TW200718314A - Method of manufacturing rigid-flexible printed circuit board - Google Patents
Method of manufacturing rigid-flexible printed circuit boardInfo
- Publication number
- TW200718314A TW200718314A TW095139767A TW95139767A TW200718314A TW 200718314 A TW200718314 A TW 200718314A TW 095139767 A TW095139767 A TW 095139767A TW 95139767 A TW95139767 A TW 95139767A TW 200718314 A TW200718314 A TW 200718314A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- rigid
- manufacturing
- Prior art date
Links
Abstract
Disclosed is a method of manufacturing a rigid-flexible printed circuit board. Particularly, this invention relates to a method of manufacturing a rigid-flexible printed circuit board including a flexible region provided with a pad portion and a rigid region, in which the pad portion, exposed for use in an external pad and a mounting pad, is protected by changing only the sequence of processes without using an additional protecting material, therefore decreasing the process cost and the process time period and increasing the reliability of products.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050102464A KR100722621B1 (en) | 2005-10-28 | 2005-10-28 | Method for manufacturing Rigid-flexible Printed Circuit Board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200718314A true TW200718314A (en) | 2007-05-01 |
TWI300678B TWI300678B (en) | 2008-09-01 |
Family
ID=38063640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95139767A TWI300678B (en) | 2005-10-28 | 2006-10-27 | Method of manufacturing rigid-flexible printed circuit board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007123902A (en) |
KR (1) | KR100722621B1 (en) |
CN (1) | CN100551206C (en) |
TW (1) | TWI300678B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010021297A (en) * | 2008-07-10 | 2010-01-28 | Compeq Manufacturing Co Ltd | Rigid flex circuit board comprising peelable protective layer and manufacturing method thereof |
KR100993318B1 (en) * | 2008-09-04 | 2010-11-09 | 삼성전기주식회사 | Method for manufacturi ng flying tail type rigid-flexible printed circuit board |
TWI496518B (en) * | 2009-10-02 | 2015-08-11 | Innolux Corp | Flexible printed circuit board and method for forming monitor |
KR101055514B1 (en) * | 2009-12-03 | 2011-08-08 | 삼성전기주식회사 | Manufacturing method of rigid-flexible substrate |
US8493747B2 (en) * | 2010-02-05 | 2013-07-23 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
KR101387313B1 (en) * | 2012-02-21 | 2014-04-18 | 삼성전기주식회사 | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
CN103635007B (en) * | 2012-08-24 | 2016-12-21 | 富葵精密组件(深圳)有限公司 | Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacture method |
KR101814113B1 (en) * | 2012-11-02 | 2018-01-02 | 삼성전기주식회사 | Method for manufacturing of printed circuit board |
CN103384444B (en) * | 2013-07-30 | 2016-04-20 | 博敏电子股份有限公司 | A kind ofly protect rigid-flex combined board of internal layer windowed regions and preparation method thereof |
CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
CN108012453B (en) * | 2017-12-07 | 2020-09-29 | 江门黑氪光电科技有限公司 | Manufacturing method of multilayer circuit board for LED lamp strip |
CN110139504B (en) * | 2019-05-24 | 2020-07-10 | 深圳市景旺电子股份有限公司 | Soft and hard combined circuit board and manufacturing method thereof |
TWI823350B (en) * | 2022-04-19 | 2023-11-21 | 大陸商深圳市柯達科電子科技有限公司 | Flexible circuit board connectors, touch screens and display devices |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3155565B2 (en) * | 1991-08-12 | 2001-04-09 | シャープ株式会社 | Manufacturing method of printed wiring board |
JPH05235556A (en) * | 1992-02-26 | 1993-09-10 | Fujitsu Ltd | Pattern cut structure of thin film substrate |
JP2752285B2 (en) * | 1992-02-26 | 1998-05-18 | シャープ株式会社 | Printed wiring board |
JPH05259645A (en) * | 1992-03-12 | 1993-10-08 | Hitachi Chem Co Ltd | Manufacture of flexible/rigid wiring board |
JPH0974252A (en) * | 1995-09-07 | 1997-03-18 | Nippon Avionics Co Ltd | Flexible rigid printed-wiring board and manufacture thereof |
JPH10224037A (en) * | 1997-02-04 | 1998-08-21 | Sharp Corp | Manufacture of composite multilayer printed wiring board |
JP4041048B2 (en) * | 2003-09-26 | 2008-01-30 | 山一電機株式会社 | Flexible / rigid wiring board and method for manufacturing the same |
KR100632557B1 (en) * | 2004-04-20 | 2006-10-09 | 삼성전기주식회사 | Manufacturing method of a printed circuit board having a coverlay molded by photosensitive polyimide |
JP2005191600A (en) * | 2005-03-24 | 2005-07-14 | Nitto Denko Corp | Manufacturing method for multilayer wiring circuit board |
-
2005
- 2005-10-28 KR KR1020050102464A patent/KR100722621B1/en not_active IP Right Cessation
-
2006
- 2006-10-27 TW TW95139767A patent/TWI300678B/en not_active IP Right Cessation
- 2006-10-27 JP JP2006292679A patent/JP2007123902A/en active Pending
- 2006-10-30 CN CNB2006101503569A patent/CN100551206C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI300678B (en) | 2008-09-01 |
CN1956628A (en) | 2007-05-02 |
KR100722621B1 (en) | 2007-05-28 |
CN100551206C (en) | 2009-10-14 |
JP2007123902A (en) | 2007-05-17 |
KR20070045787A (en) | 2007-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |