CN1956628A - Method for manufacturing rigid-flexible printed circuit board - Google Patents
Method for manufacturing rigid-flexible printed circuit board Download PDFInfo
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- CN1956628A CN1956628A CN 200610150356 CN200610150356A CN1956628A CN 1956628 A CN1956628 A CN 1956628A CN 200610150356 CN200610150356 CN 200610150356 CN 200610150356 A CN200610150356 A CN 200610150356A CN 1956628 A CN1956628 A CN 1956628A
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to a method for manufacturing a rigid flexible printed circuit board. The invention especially relates to a method for manufacturing a rigid flexible printed circuit board which includes a flexible region having a bonding pad portion and a rigid region. Wherein the bonding pad portion exposed for being used in an external bonding pad and a mounting bonding pad can be protected just by changing order of steps without using an additional protection material, thereby machining cost and machining period can be reduced, and reliability of products is increased.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
The present invention requires the rights and interests of the korean patent application No.10-2005-0102464 that is entitled as " method that is used to make rigid-flexible printed circuit board " of submission on October 28th, 2005, and its disclosure integral body is hereby expressly incorporated by reference.
Technical field
The present invention relates to the method for a kind of manufacturing rigid-flexible printed circuit board (hard and soft PCB), the invention particularly relates to the method that a kind of manufacturing comprises the hard and soft PCB of flexible region and rigid region, wherein flexible region has with the pad parts in the weld pad externally.
Background technology
Recently, along with the degree of integration of semiconductor components and devices strengthens day by day, the quantity that is used for the weld pad that semiconductor components and devices is connected with external circuit that is located on the semiconductor components and devices has increased, and packing density has also increased.In addition, in order to improve its packing density, require semiconductor equipment (such as the semiconductor packages that semiconductor components and devices is installed on it) littler and thinner.Particularly, for portable information device (such as notebook-PC, PDA, mobile phone etc.), semiconductor components and devices reducing on size and density has practical significance.
For the encapsulated semiconductor components and parts, semiconductor components and devices is installed on the circuit board, and the weld pad of semiconductor components and devices is connected with weld pad on the circuit board.Yet under the situation of the semiconductor components and devices of about 10 * 10mm size, its installing space is approximately 40 μ m in about 1000 pad installation, and this is quite small.And, when the weld pad that will have tiny semiconductor components and parts spacing is connected with the weld pad of circuit board, the location matches when requiring very high accuracy with wiring on the execution circuit board or connection.The result is difficult to adopt traditional wire bonding technique or carrier band to weld (TAB) technology automatically.
In order to address these problems, proposed to have the hard and soft PCB of following structure, in the described structure, under the situation of not using additional connector, rigid region and flexible region are interconnected by structurally making up rigid substrates and flexible base, board.In addition, hard and soft PCB so mainly is used in the Miniature Terminal (such as mobile phone), this has just required high integration, this high integration can obtain by eliminating the unnecessary space of using connector to cause, and the fine pitch (fine pitch) and the high integration of installation part are proportional with the high functionality of mobile device.
Below with reference to Figure 1A to 1D, the conventional procedures of making hard and soft PCB is described step by step.
As shown in Figure 1A, cover layer (coverlay) 20 is formed at and is located on 11 1 lip-deep first circuit patterns 12 of polyimide film, and its part with flexible region is corresponding, so that protect described flexible region.
As shown in Figure 1B, resist protective layer 30 is imposed on the circuit pattern 12, and is corresponding with the other parts of flexible region, thereby forms bottom substrate.Owing to the zone of the circuit pattern 12 that is coated with resist protective layer 30 can form after a while for weld pad externally with the pad parts that exposes in the weld pad is installed, therefore this pad parts is protected to avoid the erosion of external environment condition in the processing procedure of using resist protective layer 30.
Thereby resist protective layer 30 comprises for example heatproof zone or peelable printing ink (ink).
As shown in Fig. 1 C, wherein be formed with the insulating barrier 40 with the corresponding opening of flexible region, and the single-sided flexible copper clad laminate (single face FCCL) 45,50 with opening, under predetermined temperature and pressure, be laminated on two surfaces of bottom substrate.
