CN221010459U - Multilayer circuit board compression fittings - Google Patents

Abstract

The utility model discloses a multilayer circuit board pressing device which comprises a device frame, a placing plate and a clamping assembly, wherein the placing plate is arranged on the device frame, and the clamping assembly is arranged on the placing plate; clamping assembly includes grip block, bull stick, draw-in groove and connecting block, place the symmetry on the board and be provided with the draw-in groove, and place the symmetry on the board and be provided with the grip block, the size and the grip block looks adaptation of draw-in groove, place the symmetry on the board and be provided with the bull stick, two sets of all install the connecting block on the bull stick, connecting block and grip block fixed connection. According to the circuit board laminating machine, the circuit board to be laminated is placed on the placing plate through the clamping assembly, the clamping blocks are vertical to two sides of the circuit board, the clamping blocks are attached to the circuit board, the stacked circuit boards are stacked in order, the rotating rod is rotated, the clamping blocks are retracted into the clamping grooves on the placing plate, and the circuit board is laminated.

Description

Multilayer circuit board compression fittings

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a multilayer circuit board pressing device.

Background

The circuit board is miniaturized and visualized, plays an important role in mass production of fixed circuits and optimizing layout of electrical appliances, and is divided into three major categories of single-sided boards, double-sided boards and multi-layer circuit boards according to the number of layers, and the multi-substrate is manufactured by stacking two or more layers of circuits on each other, and reliable preset interconnection is formed between the circuits.

When the multilayer circuit board is processed, the circuit substrates are stacked and placed, and pressed by the hydraulic press, so that the substrates are easy to skew when stacked and placed, and the pressing effect is affected, and therefore, the multilayer circuit board pressing device is provided.

Disclosure of utility model

The utility model aims to solve the defects in the prior art and provides a multilayer circuit board pressing device.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the multilayer circuit board pressing device comprises a device frame, a placing plate and a clamping assembly, wherein the placing plate is arranged on the device frame, and the clamping assembly is arranged on the placing plate;

Clamping assembly includes grip block, bull stick, draw-in groove and connecting block, place the symmetry on the board and be provided with the draw-in groove, and place the symmetry on the board and be provided with the grip block, the size and the grip block looks adaptation of draw-in groove, place the symmetry on the board and be provided with the bull stick, two sets of all install the connecting block on the bull stick, connecting block and grip block fixed connection.

Further, the hydraulic cylinder is installed on the top of device frame, the stripper plate is installed to hydraulic cylinder's flexible end, install four sets of telescopic links on the stripper plate, the stripper plate is located the inside of device frame.

Further, the inside symmetry of placing the board is provided with the mounting groove, two sets of rotate on the bull stick and be connected with the sleeve, the sleeve is located the inside of mounting groove, and installs the gag lever post on the sleeve.

Further, the spring is sleeved on the limiting rod, one ends of the two groups of limiting rods penetrate through the mounting groove to extend to the outside of the placing plate, and the baffle is mounted at one end of the limiting rod.

Further, the inside symmetry of placing the board is provided with the spout, the one end of bull stick runs through draw-in groove and mounting groove, and the connection piece is installed to the one end of bull stick.

Further, be provided with the first slide hole with bull stick looks adaptation on the spout, all be provided with the second slide hole with bull stick looks adaptation on draw-in groove and the mounting groove, the connection piece is located the spout, the size and the connection piece looks adaptation of spout.

The beneficial effects of the utility model are as follows:

Through the clamping component that sets up, place the circuit substrate that will pressfitting on placing the board, the grip block is perpendicular form in circuit substrate's both sides, grip block and circuit substrate laminating, realize neatly piling up the circuit substrate that will pile up, rotate the bull stick again, make the grip block withdraw to place in the draw-in groove on the board, pressfitting circuit substrate.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a lamination device for a multilayer circuit board according to the present utility model;

Fig. 2 is a top view of an inner structure of a placement board of a multi-layer circuit board pressing device according to the present utility model;

Fig. 3 is a schematic diagram of a face black structure of a clamping block and a connecting block of a multi-layer circuit board laminating device according to the present utility model.

In the figure: 1. a device frame; 2. a hydraulic cylinder; 3. an extrusion plate; 4. a telescopic rod; 5. placing a plate; 6. a clamping block; 7. a rotating rod; 8. a clamping groove; 9. a mounting groove; 10. a chute; 11. a sleeve; 12. a limit rod; 13. a baffle; 14. a spring; 15. a connecting block; 16. and a connecting sheet.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1, a multi-layer circuit board pressing device comprises a device frame 1, a placing plate 5 and a clamping assembly, wherein the placing plate 5 is installed on the device frame 1, a slideway matched with a rotating rod 7 is arranged in the placing plate 5, and the clamping assembly is arranged on the placing plate 5.

