WO2023024981A1

WO2023024981A1 - Electronic device

Info

Publication number: WO2023024981A1
Application number: PCT/CN2022/112870
Authority: WO
Inventors: 马伊欣; 陈金榜; 唐辉俊; 曾瑞
Original assignee: 华为技术有限公司
Priority date: 2021-08-24
Filing date: 2022-08-16
Publication date: 2023-03-02
Also published as: EP4369875A1; CN115720419A

Abstract

The present application provides an electronic device, comprising a housing and a display screen, the display screen being mounted on the housing. The electronic device further comprises a carrier plate and a flexible flat cable, the carrier plate being loaded with a device, the carrier plate and the flexible flat cable being arranged between the housing and the display screen, and the flexible flat cable being connected to the carrier plate in a welding manner. According to the present application, the use of an existing connector can be canceled by connecting the flexible flat cable to the carrier plate in a welding manner, such that the distance between the housing and the display screen can be reduced from the sum of the thickness of the carrier plate and the height of the connector to the sum of the thickness of the carrier plate and the height of the device thereon, thereby facilitating the implementation of thin design of the electronic device. Moreover, the cancellation of the connector can save a large under-screen space, thereby facilitating the arrangement and optimization of the device and lines.

Description

Electronic equipment

This application claims the priority of a Chinese patent application with application number 202110974592.7 and application title "Electronic Equipment" filed with the State Intellectual Property Office of China on August 24, 2021, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of electronic terminals, and in particular to an electronic device.

Background technique

Both FFC (Flexible flat cable, flexible flat cable) and FPC (Flexible printed circuit, flexible printed circuit board) can be used for signal connection in electronic products such as monitors, notebooks, desktops, and mobile phones. At present, the connection method between FFC cable or FPC cable and PCB (Printed circuit board, printed circuit board) can only be achieved by installing a connector on the PCB board and connecting it with the FFC cable or FPC cable through the connector to realize the signal. transmission. However, the height of the connector perpendicular to the surface of the screen is large, and the width requirement is large, resulting in a small screen-to-body ratio and a small space under the screen.

application content

The purpose of the present application is to provide an electronic device to solve the problem in the prior art that the connection between the connector and the FFC cable cannot realize the thinning of the electronic product.

The present application provides an electronic device, including a casing and a display screen, the display screen is installed on the casing, wherein the electronic device further includes a carrier board and a flexible cable, the carrier board is loaded with devices, The carrier board and the flexible flat wire are disposed between the housing and the display screen, and the flexible flat wire is welded to the carrier board.

This application can eliminate the use of the existing connector by adopting the connection method of the flexible cable and the carrier board by welding, so that the distance between the housing and the display screen can be reduced from the sum of the thickness of the carrier board and the height of the connector The sum of the thickness of the substrate and the height of the device on it is beneficial to realize the thin design of electronic equipment. At the same time, canceling the connector can save a large space under the screen, which is conducive to the layout and optimization of devices and circuits.

In a possible implementation manner, the soldering height of the flexible flat wire and the carrier board is smaller than the height of the device on the carrier board, or the soldering thickness of the flexible flat wire and the carrier board is smaller than the The thickness of the device on the carrier. Therefore, the distance between the casing of the electronic device and the display screen can be further reduced at least to the sum of the thickness of the carrier board 1 and the thickness of the device, which is beneficial to realize the thin design of the electronic device.

In a possible implementation manner, the flexible flat cable includes a conductive layer, a solder layer is at least partially disposed on the conductive layer, and/or holes for filling solder are disposed on the conductive layer.

Wherein, in the case where the soldering layer is at least partly provided on the conductive layer and there is no hole in the conductive layer, the soldering layer and the solder can have a better bonding effect by providing the soldering layer, which can enhance solderability and improve the performance of the flexible cable. Welding strength with carrier board.

In the case where the conductive layer is provided with a hole for filling solder but does not have a solder layer, the hole is used to fill the solder on the carrier plate, so that both sides of the conductive layer can have solder, which also simplifies the process while ensuring the soldering strength. welding operation.

In the case where the conductive layer is provided with both a soldering layer and a hole for filling solder, the soldering operation can be simplified and the reliability of the soldering connection between the conductive layer and the carrier board can be achieved.

In a possible implementation manner, the flexible flat cable further includes an insulating layer, the conductive layer is provided with a welding area, and the insulating layer covers a part of the conductive layer outside the welding area. Therefore, the contact between the conductive layer and other components can be effectively isolated to avoid leakage. At the same time, no insulating layer is provided on the welding area, which can facilitate the welding of the conductive layer to the carrier board through its welding area, so as to realize the connection between the flexible cable and the carrier board. In addition, the insulating layer can also enhance the strength and bending resistance of the flexible flat cable, preventing the flexible flat cable from being deformed or damaged due to slight interference.

In a possible implementation manner, an opening is provided on the insulating layer, and the opening is aligned with the welding area. By setting the window on the insulating layer, it is not only convenient for welding, but also makes the setting of the welding position more flexible. The form is wider.

In a possible implementation manner, the welding area is disposed at an end of the conductive layer, and the end of the conductive layer having the welding area protrudes from the insulating layer. Wherein, one end of the conductive layer protruding from the insulating layer can be directly welded to the carrier board, so that no window needs to be opened on the insulating layer.

