CN104159400A - Packaging structure and circuit board of novel embedded components - Google Patents
Packaging structure and circuit board of novel embedded components Download PDFInfo
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- CN104159400A CN104159400A CN201410424708.XA CN201410424708A CN104159400A CN 104159400 A CN104159400 A CN 104159400A CN 201410424708 A CN201410424708 A CN 201410424708A CN 104159400 A CN104159400 A CN 104159400A
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- circuit board
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- fluting
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- novel embedded
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Abstract
The invention provides a packaging structure of novel embedded components. The packaging structure comprises a multilayer circuit board, the multilayer circuit board comprise a PCB, a glue layer and an FPC board which are all arranged in sequence, and the FPC board and the PCB are electrically connected; a plurality of grooves are formed in the multilayer circuit board and penetrate through the PCB and the glue layer; circuit connect-in ends for connecting the components placed in the grooves with the multilayer circuit board are arranged in the grooves. The invention further provides the circuit board of the novel embedded components. Through the packaging structure and the circuit board of the novel embedded components, the components can be installed in an embedded mode, and the thickness of the multilayer circuit board is reduced; the PCB can be separated from the components, the components are placed in chip grooves after the grooves are formed in the packaging substrate, the components are protected, the rejection rate of the components is reduced, and a large amount of cost is saved.
Description
Technical field
The present invention relates to a kind of encapsulating structure of circuit board, particularly a kind of encapsulating structure of novel embedded type component and circuit board.
Background technology
The development trend that volume is little, lightweight, thin thickness is electronic product, the components and parts in traditional circuit-board are all arranged on circuit board surface, certainly will increase circuit board thickness like this, simultaneously also cannot be used for manufacturing multilayer circuit board.Small and exquisite and frivolous for what electronic product was done, flush type multilayer circuit board arises at the historic moment.As its name suggests, flush type multilayer circuit board is exactly that electronic devices and components are embedded to inner circuit board.
More common a kind of flush type encapsulating structure is by implanted chip pcb board now, then pcb board is sticked with glue and link on FPC plate, after adhesion, through moulding, it is connected closely again.This encapsulating structure has no doubt met the requirement of flush type, but the current some shortcomings part that still exists: 1, under current technical merit, pcb board obtains yield can only reach 95%, while adopting above-mentioned encapsulating structure, when pcb board is scrapped, the chip of implanting wherein can not re-use.But the price of pcb board is more cheap, and chip is expensive, causes chip to be wasted because pcb board is defective, and the multiple-plate cost of flush type is significantly promoted.2, in moulding process, easily chip is damaged by pressure, this is also the Another reason that causes cost higher.
Summary of the invention
The present invention seeks to, in order to overcome the deficiencies in the prior art, provides a kind of encapsulating structure of novel embedded type component, realizes imbedding of components and parts, and has avoided the destruction of components and parts and waste.
Another object of the present invention is for a kind of circuit board of novel embedded type component is provided.
In order to achieve the above object, the present invention is by the following technical solutions:
An encapsulating structure for novel embedded type component, comprises multilayer circuit board, and described multilayer circuit board comprises pcb board, glue-line and the FPC plate setting gradually; On described multilayer circuit board, be provided with some flutings, described fluting runs through pcb board and glue-line; In described fluting, be provided with the circuit incoming end for the components and parts of inserting fluting are connected with multilayer circuit board.
As preferably, described circuit incoming end is arranged on the bottom of fluting.
As preferably, described fluting is chip groove.
A circuit board for novel embedded type component, comprises described encapsulating structure, and at least one components and parts is set in described fluting, and described components and parts are electrically connected to circuit incoming end.
As preferably, stacked at least two components and parts in described fluting.
Compared with prior art, the present invention has following beneficial effect:
By notching construction, realize the flush type of components and parts and install, reduced multiple-plate thickness.By said structure, realized the separated of pcb board and components and parts, components and parts are to insert in chip groove after base plate for packaging fluting again, have protected components and parts, reduce the scrappage of components and parts, have saved great amount of cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the encapsulating structure of novel embedded type component of the present invention;
Fig. 2 is the structural representation of the circuit board of novel embedded type component of the present invention.
In figure:
11-pcb board; 12-glue-line; 13-FPC plate; 14-fluting; 2-chip.
Now the invention will be further described with specific embodiment by reference to the accompanying drawings.
Embodiment
As shown in Figure 1, the encapsulating structure for a kind of novel embedded type component of the present invention, comprises multilayer circuit board, and multilayer circuit board comprises pcb board 11, glue-line 12 and the FPC plate 13 stacking gradually, and FPC plate 13 is electrically connected to pcb board 11; On multilayer circuit board, be provided with some flutings 14, fluting 14 runs through pcb board 11 and glue-line 12; In fluting 14, be provided with the circuit incoming end for the components and parts of inserting fluting are connected with multilayer circuit board, circuit incoming end is electrically connected to pcb board 11 and/or FPC plate 13.Circuit incoming end can be arranged on the bottom of fluting 14.When fluting 14 can be chip 2 groove.
As shown in Figure 2, for the circuit board of a kind of novel embedded type component of the present invention, comprise above-mentioned encapsulating structure, and at components and parts such as fluting 14 interior storing chips 2, and these components and parts can stackedly place, chip 2 components and parts such as grade are electrically connected to circuit incoming end.The components and parts that are placed in fluting 14 can be electrically connected to mutually.