As shown in Fig. 1 D, Copper Foil 50 is processed forming second circuit pattern 80, and resist protective layer 30 is removed from pad parts, comprises flexible region I with pad parts and the hard and soft PCB of rigid region II thereby finish.
In addition, for carry out between the second circuit pattern 80 and second circuit pattern 80 and first circuit pattern 12 between be electrically connected, formed through hole 60 and on the inwall of through hole 60, formed coating so that it has conductivity.
Being applied to predetermined pressure on the laminate layers, make to limit the end of flexible membrane 45 of opening downward-sloping at a predetermined angle.
Therefore, according to the conventional method of making hard and soft PCB, in the manufacture process of using the resist protective layer, for weld pad externally with that the pad parts that uses in the weld pad and expose is installed is protected to avoid the erosion of external environment condition.Therefore, owing to will additionally carry out the coating of resist protective layer and the removal of resist protective layer, processing cost and process-cycle have not therefore been increased with being hoped.
In addition, when firmly being coated on resist protective layer on the pad parts when being removed after handling, the resist protective layer may undesirably remain on the surface of pad parts.In this case, residual resist protective layer can cause taking place pollution problem, thereby causes and substandard products occur.
Summary of the invention
Therefore; conceived the present invention in view of the problems referred to above that occur in the prior art; the purpose of this invention is to provide a kind of method of making hard and soft PCB; wherein need not to use additional protection means to protect, therefore reduced processing cost and process-cycle and increased reliability of products in order to be used for outside weld pad and the pad parts that weld pad exposes to be installed by only changing the order of handling.
To achieve these goals; the invention provides the method that a kind of manufacturing comprises the hard and soft PCB of flexible region and rigid region; this method comprises: (A) use diaphragm to protect the part corresponding to flexible region of first circuit pattern on first flexible membrane; this first flexible membrane is formed with first circuit pattern on its at least one surface; and with insulating barrier be laminated to corresponding first circuit pattern of rigid region on; thereby formation bottom substrate; (B) the single-sided flexible copper clad laminate is laminated on two surfaces of bottom substrate; wherein each single-sided flexible copper clad laminate all has second flexible membrane and the Copper Foil that is formed on the one surface; (C) remove Copper Foil corresponding to the part of flexible region to expose second flexible membrane; and the other parts corresponding to rigid region of Copper Foil are formed the second circuit pattern that is connected with first circuit pattern, and the part of (D) removing second flexible membrane corresponding to flexible region.
In the method for the hard and soft PCB of manufacturing of the present invention, not can be used as the pad parts that uses in the weld pad externally by the other parts with corresponding first circuit pattern of flexible region of diaphragm protection.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, (D) can comprise (D-1), cut first area corresponding to second flexible membrane of the end of the flexible region that does not contact rigid region by laser processing; And (D-2), cut the second area of second flexible membrane that is cut, thereby remove the part with corresponding second flexible membrane of flexible region corresponding to the end of the flexible region of contact rigid region by physical process.
In addition; in the method for the hard and soft PCB of manufacturing of the present invention; first circuit pattern can comprise the border pattern; it is formed on the zone corresponding to the end of the flexible region that does not contact rigid region; so that protect first flexible membrane when laser processing, this border pattern does not form and can be electrically connected with another pattern of first circuit pattern.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, can come execution in step (D), promptly remove part with corresponding second flexible membrane of flexible region by laser processing.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, (D) can comprise (D-1), cut first area corresponding to second flexible membrane of the end of the flexible region that does not contact rigid region by machining; And (D-2), cut the second area of second flexible membrane that is cut, thereby remove the part with corresponding second flexible membrane of flexible region corresponding to the end of the flexible region of contact rigid region by physical process.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, can pass through machining execution in step (D), promptly remove part with corresponding second flexible membrane of flexible region.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, machining can utilize any one that choose in stamping machine, cutter and router to carry out.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, first flexible membrane and second flexible membrane can be polyimide films.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, insulating barrier can be the prepreg of semi-cured state.
In addition, in the method for the hard and soft PCB of manufacturing of the present invention, insulating barrier can be bonding sheet.