In a possible implementation manner, in a state after welding, an adhesive layer is provided between the welding area and the insulating layer. Therefore, the strength and bending resistance of the conductive layer at the position of the interface can be enhanced.

In a possible implementation manner, the material of the insulating layer is polyethylene terephthalate (PET), polyimide (PI), liquid crystal polymer (LCP) and polyether ether ketone (PEEK ) of one or a combination of two or more. This enables the insulating layer to obtain excellent electrical insulation, fatigue resistance and other characteristics.

In a possible implementation manner, the insulating layer includes a polyethylene terephthalate (PET) layer and a polyimide (PI) layer, and the polyimide (PI) layer covers the The position of the conductive layer is close to the welding area, and the polyethylene terephthalate (PET) layer covers the position of the conductive layer away from the welding area. The insulation layer adopts the combination of PET layer and PI layer as a whole, that is, the insulation layer can use PI material near the welding area, and use the high temperature resistance of PI material to avoid the problem of thermal melting and ensure the welding quality. The position of the area is made of PET material, which can effectively reduce the cost of the insulating layer while achieving insulation and protection effects.

In a possible implementation manner, the insulating layer includes a first film layer and a second film layer, and the first film layer and the second film layer are respectively disposed on two sides of the conductive layer. Thereby facilitating processing.

In a possible implementation manner, the material of the soldering layer is tin, gold or silver. Tin, gold, and silver have strong solderability, which can effectively ensure the strength and reliability of the soldering between the conductive layer and the carrier board.

In a possible implementation manner, the conductive layer includes at least one copper sheet. The copper sheet has a certain width, which is convenient for opening holes on the surface, and is also conducive to welding and fixing between the copper sheet and the carrier board.

In a possible implementation manner, the flexible flat cable is welded and connected to the carrier board through a laser welding process, an ultrasonic welding process, a reflow soldering process or a hot-press soldering soldering process. Thereby, the stability of welding quality can be guaranteed.

In a possible implementation manner, the carrier board is one of a camera module board, a microphone board, or a multilayer PCB board.

It is to be understood that both the foregoing general description and the following detailed description are exemplary only and are not restrictive of the application.

Description of drawings

Fig. 1 is the state diagram that circuit board is connected with line in the prior art;

Fig. 2 is a state diagram (1) of a conductive layer having a welding layer and not having a hole in welding;

Fig. 3 is a state diagram (two) in soldering of a conductive layer having a welding layer and not having a hole;

Fig. 4 is the state figure that has hole and does not have the conductive layer of welding layer in welding;

5 is a schematic diagram of opening holes in the welding area of the conductive layer;

Fig. 6 is a state diagram in welding of a conductive layer having both a hole and a welding layer;

Fig. 7 is the perspective view that insulating layer is arranged on conductive layer (insulating layer has window);

Fig. 8 is a cross-sectional view of an insulating layer arranged on a conductive layer (the insulating layer has a window);

Fig. 9 is a perspective view of an insulating layer disposed on a conductive layer (the insulating layer does not have a window);

10 is a cross-sectional view of an insulating layer disposed on a conductive layer (the insulating layer does not have a window);

Fig. 11 is a structural schematic diagram of the insulating layer adopting PI material arranged on the conductive layer (the end of the conductive layer does not protrude from the insulating layer);

Fig. 12 is a schematic structural view of an insulating layer including a PET layer and a PI layer disposed on a conductive layer;

Fig. 13 is a structural schematic diagram of a notebook computer;

Fig. 14 is the sectional view (insulation layer comprises PET layer and PI layer) that is provided with insulation layer on the conductive layer with welding layer;

FIG. 15 is a schematic structural view of an insulating layer of PI material disposed on a conductive layer (the end of the conductive layer protrudes from the insulating layer);

Figure 16 is a state diagram of dispensing glue in the welding area.

Reference signs:

100-circuit board;

200-connector;

300-device;

400-line;

1-carrier board;

2-soft cable;

21 - conductive layer;

211-hole;

22 - insulating layer;

221 - the first film layer;

222 - the second film layer;

23 - welding layer;

24 - open the window;

25-PET layer;

26-PI layer;

3 - solder;

4 - Laptop;

41 - housing;

42 - main board;

43 - display screen;

5- Glue.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description serve to explain the principles of the application.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated , the term "plurality" refers to two or more; the terms "connection", "fixation" and so on should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integrated Connected, or electrically connected; either directly or indirectly through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In the description of this specification, it should be understood that the orientation words such as "up" and "down" described in the embodiments of the present application are described from the perspective shown in the drawings, and should not be interpreted as a description of the embodiments of the present application. limited. Furthermore, in this context, it also needs to be understood that when it is mentioned that an element is connected "on" or "under" another element, it can not only be directly connected "on" or "under" another element, but can also To be indirectly connected "on" or "under" another element through an intervening element.

