CN102395249A - Manufacturing method of four-layer copper-based metal plate - Google Patents
Manufacturing method of four-layer copper-based metal plate Download PDFInfo
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- CN102395249A CN102395249A CN2011103315442A CN201110331544A CN102395249A CN 102395249 A CN102395249 A CN 102395249A CN 2011103315442 A CN2011103315442 A CN 2011103315442A CN 201110331544 A CN201110331544 A CN 201110331544A CN 102395249 A CN102395249 A CN 102395249A
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Abstract
The invention discloses a production method of a four-layer copper-based metal plate. The method comprises the following steps: pressing a second layer copper foil and a third layer copper foil together to form an inner plate, carrying out boring, copper deposition, electroplating and etching treatments on the inner plate in order, pressing a first layer copper foil, the inner plate and a fourth layer copper foil together, and carrying out filling pressing on a cut copper substrate and the fourth layer copper foil. Thus, an unstressed collapsing problem of a copper-clad plate at a copper substrate hollow position in pressing is solved, uniformity of a prepreg at a pressing position is improved, extending and shrinking stability of the four-layer copper-based metal plate is raised, adhesive attraction between the copper foils and the copper substrate is enhanced, and the four-layer copper-based metal plate has strong market competitiveness.
Description
Technical field
The present invention relates to Metal Substrate pcb board field, relate in particular to a kind of manufacture method of four layers of copper base metal plate.
Background technology
The copper base metal plate is a kind of Metal Substrate copper-clad plate with good heat radiating function, and it is made up of the three-decker of uniqueness, is respectively conductive layer, insulating barrier and base copper.The copper base metal plate is extraordinary pcb board, is widely used in the key component power discharging device of high powers such as photoelectricity, power supply unit, car electrics module, firing frequency equipment with its good thermal diffusivity and low energy consumption.
The copper base metal plate generally all is a multiple layer of copper Base Metal plate, and wherein, the application of four layers of copper base metal plate very extensively.But because such extraordinary pcb board manufacture difficulty is high, so the producer that domestic production is made is very few---with four layers of copper base metal plate of fluted body is example: there are the multiple technologies difficult point in its copper base and copper-clad plate process for pressing:
(1) four layers of copper base metal board using material of fluted body are many; Comprise and cover copper, copper base, prepreg PP and heat-conducting glue etc., and need that the pressing difficult parameters is with control through three process for pressing; The harmomegathus of plate is unstable after the pressing, causes copper-clad plate and base copper adhesive strength not enough after the pressing easily;
(2) because of there is the gong vacancy in the copper base before pressing, the copper-clad plate of the copper base place of emptying does not stress and stays during pressing;
(3) it is bad that pressing causes PP (polypropylene plastics) uniformity easily, and the copper base place of emptying, groove gummosis amount are difficult to control;
(4) carrying out the heavy silver in surface when handling, because of base copper is the larger areas of copper layer, displacement reaction takes place with silver in copper base easily.
Wherein, the copper base place's of emptying copper-clad plate did not stress and stays easily when maximum difficult point was (2) pressing, can cause the yield of product very low, and industry does not all have concrete actual solution temporarily at present.
In view of this, prior art is demanded urgently improving and development.
Summary of the invention
Deficiency in view of above-mentioned prior art; The object of the present invention is to provide a kind of manufacture method of four layers of copper base metal plate, be intended to solve in present four layers of copper base metal plate production process copper-clad plate do not stress stay easily, problems such as displacement reaction take place in copper base easily with silver.
Technical scheme of the present invention is following:
A kind of production method of four layers of copper base metal plate, said four layers of copper base metal plate comprise ground floor Copper Foil, second layer Copper Foil, the 3rd layer of Copper Foil and the 4th layer of Copper Foil from top to bottom, are provided with prepreg between the said Copper Foil; Wherein, said production method may further comprise the steps:
S01, open material after, second layer Copper Foil and the 3rd layer of Copper Foil are pressed together the formation inner plating;
S02, to inner plating hole successively, heavy copper, plating and etching;
S03, ground floor Copper Foil, inner plating and the 4th layer of Copper Foil are carried out pressing;
S04, copper base and the 4th layer of Copper Foil that will open behind the material are filled pressing;
Wherein, said filling pressing is carried out pressing after for groove or the place of emptying of filling copper base with the filling material again, and said filling material is a silica gel.
The production method of described four layers of copper base metal plate wherein, among the said step S01, is provided with copper base between second layer Copper Foil and the 3rd layer of Copper Foil, and the pressing between it is for filling pressing.
The production method of described four layers of copper base metal plate, wherein, during said filling pressing, carry out one penalty coefficient is set drilling handle, be used to make the size dimension between the sheet material after the pressing identical.
The production method of described four layers of copper base metal plate, wherein, when utilizing prepreg to fill pressing, the size of said prepreg is than groove or empty the little 0.5mm of size at place.
