CN112584630A - Discontinuously layered flexible laminated lamp strip circuit board and manufacturing method - Google Patents
Discontinuously layered flexible laminated lamp strip circuit board and manufacturing method Download PDFInfo
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- CN112584630A CN112584630A CN201910960778.XA CN201910960778A CN112584630A CN 112584630 A CN112584630 A CN 112584630A CN 201910960778 A CN201910960778 A CN 201910960778A CN 112584630 A CN112584630 A CN 112584630A
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- circuit board
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- lamp strip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to a discontinuous layered flexible laminated lamp strip circuit board and a manufacturing method thereof, in particular to a single-layer flexible circuit board or a double-layer flexible circuit board with a via hole, wherein adhesive is printed at a plurality of positions on the back surface of the single-layer flexible circuit board or the double-layer flexible circuit board, then a metal single-layer circuit board is manufactured, the circuit board with the printed adhesive on the back surface and the metal single-layer circuit board are adhered together to form a discontinuous adhesion and discontinuous layered structure, and the double-layer or three-layer circuit board is manufactured.
Description
Technical Field
The invention relates to the field of LED lamp strips, in particular to a discontinuously layered flexible laminated lamp strip circuit board and a manufacturing method thereof.
Background
The LED circuit board lamp strip is always bent for use at a plurality of positions according to requirements when in use, the circuit board is very easy to bend and break when the lamp strip is bent for use, or the circuit board is broken, or the long lamp belt is broken due to the self weight and the stretching when being installed, or the back of the lamp belt circuit board is provided with a thick copper wire or a thick copper flat cable, when the circuit board is bent, the thick copper pushes the circuit board to be broken, or the circuit board is broken when the waterproof resin of the lamp strip bag is bent, and the long lamp strips are manufactured by using a tin soldering connection mode, however, when the extra-long lamp strip is required to be manufactured, because of large load and large current-carrying capacity, thick copper is required to be used as a circuit conductor, however, the thicker the copper which needs to be welded and connected, the firmer the copper is by soldering, the bending resistance is not good, how to solve the problem of easy breakage of bending and stretching and improve the bending resistance is a difficult problem in the industry.
In order to overcome the defects and solve the technical problems, the circuit board is manufactured into a discontinuous layered flexible laminated lamp strip circuit board, a single-layer or double-layer flexible circuit board with elements welded on the front surface is printed with an adhesive on the local back surface, and then is adhered with a metal single-layer circuit board on the back surface to form a discontinuous adhesion and discontinuous layered structure, so that the bending resistance of the lamp strip is greatly improved, and the problem of plate breakage caused by a plurality of factors during installation and use of the lamp strip is solved.
Disclosure of Invention
The invention relates to a discontinuous layered flexible laminated lamp strip circuit board and a manufacturing method thereof, in particular to a single-layer flexible circuit board or a double-layer flexible circuit board with a via hole, wherein adhesive is printed at a plurality of positions on the back surface of the single-layer flexible circuit board or the double-layer flexible circuit board, then a metal single-layer circuit board is manufactured, the circuit board with the printed adhesive on the back surface and the metal single-layer circuit board are adhered together to form a discontinuous adhesion and discontinuous layered structure, and the double-layer or three-layer circuit board is manufactured.
The invention provides a method for manufacturing a discontinuous layered flexible laminated lamp belt circuit board, which comprises the steps of firstly manufacturing a connected single-layer flexible circuit board containing a plurality of lamp belt circuit boards or a connected double-layer flexible circuit board containing a plurality of lamp belt circuit boards, wherein the front surface of the circuit board is used for welding elements, in addition, manufacturing a lower-layer flexible circuit board containing a plurality of connected single-layer flexible circuit boards and a lower-layer circuit board for the laminated circuit boards, applying an adhesive of a middle layer on the back surface of the upper-layer circuit board or on one surface of the lower-layer circuit board, forming local adhesives at a plurality of positions on the circuit board after the application is finished, then aligning and pasting the upper-layer single-layer circuit board or the double-layer circuit board on the lower-layer circuit board, or punching the upper-layer circuit board, aligning and pasting the upper-layer circuit board on the lower layer, applying pressure and pressing to firmly bond the, the method comprises the steps of manufacturing a discontinuous layered flexible laminated lamp strip circuit board, wherein an upper layer circuit board and a lower layer circuit board of the laminated lamp strip circuit board are bonded together by forming discontinuous bonding of a plurality of local adhesives, a plurality of positions which are not bonded form separate gaps, the discontinuous layered flexible laminated lamp strip circuit board is a laminated circuit board formed by overlapping two different circuit boards and bonding the two different circuit boards together by using the adhesives, a single-layer circuit board or a double-layer circuit board is stacked on the upper layer, standby conduction connection points which can be mutually conducted are formed between the circuit boards and the lower layer single-layer circuit board on the back, the standby conduction connection points are arranged on the edge of the upper layer circuit board, a plurality of connection points on the circuit board on the lower layer are aligned to a plurality of connection points on the circuit board on the lower layer at the edge of the upper layer circuit board and can be conducted by using a conductive object at the edge of the board, or/or, the circuit board of the lower layer is provided with metal which is exposed from the front side at the via hole to form a connection point, a conductive object can be used at the via hole to enable the connection point of the circuit on the back side of the lower layer and the connection point of the circuit on the front side of the upper layer to form conductive conduction at the via hole, the discontinuous layered flexible laminated lamp strip circuit board is a double-layer board or a three-layer board which is internally provided with a plurality of discontinuous layered gaps, glue is arranged between the gaps to bond the circuit metal on the circuit board of the lower layer or/and the insulating nonmetal on the circuit with the back side of the single-layer circuit board of the upper layer or the back side of the double-layer circuit board, and discontinuous bonding at a plurality of positions is formed, the thickness of the circuit metal of the circuit board of the lower layer is larger than or equal to the thickness of the circuit metal of the circuit board of the upper layer, the manufactured discontinuous layered flexible laminated lamp strip is used for manufacturing, the manufactured lamp strip improves the bending resistance, and meanwhile, a plurality of positions are formed with discontinuous interlayer lamination bonding, and meanwhile, the lamp strip manufactured by the laminated circuit board is ensured to have a relatively firm integral structure.
