality of conductive strips of the first circuit layer. The via holes are gold plated or immersed in gold.

Further, the front parts of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm to 1.0 mm.

Further, the reinforcing plate, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer and the second insulating layer are sequentially bonded through thermosetting glue and hot-pressed.

Further, the front part of the first circuit layer, the front part of the third insulating layer, the front part of the first insulating layer and the part of the reinforcing plate extending from the front end of the second insulating layer are of the same width and length, and completely overlap.

A display device includes the flexible circuit board connector as described above.

Further, the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes and are connected to the plurality of conductive strips of the first circuit layer. The first vias The holes are gold plated or immersed in gold.

Further, the front parts of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm to 1.0 mm.

Further, a reinforcing plate is provided on the lower side of the second insulating layer, and a metal layer is provided on the upper surface of the front portion of the plurality of conductive strips of the first circuit layer to form a metal finger, and the reinforcing plate is located below the metal finger.

Further, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer, the second insulating layer and the reinforcing plate are sequentially bonded through thermosetting glue and hot pressing.

Further, the front part of the first circuit layer, the front part of the second insulating layer and the part of the reinforcing plate extending from the front end of the first insulating layer, the third insulating layer and the second circuit layer are of the same width and length, and completely overlap. .

A display device includes the flexible circuit board connector as described above.

Further, the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes and are connected to the plurality of conductive strips of the first circuit layer. The first vias The holes are gold plated or immersed in gold.

Further, the front parts of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm to 1.0 mm.

Further, the reinforcing plate, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer and the second insulating layer are sequentially bonded through thermosetting glue and hot-pressed.

Further, the front part of the first circuit layer, the front part of the third insulating layer, the front part of the first insulating layer and the part of the reinforcing plate extending from the front end of the second insulating layer are of the same width and length, and completely overlap.

The principles and features of the present invention will be described below with reference to the accompanying drawings. The enumerated embodiments are only used to explain the present invention and are not intended to limit the scope of the present invention.

Example 1:

As shown in Figures 1 to 3, the present invention provides a flexible circuit board (FPC) connector, which includes a first insulating layer 1, a first circuit layer 2 and a second insulating layer 3. The first circuit layer 2 is disposed on the first On the lower side of an insulating layer 1, a second insulating layer 3 is placed on the lower side of the first circuit layer 2. Both the front part of the first circuit layer 2 and the front part of the second insulating layer 3 extend beyond the first insulating layer 1. front end. The first circuit layer 2 is composed of a plurality of conductive strips. The front parts of the plurality of conductive strips are arranged in parallel at equal intervals. The upper surface is plated with gold or immersed in gold to form a metal layer 4. The front parts of the conductive strips and the metal layer 4 form a metal finger. .

The first insulating layer 1 and the second insulating layer 3 insulate and protect the first circuit layer 2; the first insulating layer 1, the first circuit layer 2 and the second insulating layer 3 can realize high-density wiring, which is light and thin. It is easy to bend and is used in the continuous miniaturization and thinning of electronic products to achieve flexible space utilization. Metal layer 4 can increase conductive strength and increase circuit hardness. In addition, multiple interfaces can coexist and be plugged into the motherboard. Plugging is easier than soldering, so that the interface is not damaged, making it more convenient to use, saving time, and can be reused.

In the above embodiment, N third insulating layers 5 are provided between the first insulating layer 1 and the first circuit layer 2, and a second circuit composed of a plurality of conductive strips is provided on the upper side of each third insulating layer 5. Layer 7. The plurality of conductive strips of the second circuit layer 7 pass downward through the N third insulating layers 5 and are correspondingly connected to the plurality of conductive strips on the first circuit layer 2; between the second insulating layer 3 and the first circuit layer 2 N fourth insulating layers 6 are provided. The lower side of each fourth insulating layer 6 is provided with a third circuit layer 8 composed of a plurality of conductive strips. The plurality of conductive strips on the third circuit layer 8 pass upward through N The fourth insulating layer 6 is connected to a plurality of conductive strips on the first circuit layer 2; where N≥0.

The first insulating layer 1 and the first circuit layer 2, the third insulating layer 5, the second circuit layer 7, the fourth insulating layer 6, the third circuit layer 8 and the second insulating layer 3 can realize high-density wiring, which is light and Thin and easy to bend, it is used in the continuous miniaturization and thinning of electronic products to achieve flexible space utilization.

In the above embodiment, the conductive strips on the first circuit layer 2, the second circuit layer 7 and the third circuit layer 8 are all made of gold, nickel, copper, tin, silver, aluminum or graphene. Among them, gold, nickel, copper, tin, silver, aluminum or graphene have strong electrical conductivity.

In the above embodiment, each third insulating layer 5 is provided with a first via 9 at each conductive strip on the second circuit layer 7, and a plurality of conductive strips on the second circuit layer 7 pass through the corresponding first via hole 9 respectively. The via holes 9 are connected to a plurality of conductive strips on the first circuit layer 2. Each fourth insulating layer 6 is provided with a second via hole 10 corresponding to each conductive strip on the third circuit layer 8. A plurality of conductive strips respectively pass through the corresponding second via holes 10 and are connected to a plurality of conductive strips on the first circuit layer 2 . Furthermore, gold plating or gold immersion is performed in the first via hole 9 and the second via hole 10 .

The first via hole 9 and the second via hole 10 facilitate the connection of the first circuit layer 2 with the second circuit layer 7 and the third circuit layer 8 respectively, thereby enabling high-density wiring. Moreover, gold plating or gold immersion in the holes is beneficial to the stability of the connection.

In the above embodiment, the distance between two adjacent conductive strips on the first circuit layer 2 is 0.3 mm to 1.0 mm. As the pin pitch becomes smaller, more pins can be accommodated per unit length, making it easier to reserve a variety of interfaces, such as the Main Controller Unit (MCU) interface, RGB interface, and Serial Peripheral Interface. , SPI), Mobile Industry Processor Interface (MIPI), Low-Voltage Differential Signaling (LVDS) interface, electronic compass (I2C) interface, high-definition multimedia interface (HDMI) and universal serial bus (Universal Serial Bus, USB) interface, and can further integrate touch screen interface and backlight interface.

In the above embodiment, both the first insulating layer 1 and the second insulating layer 3 are made of polyimide (PI) material or polyethylene terephthalate (PET) material, where PI or PET has strong insulation properties.

In the above embodiment, the reinforcing plate 11 is provided on the lower side of the second insulating layer 3 , and the reinforcing plate 11 is correspondingly located below the metal finger.

In the above embodiment, the first insulating layer 1, the second circuit layer 7, the third insulating layer 5, the first circuit layer 2, the fourth insulating layer 6, the third circuit layer 8, the second insulating layer 3 and the reinforcing plate 11 Through hot pressing in sequence, the thermosetting adhesive hot pressing can strengthen the first insulating layer 1, the second circuit layer 7, the third insulating layer 5, the first circuit layer 2, the fourth insulating layer 6 and the third circuit layer 8. , the connection strength between the second insulating layer 3 and the reinforcing plate 11.

Example 2:

FIG. 4 schematically illustrates the situation where N is 0 in the above-mentioned Embodiment 1, that is, the fourth insulating layer 6 and the third circuit layer 8 are omitted. In this embodiment, the flexible circuit board connector includes a first insulating layer 1, a first circuit layer 2, a second insulating layer 3, a second circuit layer 7 and a third insulating layer 5. The first circuit layer 2 is located on the first Between the insulating layer 1 and the second insulating layer 3, the first circuit layer 2 includes a plurality of conductive strips. The third insulating layer 5 is located between the first insulating layer 1 and the first circuit layer 2. The second circuit layer 7 is a plurality of conductive strips on the upper side of the third insulating layer 5; The ends of the strips pass through the third insulating layer 5 and are correspondingly connected to a plurality of conductive strips on the first circuit layer 2 . The front portion of the first circuit layer 2 and the front portion of the second insulating layer 3 both extend from the front ends of the first insulating layer 1 , the third insulating layer 5 and the second circuit layer 7 .

In this embodiment, the front part of the first circuit layer 2 , the front part of the second insulating layer 3 and the reinforcing plate 11 extend beyond the front ends of the first insulating layer 1 , the third insulating layer 5 and the second circuit layer 7 Equal width and equal length, and completely coincident.

