CN104427761A - Flexible and hard circuit board module and manufacturing method thereof - Google Patents
Flexible and hard circuit board module and manufacturing method thereof Download PDFInfo
- Publication number
- CN104427761A CN104427761A CN201310392841.7A CN201310392841A CN104427761A CN 104427761 A CN104427761 A CN 104427761A CN 201310392841 A CN201310392841 A CN 201310392841A CN 104427761 A CN104427761 A CN 104427761A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- hard
- rigid
- kink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
The invention provides a flexible and hard circuit board module and a manufacturing method thereof. The flexible and hard circuit board module comprises a flexible and hard circuit board and a high-density inner connection wire circuit board, wherein the flexible and hard circuit board comprises a flexible printed circuit board, a first hard circuit board and a first adhering layer; the flexible printed circuit board comprises a bent part and a joining part connected with the bent part; the first hard circuit board is arranged on the joining part and the bent part is exposed; the first hard circuit board is electrically connected with the flexible printed circuit board; the first adhering layer is connected between the first hard circuit board and the joining part; the high-density inner connection wire circuit board is arranged in the first hard circuit board and is electrically connected with the first hard circuit board.
Description
Technical field
The present invention relates to the manufacture method of a kind of rigid-flex module and rigid-flex module, and comprise the rigid-flex module of high density intraconnections circuit board and the manufacture method of this rigid-flex module in particular to a kind of.
Background technology
Existing rigid-flex module is mainly combined by a flexible circuit board, a hard circuit board and an adhesion layer.Flexible circuit board generally includes a kink and a junction surface be connected with kink.Hard circuit board is arranged on junction surface, and exposes kink, with the ability providing rigid-flex module to bend.
Some electronic products at present, such as smart mobile phone, liquid crystal display, panel computer and notebook computer etc., had diversified function, to such an extent as to the rigid-flex module that these electronic products adopt needs more and more higher current densities.
Summary of the invention
The invention provides a kind of rigid-flex module, it has the design of local high density intraconnections.
The invention provides a kind of manufacture method of rigid-flex module, in order to manufacture above-mentioned rigid-flex module.
The invention provides a kind of rigid-flex module, comprise a hard circuit board, a high density intraconnections circuit board.Hard circuit board comprises a flexible circuit board, one first hard circuit board and one first adhesion layer.Flexible circuit board comprises a kink and a junction surface be connected with kink.First hard circuit board is configured on junction surface, and exposes kink.First hard circuit board and flexible circuit board are electrically connected.And the first adhesion layer connects the first hard circuit board and junction surface.High density intraconnections circuit board arrangement in the first hard circuit board, and is electrically connected with the first hard circuit board.
The invention provides a kind of manufacture method of rigid-flex module, comprise and a soft or hard initial substrate is provided, at the beginning of soft or hard, make substrate comprise a flexible circuit board, the first rigid substrate and the first insulation connecting layer.Flexible circuit board comprises a kink and a junction surface be connected with kink.And the first rigid substrate is configured on flexible circuit board, the first insulation connecting layer connects flexible circuit board and the first rigid substrate.Afterwards, soft or hard initial substrate forms one second opening, the second opening runs through the first rigid substrate and the first insulation connecting layer and formed.Place a high density intraconnections circuit board in the second opening.The both sides of soft or hard initial substrate are formed a pair insulation adhesion layer.Insulation adhesion layer forms a pair increasing layer circuit layer.In insulation adhesion layer, form many conductive poles, conductive pole can be electrically connected and increase layer circuit layer, high density intraconnections circuit board and soft or hard initial substrate.Afterwards, remove part first rigid substrate, part first insulation connecting layer, SI semi-insulation adhesion layer and the part be positioned at above kink and increase layer circuit layer.
In sum, the invention provides the manufacture method of a kind of rigid-flex module and rigid-flex module.Described rigid-flex module comprises a hard circuit board and a high density intraconnections circuit board.High density intraconnections circuit board is arranged in hard circuit board, and is positioned at the region needing dense wire to design.Because high density intraconnections circuit board and hard circuit board can separately design, therefore in the manufacture method of rigid-flex module of the present invention, can first screen above-specified high density intraconnections circuit board, there is bad high density intraconnections circuit be installed in situation in hard circuit board by mistake to reduce, thus impel the lifting of yield.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention and accompanying drawing, but these illustrate and accompanying drawing is only used for the present invention is described, but not any restriction is done to right of the present invention.
Accompanying drawing explanation
Figure 1A is the generalized section of the rigid-flex module of first embodiment of the invention.
Figure 1B to Fig. 1 G is the generalized section of the manufacture method of the rigid-flex module of first embodiment of the invention.
Fig. 2 A to Fig. 2 B is the generalized section of the manufacture method of the rigid-flex module of second embodiment of the invention.
Fig. 3 is the generalized section of the rigid-flex module of third embodiment of the invention.