The method of the hard and soft PCB of manufacturing of the present invention also can comprise (E), at (A) afterwards promptly, alternately forms required additional circuit layers and supplemental dielectric layer on insulating barrier.
Description of drawings
Figure 1A to 1D is the cross-sectional view that sequentially shows the conventional procedure of making hard and soft PCB;
Fig. 2 shows the flow chart according to the process of the hard and soft PCB of manufacturing of the present invention;
Fig. 3 A to 3I is the cross-sectional view that sequentially shows according to the process of the hard and soft PCB of manufacturing of the present invention; And
Fig. 4 is the vertical view of Fig. 3 H.
Embodiment
Hereinafter, describe the preferred embodiments of the present invention with reference to the accompanying drawings in detail.
Fig. 2 and Fig. 3 A to 3I show the process according to the hard and soft PCB of manufacturing of the present invention.
Fig. 2 shows the flow chart according to the process of the hard and soft PCB of manufacturing of the present invention, and Fig. 3 A to 3I is the cross-sectional view that sequentially shows according to the process of the hard and soft PCB of manufacturing of the present invention.
Below with reference to the method for Fig. 2 description according to the hard and soft PCB of manufacturing of the present invention.
About on its at least one surface, being formed with first flexible membrane of first circuit pattern; with the part of diaphragm protection with corresponding first circuit pattern of flexible region III; and insulating barrier is arranged on the other parts with corresponding first circuit pattern of rigid region IV, thereby forms bottom substrate (S100).
Thereby, with corresponding first circuit pattern of flexible region III in, except that avoiding the external environment condition erosion with the coated diaphragm of first circuit pattern the pad parts in the weld pad externally to protect described pattern, and pad parts still keeps exposing.The example of diaphragm preferably includes flexible membrane, such as polyimide film.
In addition, in the method for the hard and soft PCB of manufacturing according to the present invention, can by be located at corresponding first circuit pattern of rigid region IV on insulating barrier on alternately the stratum press required additional circuit layers and supplemental dielectric layer to form bottom substrate.
Single face FCCL is located on two surfaces of bottom substrate (S200) by layering sequentially.
Single face FCCL comprises second flexible membrane and is formed on lip-deep Copper Foil of FCCL.Therefore, if necessary, the layering independently of second flexible membrane and Copper Foil.
Then, the part corresponding to flexible region III of Copper Foil is removed, thereby exposes second flexible membrane, and the other parts corresponding to rigid region IV of Copper Foil form the second circuit pattern (S300) that is connected with first circuit pattern.
That is to say, carry out following steps: with the corresponding Copper Foil of rigid region IV in form through hole, carry out electroless copper and electro-coppering with give through hole conductivity, remove Copper Foil by etching with the corresponding part of flexible region III and Copper Foil formed the second circuit pattern with the corresponding other parts of rigid region IV.In this case, can use through hole that the second circuit pattern is electrically connected on first circuit pattern.
At last, the part (S400) of removal and corresponding second flexible membrane of flexible region III.
Second flexible membrane is carried out laser processing or machining, thus the part of removal once and corresponding second flexible membrane of flexible region III.Therefore, in laser processing, working depth is controlled, thereby only removes second flexible membrane, and can not damage first flexible membrane.
Replacedly, can cut the first area corresponding to the end of the flexible region III that does not contact rigid region IV of second flexible membrane by laser processing or machining, and remove the second area corresponding to the end of the flexible region III of contact rigid region IV of second flexible membrane, and remove the part of the corresponding of second flexible membrane and flexible region III by physical process.Therefore, in laser processing procedure, do not damage first flexible membrane in order only to cut second flexible membrane, first circuit pattern is included in the border pattern that forms in its zone corresponding to the end of the flexible region III that does not contact rigid region IV, and described border pattern does not form and can be electrically connected with another pattern in first circuit pattern.
As mentioned above; in the method for the hard and soft PCB of manufacturing according to the present invention; pad parts among the flexible region III be not protected by the use additional protection means; following process is protected but by carrying out; promptly; after the step that forms the second circuit pattern, carry out the opening that forms second flexible membrane and Copper Foil (second flexible membrane and Copper Foil constitute exterior layer), finally under the situation that does not increase manufacturing procedure or processing cost, improve reliability of products.