The invention also provides a method for manufacturing the discontinuously layered flexible laminated strip circuit board, which comprises the steps of firstly manufacturing a plurality of single-layer connected flexible circuit boards containing a plurality of strip circuit boards, or manufacturing a plurality of double-layer connected flexible circuit boards containing a plurality of strip circuit boards, wherein the front surface of each circuit board is used for welding elements, and then manufacturing a connected single-layer long circuit board containing a plurality of strip circuit boards, and a lower-layer circuit board for lamination, applying an adhesive on the back surfaces of the plurality of upper-layer circuit boards or on one surface of the lower-layer long circuit board, after the application is finished, forming the adhesive at a plurality of positions on the circuit board, then arranging and aligning the plurality of upper-layer single-layer flexible circuit boards or the plurality of double-layer flexible circuit boards end to end on the lower-layer circuit board, or punching the plurality of upper-layer circuit boards, then arranging and aligning head and tail to be attached to a lower layer circuit board, applying pressure and pressing to firmly adhere the upper layer circuit board and the lower layer circuit board together to manufacture a laminated lamp strip circuit board, wherein the adhesion between each upper layer circuit board and the lower layer circuit board of the laminated lamp strip circuit board is formed by discontinuous adhesion of a plurality of formed local adhesive, a plurality of non-adhered positions are formed by separated gaps, namely the manufactured flexible laminated lamp strip circuit board is a discontinuous and layered flexible laminated lamp strip circuit board, the manufactured discontinuous and layered flexible laminated lamp strip circuit board is a laminated circuit board formed by a plurality of circuit boards which are arranged head and tail and adhered to a long circuit board at the lower layer through the adhesive, a single-layer circuit board or a double-layer circuit board is laminated at the upper layer, the manufactured laminated circuit board is a double-layer or three-layer circuit board, and spare conduction connection points which can be mutually conducted are arranged between the upper layer circuit board and, the standby conduction connection point is arranged at the edge of the upper layer circuit board, a plurality of connection points are arranged at the edge of the upper layer circuit board and are aligned with a plurality of connection points on the lower layer circuit board, the upper layer circuit board and the lower layer circuit board can be connected to form conduction by applying a conductive object on the edge of the board, or/and a standby conduction hole is arranged in the board of the upper layer circuit board, the conduction hole edge is provided with an exposed front circuit connection point of the upper layer circuit board, the lower layer circuit board is provided with metal exposed from the front at the conduction hole to form a connection point, an upper layer welding disc and the lower layer connection point can be connected together to form conduction by the conductive object, the discontinuous layered flexible laminated lamp strip circuit board is a double-layer circuit board or a three-layer circuit board which is internally provided with a plurality of discontinuous layered gaps, and glue is arranged between the gaps to bond the circuit metal or/and the insulating nonmetal on the circuit on the, the manufactured discontinuous layered flexible laminated lamp strip circuit board is used for manufacturing an LED lamp strip, the lamp strip manufactured by the circuit board has a discontinuous layered structure, the bending resistance of the manufactured lamp strip is improved, meanwhile, discontinuous interlayer laminated bonding is formed at a plurality of positions, and meanwhile, the lamp strip manufactured by the laminated circuit board has a relatively firm integral structure.
According to the present invention, there is also provided a discontinuously laminated flexible laminated tape wiring board comprising: a single-layer circuit board or a double-layer circuit board stacked on the upper layer; an intermediate adhesive layer; a single-layer circuit board stacked on the lower layer; the discontinuous layered flexible laminated lamp strip circuit board is characterized in that the discontinuous layered flexible laminated lamp strip circuit board is formed by adhering a plurality of conjoined single-layer circuit boards or double-layer circuit boards on an upper layer to a plurality of conjoined single-layer circuit boards or double-layer circuit boards on a lower layer through an adhesive layer, or adhering a plurality of conjoined single-layer circuit boards or double-layer circuit boards on the lower layer to a plurality of conjoined single-layer circuit boards through an adhesive layer, wherein all the upper layer circuit boards and the lower layer circuit boards of the laminated lamp strip circuit board are adhered by the adhesive layer at a plurality of positions which are formed by discontinuous adhesion of the adhesive at local parts, and the formed flexible laminated lamp strip circuit board is the discontinuous layered flexible laminated lamp strip circuit board which is formed by adhering one or a plurality of circuit boards on the lower layer by the adhesive, the formed laminated circuit board is a double-layer or three-layer circuit board, and a standby conduction connection point which can be mutually conducted is arranged between an upper-layer circuit board and a lower-layer single-layer circuit board, the standby conduction connection point is arranged at the edge of the upper-layer circuit board, a plurality of metal connection points are arranged at the edge of the upper-layer circuit board and are aligned to a plurality of metal connection points on the lower-layer circuit board, and the metal connection points of the upper layer circuit board and the lower layer circuit board can be connected to form conduction by applying a conductive object on the edge of the plate, or/and a standby conduction hole is arranged in the plate of the upper-layer circuit board, the edge of the conduction hole is provided with an exposed metal conduction connection point on the front circuit of the upper-layer circuit board, the circuit board of the lower layer is provided with metal exposed from the front side at the conduction hole to form a connection, a double-layer circuit board or a three-layer circuit board with a plurality of discontinuous layered gaps is formed in the board, circuit metal or/and insulating nonmetal on the circuit on the single-layer circuit board at the lower layer and the back of a single upper-layer circuit board or the backs of a plurality of upper-layer circuit boards are bonded by glue between the gaps, and the formed discontinuous bonding of a plurality of positions, the thickness of the circuit metal of the lower layer back circuit board is larger than or equal to that of the circuit metal of the upper layer circuit board, the manufactured discontinuous layered flexible laminated lamp strip circuit board is used for manufacturing an LED lamp strip, the lamp strip manufactured by the circuit board has a discontinuous layered structure, the manufactured lamp strip has improved bending resistance, meanwhile, intermittent interlayer lamination bonding is formed at a plurality of positions, and the lamp belt manufactured by the laminated circuit board is ensured to have a relatively firm integral structure.
According to a preferred embodiment of the present invention, when the two-layer circuit board is stacked on the upper layer, the two-layer circuits are conducted with each other by soldering at the solder conducting positions of the upper and lower layers, or by copper plating through holes formed between the two layers, or by conductive ink.
According to a preferred embodiment of the present invention, the intermittently laminated flexible laminated tape circuit board is characterized in that the adhesive is a curable or cured adhesive or a self-adhesive.
According to a preferred embodiment of the present invention, the discontinuously laminated flexible laminated strip circuit board is characterized in that the single-layer circuit board laminated on the lower layer is a single-layer circuit board, a film layer carrying the circuit is sandwiched in a board of the circuit board at a layered gap in the laminate, or the film layer is completely exposed at the lowest layer of the laminated circuit board, or the single-layer circuit board laminated on the lower layer is a double-layer circuit board, and the middle circuit layer is sandwiched by the two layers of films.
According to a preferred embodiment of the present invention, the discontinuously-layered flexible laminated light strip circuit board is characterized in that the single-layer circuit board stacked on the lower layer is a flat cable circuit board with a plurality of metal circuits arranged in parallel, and the parallel flat cables are positive and negative power supply circuits and are used for supplying power to the upper-layer circuit and the components.
According to a preferred embodiment of the present invention, the discontinuously laminated flexible laminated strip circuit board is characterized in that a plurality of cut slits are formed in the single-layer circuit board laminated on the lower layer, and the cut slits are formed between two adjacent circuits, so that the strip manufactured by using the circuit board can be mounted in a multi-directional turning manner in use.
According to a preferred embodiment of the present invention, the intermittently laminated flexible laminated tape circuit board is characterized in that the circuit metal of the single-layer circuit board laminated on the lower layer is copper, aluminum nickel plating, aluminum tin plating, aluminum copper plating or copper aluminum cladding.
According to a preferred embodiment of the invention, the discontinuously layered flexible laminated lamp strip circuit board is characterized in that a bonding pad for welding LEDs is arranged at a layered position opposite to a layered structure, and when an LED lamp is arranged at a turning position, the LED lamp strip manufactured by using the circuit board is difficult to break away or break due to turning and bending.
According to a preferred embodiment of the invention, the discontinuously laminated flexible laminated lamp strip circuit board is characterized in that a bonding pad containing a component is arranged on the surface of an upper layer circuit board of the circuit board, the designed lamp strip circuit board is clearly designed and manufactured to turn only at a position without the bonding pad (a position without welding the component), the turning position is of a laminated structure, and a position for welding an LED is arranged at a position opposite to a bonding position between the upper layer circuit board and the lower layer circuit board.
