TW200718314A - Method of manufacturing rigid-flexible printed circuit board - Google Patents

Method of manufacturing rigid-flexible printed circuit board

Info

Publication number
TW200718314A
TW200718314A TW095139767A TW95139767A TW200718314A TW 200718314 A TW200718314 A TW 200718314A TW 095139767 A TW095139767 A TW 095139767A TW 95139767 A TW95139767 A TW 95139767A TW 200718314 A TW200718314 A TW 200718314A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
flexible printed
rigid
manufacturing
Prior art date
Application number
TW095139767A
Other languages
Chinese (zh)
Other versions
TWI300678B (en
Inventor
Yang-Je Lee
Dek-Gin Yang
Dong-Gi An
Young-Duck Park
Kyu-Hyok Yim
Myung Hee Jung
Jung Hoon Jang
Chul Min Lee
Young Po Park
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW200718314A publication Critical patent/TW200718314A/en
Application granted granted Critical
Publication of TWI300678B publication Critical patent/TWI300678B/en

Links

Abstract

Disclosed is a method of manufacturing a rigid-flexible printed circuit board. Particularly, this invention relates to a method of manufacturing a rigid-flexible printed circuit board including a flexible region provided with a pad portion and a rigid region, in which the pad portion, exposed for use in an external pad and a mounting pad, is protected by changing only the sequence of processes without using an additional protecting material, therefore decreasing the process cost and the process time period and increasing the reliability of products.
TW95139767A 2005-10-28 2006-10-27 Method of manufacturing rigid-flexible printed circuit board TWI300678B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050102464A KR100722621B1 (en) 2005-10-28 2005-10-28 Method for manufacturing Rigid-flexible Printed Circuit Board

Publications (2)

Publication Number Publication Date
TW200718314A true TW200718314A (en) 2007-05-01
TWI300678B TWI300678B (en) 2008-09-01

Family

ID=38063640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95139767A TWI300678B (en) 2005-10-28 2006-10-27 Method of manufacturing rigid-flexible printed circuit board

Country Status (4)

Country Link
JP (1) JP2007123902A (en)
KR (1) KR100722621B1 (en)
CN (1) CN100551206C (en)
TW (1) TWI300678B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021297A (en) * 2008-07-10 2010-01-28 Compeq Manufacturing Co Ltd Rigid flex circuit board comprising peelable protective layer and manufacturing method thereof
KR100993318B1 (en) * 2008-09-04 2010-11-09 삼성전기주식회사 Method for manufacturi ng flying tail type rigid-flexible printed circuit board
TWI496518B (en) * 2009-10-02 2015-08-11 Innolux Corp Flexible printed circuit board and method for forming monitor
KR101055514B1 (en) * 2009-12-03 2011-08-08 삼성전기주식회사 Manufacturing method of rigid-flexible substrate
US8493747B2 (en) * 2010-02-05 2013-07-23 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
KR101387313B1 (en) * 2012-02-21 2014-04-18 삼성전기주식회사 Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same
CN103635007B (en) * 2012-08-24 2016-12-21 富葵精密组件(深圳)有限公司 Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacture method
KR101814113B1 (en) * 2012-11-02 2018-01-02 삼성전기주식회사 Method for manufacturing of printed circuit board
CN103384444B (en) * 2013-07-30 2016-04-20 博敏电子股份有限公司 A kind ofly protect rigid-flex combined board of internal layer windowed regions and preparation method thereof
CN103763859A (en) * 2014-01-18 2014-04-30 上海美维电子有限公司 Machining method for printed circuit board
CN108012453B (en) * 2017-12-07 2020-09-29 江门黑氪光电科技有限公司 Manufacturing method of multilayer circuit board for LED lamp strip
CN110139504B (en) * 2019-05-24 2020-07-10 深圳市景旺电子股份有限公司 Soft and hard combined circuit board and manufacturing method thereof
TWI823350B (en) * 2022-04-19 2023-11-21 大陸商深圳市柯達科電子科技有限公司 Flexible circuit board connectors, touch screens and display devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155565B2 (en) * 1991-08-12 2001-04-09 シャープ株式会社 Manufacturing method of printed wiring board
JPH05235556A (en) * 1992-02-26 1993-09-10 Fujitsu Ltd Pattern cut structure of thin film substrate
JP2752285B2 (en) * 1992-02-26 1998-05-18 シャープ株式会社 Printed wiring board
JPH05259645A (en) * 1992-03-12 1993-10-08 Hitachi Chem Co Ltd Manufacture of flexible/rigid wiring board
JPH0974252A (en) * 1995-09-07 1997-03-18 Nippon Avionics Co Ltd Flexible rigid printed-wiring board and manufacture thereof
JPH10224037A (en) * 1997-02-04 1998-08-21 Sharp Corp Manufacture of composite multilayer printed wiring board
JP4041048B2 (en) * 2003-09-26 2008-01-30 山一電機株式会社 Flexible / rigid wiring board and method for manufacturing the same
KR100632557B1 (en) * 2004-04-20 2006-10-09 삼성전기주식회사 Manufacturing method of a printed circuit board having a coverlay molded by photosensitive polyimide
JP2005191600A (en) * 2005-03-24 2005-07-14 Nitto Denko Corp Manufacturing method for multilayer wiring circuit board

Also Published As

Publication number Publication date
TWI300678B (en) 2008-09-01
CN1956628A (en) 2007-05-02
KR100722621B1 (en) 2007-05-28
CN100551206C (en) 2009-10-14
JP2007123902A (en) 2007-05-17
KR20070045787A (en) 2007-05-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees