CN103596355A - Double-layer flexible printed circuit board - Google Patents

Double-layer flexible printed circuit board Download PDF

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Publication number
CN103596355A
CN103596355A CN201310510896.3A CN201310510896A CN103596355A CN 103596355 A CN103596355 A CN 103596355A CN 201310510896 A CN201310510896 A CN 201310510896A CN 103596355 A CN103596355 A CN 103596355A
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China
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circuit board
flexible circuit
plurality
insulating
conductive
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CN201310510896.3A
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Chinese (zh)
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丛国芳
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溧阳市东大技术转移中心有限公司
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Priority to CN201310510896.3A priority Critical patent/CN103596355A/en
Publication of CN103596355A publication Critical patent/CN103596355A/en

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Abstract

The invention discloses a double-layer flexible printed circuit board which structurally comprises a first flexible printed circuit board and a second flexible printed circuit board. The first flexible printed circuit board is a single-face flexible printed circuit board and comprises a first base material portion, a plurality of first conductive patterns, a plurality of first insulation protruding blocks and first counterpoint holes, wherein the first conductive patterns cover the surface of the first base material portion, and the first insulation protruding blocks are arranged between the first conductive patterns. The second flexible printed circuit board is a double-face flexible printed circuit board and comprises a second base material portion, a plurality of second conductive patterns, a plurality of third conductive patterns, a plurality of second insulation protruding blocks, an insulation layer and second counterpoint holes, wherein the second conductive patterns cover the first face of the second base material portion, the third conductive patterns cover the second surface of the second base material portion, the second insulation protruding blocks are arranged between the second conductive patterns, and the insulation layer completely covers the second surface and covers the third conductive patterns. The first flexible printed circuit board and the second flexible printed circuit board are combined together through a conductive adhesive.

Description

一种双层柔性电路板 A two-layer flexible circuit board

技术领域 FIELD

[0001] 本发明涉及一种印刷电路板领域,特别是涉及一种双层柔性电路板。 [0001] The present invention relates to a printed circuit board, and more particularly, to a two-layer flexible circuit board.

背景技术 Background technique

[0002] 柔性电路板由于其特殊的可弯折性质,因此大量的应用于便携式电子设备中。 [0002] The flexible circuit board may be bent due to its special nature, the large number of portable electronic device is applied. 双层柔性电路板是将多片具有导电图案的柔性电路板结合在一起的电路电路板结构。 Layer flexible circuit board is a circuit board structure that combine multiple pieces of the flexible circuit board having a conductive pattern. 通过双层柔性电路板,可以将电子设备小型化。 Through the double flexible circuit board, the electronic device can be miniaturized.

[0003] 但现有技术中,双层柔性电路板通常都通过连接器进行连接,这种连接方式不仅制造过程复杂、成本无法降低,而且更重要的是,由于多出了连接器,因此对双层柔性电路板的进一步小型化受到了限制。 [0003] However, the prior art, two-layer flexible circuit board are generally carried out by connectors, this connection is not only complicated manufacturing process, the cost can not be reduced, and more importantly, because of the extra connector, therefore further miniaturization layer flexible circuit board is limited.

发明内容 SUMMARY

[0004] 本发明针对现有技术存在的问题,提出了一种双层柔性电路板,该柔性电路板能够无需连接器进行连接,因而可以实现进一步的小型化。 [0004] The present invention is directed to the problem of the prior art, proposes a two-layer flexible circuit board, the flexible circuit board can be connected without a connector, it is possible to achieve further downsizing.

[0005] 本发明提出的双层柔性电路板,具有如下的结构: [0005] The present invention is made of two-layer flexible circuit board has the following structure:

[0006] 双层柔性电路板包括第一柔性电路板和第二柔性电路板,所述第一柔性电路板是单面柔性电路板,其包括第一基材部、覆盖第一基材部表面的多个第一导电图案、多个第一导电图案之间的多个第一绝缘凸块以及第一对位孔; [0006] a first layer flexible circuit board comprises a flexible circuit board and a second flexible circuit board, the first single-sided flexible circuit board is a flexible circuit board including a first base portion, the base portion covering the first surface a plurality of first conductive patterns, the first plurality of insulating blocks between the first conductive pattern and a first plurality of alignment holes;

[0007] 第二柔性电路板是双面柔性电路板,其包括第二基材部、分别覆盖第一基材部第一面的多个第二导电图案、覆盖第一基材部第二表面的多个第三导电图案、多个第二导电图案之间的多个第二绝缘凸块、完全覆盖所述第二表面并且覆盖多个第三导电图案的绝缘层,以及第二对位孔; [0007] The second flexible circuit board is a double-sided flexible circuit board including a second base portion, respectively covering the plurality of the first surface of the first base portion of the second conductive pattern covering the second surface of the first base portion a plurality of third conductive pattern, a plurality of second conductive patterns between the plurality of second insulating projections, and completely covers the surface of the second insulating layer covering the plurality of third conductive pattern and a second alignment hole ;

[0008] 其中,所述第一柔性电路板和第二柔性电路板通过导电粘合剂结合在一起; [0008] wherein said first flexible circuit board and the second flexible circuit board bonded together by a conductive adhesive;

[0009] 其中,第一柔性电路板的第一对位孔和第二柔性电路板的第二对位孔对齐,所述第一柔性电路板的多个第一导电图案通过导电粘合剂与所述第二柔性电路板的多个第二导电图案对应粘合在一起,以共同构成多个互连结构,每个互连结构之间由对应的第一绝缘凸块和第二绝缘凸块电隔离;其中,第一绝缘凸块的高度至少大于第一导电图案的高度,第二绝缘凸块的高度至少大于第二导电图案的高度;优选地,第一绝缘凸块的高度至少为第一导电图案的高度的120% ;第二绝缘凸块的高度至少为第二导电图案的高度的120%,第一绝缘凸块的宽度与多个第一导电图案之间的距离相同,第二绝缘凸块的宽度与多个第二导电图案之间的距离也相同。 [0009] wherein the second alignment hole of the first alignment hole and the second flexible circuit board is aligned with a first flexible circuit board, a plurality of the first flexible circuit board is a first conductive pattern via a conductive adhesive and the plurality of second flexible circuit board corresponding to the second conductive pattern bonded together to constitute a plurality of interconnect structures, each interconnect structure between the corresponding first and second insulating blocks insulating blocks electrical isolation; wherein the height of the first insulation bump height greater than at least a first conductive pattern, the second insulating bump height at least greater than the height of the second conductive pattern; highly preferably, the first insulating at least a first bump 120% of the height of a conductive pattern; bump height of the second insulating at least 120% of the height of the second conductive pattern, the same width of the first insulating distance between the bump and the plurality of first conductive patterns, the second width of the insulating distance between the bump and the second plurality of conductive patterns are the same.

[0010] 其中,所述第一和第二基材部由聚脂薄膜形成,例如聚酰亚胺、聚酰亚胺酰亚胺或聚乙烯萘甲醛; [0010] wherein said first and second base portion is formed of a polyester film, such as polyimide, polyethylene naphthalate or polyimide, polyimide formaldehyde;

[0011] 导电粘合剂由导电颗粒、粘合树脂、固化剂以及溶解剂组成;所述导电颗粒为纳米级导电颗粒,导电颗粒例如是银、镍或铜,粒径为100-200纳米;所述粘合树脂例如是聚酯树脂、环氧树脂或聚酰亚胺树脂;当聚酯树脂被用作粘合树脂时,固化剂选择异氰酸盐化合物;当环氧树脂用作粘合树脂时,固化剂选择胺化合物或咪唑化合物;溶解剂例如是纤维素溶剂或丁基卡必醇醋酸盐。 [0011] The conductive particles of the conductive adhesive, the binder resin, curing agent, and a dissolving agent composition; said electrically conductive particles are nano-scale conductive particles, electrically conductive particles such as silver, nickel or copper, a particle size of 100-200 nm; the binder resin such as polyester resin, epoxy resin or polyimide resin; when the polyester resin is used as the binder resin, the curing agent is the isocyanate compound selected; when used as an adhesive epoxy resin resin, a curing agent of amine compound or imidazole compound; dissolving agent, for example, cellosolve acetate or butyl carbitol.

[0012]其中,所述第一绝缘凸块、第二绝缘凸块以及绝缘层皆为绝缘树脂。 [0012] wherein said first insulating block, a second insulating layer and the insulating blocks are all the insulating resin.

附图说明 BRIEF DESCRIPTION

[0013] 图1-3为本发明提出的双层柔性电路板的剖面示意图。 [0013] Figures 1-3 present a schematic cross-sectional view of the two-layer flexible circuit board proposed by the invention.

具体实施方式 Detailed ways

[0014] 参见图1-3,本发明提出的双层柔性电路板,具有如下的结构: [0014] Referring to FIG 1-3, the present invention proposes two-layer flexible circuit board has the following structure:

[0015] 双层柔性电路板包括第一柔性电路板和第二柔性电路板,所述第一柔性电路板是单面柔性电路板,其包括第一基材部100、覆盖第一基材部100表面的多个第一导电图案101、多个第一导电图案101之间的多个第一绝缘凸块104以及第一对位孔105 ; [0015] a first layer flexible circuit board comprises a flexible circuit board and a second flexible circuit board, the first single-sided flexible circuit board is a flexible circuit board including a first base portion of the first base portion 100, cover a plurality of first conductive patterns 100 of the surface 101, a plurality of first insulating projections 104 between the first conductive pattern 101 and a first plurality of alignment holes 105;

[0016] 第二柔性电路板是双面柔性电路板,其包括第二基材部200、分别覆盖第一基材部200第一面的多个第二导电图案201、覆盖第一基材部200第二表面的多个第三导电图案202、多个第二导电图案201之间的多个第二绝缘凸块204、完全覆盖所述第二表面并且覆盖多个第三导电图案202的绝缘层203,以及第二对位孔205 ; [0016] The second flexible circuit board is a double-sided flexible circuit board including a second base portion 200, first surface 200 covering the plurality of first base portion of the second conductive patterns 201, respectively, covering the first base portion a plurality of second surface 200 of the third conductive pattern 202, a plurality of a plurality of second conductive pattern 201 between the second insulating block 204, fully covering the second surface of the insulating cover and the plurality of third conductive pattern 202 layer 203, and a second alignment hole 205;

[0017] 其中,所述第一柔性电路板和第二柔性电路板通过导电粘合剂300结合在一起; [0017] wherein said first flexible circuit board and the second flexible circuit board 300 joined together by a conductive adhesive;

[0018] 其中,第一柔性电路板的第一对位孔105和第二柔性电路板的第二对位孔205对齐,所述第一柔性电路板的多个第一导电图案101通过导电粘合剂300与所述第二柔性电路板的多个第二导电图案201 —一对应粘合在一起,以共同构成多个互连结构,每个互连 [0018] wherein the second alignment hole of the first alignment hole 105 and the second flexible circuit board 205 of the first flexible circuit board is aligned, the plurality of the first flexible circuit board is a first conductive pattern 101 by conductive adhesive a plurality of agent 300 of the second flexible circuit board and a second conductive pattern 201-- corresponding to a bonded together to constitute a plurality of interconnect structures, each interconnect

结构之间由--对应的第一绝缘凸块104和第二绝缘凸块204电隔离;其中,第一绝缘凸 Between the structure - corresponding to a first bump 104 and a second insulating bumps 204 electrically insulating spacer; wherein the first insulating