According to a preferred embodiment of the present invention, the discontinuously laminated flexible laminated light strip circuit board is characterized in that the single-layer circuit board or the double-layer circuit board stacked on the upper layer is a circuit board including a plurality of periodic circuits, the circuit design of each period is the same, when the upper layer circuit board is designed with positive and negative power supply main lines from head to tail, the standby conduction connection point between the upper layer circuit board and the lower layer circuit board is arranged at one periodic position or a plurality of periodic positions, and when the upper layer circuit board is not designed with a power supply main line from head to tail, the standby conduction connection point between the upper layer circuit board and the lower layer circuit board is arranged in each period, and when the light strip is manufactured, a conductive object needs to be communicated in each period.
According to a preferred embodiment of the present invention, the intermittently laminated flexible laminated tape circuit board is characterized in that the conductive material is tin, or a tin alloy, or a conductive ink, or a conductive adhesive.
According to a preferred embodiment of the present invention, the discontinuous layered flexible laminated tape circuit board is characterized in that the conduction of the upper layer circuit board and the lower layer circuit board is formed by the contact between the bare metals at the layered position between the upper layer circuit board and the lower layer circuit board.
According to a preferred embodiment of the present invention, the method for applying the adhesive is to apply the adhesive by printing, or to apply the adhesive by a multi-head gluing machine, or to apply the adhesive by a tape gluing machine.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of an upper circuit board, in which a via hole is formed at a via soldering position, and a front circuit pad of the upper circuit board is exposed at an edge of the via hole.
Fig. 2 is a schematic plan view of the upper-layer circuit board, in which the conducting soldering positions at two ends are on the conducting soldering pads at the edge of the upper-layer circuit board, only half of the front-side circuit pads of the upper-layer circuit board are exposed, and the other half of the front-side circuit pads form holes.
Fig. 3 is a schematic plan view of the upper-layer circuit board after printing adhesive at a plurality of positions on a part of the back surface of the upper-layer circuit board.
Fig. 4 is a schematic plan view of a metal single-layer circuit of a backside underlayer.
FIG. 5 is a schematic plan view of a metal single-layer circuit board formed by attaching a film having holes to a metal single-layer circuit board of a lower layer on the back surface.
Fig. 6 is a schematic plan view of a plurality of slits disposed between two adjacent circuits of the metal single-layer circuit board.
Fig. 7 is a schematic plan view of the intermittently laminated flexible laminated tape circuit board of the intermittently laminated structure, in which the upper layer circuit board of fig. 1 is attached to the lower layer single layer circuit board by an adhesive to form an intermittent adhesive.
Fig. 8 is a schematic plan view of the intermittently layered flexible laminated tape circuit board of the intermittently layered structure, in which the upper layer circuit board of fig. 2 is attached to the lower layer single layer circuit board by an adhesive to form an intermittent adhesive.
Fig. 9 is a schematic plan view of a plurality of upper-layer circuit boards aligned end to end and attached to a lower-layer circuit board.
Fig. 10 is a schematic cross-sectional view of a discontinuously layered flexible laminate tape cord board at the via location.
Fig. 11 is a schematic cross-sectional view of a discontinuous layered flexible laminated tape wiring board at a conduction welding position at both ends.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Manufacturing an upper-layer circuit board:
the manufacturing method comprises the steps of adopting a traditional circuit board manufacturing process, carrying out silk-screen printing on a single-sided flexible copper-clad plate through circuit anti-corrosion ink, baking and curing, etching, film stripping and silk-screen printing on front ink solder resist to expose a resistance pad 1.1a and an LED lamp pad 1.1b, baking and character printing, baking and curing, punching out a through hole 1.2a by using a die, wherein the front circuit pad 1.3a of an upper-layer circuit board is exposed at the hole edge of the through hole 1.2a, so as to manufacture the upper-layer single-layer circuit board 1 shown in figure 1, or shortening the upper-layer circuit on the pads at the conducting and welding positions at the two ends of the circuit board, so that only half of conducting connection points 1.3b of the upper-layer circuit are exposed at the conducting and welding connection points, and the other half of holes 1.2b are formed, so as to manufacture the upper-layer single-layer circuit board 1 shown in figure 2 in.
Or drilling a double-sided flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and displaying a scene, etching, removing a film, silk-screening front ink solder resist, exposing a resistance pad 1.1a and an LED lamp pad 1.1b, baking, silk-screening back ink solder resist, baking, characters, baking, punching out a via hole 1.2a by using a die, wherein the front circuit pad 1.3a of an upper circuit board is exposed at the hole edge of the via hole 1.2a, so as to manufacture the upper double-layer circuit board 1 shown in the figure 1, or shortening the upper circuit on the pads at the conducting and welding positions at the two ends of the circuit board, so that only half of the conducting connection point 1.3b of the upper circuit is exposed at the conducting and welding connection points, and the other half of the hole 1.2b is formed, so as to manufacture the upper double-layer circuit board 1 shown in the figure 2, wherein the mark 1 in the figure 1 and the figure 2 indicates the double-layer circuit board.