An embodiment of the present application provides an electronic device, the electronic device includes, for example, a display, a notebook computer, a desktop computer, an all-in-one computer, a mobile phone, a tablet computer or a smart watch, etc. This embodiment does not make specific limitations. Electronic equipment usually includes a display screen and a housing, and a circuit board is integrated between the display screen and the housing, and various devices capable of realizing different functions are arranged on the circuit board, such as a camera module, a microphone module, and the like. This type of device needs to be connected to the main control unit of the electronic device through a line, and the main control unit can perform signal transmission through the line to realize the above-mentioned various functions.

Fig. 1 is the state diagram of circuit board and circuit connection in the prior art, as shown in Fig. 1, existing circuit usually needs to realize the connection with circuit board 100 through connector 200 (such as BTB/Zif/WTB connector), That is, it is necessary to solder the connector on the circuit board 100 , and then insert the circuit 400 into the interface of the connector 200 , so as to complete the connection between the circuit 400 and the circuit board 100 . However, the existing connectors 200 are all three-dimensional block structures, and their height in the Z direction (direction perpendicular to the surface of the display screen) is relatively large, and is usually greater than the height of the device 300 on the circuit board 100, which requires that the housing and The distance between displays is large, making it difficult to achieve thin designs for electronic devices. At the same time, the overall volume of the connector 200 is relatively large, which reduces the space under the screen of the electronic device, and requires a large width of the connector 200 in a direction parallel to the display screen, which also reduces the screen-to-body ratio of the screen.

To this end, the embodiment of the present application provides an electronic device, which includes a casing and a display screen, and the display screen is installed on the casing, wherein the electronic device also includes a carrier board 1 and a flexible cable 2, and the carrier board 1 is loaded with There are devices that can realize various functions. The carrier board 1 and the flexible flat cable 2 are arranged between the casing and the display screen, and the flexible flat cable 2 is connected to the carrier board 1 by welding. Wherein, the carrier board 1 can be a circuit board, such as a single-layer or multi-layer PCB (Printed circuit board, printed circuit board) board, FPC (Flexible printed circuit, flexible printed circuit board) board, etc. The carrier board 1 has a certain width and length, and its surface can be mounted with various functional devices. The thickness of the carrier board 1 is small. When the carrier board 1 is installed on the housing, the surface of the carrier board 1 and the display The surfaces are parallel. At this time, the thickness of the carrier board 1 and the height of the device on the carrier board 1 define the distance between the housing and the display screen. By using the connection method of the flexible flat wire 2 and the carrier board 1 by welding, it can The use of the existing connector is canceled, and the welding height of the flexible cable 2 and the carrier board 1 at the welding position is much smaller than the height of the device on the carrier board 1, so that the distance between the housing and the display screen can be reduced from the carrier board The sum of the thickness of 1 and the height of the connector is reduced to the sum of the thickness of the carrier 1 and the height of the components on it, which is beneficial to realize the thin design of electronic equipment. At the same time, canceling the connector can save a large space under the screen, which is the space between the display screen and the housing, which is beneficial to the arrangement and optimization of devices and circuits.

In addition, since the connector has a larger size in the directions of width and length, this also requires a larger size of the circuit board connected with the connector, resulting in a reduced screen-to-body ratio. In this embodiment, by using welding instead of the application of the connector, the welding area does not need to occupy a large area on the carrier 1 , thereby reducing the width and length of the carrier 1 and increasing the screen ratio.

Wherein, the flexible flat cable 2 may be flexible flat cable such as FFC (Flexible flat cable, flexible flat cable) flat cable, FPC (Flexible printed circuit, flexible printed circuit board) flat cable. In this embodiment, the flexible flat cable 2 is preferably an FFC flat cable, and the number and spacing of wires can be arbitrarily selected for the FFC flat cable, which makes the connection more convenient and greatly reduces the size of the electronic device.

It should be noted that the welding height of the flexible flat wire 2 and the carrier 1 is smaller than the height of the devices on the carrier 1 , or the welding thickness of the flexible flat wire 2 and the carrier 1 is smaller than the thickness of the devices on the carrier 1 . Among them, the welding height of the flexible flat wire 2 and the carrier 1 and the height of the device on the carrier 1 refer to the height dimension perpendicular to the surface of the display screen, or the welding thickness of the flexible flat wire 2 and the carrier 1 and the height of the carrier 1. The thickness of the device on 1 refers to the thickness dimension in the direction perpendicular to the surface of the display. In this application, the soldering thickness of the flexible flat cable 2 and the carrier board 1 is smaller than the thickness of the devices on the carrier board 1 for illustration.

It can be understood that for existing electronic devices with connectors, since the thickness of the connector is usually greater than the thickness of the device on the carrier, the thickness of the electronic device is determined by the thickness of the carrier and the thickness of the connector on the carrier. , that is, the overall thickness of the electronic device is at least greater than the sum of the thickness of the carrier board and the thickness of the connector, which leads to the fact that the thickness of the electronic device cannot be further reduced, and it is difficult to realize the thin design of the electronic device. For this reason, in this embodiment, the use of the existing connector can be eliminated by adopting the connection method in which the carrier board 1 and the flexible flat cable 2 are welded together, and the welding thickness of the flexible flat cable 2 and the carrier board 1 at the welding position is much larger. Far smaller than the height of the device on the carrier 1, the distance between the casing of the electronic device and the display screen can be further reduced at least to the sum of the thickness of the carrier 1 and the device, which is beneficial to realize the thin design of the electronic device.

