CN1241894A - Circuit board and its producing method - Google Patents

Abstract

Through holes (104) formed in an electrical insulating substrate (102) having adhesive layers (101) on its both surfaces are filled with a conductor (105). Then, supporting bases (106) having wiring layers (107) with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate (102), which are then heated and pressurized. After that, the supporting bases (106) are removed, thus obtaining a circuit board in which the wiring layers (107) have been embedded in the adhesive layers (101). The conductor (105) within the through holes (104) are compressed sufficiently, thus forming minute via holes with high reliability.

Description

Wiring board and manufacture method thereof

The present invention relates to be undertaken the wiring board that is electrically connected and the manufacture method thereof of interlayer by electric conductors such as electrocondution slurries.

Recently, the applicant has proposed to carry out with electrocondution slurry the multilayer circuit board that is electrically connected (No. the 2601128th, Japanese patent application) of interlayer.The manufacture method of the above-mentioned multilayer circuit board of expression in Fig. 8.At first, shown in Fig. 8 (a) like that, in the aroma type Fypro, soak on the two sides of the porous material 502 that has contained heat-curable epoxy resin mould release film 501 such as stacked polyester then, shown in Fig. 8 (b) like that, on the precalculated position of porous material 502, form through hole 503 with laser processing method.Then, shown in Fig. 8 (c), filled conductive slurry 504 in through hole 503.Method as filling is arranged on the porous material 502 with through hole 503 on the table top of screen printer, direct printing conductive slurry 504 from the mould release film 501.At this moment, the mould release film 501 of printing surface plays the effect of mask to print and prevents the effect of the pollution on porous material 502 surfaces.Then, peel off mould release film 501 from the two sides of porous material 502.Then, on the two sides of porous material 502, paste metal forming 505 such as Copper Foil.Under this state, carry out heating and pressurizing, thus, shown in Fig. 8 (d), porous material 502 and metal forming 505 are bonded together.In this operation, porous material 502 is compressed, its thickness attenuation.At this moment, electrocondution slurry 504 in the through hole 503 is compressed, and this moment, the adhesive ingredients in the electrocondution slurry was extruded, conductive compositions each other and combining between conductive compositions and the metal forming 505 become firm, conductive materials in the electrocondution slurry 504 is by densification, and obtains being electrically connected of interlayer.After this, heat-curing resin and the electrocondution slurry 504 as the constituent of porous material 502 is cured.At last, shown in Fig. 8 (e), on metal forming 505, select to be etched into predetermined figure, and make double-sided wiring board.

But, in above-mentioned such formation and manufacture method,, initially connecting resistance value and uprise when through hole 503 becomes when fine, it is big that its deviation also becomes.And, by the reliability test of temperature cycling test and pressure cooker testing etc., there is the problem that connects the resistance value change.This be because: when through hole 503 becomes when fine, approach 1, be electrically connected, must obtain necessary compression ratio for stable as the length-width ratio of the ratio of the thickness of the diameter of through hole 503 and porous material 502.

In the operation of peeling off mould release film 501, when through-hole diameter diminishes, can not ignore influence at the mould release film of through hole end, when peeling off mould release film, electrocondution slurry 504 is removed by mould release film, as a result of, has the problem that hinders the filling of electrocondution slurry in through hole.

In view of the above problems, the purpose of this invention is to provide a kind of wiring board and manufacture method thereof, can use conductive materials such as electrocondution slurry, be implemented in the trickle through hole (Via Hole) that has high reliability down.

In order to address the above problem, wiring board of the present invention, filled conductive body in the through hole of on the thickness direction of electric insulating quality material, leaving, come to form between the wiring layer of predetermined pattern on the electric two sides that is connected above-mentioned electric insulating quality material with above-mentioned electric conductor, it is characterized in that, two sides at above-mentioned electric insulating quality material forms bond layer, and at least one side's above-mentioned wiring layer is embedded in the above-mentioned bond layer.By taking such formation, the electric conductor in the through hole is fully compressed, and can form the fine through hole with high reliability.That is, be embedded in the bond layer, the electric conductor in the through hole is compressed fully by wiring layer with at least one side, its result, the conductor composition of electric conductor is initially connected the resistance value step-down by densification, can realize that the through hole with high reliability connects.

When electric conductor was electrocondution slurry, when the electrocondution slurry in the through hole was compressed, the resinous principle in the electrocondution slurry was discharged in through hole, the conductor composition densification in the electrocondution slurry, and initial resistivity value reduces, and is easy to obtain having the through hole connection of high reliability.

When covering the through hole on top layer with wiring layer, the electric conductor of being filled can not expose from the teeth outwards.Like this, when such through hole being located at the top layer of substrate, be effective.

And, form wiring layer so that the part of through hole is exposed, when in internal layer, using it, can enough wirings realize compressing the boundless through hole (ラ Application De レ ス PVC ア) of through hole, and form trickleer wiring less than through-hole diameter.

And when being carried out roughening treatment on the wiring layer surface relative with through hole at least, the contact area of wiring layer and electric conductor increases, and the tight contact of wiring layer and bond layer improves, and therefore, can further improve the reliability of fine through hole.

Of the present invention first constitutes the manufacture method of related wiring board, has: formed the operation that through hole is set on the electric insulating quality material of bond layer on the two sides; The operation of filled conductive slurry in above-mentioned through hole; Overlapping wiring layer is formed the operation of the backing material of predetermined pattern on the one side at least of above-mentioned electric insulating quality material; Carry out heating and pressurizing and compress by above-mentioned electric insulating quality material, in above-mentioned bond layer, bury the operation of above-mentioned wiring layer underground overlapping above-mentioned backing material; The operation that stays above-mentioned wiring layer and remove above-mentioned backing material.Thus, can support the wiring layer that has carried out needle drawing, after lamination, remove backing material, can provide the wiring board that has with the through hole of the high connecting reliability of trickle wiring layer by such short-cut method by backing material.

Of the present invention second constitutes the manufacture method of related wiring board, has: paste one side and form the mould release film of bond layer so that above-mentioned bond layer and the contacted operation of above-mentioned electric insulating quality material on the two sides of electric insulating quality material; Has the operation that through hole is set on the electric insulating quality material of above-mentioned mould release film; The operation of filled conductive slurry in above-mentioned through hole; On above-mentioned electric insulating quality material, stay above-mentioned bond layer and peel off the operation of above-mentioned mould release film; Overlapping wiring layer is formed the operation of the backing material of predetermined pattern on the one side at least of above-mentioned electric insulating quality material; Carry out heating and pressurizing and compress by above-mentioned electric insulating quality material, in above-mentioned bond layer, bury the operation of above-mentioned wiring layer underground overlapping above-mentioned backing material; The operation that stays above-mentioned wiring layer and remove above-mentioned backing material.According to this method, can avoid the difficulty in the such manufacturing of the bond layer that forms thin semi-cured state on the two sides of electric insulating quality material simultaneously.And, after the backing material that forms wiring layer is carried out lamination, remove backing material, can provide the wiring board that has with the through hole of the high connecting reliability of trickle wiring layer by such short-cut method.

In above-mentioned first or second manufacture method, carrying out heating and pressurizing electric insulating quality material before is the thermosetting resin of semi-cured state and the composite material of the cloth that glass is made into, when bond layer is above-mentioned thermosetting resin, can use existing glass epoxide composite material, and do not need to provide specially the operation of bond layer, therefore, can easily make wiring board.

And, carrying out electric insulating quality material before the heating and pressurizing and be film based on organic material, bond layer can be the organic resin of semi-cured state.High heat-resisting, high rigidity by thin-film material is selected, can have the character that is suitable for the semiconductor installation.And, for the material of bond layer, can freely select to consider the material of electric insulating quality and imbedibility, and can realize high performance wiring board.And, owing to can make thin film, therefore, can form the through hole of trickle diameter with even composition.

The thickness of set bond layer is when being substantially equal to or being thinner than the thickness of the wiring layer of being buried underground in above-mentioned bond layer on the surface of the electric insulating quality material before carrying out heating and pressurizing, still almost can be on the electric insulating quality material buried wiring layer, can make the reduction that when compression, makes bond layer expand the compression stress of the electrocondution slurry that is produced in the horizontal become minimum.

When the electric insulating quality material before carrying out heating and pressurizing has the space of the constituent material that can hold bond layer, the constituent material of the bond layer of fusion when the heating and pressurizing is contained in the electric insulating quality material, thus, can suppress wiring layer and imbed the electric insulating quality distortion of materials that is produced.

When the trickle hole of carrying out that electric insulating quality material before the heating and pressurizing has that the constituent material of bond layer set on the two sides can move, owing to can make constituent material current downflow on the electric insulating quality material of the bond layer of fusion when heating and pressurizing, therefore can further suppress the electric insulating quality distortion of materials.

The operation that stays wiring layer and remove backing material preferably selectively dissolving remove above-mentioned backing material.Remove backing material by dissolving, can not apply mechanical external force, therefore, can make wiring board in the rate of finished products highland with the fine pitch wirings layer that does not have broken string and distortion to wiring layer.And,, also can make easily even for large-area wiring board.

Above-mentioned first or the manufacture method of second kind of wiring board in, wiring layer and backing material preferably are made of the material that can remove selectively respectively.According to this formation, after burying underground wiring layer in the bond layer, the operation that can easily only stay wiring layer and remove backing material.

Wherein, can constitute wiring layer removes with different corrosive liquids selectively with backing material.According to this formation, after burying underground wiring layer in the bond layer, by corrosion when removing backing material, can prevent because excessive erosion and situation that wiring layer is removed in corrosion simultaneously, therefore, the wiring layer rate of finished products highland with trickle figure is remained in the bond layer.Owing to can remove a side selectively,, be enough if then on corrosion rate, have for example difference of several times degree of enough difference by corrosion.

Above-mentioned first or the manufacture method of second kind of wiring board in, on the surface of backing material, form the corrosion barrier layer more than one deck at least, on above-mentioned corrosion barrier layer surface, wiring layer is set, best, above-mentioned wiring layer and above-mentioned at least corrosion barrier layer are made of the material that can remove selectively respectively.Constitute according to this, can improve the selectivity when only backing material and wiring layer either party are removed in corrosion.Its result, after burying underground wiring layer in the bond layer, the operation that can easily only stay wiring layer and remove backing material.More particularly, when removing backing material, can prevent to corrode the situation of removing wiring layer simultaneously, therefore, the wiring layer rate of finished products highland with trickle figure is retained in the bond layer because of excessive erosion by corrosion.

Wherein, preferably constituting at least wiring layer can remove by different corrosive liquids selectively with corrosion barrier layer.According to this formation, even when backing material is made of the material of removing with identical corrosive liquid with wiring layer, also can corrode by the enough corrosive liquids that can only remove corrosion barrier layer selectively, thus, can remove backing material with corrosion barrier layer, and only stay wiring layer.

Above-mentioned first or the manufacture method of second kind of wiring board in, the backing material that forms above-mentioned wiring layer is preferably through following operation and obtain: on the backing material surface or be formed on the operation that forms insulating properties material figure on the lip-deep corrosion barrier layer of the backing material surface; In the zone that above-mentioned backing material surface or corrosion barrier layer surface spill, adhere to the operation that conductive material forms the wiring layer of required figure by electroplating.Constitute according to this, can easily obtain having the wiring layer of required figure.

Wherein, the formation of insulating properties material can obtain like this: after on photoresist being attached to backing material surface or corrosion barrier layer surface, carry out the selectivity exposure with desirable mask graph, develop then.Thus, can easily in desirable zone, form desirable insulating properties material figure.

And, when so-called " plating " is plating, can easily only be attached to conductive material selectively on the zone that spills that does not form insulating properties material figure, therefore, can form desirable fine pitch wirings figure simply.

Above-mentioned first or the manufacture method of second kind of wiring board in, the backing material that forms above-mentioned wiring layer is preferably through following operation and obtain: the operation of using the bonding agent of forfeiture bonding force more than predetermined temperature to come multilayer board in the inside of backing material; On the surface of above-mentioned supporting substrate directly or form the operation of wiring layer by corrosion barrier layer.Even backing material is the material of film like, can carry out reinforcement by being layered on the substrate with the intensity that can support it.If form wiring layer then, can easily carry out the formation operation of wiring layer.And, stacked by using the bonding agent of more than predetermined temperature, losing bonding force to carry out, can easily separate backing material and substrate by heating through after being scheduled to operation, thereby improve operation.

Of the present invention first constitutes related multilayer circuit board, be that the electric insulating quality material with through hole of the thickness direction of having filled electric conductor carries out stacked multilayer circuit board more than 2 layers by bond layer, it is characterized in that, have the wiring layer that forms predetermined pattern in above-mentioned bond layer, above-mentioned wiring layer comes to be electrically connected with the above-mentioned electric conductor of the above-mentioned electric insulating quality material of its both sides by apply compression stress on stacked direction.Constitute by this, the multilayer circuit board with trickle through hole can be provided under high reliability.

Of the present invention first constitutes the manufacture method of related multilayer circuit board, it is characterized in that, repeat following operation: have bond layer on the two sides and have the operation that overlapping wiring layer on the one side of electric insulating quality material of through hole of filled conductive slurry is formed the backing material of predetermined pattern; By carrying out heating and pressurizing and compressing above-mentioned wiring layer is buried underground operation in the above-mentioned bond layer; The operation that stays above-mentioned wiring layer and remove above-mentioned backing material.Constitute according to this, the manufacture method of simple multilayer circuit board can be provided.

In the manufacture method of above-mentioned first multilayer circuit board, wiring layer and backing material preferably are made of the material that can remove selectively respectively.And, on the surface of backing material, form the corrosion barrier layer more than one deck at least, on above-mentioned corrosion barrier layer surface, wiring layer is set, best, above-mentioned wiring layer and above-mentioned at least corrosion barrier layer are made of the material that can remove selectively respectively.And the backing material that forms above-mentioned wiring layer is preferably through following operation and obtain: on the backing material surface or be formed on the operation that forms insulating properties material figure on the lip-deep corrosion barrier layer of the backing material surface; In the zone that above-mentioned backing material surface or corrosion barrier layer surface spill, adhere to the operation that conductive material forms the wiring layer of required figure by plating.And the backing material that forms above-mentioned wiring layer preferably obtains through following operation: the operation of using the bonding agent of forfeiture bonding force more than predetermined temperature to come multilayer board in the inside of backing material; On the surface of above-mentioned supporting substrate directly or form the operation of wiring layer by corrosion barrier layer.All be according to above-mentioned first or identical reason during the manufacture method of second kind of wiring board.

Of the present invention second constitutes related multilayer circuit board, it is characterized in that, the wiring layer on top layer that constitutes formed wiring layer on the top layer of related multilayer circuit board in first of the invention described above and have a central layer of predetermined insulating barrier and wiring layer is electrically connected by the electric insulating quality material that has bond layer and have a through hole of having filled electric conductor on the two sides, and at least one side in the wiring layer on the wiring layer on the top layer of above-mentioned multilayer circuit board and the top layer of above-mentioned central layer is embedded in the above-mentioned bond layer.Constitute by this, can provide the wiring layer on the top layer of central layer and have the fine pitch wirings formed by multilayer and multilayer circuit board that first wiring layer that constitutes the top layer of related multilayer circuit board of trickle through hole is electrically connected.

Of the present invention second constitutes the manufacture method of related multilayer circuit board, it is characterized in that having following operation: first of the invention described above is constituted related multilayer circuit board by overlap onto the operation on the central layer with predetermined insulating barrier and wiring layer at the electric insulating quality material that has bond layer on the two sides and have a through hole of having filled electrocondution slurry; To overlapping central layer and above-mentioned multilayer circuit board carries out heating and pressurizing by above-mentioned electric insulating quality material, thus, at least one side in the wiring layer on the top layer of formed wiring layer and above-mentioned central layer on the top layer of above-mentioned multilayer circuit board is embedded in operation in the above-mentioned bond layer.Constitute according to this, the manufacture method of easy multilayer circuit board can be provided.

Above-mentioned first or the manufacture method of second multilayer circuit board in, the electric insulating quality material that carries out before the heating and pressurizing is the thermosetting resin of semi-cured state and the composite material of the cloth that glass is made into, bond layer can be above-mentioned thermosetting resin.Perhaps, carry out electric insulating quality material before the heating and pressurizing and be the film based on organic material, bond layer can be the organic resin of semi-cured state.