According to the engineering data of design, the 18T silk screen printing glue is used at a plurality of local positions on the back surface of the upper layer circuit board 1, the silk screen does not leak glue at the glue leaking part position of the partial position, a net frame is erected on a silk screen printing bench, a positioning nail is arranged on an alignment back surface, the back surface of the circuit board is placed on a table top upwards, the positioning nail enters a positioning hole for positioning, glue is added on the net, an acrylic acid adhesive 2 for a flexible board is printed on a plurality of pre-designed position surfaces (shown in figure 3) on the board, the circuit board enters a tunnel furnace for 120 ℃ and 3 minutes, and the solvent in the acrylic acid adhesive 2 is heated and volatilized.
Manufacturing a back lower-layer metal single-layer circuit board:
the method comprises the steps of adopting a traditional circuit board manufacturing process, printing circuit anti-corrosion ink on a single-sided flexible copper clad laminate with the copper thickness of 0.15mm by silk screen printing, baking, curing, etching, removing a film, manufacturing a metal circuit 3.1 (shown in figure 4), then attaching a PI cover film with holes on the metal circuit 3.1, exposing the metal circuit 3.1 from the holes of the PI cover film, pressing and baking to manufacture a lower-layer metal single-layer circuit board (shown in figure 5), wherein the length of the lower-layer metal single-layer circuit board is 0.5-300 m, punching a plurality of gaps 3.2 (shown in figure 6) between two adjacent circuits 3.1 on the metal single-layer circuit board by using a cutting die, and cutting the gaps 3.2 to facilitate multidirectional turning installation of a subsequent lamp strip.
Discontinuous layered flexible laminated lamp strip circuit board manufacturing:
preferred embodiment (1) combination of a single upper layer wiring board and a lower layer metal single layer board
A template with positioning nails is used for placing a lower layer metal single-layer board 3 with the length of 0.5 meter on the template, the positioning nails are inserted into positioning holes of the board, and then the single-layer board 1 or the double-layer board 1 with the upper layer printed with an adhesive 2 is folded downwards, the adhesive 2 is also folded downwards onto the metal single-layer board 3, and the positioning nails on the board are inserted into the positioning holes to align the upper layer and the lower layer, at the moment, a metal circuit 3.1 is exposed at a through hole 1.2a on the upper layer circuit board 1, a front circuit pad 1.3a of the upper layer circuit board is exposed at the edge of the through hole 1.2a, the metal circuit 3.1 of the lower layer circuit board is exposed from the front side at the through hole 1.2a (as shown in figures 7 and 10), or, at two ends of the circuit board, the pads at the through welding positions are shortened to expose only half of the through connection point 1.3b of the upper layer circuit on the through welding connection point, and the metal circuit 3.1 of the lower layer circuit board is exposed from the other half of the front side at the through hole 1., Fig. 11), then an iron is used to heat the upper plate to transfer heat to the 2 adhesive layers, the 2 adhesive layers are adhered to the upper circuit board 1, the lower metal single-layer circuit board 3 is transferred to a faster press, the stacked boards are pressed for 1 minute at 150 degrees and 120KG, and then are taken out and put into an oven, and the boards are baked for 60 minutes at 150 degrees to solidify the adhesive, so that the discontinuous and layered flexible laminated lamp strip circuit board (as shown in fig. 7, 8, 10 and 11) is manufactured and specially used for manufacturing the LED strip.
Preferred embodiment (2), combination of a plurality of upper-layer wiring boards and lower-layer metal single-layer board
A template with a positioning nail is used, a first section of a lower metal single-layer plate 3 with the length of 100 meters is placed on the template, the positioning nail is inserted into a positioning hole of the plate, a first single-layer plate 1 with an upper layer printed with an adhesive 2 or a double-layer plate 1 is folded downwards, the adhesive 2 is overlapped on the first section of the metal single-layer plate 3, the positioning nail on the plate is also inserted into the positioning hole, the upper layer and the lower layer are aligned, at the moment, a metal circuit 3.1 is exposed at a through hole 1.2a on the upper layer circuit board 1, a front circuit pad 1.3a of the upper layer circuit board is exposed at the edge of the through hole 1.2a, the metal circuit 3.1 of the lower layer circuit board is exposed from the front side at the through hole 1.2a (as shown in figures 9 and 10), or, the upper layer circuit is shortened on a pad at a conducting welding position at two ends of the circuit board, so that only half of the conducting connection point 1.3b of the upper layer circuit is exposed at the conducting, the metal circuit 3.1 of the lower layer of wiring board is exposed from the front side at the other half-hole 1.2b (as shown in figures 9 and 11), then heating the upper layer board by an iron to transfer heat to the adhesive 2 layer, enabling the adhesive 2 layer to stick the upper layer circuit board 1 and the lower layer metal single layer circuit board 3, then sequentially sticking the second, third and fourth boards until the last single layer board 1 or double layer board 1 with the adhesive 2 printed on the upper layer is aligned and stuck to the lower layer metal single layer circuit board 3 end to end according to the method, then pressing the materials section by section in a faster press with each section at 150 ℃ under 120KG for 1 minute, putting the materials into an oven, baking the materials at 150 ℃ for 60 minutes to solidify the glue, namely, the discontinuous and layered flexible laminated strip circuit board (as shown in fig. 7, fig. 8, fig. 10 and fig. 11) is manufactured and specially used for manufacturing the LED strip.