块104的高度至少大于第一导电图案101的高度,第二绝缘凸块204的高度至少大于第二导电图案201的高度;优选地,第一绝缘凸块104的高度至少为第一导电图案101的高度的120% ;第二绝缘凸块204的高度至少为第二导电图案201的高度的120%,第一绝缘凸块104的宽度与多个第一导电图案201之间的距离相同,第二绝缘凸块204的宽度与多个第二导电图案201之间的距离也相同。 Height greater than a height of at least 104 blocks a first conductive pattern 101, the height of the second insulating bumps 204 is greater than the height of at least a second conductive pattern 201; Highly preferably, the first insulating protrusion 104 is at least a first conductive pattern 101 120% of the height; the height of the second insulating bumps 204 is at least 120% of the height of the second conductive pattern 201, the distance between the same and the width 201 of the first conductive pattern of the first plurality of insulating blocks 104, the first the width of the two insulating blocks 204 and the distance between the plurality of second conductive patterns 201 are also the same.

[0019] 其中,所述第一基材部100和第二基材部200由聚脂薄膜形成,例如聚酰亚胺、聚酰亚胺酰亚胺或聚乙烯萘甲醛; [0019] wherein the first substrate portion 100 and the second substrate portion 200 is formed of a polyester film, such as polyimide, polyethylene naphthalate or polyimide, polyimide formaldehyde;

[0020] 导电粘合剂300由导电颗粒、粘合树脂、固化剂以及溶解剂组成;所述导电颗粒为纳米级导电颗粒,导电颗粒例如是银、镍或铜,粒径为100-200纳米;所述粘合树脂例如是聚酯树脂、环氧树脂或聚酰亚胺树脂;当聚酯树脂被用作粘合树脂时,固化剂选择异氰酸盐化合物;当环氧树脂用作粘合树脂时,固化剂选择胺化合物或咪唑化合物。 [0020] The conductive particles of the conductive adhesive 300, an adhesive resin, curing agent, and a dissolving agent composition; said electrically conductive particles are nano-scale conductive particles, electrically conductive particles such as silver, nickel or copper, diameter of 100 to 200 nanometers ; for example, the binder resin is a polyester resin, an epoxy resin or polyimide resin; when the polyester resin is used as the binder resin, the curing agent is the isocyanate compound selected; when used as an epoxy resin adhesive when the resin, the curing agent of amine compound or imidazole compound. 溶解剂例如是纤维素溶剂或丁基卡必醇醋酸盐。 Cellulose dissolving agent such as a solvent or butyl carbitol acetate.

[0021] 其中,所述第一绝缘凸块104、第二绝缘凸块204以及绝缘层203皆为绝缘树脂层。 [0021] wherein said first insulating blocks 104, block 204 and the second insulating layer 203 are both insulating resin insulating layer.

[0022] 下面介绍本发明提出的双层柔性电路板的制造方法,所述方法依次包括如下步骤: [0022] The following describes the method of manufacturing a double-layer flexible circuit board made according to the present invention, the method comprises the steps of sequentially:

[0023] 依次包括如下步骤: [0023] comprising the steps of sequentially:

[0024] (I)在第一柔性电路板具有多个第一导电图案101的表面旋涂导电粘合剂300,在具有多个第二导电图案201的第二柔性电路板的表面旋涂导电粘合剂300 ;[0025] (2)使第一柔性电路板的第一对位孔105与第二柔性电路板的第二对位孔205的对齐后,将第一柔性电路板和第二柔性电路板粘合在一起; [0024] (I) having a plurality of first conductive patterns 101 of the surface of the spin-coating a conductive adhesive 300 in the first flexible circuit board, the electrically conductive surface having a plurality of spin-coating a second conductive pattern of the second flexible circuit board 201 adhesive 300; the [0025] (2) a first alignment hole of the second alignment hole 105 and the second flexible circuit board is aligned with a first flexible circuit board 205, the first and second flexible circuit board a flexible circuit board bonded together;

[0026] (3)将粘合后的第一柔性电路板和第二柔性电路板放入烘烤箱中加热,从而使得导电粘合剂300固化。 [0026] (3) After the adhesive first flexible circuit board and the second flexible circuit board in a heated baking in the oven, so that the conductive adhesive 300 is cured.

