"1300678 九、發明說明： 【發明所屬之技術領域】 ::明是有關於一種硬性·軟性印刷電路板 (叩d-flexible pCB)之製造方法，尤其—種包括有一具有用 於外部墊體之墊體部分的軟性區域、及—硬性區域的硬性-軟性印刷電路板之製造方法。 【先前技術】 近來’由於半導體元件整合度逐漸增加，所以提供在 :導體7L件上以連接半導體元件和外部電路的墊體數量亦 T曰加：亚且安裝密度也增加。另夕卜，半導體裝置（如 女衣^半導體7L件之半導體封裝）亦必須越小且越薄，以 口安衣山纟尤其’對可攜式設備，如筆記型電腦、個 15 20 =位助理、行動電話等等，半導體封裝尺寸與厚度的減 少疋令人期待的。 為封裝半導體元件，半導體元件安裝在一接線基板 上，然後半導體元件的墊體連接至接線基板上之墊體。铁 而，在這個情況下，圍繞在1GxlGmm尺寸的半導體 ^ 咖約安裝有咖個，其安裝間距（gap⑷ 勺為40 um更且，當連接半導體元件之具有細微間距的墊 體至接線基板之墊體時，必須以非常高之精密度來執行接 線基板上的接線或連接位置的對稱。因此，這對應用傳统 接線結合技㈣捲帶自動钻合〈讓來說是因難的。 為解決這此問題已經提出一種硬性_軟性印刷電路 5 1300678 5"1300678 IX. Description of the invention: [Technical field to which the invention pertains] :: The invention relates to a manufacturing method of a hard-and-flexible printed circuit board (,d-flexible pCB), in particular, including one having an outer cushion body A soft region of the pad portion and a method of manufacturing a rigid-flexible printed circuit board in a hard region. [Prior Art] Recently, since the degree of integration of semiconductor elements has gradually increased, the number of pads provided on the conductors 7L to connect the semiconductor elements and external circuits has also increased: and the mounting density has also increased. In addition, the semiconductor device (such as the semiconductor package of the 7L piece of the female clothing) must also be smaller and thinner, especially for the portable device, such as a notebook computer, a 15 20 = position assistant. , mobile phones, etc., the reduction in size and thickness of semiconductor packages is expected. To package a semiconductor component, the semiconductor component is mounted on a wiring substrate, and then the pad of the semiconductor component is connected to the pad body on the wiring substrate. Iron, in this case, around the 1GxlGmm size semiconductor device is installed with a coffee, the mounting pitch (gap (4) spoon is 40 um and, when connecting the semiconductor element with the fine pitch of the pad to the wiring substrate pad In the case of body, the wiring on the wiring board or the symmetry of the connection position must be performed with very high precision. Therefore, it is difficult to apply the conventional wiring combination technique (4) tape automatic drilling. This problem has been proposed as a hard_flexible printed circuit 5 1300678 5
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二軟性區域與—硬性區域之結構，其利用結構 外、:。：二性區域與硬性區域而不使用任何的連接器。另 k硬性-軟性印刷電路板其主要是用在小的終端裝置 安壯Γ行動電話，其依據隨著行動裝置的高功能性而對 :茶件之細微間距及高整合性之要求，藉由去除 的使用接頭空間而達成高度整合。 ，參考㈣㈣，逐步描述—傳統硬性_軟性印刷電 路板製造之處理步驟。 —如圖1績示’一聚亞醯胺薄膜η之-表面上提供一第 :電路圖㈣，其上對應於_軟性區域之—部分係形成一 後盍層20，俾以保護這軟性區域。 如圖1Β所示，對應於軟性區域之其他部分之第一電路 =樣12上施m罩3G，因此係形成_基板。由於第一 電路圖樣12上覆蓋有抗餘罩3〇之區域在之後將形成為暴露 以作為-外部墊體與一安装墊體之墊體部分，所以，在處 理步驟期間’其必須使用抗料3G來保護以*受 ： 之影響。 兄 20 抗蝕罩30本身包括例如一抗熱膠帶或一可脫落墨水。 如圖1C所示，對應於軟性區域之一開口係形成在一絕 、、彖層40上，在預定的熱度及壓力下，絕緣層仙及具有該開 口之一單邊軟性銅披覆層壓板（singk_sided C % 係層壓（laminate )在基板的兩表面上。 單邊軟性銅披覆層壓板45,5〇包括形成在一表面上之 一軟性薄膜45與一銅箱50,軟性薄膜45較佳為一聚亞醯胺 6 Ί300678 薄膜。 如圖m所示，銅㈣經過處理以形成—第二電路圖樣 8〇,且抗料3〇由㈣部分料，目此完成—钱·軟 刷電路板’其中包括一具有一墊矽邱八 八啕蛩體部分之軟性區域1、 硬性區域II。 另外’為達成第二電路圖樣80與第二電路圖樣8〇之 間、及第-電路圖樣12之間的電連接，係形成—貫孔的，The structure of the two soft areas and the hard areas, which utilizes the structure, and: : The sex zone and the hard zone do not use any connectors. Another k-hard-flexible printed circuit board is mainly used in small terminal devices to secure mobile phones, which are based on the high functionality of the mobile device: the fine pitch and high integration requirements of the tea pieces. The removal of the joint space is used to achieve a high degree of integration. , refer to (4) (4), step by step description - the processing steps of the traditional rigid _ flexible printed circuit board manufacturing. - As shown in Fig. 1, the film of the polyimide film η is provided with a circuit diagram (4) on which a portion corresponding to the _soft region is formed to form a rear ruthenium layer 20 to protect the soft region. As shown in FIG. 1A, the first circuit corresponding to the other portion of the soft region has a mask 3G, and thus forms a substrate. Since the area of the first circuit pattern 12 covered with the anti-removal cover 3 在 will later be formed to be exposed as the body portion of the outer pad body and a mounting pad body, it must be used during the processing step. 3G to protect the impact of * by:. The brother 