According to the invention, the single-layer or double-layer flexible circuit board with the front surface welded with the element is printed with the adhesive discontinuously at the local back surface, and then is adhered with the metal single-layer circuit board at the back surface to form a discontinuous adhesion and discontinuous layering structure, so that the bending resistance of the lamp strip is greatly improved, and the problem of plate breakage caused by a plurality of factors during installation and use of the lamp strip is solved.
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a discontinuous layered flexible laminated tape circuit board and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (15)
1. A method for manufacturing a discontinuous layered flexible laminated strip circuit board comprises the steps of firstly manufacturing a connected single-layer flexible circuit board containing a plurality of strip circuit boards or a connected double-layer flexible circuit board containing a plurality of strip circuit boards, wherein the connected double-layer flexible circuit board is used for an upper layer circuit board of the laminated circuit board, the front surface of the circuit board is used for welding elements, in addition, a lower layer circuit board containing a plurality of connected single-layer flexible circuit boards is manufactured, an adhesive of a middle layer is applied to the back surface of the upper layer circuit board or one surface of the lower layer circuit board, after the application is finished, the local adhesive is formed on a plurality of positions on the circuit board, then the upper layer single-layer circuit board or the double-layer circuit board is aligned and attached to the lower layer circuit board, or after the upper layer circuit board is punched, the upper layer circuit board is aligned and attached to the lower layer circuit board, the method comprises the steps of manufacturing a discontinuous layered flexible laminated lamp strip circuit board, wherein an upper layer circuit board and a lower layer circuit board of the laminated lamp strip circuit board are bonded together by forming discontinuous bonding of a plurality of local adhesives, a plurality of positions which are not bonded form separate gaps, the discontinuous layered flexible laminated lamp strip circuit board is a laminated circuit board formed by overlapping two different circuit boards and bonding the two different circuit boards together by using the adhesives, a single-layer circuit board or a double-layer circuit board is stacked on the upper layer, standby conduction connection points which can be mutually conducted are formed between the circuit boards and the lower layer single-layer circuit board on the back, the standby conduction connection points are arranged on the edge of the upper layer circuit board, a plurality of connection points on the circuit board on the lower layer are aligned to a plurality of connection points on the circuit board on the lower layer at the edge of the upper layer circuit board and can be conducted by using a conductive object at the edge of the board, or/or, the circuit board of the lower layer is provided with metal which is exposed from the front side at the via hole to form a connection point, a conductive object can be used at the via hole to enable the connection point of the circuit on the back side of the lower layer and the connection point of the circuit on the front side of the upper layer to form conductive conduction at the via hole, the discontinuous layered flexible laminated lamp strip circuit board is a double-layer board or a three-layer board which is internally provided with a plurality of discontinuous layered gaps, glue is arranged between the gaps to bond the circuit metal on the circuit board of the lower layer or/and the insulating nonmetal on the circuit with the back side of the single-layer circuit board of the upper layer or the back side of the double-layer circuit board, and discontinuous bonding at a plurality of positions is formed, the thickness of the circuit metal of the circuit board of the lower layer is larger than or equal to the thickness of the circuit metal of the circuit board of the upper layer, the manufactured discontinuous layered flexible laminated lamp strip is used for manufacturing, the manufactured lamp strip improves the bending resistance, and meanwhile, a plurality of positions are formed with discontinuous interlayer lamination bonding, and meanwhile, the lamp strip manufactured by the laminated circuit board is ensured to have a relatively firm integral structure.