Above-mentioned first or the manufacture method of second multilayer circuit board in, the thickness of set bond layer is the thickness that is substantially equal to or is thinner than the wiring layer of being buried underground in above-mentioned bond layer on the surface of the electric insulating quality material before carrying out heating and pressurizing.

Above-mentioned first or the manufacture method of second multilayer circuit board in, have the space of the constituent material that can hold bond layer on the electric insulating quality material before carrying out heating and pressurizing.And, have the trickle hole that the constituent material of bond layer can move on the electric insulating quality material before carrying out heating and pressurizing.

The of the present invention the 3rd constitutes related multilayer circuit board, it is characterized in that, first of the invention described above constitutes related multilayer circuit board and is undertaken stacked with the central layer with predetermined insulating barrier and wiring layer by the substrate conjugant with the through hole of having filled electric conductor, the wiring layer on the top layer of formed wiring layer and above-mentioned central layer is electrically connected by above-mentioned electric conductor on the top layer of above-mentioned multilayer circuit board, and stacked preceding aforesaid substrate conjugant has the property of being compressed.The multilayer circuit board that can provide wiring layer and first wiring layer that constitutes the top layer of related multilayer circuit board with the fine pitch wirings be made up of multilayer and trickle through hole on the top layer of central layer to be electrically connected is provided by this.

In above-mentioned, so-called " the substrate conjugant has being compressed property and is meant for example to be made up of the porous material that has emptying aperture in inside by the substrate conjugant to have the character that can compress.Preferred void content under situation about being made up of porous material is 2～35 volume %.When void content is lower than at that time, compression is difficult, and the resistance that is electrically connected of electric conductor and wiring layer uprises, and perhaps produces bad connection.On the other hand, when void content is higher than at that time, when compression, it is big that the distortion of the substrate conjugant of the direction vertical with compression direction becomes, and perhaps, electroconductive resin is immersed in the emptying aperture, electroconductive resin can not fully compress, and therefore, the resistance that is electrically connected of electric conductor and wiring layer uprises.

In above-mentioned the 3rd multilayer circuit board, the material that constitutes the aforesaid substrate conjugant is the selected at least a material the resinous fibre plate material that soaks from being made up of the composite material of glass fibre non-woven or organic fiber nonwoven fabrics and thermosetting resin at least preferably.Constitute according to this, can further improve the electrical characteristic and the mechanical property of multilayer circuit board.

The of the present invention the 3rd constitutes the manufacture method of related multilayer circuit board, it is characterized in that, comprise following operation: first of the invention described above is constituted related multilayer circuit board carry out overlapping operation with central layer with predetermined insulating barrier and wiring layer by the substrate conjugant with being compressed property of in through hole, having filled conductive paste; To by the aforesaid substrate conjugant overlapping above-mentioned multilayer circuit board and central layer carry out heating and pressurizing, thus, the operation of coming the wiring layer to formed wiring layer and above-mentioned central layer on the top layer of above-mentioned multilayer circuit board to be electrically connected by above-mentioned electrocondution slurry.Constitute according to this, the manufacture method of easy multilayer circuit board can be provided.

In the manufacture method of above-mentioned the 3rd multilayer circuit board, in the substrate conjugant before carrying out heating and pressurizing, the electrocondution slurry that is filled in the through hole of substrate conjugant is preferably outstanding from substrate conjugant surface.Constitute according to this, can be by electrocondution slurry with low resistance and carry out being electrically connected of two wiring layers reliably.

These and other purpose, advantage and feature of the present invention will be in conjunction with the drawings to the description of embodiments of the invention and further specified.In these accompanying drawings:

Fig. 1 is the process profile diagram of the manufacture method of the double-sided wiring board in the expression first embodiment of the present invention;

Fig. 2 is the process profile diagram of an example of the manufacture method of the expression backing material that forms wiring layer of the present invention;

Fig. 3 is the process profile diagram of the manufacture method of the double-sided wiring board in the expression second embodiment of the present invention;

Fig. 4 is the process profile diagram of the manufacture method of the multilayer circuit board in the expression third embodiment of the present invention;

Fig. 5 is another routine process profile diagram of the manufacture method of the expression backing material that forms wiring layer of the present invention;

Fig. 6 is the process profile diagram of another example of the manufacture method of the expression backing material that forms wiring layer of the present invention;

Fig. 7 is the process profile diagram of the manufacture method of the multilayer circuit board in the expression fourth embodiment of the present invention;

Fig. 8 is the process profile diagram of the manufacture method of the existing multilayer circuit board of expression (ALIVH substrate).

With reference to the accompanying drawings embodiments of the invention are described.

Embodiment 1

Fig. 1 is the process profile diagram of the manufacture method of the double-sided wiring board in the expression first embodiment of the present invention.

At first, shown in Fig. 1 (a), on its two sides, prepare to form the electric insulating quality material 102 of bond layer 101.As electric insulating quality material 102, use good and high-fire resistance on dimensional stability.As such film, have polyimide film and aromatic polyamide thin-film etc.In polyimide film, have " カ プ ト Application " (trade mark of eastern レ デ ュ Port Application (strain)), " ユ-ピ レ Star Network ス " (trade mark of the emerging product of space portion (strain)), " ア ピ カ Le " (trade mark of clock deep pool chemistry (strain)), it is characterized in that the low suction that determines by grade.In aromatic polyamide thin-film, have " ア ラ ミ カ " (trade mark of Asahi Chemical Industry's (strain)), " ミ Network ト ロ Application " (trade mark of eastern レ (strain)), compare with polyimides, it is characterized in that rigidity is stronger, be difficult to extend.

As bond layer 101, use epoxies bonding agent and imines class bonding agent as thermosetting resin, the bonding agent of the high thermal endurance class of use silicon class is as the thermoplastic adhesive.In order to ensure the imbedibility of wiring layer, thermosetting resin is preferably semi-cured state.

In the present embodiment, use thick " the ア ラ ミ カ " film of 12 μ m to use rubber modified epoxy resin as bond layer 101 as electric insulating quality material 102.Why carrying out rubber modifiedly, is because better with the intimate property of thin-film material.In order to ensure the figure imbedibility, epoxy resin carries out drying after coating, and becomes semi-cured state.The thickness of bond layer is every side 5 μ m.

Then, shown in Fig. 1 (b), formed the mould release film 103 of lamination polyester etc. on the two sides of electric insulating quality material 102 of bond layer 101 on its two sides.Lamination is to carry out under 80 ℃ temperature.Thus, the surface of bond layer 101 slightly fusion paste mould release film 103.In the present embodiment, on mould release film, use thick poly-terephthaldehyde's ester second diester (PET) film of 16 μ m.The gross thickness that has added mould release film 103 is 54 μ m.

Then, shown in Fig. 1 (c), form through hole 104 by laser being provided with on the electric insulating quality material 102 of mould release film 103.Can use the excimer laser of wavelength 307nm and 3 times of short wavelength lasers such as high order harmonic component YAG solid state laser of wavelength 355nm to be used as laser.Form the through hole 104 of the about 50 μ m in aperture with above-mentioned short wavelength laser.

Then, shown in Fig. 1 (d), filled conductive slurry 105 in through hole 104.As fill method, can be by screen printer and from the mould release film 103 direct printing conductive slurry 105, fill thus.At this moment, carry out vacuum suction by porous matter sheets such as Japan papers, thus, draw the resinous principle in the electrocondution slurry 105 in the through hole 104, and the conductor components in proportions is increased, thus, can fill the conductor composition more densely from print surface and opposite side.And mould release film 103 plays the effect of mask to print and prevents the effect of bond layer 101 surface contaminations.Though for aperture 50 μ m, gross thickness 54 μ m and length-width ratio are below 1, can be about 0.3, that is, the aperture arrives the degree of 20 μ m, can the filled conductive slurry by said method.

Then, shown in Fig. 1 (e), peel off mould release film 103 from the two sides.At this moment, because through hole 104 is that 50 μ m are trickle, can not ignore the influence of end, the electrocondution slurry in the through hole of mould release film 103 is removed with mould release film.The method that stays of electrocondution slurry 105 has multiple, but does not take downwards from the surface of bond layer 101.Under the poorest situation, there is the worn-off state (surface of the upper surface of electrocondution slurry and bond layer 101 roughly is in the state of equal height) of bond layer 101.The phenomenon of removing electrocondution slurry owing to such mould release film 103 is that 100 μ m are especially remarkable when following in the aperture.