20 resist 30 itself includes, for example, a heat resistant tape or a detachable ink. As shown in FIG. 1C, an opening corresponding to one of the soft regions is formed on a barrier layer 40, and under a predetermined heat and pressure, the insulating layer has a single-sided soft copper-clad laminate having the opening. (singk_sided C % is laminated on both surfaces of the substrate. The unilateral soft copper-clad laminate 45, 5 〇 comprises a soft film 45 formed on a surface and a copper box 50, the soft film 45 It is a poly-methyleneamine 6 Ί300678 film. As shown in Figure m, copper (4) is processed to form - the second circuit pattern 8 〇, and the material 3 〇 from (4) part of the material, the purpose is completed - money · soft brush circuit The board 'includes a soft area 1 having a mat 矽 八 啕蛩 1、 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The electrical connection between them is formed through the through hole,
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且在貝孔60内壁上形成一鍍層以提供導電性。 ”由於施加在層壓之預定壓力，使得定義_口<㈣ 薄膜45之末端係以一定預定角度斜傾向下。 以此方式’根據該傳統硬性.軟性印刷電路板之紫造方 法，在製造過程期間，錢用—抗料來保護暴露則乍為 -外部墊體與-安裝墊體之墊體部分免於受外在環境之％ 響。因此’制抗餘罩與去除抗料之額外動作f將造^ 處理費用及處理時間週期的不必要之增加。 另外，當製作完成而將緊密施加在墊體部分上之抗蝕 罩去除之後’墊體部分之表面上仍殘留不必要之抗姓罩， 在這情況下，彡留的抗蝕罩可能造成污染的問題，導 生不良品。 20 【發明内容】 ^因此，依據先前技術上所造成的問題，本發明之目的 係在提供―種硬性_軟性印刷電路板之製造方法，在其中暴 露以作為—外部墊體及-安裝墊體之墊體部分可僅:改i 7 "1300678 f理之順序而保護，而不使用額外保 理上的花費及時間週期，並增加產品的可靠度心處 鱼-石^「成ί述目的，本發明提供一種包括有一軟性區域 二硬性區域之硬性·軟性印刷電路板，其步驟包括·· 10 圖二：ΐ於卜軟性薄膜的至少一表面上之第-電路 的：一：：潯膜上，以-保護膜來保護對應軟性區域 性：域之>路圖Γ之一部分，並且層壓一絕緣層在對應於硬 如：二#电路圖樣上’從而形成-基板；（Β)層壓複數 ㈣t層壓板於基板的兩表面上’其每一層壓板 皆具有形成在其一表面上之一第二軟性薄膜和—鋼箱 去除對應軟性區域之㈣的部分，以暴露出第二軟性薄 膜，然後形成對應硬性區域之銅荡的其他部分· 路圖樣’以連接第一電路圖樣；以及(D)去除對應軟性區域 之第二軟性薄膜的部分。 於本發明之硬性_軟性印刷電路板的製造方法中，對應 軟性區域而不受保護膜所保護之第一電路圖樣的其他部: 齡 可為一用於外部墊體之墊體部分。 另外，於本發明之硬性_軟性印刷電路板的製造方法 中，步驟（D)可包括（D-1)以雷射加工切割第二軟性薄膜之一 2〇第—區域，其可對應於不與硬性區接觸的軟性區域之末 端；以及（D-2)以物理處理切割切割過的第二軟性薄膜之一 第二區域，其可對應於與硬性區接觸的軟性區域之一末 端，因此去除對應軟性區域之第二軟性薄膜的部分。 此外，於本發明之硬性-軟性印刷電路板的製造方法 Ί300678 :路圖樣包括一邊界圖樣形成在第 r 區域中’區域對應不盘硬性二=弟—電路圖樣的 以於雷射加工時保護第 ^之末知 電連接料第4界®㈣形成為不 矛电路圖樣中之另一圖樣。 t - (D)i!! IΓ "Γ "ep ^'J t5"^ ^ 膜的部分而執行除對應軟性區域之第二軟性薄 此外’於本發明之硬性-軟性印刷電路板的製造方法 >中’'驟⑼包括㈤)以機械加均割第二教性薄膜之一第 10 -區域’其可對應不與硬性區接觸的軟性區域之末端；以 及（D-2)以物理處理切割切割過的第二軟性薄膜之—第二區 域’其可對應與硬性區接觸的軟性區域之一末端，因此去 除對應軟性區域之第二軟性薄膜的部分。 另外，於本發明之硬性_軟性印刷電路板的製造方法 15中V I (D)可以機械加工去除對應軟性區域之第二軟性薄 膜的部分而執行。 # 此外，於本發明之硬性-軟性印刷電路板的製造方法 中，機械加工可選擇衝壓、刀刺、及刳刨工具其中一種來 執行。 另外’於本發明之硬性-軟性印刷電路板的製造方法 中，第一軟性薄膜與第二軟性薄膜為聚亞醯胺薄膜。 硬性-軟性印刷電路板的製造方法，其中絕緣層可為在 半固化狀態的一預浸潰體。 此外’於本發明之硬性-軟性印刷電路板的製造方法 9 ^1300678 中，絕緣層為一結合薄片。 本^明之硬性-軟性印刷電路板生 夕驟（A)之後進一步包括牛 Ik方法，在 額外的電路層和額外：:，以在絕緣層上交替形成 領外的虼緣層至欲達到之層數。 【實施方式】 =明之較佳實施例將參考圖示加以描述如下。 路板製造方法之製作過程。 狀更^性印刷電 10 15 本身是_硬性_軟性印刷電路板製 程之流程圖，圖3A5 B日分产胃- 之衣作過 印刷•路柘制生1疋依序顯示根據本發明之硬性-軟性 印刷：路板製造方法的製作過程之截面圖。 圖2 ’其描述根據本發明—具體實施例之硬性- 軟性印刷電路板製造方法。 於步驟100中，關於在1 m Μ ^ ^ ^ . /、 表面上形成一第一電路 ^一 人性薄膜’對應於一軟性區域III的第-電路圖 分係以—保護膜來保護，並且-絕緣層係提供在 、以硬性區域Ιν之第一電路圖樣的其他部分，從而形 成一基板。 在對應於軟性區域m之第一電路圖樣中，除了用來當 '夕部塾體之塾體部分的第一電路圖樣係覆蓋有保護膜以 保護免於外部環境之影響，墊體部分是處於—暴露的情 況。保濩臈係例如為一軟性薄膜，較佳為聚亞醯胺薄膜。 另外，於本發明之硬性-軟性印刷電路板製造方法中， 20 Ί300678 可在對應於該硬性區域IV且提 上交替層遲額外的電路層與額' —電路圖樣之絕緣層 數，從而形成一基板。 表層至所期望的層 然後，於步驟200中，係將複數 板依序堆疊在基板的兩表面上。*邊軟性銅披覆層麼 第二性銅披編板包括有形成在其-表面上之- 幸人H潯膜與一銅箔。如需 ^ 箔可以分別堆疊。 、σ ，弟二軟性薄膜與銅 接著，於步驟300中，係去 之一邱八，、，i七 對應於軟性區域ΠΙ之銅箔 4刀以暴路出第二軟性薄膜， # 然後對應於該硬性區域 圖:銅泊之其他部分形成第二電路圖樣，以連接第一電路 15 20 亦即執行下述製造過程，在對應於該硬性區域ιν之銅 /白形成貝孔（through hole )，使用非銅電鍍（ :p atmg)與銅電鍍（c〇pperelectr〇pw—)提供貫孔 + 以_去_應於軟性區域III之銅箱之-部分， =著將對應於該硬性區域…之銅箱之其他部分形成為第二 —圖樣在此6況，第二電路圖樣可藉由貫孔而電連接 至第一電路圖樣。 最後，係去除對應於軟性區域m之第二軟性薄膜之一 部分（步驟400)。 *、第一权性薄膜係適合以雷射加工（laser machining )或 機械加工（mechamcalmachini叩）方式去除對應於軟性區 或III之一部分。雷射加工本身的加工深度是可以控制為僅 11 ?13〇〇678 去，：軟性薄膜，而不會傷害第—軟性薄膜。 一第1區二雷：加工或機械加工來切割第二軟性薄膜之 區域IIlH匕帛區域係對應不與硬性區IV接觸的軟性 薄膜 k end) ’而料應於軟㈣域III之第二軟性 10 P :「：可予以去除，然後以物理處理(一 第二軟性薄膜之一第二區域，此第二區域係 與Γ區域㈣觸的軟性區域m之—末端。在雷射加 篦一 ’、’、了僅切割罘二軟性薄膜而不損害第-軟性薄膜， 二路圖樣包括有—邊界圖樣（boun〜卿⑽），其 w對應於不與該硬性區1讀觸的軟性區域III之末端的 :上圖：界圖樣係形成為不電連接於在第一電路圖樣中 如上所述，在本發明之硬性_軟性印刷電路板製造方法 中，軟性區域m中的塾體部分不以額外的保護手段來保 15瘦’而是藉由執行在第二軟性薄膜與銅猪中形成開口之過 私及在形成第二電路圖樣之後建構外部層所保護，最線 >改善產品的可靠度而且不增加處理程序之數目及處理花 圖3 A至31依序顯示根據本發明之硬性_軟性印刷電路 20 板的製造方法之過程。 ^如圖3A所示，提供一軟性銅披覆層壓板1〇〇，係包括一 第-軟性薄膜110、及形成在第—軟性薄膜11G的兩表面上 之銅箔120。 舉例來說，第一軟性薄膜110包括為一聚酯薄膜或一聚 12 ’1300678 亞醯胺薄膜。 如圖3 B所示’多個相互雷鱼 “ 連接之弟一電路圖樣15〇形成 在弟 |人性;4膜11 〇的兩表面。 為了這個目的，可劼杆v 仃以下之處理過程，形成穿透軟 性銅披覆層壓板刚之-内部取道孔（innerviahole)130, (electroless plating) # „ ( electroplating } 10 方法以形成-電鑛層14G，然後經由微影製程將具有電鑛層 140之㈣⑽形成為第-電路圖樣15〇。