CN206433257U - A kind of combined type circuit board - Google Patents
A kind of combined type circuit board Download PDFInfo
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- CN206433257U CN206433257U CN201621310835.8U CN201621310835U CN206433257U CN 206433257 U CN206433257 U CN 206433257U CN 201621310835 U CN201621310835 U CN 201621310835U CN 206433257 U CN206433257 U CN 206433257U
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- rigid
- flaggy
- circuit board
- combined type
- layer
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Abstract
The utility model is related to a kind of combined type circuit board, and it includes rigid flaggy I, rigid flaggy II and flexible sheet layer；The surface in the rigid outside of flaggy I is provided with the first circuit layer, and the surface in the rigid outside of flaggy II is provided with second circuit layer, and flexible sheet layer is arranged between rigid flaggy I and rigid flaggy II, and the surface of wherein flexible sheet layer is provided with tertiary circuit layer.The second circuit layer of first circuit layer of the combined type circuit board of the present utility model by the rigid flaggy I positioned at side or the rigid flaggy II positioned at opposite side, it is connected with the tertiary circuit layer of flexible sheet layer, so as to reduce the setting difficulty of combined type circuit board surface component.
Description
Technical field
The utility model is related to circuit board making field, more particularly to a kind of combined type circuit board.
Background technology
The material of traditional printed circuit board (PCB) (PCB, Printed Circuit Board) is stiff board material, by epoxy
Resin, glass-fiber-fabric and copper foil composition, after cured by heat zone, bonding turns into an entirety, possesses well just
Property performance, can be played in welding and installation well support and fixation.But general printed circuit board (PCB) is rigid print
Printed circuit board, can only carry out two-dimentional connection, i.e., connection be completed in the plate face of printed circuit board (PCB), if tie point to be connected does not exist
In same plate face, then need that by wire conducting could be completed, thus it is high to the space requirement of electronic product.
To solve this problem, designer develops a kind of combined type circuit board, and the combined type circuit board is by flexible material
Combined with rigid material, i.e., simultaneously including one or more flexible material regions and rigid material on the printed circuit board (PCB)
Expect region, wherein rigid material region can play support and fixation well, and flexible material region has certain again
Material buckles, are easy to complete three-dimensional connection.Therefore the relatively conventional rigidity printing of the printed circuit board (PCB) of this rigid flexible system is electric
Road plate has the advantages that flexible structure, small volume, lightweight and flexible.
The structure of current combined type circuit board as shown in figure 1, Fig. 1 is the structural representation of existing combined type circuit board,
The combined type circuit board 10 includes flexible sheet layer 11 and rigid plate 12, and the surface of flexible sheet layer 11 is provided with tertiary circuit layer 111
And cover layer 112, the surface of rigid plate 12 is provided with circuit layer 121, and flexible sheet layer 11 is connected with rigid plate 12 by tack coat 13
Connect.
But the combined type circuit board 10 is in use, other components can not be arranged on flexible sheet layer 11 well, because
This other component can only be connected by the through hole 14 in rigid plate 12 with circuit layer 121 or tertiary circuit layer 111, it is impossible to be passed through
Flexible sheet layer 11 is connected with tertiary circuit layer 111, improves the setting difficulty of the surface component of combined type circuit board 10.
Therefore, it is necessary to a kind of combined type circuit board is provided, to solve the problems of prior art.
Utility model content
The purpose of this utility model is to provide a kind of combined type circuit board, and it can pass through the rigid flaggy I positioned at side
The first circuit layer or rigid flaggy II positioned at opposite side second circuit layer, be connected with the tertiary circuit of flexible sheet layer layer,
So as to reduce the setting difficulty of combined type circuit board surface component；To solve the surface element device of existing combined type circuit board
The larger technical problem of the setting difficulty of part.
