CN102244980A - Manufacturing method of metal substrate - Google Patents
Manufacturing method of metal substrate Download PDFInfo
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- CN102244980A CN102244980A CN2010101743465A CN201010174346A CN102244980A CN 102244980 A CN102244980 A CN 102244980A CN 2010101743465 A CN2010101743465 A CN 2010101743465A CN 201010174346 A CN201010174346 A CN 201010174346A CN 102244980 A CN102244980 A CN 102244980A
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Abstract
The invention provides a manufacturing method of a metal substrate, comprising the following steps: providing a metal plate with a first through hole; forming a stacked structure on at least one surface of the metal plate, wherein the stacked structure sequentially comprises a resin film layer, a prepreg layer and a metal foil layer at the side close to the metal plate; and laminating the metal plate and the stacked structure. In the invention, favorable mechanical strength can be achieved by simultaneously using a prepreg and a resin film as insulation materials, thus not only solving the problem caused by the fact that through holes can not be filled up to leave cavities in the traditional hole filling process, but also further improving the processing characteristics of the metal plate. In addition, the invention also provides a metal substrate manufactured by the method.
Description
Technical field
The present invention refers to a kind of metal substrate manufacture method that reduces the interior residual cavity of through hole in the substrate filling perforation processing procedure especially about a kind of manufacture method of metal substrate.
Background technology
In recent years, the illumination of light-emitting diode and backlight technology are full-fledged gradually, and its Related product also begins to popularize.The known luminescence diode can be supervened a large amount of heat energy when producing light at present, and this moment, heat energy was if can't will reduce the luminous efficiency of light-emitting diode effectively by the light-emitting diode discharge.To this, traditional printed circuit board (PCB) is because pyroconductivity is not high, and the substrate that does not apply the high light-emitting diode of radiating requirements gradually is required, and therefore using higher metal substrate of radiating efficiency or metal core (core) substrate is preferable selection.
Generally speaking, the structure of metal substrate mainly contains a metallic plate, and its surface is coated with insulating material and Copper Foil in regular turn, and it can be made as the single or double plate.At present when making the double-sided metal substrate, need hole, step such as filling perforation, secondary drilling and plating, its main elder generation forms first through hole that runs through metal substrate by machinery or laser mode, and with insulating resin or the filling perforation of insulating heat-conductive resin, behind the resin baking-curing, bore the second less through hole of an aperture again, in second through hole, insert conductive materials at last or utilize plating to form conductive layer, be connected to reach two-sided conducting wire.
As previously mentioned, in the filling perforation processing procedure of known technology, use filling perforation glue to insert through hole mostly earlier, yet, because the aperture of through hole is big and capillarity a little less than, often cause filling perforation glue part colloid when baking-curing to flow out through hole, make through hole effectively to fill up, cause forming cavity (void) or depression in the successive process, the reliability and the quality of circuit board are brought very big influence.
For reducing the formation in cavity, also there are the semi-solid preparation film (prepreg) of employing or resin molding (film) to cooperate Copper Foil in the prior art, or utilize gum Copper Foil (resin coated copper (RCC) foil) to finish filling perforation person by pressing.Yet it is not satisfied that the result of these filling perforation processing procedures still makes us.
In the filling perforation processing procedure of present use semi-solid preparation film, with semi-solid preparation film stacked on top of one another in the both sides of metallic plate, afterwards again in the folded Copper Foil of semi-solid preparation film outside layer, and, make the resin of semi-solid preparation film insert in the through hole of metallic plate with superimposed each layer structure pressing under vacuum, high temperature, condition of high voltage.Yet, because general semi-solid preparation film uses the glass fabric that contains resin pickup, its glass fabric density height, resin content is 40～80% only, is not enough to fill up the through hole in the metallic plate.In addition, resin is hindered by glass fabric can when mobile and cause flowability relatively poor, makes that the resin in the through-hole structure can't fill up and residual cavity.
In the filling perforation processing procedure of present use gum Copper Foil, the gum Copper Foil stacked on top of one another that is coated with resin glue is directly replaced semi-solid preparation film and Copper Foil in the both sides of metallic plate, and with the metallic plate pressing so that the resin of gum Copper Foil insert in the through hole of metallic plate.But coming to the same thing of this technology and semi-curing glue chip technology still can cause the cavity in through-hole structure.