[0027] 其中,步骤(3)的加热温度为100-150摄氏度,加热时间为0.5-1小时。 [0027] wherein, in step (3) is a heating temperature of 100 to 150 degrees Celsius, the heating time was 0.5-1 hours.

[0028] 本发明提出的双层柔性电路板,第一柔性电路板和第二柔性电路板通过导电粘合剂300直接连接,因此无需通过连接器将第一柔性电路板连接到第二柔性电路板,因而能够简化第一柔性电路板连接到第二柔性电路板的结构,并且由于在第一柔性电路板的多个第一导电图案之间以及第二柔性电路板的多个第二导电图案之间分别具有多个第一绝缘凸块和多个第二绝缘凸块,通过导电粘合剂将第一柔性电路板和第二柔性电路板结合时,由第一绝缘凸块和第二绝缘凸块即可形成电隔离;因此导电粘合剂无需通过丝网印刷的方式涂覆在第一柔性电路板上,仅需通过旋涂的方式涂覆在第一柔性电路板上即可,旋涂的方式免去了需丝网印刷过程中将丝网与电路板对准的过程,因此导电粘合剂的涂覆效率更高,利于大规模的生产。 [0028] The present invention is made of two-layer flexible circuit board, a first flexible circuit board and the second flexible circuit board 300 is directly connected by a conductive adhesive, thereby eliminating the need of the first flexible circuit board is connected to the circuit via the second flexible connector plate, it is possible to simplify the structure of the first flexible circuit board connected to the second flexible circuit board, and since the first flexible circuit board between a plurality of first conductive pattern and a plurality of second flexible circuit board second conductive pattern when insulation between each having a first plurality of projections and a plurality of second insulating bumps, conductive adhesive bonding the first flexible circuit board and the second flexible circuit board, the first and second insulating blocks insulating forming bumps to electrically isolate; therefore without the electrically conductive adhesive applied by screen printing method on the first flexible circuit board, only by way of spin coating coated on the first flexible circuit board to spin coating process embodiment eliminates the need to screen the screen printing process will aligned with the circuit board, thus higher coating efficiency of a conductive adhesive, facilitate large-scale production.

[0029] 至此已对本发明做了详细的说明,但前文的描述的实施例仅仅只是本发明的优选实施例,其并非用于限定本发明。 [0029] The present invention has been done so far described in detail, but merely a preferred embodiment of the present invention, the foregoing embodiment described, it is not intended to limit the present invention. 本领域技术人员可对本发明做任何的修改,而本发明的保护范围由所附的权利要求来限定。 Those skilled in the art can make any modifications to the present invention, the scope of the invention be defined by the appended claims.

Claims (3)