在此情況下，形成 在第一軟性薄膜的兩表面之第—電路圖樣15阿沿著内部 取運孔13G而相互電連接’内部取道孔⑽係藉由鑛層刚來 提供導電性。 • 第電路圖樣150包括在有一墊體部分15〇a，其用於在 軟性區域中之-外部墊體，而該軟性區域僅在其一表面上 形成第一電路圖樣15〇。 15 如圖3C所示，除了墊體部分15〇a外，對應於軟性區域 in之第一電路圖樣150之部分上施加有保護膜16()。 • 保護膜I60保護除了墊體部分150a外對應於軟性區域 in之苐電路圖樣150之一部分免於受到外在環境影響，保 護膜160係一軟性薄膜，如聚亞醯胺薄膜，其與第一電路圖 20樣150之上表面緊密接觸，因而保護了第一電路圖樣15〇。 如圖3D所示，長:供一絕緣層170，其具有一對應於軟性 區域之一開口 180。 該絕緣層170係以熱固樹脂（thermosettingresin)注入 玻璃纖維做成的半固化（semi-cure(j )狀態預浸潰體 13 1300678 (prepreg)或結合連接 據以增加層壓時之層間 壓後的物理強度。 薄片（bonding sheet)而形成，， 的附著力與增加該硬性區域IV在層 該開口刚可用木材沖模（_ddie)或金屬沖模（metai 心）的衝壓（punehing)方式或仙工具（雇如 而形成。A plating layer is formed on the inner wall of the beak hole 60 to provide electrical conductivity. "Because of the predetermined pressure applied to the lamination, the end of the film 45 is defined as inclined at a predetermined angle. In this way, according to the conventional method of manufacturing a rigid, flexible printed circuit board, in manufacturing During the process, the money is protected by the anti-material to protect the exposure - the outer pad and the pad body of the mounting pad are protected from the external environment. Therefore, the extra action of the anti-overcap and the anti-material is removed. f will increase the processing cost and the unnecessary increase of the processing time period. In addition, when the preparation is completed and the resist is applied tightly on the pad portion, the unnecessary anti-surname remains on the surface of the pad portion. Cover, in this case, the retained resist may cause contamination problems, and lead to defective products. 20 [Summary of the Invention] Therefore, according to the problems caused by the prior art, the object of the present invention is to provide The manufacturing method of the rigid-flexible printed circuit board, in which the portion of the pad body exposed as the outer pad body and the mounting pad body can be protected only by changing the order of the i 7 "1300678 f, without using additional factoring The cost and time period, and the reliability of the product is increased. The present invention provides a rigid/flexible printed circuit board comprising a flexible region and a hard region, the steps of which include ··· 2: on the at least one surface of the soft film of the first circuit: a:: on the enamel film, with a protective film to protect the corresponding soft regionality: one of the fields > The insulating layer is formed on a hard surface such as a circuit pattern to form a substrate; (Β) a plurality of (four) t laminates on both surfaces of the substrate, each of which has a surface formed on one surface thereof The two soft films and the steel box remove the portion corresponding to the (4) portion of the soft region to expose the second soft film, and then form other portions of the copper sway corresponding to the hard region, the road pattern 'to connect the first circuit pattern; and (D) Removing a portion of the second flexible film corresponding to the soft region. In the method for manufacturing a rigid-flexible printed circuit board of the present invention, the first circuit pattern corresponding to the soft region and not protected by the protective film is The portion may be a portion of the pad body for the outer pad. Further, in the method of manufacturing the rigid-flexible printed circuit board of the present invention, the step (D) may include (D-1) cutting by laser processing. One of the two flexible films, the second region, which may correspond to the end of the soft region not in contact with the hard region; and (D-2) the second region of the second soft film that is cut by physical treatment, Corresponding to one end of the soft region in contact with the hard region, thereby removing the portion of the second flexible film corresponding to the soft region. Further, in the method of manufacturing the rigid-flexible printed circuit board of the present invention, 678300678: the road pattern includes a boundary pattern Formed in the r-th region, the region corresponds to the hard disk=di-circuit pattern, and the laser protection is protected during the laser processing. The fourth boundary® (4) is formed into another pattern in the non-spray circuit pattern. . t - (D)i!! IΓ "Γ "ep ^'J t5"^ ^ Part of the film is performed in addition to the second soft thin