Then, shown in Fig. 1 (f), the superimposed backing material 106 from the both sides of electric insulating quality material 102, to make wiring layer 107 arrive through hole 104 tops of filled conductive slurry 105 at least, and carrying out heating and pressurizing, this backing material 106 is by comprising that the aluminium foil that makes Copper Foil form the wiring layer 107 of reservation shape constitutes.Carry out heating and pressurizing by vacuum press.

By this heating and pressurizing, shown in Fig. 1 (g), bond layer 101 flows, and wiring layer 107 is embedded in the bond layer 101.Like this, be embedded in the bond layer 101 by wiring layer 107, electrocondution slurry 105 in the through hole 104 is compressed, resinous principle in the electrocondution slurry 105 flows out in the bond layer 101, make the conductor composition densification in the electrocondution slurry 105, and obtain being electrically connected between the wiring layer 107 in electric insulating quality material 102 table.Then, bond layer 101 and electrocondution slurry 105 are cured.

At last, shown in Fig. 1 (h), stay the wiring layer 107 that is embedded in the bond layer 101, and remove backing material 106, and finish double-sided wiring board.In the present embodiment, on backing material 106, use aluminium foil, on wiring layer 107, use Copper Foil.Removing of backing material 106 is to dissolve by the selective etching of aluminium foil and Copper Foil to remove aluminium foil and realize.Remove backing material 106 by dissolving, thus, can be and destroyed to the double-sided wiring board stress application.Owing to can remove by enough streamlines, and improved productivity.Can use ammonium persulfate etc. as selective etching liquid.Use identical method that wiring layer 107 is formed predetermined pattern.As the composite material of aluminium foil and Copper Foil, has for example Copper Foil UTC-Foil of the band aluminium support of Mitsui Metal Co., Ltd.'s (strain).In this composite material,, can realize that trickle figure forms because copper thickness is that 5 μ m or 9 μ m are thin.

On aluminium foil, be pre-formed the resist figure, after the zincate of acidity is handled, carry out the cathode copper plating, can access same composite material thus.In method, can obtain the thicker Copper Foil of thickness with fine pattern by the electrolysis plating.In the method, can manufacture experimently the Copper Foil that thickness is 15 μ m with live width 10 μ m, interval 10 μ m.

In the present embodiment, using copper thickness is 9 μ m.The thickness of bond layer 101 is one-sided to be 5 μ m, is set at the thin thickness than Copper Foil." the ア ラ ミ カ " film that uses 12 μ m is as electric insulating quality material 102, and the epoxy adhesive layer that uses every side 5 μ m is as bond layer 101, and therefore, the thickness of the electrocondution slurry 105 before imbedding is 22 μ m.Being used as wiring layer 107 owing to imbed the Copper Foil of 9 μ m in this bond layer 101, is 18/22=about 82% as compression ratio then.In fact, under the situation of maximum, the electrocondution slurry of the thickness of mould release film 103 part forms from the surface of bond layer 101 is outstanding, and therefore, additional this thickness partly further improves compression ratio.The volume ratio of resinous principle in the electrocondution slurry 105 and conductor composition is considered printing and is set at about 50%, therefore, resinous principle in the electrocondution slurry 105 in the through hole 104 almost is extruded bond layer, in through hole 104, the conductor composition is by densification, and can obtain the through hole of high reliability under low resistance.In experiment, if the volume compressibility more than 20%, be electrically connected and be low resistance, improved connection reliability and be judged as.Since the thickness setting of bond layer 101 and wiring layer 107 be roughly the same or wiring layer 107 1 sides thick, in the process that wiring layer 107 is pressed in the bond layer 101, the through-hole aperture of bond layer 101 can not expanded and compression stress is stretched in the horizontal, and can compression conductive slurry 105.And when compressing, because the size of electric insulating quality material 102 does not almost change, therefore the major part by the pressure that press produced acts in vertical direction in through hole, and electrocondution slurry 105 is compressed.

Owing to the Copper Foil that uses as wiring layer 107 carry out roughened surface treatment with electrocondution slurry 105 contacted sides, and improved the cementability of bond layer 101 and Copper Foil, the peel strength grow.And because the contact area of Copper Foil and electrocondution slurry 105 increases, then connection reliability improves.

In the above-described embodiments, use the structure that bond layer 101 is set on the two sides of electric insulating quality material 102, this can be pasting on the electric insulating quality material 102 after on the mould release film 103 bond layer 101 being set.By using such manufacture method, can be at a side adhesive-applying layer 101 of mould release film 103, under semi-cured state, carry out drying, also can be at the two sides while of electric insulating quality material 102 adhesive-applying layer 101, under semi-cured state, carry out drying, by this operation, can on the two sides of electric insulating quality material 102, form bond layer 101 more easily.

In Fig. 1 of the foregoing description, wiring layer 107 has represented to cover the formation of through hole 104, still, is not whole parts that must cover through hole 104.Wiring layer 107 can be embedded between the wiring layer in the through hole to obtain predetermined compression ratio, therefore, can cover the part of through hole.That is, if the electrocondution slurry of through hole compresses with being arranged on wiring layer up and down, overlapping, then the part of through hole can be exposed.For example, in the present embodiment, if use the wiring of the through hole and the 30 μ m width of 50 μ m diameters, electrocondution slurry is compressed, and obtains being electrically connected between wiring layer.By taking such formation, so-called island just becomes unwanted, and can form trickleer wiring.Particularly, when being configured for the internal layer of multilayer circuit board, be effective when above-mentioned.

In the above-described embodiments, to using high heat-pesistant thin film, use thermosetting resin or thermoplastic resin to be illustrated, still as the situation of bond layer 101 as electric insulating quality material 102, even use the glass epoxide prepreg to replace it, also can realize same formation.That is, can use the thermosetting resin of semi-cured state and the composite material of the cloth that glass is weaved to be used as the electric insulating quality material, and, use the thermoset resin layer identical to be used as bond layer with the resin of impregnation.In the glass epoxide prepreg, do not need to form especially bond layer, when soaking in the cloth in glass weaving when containing thermosetting resin, therefore nature, can implement the present invention more easily at the thermoset resin layer of formation up and down of the cloth of glass weaving.

Use Fig. 2 to represent to have the example of manufacture method of the backing material 106 of the wiring layer 107 that uses in the foregoing description below.

Shown in Fig. 2 (a), the Copper Foil UTC-Foil that the band aluminium of Mitsui Metal Co., Ltd.'s (strain) of preparing metal level 110 stacked supports, this metal level 110 is made up of the copper that is used for forming wiring layer on the surface of the backing material 106 that is made of aluminium.Such composite material can form by plating on aluminium foil and evaporation or bonding copper.Wherein, consider in subsequent handling, to dissolve and remove (corrosion is removed), and wish that backing material 106 is following thin like that for 1mm.But, otherwise, if thin excessively, difficult treatment then, and wish more than 5 μ m.In the present embodiment, use about 50 μ m.In order to be easy to remove by corrosion, backing material 106 is important for what approach, still, even under the thickness of 50 μ m degree, usually can occur can producing fold and bending by processing.

In the present embodiment, in order to handle easily, shown in Fig. 2 (b), bonding to by bonding agent 114 on the face that does not form metal level 110 of backing material 106, carry out reinforcement thus by substrate 113 with suitable intensity and comparison acid resistance, alkali-proof certain poly-terephthaldehyde's ester diethylester (PET) film formation.Can using when becoming predetermined above temperature in fact, bonding force material more weak or that lose is used as bonding agent 114.The bonding agent 114 of present embodiment contains the blowing agent that foams more than predetermined temperature.As the substrate 113 that such bonding agent 114 adheres to, has commercially available for example hot stripping film " リ バ ア Le Off ァ (REVALPHA) " (trade name of Nitto Denko Corp).

Then, form by the formed wiring layer 107 of the copper with predetermined pattern (Fig. 2 (c)) by metal level 110 being carried out photoetching.Wherein, use liquid resist at the photoresist that is used for photoetching.Though can use the film resist, also can realize forming of trickle figure by the scheme that liquid resist carried out.And, constituting the aluminium of backing material 106 and be configured for forming the copper of the metal level 110 of wiring layer 107, its corrosive liquid is different.Like this, by selecting to be suitable for Corrosion of Metallic Materials liquid separately, can only corrode metal separately selectively.In the case, as the corrosive liquid that is used to form the figure that produces by copper, owing in common employed copper chloride class and copper sulphate class, aluminium is corroded, and sodium peroxydisulfate class and persulfuric acid amine that selection is not corroded aluminium can only corrode copper thus selectively.Then, when the copper that is used to form figure corroded, even carried out excessive erosion, the aluminium of backing material 106 can not be corroded yet.