In the filling perforation processing procedure of present use resin molding, use resin molding to replace the semi-solid preparation film, stacked on top of one another is in two rear flank of metallic plate, with Copper Foil and metallic plate pressing.Yet, because resin molding does not have fiber material, the supportive deficiency after the pressing, so can there be the cavity in the resin bed in the through-hole structure, and the Copper Foil of through hole upper and lower and resin bed also can produce depressed phenomenon, and it is not good to form surface flatness, and influence the yield of follow-up circuit processing procedure.
Summary of the invention
Because aforementioned problems of the prior art, how a kind of manufacture method of metal substrate is provided, it can reach excellent mechanical intensity and reduce the problem that resin bed produces the cavity or caves in the through-hole structure, and further improve the electric and processing characteristics of made metal substrate, will be that the present invention desires actively to describe part.
One of main purpose of the present invention is to provide a kind of manufacture method of metal substrate, it is by using semi-solid preparation film (prepreg) and resin molding (film) as insulating material simultaneously, can reach the increase mechanical strength, and reduce the purpose in resin generation cavity in the through-hole structure.
For reaching above-mentioned purpose, the invention provides a kind of manufacture method of metal substrate, it comprises: (1) provides a metallic plate with first through hole; (2) one side at least in this metallic plate goes up formation one stepped construction, and this stepped construction comprises a resin film layer, a semi-solid preparation film layers and a metal foil layer in regular turn in the side near this metallic plate; And this metallic plate of (3) pressing and this stepped construction.
In addition, the present invention also provides a kind of metal substrate, it comprises the stepped construction that a metallic plate and is formed at this metal sheet surface, and this metallic plate comprises one first through hole, and this stepped construction comprises a resin film layer, a semi-solid preparation film layers and a metal foil layer in regular turn in the side near this metallic plate.
In above-mentioned method or metal substrate, the semi-solid preparation film can be insulating paper, glass fibre, carbon fiber or other fiber material and contains the film that is dipped in resin groups one-tenth (varnish) back baking heating gained.
In above-mentioned method or metal substrate, resin molding refers to that resin glue coats on the release film (as PET), removes release film gained person again after directly adding the thermosetting semi-cured state, and the main difference of itself and semi-solid preparation film is that resin molding does not have fiber material.In addition, the resin composition material of semi-solid preparation film and resin molding can be selected from wherein one or its combination of epoxy resin, phenolic resins, polyimide resin, polyphenylene oxide resin, mylar, cyanate ester resin, polyflon, ABF (Ajinomoto Build-up Film) and BT resin (bismaleimide triazine).
In addition, in order to increase the pyroconductivity of semi-solid preparation film and resin molding, this resin is formed can further comprise inorganic filler, this inorganic filler can be silicon dioxide (molten state or non-molten state), aluminium oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talcum, clay, aluminium nitride, boron nitride, aluminium hydroxide, aluminum silicon carbide, carborundum, sodium carbonate, titanium dioxide, zinc oxide, zirconia, quartzy, diamond dust, the class diamond dust, at least one or its combination of graphite or calcined kaolin, the pyroconductivity of this inorganic filler is higher than resin material, can effectively promote the pyroconductivity that described resin is formed.In addition, this resin is formed and also can further be comprised additives such as interface activating agent, flexibilizer, hardening accelerator or solvent.
In above-mentioned method or metal substrate, metallic plate can comprise copper, aluminium, stainless steel, magnesium, nickel, titanium or its alloy, and metal foil layer can comprise Copper Foil.
In above-mentioned method or metal substrate, the aperture of first through hole can be 0.4 to 1.6mm, and the thickness of metal substrate can be 0.3 to 3mm.
In above-mentioned method, preferable alternative is carried out following steps: formation one runs through second through hole of this stepped construction and this metallic plate, and the aperture of this second through hole is less than this first through hole; In this second through hole, form a metal conducting layer; Maybe this metal foil layer is made a circuit.