2. A method for manufacturing discontinuous layered flexible laminated strip circuit board includes preparing multiple single layer flexible circuit boards containing multiple strip circuit boards or multiple double layer flexible circuit boards containing multiple strip circuit boards, using front surface of circuit board for welding element, preparing one single layer long circuit board containing multiple strip circuit boards, applying adhesive on back surface of multiple upper layer circuit boards or one surface of lower layer long circuit board, forming adhesive on circuit board at multiple positions, attaching multiple upper layer single layer flexible circuit boards or multiple double layer flexible circuit boards to lower layer circuit board in head-to-tail alignment mode or punching multiple upper layer circuit boards and then attaching them to lower layer circuit board in head-to-tail alignment mode, then applying pressure and pressing to firmly bond the upper layer circuit board and the lower layer circuit board together to manufacture a laminated lamp strip circuit board, wherein the bonding between each upper layer circuit board and each lower layer circuit board of the laminated lamp strip circuit board is the discontinuous bonding of a plurality of formed local adhesive at a plurality of positions, and a plurality of non-bonded positions are provided with separated gaps, namely the manufactured flexible laminated lamp strip circuit board is a discontinuous laminated flexible laminated lamp strip circuit board, the manufactured discontinuous laminated flexible laminated lamp strip circuit board is a laminated circuit board formed by arranging a plurality of circuit boards end to end and bonding a long circuit board at the lower layer through the adhesive, a single-layer circuit board or a double-layer circuit board is laminated at the upper layer, the manufactured laminated circuit board is a double-layer or three-layer circuit board, and spare conduction connection points capable of mutually conducting are arranged between the upper layer circuit board and the back lower layer circuit board, the standby conduction connection point is arranged at the edge of the upper layer circuit board, a plurality of connection points are arranged at the edge of the upper layer circuit board and are aligned with a plurality of connection points on the lower layer circuit board, the upper layer circuit board and the lower layer circuit board can be connected to form conduction by applying a conductive object on the edge of the board, or/and a standby conduction hole is arranged in the board of the upper layer circuit board, the conduction hole edge is provided with an exposed front circuit connection point of the upper layer circuit board, the lower layer circuit board is provided with metal exposed from the front at the conduction hole to form a connection point, an upper layer welding disc and the lower layer connection point can be connected together to form conduction by the conductive object, the discontinuous layered flexible laminated lamp strip circuit board is a double-layer circuit board or a three-layer circuit board which is internally provided with a plurality of discontinuous layered gaps, and glue is arranged between the gaps to bond the circuit metal or/and the insulating nonmetal on the circuit on the, the manufactured discontinuous layered flexible laminated lamp strip circuit board is used for manufacturing an LED lamp strip, the lamp strip manufactured by the circuit board has a discontinuous layered structure, the bending resistance of the manufactured lamp strip is improved, meanwhile, discontinuous interlayer laminated bonding is formed at a plurality of positions, and meanwhile, the lamp strip manufactured by the laminated circuit board has a relatively firm integral structure.
3. A discontinuously layered flexible laminated tape strip circuit board comprising:
a single-layer circuit board or a double-layer circuit board stacked on the upper layer;
an intermediate adhesive layer;
a single-layer circuit board stacked on the lower layer;
the discontinuous layered flexible laminated lamp strip circuit board is characterized in that the discontinuous layered flexible laminated lamp strip circuit board is formed by adhering a plurality of conjoined single-layer circuit boards or double-layer circuit boards on an upper layer to a plurality of conjoined single-layer circuit boards or double-layer circuit boards on a lower layer through an adhesive layer, or adhering a plurality of conjoined single-layer circuit boards or double-layer circuit boards on the lower layer to a plurality of conjoined single-layer circuit boards through an adhesive layer, wherein all the upper layer circuit boards and the lower layer circuit boards of the laminated lamp strip circuit board are adhered by the adhesive layer at a plurality of positions which are formed by discontinuous adhesion of the adhesive at local parts, and the formed flexible laminated lamp strip circuit board is the discontinuous layered flexible laminated lamp strip circuit board which is formed by adhering one or a plurality of circuit boards on the lower layer by the adhesive, the formed laminated circuit board is a double-layer or three-layer circuit board, and a standby conduction connection point which can be mutually conducted is arranged between an upper-layer circuit board and a lower-layer single-layer circuit board, the standby conduction connection point is arranged at the edge of the upper-layer circuit board, a plurality of metal connection points are arranged at the edge of the upper-layer circuit board and are aligned to a plurality of metal connection points on the lower-layer circuit board, and the metal connection points of the upper layer circuit board and the lower layer circuit board can be connected to form conduction by applying a conductive object on the edge of the plate, or/and a standby conduction hole is arranged in the plate of the upper-layer circuit board, the edge of the conduction hole is provided with an exposed metal conduction connection point on the front circuit of the upper-layer circuit board, the circuit board of the lower layer is provided with metal exposed from the front side at the conduction hole to form a connection, a double-layer circuit board or a three-layer circuit board with a plurality of discontinuous layered gaps is formed in the board, circuit metal or/and insulating nonmetal on the circuit on the single-layer circuit board at the lower layer and the back of a single upper-layer circuit board or the backs of a plurality of upper-layer circuit boards are bonded by glue between the gaps, and the formed discontinuous bonding of a plurality of positions, the thickness of the circuit metal of the lower layer back circuit board is larger than or equal to that of the circuit metal of the upper layer circuit board, the manufactured discontinuous layered flexible laminated lamp strip circuit board is used for manufacturing an LED lamp strip, the lamp strip manufactured by the circuit board has a discontinuous layered structure, the manufactured lamp strip has improved bending resistance, meanwhile, intermittent interlayer lamination bonding is formed at a plurality of positions, and the lamp belt manufactured by the laminated circuit board is ensured to have a relatively firm integral structure.
4. A discontinuous layered flexible laminated strip wiring board according to claim 1, 2 or 3, wherein when the upper layer is a double-layer wiring board, the double-layer wiring is conducted by soldering at the designed solder conducting positions of the upper and lower layers, or by copper plating through holes formed between the two layers, or by conductive ink.