On the other hand, aluminium is by hydrochloric acid solution (hydrochloric acid for example: water=1: 1) can easily corrode, and can not corrode the copper of wiring layer 107 with this solution.

After figure forms, can carry out surface treatments such as roughened to the copper surface.

And, after the unwanted zone of having corroded the metal level 110 that constitutes by copper, when removing resist, the general aqueous slkali that in the film resist, uses sodium carbonate, and, in the resist of liquid state, generally use aqueous slkalis such as NaOH.These solution can carry out some corrosion to the aluminium of backing material 106, still since on backing material 106 with bonding agent 114 bonding have above-mentioned acid resistance, alkali-proof substrate 113, then backing material 106 can not be corroded.

Then, be heated to more than the temperature that the blowing agent of bonding agent 114 foams.Thus, the blowing agent of bonding agent 114 foams, the bonding force forfeiture.Its result can easily peel off substrate 113, and obtains having formed the backing material of being made up of aluminium 106 (Fig. 2 (d)) of wiring layer 107 that the copper by desirable figure constitutes.

The heating-up temperature of this moment can be selected in 90 ℃～180 ℃ scope according to blowing agent, but, photoresist is can be enough ovenable roasting, in order to prevent to go bad because of thermal oxidation etc. at the copper of the aluminium of blowing temperature lower support material 106 and wiring layer 107, is suitable about 150 ℃.

In above-mentioned example, in substrate 113, use the PET film, but if having suitable intensity, and have more intense acid resistance, alkali-proof material, also can be other organic material, glass and stainless steel.

Embodiment 2

Come the manufacture method of the double-sided wiring board in the second embodiment of the present invention is described below with reference to Fig. 3 (a)～(d).

At first, identical with embodiment 1 shown in Fig. 3 (a), on the electric insulating quality material 202 that forms bond layer 201 on the two sides, through hole 204 is set, filled conductive slurry 205.Then, shown in Fig. 3 (b), stress to fold backing material 206,, Copper Foil 208 is overlapped onto on the opposite side so that make wiring layer 207 arrive through hole 204 tops of having filled electrocondution slurry 205 at least with the wiring layer 207 that forms reservation shape from one.Then, carry out heating and pressurizing by vacuum press.By this heating and pressurizing, shown in Fig. 3 (c), bond layer 201 flows, and wiring layer 207 is embedded in the bond layer 201.Like this, by wiring layer 207 is embedded in the bond layer 201,202 distortion of electric insulating quality material, electrocondution slurry 205 in the through hole 204 is compressed, resinous principle in the electrocondution slurry 205 flows out to bond layer 201, conductor composition in the electrocondution slurry 205 is by densification, thereby obtains being electrically connected between wiring layer 207 on electric insulating quality material 202 1 side surfaces and the lip-deep Copper Foil 208 of opposite side.Then, bond layer 201 and electrocondution slurry 205 are cured.At last, shown in Fig. 3 (d), stay the wiring layer of imbedding in the bond layer 201 207, remove backing material 206, thereby finish double-sided wiring board.With the first embodiment difference is to compress from a side of electric insulating quality material 202.

In the present embodiment, when the film thickness as electric insulating quality material 202 is 12 μ m, when the every side of the thickness of bond layer 201 is 5 μ m, be set at identical with first embodiment.The thickness of wiring layer 207 is all 9 μ m mutually with first embodiment.That is, the thickness setting of the gross thickness of bond layer 201 and wiring layer 207 is for about equally.Thus, when being pressed into wiring layer 207 in the bond layer 201, electric insulating quality material 202 fully is out of shape, the through-hole aperture of bond layer 201 can not enlarge, and can compression conductive slurry 205.Under the situation of present embodiment, be 9/22=about 41% as compression ratio.In fact, under the situation of maximum, the electrocondution slurry of the thickness of mould release film part forms from the surface of bond layer 201 is outstanding, and therefore, additional this thickness partly further improves compression ratio.The volume ratio of resinous principle in the electrocondution slurry 205 and conductor composition is considered printing and is set at about 50%, therefore, resinous principle in the electrocondution slurry 205 in the through hole 204 almost is extruded bond layer, in through hole 204, the conductor composition is by densification, and can obtain the through hole of high reliability under low resistance.In experiment, if the volume compressibility more than 20%, be electrically connected and be low resistance, improved connection reliability and be judged as.

In the present embodiment, the gross thickness of bond layer 201 and the thickness example about equally of wiring layer 207 are illustrated, and if the thickness of wiring layer is thicker than the thickness of bond layer, be electrically connected better.But,, therefore when wiring layer is blocked up, just can not be embedded between conductor because bonding agent is accommodated between the conductor of wiring layer.And, can reckon with that the quantitative change of electric insulating quality distortion of materials is big.This deflection is that residual copper rate changes with the density of wiring layer.

Therefore, if use the porous material in the space that has formed the constituent material that can hold the bond layer that is located at its two sides to be used as the electric insulating quality material, when then bond layer being flowed carrying out heating and pressurizing, the constituent material that can hold the bond layer of fusion, therefore, can compress electric insulating quality distortion of materials amount.Thus, can increase connection stability.And, because the constituent material of the bond layer under the wiring layer is accommodated between the figure of wiring layer, and consider that the amount of being pressed into changes with the figure configuration, but, in the electric insulating quality material owing to have the space that can hold the constituent material that is located at the bond layer that its two sides is provided with, thus, can be compressed to Min. to this variable quantity.

And, if use the porous material of the fine holes that constituent material with the bond layer that is located at its two sides can move to be used as the electric insulating quality material, when then bond layer being flowed carrying out heating and pressurizing, the constituent material of the bond layer of fusion can move between about the electric insulating quality material, thus, has better effect.The degree that the good trickle conductor composition in electrocondution slurry of this trickle Kongzui is not spilt.For example, be under the copper of the 10 μ m diameters situation of dividing at the conductor composition, be preferably 5 μ m degree as fine pore size.

Embodiment 3

Come the manufacture method of the multilayer circuit board in the third embodiment of the present invention is described below with reference to Fig. 4.

At first, identical with embodiment 2 shown in Fig. 4 (a), make double-sided wiring board.The 301st, bond layer, the 302nd, the electric insulating quality material, 304 are provided in a side of the through hole on the electric insulating quality material 302.Filled conductive slurry 305 in through hole 304.Electrocondution slurry 305 in the through hole 304 is compressed from a side by wiring layer 307.The 308th, Copper Foil.Shown in Fig. 4 (b), in wiring layer 307 sides, will have bond layer 311 and overlap on the two sides at the electric insulating quality material 312 that the through hole 314 of having filled electrocondution slurry 315 is set on the precalculated position with backing material 316 with the wiring layer 317 that forms predetermined pattern by above-mentioned such double-sided wiring board that forms.Then, shown in Fig. 4 (c), carry out heating and pressurizing, thereby carry out being electrically connected between wiring layer 307 and the wiring layer 317 by vacuum press.Then shown in Fig. 4 (c), remove backing material 316.The operation of above-mentioned Fig. 4 (b)～Fig. 4 (d) is repeated pre-determined number, carried out after predetermined number of layers stacked, shown in Fig. 4 (e), thereby Copper Foil 308 corrosion are finished multilayer circuit board for reservation shape.

On the multilayer circuit board of present embodiment,, hold rate and improved wiring owing to can on through hole (for example through hole 304), form through hole (for example through hole 314).And, because the surface of having removed after the backing material 316 is smooth, though stacked be multilayer, can not produce from the teeth outwards yet concavo-convex, thereby can become a lot of layers.

Multilayer circuit board of the present invention, because it is its surface is level and smooth, then when semiconductor bare chip is installed, all right.In fact the flatness of the multilayer circuit board of Zhi Zuoing is extremely smooth when being ± 5 μ m in the 10 μ m mouths in the semiconductor bare chip installation region.When on this substrate semiconductor bare chip being carried out upside-down mounting and install, because chip flatness down is good, then the mounting finished product rate is good, the installation reliability raising.