corresponding to the soft region. Further, in the manufacture of the rigid-flexible printed circuit board of the present invention Method> "Step (9) includes (5)) mechanically plus singulation of one of the second teaching films, the 10th - region 'which may correspond to the end of the soft region not in contact with the hard region; and (D-2) to the physics The second region of the second soft film that cuts the cut is treated to correspond to one end of the soft region in contact with the hard region, thus removing the portion of the second soft film corresponding to the soft region. Further, in the method of manufacturing a rigid-flexible printed circuit board of the present invention, V I (D) can be performed by mechanically removing a portion of the second soft film corresponding to the soft region. Further, in the method of manufacturing a rigid-flexible printed circuit board of the present invention, the machining may be performed by one of a stamping, a stab, and a router. Further, in the method for producing a rigid-flexible printed circuit board of the present invention, the first flexible film and the second flexible film are polyimine films. A method of manufacturing a rigid-flexible printed circuit board, wherein the insulating layer is a prepreg in a semi-cured state. Further, in the method of manufacturing a rigid-flexible printed circuit board of the present invention 9 1300678, the insulating layer is a bonded sheet. The hard-flexible printed circuit board (A) further includes a bovine Ik method, in an additional circuit layer and an additional:: to alternately form an outer leading edge layer on the insulating layer to the desired layer number. [Embodiment] A preferred embodiment of the invention will be described below with reference to the drawings. The manufacturing process of the road board manufacturing method. The shape of the printed circuit 10 15 itself is a _ rigid _ flexible printed circuit board process flow chart, Figure 3A5 B day of the production of stomach - clothing has been printed • Roller production 1 疋 sequentially shows the hardness according to the present invention - Soft printing: A cross-sectional view of the manufacturing process of the road board manufacturing method. Fig. 2'' illustrates a method of manufacturing a rigid-flexible printed circuit board in accordance with the present invention. In step 100, a first circuit is formed on the surface of 1 m Μ ^ ^ ^ . /, and a first circuit is formed. The first circuit diagram corresponding to a soft region III is protected by a protective film, and - is insulated. The layer is provided with other portions of the first circuit pattern in the hard region Ιν to form a substrate. In the first circuit pattern corresponding to the soft region m, except that the first circuit pattern for the body portion of the 'night body' is covered with a protective film to protect against the external environment, the pad portion is at - the situation of exposure. The protective layer is, for example, a soft film, preferably a polyimide film. In addition, in the method for manufacturing a rigid-flexible printed circuit board of the present invention, 20 Ί 300678 may form an insulating layer corresponding to the hard region IV and an additional layer of circuit layers and a circuit pattern. Substrate. Surface layer to desired layer Next, in step 200, the plurality of sheets are sequentially stacked on both surfaces of the substrate. * Soft copper cladding layer The second copper woven plate includes a film formed on its surface - a H-film and a copper foil. If you need ^ foil can be stacked separately. , σ, Di two soft film and copper, in step 300, one of the Qiu Ba,, i seven corresponds to the soft area of the copper foil 4 knife to violently exit the second soft film, # then corresponds to The hard area map: the other part of the copper pouch forms a second circuit pattern to connect the first circuit 15 20 to perform the following manufacturing process, forming a through hole corresponding to the copper/white corresponding to the hard area ιν, Use non-copper plating ( : p atmg) and copper plating (c〇pperelectr〇pw -) to provide a through hole + to _ to be in the soft area III of the copper box - part, = will correspond to the hard area ... The other portion of the copper box is formed as a second pattern in which the second circuit pattern can be electrically connected to the first circuit pattern by the through hole. Finally, a portion of the second flexible film corresponding to the soft region m is removed (step 400). * The first weight film is suitable for removing a portion corresponding to the soft region or III by laser machining or machining (mechamcalmachini). The processing depth of the laser processing itself can be controlled to only 11 ? 13 〇〇 678 to go: soft film without damaging the first - soft film. A zone 1 second mine: processing or machining to cut the second soft film region IIlH匕帛 region corresponds to the soft film k end) which is not in contact with the hard region IV and is expected to be the second softness of the soft (four) domain III 10 P : ": Can be removed, and then physically treated (the second region of one of the second soft films, the second region is the end of the soft region m touched by the Γ region (4). , ', only cut the second soft film without damaging the first soft film, the two-way pattern includes a boundary pattern (boun~qing (10)), where w corresponds to the soft region III that is not touched by the hard region 1 The upper part: the upper picture: the boundary pattern is formed not electrically connected to the first circuit pattern as described above, and in the rigid-flexible printed circuit board manufacturing method of the present invention, the body portion in the soft region m is not extra The protection means to protect the 15 thin' but to protect the reliability of the product by performing the protection of forming the opening in the second soft film and the copper pig and constructing the outer layer after forming the second circuit pattern. And don't increase the processing 3 and 31 sequentially show the process of the method of manufacturing the rigid-flexible printed circuit board 20 according to the present invention. As shown in FIG. 3A, a soft copper-clad laminate is provided, including A first flexible film 110 and a copper foil 120 formed on both surfaces of the first flexible film 11G. For example, the first flexible film 110 comprises a polyester film or a poly 12'1300678 melamine film. As shown in Figure 3B, 'multiple mutual squid' connected to the circuit of a circuit pattern 15 〇 formed in the brother | human nature; 4 membrane 11 〇 two surfaces. For this purpose, the following process can be formed by mast v 仃Through the soft copper-clad laminate just-innerviahole 130, (electroless plating) # „ (electroplating } 10 method to form - electric ore layer 14G, and then will have an electric ore layer 140 via a lithography process (4) (10) is formed as a first-circuit pattern 15A. In this case, the first circuit pattern 15 formed on both surfaces of the first flexible film is electrically connected to each other along the internal take-up hole 13G, and the internal passage hole (10) is used by The ore layer has just come to provide electrical conductivity. • The first circuit pattern 150 is included in a pad portion 15〇a for the outer pad in the soft region, and the soft region forms the first circuit pattern 15〇 on only one surface thereof. As shown, in addition to the pad portion 15A, a protective film 16() is applied to a portion of the first circuit pattern 150 corresponding to the soft region in. • The protective film I60 protects the soft region in addition to the pad portion 150a. Then, part of the circuit pattern 150 is protected from the external environment, and the protective film 160 is a flexible film, such as a polyimide film, which is in close contact with the upper surface of the first circuit pattern 150, thereby protecting the first circuit. Figure 15〇. As shown in Fig. 3D, length: an insulating layer 170 having an opening 180 corresponding to one of the soft regions. The insulating layer 170 is a semi-cured (pre-gure) pre-impregnated body 13 1300678 (prepreg) or a bonding connection formed by injecting glass fibers with a thermosetting resin to increase the interlayer pressure during lamination. The physical strength of the bond sheet is formed by the adhesion of the hard region IV in the layer of the opening just available for the wood die (_ddie) or the metal die (metai heart) punehing or fairy tool ( Employment is formed.
10 如圖3E所*，在具有由保護膜16〇所保護的第一電路圖 U50之軟性薄膜11()之兩表面上，具有開口⑽之絕緣 層170係以層壓方式形成一具有軟性區域m和一預備硬性 區域IV之一基板190。 1510, as shown in FIG. 3E, on both surfaces of the flexible film 11 () having the first circuit pattern U50 protected by the protective film 16, the insulating layer 170 having the opening (10) is formed in a laminated manner with a soft region m And a substrate 190 of one of the hard regions IV. 15
或者，在根據本發明之硬性_軟性印刷電路板製造方法 中，係於絕緣層170上交替層壓額外的電路層（圖未示）與額 外的絕緣層至欲達到的層數，而形成該基板19〇。 ^ 、 由絕緣層no之開口 180暴露出之第一電路圖樣15〇與 第一軟性薄膜110組成該軟性區域ΙΠ，而具有層壓絕緣層 170之區域以展現增強之機械強度則組成該預備硬性區域 IV。 20 如圖3F所示，單邊軟性銅披覆層壓板 200,210,200’ ，210’係層壓在在基板19〇之兩表面。 單邊軟性銅彼覆層壓板200,2丨〇包括形成在其一表面 上之一第二軟性薄膜2〇〇與一銅箔21〇。 由在基板190之一表面上之絕緣層17〇之開口 18〇所暴 露出的塾體部分可由無開口之單邊軟性銅披覆層壓板 200,210所保護，而不受外在環境影響，直至完成硬性-軟性 14 ，I300678 印刷電路板。 另外，該單邊軟性銅坡覆層壓板200，，210’係層壓在 基板190之另一表面上，該單邊軟性銅披覆層壓板 ，21〇 具有對應於形成在第一軟性薄膜11〇上之絕緣 層Π〇的開口 180之一開口 220’ ，且不具有第一電路圖樣 150 〇 如同第一軟性薄膜110，該第二軟性薄膜200可由一聚 脂薄膜或一聚亞醯胺薄膜形成。 丨如圖3G所示，一貫孔230形成以穿透基板190之兩表面 10 上的銅箔210,210，，然後於貫孔230之内壁上和銅箔 210,210’ 上形成鍍層 24〇,24〇，。 由於用以將具有銅箔210之第二電路圖樣電連接至第 一電路圖樣150的貫孔230包含有絕緣材料，例如第一軟性 薄膜110、絕緣層170、及第二軟性薄膜2〇〇,2〇〇，，故以執 15 行非電電鍍與電鍍來形成鍍層240,240，，因而賦予貫孔 230導電性。 、 丨貫孔230係以使用機械鑽頭，如電腦數值控制（cnc爾 頭’而形成在預定的位置上。 在本發明中，在内壁上形成具有鍍層24〇,24〇,之貫孔 20 23〇係可以填滿墨水（圖未示）。 、 如圖3H所示，對應於軟性區域m之具有鍍層24〇的銅箱 210之一部分被去除，而對應於預備硬性區域^之具有鍍層 240,240’的銅箔21〇,21〇，之部分俜开$ 士、势 ^ 曰 1刀你办成弟二電路圖樣 250,250’ ，從而完成硬性區域V。 15 ’1300678 在足個情況下，可以藉由在鍍層240,240，上施加感光 材料（圖未示），再施加一具有預定圖樣的圖樣薄膜，然後執 行曝光和顯影以形成一抗餘刻圖樣，接著執行包括有餘刻 過f王的微衫製私’據以形成該第二電路圖樣謂，。 5 第二電路圖樣25G可經由貫孔⑽電連接第-電路圖樣 150與形成在基板的另一表面上之第二電路圖樣25〇，。 ^最後，如圖31所示，對應於軟性區域III之第二軟性薄 膜200之一部分被去除，因此形成包括有一軟性區域m與一 籲 硬性區域V之硬性-軟性印刷電路板。 10 請參考圖4，係圖3H之上視圖，其描繪去除對應的第二 • 軟性薄膜200…亦即，如圖4所示，以雷射加工或機械加工 . 切割對應於不與硬性區域V接觸之軟性區域冚端末之第二 权性溥膜200的第一區域A，然後以物理處理去除對應於與 硬性區域v接觸之軟性區域见末端之第二軟性薄膜2〇〇的第 b二區域B，據以去除對應於軟性區域m之第二軟性薄膜 之部分。 • 如上所述，當以物理處理去除對應於與硬性區域V接觸 之軟性區域III末端之第二軟性薄膜2〇〇之第二區域B，由於 物理處理中所施加之預定壓力，造成第二軟性薄膜2〇〇之末 20端以一預定角度向上傾斜，因此在形狀上相反於如圖1〇中 所不傳統處理過程中於形成開口後所層壓之軟性薄膜Μ的 末端。 、 關於雷射加工，為了只切割第二軟性薄膜200而不損害 第一軟性薄膜110’第一電路圖樣15〇可進一步包括—邊ς 16 Ί300678 二ΐΐ',τ)，邊界圖樣形成在對應於不與硬性區域V接 不連接第-電路圖樣心=成的邊界圖樣本身是 5 15 20 ===根據本發明之硬性·軟性印刷電路板製造方法 了糟由讀加X或機械加卫—次去 in之第二軟性薄膜2〇〇之部分。另外，以帝射：於软⑽域 工噗疮^ 刀为外以田射加工可控制加 /又，俾以僅去除第二軟性薄膜的，而不損 路圖樣15 〇。 " 电 機械加工較佳地使用衝塵、刀刺、彻工具而執行。 於傳統硬性_軟性印刷電路板製造方μ，為在處理過 2避免在軟性區域中用於外部墊體或安裝塾體之塾體部 ^到：部環境影響，使用抗熱膠帶（“ resistant tape ) I可脱洛墨水（peelable ink)來形成塾體部分上的抗钮罩 reSlstC(3ver)、然後在完成製造之後去除抗料。因此， (、先的方去所遭遇之困難在於殘餘的抗钱罩之 產：缺陷率之增加，而且形成和去除抗餘罩之額夕;的處理 過私增加了處理的花費和處理的時間週期。 然而’根據本發明之硬性_軟性印刷電路板製造方法， 暴露以用於外部墊體及安裝塾體之墊體部分可僅由改變處 理之順序而予以保護，而不使用額外保護材料，因此減少 處理上的花費及時間週期，並增加產品的可靠度。 斤亦即’在層壓單邊軟性銅披覆制板以形成硬性區域 ^第一电路圖樣4 ’對應於軟性區域之開口在層麼前是未 形成的，而是在第二電路圖樣形成之後才形成的，因此， 17 •1300678 於製造過程中，暴露於外的墊體部分既使不使用額外的保 :蔓：段也能受到保護，因此實現了 —簡單的處理過程和高 可罪度的產品。 、生如上所述，本發明係提供—硬性_軟性印㈣路板的製 5造方法’根據本發明之硬性軟性印刷電路板製造方法，暴 露以用於外部塾體及安裝墊體之塾體部分可僅由改變處^ 之順序而予以保護，而不使用額外保護材料，因此減少處 理上的花費及時間週期，並增加產品的可靠度。 上述實施例僅係、為了方便說明而舉例而已，本發明所主 10張之權利範圍自應以申請專利範圍所述為準，而非僅限於 上述實施例。 【圖式簡單說明】 圖1A至1D係依序顯示傳統硬性_軟性印刷電路板製造方法 15 之過程的截面圖。 圖2係本發明之硬性.軟性印刷電路板製造方法之流程圖。 圖3A至31係依序顯示根據本發明一硬性-軟性印刷電路板 製造方法之過程的截面圖。 圖4係圖3H之上視平面圖。 !0 【主要元件符號說明】 硬性區域V 第一軟性薄膜110Alternatively, in the method of manufacturing a rigid-flexible printed circuit board according to the present invention, an additional circuit layer (not shown) and an additional insulating layer are alternately laminated on the insulating layer 170 to the number of layers to be formed, thereby forming the The substrate 19 is. ^, the first circuit pattern 15 暴露 exposed by the opening 180 of the insulating layer no and the first flexible film 110 constitute the soft region ΙΠ, and the region having the laminated insulating layer 170 to exhibit enhanced mechanical strength constitutes the preliminary hardness Area IV. As shown in Fig. 3F, the unilateral soft copper-clad laminates 200, 210, 200', 210' are laminated on both surfaces of the substrate 19. The unilateral flexible copper-clad laminate 200, 2 丨〇 includes a second flexible film 2 〇〇 and a copper foil 21 形成 formed on one surface thereof. The body portion exposed by the opening 18 of the insulating layer 17 on one surface of the substrate 190 can be protected by the single-sided soft copper-coated