Fig. 3 A to 3I sequentially shows the process according to the hard and soft PCB of manufacturing of the present invention.
As shown in Fig. 3 A, FCCL 100 is provided, comprise first flexible membrane 110 and be formed on two lip-deep Copper Foils 120 of FCCL.
The example of first flexible membrane 110 comprises polyester film or polyimide film.
As shown in Fig. 3 B, on two surfaces of first flexible membrane 110, be formed with first circuit pattern 150 of mutual electrical connection.
Therefore, can carry out following steps: the interior via hole 130, execution chemical plating and the plating that form break-through FCCL 100 are to form coating 140; And form first circuit pattern 150 by the Copper Foil 120 that photoetching process will have coating 140.In this case, being formed on two lip-deep first circuit patterns 150 of first flexible membrane can be electrically connected mutually along the interior via hole 130 that is endowed conductivity by coating 140.
First circuit pattern 150 comprises the pad parts 150a in the outside weld pad that is used in the flexible region, and flexible region has lip-deep first circuit pattern 150 that only is formed on first flexible membrane.
Shown in Fig. 3 C, diaphragm 160 puts on except that pad parts 150a and the part corresponding first circuit pattern 150 of flexible region.
For example coating flexible film (such as polyimide film) is as being used to protect the part with corresponding first circuit pattern 150 of flexible region except that pad parts 150a to avoid the diaphragm that external environment condition corrodes; make described flexible membrane closely contact, thereby protect first circuit pattern 150 with the upper surface of first circuit pattern 150.
Shown in Fig. 3 D, provide the insulating barrier 170 that has with the corresponding opening 180 of flexible region.
Use is by forming insulating barrier 170 with the prepreg thermosetting resin impregnated glass fiber and that be made into semi-harden state or bonding sheet, with the physical strength that is used for increasing the interlayer adhesion strength when the lamination and strengthen rigid region after lamination.
Can be by using wooden punch die or metal die to carry out punching or being processed to form opening 180 by matching plane.
Shown in Fig. 3 E; insulating barrier 170 with opening 180 is laminated on two surfaces that have by first flexible membrane 110 of the part of first circuit pattern 150 of diaphragm 160 protection, has the bottom substrate of the rigid region IV of flexible region III and preparation with formation.
Replacedly, in the method for the hard and soft PCB of manufacturing according to the present invention, can press required additional circuit layers (not shown) and supplemental dielectric layer to form bottom substrate by on insulating barrier 170, replacing the stratum.
Therefore, first circuit pattern 150 and first flexible membrane 110 that opening 180 by insulating barrier 170 exposes have constituted flexible region III, and the zone that has demonstrated the mechanical strength that strengthens owing to the insulating barrier 170 with lamination has constituted the rigid region IV of preparation.
Shown in Fig. 3 F, single face FCCL 200,210,200 ', 210 ' is laminated on two surfaces of bottom substrate 190.
Single face FCCL 200,210 comprises second flexible membrane 200 and is formed on lip-deep Copper Foil 210 of FCCL.
Before hard and soft PCB finishes, can avoid the erosion of external environment condition by the pad parts that astomous single face FCCL 200,210 protects the opening 180 by 190 1 lip-deep insulating barriers 170 of bottom substrate to expose.
In addition, single face FCCL200 ', 210 ' is laminated on another surface of bottom substrate 190, described single face FCCL200 ', 210 ' has and the opening 180 corresponding openings 220 that are formed on the insulating barrier 170 on first flexible membrane 110, does not have first circuit pattern 150 simultaneously.
As in first flexible membrane 110, second flexible membrane 200 also can be formed by polyester film or polyimide film.
As shown in Fig. 3 G, break-through is at the Copper Foil 210,210 of 190 two surperficial higher slices of bottom substrate ' formed through hole 230, the inwall of and coating 240,240 ' be formed at through hole 230 and Copper Foil 210,210 ' on.
Since through hole 230 comprise such as first flexible membrane 110, insulating barrier 170 and second flexible membrane 200,200 ' etc. insulating material, wherein the through hole 230 second circuit pattern that is used for being made of Copper Foil 210 is electrically connected with first circuit pattern 150, therefore carry out chemical plating and electroplate with form coating 240,240 ', thereby give through hole 230 conductivity.
