CN204316866U - Flex circuit application presses the pressing structure of reinforcement soon - Google Patents
Flex circuit application presses the pressing structure of reinforcement soon Download PDFInfo
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- CN204316866U CN204316866U CN201420846406.7U CN201420846406U CN204316866U CN 204316866 U CN204316866 U CN 204316866U CN 201420846406 U CN201420846406 U CN 201420846406U CN 204316866 U CN204316866 U CN 204316866U
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- reinforcement
- soon
- pressing structure
- circuit application
- flex circuit
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Abstract
The utility model relates to the pressing structure that a kind of flex circuit application presses reinforcement soon, it comprises flex plate, this flex plate has reinforcement face and non-reinforcement face, reinforcement face is provided with polymer strengthening course, pressing structure is disposed with release film, polypropylene screen, release film and silicon aluminium foil on polymer strengthening course, and pressing structure is disposed with release film, polypropylene screen, release film, green layer of silica gel and glass-fiber-fabric on non-reinforcement face.The flex circuit application with said structure presses the pressing structure of reinforcement can realize being not more than the polymer strengthening course of 10mil thickness and the quick pressing of flex plate soon, and pressing efficiency is high, and not easily occurs the phenomenon of reinforcement layering.
Description
Technical field
The utility model relates to wiring board and manufactures field, especially relates to the pressing structure that a kind of flex circuit application presses reinforcement soon.
Background technology
Along with electronic product is to miniaturized, portable future development, flex circuit application replaces conventional wires and the status of rigid line plate in electronic product gradually, and the market demand increases day by day.Flex circuit application directly adopts the macromolecular material of resistance to bending to make base material, lacks the supporter of glass-fiber-fabric and so in rigid line plate substrate, makes to carry out lacking enough supports when welding or plug device on flex circuit application.Therefore, flex circuit application usually need local location bonding on reinforcement as supporter.The reinforcement of flex circuit application bonding can be divided into hot pressing depending on the difference of binding agent and cold pressing.Hot pressing reinforcement has two kinds of modes usually: one be adopt traditional press height cover shape performance cover shape material under carry out pressing, pressing required time is longer; Two be adopt quick press low cover the material of shape performance under carry out pressing, pressing required time is shorter.Adopt the efficiency of quick press pressing reinforcement high, but, what cover shape material (as silicon aluminium foil, silicon rubber etc.) because quick press is used covers shape ability, and traditional employing presses the pressing structure of reinforcement usually to occur the uneven phenomenon causing reinforcement layering of pressure when fast pressure soon.
Utility model content
Based on this, be necessary to provide a kind of pressing structure that can prevent the flex circuit application of reinforcement layering from pressing reinforcement soon.
A kind of flex circuit application presses the pressing structure of reinforcement soon, comprise flex plate, described flex plate has reinforcement face and non-reinforcement face, described reinforcement face is provided with polymer strengthening course, described pressing structure is also included in release film, polypropylene screen, release film and silicon aluminium foil that described polymer strengthening course sets gradually, and the release film, polypropylene screen, release film, green layer of silica gel and the glass-fiber-fabric that set gradually on described non-reinforcement face.。
Wherein in an embodiment, described polymer strengthening course is polyimides strengthening course.
Wherein in an embodiment, the thickness of described polymer strengthening course is not more than 10mil.
Wherein in an embodiment, the thickness of described polypropylene screen is 50 ~ 150 μm.
Wherein in an embodiment, described green layer of silica gel is the silastic-layer of band glass-fiber-fabric.
Wherein in an embodiment, the thickness of described green layer of silica gel is 1.0 ~ 3.0mm.
The flex circuit application with said structure presses the pressing structure of reinforcement can realize being not more than the polymer strengthening course of 10mil thickness and the quick pressing of flex plate soon, and has following beneficial effect:
1, pressing efficiency is high, can improve the pressing efficiency more than 50% for the flex circuit application employing quick pressing reinforcement that production quantity is less;
2, production cost is low, and pressing auxiliary material used can be reused repeatedly, can reduce the cost that about 60% produces material;
3, qualification rate is high, and quick pressing is convenient to the character surveillance of production process, adjusts manufacturing parameter in time, and effectively improve quality qualification rate, qualification rate can reach more than 98%.
Accompanying drawing explanation
Fig. 1 is the structural representation that the flex circuit application of an execution mode presses the pressing structure of reinforcement soon.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present utility model more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in specification of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As shown in Figure 1, the flex circuit application of an execution mode presses the pressing structure 10 of reinforcement to comprise flex plate 100 soon.Flex plate 100 is provided with the flex plate of reinforced structure for one side, has reinforcement face 102 and non-reinforcement face 104.Reinforcement face 102 is provided with polymer strengthening course 200.Further, in the present embodiment, pressing structure 10 is disposed with release film 300, polypropylene (PE) film 400, release film 300 and silicon aluminium foil 500 on polymer strengthening course 200; Pressing structure 10 is disposed with release film 300, polypropylene screen 400, release film 300, green layer of silica gel 600 and glass-fiber-fabric 700 on non-reinforcement face 104.