Referring to fig. 2 and 3, the clamping assembly includes clamping blocks 6, rotating rods 7, clamping grooves 8 and connecting blocks 15, the clamping grooves 8 are symmetrically arranged on the placing plate 5, the clamping blocks 6 are symmetrically arranged on the placing plate 5, the clamping grooves 8 are matched with the clamping blocks 6 in size, the rotating rods 7 are symmetrically arranged on the placing plate 5, the connecting blocks 15 are respectively arranged on the two groups of rotating rods 7, and the connecting blocks 15 are fixedly connected with the clamping blocks 6;

The hydraulic cylinder 2 is arranged at the top end of the device frame 1, the extrusion plate 3 is arranged at the telescopic end of the hydraulic cylinder 2, four groups of telescopic rods 4 are arranged on the extrusion plate 3, the extrusion plate 3 is positioned in the device frame 1, mounting grooves 9 are symmetrically arranged in the placing plate 5, two groups of rotating rods 7 are rotationally connected with a sleeve 11, the sleeve 11 is positioned in the mounting grooves 9, a limiting rod 12 is arranged on the sleeve 11, a spring 14 is sleeved on the limiting rod 12, the rotating rods 7 are pulled to two sides, the rotating rods 7 slide on the placing plate 5, the sleeve 11 drives the limiting rod 12 to slide in the mounting grooves 9, the limiting rod 12 slides out of the placing plate 5, the sleeve 11 extrudes the spring 14, and a large-size circuit substrate can be clamped on the placing plate 5 by the clamping block 6 through the elasticity of the spring 14;

Two sets of the one end of gag lever post 12 runs through mounting groove 9 and extends to place the board 5 outside, and baffle 13 is installed to the one end of gag lever post 12, the inside symmetry of placing the board 5 is provided with spout 10, draw-in groove 8 and mounting groove 9 are run through to the one end of bull stick 7, and connection piece 16 is installed to the one end of bull stick 7, all be provided with the first slide opening with bull stick 7 looks adaptation on spout 10, all be provided with the second slide opening with bull stick 7 looks adaptation on draw-in groove 8 and the mounting groove 9, connection piece 16 is located spout 10, the size and the connection piece 16 looks adaptation of spout 10, rotate bull stick 7 and drive grip block 6 and rotate, withdraw grip block 6 to in the draw-in groove 8.

Working principle: during the use, place the circuit substrate that stacks on placing the board 5, grip block 6 is in circuit substrate's both sides, pull bull stick 7 to both sides, bull stick 7 slides in placing the board 5, sleeve 11 extrusion spring 14, gag lever post 12 case place the board 5 slide to placing the outside of board 5, grip block 6 is vertical form with placing the board 5, through the elasticity of spring 14, grip block 6 keeps the circuit substrate that stacks neatly when grip block 6 is with circuit substrate centre gripping, rotate bull stick 7, bull stick 7 drives grip block 6 and rotates together, withdraw grip block 6 in draw-in groove 8, hydraulic cylinder 2 moves, press together circuit substrate through stripper plate 3.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

In the description of this patent, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the patent and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and are therefore not to be construed as limiting the patent.

Claims (6)

1. The multilayer circuit board laminating device is characterized by comprising a device frame (1), a placing plate (5) and a clamping assembly, wherein the placing plate (5) is arranged on the device frame (1), and the clamping assembly is arranged on the placing plate (5);

Clamping assembly includes grip block (6), bull stick (7), draw-in groove (8) and connecting block (15), place symmetry on board (5) and be provided with draw-in groove (8), and place symmetry on board (5) and be provided with grip block (6), the size and the grip block (6) looks adaptation of draw-in groove (8), place symmetry on board (5) and be provided with bull stick (7), two sets of connecting block (15) are all installed on bull stick (7), connecting block (15) and grip block (6) fixed connection.

2. The multilayer circuit board laminating device according to claim 1, wherein a hydraulic cylinder (2) is mounted at the top end of the device frame (1), a squeeze plate (3) is mounted at the telescopic end of the hydraulic cylinder (2), four groups of telescopic rods (4) are mounted on the squeeze plate (3), and the squeeze plate (3) is located inside the device frame (1).

3. The multilayer circuit board pressing device according to claim 1, wherein the inner parts of the placing plates (5) are symmetrically provided with mounting grooves (9), two groups of rotating rods (7) are rotationally connected with sleeves (11), the sleeves (11) are positioned in the mounting grooves (9), and limiting rods (12) are mounted on the sleeves (11).

4. A multilayer circuit board pressing device according to claim 3, wherein the limit rods (12) are sleeved with springs (14), one ends of the two groups of limit rods (12) penetrate through the mounting grooves (9) to extend to the outside of the placing plate (5), and one ends of the limit rods (12) are provided with baffle plates (13).

5. The multilayer circuit board pressing device according to claim 1, wherein sliding grooves (10) are symmetrically formed in the placing plate (5), one end of the rotating rod (7) penetrates through the clamping groove (8) and the mounting groove (9), and a connecting sheet (16) is mounted at one end of the rotating rod (7).

6. The multilayer circuit board pressing device according to claim 5, wherein the sliding groove (10) is provided with a first sliding hole matched with the rotating rod (7), the clamping groove (8) and the mounting groove (9) are both provided with a second sliding hole matched with the rotating rod (7), the connecting sheet (16) is positioned in the sliding groove (10), and the sliding groove (10) is matched with the connecting sheet (16) in size.