[symbol description]
1,1 ' rigid-flex module
10,10 ' soft or hard initial substrate
10 ' ' hard circuit board
100,100 ', 100 ' ' flexible circuit board
200, the 200 ' first insulation connecting layer
200 ' ' the first adhesion layer
300, the 300 ' first rigid substrate
300 ' ' the first hard circuit board
410,410 ', 420,420 ' increases layer circuit layer
500 release layers
600, the 600 ' second insulation connecting layer
600 ' ' the second adhesion layer
700, the 700 ' second rigid substrate
700 ' ' the second hard circuit board
800,800 ' high density intraconnections circuit board
900 conductive poles
20 carriers
22 fixtures
30 accompany pressure material
A junction surface
B kink
H1, h1 ' first opening
H2, h2 ' second opening
H3 the 3rd opening
H through hole
Embodiment
Figure 1A is the generalized section of the rigid-flex module 1 of first embodiment of the invention.Refer to Figure 1A, rigid-flex module 1 comprises hard circuit board 10 ' ', high density intraconnections circuit board 800, two to increasing layer circuit layer 410 ', 420 ', multiple conductive pole 900 and through hole H.
As shown in Figure 1A, hard circuit board 10 ' ' also comprise flexible circuit board 100 ', the first adhesion layer 200 ' ', the first hard circuit board 300 ' ', the second adhesion layer 600 ' ', the second hard circuit board 700 ' '.And flexible circuit board 100' comprises the junction surface A that a kink B and is connected with kink B.First hard circuit board 300 ' ' and the second hard circuit board 700'' be configured in the both sides of flexible circuit board 100'.Specifically, the first hard circuit board 300 ' ' and the second hard circuit board 700'' be configured on the both sides of junction surface A of flexible circuit board 100', and expose kink B.First adhesion layer 200'' connects the wherein side of the first hard circuit board 300'' and junction surface A, and the second adhesion layer 600'' connects the other side of the second hard circuit board 700'' and junction surface A.
In addition, in the present embodiment, the quantity of kink B is one, and the quantity of junction surface A is two, and kink B is between two junction surface A.But the present invention is not as limit, and in other embodiments, the quantity of junction surface A and kink B can be only one, A connecting bending folding part, junction surface B.In addition, the quantity of junction surface A and kink B also can be multiple, and kink B is wherein between two junction surface A.
In addition, in the present embodiment, hard circuit board 10 ' ' comprise flexible circuit board 100 ', the first hard circuit board 300 ' ' and the second hard circuit board 700 ' ', and flexible circuit board 100 ' is positioned at the first hard circuit board 300 ' ' and the second hard circuit board 700 ' ' between.But the present invention does not limit the quantity of flexible circuit board and hard circuit board.In other embodiments, hard circuit board only can comprise one deck hard circuit board and one deck flexible circuit board, and hard circuit board can be positioned on the junction surface of flexible circuit board.
It should be noted that, flexible circuit board 100', the first hard circuit board 300'' and the second hard circuit board 700'' comprise multilayer dielectric layer and multilayer line layer (layer insulating and one deck line layer are only shown in figure).And the material of the first adhesion layer 200'' and the second adhesion layer 600'' can be acrylic resin (polypropylene, PP).But the present invention is not as limit, the material of the first adhesion layer 200'' and the second adhesion layer 600'' also can be the macromolecular material that other can stick together.
Please continue to refer to Figure 1A, high density intraconnections circuit board 800 is configured at hard circuit board 10 ' ' in, and be electrically connected the first hard circuit board 300'', flexible circuit board 100' and the second hard circuit board 700''.Specifically, rigid-flex module 1 has a second opening h2, and this second opening h2 runs through the first hard circuit board 300'', flexible circuit board 100' and the second hard circuit board 700'' forms.In addition, the cross sectional shape of this second opening h2 can be non-dots symmetrical pattern, such as, be lightning shape, and the cross sectional shape of high density intraconnections circuit board 800 is then identical with the second opening h2.Because the cross sectional shape of the second opening h2 can be non-dots symmetrical pattern, therefore non-dots symmetrical pattern is utilized, high density intraconnections circuit board 800 correctly can put into the second opening h2, the conductive pole 900 of follow-up formation is helped correctly to be electrically connected with the connection pad (pad, figure do not indicate) on high density intraconnections circuit board 800.
It should be noted that, high density intraconnections circuit board 800 is made up of multilayer dielectric layer and line layer.And high density intraconnections circuit board 800 is under fixed thickness, the summation of its circuit number of plies can be greater than hard circuit board 10 ' ', the namely summation of the first hard circuit board 300'', flexible circuit board 100' and the second hard circuit board 700'' number of plies.That is, the line layer dense degree of high density intraconnections circuit board 800 can be greater than hard circuit board 10 ' ' line layer dense degree.In addition, as shown in Figure 1A, in the present embodiment, the quantity of high density intraconnections circuit board 800 is one.But in other embodiments, the quantity of high density intraconnections circuit board 800 also can be greater than one, and the present invention does not limit the quantity of high density intraconnections circuit board 800.
It is worth mentioning that, the present embodiment is that a high density intraconnections circuit board 800 is arranged on hard circuit board 10 ' ' among.In practical operation, high density intraconnections circuit board 800 and hard circuit board 10 ' ' can separately design.Hard circuit board 10 ' ' design can be comparatively simple, and at hard circuit board 10 ' ' in, dig out the second opening h2 in the region needing dense wire to design, the high density intraconnections circuit board 800 designing comparatively dense in addition put into the second opening h2.Compared in prior art, direct design highdensity circuit board is to reach the intensive demand of part circuit, rigid-flex module 1 of the present invention can first be screened above-specified high density intraconnections circuit board, there is bad high density intraconnections circuit be installed in situation in hard circuit board by mistake to reduce, thus impel the lifting of yield.
Please continue to refer to Figure 1A, rigid-flex module 1 also comprise two to increasing layer circuit layer 410 ', 420 ', conductive pole 900 and through hole H.Increase layer circuit layer 410 ' and be positioned at hard circuit board 10 ' ' and the both sides of high density intraconnections circuit board 800.That is, the first hard circuit board 300'', flexible circuit board 100', the second hard circuit board 700'' and high density intraconnections circuit board 800 are positioned at this between increasing layer circuit layer 410 '.Specifically, wherein one increases the side that layer circuit layer 410 ' can be attached at the first hard circuit board 300'' and high density intraconnections circuit board 800, and another increases the opposite side that layer circuit layer 410 ' then can be attached at the second hard circuit board 700'' and high density intraconnections circuit board 800.In addition, increase layer circuit layer 410 ' and kink B can be exposed.
It should be noted that, increase layer circuit layer 410 ' and comprise at least one adhesion material layer and at least one line layer (scheming not shown).The material of adhesion material layer can be acrylic resin or other macromolecular materials that can stick together, but the present invention is not as limit.And increase the both sides that layer circuit layer 420 ' is configured in increasing layer circuit layer 410 ' respectively, and expose kink B.Conductive pole 900 makes increasing layer circuit layer 410 ', increasing layer circuit layer 420 ', high density intraconnections circuit board 800, first hard circuit board 300'' and the second hard circuit board 700'' be electrically connected to each other.The internal wiring that through hole H is through hard circuit board 10 ' then ', in order to be communicated with hard circuit board 10 ' '.
The above is the structure of rigid-flex module 1 in the present embodiment.Next, the manufacture method for rigid-flex module 1 is described in detail.Refer to Figure 1B to Fig. 1 G, Figure 1B to Fig. 1 G is the generalized section of the manufacture method of the rigid-flex module 1 of first embodiment of the invention.
Refer to Figure 1B, first, provide a soft or hard initial substrate 10.Soft or hard initial substrate 10 comprises flexible circuit board 100, a pair release layer 500, first insulation connecting layer 200, first rigid substrate 300, second insulation connecting layer 600 and the second rigid substrate 700.Flexible circuit board 100 comprises an a junction surface A and kink B, and junction surface A is connected with kink B.Release layer 500 is configured on the kink B of flexible circuit board 100 both sides respectively, and covers kink B.First rigid substrate 300 and the second rigid substrate 700 are configured at the both sides of the release layer 500 of flexible circuit board 100 respectively, and cover junction surface A and the kink B of flexible circuit board 100.First insulation connecting layer 200 is connected between the first rigid substrate 300 and flexible circuit board 100, and the second insulation connecting layer 600 is then connected between the second rigid substrate 700 and flexible circuit board 100.
It should be noted that, flexible circuit board 100, first rigid substrate 300 and the second rigid substrate 700 comprise multilayer dielectric layer and multilayer line layer (insulating barrier and a line layer are only shown in figure).
In addition, in the present embodiment, the quantity of kink B is one, and the quantity of junction surface A is two, and kink B is between two junction surface A.But the present invention is not as limit, and in other embodiments, the quantity of junction surface A and kink B can be only one, and junction surface A is connected with kink B.In addition, the quantity of junction surface A and kink B also can be multiple, and kink B can wherein between two junction surface A.
In addition, in the present embodiment, soft or hard initial circuit plate 10 comprises flexible circuit board 100, first rigid substrate 300 and the second rigid substrate 700, and flexible circuit board 100 is between the first rigid substrate 300 and the second rigid substrate 700.But the present invention does not limit the quantity of flexible circuit board 100 and hard circuit board.In other embodiments, soft or hard initial circuit plate 10 only can comprise one deck rigid substrate and one deck flexible circuit board.
Refer to Fig. 1 C, then, in soft or hard initial substrate 10 ', form a pair first opening h1 relative to the position of kink B.As shown in Figure 1 C, wherein through first rigid substrate 300 ' of one first opening h1, the first insulation connecting layer 200 ', to expose the release layer 500 of the wherein side of flexible circuit board 100 '.Another first opening h1 then through second rigid substrate 700 ', the second insulation connecting layer 600 ', to expose the release layer 500 of the other side of flexible circuit board 100 '.That is, the first opening h1 exposes the kink B of flexible circuit board 100 ' both sides.And when forming opening, this can protect the flexible circuit board of kink B position to release layer 500.
It should be noted that, remove part first rigid substrate 300 ', part first insulation connecting layer 200 ', part second insulation connecting layer 600 ', part second rigid substrate 700 ' method comprise and utilize ultraviolet laser, excision forming or stamping forming mode to carry out.In addition, the release layer 500 being positioned at kink B both sides can be used as the protective layer of flexible circuit board 100 ', when carrying out removing step, can avoid destroying flexible circuit board 100 '.
Next, refer to Fig. 1 D, at hard circuit board 10 ' ' in relative to junction surface A position formed one second opening h2.As shown in figure ip, the second opening h2 runs through the first rigid substrate 300 ' ', the first insulation connecting layer 200 ' ', flexible circuit board 100 ' ', the second insulation connecting layer 600 ' ' and the second rigid substrate 700 ' '.It should be noted that, the cross sectional shape of the second opening h2 can be non-point symmetry figure, such as, be lightning shape.In addition, the method forming the second opening h2 can comprise utilize ultraviolet laser (UV laser), the mode of excision forming (routing) or punch forming (punch) is prepared from.Afterwards, form a through hole H in hard circuit board 10 ' ' in, through hole H runs through the first rigid substrate 300 ' ', the first insulation connecting layer 200'', flexible circuit board 100', the second insulation connecting layer 600 ' ' and the second rigid substrate 700 ' '.Through hole H is in order to electrical communication hard circuit board 10 ' ' internal wiring.
Next Fig. 1 E is referred to, by hard circuit board 10 ' ' be positioned on a carrier 20.Carrier 20 has multiple fixture 22, in order to fixing hard circuit board 10 ' ', and fixture 22 can extend to the first hard circuit board 300 ' ' on.The second rigid substrate 700 ' that also having one deck above carrier 20 accompanies pressure material 30 and to increase layer circuit layer 410, and hard circuit board 10 ' ' be namely positioned on carrier 20, and hard circuit board 10 ' ' ' can be attached at and increase on layer circuit layer 410.
It should be noted that, increase layer circuit layer 410 and comprise at least one adhesion material layer and at least one line layer (scheming not shown), and increasing layer circuit layer 410 has the 3rd opening h3 that is parallel to the first opening h1.The material of adhesion material layer can be acrylic resin, but the present invention is not as limit, and the material of adhesion material layer also can be the macromolecular material that other can stick together.In addition, accompany the material of pressure material 30 can be poly terephthalic acid with diester (polyethylene terephthalate, PET), but the present invention is not as limit.Accompany pressure material 30 to be intended for the resilient coating increased between layer circuit layer 410 and carrier 20, stick on carrier 20 to avoid increasing layer circuit layer 410.
Afterwards, high density intraconnections circuit board 800 is put into the second opening h2.It should be noted that, the cross sectional shape of high density intraconnections circuit board 800 is also non-point symmetry pattern, and identical with the cross sectional shape of the second opening h2.So, high density intraconnections circuit board 800 can put into the second opening h2, and aims at the second opening h2.
In addition, high density intraconnections circuit board 800 is also made up of multilayer adhesion layer, insulating barrier and line layer.And the summation of the high density intraconnections circuit board 800 circuit number of plies can be greater than hard circuit board 10 ' ' summation of the circuit number of plies.Hard circuit board 10 ' the summation of the circuit number of plies ' comprise the first rigid substrate 300 ' ', flexible circuit board 100 ' and the second rigid substrate 700 ' ' number of plies summation.In addition, as referring to figure 1e, in the present embodiment, the quantity of high density intraconnections circuit board 800 is one.But the present invention does not limit the quantity of high density intraconnections circuit board 800, in other embodiments, high density intraconnections circuit board 800 also can be greater than one.
It is worth mentioning that, the present embodiment is that a high density intraconnections circuit board 800 is arranged on hard circuit board 10 ' ' among.In practical operation, high density intraconnections circuit board 800 and hard circuit board 10 ' ' can separately design.Hard circuit board 10 ' ' design can be comparatively simple, the number of plies can be less.And at hard circuit board 10 ' ' in, need to dig out the second opening h2 in the region of dense wire design, the high density intraconnections circuit board 800 designing comparatively dense is in addition put into the second opening h2.A highdensity circuit board is directly designed to reach the intensive demand of part circuit in prior art, rigid-flex module 1 of the present invention can first be screened above-specified high density intraconnections circuit board, there is bad high density intraconnections circuit be installed in situation in hard circuit board by mistake to reduce, thus impel the lifting of yield.
Then, another is increased layer circuit layer 410 and is covered in the first rigid substrate 300 ' ' and high density intraconnections circuit board 800 on, make hard circuit board 10 ' ' and high density intraconnections circuit board 800 is positioned among a pair increasing layer circuit layer 410.Afterwards, more other put on the increasing layer circuit layer 410 on upper strata one deck accompany pressure material 30.At this, accompany pressure material 30 in order to the protection resilient coating as increasing layer circuit layer 410.It should be noted that, the fixture 22 of carrier 20 extends to the increasing layer circuit layer 410 on upper strata and accompanies on pressure material 30, and by increasings layer circuit layer 410 and accompany press material 30 to be fixed on hard circuit board 10 ' ' on, in order to follow-up step of sticking together in advance.