In the present embodiment, polymer strengthening course 200 is polyimides (PI) strengthening course.The thickness of polymer strengthening course 200 is not more than 10mil.By arranging polymer strengthening course 200 on flex plate 100, polymer strengthening course 200 can as the supporter on flex plate, for flex plate 100 is carrying out providing enough supports when welding or plug the operations such as device.Polymer strengthening course 200 comprises multiple finishing strips 210.Interval between multiple finishing strips 210 and be arrangeding in parallel, can not disturb the flexibility of flex plate 100 while the support of providing enough to flex plate 100.Can understand, in other embodiments, polymer strengthening course 200 can also be the composite construction etc. comprising multiple reinforcing block or finishing strips and reinforcing block.
Corresponding adjacent layer separates by release film 300, after pressing, can be separated by other layers faster, to obtain the flex plate with pressing reinforced structure.
Polypropylene screen 400 is as covering shape material, and thickness is 50 ~ 150 μm.
Green layer of silica gel 600 is the silastic-layer of band glass-fiber-fabric.Green layer of silica gel 600 covers shape material as auxiliary, and be located at the side, non-reinforcement face 104 of flex plate 100, thickness is 1.0 ~ 3.0mm.
Silicon aluminium foil 500 and glass-fiber-fabric 700, as pressing protective material, can press through in journey as flex plate 100 provides enough protections soon.
The flex circuit application with said structure presses the pressing structure of reinforcement to arrange in pairs or groups by introducing green layer of silica gel 600 achieve the quick pressing of the larger reinforcement of thickness as auxiliary shape material and the PE film 400 of covering soon, the polymer strengthening course of 10mil thickness and the quick pressing of flex plate is not more than as realized, pressing efficiency is high, and not easily occurs the phenomenon of reinforcement layering.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (6)
1. a flex circuit application presses the pressing structure of reinforcement soon, it is characterized in that, comprise flex plate, described flex plate has reinforcement face and non-reinforcement face, described reinforcement face is provided with polymer strengthening course, described pressing structure is also included in release film, polypropylene screen, release film and silicon aluminium foil that described polymer strengthening course sets gradually, and the release film, polypropylene screen, release film, green layer of silica gel and the glass-fiber-fabric that set gradually on described non-reinforcement face.
2. flex circuit application as claimed in claim 1 presses the pressing structure of reinforcement soon, and it is characterized in that, described polymer strengthening course is polyimides strengthening course.
3. flex circuit application as claimed in claim 1 or 2 presses the pressing structure of reinforcement soon, and it is characterized in that, the thickness of described polymer strengthening course is not more than 10mil.
4. flex circuit application as claimed in claim 1 presses the pressing structure of reinforcement soon, and it is characterized in that, the thickness of described polypropylene screen is 50 ~ 150 μm.
5. flex circuit application as claimed in claim 1 presses the pressing structure of reinforcement soon, it is characterized in that, described green layer of silica gel is the silastic-layer of band glass-fiber-fabric.
6. the flex circuit application as described in claim 1 or 5 presses the pressing structure of reinforcement soon, it is characterized in that, the thickness of described green layer of silica gel is 1.0 ~ 3.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420846406.7U CN204316866U (en) | 2014-12-25 | 2014-12-25 | Flex circuit application presses the pressing structure of reinforcement soon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420846406.7U CN204316866U (en) | 2014-12-25 | 2014-12-25 | Flex circuit application presses the pressing structure of reinforcement soon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204316866U true CN204316866U (en) | 2015-05-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420846406.7U Expired - Fee Related CN204316866U (en) | 2014-12-25 | 2014-12-25 | Flex circuit application presses the pressing structure of reinforcement soon |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204316866U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555025A (en) * | 2015-12-09 | 2016-05-04 | 深圳市精诚达电路科技股份有限公司 | Technological method for preventing edge of flexible circuit board from being inclined after stitching |
| CN113891580A (en) * | 2021-09-02 | 2022-01-04 | 深圳市新宇腾跃电子有限公司 | Multilayer flexible circuit board laminating process and multilayer flexible circuit board product |
-
2014
- 2014-12-25 CN CN201420846406.7U patent/CN204316866U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555025A (en) * | 2015-12-09 | 2016-05-04 | 深圳市精诚达电路科技股份有限公司 | Technological method for preventing edge of flexible circuit board from being inclined after stitching |
| CN105555025B (en) * | 2015-12-09 | 2018-08-31 | 深圳市精诚达电路科技股份有限公司 | One kind preventing the flexible PCB pressing processing inclined process of back edge |
| CN113891580A (en) * | 2021-09-02 | 2022-01-04 | 深圳市新宇腾跃电子有限公司 | Multilayer flexible circuit board laminating process and multilayer flexible circuit board product |
| CN113891580B (en) * | 2021-09-02 | 2023-09-29 | 深圳市新宇腾跃电子有限公司 | Lamination process of multilayer flexible circuit board and multilayer flexible circuit board product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150506 Termination date: 20211225 |