Wherein, second through hole can utilize machine drilling or Laser drill to form; Metal conducting layer can utilize galvanoplastic to form; And circuit can utilize micro image etching procedure to form.
Thus, metal substrate manufacture method of the present invention is by using semi-solid preparation film and resin molding as insulating material simultaneously, and then reach good mechanical strength, and reduce the resin generation cavity in the through-hole structure, and can further improve the processing yield of metal substrate in the printed circuit processing procedure.
Description of drawings
Figure 1A, 1B, 1C, 1D, 1E, 1F are the generalized section of preferred embodiment of the present invention.
Fig. 2 A is the profile of known technology resulting structures.
Fig. 2 B is the profile of preferred embodiment resulting structures of the present invention.
[primary clustering symbol description]
1 metallic plate
2 resin moldings
3 semi-solid preparation films
4 Copper Foils
5 first through holes
Resin bed in 51 through-hole structures
6 second through holes
7 metal conducting layers
8 cavities
9 depressions
10 glass fabrics
Embodiment
Be fully to understand purpose of the present invention, feature and effect, existing by following specific embodiment and cooperate appended graphic to the present invention be described in detail as after.
In the present invention, metal substrate refers to that the surface is coated with the structure of metallic plate gained after pressing of insulating material and metal foil layer in regular turn, therefore, metal core laminate (metal-core laminate) all belongs to one of aspect of metal substrate of the present invention with metal core circuit board (metal-core PCB), and not as limit.The material of metallic plate can be metal or its alloys such as aluminium, copper, stainless steel, magnesium, nickel, titanium.In addition, in the present invention, through hole refers to a kind of hole that runs through, and it can further become blind hole, buried via hole etc. according to different processing procedures.
See also Fig. 1, the generalized section of its metal substrate manufacture method one preferred embodiment of the present invention, wherein Figure 1A to Fig. 1 F shows the manufacturing step in each stage respectively.
At first, shown in Figure 1A, provide a metallic plate 1 with first through hole 5.The aperture of this first through hole 5 can be 0.4 to 1.6mm; The material of metallic plate 1 can be metal or its alloys such as aluminium, copper, stainless steel, magnesium, nickel, titanium, or any metallic core (metal core) person who can be applicable to metal core circuit board (metal-core PCB).In addition, both sides provide resin molding 2, semi-solid preparation film 3 and Copper Foil 4 in regular turn in this metallic plate about in the of 1.
The resin composition material of resin molding 2 can be selected from wherein one or its combination of epoxy resin, phenolic resins, polyimide resin, polyphenylene oxide resin, mylar, cyanate ester resin, polyflon, ABF (AjinomotoBuild-up Film) and BT resin (Bismaleimide Triazine).
Figure 1B shows the situation of each layer structure before pressing, and it comprises a metallic plate 1 and a stepped construction, and this stepped construction comprises resin film layer 2, semi-curing glue lamella 3 and copper foil layer 4.Under vacuum, high temperature, high pressure, the above-mentioned metallic plate 1 of pressing and this stepped construction can form the metal substrate shown in Fig. 1 C.
In addition, the present invention can repeat to provide the step of metallic plate and stepped construction to form multilayer circuit board.Metallic plate 1 and stepped construction are when pressing, and the resin glue in resin molding 2 and/or the semi-solid preparation film 3 can be filled in first through hole 5.The temperature range of wherein pressing condition can be 70 ℃～300 ℃, and programming rate can be greater than 2 ℃/min, and pressure can be greater than 20kg/cm
2
Fig. 1 C shows the situation of each layer structure after pressing under vacuum, high temperature, the high pressure, and wherein, the purpose of high temperature is to heat semi-solid preparation film 3 and/or resin molding 2, makes its resin liquefaction and has flowability, to be filled in first through hole.After pressing, the resin glue in resin molding 2 and/or the semi-solid preparation film 3 be filled in first through hole partly or entirely, form the resin bed 51 in the through-hole structure.
Fig. 1 D shows the making step that carries out second through hole 6, and the aperture of this second through hole 6 is less than this first through hole, and making step carries out with machine drilling or Laser drill mode.