Therefore, use mechanical drilling machine,, in the precalculated position, form through hole 230 such as computer numerical control drilling machine (CNC).
In the present invention, be formed with on its inwall coating 240,240 ' through hole 230 can be filled the printing ink (not shown).
Shown in Fig. 3 H, be removed with the corresponding part of flexible region III with Copper Foil 210 of coating 240, and with the preparation rigid region IV corresponding have coating 240,240 ' Copper Foil 210,210 ' part be formed second circuit pattern 250,250 ', thereby finish rigid region V.
In this case, can by following steps form second circuit pattern 250,250 ', described step is: thus coating 240,240 ' on apply the photosensitive material (not shown), apply wiring diagram film, carry out exposure and develop and form the resist pattern that etching is used with predetermined pattern, and carry out the photoetching process that comprises etch processes.
Therefore, second circuit pattern 250 can be by through hole 230 and another lip-deep first circuit pattern 150 that is formed on substrate and second circuit pattern 250 ' be electrically connected.
At last, as shown in Fig. 3 I, be removed, thereby form the hard and soft PCB that comprises flexible region III and rigid region V with the part of corresponding second flexible membrane 200 of flexible region III.
Reference will be described the removal of corresponding second flexible membrane 200 as Fig. 4 of the vertical view of Fig. 3 H.That is to say, as shown in Figure 4, cut first area A with corresponding second flexible membrane 200 in the end of the flexible region III that does not contact rigid region V by laser processing or machining, and remove second area B with corresponding second flexible membrane 200 in the end of the flexible region III that contacts rigid region V by physical process.
Aforesaid, when the second area B that removes by physical process with corresponding second flexible membrane 200 in the end of the flexible region III that contacts rigid region V, the predetermined pressure that is applied in the physical process makes the end of second flexible membrane 200 predetermined angular that is inclined upwardly, therefore with to form the shape of flexible membrane 45 ends of lamination behind the opening opposite in the conventional procedures shown in Fig. 1 D.
When laser processing, do not damage in order only to cut second flexible membrane 200 first flexible membrane, 110, the first circuit patterns 150 also can comprise be formed on its with the corresponding zone, end of the flexible region III that does not contact rigid region V in border pattern (not shown).Therefore, described border pattern should not form and can be electrically connected with other pattern in first circuit pattern 150.
Replacedly, in the method for the hard and soft PCB of manufacturing according to the present invention, can remove part with corresponding second flexible membrane 200 of flexible region III once by laser processing or machining.In addition, when laser processing, can control, can not damage first flexible membrane 110 so that only remove second flexible membrane 200 to working depth.
Preferably use stamping machine, cutter or router to carry out machining.
In the conventional method of making hard and soft PCB; in processing procedure in order to protect the outside weld pad in flexible region or the erosion that employed pad parts in the weld pad is avoided external environment condition to be installed; use heatproof zone or peelable printing ink on pad parts, to form the resist protective layer; then after manufacturing process is finished, remove described resist protective layer.Therefore, conventional method meets with following problem, that is, because the pollution of residual resist protective layer causes the defect rate of product to increase, in addition, cause processing cost and process-cycle to increase owing to form the resist protective layer with the additional step of removing the resist protective layer.
Yet; method according to the hard and soft PCB of manufacturing of the present invention; can need not to use additional protection means to protect by the order that only changes step, therefore reduce processing cost and process-cycle and increased reliability of products in order externally to use the pad parts that exposes in weld pad and the installation weld pad.
That is to say, as lamination single face FCCL so that when forming the second circuit pattern of rigid region, before lamination, form and the corresponding opening of flexible region, but after the second circuit pattern forms, form described opening.Therefore,, also can in manufacture process, protect the pad parts that exposes, thereby realize the simple and product high reliability of technology even do not having under the situation of additional protection means.
As described in the text, the invention provides the method for making hard and soft PCB.Make the method for hard and soft PCB according to the present invention; need not to use the supplementary protection material just can protect for weld pad externally and install and use the pad parts that exposes in the weld pad by the order that only changes step, thereby reduced processing cost and process-cycle and increased reliability of products.