Wherein, the flexible flat cable 2 includes a conductive layer 21 , which can realize signal transmission between the main control unit and the carrier board 1 , and at the same time, the flexible flat cable 2 can be directly connected to the carrier board 1 by welding through the conductive layer 21 .

In a specific embodiment, the conductive layer 21 is at least partially provided with the solder layer 23 , and the conductive layer 21 does not have the hole 211 . Specifically, the soldering layer 23 may be disposed in a certain area on the conductive layer 21 that is soldered to the carrier board 1 . In one welding operation mode, as shown in FIG. 2 , solder 3 can be added to the soldering part on the carrier board 1 first, and then the soldering part on the conductive layer 21 is overlapped to the soldering part on the carrier board 1. The welding process provided is to weld the conductive layer 21 at the overlapping position of the carrier board 1 . In another soldering operation mode, as shown in FIG. 3 , it is also possible to add solder 3 to the soldering part on the carrier board 1 first, and then overlap the soldering part on the conductive layer 21 to the soldering part on the carrier board 1, Then add solder 3 to the soldering part on the conductive layer 21, so that the soldering part of the conductive layer 21 is buried in the solder 3, and then use a preset welding process to weld the overlapping position of the conductive layer 21 and the carrier board 1.

During soldering, the temperature at the soldering position is relatively high, and the solder layer 23 and the solder 3 are melted and combined into one body, so that the reliable connection between the conductive layer 21 and the carrier board 1 is realized through the fusion of the solder layer 23 and the solder 3 .

Compared with the way that the conductive layer 21 is directly soldered to the carrier 1, by setting the soldering layer 23 on the conductive layer 21, the soldering layer 23 and the solder 3 can have a better bonding effect, enhance solderability, and improve the flexibility of the flexible cable 2. Welding strength with carrier 1.

It should be noted that the conductive layer 21 generally has a relatively long length. Before the soldering layer 23 is set on the conductive layer 21, it can be determined that the soldering layer 23 needs to be set on the conductive layer 21 according to the length requirement of the flexible flat cable 2 required by the electronic equipment. s position. Of course, in order to simplify the process of disposing the soldering layer 23 on the conductive layer 21, the soldering layer 23 can also be provided on the entire surface of the conductive layer 21. When it is applied to an electronic device, it only needs to be cut to a length that meets the requirements of the electronic device.

In another specific embodiment, as shown in FIG. 4 and FIG. 5 , the conductive layer 21 may be provided with a hole 211 for filling the solder 3 , but the conductive layer 21 does not have a solder layer 23 . During the soldering operation, the soldering part on the conductive layer 21 can be overlapped to the soldering part on the carrier board 1, and then the solder 3 is added on the conductive layer 21. Since the conductive layer 21 is provided with a hole 211, the solder 3 can be The via hole 211 is filled on the carrier board 1 , and then a preset soldering process can be used to weld the conductive layer 21 at the overlapping position of the carrier board 1 . In this embodiment, the solder 3 can be filled between the conductive layer 21 and the carrier 1 from the side of the conductive layer 21 away from the carrier 1 through the hole 211 on the conductive layer 21, so that both sides of the conductive layer 21 can have The solder 3 , during the soldering process, the molten solder 3 can completely cover and fix the welding part of the conductive layer 21 to the carrier board 1 , thereby improving the welding strength between the conductive layer 21 and the carrier board 1 . At the same time, in this embodiment, only the solder 3 is added to the conductive layer 21 , which simplifies the soldering operation.

Wherein, the hole 211 on the conductive layer 21 can be opened on the conductive layer 21 for soldering, so as to allow the solder 3 to pass through. The hole 211 may be realized by laser drilling 211 or mechanical drilling 211 , which is not limited in this embodiment.

In yet another specific embodiment, as shown in FIG. 6 , both the solder layer 23 and the hole 211 for filling the solder 3 are provided on the conductive layer 21 . During the soldering operation, the soldering part on the conductive layer 21 can be overlapped to the soldering part on the carrier board 1, and then the solder 3 is added on the conductive layer 21. Since the conductive layer 21 is provided with a hole 211, the solder 3 can be The via hole 211 is filled on the carrier board 1 , and then a preset soldering process can be used to weld the conductive layer 21 at the overlapping position of the carrier board 1 . During soldering, the higher heat melts and combines the soldering layer 23 and the solder 3 into one, and at the same time, the molten soldering layer 23 and the soldering material 3 can cover and fix the soldering part of the conductive layer 21 to the carrier plate 1 as a whole, thereby , this embodiment not only simplifies the welding operation, but also can realize the reliability of the welding connection between the conductive layer 21 and the carrier board 1 .

Wherein, the welding process adopted between the flexible flat cable 2 and the carrier board 1 may be a laser welding process, an ultrasonic welding process, a reflow soldering process or a hot-press melting soldering process and the like.

In addition, the above-mentioned solder 3 can be tin material, and the method of adding solder 3 can be prefabricated tin at the soldering position on the carrier board 1, or manual tinning, such as tin wire feeding, tin spraying, etc. Examples are not limited.