laminate 200, 210 without opening, without being affected by the external environment until completion Hard-soft 14, I300678 printed circuit board. In addition, the one-sided soft copper-slope laminate 200, 210' is laminated on the other surface of the substrate 190, and the single-sided soft copper-clad laminate, 21〇 has a corresponding shape formed on the first flexible film 11. One opening 210' of the opening 180 of the insulating layer of the insulating layer and having no first circuit pattern 150 is like the first flexible film 110, and the second flexible film 200 may be a polyester film or a polyimide film. form. As shown in Fig. 3G, the uniform holes 230 are formed to penetrate the copper foils 210, 210 on the both surfaces 10 of the substrate 190, and then the plating layers 24, 24" are formed on the inner walls of the through holes 230 and the copper foils 210, 210'. Since the through hole 230 for electrically connecting the second circuit pattern having the copper foil 210 to the first circuit pattern 150 includes an insulating material, such as the first flexible film 110, the insulating layer 170, and the second flexible film 2, 2,, the plating layers 240, 240 are formed by performing 15 electroless plating and electroplating, thereby imparting conductivity to the via 230. The through hole 230 is formed at a predetermined position by using a mechanical drill such as a computer numerical control (cnc head). In the present invention, a through hole 20 23 having a plating layer 24, 24 inches is formed on the inner wall. The lanthanide system may be filled with ink (not shown). As shown in FIG. 3H, a portion of the copper box 210 having the plating layer 24 corresponding to the soft region m is removed, and the plating layer 240, 240' corresponding to the preliminary hard region ^ is provided. The copper foil is 21 〇, 21 〇, and the part is opened by $士, potential^ 曰1 knife, you make the second circuit pattern 250,250', thus completing the hard area V. 15 '1300678 In the full case, you can The coating layer 240, 240 is coated with a photosensitive material (not shown), and then a pattern film having a predetermined pattern is applied, and then exposure and development are performed to form a resist pattern, and then the micro-shirts including the remnant of the king are executed. According to the second circuit pattern, the second circuit pattern 25G can electrically connect the first circuit pattern 150 and the second circuit pattern 25 形成 formed on the other surface of the substrate via the through hole (10). Finally, As shown in Figure 31, the corresponding A portion of the second flexible film 200 in the soft region III is removed, thereby forming a rigid-flexible printed circuit board including a soft region m and a hard-wearing region V. 10 Referring to FIG. 4, a top view of FIG. 3H is shown. Depicting the corresponding second soft film 200... that is, as shown in FIG. 4, laser processing or machining. Cutting the second weight film 200 corresponding to the soft region end not in contact with the hard region V The first region A is then physically removed to remove the b-th region B corresponding to the second soft film 2〇〇 at the end of the soft region in contact with the hard region v, thereby removing the second softness corresponding to the soft region m Part of the film. As described above, when the second region B corresponding to the second soft film 2〇〇 at the end of the soft region III in contact with the hard region V is removed by physical treatment, due to the predetermined pressure applied in the physical treatment, Causing the end 20 of the second flexible film to be inclined upward at a predetermined angle, and thus is opposite in shape to the softness laminated after the opening is formed in the conventional process as shown in FIG. The end of the film crucible. Regarding the laser processing, in order to cut only the second flexible film 200 without damaging the first flexible film 110', the first circuit pattern 15〇 may further include—edge ς16 Ί300678 