In the manufacture method of multilayer circuit board of the present invention, owing to carry out stackedly on Copper Foil 308, the change in size after stacked is compressed, and therefore, even become a lot of layers, also can suppress position deviation, can design by enough trickle design rules.

In the foregoing description 1～3, have wiring layer 107 (perhaps 207,317) backing material 106 (perhaps 206,316) can except that Fig. 2 explanation like that make like that according to following.

Method for making 1

Shown in Fig. 5 (a), make in the postpose operation Copper Foil of the thickness 18 μ m thickness that corrosion easily removes be used as backing material 26, on the surface of Copper Foil 26, do not have the nickel dam of through hole etc. to form 3 μ m and be used as corrosion barrier layer 22 by plating and evaporation and handle such as bonding.And the metal level of being made up of copper by plating and evaporation and formation such as bonding on the surface of corrosion barrier layer 22 21 is used as the wiring layer material.Wherein, need metal level 21 for should satisfying thickness fully, and be the thickness that can form trickle figure in the corrosion process afterwards less than the influence that is produced by sidewall corrosion etc. as the electrical characteristic of wiring layer.In this method for making, consider these and form 10 μ m thickness.

Then, identical with the situation of Fig. 2, use the bonding agent 24 comprise blowing agent that the substrates of being made up of the PET film 23 are bonded on the surperficial facing surfaces with the nickel dam 22 of stacked backing material 26 and copper layer 21 (Fig. 5 (b)).

Then, by the copper as the metal level 21 on surface is carried out photoetching, form the wiring layer 27 (Fig. 5 (c)) of desired figure.Use ammonium persulfate solution as corrosive liquid.At this moment, because the nickel of corrosion barrier layer 22 can not be corroded in ammonium persulfate solution, then only there is the copper of metal level 21 to be corroded.And,, can not be subjected to any intrusion because the copper of backing material 26 is protected from the inboard by substrate 23.

Then, be heated to predetermined temperature.Thus, blowing agent foams, and bonding agent 24 has been lost bonding force.Its result separates on the linkage interface of substrate 23 and backing material 26 easily.Like this, can access the duplexer (Fig. 5 (d)) of the wiring layer 27 that stacks gradually backing material 26, corrosion barrier layer 22 and form by the copper of desired figure.

Use the duplexer that is obtained by this method for making to come the backing material with wiring layer 107 106 of alternate embodiment 1, with the embodiment 1 identical heating and pressurizing of carrying out, identical with embodiment 1, wiring layer 27 is embedded in the bond layer 101.And, obtain being electrically connected between the inside and outside wiring layer 27 of electric insulating quality material 102.

Then, corrode the copper of backing material 26 with ammonium persulfate solution, then, with hydrochloric acid solution respectively individually corrosion remove nickel dam 22, thus, obtain wiring layer 27 and buried underground double-sided wiring board in the bond layer 101.

Though in above-mentioned example, copper as backing material 26, if different with corrosion barrier layer 22 corrosive liquids, can be used aluminium.And, on corrosion barrier layer 22, except that nickel, can use iron and chromium etc., by the selection of etchant solution, the combination of each material all is possible.

And not the duplexer under Fig. 5 (c) state to be heated to peel off remove substrate 23, but be layered in (with reference to Fig. 1 (f)) on the electric insulating quality material 102, when carrying out heating and pressurizing, by the blowing agent in the bonding agent 24 being heated to more than the temperature of foaming, can carry out the separation circuit of burying operation and substrate 23 of wiring layer 27 simultaneously to bond layer 101.

Method for making 2

Shown in Fig. 6 (a), substrate 33 is bonded to the back side of the backing material 36 that constitutes by aluminium by the bonding agent 34 that comprises blowing agent.

Then, in order to carry out being formed by the figure that the insulating properties material is produced on the surface of the aluminium of backing material 36, the photoresist that forms about 10 μ m thickness is used as the insulating properties material.The formation of photoresist can be undertaken by spin coating and roller coat etc.Then, carry out exposure imaging, come on the surface of backing material 36, to form photoresist figure 38 (Fig. 6 (b)) by mask with desired figure.

Then, on the surface that backing material 36 exposes, carry out copper facing, thus, form by the formed wiring layer 37 of the copper with desired figure (Fig. 6 (c)).

Wherein, be under the situation of electroless plating in plating, the copper of on photoresist figure 38, also growing up.Then, when removing photoresist, can remove the copper that (what is called unloads) grows up on photoresist figure 38 with photoresist.Therefore, enough thick if photoresist is compared with the thickness of the copper of plating, photoresist covers on the copper, and can not remove smoothly, therefore, can not obtain the wiring layer of desired figure.

But if electroplate, on the zone as the photoresist figure 38 of electrical insulating property material, copper can not plate, therefore, and plated with copper selectively on the zone of can be easily only exposing on the surface of backing material 36.Though can be layered in the corrosion barrier layer of explanation in the method for making 1 between backing material 36 and photoresist figure 38, in the case, corrosion barrier layer must be a conductive material.

Then, remove photoresist figure 38 (Fig. 6 (d)) with the sodium hydroxide solution of 3 weight % degree.

Then, be heated to predetermined temperature and make the blowing agent foaming of bonding agent 34, peel off substrate 33.Like this, obtain the backing material that forms wiring layer 37 36 (Fig. 6 (e)) that the copper by desired figure constitutes.

Resembling corrosion by adhering to of the formed copper of plating and not having sidewall corrosion like that of this method for making forms and can carry out figure reliably on the resist figure, therefore, is favourable in trickle figure forms.

In above-mentioned, not to peel off by heating to remove substrate 33 for the duplexer under Fig. 6 (d) state, but duplexer is laminated on the electric insulating quality material, carry out heating and pressurizing then, thus, can peel off and remove substrate 33, this situation with above-mentioned method for making 1 is identical.

Embodiment 4

Come the manufacture method of the multilayer circuit board in the fourth embodiment of the present invention is described below with reference to Fig. 7.

At first, identical with the 3rd embodiment, prepare made multilayer circuit board 410 and have the insulating barrier of predetermined layer and the central layer 411 of wiring layer.In the present embodiment, describe with the example that uses the above-mentioned multilayer circuit board that in existing example, illustrates to be used as central layer 411.Then shown in Fig. 7 (a), by carrying out overlapping at the electric insulating quality material 402 that has bond layer 401 on the two sides and on the precalculated position, have a through hole 404 of having filled electrocondution slurry 405.Such electric insulating quality material 402 obtains through the operation identical with Fig. 1 (a)～Fig. 1 (e) of first embodiment.Then, shown in Fig. 7 (b), carry out heating and pressurizing and the conductor 427 on central layer 411 top layers is embedded in the bond layer 401, thus, the electrocondution slurry 405 by in the compression through hole 404 carries out being electrically connected between multilayer circuit board 410 and the central layer 411.At last, shown in Fig. 7 (c), Copper Foil 408 selective etchings on multilayer circuit board 410 top layers are become predetermined shape, and finish the multilayer circuit board that on the top layer of above-mentioned multilayer circuit board, has the fine pitch wirings figure.

Above-mentioned multilayer circuit board is a substrate good on the wiring property held, and by the fine pitch wirings figure is set on its top layer, has further improved wiring and has held rate.And, in semiconductor bare chip is installed, on the top layer, need and the corresponding trickle wiring of its filling spacing, but can install corresponding with such semiconductor bare chip.

In the present embodiment, though the example that multilayer circuit board 410 is set in the side as the above-mentioned multilayer circuit board of central layer 411 is illustrated,, on the warpage of circuit slab integral, be favourable in the scheme that is provided with on the two sides.

In multilayer circuit board of the present invention, the example that uses the above-mentioned multilayer circuit board that illustrates in existing example to be used as central layer 411 is described, still, be not limited in this.For example, can use the glass epoxide multilayer circuit board as central layer 411.In the case, be easy on the glass epoxide multilayer circuit board, form fine pitch wirings, compare, have such effect with what is called assembling wiring board:

(1) owing to can come by other processing on Copper Foil, to form the fine pitch wirings layer, and increases the degree of freedom of treatment conditions etc., had high-performance.

(2) owing to after the formation fine pitch wirings layer on Copper Foil, stacked being transferred on the central layer, the position overlaps and can carry out more cursorily, and has improved rate of finished products.Can further under large tracts of land, make.