As a specific implementation, the flexible flat cable 2 further includes an insulating layer 22 , the conductive layer 21 is provided with a welding area, and the insulating layer 22 covers a part of the conductive layer 21 outside the welding area. The welding area is an area on the conductive layer 21 that needs to be welded to the carrier board 1 through a welding process. It can be understood that there is usually a certain distance between the carrier board 1 and the main control unit in the electronic device, and it needs to be connected through a flexible flat cable 2, and the flexible flat cable 2 is easily located between the carrier board 1 and the main control unit. If the conductive layer 21 is in a bare state as a whole, it will easily cause leakage, and lead to problems such as short circuit and ablation between the flexible flat cable 2 and other components. For this reason, in this embodiment, by arranging the insulating layer 22 on the position outside the welding area on the conductive layer 21, the contact between the conductive layer 21 and other components and parts can be effectively isolated, and electric leakage is avoided. At the same time, no insulating layer is provided on the welding area. 22, which can facilitate the welding of the conductive layer 21 to the carrier board 1 through its welding area, so as to realize the connection of the flexible flat wire 2 and the carrier board 1 . In addition, the insulating layer 22 can also enhance the strength and bending resistance of the flexible flat wire 2 to prevent the flexible flat wire 2 from being deformed or damaged due to slight interference.

In a specific embodiment, as shown in Figures 7 and 8, the insulating layer 22 can cover the conductive layer 21 as a whole, and the window 24 is only opened at the position opposite to the welding area, so that the welding area can pass through The window 24 is exposed to facilitate the addition of solder 3 to the soldering area through the window 24 and the soldering operation. Wherein, the welding area can be set at a certain set position between the two ends of the conductive layer 21, and the window 24 can be set at a corresponding position on the insulating layer 22 according to the setting of the welding position. The window 24 is set on the insulating layer 22, which not only facilitates the welding, but also makes the setting of the welding position more flexible. The application form is more extensive.

In another specific embodiment, as shown in FIG. 9 and FIG. 10, the welding area can be arranged at the end of the conductive layer 21, that is, a section of length at the end of the conductive layer 21 can be a welding area, and the conductive layer The end at 21 with the soldering area protrudes from the insulating layer 22 . In this embodiment, one end of the conductive layer 21 protruding from the insulating layer 22 can be directly soldered to the carrier 1 , and the insulating layer 22 does not need to open a window 24 . Wherein, the length of the insulating layer 22 can be determined according to the length requirement of the conductive layer 21 .

In addition, it should be noted that, in this embodiment, the end portion with the welding area on the conductive layer 21 protrudes from the insulating layer 22, that is, only one side of the welding area has the insulating layer 22, and the end surface of the insulating layer 22 forms a welding The interface between the area and the insulating layer 22, the part of the flexible flat cable 2 with the insulating layer 22 has strong bending resistance, while the welding area without the insulating layer 22 has weak bending resistance and is prone to bending deformation, and is easy to The bending deformation occurs at the interface, and the bending deformation will cause fatigue fracture of the conductive layer 21 at the interface. For this reason, after welding, an adhesive layer can be arranged between the welding area and the insulating layer 22, that is, the adhesive layer is preferably arranged at the interface position, thereby enhancing the strength and bending resistance of the conductive layer 21 at the interface position. sex.

Specifically, the material of the insulating layer 22 is but not limited to one of polyethylene terephthalate (PET), polyimide (PI), liquid crystal polymer (LCP) and polyether ether ketone (PEEK). one or a combination of two or more. Wherein, the insulating layer 22 as a whole can be prepared from any of the above-mentioned materials; the insulating layer 22 can also have multiple sections, and each section can be prepared from any of the above-mentioned materials, and then each section is combined to form a complete insulating layer 22, wherein , the length of each section can be the same or different, and can be specifically determined according to the size specification of the conductive layer 21 and the position of the welding area. The insulating layer 22 can be disposed on the conductive layer 21 by a thermocompression bonding process, and of course other existing processes can also be used, which is not limited in this embodiment.

In a specific embodiment, the material of the insulating layer 22 is PET, and the insulating layer 22 of the PET material has excellent electrical insulation, creep resistance, fatigue resistance, friction resistance and dimensional stability, and PET The material cost is low, which saves the manufacturing cost of the electronic device.

In another specific embodiment, since the thermal melting point of the PET material is 105°C, during the welding process of the welding area of the conductive layer 21, there is a heat-affected zone in a certain range around the welding area, and the heat-affected zone is formed by welding The temperature of the heat-affected zone is still high, which will cause the PET material in contact with the heat-affected zone to melt and flow to the welding position, forming holes in the welding position and other problems. For this reason, in this embodiment, as shown in Figure 11, the material of the insulating layer 22 is PI, because its high temperature resistance can reach more than 400°C, and it will not melt when it contacts the heat-affected zone, thus ensuring the conductive layer. The welding effect between 21 and the carrier plate 1 prevents the formation of voids at the welding position.