Example 3:

FIG. 5 schematically illustrates the situation where N is 0 in the above-mentioned Embodiment 1, that is, the fourth insulating layer 6 and the third circuit layer 8 are omitted. In this embodiment, a flexible circuit board connector includes a first insulation layer 1, a first circuit layer 2, a second insulation layer 3, a second circuit layer 7 and a third insulation layer 5. The first circuit layer 2 is located on the third Between an insulating layer 1 and a second insulating layer 3, the first circuit layer 2 includes a plurality of conductive strips. The third insulating layer 5 is located between the first insulating layer 1 and the first circuit layer 2 . The second circuit layer 7 is a plurality of conductive strips on the upper side of the third insulating layer 5 . The ends of the plurality of conductive strips on the second circuit layer 7 pass through the third insulating layer 5 and are correspondingly connected to the plurality of conductive strips on the first circuit layer 2 . The front part of the first circuit layer 2 and the third insulating layer 5 Both the front part and the front part of the first insulating layer 1 extend from the front end of the second insulating layer 3. The upper side of the first insulating layer 1 is provided with a reinforcing plate 11a. The front part of the plurality of conductive strips of the first circuit layer 2 A metal layer 4 is provided on the lower surface to form a metal finger, and the reinforcing plate 11a is located above the metal finger. In this embodiment, the front part of the first circuit layer 2, the front part of the third insulating layer 5, the front part of the first insulating layer 1 and the part of the reinforcing plate 11a extending from the front end of the second insulating layer 3 are of equal width and Equal length and completely coincident.

Example 4:

A touch screen, including the flexible circuit board connector in the above-mentioned Embodiment 1; the flexible circuit board connector can be directly plugged into the connector of the circuit board without being welded to the motherboard to realize the display device and the host computer The boards are connected and receive power and signals. The flexible circuit board connector of this touch screen can achieve high-density wiring. It is light, thin and easy to bend. It is used in the continuous miniaturization and thinning of electronic products to achieve flexible space utilization. Metal layer 4 can increase conductive strength and increase circuit hardness. In addition, multiple interfaces can coexist and be plugged into the motherboard. Plugging is easier than soldering, so that the interface will not be damaged. It is more convenient and time-saving to use, and can be reused, making the touch control more convenient. The overall performance of the screen is higher.

Example 5:

A touch screen, including the flexible circuit board connector of the above-mentioned Embodiment 2; the flexible circuit board connector can be directly plugged into the connector of the circuit board without being welded to the motherboard to realize the display device and the motherboard Connect to each other and get power and signals. The cost of the flexible circuit board connector of the touch screen in this embodiment is lower, so that the cost of the touch screen is also lower, and it also has the performance of the touch screen in the above-mentioned Embodiment 4.

Example 6:

A touch screen, including the flexible circuit board connector of the above-mentioned Embodiment 3; the flexible circuit board connector can be directly plugged into the connector of the circuit board without being welded to the motherboard to realize the display device and the motherboard Connect to each other and get power and signals. In this embodiment, the touch screen not only has the performance of the touch screen in the above-mentioned Embodiment 4, but also has the front part of the first circuit layer 2 , the front part of the third insulating layer 5 , and the front part of the first insulating layer 1 . The front part and the part of the reinforcing plate 11a extending from the front end of the second insulating layer 3 are equal in width and length, and completely overlap. The reinforcing plate 11a is arranged on the upper side of the first insulating layer 1, which can adapt to some touch screens. Plugging and unplugging habits can improve the service life.

Example 7:

A display device. The display device may be a liquid crystal screen, which includes the flexible circuit board connector in the above-mentioned Embodiment 1; the flexible circuit board connector may not be soldered to the motherboard, but directly plugged into the connector of the circuit board. , to connect the display device and the motherboard and obtain power and signals. The flexible circuit board connector of this display device can realize high-density wiring, is light, thin and easy to bend, and is used in the continuous miniaturization and thinning of electronic products to achieve flexible space utilization. Metal layer 4 can increase conductive strength and increase circuit hardness. In addition, multiple interfaces can coexist and be plugged into the motherboard. Plugging is easier than soldering, so that the interface is not damaged. It is more convenient to use, saves time, and can be reused, making the display The overall performance of the device is higher.

Example 8:

A display device. This display device may be a liquid crystal screen, which includes the flexible circuit board connector in the above-mentioned Embodiment 2; the flexible circuit board connector may not be soldered to the motherboard, but directly inserted into the connector of the circuit board. , to connect the display device and the motherboard and obtain power and signals. The cost of the flexible circuit board connector of the display device in this embodiment is lower, so that the cost of the display device is also lower, and it also has the performance of the display device in Embodiment 7 above.