To solve the above problems, the technical scheme that the utility model is provided is as follows：
The utility model embodiment provides a kind of combined type circuit board, and it includes：
Rigid flaggy I, the surface on the outside of it is provided with the first circuit layer；
Rigid flaggy II；Surface on the outside of it is provided with second circuit layer；And
Flexible sheet layer, is arranged between the rigid flaggy I and the rigid flaggy II, and its surface is provided with the 3rd electricity
Road floor；
The combined type circuit board also includes running through the rigid flaggy I, the flexible sheet layer and the rigid flaggy
II through hole, the rigid flaggy I, the position of the through hole corresponding with flexible sheet layer of rigid flaggy II are respectively arranged with and the first electricity
Conduction copper column is provided with the conducting ring of road floor, second circuit floor and the connection of tertiary circuit floor, the through hole.
In combined type circuit board of the present utility model, the surface of the flexible sheet layer is additionally provided with for protecting described soft
The cover layer of property flaggy.
In combined type circuit board of the present utility model, middle through hole is provided with the middle of the conduction copper column so that conductive copper
Post one tubular conductive structure of formation, so as to play a part of saving material.
In combined type circuit board of the present utility model, the cross section of the through hole is up big and down small frustum structure,
The conduction copper column is correspondingly arranged the tapered tubular structure led to in so that connects, fix more firm.
In combined type circuit board of the present utility model, the surface of the rigid flaggy I and the rigid flaggy II is also divided
Pad is not provided with, and the pad is connected with first circuit layer or second circuit layer.
In combined type circuit board of the present utility model, the flexible sheet layer is connected by tack coat with the rigid flaggy I
Connect.
In combined type circuit board of the present utility model, the tack coat is epoxide-resin glue.
In combined type circuit board of the present utility model, the flexible sheet layer is connected by tack coat with the rigid flaggy II
Connect.
In combined type circuit board of the present utility model, the tack coat is epoxide-resin glue.
In combined type circuit board of the present utility model, the conducting ring is that internal diameter is slightly less than correspondence position through hole external diameter
High ductility conductive ring structure.
In combined type circuit board of the present utility model, the conduction copper column by flange respectively with the first circuit layer,
Two circuit layers are connected.
Compared to the combined type circuit board of prior art, combined type circuit board of the present utility model passes through positioned at the hard of side
First circuit layer of formula flaggy I or positioned at opposite side rigid flaggy II second circuit layer, the tertiary circuit with flexible sheet layer
Layer connection, so as to reduce the setting difficulty of combined type circuit board surface component；Solve existing combined type circuit board
The larger technical problem of the setting difficulty of surface component, passes through conduction copper column, it is possible to achieve rapid processing, connects each circuit
Layer, and ensure the firm of connection, fixed combined type circuit board can also be played a part of.
Brief description of the drawings
Fig. 1 is the structural representation of existing combined type circuit board；
Fig. 2 is the structural representation of the preferred embodiment of combined type circuit board of the present utility model；
Fig. 3 is one of making structural representation of preferred embodiment of combined type circuit board of the present utility model；
Fig. 4 is the two of the making structural representation of the preferred embodiment of combined type circuit board of the present utility model；
Fig. 5 is the three of the making structural representation of the preferred embodiment of combined type circuit board of the present utility model；
Fig. 6 is the four of the making structural representation of the preferred embodiment of combined type circuit board of the present utility model；
Wherein, description of reference numerals is as follows：
20th, combined type circuit board；
21st, rigid flaggy I；
211st, the first circuit layer；
22nd, rigid flaggy II；
221st, second circuit layer；
23rd, flexible sheet layer；
231st, tertiary circuit layer；
232nd, cover layer；
233rd, tack coat；
24th, through hole；
241st, conduction copper column.
Embodiment
The explanation of following embodiment is, with reference to additional schema, the specific of implementation to be can be used to illustrate the utility model
Embodiment.