In yet another specific embodiment, as shown in FIG. 12 , the insulating layer 22 includes a PET layer 25 and a PI layer 26 , and the PI layer 26 covers the position of the conductive layer 21 close to the welding area. It should be noted that the cost of the PI material is much higher than that of the PET material. If the insulating layer 22 is entirely made of the PI material, the overall cost of the electronic device will increase. For this reason, in the present embodiment, the insulating layer 22 adopts the combined application form of the PET layer 25 and the PI layer 26 as a whole, that is, the insulating layer 22 can adopt PI material near the welding area, and utilize the high temperature resistance characteristic of the PI material to avoid heat melting. If problems occur, the welding quality is guaranteed, and the use of PET material at a position away from the welding area can effectively reduce the cost of the insulating layer 22 while achieving insulation and protection effects.

Specifically, as shown in FIG. 7 and FIG. 9 , the insulating layer 22 includes a first film layer 221 and a second film layer 222 , and the first film layer 221 and the second film layer 222 are respectively disposed on two sides of the conductive layer 21 . Both the first film layer 221 and the second film layer 222 can be in the shape of a film, and when preparing the flexible cable 2, the conductive layer 21 can be arranged between the first film layer 221 and the second film layer 222, and adopt The heat-compression bonding process heat-compresses the first film layer 221 , the conductive layer 21 and the second film layer 222 into an integral structure, so that the first film layer 221 and the second film layer 222 are fixedly covered on the conductive layer 21 .

As a specific implementation manner, the material of the soldering layer 23 is tin, gold or silver. Wherein, the welding layer 23 is a plating layer formed on the conductive layer 21 through a surface treatment process. Tin, gold, and silver have strong solderability, which can effectively ensure the strength and reliability of the soldering between the conductive layer 21 and the carrier board 1 . In this embodiment, the material of the welding layer 23 is preferably tin, and the tin material used as the welding layer 23 can not only ensure the welding strength, but also reduce the cost.

As a specific implementation manner, the conductive layer 21 may be made of copper, and specifically may include at least one copper sheet. The copper sheet has a certain width, and a through hole 211 can be opened on the surface of the copper sheet, for solder 3 to be added in the hole 211 and solder 3 to be added between the copper sheet and the carrier plate 1 after passing through the hole 211, so as to ensure the soldering reliability.

As a specific implementation manner, the carrier board 1 in the embodiment of the present application may be one of a camera module board, a microphone board or a multi-layer PCB board.

The present application is specifically illustrated by the following examples.

Example 1:

As shown in Figure 13, the electronic device can be a notebook computer 4 product, and the carrier board 1 can be a small camera module board, and the camera module small board is fixed on the casing 41 of the notebook computer, and is located between the display screen 43 and the casing. Between body 41. Flexible cable 2 is an FPC cable. One end of the FPC cable can be connected to the small board of the camera module by laser welding, ultrasonic welding, reflow welding or hot-press soldering. The other end of the FPC cable is connected to the notebook The main board 42 of the computer 4, so that the signal transmission between the main board 42 and the small board of the camera module can be realized through the FPC cable. In this embodiment, as shown in FIG. 4 and FIG. 5 , the conductive layer 21 of the FPC cable can be provided with holes 211 for adding solder 3 by means of mechanical drilling 211, laser drilling 211, etc., and the conductive layer 21 An insulating layer 22 is arranged on the outside, and the material of the insulating layer 22 is PI, as shown in FIG. 11 . Wherein, the conductive layer 21 is a copper wire.

In this embodiment, the solder 3 can be filled into the hole 211, and can also be filled from the side of the conductive layer 21 away from the small camera module board to between the conductive layer 21 and the small camera module board through the hole 211 on the conductive layer 21. During the welding process, the molten solder 3 can completely cover and fix the welding part of the conductive layer 21 on the small board of the camera module, thereby improving the conductive layer 21. Welding strength with the small board of the camera module. At the same time, in this embodiment, only the solder 3 is added to the conductive layer 21 without adding solder 3 to the camera module board, which simplifies the soldering operation.

In addition, in this embodiment, as shown in FIG. 7 and FIG. 8 , the insulating layer 22 can cover the conductive layer 21 as a whole, and a window 24 is only opened at a position opposite to the welding area, so that the welding area can pass through the window 24 It is exposed outside so as to facilitate the addition of solder 3 to the soldering area through the window 24 and the soldering operation. Wherein, the welding area can be set at a certain set position between the two ends of the conductive layer 21, that is, the welding area has an insulating layer 22 on both sides in the length direction of the flexible flat cable 2, through which the insulating layer 22 can be lifted. The bending resistance of the flexible flat cable 2 on both sides of the welding area, after the welding is completed, the strength of the welding position can still be guaranteed without dispensing glue. At the same time, the welding method between the small camera module board and the FPC cable can reduce the Z-direction space between the small camera module board and the notebook computer casing, thereby reducing the overall thickness of the screen side and realizing the thin design of the notebook computer. In addition, the welding method between the camera module board and the FPC cable replaces the application of traditional connectors, which can reduce the width of the camera module board and increase the competitiveness of the notebook computer screen ratio.