The wiring layer transfer printing is being formed on the top layer and on the multilayer circuit board that obtains, can by embodiment 1～3 explanation like that, under high-fire resistance, use the thin-film material of high rigidity, therefore, heat treated in the time of can tolerating the semiconductor bare chip installation can suppress change in size.

When the manufacture method of the multilayer circuit board that uses present embodiment, owing to can make multilayer circuit board 410 and the central layer 411 of checking the top layer respectively, and can improve comprehensive rate of finished products.And owing to use the electric insulating quality material of no trickle through hole in link, then the position registration accuracy reduces, and can make easily.

In the present embodiment, though the example that the wiring layer 427 on the top layer of central layer 411 is embedded in the bond layer 401 is illustrated, but, for with the multilayer circuit board shown in the same Fig. 4 (c) that makes of the 3rd embodiment, can be laminated to electric insulating quality material 402 sides to the wiring layer side of forming by the Copper Foil 308 that has carried out selective etching.In the case, the wiring layer on the top layer of multilayer circuit board 410 is embedded in the bond layer 401.Because the wiring layer of being made up of Copper Foil 308 has compressed the electrocondution slurry 405 in the through hole 404, then has effect same as described above.

In above-mentioned, do not remove backing material 316, carry out heating and pressurizing, after being embedded in the bond layer 401, remove backing material 316 at last to the wiring layer 308 on the top layer of multilayer circuit board 410.In the case, the fine pitch wirings layer on top layer also comprises backing material 316 when heating and pressurizing, before finishing, the multilayer circuit board of present embodiment protected by backing material 316, and therefore, on making, be favourable.

And, can be embedded in 308 liang of sides of the wiring layer on the top layer of the wiring layer 427 on the top layer of central layer 411 and multilayer circuit board 410 in the bond layer 401.In the case, because the electrocondution slurry 405 in the through hole 404 is compressed from both sides, so the compression of electrocondution slurry is further to become big, thereby can further improve the connection reliability that is produced by electrocondution slurry.

Embodiment 5

In embodiment 4, on the two sides, replace the electric insulating quality material 402 that has bond layer 401 and have the through hole 404 of having filled electrocondution slurry 405, use has on the precalculated position substrate conjugant of the being compressed property of filled conductive slurry in the formed through hole, makes multilayer circuit board.

Constituent material as the substrate conjugant, it is the material of electric insulating quality, for example can use materials such as glass epoxide resinoid, phenolic resin, polyimide based resin, polyester resin, aromatic polyamide resin, in the aromatic polyamide nonwoven fabrics, flood epoxy resin and made it become the prepreg of semi-cured state (B level state) and generally can use.This prepreg is carried out hole processing by laser processing on the precalculated position, in this through hole, fill and contain for example electrocondution slurry of conductor composition such as Ag, Cu or Ag-Cu alloy.At this moment, when electrocondution slurry is formed from the surface of substrate conjugant when outstanding, electrocondution slurry is by good compression, can carry out being electrically connected of multilayer circuit board 410 and central layer 411 with low resistance.In the present embodiment, the prepreg at the about 0.1mm of thickness that has flooded epoxy resin in the aromatic polyamide nonwoven fabrics is used CO ₂Laser carries out hole processing on desirable position, fill the Cu slurry so that outstanding slightly from the surface in this through hole.

Then, multilayer circuit board 410 and aforesaid substrate conjugant and central layer 411 are added hot compression.In the present embodiment, with pressure 45～55kg/cm ², carry out 60 minutes the hot compression that adds under 200 ℃ of the temperature.Thus, the conductor 427 at the surperficial upper process of central layer 411 submerges in the epoxy resin of substrate conjugant.At this moment, because electrocondution slurry is clipped in the conductor 427 on surface of the wiring layer of multilayer circuit board 410 and central layer 411 simultaneously, then the electrocondution slurry of filling in inside is compressed, and above-mentioned wiring layer and above-mentioned conductor 427 are electrically connected.

In the present embodiment, the example that conductor 427 at the surperficial upper process of central layer 411 is embedded in the substrate conjugant is illustrated, but, also can with in the 4th embodiment, illustrate identical, be formed on the wiring layer of the lamination surface lateral process of multilayer circuit board 410, also can play same effect.And, can be being embedded in the substrate conjugant at the conductor 427 of the surperficial upper process of central layer 411 and wiring layer at the surperficial upper process of multilayer circuit board 410.In the case, because the electrocondution slurry in the through hole is compressed from both sides, the decrement of electrocondution slurry is bigger, thereby can further improve by the formed connection reliability of electrocondution slurry.

When roughened is carried out on the surface of the conductor 427 on the surface of the surface of the wiring layer of the multilayer circuit board 410 that contacts with electrocondution slurry and central layer 411, improve by the formed connection reliability of electrocondution slurry.In the present embodiment, before heating and pressurizing, handle by the melanism of using NaOH 15g/ liter, sodium phosphate 12g/ liter, chloritization sodium 30g/ to rise to the surface of the conductor 427 of the surface of the wiring layer of multilayer circuit board 410 and central layer 411, thus, carry out asperitiesization with the roughness of 0.5 μ m degree.Handling the film generated by melanism on copper foil surface is dielectric film, still, because extremely thin, then destroyed easily and conducting when heating and pressurizing.

As the method for asperitiesization, can use electrolytic copper plating.That is, compare with the condition of making Copper Foil, improved current density, the method that copper is separated out unusually to pimple generally is known.When using this method, the film that is on copper foil surface to be generated is a copper, can access more stable connection.

As seeing from the above description, the invention provides a kind of wiring board, filled conductive body in the through hole on the electric insulating quality material that is located at two sides formation bond layer, come to form between the wiring layer of predetermined pattern on the electric two sides that is connected above-mentioned electric insulating quality material with above-mentioned electric conductor, by at least above-mentioned wiring layer of the side being embedded in the above-mentioned bond layer, electric conductor in the through hole is compressed fully, its result, the conductor composition of electric conductor is by densification, initial resistivity value reduces, and can realize that the trickle through hole with high reliability connects.

Claims (34)

1. wiring board, filled conductive body in the through hole of on the thickness direction of electric insulating quality material, leaving, come to form between the wiring layer of predetermined pattern on the electric two sides that is connected above-mentioned electric insulating quality material with above-mentioned electric conductor, it is characterized in that, two sides at above-mentioned electric insulating quality material forms bond layer, and at least one side's above-mentioned wiring layer is embedded in the above-mentioned bond layer.

2. wiring board according to claim 1 is characterized in that electric conductor is an electrocondution slurry.

3. wiring board according to claim 1 and 2 is characterized in that, covers through hole with wiring layer.

4. according to each described wiring board of claim 1 to 3, it is characterized in that, form wiring layer the part of through hole is exposed.

5. according to each described wiring board of claim 1 to 4, it is characterized in that relative with through hole at least wiring layer surface is carried out roughening treatment.

6. the manufacture method of a wiring board has: the operation that through hole is set on the electric insulating quality material of two sides formation bond layer; The operation of filled conductive slurry in above-mentioned through hole; Overlapping wiring layer is formed the operation of the backing material of predetermined pattern on the one side at least of above-mentioned electric insulating quality material; Carry out heating and pressurizing and compress by above-mentioned electric insulating quality material, in above-mentioned bond layer, bury the operation of above-mentioned wiring layer underground overlapping above-mentioned backing material; The operation that stays above-mentioned wiring layer and remove above-mentioned backing material.

7. the manufacture method of a wiring board has: paste one side and form the mould release film of bond layer so that above-mentioned bond layer and the contacted operation of above-mentioned electric insulating quality material on the two sides of electric insulating quality material; Has the operation that through hole is set on the electric insulating quality material of above-mentioned mould release film; The operation of filled conductive slurry in above-mentioned through hole; On above-mentioned electric insulating quality material, stay above-mentioned bond layer and peel off the operation of above-mentioned mould release film; Overlapping wiring layer is formed the operation of the backing material of predetermined pattern on the one side at least of above-mentioned electric insulating quality material; Carry out heating and pressurizing and compress by above-mentioned electric insulating quality material, in above-mentioned bond layer, bury the operation of above-mentioned wiring layer underground overlapping above-mentioned backing material; The operation that stays above-mentioned wiring layer and remove above-mentioned backing material.

8. according to the manufacture method of claim 6 or 7 described wiring boards, it is characterized in that carrying out heating and pressurizing electric insulating quality material before is the thermosetting resin of semi-cured state and the composite material of the cloth that glass is made into, bond layer is above-mentioned thermosetting resin.