Fig. 1 E is shown in and electroplates a metal conducting layer 7 on the hole wall of this second through hole, to finish the conducting of levels circuit.
Fig. 1 F is shown on this copper foil layer 4, makes the conducting wire with micro image etching procedure, promptly utilizes etching to remove the part circuit, and the copper wire that stays forms the circuit of design.
At last, see also Fig. 2, wherein Fig. 2 A is the profile of known technology resulting structures, known technology only uses the insulating material of resin molding as laminated plates, because resin molding does not have fiber material, the supportive deficiency after the pressing, can there be cavity, many places 8 in resin bed in the through-hole structure, the Copper Foil of through hole upper and lower and resin bed also produce depression 9 phenomenons, and it is not good to form surface flatness, with the yield of the follow-up circuit processing procedure of influence.On the other hand, 2B figure is the profile of preferred embodiment resulting structures of the present invention, and wherein dash area is a glass fabric 10.Can find by 2B figure, the present invention is by the insulating material that uses semi-solid preparation film and resin molding as laminated plates simultaneously, known technology be can significantly reduce and cavity and depressed phenomenon in the through-hole structure resulted from, and have good mechanical strength, and reach the purpose of the processing yields such as printed circuit of further raising metal substrate.
As mentioned above, the present invention meets patent three important documents fully: novelty, creativeness and practicality.With novelty and creative, the present invention is by using semi-solid preparation film and the resin molding insulating material as metal substrate simultaneously, and then reaches good mechanical strength, and the resin bed that reduces in the through-hole structure produces the cavity; And reach the purpose of processing such as the printed circuit yield of further raising metal substrate; With regard to industry applications, the product that utilizes the present invention to derive is when the demand that can fully satisfy existing market.
The present invention discloses with preferred embodiment hereinbefore, it will be understood by those skilled in the art that so this embodiment only is used to describe the present invention, does not limit the scope of the invention and should not be read as.It should be noted, with the variation and the displacement of this embodiment equivalence, all should be considered as being covered by in the category of the present invention such as.Therefore, protection scope of the present invention when with claim the person of being defined be as the criterion.
Claims (11)
1. the manufacture method of a metal substrate comprises:
One metallic plate with first through hole is provided;
One side at least in this metallic plate goes up formation one stepped construction, and this stepped construction comprises a resin film layer, a semi-solid preparation film layers and a metal foil layer in regular turn in the side near this metallic plate; And
This metallic plate of pressing and this stepped construction.
2. the method for claim 1 is characterized in that, this metallic plate comprises copper, aluminium, stainless steel, magnesium, nickel, titanium or its alloy, and this metal foil layer comprises Copper Foil.
3. method as claimed in claim 1 or 2 is characterized in that, more comprises:
Formation one runs through second through hole of this stepped construction and this metallic plate, and the aperture of this second through hole is less than this first through hole.
4. method as claimed in claim 3 is characterized in that, more comprises:
In this second through hole, form a metal conducting layer.
5. method as claimed in claim 4 is characterized in that, more comprises:
This metal foil layer is made a circuit.
6. metal substrate, comprise the stepped construction that a metallic plate and is formed at this metal sheet surface, this metallic plate comprises one first through hole, and this stepped construction comprises a resin film layer, a semi-solid preparation film layers and a metal foil layer in regular turn in the side near this metallic plate.
7. metal substrate as claimed in claim 6 is characterized in that, this metallic plate comprises copper, aluminium, stainless steel, magnesium, nickel, titanium or its alloy, and this metal foil layer comprises Copper Foil.
8. metal substrate as claimed in claim 6 is characterized in that at least a portion of this first through hole is filled by the resin of this resin film layer.
9. metal substrate as claimed in claim 8 is characterized in that, more comprises one second through hole, and it runs through the resin in this stepped construction and this first through hole.
10. metal substrate as claimed in claim 9 is characterized in that the hole wall surface of this second through hole is covered by electric conducting material.