Example 9:

A display device. This display device may be a liquid crystal screen, which includes the flexible circuit board connector in the above-mentioned Embodiment 3; the flexible circuit board connector may not be soldered to the motherboard, but directly plugged into the connector of the circuit board. , to connect the display device and the motherboard and obtain power and signals. In this embodiment, the display device not only has the performance of the display device in Embodiment 7 above, but also has the front portion of the first circuit layer 2 , the front portion of the third insulating layer 5 , the front portion of the first insulating layer 1 and The part of the reinforcing plate 11a extending from the front end of the second insulating layer 3 is of equal width and length, and completely overlaps. The reinforcing plate 11a is arranged on the upper side of the first insulating layer 1, which can adapt to the plugging and unplugging habits of some display devices. Improve service life.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

1: First insulation layer 2: First circuit layer 3: Second insulation layer 4:Metal layer 5:Third insulation layer 6: The fourth insulation layer 7: Second circuit layer 8: The third circuit layer 9: First via hole 10: Second via hole 11,11a: Reinforcement board

Figure 1 is a structural exploded schematic diagram of a flexible circuit board (FPC) connector of the present invention; Figure 2 is a front view between a plurality of conductive strips and a metal layer; Figure 3 is a front view of a flexible circuit board connector according to the present invention. Figure 4 is an exploded schematic structural view of another flexible circuit board connector according to the present invention; and FIG. 5 is an exploded schematic diagram of the structure of yet another flexible circuit board connector according to the present invention.

1: First insulation layer 2: First circuit layer 3: Second insulation layer 4:Metal layer 5:Third insulation layer 7: Second circuit layer 9: First via hole 11a: Reinforcement board

Claims (34)

A flexible circuit board connector, which includes a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer and N third insulating layers. The first circuit layer is located on the first insulating layer. layer and the second insulating layer, the first circuit layer includes a plurality of conductive strips; the third insulating layer is located between the first insulating layer and the first circuit layer, the second circuit layer is the third A plurality of conductive strips on the upper side of the insulating layer; the ends of the plurality of conductive strips on the second circuit layer pass through the N third insulating layers and are correspondingly connected to the plurality of conductive strips on the first circuit layer, the The front part of the first circuit layer and the front part of the second insulating layer both extend from the first insulating layer, N third insulating layers and the front ends of the second circuit layer; where N