1.一种双层柔性电路板,具有如下的结构:包括第一柔性电路板和第二柔性电路板,所述第一柔性电路板是单面柔性电路板,其包括第一基材部、覆盖第一基材部表面的多个第一导电图案、多个第一导电图案之间的多个第一绝缘凸块以及第一对位孔; 第二柔性电路板是双面柔性电路板,其包括第二基材部、分别覆盖第一基材部第一面的多个第二导电图案、覆盖第一基材部第二表面的多个第三导电图案、多个第二导电图案之间的多个第二绝缘凸块、完全覆盖所述第二表面并且覆盖多个第三导电图案的绝缘层,以及第二对位孔; 其中,所述第一柔性电路板和第二柔性电路板通过导电粘合剂结合在一起。 A two-layer flexible circuit board has the following structure: a flexible circuit board comprises a first and a second flexible circuit board, said first flexible circuit board is single-sided flexible circuit board comprises a first base portion, covering the first surface of the base portion of the first plurality of conductive patterns, a plurality of first bumps and a first insulating alignment holes between the plurality of first conductive patterns; the second flexible circuit board is a double-sided flexible circuit board, a second portion comprising a base, a plurality of second conductive patterns respectively cover a first surface of the first base portion, a plurality of covering the surface of the second portion of the third conductive pattern of the first base, a second plurality of conductive patterns a second plurality of insulation between the bumps, and completely covers the surface of the second insulating layer covering the plurality of third conductive pattern and a second alignment hole; wherein said first flexible circuit board and the second flexible circuit plates bonded together by a conductive adhesive.
2.如权利要求1所述的双层柔性电路板,其特征在于: 其中,第一柔性电路板的第一对位孔和第二柔性电路板的第二对位孔对齐,所述第一柔性电路板的多个第一导电图案通过导电粘合剂与所述第二柔性电路板的多个第二导电图案一一对应粘合在一起,以共同构成多个互连结构,每个互连结构之间由一一对应的第一绝缘凸块和第二绝缘凸块电隔离;其中,第一绝缘凸块的高度至少大于第一导电图案的高度,第二绝缘凸块的高度至少大于第二导电图案的高度;优选地,第一绝缘凸块的高度至少为第一导电图案的高度的120%;第二绝缘凸块的高度至少为第二导电图案的高度的120%,第一绝缘凸块的宽度与多个第一导电图案之间的距离相同,第二绝缘凸块的宽度与多个第二导电图案之间的距离也相同。 2. The two-layer flexible circuit board according to claim 1, characterized in that: wherein the second alignment hole of the first alignment hole and the second flexible circuit board is aligned with a first flexible circuit board, said first a plurality of flexible circuit board by a plurality of first conductive pattern of conductive adhesive and the second flexible circuit board bonded to each second conductive pattern correspond to collectively form a plurality of interconnect structures, each mutual even between the structures of the first and second insulating blocks insulating bumps electrically isolated one correspondence; wherein the height of the first insulation bump height greater than at least a first conductive pattern, the second insulating bump height greater than at least height of the second conductive pattern; highly preferably, the first insulating bump at least 120% of the height of the first conductive pattern; bump height of the second insulating at least 120% of the height of the second conductive pattern, a first the same width and the distance between the plurality of first conductive patterns insulating bumps, the distance between the width of the second insulating blocks and the plurality of second conductive patterns are the same.
3.如权利要求2所述的双层柔性电路板,其特征在于: 其中,所述第一和第二基材部由聚脂薄膜形成,例如聚酰亚胺、聚酰亚胺酰亚胺或聚乙烯萘甲醛; 导电粘合剂由导电颗粒、粘合树脂、固化剂以及溶解剂组成;所述导电颗粒为纳米级导电颗粒,导电颗粒例如是银、镍或铜,粒径为100-200纳米;所述粘合树脂例如是聚酯树脂、环氧树脂或聚酰亚胺树脂;当聚酯树脂被用作粘合树脂时,固化剂选择异氰酸盐化合物;当环氧树脂用作粘合树脂时,固化剂选择胺化合物或咪唑化合物;溶解剂例如是纤维素溶剂或丁基卡必醇醋酸盐; 其中,所述第一绝缘凸块、第二绝缘凸块以及绝缘层皆为绝缘树脂。 Layer flexible circuit board as claimed in claim 2, wherein: wherein said first and second base portion is formed of a polyester film, such as polyimide, polyimide-imide or polyethylene naphthalene formaldehyde; conductive particles by a conductive adhesive, an adhesive resin, curing agent, and a dissolving agent composition; said electrically conductive particles are nano-scale conductive particles, electrically conductive particles such as silver, nickel or copper, a particle size of 100 200 nm; for example, the binder resin is a polyester resin, an epoxy resin or polyimide resin; when the polyester resin is used as the binder resin, the curing agent is the isocyanate compound selected; when the epoxy resin when the binder resin as a curing agent of amine compound or imidazole compound; dissolving agent, for example, butyl carbitol or cellosolve acetate; wherein said first insulating block, a second insulating layer and the insulating blocks are all the insulating resin.
CN201310510896.3A 2013-10-26 2013-10-26 Double-layer flexible printed circuit board CN103596355A (en)

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