Although described the preferred embodiments of the present invention for illustrative purposes, but those of ordinary skills are understood that, under the prerequisite that does not break away from the scope and spirit of the present invention in the claims, can have various corrections, interpolation and alternative.
Claims (12)
1. a manufacturing comprises the method for the rigid-flexible printed circuit board of flexible region and rigid region, comprising:
Step (A): use diaphragm to protect the part corresponding to described flexible region of first circuit pattern on first flexible membrane, on its at least one surface, be formed with described first circuit pattern on described first flexible membrane, and with insulating barrier be laminated to corresponding described first circuit pattern of described rigid region on, thereby form bottom substrate;
Step (B): the single-sided flexible copper clad laminate is laminated on two surfaces of described bottom substrate, wherein each described single-sided flexible copper clad laminate all has second flexible membrane and the Copper Foil that is formed on the one surface;
Step (C): remove described Copper Foil corresponding to the part of described flexible region so that expose described second flexible membrane, and the other parts corresponding to described rigid region of described Copper Foil are formed the second circuit pattern that is connected with described first circuit pattern; And
Step (D): the part of removing described second flexible membrane corresponding to described flexible region.
2. method according to claim 1, wherein, the other parts corresponding to described flexible region by described first circuit pattern of described diaphragm protection are not the pad parts that are used for outside weld pad.
3. method according to claim 1, wherein, step (D) comprising:
(D-1) cut first area with corresponding described second flexible membrane in the end of the described flexible region that does not contact described rigid region by laser processing, and
(D-2) cut second area with corresponding second flexible membrane that is cut in the end of the described flexible region that contacts described rigid region by physical process, thus remove described second flexible membrane with the corresponding part of described flexible region.
4. method according to claim 3; wherein; described first circuit pattern comprises and is formed on it corresponding to the border pattern on the zone of the end of the described flexible region that does not contact described rigid region; so that protect described first flexible membrane when laser processing, described border pattern does not form and can be electrically connected with another pattern in described first circuit pattern.
5. method according to claim 1 wherein, is come performing step (D) by the part corresponding to described flexible region of utilizing laser processing to remove described second flexible membrane.
6. method according to claim 1, wherein, step (D) comprising:
(D-1) cut the first area corresponding to the described flexible region end that does not contact described rigid region of described second flexible membrane by machining, and
(D-2) cut the second area corresponding to the described flexible region end that contacts described rigid region of described second flexible membrane that is cut by physical process, thereby remove the part corresponding to described flexible region of described second flexible membrane.
7. method according to claim 1 wherein, is come performing step (D) by the part corresponding to described flexible region of utilizing machining to remove described second flexible membrane.
8. according to claim 6 or 7 described methods, wherein, described machining is by a kind of realization the optional in stamping machine, cutter and the router.
9. method according to claim 1, wherein, described first flexible membrane and described second flexible membrane all are polyimide films.
10. method according to claim 1, wherein, described insulating barrier is the prepreg under the semi-cured state.
11. method according to claim 1, wherein, described insulating barrier is a bonding sheet.