0; wherein no components are disposed between the first circuit layer and the second insulating layer. The flexible circuit board connector according to claim 1, wherein the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes respectively and are connected with the first via hole. A plurality of conductive strips on the first circuit layer are connected, and gold plating or gold immersion is performed in the first via hole. The flexible circuit board connector according to claim 1, wherein the front parts of the conductive strips of the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm~1.0mm. The flexible circuit board connector according to claim 1, wherein the first insulating layer and the second insulating layer are both polyimide (PI) material or polyethylene terephthalate (PET) material. The flexible circuit board connector according to claim 4, wherein a reinforcing plate is provided on the lower side of the second insulating layer, and a metal layer is provided on the upper surface of the front portion of the plurality of conductive strips of the first circuit layer. A metal finger, the reinforcing plate is in the The metal finger below. The flexible circuit board connector according to claim 5, wherein the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer, the second insulating layer and the reinforcing plate are sequentially heated through Glue and heat press. The flexible circuit board connector according to claim 5, wherein the front part of the first circuit layer, the front part of the second insulating layer and the reinforcing plate extend out of the first insulating layer and N third insulating layers. It is the same width and length as the front end of the second circuit layer, and completely overlaps with it. A flexible circuit board connector, which includes a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer and a third insulating layer, the first circuit layer is located on the first insulating layer and the second insulating layer, the first circuit layer includes a plurality of conductive strips; the third insulating layer is located between the first insulating layer and the first circuit layer, the second circuit layer is the third insulating layer A plurality of conductive strips on the upper side of the layer; the ends of the plurality of conductive strips on the second circuit layer pass through the third insulating layer and are correspondingly connected to the plurality of conductive strips on the first circuit layer, and the first circuit layer The front part of the layer, the front part of the third insulating layer and the front part of the first insulating layer all extend from the front end of the second insulating layer. A reinforcing plate is provided on the upper side of the first insulating layer. The first circuit A metal layer is provided on the lower surface of the front part of the plurality of conductive strips of the layer to form a metal finger, and the reinforcing plate is above the metal finger; wherein, there is no set between the first circuit layer and the second insulating layer. element. The flexible circuit board connector according to claim 8, wherein the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes respectively and are connected with the first via hole. A plurality of conductive strips on the first circuit layer are connected, and gold plating or gold immersion is performed in the first via hole. The flexible circuit board connector according to claim 8, wherein the front portions of the conductive strips of the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm~1.0mm. The flexible circuit board connector of claim 8, wherein the reinforcing plate, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer and the second insulating layer sequentially transmit heat Solid glue and hot pressing. The flexible circuit board connector of claim 8, wherein the front part of the first circuit layer, the front part of the third insulation layer, the front part of the first insulation layer and the reinforcing plate extend out of the second insulation The front portions of the layers are equal in width and length, and completely coincide with each other. A touch screen, which includes the flexible circuit board connector described in any one of claims 1 to 7. The touch screen of claim 13, wherein the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes respectively and are connected with the first via holes. A plurality of conductive strips on the first circuit layer are connected, and gold plating or gold immersion is performed in the first via hole. The touch screen as claimed in claim 13, wherein the front portions of the conductive strips on the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3mm. ~1.0mm. The touch screen of claim 13, wherein a reinforcing plate is provided on the lower side of the second insulating layer, and a metal layer is provided on the upper surface of the front portion of the plurality of conductive strips of the first circuit layer to form a Metal finger, the reinforcing plate is located below the metal finger. The touch screen as claimed in claim 16, wherein the first insulating layer, the third The second circuit layer, the third insulating layer, the first circuit layer, the second insulating layer and the reinforcing plate are sequentially bonded through thermosetting glue and hot pressing. The touch screen of claim 16, wherein the front part of the first circuit layer, the front part of the second insulating layer and the reinforcing plate extend out of the first insulating layer, the third insulating layer and the third insulating layer. The front portions of the two circuit layers are equal in width and length, and completely overlap. A touch screen, which includes the flexible circuit board connector described in any one of claims 8 to 12. The touch screen of claim 19, wherein the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer pass through the corresponding first via holes respectively and are connected with the first via holes. A plurality of conductive strips on the first circuit layer are connected, and gold plating or gold immersion is performed in the first via hole. The touch screen of claim 19, wherein the front portions of the conductive strips of the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3 mm~1.0mm. The touch screen as claimed in claim 19, wherein the reinforcing plate, the first insulation layer, the second circuit layer, the third insulation layer, the first circuit layer and the second insulation layer are sequentially through thermoset Glue and heat press. The touch screen of claim 19, wherein the front part of the first circuit layer, the front part of the third insulating layer, the front part of the first insulating layer and the reinforcing plate extend out of the second insulating layer The front parts are equal in width and length, and completely coincide with each other. A display device comprising the flexible circuit board connector as described in any one of claims 1 to 7. The display device according to claim 24, wherein the third insulating layer is provided with a complex A plurality of first via holes, a plurality of conductive strips of the second circuit layer respectively pass through the corresponding first via holes and are connected to a plurality of conductive strips of the first circuit layer, in the holes of the first via holes Gold plating or gold immersion. The display device of claim 24, wherein the front portions of the conductive strips of the first circuit layer are arranged in parallel at equal distances, and the pin pitch between two adjacent conductive strips on the first circuit layer is 0.3mm~1.0 mm. The display device of claim 24, wherein a reinforcing plate is provided on the lower side of the second insulating layer, and a metal layer is provided on the upper surface of the front portion of the plurality of conductive strips of the first circuit layer to form a metal finger. , the reinforcing plate is located below the metal finger. The display device of claim 27, wherein the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer, the second insulating layer and the reinforcing plate are sequentially passed through thermosetting adhesive and Heat press fit. The display device of claim 27, wherein the front part of the first circuit layer, the front part of the second insulating layer and the reinforcing plate extend out of the first insulating layer, the third insulating layer and the second circuit The front portions of the layers are equal in width and length, and completely coincide with each other. A display device, which includes the flexible circuit board connector as described in any one of claim 8 to claim 12. The display device of claim 30, wherein the third insulating layer is provided with a plurality of first via holes, and the plurality of conductive strips of the second circuit layer respectively pass through the corresponding first via holes and are connected with the first via holes. A plurality of conductive strips on the circuit layer are connected, and gold plating or gold immersion is performed in the first via hole. The display device according to claim 30, wherein the conductive strip of the first circuit layer The front parts are arranged in parallel at equal distances, and the pin spacing between two adjacent conductive strips on the first circuit layer is 0.3mm~1.0mm. The display device of claim 30, wherein the reinforcing plate, the first insulating layer, the second circuit layer, the third insulating layer, the first circuit layer and the second insulating layer are sequentially passed through thermosetting adhesive and Heat press fit. The display device of claim 30, wherein the front part of the first circuit layer, the front part of the third insulating layer, the front part of the first insulating layer and the reinforcing plate extend from the front end of the second insulating layer. The parts are equal in width and length, and completely coincide with each other.

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