ΐΐ', τ), boundary The pattern is formed in a boundary pattern corresponding to the non-connected with the hard region V. The first circuit diagram is a boundary diagram. The sample body is 5 15 20 === The rigid and flexible printed circuit board manufacturing method according to the present invention is badly read by X or Mechanical reinforcement - the second part of the second soft film. In addition, the emperor shot: in the soft (10) domain of the hemorrhoids ^ knife for the field to control the addition / /, to remove only the second soft film, without damage to the road pattern 15 〇. " Electromechanical processing is preferably performed using dust, spurs, and tools. In the traditional rigid _ flexible printed circuit board manufacturing side, in the treatment of 2 to avoid the use of external body or soft body in the soft area of the body part: the environmental impact, the use of heat resistant tape ("resistant tape I. Peelable ink to form the anti-button reslst (3ver) on the body part, and then remove the anti-material after the completion of the manufacturing. Therefore, the difficulty encountered in the first step is the residual resistance. The production of the money cover: the increase of the defect rate, and the formation and removal of the anti-removal cover; the processing of the private increases the processing cost and the processing time period. However, the hard_flexible printed circuit board manufacturing method according to the present invention The part of the pad exposed for the outer pad and the mounting body can be protected only by changing the order of processing without using additional protective materials, thus reducing processing costs and time periods, and increasing product reliability. The jin is also 'laminated in a laminated single-sided soft copper to form a hard region ^ The first circuit pattern 4 ' corresponds to the opening of the soft region is not formed in front of the layer, but in the second The road pattern is formed after the formation of the road pattern. Therefore, during the manufacturing process, the part of the body that is exposed to the outside is not protected by the extra protection: the vine: the section can also be protected, thus achieving a simple process and Highly sinful product. As described above, the present invention provides a method for manufacturing a rigid flexible printed circuit board according to the present invention, which is exposed for use in an external body. And the body portion of the mounting mat can be protected only by the order of the change, without using additional protective materials, thereby reducing the processing time and time period, and increasing the reliability of the product. For the convenience of the description, the scope of the present invention is limited to the above-mentioned embodiments, and is not limited to the above embodiments. [Fig. 1A to 1D show the tradition in order. FIG. 2 is a flow chart showing a process of manufacturing a rigid flexible printed circuit board according to the present invention. FIG. 3 is a flowchart showing a method of manufacturing a flexible printed circuit board. . 3H top plan view sectional view of a method of manufacturing a process flexible printed circuit board 4 0 The main system components of FIG REFERENCE NUMERALS V region of a first rigid flexible film 110-- the present invention according to a rigid.!
軟性區域III 預備硬性區域IV 單邊軟性銅披覆層壓板100 18 Ί300678Soft Zone III Pre-hardened Zone IV Unilateral Soft Copper Cladding Laminate 100 18 Ί300678
銅箔120 内部取道孔130 鍍層140 第一電路圖樣150 墊體部分150a 保護膜160 絕緣層170 開口 180 基板190 第二軟性薄膜200 第二軟性薄膜200’ 銅箔210 銅箔210’ 另一開口 220 貫孔230 鍍層240 第二電路圖樣250 第二電路圖樣250’ 第一區域A 第二區域BCopper foil 120 internal passage hole 130 plating layer 140 First circuit pattern 150 Pad portion 150a Protective film 160 Insulation layer 170 Opening 180 Substrate 190 Second flexible film 200 Second flexible film 200' Copper foil 210 Copper foil 210' Another opening 220 Through hole 230 plating 240 second circuit pattern 250 second circuit pattern 250' first area A second area B
1919