5. A discontinuously laminated flexible tape strip circuit as in claim 1, 2 or 3, wherein said adhesive is a curable or cured-formed adhesive or a non-tacky adhesive.
6. A discontinuously laminated flexible strip wiring board as in claim 1, 2 or 3, wherein said single layer wiring board laminated on the bottom layer is a single layer wiring board, a wiring-carrying film layer is sandwiched between the wiring boards at the seams of the layers in the board, or the film layer is exposed at the lowest layer of the laminated wiring board, or said single layer wiring board laminated on the bottom layer is a double layer wiring board, and the two layers sandwich the middle wiring layer.
7. A discontinuously laminated flexible strip wiring board as in claim 1, 2 or 3, wherein said single layer wiring board laminated on the lower layer is a flat cable wiring board with a plurality of metal lines arranged in parallel, and the parallel flat cables are positive and negative power supply lines for supplying power to the circuits and components on the upper layer.
8. A intermittently laminated flexible tape carrier board according to claim 1, 2 or 3, wherein said single layer carrier board laminated on the lower layer is formed with a plurality of slits formed between two adjacent circuits, thereby facilitating the tape carrier board manufactured from said single layer carrier board to be mounted with a multi-directional turning during use.
9. A discontinuous layered flexible laminate tape circuit board according to claim 1, 2 or 3, wherein the wiring metal of the single layer circuit board layered on the lower layer is copper, or aluminum nickel plating, or aluminum tin plating, or aluminum copper plating, or copper aluminum cladding.
10. A discontinuously laminated flexible laminated strip circuit board as claimed in claim 1, 2 or 3, wherein the pads for soldering LEDs are arranged at the position of the lamination opposite to the lamination of the lamination structure, and the LED strip manufactured by using said circuit board is not easy to break away or break by bending at a turn when LED lamps are arranged at the turn.
11. A discontinuously laminated flexible laminated strip wiring board as claimed in claim 1, 2 or 3, wherein the surface of the upper layer wiring board of said wiring board is provided with pads containing components, the designed strip wiring board is specifically designed to turn only at the positions without pads (positions where no components are welded), the turn is of a laminated structure, and the positions where the LEDs are welded are arranged at the positions opposite to the bonding positions between the upper layer wiring board and the lower layer wiring board.
12. A discontinuous layered flexible laminated strip wiring board according to claim 1, 2 or 3, wherein the single layer wiring board or the double layer wiring board stacked on the upper layer is a wiring board having a plurality of periodic circuits, the circuit design of each period is the same, when the upper layer wiring board is designed with positive and negative power supply main lines from head to tail, the standby conducting connection point between the upper layer wiring board and the lower layer wiring board is arranged at one periodic position or a plurality of periodic positions, and when the upper layer wiring board is not designed with a power supply main line from head to tail, the standby conducting connection point between the upper layer wiring board and the lower layer wiring board is arranged at each period, and when the strip wiring board is manufactured, the conductive object must be connected in each period.
13. A discontinuously laminated flexible tape tab as defined in claim 1, 2 or 3, wherein said conductive material is tin, or a tin alloy, or a conductive ink, or a conductive adhesive.
14. A discontinuously laminated flexible strip wiring board as in claim 1, 2 or 3, wherein the conduction between the upper and lower layers of wiring board is via contact between the upper and lower layers of wiring board at the position of the lamination where the bare metal contacts each other.
15. A discontinuous layered flexible laminated tape circuit board according to claim 1 or 2, wherein said adhesive is applied by printing, by a multi-head glue applicator, or by a tape.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910960778.XA CN112584630A (en) | 2019-09-27 | 2019-09-27 | Discontinuously layered flexible laminated lamp strip circuit board and manufacturing method |
| PCT/CN2020/109147 WO2021057321A1 (en) | 2019-09-27 | 2020-08-14 | Discontinuously layered flexible lamination lamp strip circuit board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910960778.XA CN112584630A (en) | 2019-09-27 | 2019-09-27 | Discontinuously layered flexible laminated lamp strip circuit board and manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN112584630A true CN112584630A (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910960778.XA Pending CN112584630A (en) | 2019-09-27 | 2019-09-27 | Discontinuously layered flexible laminated lamp strip circuit board and manufacturing method |
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| CN (1) | CN112584630A (en) |
| WO (1) | WO2021057321A1 (en) |
Family Cites Families (3)
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|---|---|---|---|---|
| CN103906344B (en) * | 2013-12-01 | 2017-06-06 | 东莞市震泰电子科技有限公司 | Heat-conducting type double-sided PCB |
| CN105172089A (en) * | 2015-10-16 | 2015-12-23 | 中山市欧曼科技照明有限公司 | Production method of flexile LED lamp band |
| CN109282179A (en) * | 2018-09-13 | 2019-01-29 | 湖南华特光电科技有限公司 | A kind of flexible LED rope light |
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- 2019-09-27 CN CN201910960778.XA patent/CN112584630A/en active Pending
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