Fig. 2 is refer to, Fig. 2 is the structural representation of the preferred embodiment of combined type circuit board of the present utility model.This is excellent
Selecting the combined type circuit board 20 of embodiment includes rigid flaggy I 21, rigid flaggy II 22 and flexible sheet layer 23.Rigid flaggy I
The surface in 21 outside is provided with the first circuit layer 211, and the surface in the outside of rigid flaggy II 22 is provided with second circuit layer
221, flexible sheet layer 23 is arranged between rigid flaggy I 21 and rigid flaggy II 23, and the surface of flexible sheet layer 23 is provided with the 3rd
Circuit layer 231, the combined type circuit board 20 is also included through the rigid flaggy I 21, the flexible sheet layer 23 and described
The through hole 24 of rigid flaggy II 22, the position of the rigid flaggy I 21, rigid flaggy II 22 and the correspondence through hole 24 of flexible sheet layer 23
Put, be respectively arranged with the conducting ring being connected with the first circuit layer 211, second circuit layer 221 and tertiary circuit layer 231, it is described logical
Conduction copper column 241 is provided with hole 24, the conducting ring is the high ductility conducting ring that internal diameter is slightly less than correspondence position through hole external diameter
Structure, plays a part of connecting circuit, it is ensured that circuit can be connected reliably.The surface of flexible sheet layer 23 is additionally provided with for protecting
Flexible sheet layer 23 and the cover layer 232 with good electrical insulating properties.
Flexible sheet layer 23 using pressing by the way of, by tack coat 233 respectively with rigid flaggy I 21 and rigid flaggy II 22
Connection, the tack coat 233 is preferably epoxide-resin glue.
The combined type circuit board 20 of this preferred embodiment is also included through rigid flaggy I 21, flexible sheet layer 23 and rigid
Be provided with conduction copper column 241 in the through hole 24 of flaggy II 22, the through hole 24, conduction copper column 241 respectively with the first circuit layer 211,
Second circuit layer 221 and tertiary circuit layer 231 are connected.The surface of rigid flaggy I 21 and rigid flaggy II 23 is also respectively provided with
Pad, the pad is connected with corresponding first circuit layer 211 and second circuit layer 221, and can pass through first circuit layer
211st, conduction copper column 241 is connected with corresponding tertiary circuit layer 231, or passes through second circuit layer 221, conduction copper column 241 and phase
The tertiary circuit layer 231 answered is connected.
It is preferred that, it is provided with middle through hole in the middle of the conduction copper column 241 so that one tubulose of formation of conduction copper column 241 is led
Electric structure, the cross section of the through hole 24 is up big and down small frustum structure, and the conduction copper column 241 is correspondingly arranged to be led to in
Tapered tubular structure so that connection more consolidate, electric conductivity more preferably, and play the role of save metal material.
Illustrate the manufacturing process of the combined type circuit board of this preferred embodiment below by Fig. 3-Fig. 6, Fig. 3 is that this practicality is new
One of making structural representation of the preferred embodiment of the combined type circuit board of type；Fig. 4 is combined circuit of the present utility model
The two of the making structural representation of the preferred embodiment of plate；Fig. 5 is the preferred embodiment of combined type circuit board of the present utility model
Making structural representation three；Fig. 6 is the making structural representation of the preferred embodiment of combined type circuit board of the present utility model
The four of figure.
First, on flexible sheet layer 23 make tertiary circuit layer 231, then on flexible sheet layer 23 suppress cover layer 232 with
Flexible sheet layer 23 is protected, as shown in Figure 3.
2nd, the one side copper of rigid flaggy I 21 is etched away, then in the joint portion of rigid flaggy I 21 and flexible sheet layer 23
Make a control deep trouth；Same operation is done to rigid flaggy II 22, as shown in Figure 4.
3rd, flexible sheet layer 23, rigid flaggy I 21 and rigid flaggy II 22 are pressed together by bonding sheet 233, so
The first circuit layer 211 is made in the outer surface of rigid flaggy I 21 afterwards, the second electricity is made in the outer surface of rigid flaggy II 22
Road floor 221, as shown in Figure 5.
4th, by control deep trouth removal unnecessary rigid flaggy I 21 and rigid flaggy II 22, exposed portion flexible sheet layer 23, such as
Shown in Fig. 6.
5th, it is last to be made and circuit layer in the outer surface of rigid flaggy I 21 and the outer surface of rigid flaggy II 22
The pad (not shown) of connection, and make the through hole through rigid flaggy I 21, flexible sheet layer 23 and rigid flaggy II 22
24, conduction copper column 241 is provided with through hole 24, as shown in Fig. 2 optionally, leading in being provided with the middle of the conduction copper column 241
Hole so that the one tubular conductive structure of formation of conduction copper column 241, conduction copper column 241 is arranged at through hole 24, in through hole 24
Two ends are correspondingly arranged on wedge head, pass through punching press so that the two ends flange of conduction copper column 241 is fixed in through hole 24, it is thus possible to
Rapid processing is realized, each circuit layer is connected, and ensures the firm of connection, the work of fixed combined type circuit board can also be played
With.