9. according to the manufacture method of claim 6 or 7 described wiring boards, it is characterized in that carry out electric insulating quality material before the heating and pressurizing and be the film based on organic material, bond layer is the organic resin of semi-cured state.

10. according to the manufacture method of claim 6 or 7 described wiring boards, it is characterized in that the thickness of set bond layer is the thickness that is substantially equal to or is thinner than the wiring layer of being buried underground in above-mentioned bond layer on the surface of the electric insulating quality material before carrying out heating and pressurizing.

11. the manufacture method according to claim 6 or 7 described wiring boards is characterized in that, carries out the space that heating and pressurizing electric insulating quality material before has the constituent material that can hold bond layer.

12. the manufacture method according to claim 6 or 7 described wiring boards is characterized in that, carries out having on the electric insulating quality material before the heating and pressurizing the trickle hole that the constituent material of bond layer can move.

13. the manufacture method according to claim 6 or 7 described wiring boards is characterized in that, the operation that stays wiring layer and remove backing material is dissolved selectively and is removed above-mentioned backing material.

14. the manufacture method according to claim 6 or 7 described wiring boards is characterized in that wiring layer and backing material are made of the material that can remove selectively respectively.

15. manufacture method according to claim 6 or 7 described wiring boards, it is characterized in that, on the surface of backing material, form the corrosion barrier layer more than one deck at least, on above-mentioned corrosion barrier layer surface wiring layer is set, above-mentioned wiring layer and above-mentioned at least corrosion barrier layer are made of the material that can remove selectively respectively.

16. manufacture method according to claim 6 or 7 described wiring boards, it is characterized in that the backing material that forms above-mentioned wiring layer is preferably through following operation and obtain: on the backing material surface or be formed on the operation that forms insulating properties material figure on the lip-deep corrosion barrier layer of the backing material surface; In the zone that above-mentioned backing material surface or corrosion barrier layer surface spill, thereby adhere to the operation that conductive material forms the wiring layer of required figure by plating.

17. manufacture method according to claim 6 or 7 described wiring boards, it is characterized in that the backing material that forms above-mentioned wiring layer preferably obtains through following operation: the operation of using the bonding agent of forfeiture bonding force more than predetermined temperature to come multilayer board in the inside of backing material; On the surface of above-mentioned supporting substrate directly or form the operation of wiring layer by corrosion barrier layer.

18. multilayer circuit board, electric insulating quality material with through hole of the thickness direction of having filled electric conductor carries out stacked more than 2 layers by bond layer, it is characterized in that, have the wiring layer that forms predetermined pattern in above-mentioned bond layer, above-mentioned wiring layer comes to be electrically connected with the above-mentioned electric conductor of the above-mentioned electric insulating quality material of its both sides by apply compression stress on stacked direction.

19. the manufacture method of a multilayer circuit board, it is characterized in that, repeat following operation: have bond layer on the two sides and have the operation that overlapping wiring layer on the one side of electric insulating quality material of through hole of filled conductive slurry is formed the backing material of predetermined pattern; By carrying out heating and pressurizing and compressing above-mentioned wiring layer is buried underground operation in the above-mentioned bond layer; The operation that stays above-mentioned wiring layer and remove above-mentioned backing material.

20. the manufacture method of multilayer circuit board according to claim 19 is characterized in that, wiring layer and backing material are made of the material that can remove selectively respectively.

21. the manufacture method of multilayer circuit board according to claim 19, it is characterized in that, on the surface of backing material, form the corrosion barrier layer more than one deck at least, on above-mentioned corrosion barrier layer surface wiring layer is set, above-mentioned wiring layer and above-mentioned at least corrosion barrier layer are made of the material that can remove selectively respectively.

22. the manufacture method of multilayer circuit board according to claim 19, it is characterized in that the backing material that forms above-mentioned wiring layer is through following operation and obtain: on the backing material surface or be formed on the operation that forms insulating properties material figure on the lip-deep corrosion barrier layer of the backing material surface; In the zone that above-mentioned backing material surface or corrosion barrier layer surface spill, thereby adhere to the operation that conductive material forms the wiring layer of figure by plating.

23. the manufacture method of multilayer circuit board according to claim 19, it is characterized in that the backing material that forms above-mentioned wiring layer obtains through following operation: the operation of using the bonding agent of forfeiture bonding force more than predetermined temperature to come multilayer board in the inside of backing material; On the surface of above-mentioned supporting substrate directly or form the operation of wiring layer by corrosion barrier layer.

24. multilayer circuit board, it is characterized in that, the formed wiring layer and the wiring layer on top layer with central layer of predetermined insulating barrier and wiring layer are electrically connected by the electric insulating quality material that has bond layer and have a through hole of having filled electric conductor on the two sides on the top layer of the described multilayer circuit board of claim 18, and at least one side in the wiring layer on the wiring layer on the top layer of above-mentioned multilayer circuit board and the top layer of above-mentioned central layer is embedded in the above-mentioned bond layer.

25. the manufacture method of a multilayer circuit board, it is characterized in that having following operation: the described multilayer circuit board of claim 18 by overlap onto the operation on the central layer with predetermined insulating barrier and wiring layer at the electric insulating quality material that has bond layer on the two sides and have a through hole of having filled electrocondution slurry; To overlapping central layer and above-mentioned multilayer circuit board carries out heating and pressurizing by above-mentioned electric insulating quality material, thus, at least one side in the wiring layer on the top layer of wiring layer that forms and above-mentioned central layer is embedded in operation in the above-mentioned bond layer on the top layer of above-mentioned multilayer circuit board.

26. manufacture method according to claim 19 or 25 described multilayer circuit boards, it is characterized in that, carrying out heating and pressurizing electric insulating quality material before is the thermosetting resin of semi-cured state and the composite material of the cloth that glass is made into, and bond layer is above-mentioned thermosetting resin.

27. the manufacture method according to claim 19 or 25 described multilayer circuit boards is characterized in that, carries out electric insulating quality material before the heating and pressurizing and be the film based on organic material, bond layer is the organic resin of semi-cured state.

28. manufacture method according to claim 19 or 25 described multilayer circuit boards, it is characterized in that the thickness of set bond layer is substantially equal to or is thinner than the thickness of the wiring layer of burying underground on the surface of the electric insulating quality material before carrying out heating and pressurizing in above-mentioned bond layer.

29. the manufacture method according to claim 19 or 25 described multilayer circuit boards is characterized in that, has the space of the constituent material that can hold bond layer on the electric insulating quality material before carrying out heating and pressurizing.

30. the manufacture method according to claim 19 or 25 described multilayer circuit boards is characterized in that, has the trickle hole that the constituent material of bond layer can move on the electric insulating quality material before carrying out heating and pressurizing.

31. multilayer circuit board, it is characterized in that, the described multilayer circuit board of claim 18 is undertaken stacked with the central layer with predetermined insulating barrier and wiring layer by the substrate conjugant with the through hole of having filled electric conductor, the wiring layer on the wiring layer that forms on the top layer of above-mentioned multilayer circuit board and the top layer of above-mentioned central layer is electrically connected by above-mentioned electric conductor, and stacked preceding aforesaid substrate conjugant has the property of being compressed.

32. multilayer circuit board according to claim 31, it is characterized in that the material that constitutes the aforesaid substrate conjugant is the selected at least a material the resinous fibre plate material that soaks from being made up of the composite material of glass fibre non-woven or organic fiber nonwoven fabrics and thermosetting resin at least.

33. the manufacture method of a multilayer circuit board, it is characterized in that, comprise following operation: the described multilayer circuit board of claim 18 is carried out overlapping operation by the substrate conjugant with being compressed property of having filled electrocondution slurry in through hole with the central layer with predetermined insulating barrier and wiring layer; To by the aforesaid substrate conjugant overlapping above-mentioned multilayer circuit board and central layer carry out heating and pressurizing, thus, the operation of coming the wiring layer to formed wiring layer and above-mentioned central layer on the top layer of above-mentioned multilayer circuit board to be electrically connected by above-mentioned electrocondution slurry.

34. the manufacture method of multilayer circuit board according to claim 33 is characterized in that, in the substrate conjugant before carrying out heating and pressurizing, the electrocondution slurry that is filled in the through hole of substrate conjugant is outstanding from substrate conjugant surface.

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