Example 2:

The electronic device can be a display product, the carrier board 1 can be a small microphone board, the flexible flat cable 2 can be an FFC flat cable, and one end of the FFC flat cable and the small microphone small board can be welded by laser welding, ultrasonic welding, reflow welding or hot-press melting The other end of the FFC cable is connected to the motherboard of the display product, so that the signal transmission between the motherboard and the microphone board can be realized through the FFC cable. In this embodiment, as shown in FIG. 5 and FIG. 6 , the conductive layer 21 of the FFC cable can be provided with holes 211 for adding solder 3 through mechanical drilling 211, laser drilling 211, etc., and the conductive layer 21 An insulating layer 22 is arranged on the outside, and the material of the insulating layer 22 is a combination of PET and PI, as shown in FIG. 12 . Wherein, the conductive layer 21 is a tinned copper wire.

In this embodiment, the solder 3 can be filled into the hole 211, and can also be filled between the conductive layer 21 and the microphone plate from the side of the conductive layer 21 away from the microphone plate through the hole 211 on the conductive layer 21, so that the conduction Both sides of layer 21 can have solder 3 , which is tin. During the soldering process, the molten tin material can completely cover and fix the welding part of the conductive layer 21 to the microphone board, thereby improving the welding strength between the conductive layer 21 and the microphone board. At the same time, in this embodiment, it is only necessary to add tin material to the conductive layer 21 , without adding tin material separately to the small microphone board, which simplifies the soldering operation.

In addition, in this embodiment, the insulating layer 22 includes a PET layer 25 and a PI layer 26. After the insulating layer 22 is disposed on the conductive layer 21, the PET layer 25 and the PI layer 26 are butted in the length direction of the conductive layer 21, wherein the PI layer The layer 26 covers the position of the conductive layer 21 close to the welding area, so that the high temperature resistance of the PI material can be used to avoid the problem of thermal melting and ensure the welding quality. The use of PET material at a position away from the welding area can effectively reduce the cost of the insulating layer 22 while achieving insulation and protection effects.

In this embodiment, the conductive layer 21 is a tinned copper wire. When welding, the temperature at the welding position is relatively high, and the tin layer on the copper wire and the tin material are melted and combined into one, thereby achieving This ensures reliable connection between the conductive layer 21 and the microphone board.

In addition, as shown in Figure 9 and Figure 14, the welding area is set at the end of the conductive layer 21, that is, a section of length at the end of the conductive layer 21 is a welding area, and the end with the welding area on the conductive layer 21 is insulated from the The insulating layer 22 protrudes and can be directly welded to the small microphone board without opening the window 24 on the insulating layer 22, which simplifies the process.

In this embodiment, tinned copper wires are used, and holes 211 for adding tin materials are provided on the tinned copper wires, which effectively improves the welding strength, eliminates the need for glue dispensing in the welding area, and simplifies the process. At the same time, the welding method between the microphone board and the FFC cable replaces the application of traditional connectors, so that the width and other dimensions of the microphone board can be further reduced, thereby improving the space on the display structure and saving production cost.

Example 3:

The electronic device can be a new type of sandwich structure, the sandwich structure includes a multi-layer PCB board, the flexible cable 2 is an FFC cable, and the FFC cable is connected to the multi-layer PCB board by welding, that is, the multi-layer PCB board can be passed through the FFC cable. The welding process realizes the transmission and conduction of signals.

In this embodiment, as shown in FIG. 3 , the conductive layer 21 of the FFC cable is a tinned copper wire, and the tinned copper wire does not need to punch holes 211 . Before soldering, you can add tin material to the soldering position of the PCB board first, then lap the welding area of the FFC cable to the top of the tin material on the PCB board, and then add tin material to the side of the FFC cable away from the PCB board , so that both sides of the FFC cable welding area are covered with tin. During soldering, the tin material and the tin layer on the tinned copper wire are melted and combined into one, so that the reliable welding of the FFC cable and the multi-layer PCB is realized through the fusion of the tin layer and the tin material. By adopting the welding method of this embodiment, there is no need for dispensing treatment after welding, that is, the strength of the welding position can be guaranteed.

It should be noted that the welding process is used to realize the connection between the FFC cable and the multi-layer PCB board, replacing the existing connector, and can also make full use of the flexibility of the FFC cable to realize 180° reverse rotation between the multi-layer PCB boards. Folding to realize the connection of multi-layer PCB boards, without setting brackets between multi-layer PCB boards, thus effectively reducing the Z-direction height of the sandwich structure, and also saving production costs.

In this embodiment, as shown in FIG. 15 , the material of the insulating layer 22 is PI, and the high temperature resistance of PI material can be used to avoid the problem of heat melting and ensure the welding quality.

In addition, as shown in Figure 9 and Figure 15, the welding area is set at the end of the conductive layer 21, that is, a section of length at the end of the conductive layer 21 is a welding area, and the end with the welding area on the conductive layer 21 is isolated from the insulation. The insulating layer 22 protrudes and can be directly welded to the PCB board without opening the window 24 on the insulating layer 22, which simplifies the process.

Example 4:

The electronic device can be a flexible electronic product, such as a folding screen, a flexible keyboard, a flexible wearable electronic product, etc. Various substrates are integrated in the flexible electronic product, and the flexible cable 2 used to connect each substrate is an FFC cable, and the FFC cable It is connected to the substrate by welding, that is, the signal transmission and conduction between the substrates can be realized by using the FFC cable. Wherein, the substrate may be an FFC board or an FPC board.