So complete the manufacturing process of the combined type circuit board of this preferred embodiment.
Component on the rigid flaggy I of this combined type circuit board can pass through pad, circuit layer, conduction copper column and flexible board
Component on the tertiary circuit layer connection of layer, rigid flaggy II can also pass through weldering, circuit layer, conduction copper column and flexible sheet layer
Tertiary circuit layer connection.So user easily can be set in the rigid flaggy I of combined type circuit board or the surface of rigid flaggy II
Component, reduces the difficulty that component is set in combined circuit plate surface；Solve the table of existing combined type circuit board
The larger technical problem of the setting difficulty of bin device.
In summary, although the utility model is disclosed above with preferred embodiment, but above preferred embodiment is not used
To limit the utility model, one of ordinary skill in the art is not departing from spirit and scope of the present utility model, can made
Various changes are defined with retouching, therefore protection domain of the present utility model by the scope that claim is defined.
Claims (9)
1. a kind of combined type circuit board, it is characterised in that including：
Rigid flaggy I, the surface on the outside of it is provided with the first circuit layer；
Rigid flaggy II；Surface on the outside of it is provided with second circuit layer；And
Flexible sheet layer, is arranged between the rigid flaggy I and the rigid flaggy II, its surface is provided with tertiary circuit
Layer；
The combined type circuit board is also included through the rigid flaggy I, the flexible sheet layer and the rigid flaggy II
Through hole, the rigid flaggy I, the position of the through hole corresponding with flexible sheet layer of rigid flaggy II, be respectively arranged with the first circuit layer,
Conduction copper column is provided with second circuit layer and the conducting ring of tertiary circuit layer connection, the through hole.
2. combined type circuit board according to claim 1, it is characterised in that the surface of the flexible sheet layer is additionally provided with use
In the cover layer for protecting the flexible sheet layer.
3. combined type circuit board according to claim 1, it is characterised in that lead in being provided with the middle of the conduction copper column
Hole so that conduction copper column one tubular conductive structure of formation.
4. combined type circuit board according to claim 3, it is characterised in that the cross section of the through hole is up big and down small
Frustum structure, the conduction copper column is correspondingly arranged the tapered tubular structure led to in.
5. combined type circuit board according to claim 1, it is characterised in that the rigid flaggy I and the rigid flaggy
II surface is also respectively provided with pad, and the pad is connected with first circuit layer or second circuit layer.
6. combined type circuit board according to claim 1, it is characterised in that the flexible sheet layer by tack coat with it is described
Rigid flaggy I or the rigid flaggy II are connected.
7. combined type circuit board according to claim 6, it is characterised in that the tack coat is epoxide-resin glue.
8. combined type circuit board according to claim 1, it is characterised in that conducting ring is slightly less than correspondence position for internal diameter and led to
The high ductility conductive ring structure of hole external diameter.
9. the combined type circuit board according to claim 3 or 4, it is characterised in that the conduction copper column is distinguished by flange
It is connected with the first circuit layer, second circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621310835.8U CN206433257U (en) | 2016-11-30 | 2016-11-30 | A kind of combined type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621310835.8U CN206433257U (en) | 2016-11-30 | 2016-11-30 | A kind of combined type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206433257U true CN206433257U (en) | 2017-08-22 |
Family
ID=59586242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621310835.8U Active CN206433257U (en) | 2016-11-30 | 2016-11-30 | A kind of combined type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206433257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507584A (en) * | 2016-11-30 | 2017-03-15 | 长沙牧泰莱电路技术有限公司 | A kind of combined type circuit board and preparation method thereof |
-
2016
- 2016-11-30 CN CN201621310835.8U patent/CN206433257U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507584A (en) * | 2016-11-30 | 2017-03-15 | 长沙牧泰莱电路技术有限公司 | A kind of combined type circuit board and preparation method thereof |
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