Moreover heating increases the adhesion material layer of layer circuit layer 410, and adhesion material layer fills up the first opening h1, and can to hard circuit board 10 ' ' and high density intraconnections circuit board 800 stick together in advance.Adhesion material layer after heating presents half liquefaction and has tackness, and then can by hard circuit board 10 ' ' and high density intraconnections circuit board 800 be temporarily fixed on and increase among layer circuit layer 410.
Next, refer to Fig. 1 F, then remove carrier 20 and accompany pressure material 30, and form a pair increasing layer circuit layer 420 on increasing layer circuit layer 410.Increase layer circuit layer 420 and also comprise at least one adhesion material layer and at least one line layer (scheme not shown, its adhesion layer material is identical with increasing layer circuit layer 410, does not repeat at this).Insulation adhesion layer 410 forms the step increasing layer circuit layer 420 also comprise, increasing layer circuit layer 420 is attached at and increases on layer circuit layer 410, heating afterwards and pressing increases layer circuit layer 420, to be fixed on hard circuit board 10 ' by increasing layer circuit layer 420 ' and the both sides of high density intraconnections circuit board 800.
Heating and adhesion material layer after pressing can form sclerosis and the end-state that cannot reply.It should be noted that, during heating adhesion material layer, part adhesion material layer can flow to the clearance position between high density intraconnections circuit board 800 and the second opening h2, and then makes high density intraconnections circuit board 800 be fixed on hard circuit board 10 ' ' among.
Then, refer to Fig. 1 G, form multiple conductive pole 900.Conductive pole 900 can make to increase layer circuit layer 420, increase layer circuit layer 410, hard circuit board 10 ' ' and high density intraconnections circuit board 800 be electrically connected to each other.
Then, please again consult Figure 1A, remove release layer 500 to expose the kink B of flexible circuit board 100 ' both sides, form rigid-flex module 1.Because the kink B of flexible circuit board 100 ' comes out, therefore rigid-flex module 1 can bend, to reach the effect of rigid-flex.
Summing up above-mentioned, in the first embodiment of the invention, is first form the first opening h1, the second opening h2, then carries out increasing the step of layer, to be formed at hard circuit board 10 ' by increasing layer circuit layer 410,420 ' both sides, to form rigid-flex module 1.
Fig. 2 A to Fig. 2 B is the generalized section of the manufacture method of the rigid-flex module 1 of second embodiment of the invention.Refer to Fig. 2 A, the step of Fig. 2 A is the Figure 1B that continues, and namely provides the step after soft or hard initial substrate 10.It should be noted that, the structure of the soft or hard initial substrate 10 in Fig. 2 A is roughly the same with previous embodiment.
In the present embodiment, after a soft or hard initial substrate 10 is provided, can be first at hard circuit board 10 ' ' a middle formation one second opening h2 and through hole H.Second opening h2 is relatively formed at the position of junction surface A.Second opening h2 runs through the first rigid substrate 300 ' ', the first insulation connecting layer 200 ' ', flexible circuit board 100 ' ', the second insulation connecting layer 600 ' ' and the second rigid substrate 700 ' '.And the cross sectional shape of the second opening h2 and formation method roughly identical with previous embodiment.In addition, the generation type of through hole H is also identical with previous embodiment, does not repeat at this.
Then, Fig. 2 B is referred to, by hard circuit board 10 ' ' be positioned on a carrier 20, carrier 20 has multiple fixture 22, in order to fixing hard circuit board 10 ' '.The second rigid substrate 700 ' that also having one deck above carrier 20 accompanies pressure material 30 and to increase layer circuit layer 410, and hard circuit board 10 ' ' be namely positioned on carrier 20, and hard circuit board 10 ' ' ' be attached at and increase on layer circuit layer 410.
Afterwards, high density intraconnections circuit board 800 is put into the second opening h2.It should be noted that, the cross sectional shape of high density intraconnections circuit board 800 can be identical with the cross sectional shape of the second opening h2.Thus, high density intraconnections circuit board 800 can put into the second opening h2, and can aim at the second opening h2.Then, as shown in Figure 2 B, another increased layer circuit layer 410 and accompany pressure material 30 to be covered in the first rigid substrate 300 ' ' and high density intraconnections circuit board 800 on.And heat, make hard circuit board 10 ' ' and high density intraconnections circuit board 800 be first fixed on and increase among layer circuit layer 410.
Moreover, refer to Figure 1A, increasing layer circuit layer 410 forms a pair increasing layer circuit layer 420.Heating afterwards and pressing increases layer circuit layer 420 to be fixed on hard circuit board 10 ' by increasing layer circuit layer 420 ', high density intraconnections circuit board 800 and increase the both sides of layer circuit layer 410.Then, form multiple conductive pole 900, make to increase layer circuit layer 420, increase layer circuit layer 410, hard circuit board 10 ' ' and high density intraconnections circuit board 800 be electrically connected to each other.
Finally, in soft or hard initial substrate 10 ', a pair first opening h1 are formed relative to the position of kink B.And this can expose the kink B of flexible circuit board 100 both sides to the first opening h1, form rigid-flex module 1.The method forming the first opening h1 can comprise and utilizes ultraviolet laser (UVlaser), excision forming (routing) or punch forming (punch).In addition, because flexible circuit board 100 ' exposes kink B, therefore rigid-flex module 1 can bend, to reach the effect of rigid-flex.
Sum up above-mentioned, in second embodiment of the invention, first can form the second opening h2, then carry out increasing the step of layer, to be formed at hard circuit board 10 ' by increasing layer circuit layer 410,420 ' both sides.Finally, then form a pair first opening h1 to expose the kink B of hard circuit board 100 both sides, to form rigid-flex module 1.
It should be noted that, first embodiment of the invention is that pressing has the build-up circuit layer 410 of opening again after formation first opening, so be comparatively applicable to that there is thicker first rigid substrate 300 ' ' rigid-flex module 1, reducing when forming opening, causing because thickness is thicker opening precision to decline or producing the probability of error.And the second embodiment, only form the first opening h1 in last step for the position of the first opening h1.Therefore be comparatively applicable to that there is thinner first rigid substrate 300 ' ' rigid-flex module 1.
In addition, the difference of second embodiment of the invention and the first embodiment is formation first opening h1, the second opening h2 and increases the order of layer step.And the structure of other detail characteristics such as high density intraconnections circuit board 800 is made peace greatly, previous embodiment is identical, does not repeat at this.
Fig. 3 is the generalized section of the rigid-flex module 1 ' of third embodiment of the invention.Refer to Fig. 3, the structure of rigid-flex module 1 ' is roughly identical with the rigid-flex module 1 of previous embodiment, also comprises hard circuit board 10 ' ', high density intraconnections circuit board 800 ', two is to increasing layer circuit layer 410 ', 420 ' and multiple conductive pole 900.And hard circuit board 10 ' ' also comprise flexible circuit board 100 ', the first adhesion layer 200 ' ', the first hard circuit board 300 ' ', the second adhesion layer 600 ' ', the second hard circuit board 700 ' '.
But be different from rigid-flex module 1, the rigid-flex module 1 ' of the present embodiment has one second opening h2 ', and the second opening h2 ' runs through the first hard circuit board 300 ' ' and the first adhesion layer 200 ' '.And high density intraconnections circuit board 800 ' can put into the second opening h2 ', and aim at the second opening h2 '.The summation of the number of plies that it should be noted that, the summation of high density intraconnections circuit board 800 ' the circuit number of plies is greater than the first hard circuit board 300 ' ' and the first adhesion layer 200 ' '.That is, the line layer dense degree that the line layer dense degree of high density intraconnections circuit board 800 ' is greater than the first hard circuit board 300 ' ' and the first adhesion layer 200 ' '.
In addition, in other embodiments, the second opening h2 ' also can run through the second adhesion layer 600 ' ' and the second hard circuit board 700 ' '.The summation that the summation of the circuit number of plies of high density intraconnections circuit board 800' is then greater than the second hard circuit board 700 ' ' and the second adhesion layer 600 ' '.The present invention does not limit the position of high density intraconnections circuit board 800 '.
In sum, the invention provides the manufacture method of a kind of rigid-flex module and rigid-flex module.Described rigid-flex module comprises a hard circuit board and a high density intraconnections circuit board.High density intraconnections circuit board is arranged in hard circuit board, and is positioned at the region needing dense wire to design.Because high density intraconnections circuit board and hard circuit board can separately design, the Yield lmproved of rigid-flex module therefore can be helped.
The foregoing is only embodiments of the invention, it is also not used to limit scope of patent protection of the present invention.Any those skilled in the art, not departing from spirit of the present invention and scope, the equivalence of the change done and retouching is replaced, and is still in scope of patent protection of the present invention.
Claims (11)
1. a rigid-flex module, is characterized in that, described rigid-flex module comprises:
One hard circuit board, comprising:
One flexible circuit board, comprises a kink and a junction surface be connected with described kink;
One first hard circuit board, is configured on described junction surface, and exposes described kink, and wherein said first hard circuit board and described flexible circuit board are electrically connected;
One first adhesion layer, is connected between described first hard circuit board and described junction surface; And
One high density intraconnections circuit board, is configured in described first hard circuit board, and is electrically connected with described first hard circuit board, and wherein under fixed thickness, the number of plies summation of described high density intraconnections circuit board is greater than the number of plies summation of described hard circuit board.
2. rigid-flex module according to claim 1, is characterized in that, described rigid-flex module also comprises:
At least one pair of increases layer circuit layer, and described increasing layer circuit layer is positioned at the both sides of described hard circuit board and described both high density intraconnections circuit boards; And
Many conductive poles, described conductive pole makes described increasing layer circuit layer, described high density intraconnections circuit board and described first hard circuit board be electrically connected.
3. rigid-flex module according to claim 1 and 2, is characterized in that, described hard circuit board also comprises:
One second hard circuit board, described second hard circuit board to be configured on described junction surface and to expose described kink, and described flexible circuit board is between described first hard circuit board and described second hard circuit board; And
One second adhesion layer, described second adhesion layer is connected between described second hard circuit board and described junction surface.
4. rigid-flex module according to claim 3, it is characterized in that, described high density intraconnections circuit board arrangement is in described first hard circuit board, described flexible circuit board and described second hard circuit board, and described high density intraconnections circuit board is electrically connected described first hard circuit board, described flexible circuit board and described second hard circuit board.
5. rigid-flex module according to claim 1, is characterized in that, described junction surface is multiple, and described bending part is in wherein between two described junction surfaces.
6. a manufacture method for rigid-flex module, is characterized in that, the manufacture method of described rigid-flex module comprises:
There is provided a soft or hard initial substrate, described soft or hard initial substrate comprises a flexible circuit board, a pair release layer, one first rigid substrate and one first insulation connecting layer,
Wherein said flexible circuit board comprises a kink and a junction surface be connected with described kink, described release layer be configured in respectively be positioned at described flexible circuit board both sides kink on and cover described kink, and described first rigid substrate to be configured on described flexible circuit board and described release layer and to cover described kink and described junction surface, described first insulation connecting layer is connected between described first rigid substrate and described flexible circuit board;
In described soft or hard initial substrate, form a pair first openings, wherein said first opening exposes described kink;
In described soft or hard initial substrate, form one second opening, wherein said second opening runs through described first rigid substrate and described first insulation connecting layer and is formed;
A high density intraconnections circuit board is placed in described second opening;
The both sides of described soft or hard initial substrate are formed a pair increasing layer circuit layer, and wherein said increasing layer circuit layer covers the both sides of described high density intraconnections circuit board and described soft or hard initial substrate;
Form many conductive poles, wherein said conductive pole makes described increasing layer circuit layer, described high density intraconnections circuit board and described soft or hard initial substrate be electrically connected.
7. the manufacture method of rigid-flex module according to claim 6, is characterized in that, described soft or hard initial substrate also comprises:
One second rigid substrate, be configured on described flexible circuit board, and described flexible circuit board is between described first rigid substrate and described second rigid substrate; And
One second insulation connecting layer, is connected between described second rigid substrate and described junction surface.
8. the manufacture method of rigid-flex module according to claim 7, it is characterized in that, described second opening runs through described first rigid substrate, described first insulation connecting layer, described flexible circuit board, described second insulation connecting layer and described second rigid substrate and is formed.
9. a manufacture method for rigid-flex module, is characterized in that, the manufacture method of described rigid-flex module comprises:
There is provided a soft or hard initial substrate, described soft or hard initial substrate comprises a flexible circuit board, a pair release layer, one first rigid substrate and one first insulation connecting layer,
Wherein said flexible circuit board comprises a kink and a junction surface be connected with described kink, described release layer be configured in respectively be positioned at described flexible circuit board both sides kink on and cover described kink, and described first rigid substrate to be configured on described flexible circuit board and described release layer and to cover described kink and described junction surface, described first insulation connecting layer is connected between described first rigid substrate and described flexible circuit board;
Described soft or hard initial substrate forms one second opening, and wherein said second opening runs through described first rigid substrate and described first insulation connecting layer and formed;
A high density intraconnections circuit board is placed in described second opening;
The both sides of described soft or hard initial substrate are formed a pair increasing layer circuit layer, and wherein said increasing layer circuit layer covers the both sides of described high density intraconnections circuit board and described soft or hard initial substrate;
Form many conductive poles, wherein said conductive pole makes described increasing layer circuit layer, described high density intraconnections circuit board and described soft or hard initial substrate be electrically connected; And
After the described increasing layer circuit layer of formation and described conductive pole, remove described first rigid substrate of the part be positioned at above described kink, described first insulation connecting layer of part and the described increasing layer circuit layer of part;
Described soft or hard initial substrate forms a pair first openings, and wherein said first opening exposes described kink.
10. the manufacture method of rigid-flex module according to claim 9, is characterized in that, described soft or hard initial substrate also comprises:
One second rigid substrate, described second rigid substrate is configured on described flexible circuit board, and described flexible circuit board is between described first rigid substrate and described second rigid substrate; And
One second insulation connecting layer, described second insulation connecting layer is connected between described second rigid substrate and described junction surface.
The manufacture method of 11. rigid-flex modules according to claim 10, it is characterized in that, described second opening runs through described first rigid substrate, described first insulation connecting layer, described flexible circuit board, described second insulation connecting layer and described second rigid substrate and is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310392841.7A CN104427761A (en) | 2013-09-02 | 2013-09-02 | Flexible and hard circuit board module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310392841.7A CN104427761A (en) | 2013-09-02 | 2013-09-02 | Flexible and hard circuit board module and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104427761A true CN104427761A (en) | 2015-03-18 |
Family
ID=52975368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310392841.7A Pending CN104427761A (en) | 2013-09-02 | 2013-09-02 | Flexible and hard circuit board module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104427761A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578753A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and manufacturing method thereof |
| CN106211575A (en) * | 2015-05-26 | 2016-12-07 | 景硕科技股份有限公司 | Carrier plate structure with magnetic induction coil and soft board |
| CN106373939A (en) * | 2016-11-18 | 2017-02-01 | 江阴长电先进封装有限公司 | Structure of package substrate and packaging method thereof |
| CN106373938A (en) * | 2016-11-18 | 2017-02-01 | 江阴长电先进封装有限公司 | Structure of hybrid-density package substrate and packaging method thereof |
| CN112566368A (en) * | 2019-09-25 | 2021-03-26 | 欣兴电子股份有限公司 | Soft and hard composite circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201112888A (en) * | 2009-09-16 | 2011-04-01 | Unimicron Technology Corp | Circuit board structure |
| CN102246608A (en) * | 2008-12-08 | 2011-11-16 | 揖斐电株式会社 | Wiring board and method for manufacturing same |
| CN102256438A (en) * | 2011-05-09 | 2011-11-23 | 厦门市英诺尔电子科技有限公司 | Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN102510679A (en) * | 2011-11-02 | 2012-06-20 | 上海美维电子有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
-
2013
- 2013-09-02 CN CN201310392841.7A patent/CN104427761A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102246608A (en) * | 2008-12-08 | 2011-11-16 | 揖斐电株式会社 | Wiring board and method for manufacturing same |
| TW201112888A (en) * | 2009-09-16 | 2011-04-01 | Unimicron Technology Corp | Circuit board structure |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN102256438A (en) * | 2011-05-09 | 2011-11-23 | 厦门市英诺尔电子科技有限公司 | Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof |
| CN102510679A (en) * | 2011-11-02 | 2012-06-20 | 上海美维电子有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211575A (en) * | 2015-05-26 | 2016-12-07 | 景硕科技股份有限公司 | Carrier plate structure with magnetic induction coil and soft board |
| CN106211575B (en) * | 2015-05-26 | 2018-12-18 | 景硕科技股份有限公司 | Carrier plate structure with magnetic induction coil and soft board |
| CN105578753A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and manufacturing method thereof |
| CN106373939A (en) * | 2016-11-18 | 2017-02-01 | 江阴长电先进封装有限公司 | Structure of package substrate and packaging method thereof |
| CN106373938A (en) * | 2016-11-18 | 2017-02-01 | 江阴长电先进封装有限公司 | Structure of hybrid-density package substrate and packaging method thereof |
| CN106373938B (en) * | 2016-11-18 | 2019-02-26 | 江阴长电先进封装有限公司 | A kind of structure and its packaging method of hybrid density package substrate |
| CN106373939B (en) * | 2016-11-18 | 2019-04-19 | 江阴长电先进封装有限公司 | A kind of structure and its packaging method of package substrate |
| CN112566368A (en) * | 2019-09-25 | 2021-03-26 | 欣兴电子股份有限公司 | Soft and hard composite circuit board |
| CN112566368B (en) * | 2019-09-25 | 2022-04-19 | 欣兴电子股份有限公司 | Soft and hard composite circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9900997B2 (en) | Manufacturing method of a rigid flex board module | |
| CN104427761A (en) | Flexible and hard circuit board module and manufacturing method thereof | |
| CN104349575B (en) | Flexible PCB and preparation method thereof | |
| CN203608443U (en) | Printed circuit and electronic module provided with same | |
| CN102577647A (en) | Circuit board | |
| CN110337178A (en) | A kind of circuit board assemblies and electronic equipment | |
| US9807877B1 (en) | Method for making a multilayer flexible printed circuit board | |
| CN205584642U (en) | Resin multilayer substrate | |
| CN102223753B (en) | Circuit board and production method thereof | |
| EP3430469B1 (en) | Flexible circuit board, array substrate, fabricating method thereof, and display apparatus | |
| CN205093051U (en) | Built -in base plate of part and communication module | |
| CN101483977B (en) | Circuit board and manufacturing method thereof | |
| CN101131919B (en) | Method of forming an insulative film | |
| CN101340775B (en) | Flexible circuit board and manufacturing method thereof | |
| CN102804937A (en) | Light-emitting device | |
| CN103098565A (en) | Substrate with built-in components | |
| CN104966709A (en) | Packaging substrate and manufacturing method therefor | |
| CN104661428A (en) | Double-sided flexible circuit board and manufacturing method thereof | |
| CN203352937U (en) | Flexible circuit board | |
| CN102883520B (en) | Flexible circuit board | |
| CN100584155C (en) | Manufacture process for substrate of internally embedded element | |
| CN107634078B (en) | Bottom plate of camera module and camera module | |
| CN103596355A (en) | Double-layer flexible printed circuit board | |
| CN103957657B (en) | FPC and the optical module with the FPC | |
| TWI793897B (en) | Circuit board assembly and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150318 |