Wherein, as shown in Figure 5 and Figure 12, the conductive layer 21 of the FFC cable is a copper wire, and the copper wire can be provided with a hole 211 for adding solder 3 by means of mechanical drilling 211, laser drilling 211, etc., the solder 3 is tin material. Tin material can be filled into the hole 211 , and can also be filled between the conductive layer 21 and the substrate through the hole 211 from the side away from the substrate on the conductive layer 21 , so that both sides of the conductive layer 21 can have tin material. During the soldering process, the molten tin can completely cover and fix the soldering part of the conductive layer 21 to the substrate, thereby improving the soldering strength of the conductive layer 21 and the substrate. At the same time, in this embodiment, it is only necessary to add tin material to the conductive layer 21 , without adding tin material separately to the small microphone board, which simplifies the soldering operation.

In this embodiment, as shown in FIG. 12, the insulating layer 22 includes a PET layer 25 and a PI layer 26. After the insulating layer 22 is arranged on the conductive layer 21, the PET layer 25 and the PI layer 26 are butted in the length direction of the conductive layer 21. , wherein, the PI layer 26 covers the position of the conductive layer 21 close to the welding area, so that the high temperature resistance of the PI material can be utilized to avoid the problem of thermal melting and ensure the welding quality. The use of PET material at a position away from the welding area can effectively reduce the cost of the insulating layer 22 while achieving insulation and protection effects.

In addition, as shown in FIG. 9 , the welding area is set at the end of the conductive layer 21, that is, a length at the end of the conductive layer 21 is a welding area, and the end of the conductive layer 21 with the welding area is removed from the insulating layer 22. protruding, and can be directly soldered to the substrate, without opening the window 24 on the insulating layer 22, which simplifies the process.

Among them, as shown in Figure 16, the conductive layer 21 in this embodiment is welded with untinned copper wire, and the welding position can be treated with glue 5 after the welding is completed, so as to further improve the connection between the FFC cable and the substrate. The connection strength at the position,

It should be noted that flexible electronic products need to be bent in some usage scenarios. For this reason, in this embodiment, the welding process is adopted, which realizes the connection between the FFC cable and the substrate, and can also make full use of the flexibility of the FFC cable. In realizing 180° reflexion, the matching design of flexible electronic products in terms of bending angle has a larger design space, and the welding connection method replaces the application of existing connectors, which significantly reduces production costs.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims

An electronic device, comprising a casing and a display screen, the display screen is installed on the casing, characterized in that the electronic device also includes a carrier board and a flexible cable, the carrier board is loaded with devices, the The carrier board and the flexible flat wire are disposed between the housing and the display screen, and the flexible flat wire is connected to the carrier board by welding.
The electronic device according to claim 1, wherein the welding height of the flexible flat wire and the carrier board is smaller than the height of the device on the carrier board, or the height of the flexible flat wire and the carrier board is The soldering thickness is smaller than the thickness of the devices on the carrier.
The electronic device according to claim 1, wherein the flexible flat cable comprises a conductive layer, and a soldering layer is at least partially provided on the conductive layer, and/or

Holes for filling solder are arranged on the conductive layer.
The electronic device according to claim 2, wherein the flexible flat cable further includes an insulating layer, the conductive layer is provided with a welding area, and the insulating layer covers the conductive layer and is located outside the welding area parts.
The electronic device according to claim 4, wherein an opening is provided on the insulating layer, and the opening is aligned with the soldering area.
The electronic device according to claim 4, wherein the welding area is arranged at an end of the conductive layer, and the end of the conductive layer having the welding area protrudes from the insulating layer .
The electronic device according to claim 6, characterized in that, in a state after welding, an adhesive layer is provided between the welding area and the insulating layer.
The electronic device according to claim 4, wherein the material of the insulating layer is polyethylene terephthalate (PET), polyimide (PI), liquid crystal polymer (LCP) and poly One or a combination of two or more of ether ether ketone (PEEK).
The electronic device according to claim 8, wherein the insulating layer comprises a polyethylene terephthalate (PET) layer and a polyimide (PI) layer, and the polyimide (PI) ) layer covers the position of the conductive layer close to the welding area, and the polyethylene terephthalate (PET) layer covers the position of the conductive layer away from the welding area.
The electronic device according to any one of claims 4-9, wherein the insulating layer comprises a first film layer and a second film layer, and the first film layer and the second film layer are respectively arranged on both sides of the conductive layer.
The electronic device according to any one of claims 1-9, wherein the flexible flat cable is an FFC flat cable or an FPC flat cable.
The electronic device according to any one of claims 1-9, characterized in that the material of the soldering layer is tin, gold or silver.
The electronic device according to any one of claims 1-9, wherein the conductive layer comprises at least one copper sheet.
The electronic device according to any one of claims 1-9, wherein the flexible flat cable is welded to the carrier board through a laser welding process, an ultrasonic welding process, a reflow soldering process or a hot-press soldering soldering process .
The electronic device according to any one of claims 1-9, wherein the carrier board is one of a small camera module board, a small microphone board, a multilayer PCB board, an FPC board or an FFC board.