The production method of described four layers of copper base metal plate, wherein, said production method comprises that also four layers of copper base metal plate are sunk silver to be handled, and before heavy silver is handled, attaches the acid and alkali-resistance diaphragm on copper base.
The production method of described four layers of copper base metal plate, wherein, behind the attaching acid and alkali-resistance diaphragm, removal needs the acid and alkali-resistance diaphragm of the groove of silver-plated copper base.
Beneficial effect: the production method that the invention provides a kind of four layers of copper base metal plate; The problem that the copper-clad plate of the copper base place of emptying does not stress and stays when having solved pressing; Improved the uniformity of pressing place prepreg in addition; Improve the harmomegathus stability of four layers of copper base metal plate, strengthened the adhesive force between Copper Foil and the copper base, had the very strong market competitiveness.
Description of drawings
Fig. 1 is the hierarchy sketch map of four layers of copper base metal plate of the present invention.
Fig. 2 is the flow chart of the production method of four layers of copper base metal plate of the present invention.
Embodiment
The present invention provides a kind of production method of four layers of copper base metal plate, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also Fig. 1, it is the hierarchy sketch map of four layers of copper base metal plate of the present invention.As shown in the figure, said four layers of copper base metal plate comprise from top to bottom the ground floor Copper Foil L1 that is provided with, second layer Copper Foil L2, the 3rd layer of Copper Foil L3 and the 4th layer of Copper Foil L4 (among the figure, L2 and L3 press together with L2/L3 and represent); Be provided with prepreg PP between the said Copper Foil, said the 4th layer of copper L4 paper tinsel links to each other with copper base N through silica gel (also claiming heat-conducting glue) M.
Particularly, said Copper Foil is the stock that conductive pattern constitutes, and said prepreg is multi-layer sheet indispensable material when making, and is used for adjacent two and covers bonding between the copper layer (promptly being provided with the layer of Copper Foil), has also played the effect of insulating simultaneously.Said copper base is that the copper base metal plate is distinctive, because of it is a prior art, here just no longer too much describes.
In four layers of copper base metal plate that the embodiment of the invention provides, said ground floor Copper Foil and the 4th layer of Copper Foil are the 2OZ Copper Foil, and it is thick that said second layer Copper Foil and the 3rd layer of Copper Foil are 0.3mm, the Copper Foil of 3OZ; The thickness of said copper base is 1.0mm.Said silica gel is resistant to elevated temperatures silica gel.
Please continue to consult Fig. 2, it is the flow chart of the production method of four layers of copper base metal plate of the present invention.As shown in the figure, said method comprising the steps of:
S01, open material after, second layer Copper Foil and the 3rd layer of Copper Foil are pressed together the formation inner plating;
S02, to inner plating hole successively, heavy copper, plating and etching;
S03, ground floor Copper Foil, inner plating and the 4th layer of Copper Foil are carried out pressing;
S04, copper base and the 4th layer of Copper Foil that will open behind the material are filled pressing.
Below, be described in detail to above-mentioned steps respectively:
Said step S01 is the manufacture method of inner plating: after opening material, second layer Copper Foil and the 3rd layer of Copper Foil are pressed together the formation inner plating; Specifically, said opening expects it is the process that cuts into original copper-clad plate (being provided with the laminate of Copper Foil) plank that can on production line, make.With second layer Copper Foil and the 3rd layer of Copper Foil pressing the time (laminate that is about to have corresponding Copper Foil carries out pressing, down with), be the process that is bonded to the circuit of equivalent layer integral body.It can be to carry out through the vacuum hotpressing machine.Be between said second layer Copper Foil and the 3rd layer of Copper Foil, also to be provided with copper base with being to be understood that.Its concrete pressing can adopt the mode of filling pressing to carry out, and can be described in detail filling pressing below.
Said step S02 carries out subsequent treatment to the inner plating after the pressing, and said subsequent treatment can comprise: boring, heavy copper, plating and etching, because of it is identical with prior art, here just do not described one by one.
Said S03 carries out pressing with ground floor Copper Foil, inner plating and the 4th layer of Copper Foil, specifically comprises the pressing between ground floor Copper Foil and the inner plating, the pressing between inner plating and the 4th layer of Copper Foil.Further; Because of pressing causes prepreg PP uniformity bad easily; Copper base place of emptying or groove (corresponding description is carried out in following meeting) gummosis amount is difficult to control; Adopt prepreg PP ratio to empty place, the little 0.5mm design of groove in the production process, the reservation prepreg PP wider space that is heated.
Said step S04 is that copper base and the 4th layer of Copper Foil of splitting behind the material are filled pressing, can also carry out groove on the said copper base as required and handle or empty processing, forms groove or empties the place.Said filling pressing is utilize to fill to carry out pressing again after material is filled groove or the place of emptying of copper base, and the filling material between said copper base and the 4th layer of Copper Foil is a silica gel.Specifically,, do not stay, so the gong vacancy need fill tightly, select for use high temperature resistant silica gel in process of production as packing material for the copper-clad plate that prevents when pressing copper base place of emptying or groove stresses because of there is the gong vacancy in copper base before pressing.Copper base after the pressing is carried out corresponding subsequent processing, comprising: secondary drilling, heavy silver or the like, here superfluous one by one having stated not just.
Further, during said filling pressing, need carry out one penalty coefficient is set drilling handle, be used to make the size dimension between the sheet material after the pressing identical.Specifically, said penalty coefficient can comprise: bore the gong penalty coefficient after bore hole compensated coefficient, FR-4 internal layer penalty coefficient and the copper base pressing.Said penalty coefficient be provided for offsetting the harmomegathus coefficient between the sheet material, improved harmomegathus stability, strengthened the adhesive force of (like copper base and cover between the copper layer) between it.
Further, behind the completing steps S04, comprise in the subsequent treatment of carrying out that it is sunk silver handles, because of the copper basal plane is the larger areas of copper layer, give birth to displacement reaction for preventing copper base and silver hair, copper base need subsides acid and alkali-resistance diaphragm before heavy silver.In addition, because of the copper base groove need be silver-plated, behind the attaching acid and alkali-resistance diaphragm, removal needs the acid and alkali-resistance diaphragm of the groove of silver-plated copper base.
In sum; The production method of four layers of copper base metal plate provided by the invention; At first second layer Copper Foil and the 3rd layer of Copper Foil are pressed together the formation inner plating; Then to inner plating hole successively, heavy copper, plating and etching, again ground floor Copper Foil, inner plating and the 4th layer of Copper Foil are carried out pressing, copper base and the 4th layer of Copper Foil that will open at last behind the material are filled pressing.Thereby the problem that the copper-clad plate of the copper base place of emptying does not stress and stays when having solved pressing; Improved the uniformity of pressing place prepreg in addition; Improve the harmomegathus stability of four layers of copper base metal plate, strengthened the adhesive force between Copper Foil and the copper base, had the very strong market competitiveness.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (6)
1. the production method of four layers of copper base metal plate, said four layers of copper base metal plate comprise ground floor Copper Foil, second layer Copper Foil, the 3rd layer of Copper Foil and the 4th layer of Copper Foil from top to bottom, are provided with prepreg between the said Copper Foil; It is characterized in that said production method may further comprise the steps:
S01, open material after, second layer Copper Foil and the 3rd layer of Copper Foil are pressed together the formation inner plating;
S02, to inner plating hole successively, heavy copper, plating and etching;
S03, ground floor Copper Foil, inner plating and the 4th layer of Copper Foil are carried out pressing;
S04, copper base and the 4th layer of Copper Foil that will open behind the material are filled pressing;
Wherein, said filling pressing is carried out pressing after for groove or the place of emptying of filling copper base with the filling material again, and said filling material is a silica gel.
2. the production method of four layers of copper base metal plate according to claim 1 is characterized in that, among the said step S01, is provided with copper base between second layer Copper Foil and the 3rd layer of Copper Foil, and the pressing between it is for filling pressing.
3. the production method of four layers of copper base metal plate according to claim 1 and 2 is characterized in that, during said filling pressing, carry out one penalty coefficient is set drilling handle, be used to make the size dimension between the sheet material after the pressing identical.
4. the production method of four layers of copper base metal plate according to claim 1 is characterized in that, the size of said prepreg is than groove or empty the little 0.5mm of size at place.
5. the production method of four layers of copper base metal plate according to claim 3 is characterized in that, said production method comprises that also four layers of copper base metal plate are sunk silver to be handled, and before heavy silver is handled, attaches the acid and alkali-resistance diaphragm on copper base.
6. the production method of four layers of copper base metal plate according to claim 5 is characterized in that, behind the attaching acid and alkali-resistance diaphragm, removal needs the acid and alkali-resistance diaphragm of the groove of silver-plated copper base.
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| CN 201110331544 CN102395249B (en) | 2011-10-27 | 2011-10-27 | Manufacturing method of four-layer copper-based metal plate |
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| CN 201110331544 CN102395249B (en) | 2011-10-27 | 2011-10-27 | Manufacturing method of four-layer copper-based metal plate |
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| CN102395249B CN102395249B (en) | 2013-07-10 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103079346A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Processing method for printed circuit board with blind slot |
| CN103945659A (en) * | 2013-01-22 | 2014-07-23 | 深圳市万泰电路有限公司 | Method of manufacturing six-layer copper-based circuit board |
| CN107635357A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of pcb board golden finger guard method of easy to clean |
| WO2018058761A1 (en) * | 2016-09-27 | 2018-04-05 | 惠州市金百泽电路科技有限公司 | Manufacturing method for 77 ghz high-precision radio frequency radar printed circuit board |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
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| CN104582256B (en) * | 2014-12-31 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Centreless board member |
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| CN107635357A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of pcb board golden finger guard method of easy to clean |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
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| CN102395249B (en) | 2013-07-10 |
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