12. method according to claim 1 also comprises step (E), in step (A) afterwards promptly, alternately forms required additional circuit layers and supplemental dielectric layer on described insulating barrier.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050102464 | 2005-10-28 | ||
| KR1020050102464A KR100722621B1 (en) | 2005-10-28 | 2005-10-28 | Method for manufacturing Rigid-flexible Printed Circuit Board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1956628A true CN1956628A (en) | 2007-05-02 |
| CN100551206C CN100551206C (en) | 2009-10-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101503569A Expired - Fee Related CN100551206C (en) | 2005-10-28 | 2006-10-30 | Make the method for rigid-flexible printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007123902A (en) |
| KR (1) | KR100722621B1 (en) |
| CN (1) | CN100551206C (en) |
| TW (1) | TWI300678B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102149251A (en) * | 2010-02-05 | 2011-08-10 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| CN103813638A (en) * | 2012-11-02 | 2014-05-21 | 三星电机株式会社 | Method for manufacturing printed circuit board |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
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| JP2010021297A (en) * | 2008-07-10 | 2010-01-28 | Compeq Manufacturing Co Ltd | Rigid flex circuit board comprising peelable protective layer and manufacturing method thereof |
| KR100993318B1 (en) * | 2008-09-04 | 2010-11-09 | 삼성전기주식회사 | Method for manufacturi ng flying tail type rigid-flexible printed circuit board |
| TWI496518B (en) * | 2009-10-02 | 2015-08-11 | Innolux Corp | Flexible printed circuit board and method for forming monitor |
| KR101055514B1 (en) * | 2009-12-03 | 2011-08-08 | 삼성전기주식회사 | Manufacturing method of rigid-flexible substrate |
| KR101387313B1 (en) * | 2012-02-21 | 2014-04-18 | 삼성전기주식회사 | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
| CN103635007B (en) * | 2012-08-24 | 2016-12-21 | 富葵精密组件(深圳)有限公司 | Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacture method |
| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
| CN108012453B (en) * | 2017-12-07 | 2020-09-29 | 江门黑氪光电科技有限公司 | Manufacturing method of multilayer circuit board for LED lamp strip |
| TWI823350B (en) * | 2022-04-19 | 2023-11-21 | 大陸商深圳市柯達科電子科技有限公司 | Flexible circuit board connectors, touch screens and display devices |
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| JP3155565B2 (en) * | 1991-08-12 | 2001-04-09 | シャープ株式会社 | Manufacturing method of printed wiring board |
| JP2752285B2 (en) * | 1992-02-26 | 1998-05-18 | シャープ株式会社 | Printed wiring board |
| JPH05235556A (en) * | 1992-02-26 | 1993-09-10 | Fujitsu Ltd | Pattern cut structure of thin film substrate |
| JPH05259645A (en) * | 1992-03-12 | 1993-10-08 | Hitachi Chem Co Ltd | Manufacture of flexible/rigid wiring board |
| JPH0974252A (en) * | 1995-09-07 | 1997-03-18 | Nippon Avionics Co Ltd | Flexible rigid printed-wiring board and manufacture thereof |
| JPH10224037A (en) * | 1997-02-04 | 1998-08-21 | Sharp Corp | Manufacture of composite multilayer printed wiring board |
| JP4041048B2 (en) * | 2003-09-26 | 2008-01-30 | 山一電機株式会社 | Flexible / rigid wiring board and method for manufacturing the same |
| KR100632557B1 (en) * | 2004-04-20 | 2006-10-09 | 삼성전기주식회사 | Manufacturing method of a printed circuit board having a coverlay molded by photosensitive polyimide |
| JP2005191600A (en) * | 2005-03-24 | 2005-07-14 | Nitto Denko Corp | Manufacturing method for multilayer wiring circuit board |
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2005
- 2005-10-28 KR KR1020050102464A patent/KR100722621B1/en not_active IP Right Cessation
-
2006
- 2006-10-27 JP JP2006292679A patent/JP2007123902A/en active Pending
- 2006-10-27 TW TW95139767A patent/TWI300678B/en not_active IP Right Cessation
- 2006-10-30 CN CNB2006101503569A patent/CN100551206C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102149251A (en) * | 2010-02-05 | 2011-08-10 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN102149251B (en) * | 2010-02-05 | 2014-07-30 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN103813638A (en) * | 2012-11-02 | 2014-05-21 | 三星电机株式会社 | Method for manufacturing printed circuit board |
| CN103813638B (en) * | 2012-11-02 | 2018-06-29 | 三星电机株式会社 | For manufacturing the method for printed circuit board |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| CN103384444B (en) * | 2013-07-30 | 2016-04-20 | 博敏电子股份有限公司 | A kind ofly protect rigid-flex combined board of internal layer windowed regions and preparation method thereof |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN110139504B (en) * | 2019-05-24 | 2020-07-10 | 深圳市景旺电子股份有限公司 | Soft and hard combined circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007123902A (en) | 2007-05-17 |
| KR100722621B1 (en) | 2007-05-28 |
| CN100551206C (en) | 2009-10-14 |
| KR20070045787A (en) | 2007-05-02 |
| TW200718314A (en) | 2007-05-01 |
| TWI300678B (en) | 2008-09-01 |
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