11., it is characterized in that this metal foil layer has circuit as each described metal substrate among the claim 6-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101743465A CN102244980A (en) | 2010-05-13 | 2010-05-13 | Manufacturing method of metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101743465A CN102244980A (en) | 2010-05-13 | 2010-05-13 | Manufacturing method of metal substrate |
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| CN102244980A true CN102244980A (en) | 2011-11-16 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638948A (en) * | 2012-04-25 | 2012-08-15 | 梅州市志浩电子科技有限公司 | Manufacturing method of printed circuit board |
| CN103179808A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
| CN104037467A (en) * | 2013-03-06 | 2014-09-10 | 罗伯特·博世有限公司 | Storage battery CELL HOUSING with integrated electronic device |
| CN105744718A (en) * | 2014-12-11 | 2016-07-06 | 深南电路有限公司 | Heat dissipation PCB and processing method thereof |
| CN105826208A (en) * | 2016-04-06 | 2016-08-03 | 西安明科微电子材料有限公司 | Manufacturing method of packaging substrate hole site |
| CN105979704A (en) * | 2016-06-06 | 2016-09-28 | 苏州安洁科技股份有限公司 | High heat radiation printed circuit board welding technology based on double-layer aluminum |
| CN107249252A (en) * | 2017-07-27 | 2017-10-13 | 维沃移动通信有限公司 | The preparation method and printed circuit board of a kind of printed circuit board |
| CN107613635A (en) * | 2016-07-12 | 2018-01-19 | 欣兴电子股份有限公司 | Wiring board and preparation method thereof |
| CN108987658A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | Complex copper aluminium double-side cell protection board manufacture craft |
| CN111754886A (en) * | 2019-03-28 | 2020-10-09 | 合肥精显电子科技有限公司 | Face mask structure of LCD display screen and manufacturing process thereof |
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| CN101466199A (en) * | 2007-12-21 | 2009-06-24 | 欣兴电子股份有限公司 | Method for forming blind hole of circuit board using laser |
| CN201267058Y (en) * | 2008-08-22 | 2009-07-01 | 欣兴电子股份有限公司 | Composite circuit board |
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| JPS60127781A (en) * | 1983-12-14 | 1985-07-08 | 松下電工株式会社 | Metal base metal coated board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179808A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
| CN102638948A (en) * | 2012-04-25 | 2012-08-15 | 梅州市志浩电子科技有限公司 | Manufacturing method of printed circuit board |
| CN104037467A (en) * | 2013-03-06 | 2014-09-10 | 罗伯特·博世有限公司 | Storage battery CELL HOUSING with integrated electronic device |
| CN105744718A (en) * | 2014-12-11 | 2016-07-06 | 深南电路有限公司 | Heat dissipation PCB and processing method thereof |
| CN105826208A (en) * | 2016-04-06 | 2016-08-03 | 西安明科微电子材料有限公司 | Manufacturing method of packaging substrate hole site |
| CN105979704A (en) * | 2016-06-06 | 2016-09-28 | 苏州安洁科技股份有限公司 | High heat radiation printed circuit board welding technology based on double-layer aluminum |
| CN105979704B (en) * | 2016-06-06 | 2018-10-26 | 苏州安洁科技股份有限公司 | A kind of welding procedure based on the high heat elimination printed circuit board of the double-deck aluminium |
| CN107613635B (en) * | 2016-07-12 | 2019-11-05 | 欣兴电子股份有限公司 | Wiring board and preparation method thereof |
| CN107613635A (en) * | 2016-07-12 | 2018-01-19 | 欣兴电子股份有限公司 | Wiring board and preparation method thereof |
| CN107249252A (en) * | 2017-07-27 | 2017-10-13 | 维沃移动通信有限公司 | The preparation method and printed circuit board of a kind of printed circuit board |
| CN107249252B (en) * | 2017-07-27 | 2019-12-17 | 维沃移动通信有限公司 | manufacturing method of printed circuit board and printed circuit board |
| CN108987658A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | Complex copper aluminium double-side cell protection board manufacture craft |
| CN111754886A (en) * | 2019-03-28 | 2020-10-09 | 合肥精显电子科技有限公司 | Face mask structure of LCD display screen and manufacturing process thereof |
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Application publication date: 20111116 |