The practical application of encapsulating structure of the present invention: chip 2 components and parts such as grade are inserted in the fluting in the encapsulating structure of novel embedded type component of the present invention, stacked one by one; And by demand, the components and parts such as chip 2 and pcb board 11 and/FPC plate 13 are electrically connected to.
The effect of the part-structure of the encapsulating structure of novel embedded type component of the present invention:
Glue-line 12: for connecting PCB board 11 and FPC plate 13.
Fluting 14: for chip placement 2 components and parts such as grade; Fluting 14 runs through pcb board 11 and glue-line 12, guarantees that the components and parts in fluting 14 are more convenient with being electrically connected to of pcb board 11 and FPC plate 13.
Circuit incoming end: in fluting 14 inside, circuit incoming end is set, the circuit of make to slot components and parts access pcb board 11 in 14 or FPC plate 13 is more direct, reduces the impact of external conducting medium on multilayer circuit board, has also reduced quality and the thickness of multilayer circuit board.
The multilayer circuit board that pcb board 11, glue-line 12 and FPC plate 13 form: volume is little, quality is light, because the line between high density assembling, parts (comprising parts) reduces, thereby has increased reliability; Can increase wiring layers, then increase design flexibility, can form and there is certain high speed transmission circuit; Can initialization circuit, electro-magnetic screen layer; Also metal core layer can be installed, meet function and the demands such as special heat is heat insulation; Easy for installation, reliability is high.Pcb board 11 combines mutually with FPC plate 13, can possess the advantage of FPC, and strengthens bulk strength by pcb board 11.
The present invention realizes the flush type of components and parts and installs, and has reduced multiple-plate thickness.Realized the separated of pcb board 11 and chip 2 (components and parts); chip 2 (components and parts) is to insert in fluting 14 after base plate for packaging fluting 14 again; protect chip 2 (components and parts), reduced the scrappage of chip 2 (components and parts), saved great amount of cost.
The present invention is not limited to above-mentioned execution mode, if various changes of the present invention or modification are not departed to the spirit and scope of the present invention, if within these changes and modification belong to claim of the present invention and equivalent technologies scope, the present invention is also intended to comprise these changes and change.
Claims (5)
1. an encapsulating structure for novel embedded type component, is characterized in that, comprises multilayer circuit board, and described multilayer circuit board comprises pcb board, glue-line and the FPC plate setting gradually; On described multilayer circuit board, be provided with some flutings, described fluting runs through pcb board and glue-line; In described fluting, be provided with the circuit incoming end for the components and parts of inserting fluting are connected with multilayer circuit board.
2. the encapsulating structure of novel embedded type component according to claim 1, is characterized in that, described circuit incoming end is arranged on the bottom of fluting.
3. the encapsulating structure of novel embedded type component according to claim 1 and 2, is characterized in that, described fluting is chip groove.
4. a circuit board for novel embedded type component, is characterized in that, comprises encapsulating structure as claimed in claim 1 or 2, and at least one components and parts is set in described fluting, and described components and parts are electrically connected to circuit incoming end.
5. the circuit board of novel embedded type component according to claim 4, is characterized in that, stacked at least two components and parts in described fluting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410424708.XA CN104159400A (en) | 2014-08-26 | 2014-08-26 | Packaging structure and circuit board of novel embedded components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410424708.XA CN104159400A (en) | 2014-08-26 | 2014-08-26 | Packaging structure and circuit board of novel embedded components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104159400A true CN104159400A (en) | 2014-11-19 |
Family
ID=51884778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410424708.XA Pending CN104159400A (en) | 2014-08-26 | 2014-08-26 | Packaging structure and circuit board of novel embedded components |
Country Status (1)
| Country | Link |
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| CN (1) | CN104159400A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109855658A (en) * | 2019-05-06 | 2019-06-07 | 微传智能科技（常州）有限公司 | Motor, encoder, magnetic degree sensor and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6678167B1 (en) * | 2000-02-04 | 2004-01-13 | Agere Systems Inc | High performance multi-chip IC package |
| CN102789991A (en) * | 2011-05-20 | 2012-11-21 | 旭德科技股份有限公司 | Packaging structure and manufacturing method thereof |
| CN103458628A (en) * | 2012-05-30 | 2013-12-18 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| US20130341075A1 (en) * | 2012-06-25 | 2013-12-26 | Honeywell International Inc. | Printed circuit board |
| CN204046940U (en) * | 2014-08-26 | 2014-12-24 | 安捷利电子科技（苏州）有限公司 | The encapsulating structure of novel embedded type component and circuit board |
-
2014
- 2014-08-26 CN CN201410424708.XA patent/CN104159400A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6678167B1 (en) * | 2000-02-04 | 2004-01-13 | Agere Systems Inc | High performance multi-chip IC package |
| CN102789991A (en) * | 2011-05-20 | 2012-11-21 | 旭德科技股份有限公司 | Packaging structure and manufacturing method thereof |
| CN103458628A (en) * | 2012-05-30 | 2013-12-18 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| US20130341075A1 (en) * | 2012-06-25 | 2013-12-26 | Honeywell International Inc. | Printed circuit board |
| CN204046940U (en) * | 2014-08-26 | 2014-12-24 | 安捷利电子科技（苏州）有限公司 | The encapsulating structure of novel embedded type component and circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109855658A (en) * | 2019-05-06 | 2019-06-07 | 微传智能科技（常州）有限公司 | Motor, encoder, magnetic degree sensor and preparation method thereof |
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Application publication date: 20141119 |