CN101976716A - Electric conduction method of base plate through holes - Google Patents
Electric conduction method of base plate through holes Download PDFInfo
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- CN101976716A CN101976716A CN 201010514069 CN201010514069A CN101976716A CN 101976716 A CN101976716 A CN 101976716A CN 201010514069 CN201010514069 CN 201010514069 CN 201010514069 A CN201010514069 A CN 201010514069A CN 101976716 A CN101976716 A CN 101976716A
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- base plate
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- metallic circuit
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Abstract
The invention relates to an electric conduction method of base plate through holes, which belongs to the field of electrics. The electric conduction method mainly comprises the following steps of: respectively installing a peeling film at two side surfaces of a base plate; forming through holes which are respectively penetrated through each peeling film on the base plate; filling conductive adhesives into each through hole; respectively peeling each peeling film; depositing a metal conductive layer on the surface of the base plate from which each peeling film is peeled; forming a specific molding pattern by the lithography technology on the base material deposited with the metal conductive layer; forming a metal line layer on the base material by applying the electrochemical technology; and removing the specific molding pattern and the metal conductive layer. Through the method, the surface of the base plate can not be polluted through the conductive adhesives, in addition, the direct attachment of the metal conductive layer on the base plate can be achieved by the depositing technology, at the same time, small-line-width metal lines are formed by utilizing lithography process, and the layout density of LED (Light Emitting Diode) assemblies can be improved.
Description
Technical field
The present invention relates to electric information,, refer to that especially a kind of utilization detachment film does not stain ceramic substrate to reach conducting resinl, and can on ceramic substrate, form the conductive method of the substrate through-hole of metal conducting layer by deposition for a kind of conductive method of substrate through-hole is provided.
Background technology
The present application that can see emitting led diode commodity of all kinds in life, for example traffic lights, locomotive taillight, auto bulb, street lamp, computer indicator light, flashlight, LED-backlit source etc.These commodity all must be through very important program-encapsulation together except the led chip processing procedure of necessity.The LED encapsulation function is to provide necessity support on LED chip electricity, light, the heat.For example semiconductor subassembly is exposed in the atmosphere for a long time, can be subjected to the chemical substance in aqueous vapor or other environment and wears out, and causes the decline of characteristic.Selecting for use the epoxy resin of the high grade of transparency to coat light-emitting diode, is a kind of method of effectively isolated atmosphere.Select for use suitable base material can provide the LED assembly enough heat sinking functions in addition, the reliability of LED is significantly promoted, promote the luminous efficiency of LED crystal grain simultaneously and increase useful life.
As shown in Figure 1, be the generalized section of existing substrate through-hole filling conducting resinl,, at first on substrate 1, be formed with through hole 10 for shortening the electric signal transmission range, and a metallic shield 12 is set on substrate 1, and, then carry out encapsulating again, owing to use this kind metallic shield 12 with the through hole 10 on 120 align substrates 1 of the perforation in the metallic shield 12, have alignment issues, large tracts of land is because of dimensional effect, and accumulated error is big in edge, more can't aim at filling perforation.
The method of another kind of filling conducting resinl is used and is electroplated filling perforation (drawing does not show), its overall process complexity, increase man-hour, the cost height is difficult for complete the filling out of through hole covered, and uses pulse plating then effect improved limited, still have bubble in the through hole, have the qualification rate problem, add power supply unit cost height, the power supply unit quantity of using during production and the configuration in board circuit and space will become one and bear greatly.
Summary of the invention
Main purpose of the present invention is to provide a kind of utilization detachment film not stain ceramic substrate to reach conducting resinl, and can form the conductive method of the substrate through-hole of metal conducting layer on ceramic substrate by deposition.Solve its overall process complexity of method of existing filling conducting resinl, increase man-hour, the cost height is difficult for complete the filling out of through hole covered, and uses the then effect improved limited problem of pulse plating.
For reaching above-mentioned purpose, main method of the present invention comprises:
A, be equipped with a detachment film in substrate two side faces branch; B, on this substrate, be formed with and run through the respectively through hole of this detachment film respectively; C, in this through hole filled conductive glue respectively; D, aforementioned respectively this detachment film is peeled off respectively; E, this substrate surface of this detachment film deposits a metal conducting layer in breaking away from respectively; F, be formed with a specific model pattern in this base material that deposits this metal conducting layer; G, on this base material, be formed with a metallic circuit layer in addition; H, remove specific model pattern and metal conducting layer.
Wherein this substrate is a ceramic substrate;
After wherein this metallic circuit layer forms, then respectively this specific model pattern and metal conducting layer are removed, make the conducting wire of this metallic circuit layer have insulation effect to each other;
Wherein this specific model pattern uses little shadow technology to form;
Wherein these metallic circuit layer utilization electrochemical techniques form.
The invention has the advantages that: the formed through hole of detachment film and substrate has the self-aligned function, conducting resinl can fully enter to fill out in the through hole and cover and do not have bubble and produce when filling perforation, and can not stain substrate surface, therefore need not additionally substrate surface to be made clean, lowering apparatus equipment cost and man-hour, in addition, utilize deposition technique to reach metal conducting layer and directly be attached to substrate, also use micro-photographing process to form little live width metallic circuit simultaneously, use promoting LED assembly layout density; Metal conducting layer can directly adhere to substrate on, non-in the attaching mode, therefore can strengthen its coating intensity.
Description of drawings
Fig. 1 is the generalized section of existing substrate through-hole filling conducting resinl.
Fig. 2 ~ Fig. 9 is the step profile of substrate manufacture of the present invention.
Embodiment
To shown in the accompanying drawing 9, be the step profile of substrate manufacture of the present invention as accompanying drawing 2, find out and the present invention includes by knowing among the figure: a) be equipped with a detachment film in substrate two side faces branch; B) on this substrate, be formed with and run through the respectively through hole of this detachment film respectively; C) in this through hole filled conductive glue respectively; D) aforementioned respectively this detachment film is peeled off respectively; E) this substrate surface of this detachment film deposits a metal conducting layer in breaking away from respectively; F) use little shadow technology to be formed with a specific model pattern in this base material that deposits this metal conducting layer; G) on this base material, use electrochemical techniques to be formed with a metallic circuit layer and a h in addition) remove specific model pattern and metal conducting layer.
At first, step a) utilizes pottery as substrate 2, because the ceramic substrate thermal conduction characteristic is good, the heat energy that produces when can be with high-capacity LED luminous exports to the external world rapidly, make LED crystal grain not reason heat energy accumulation elevate the temperature and influence luminous efficiency and useful life, ceramic substrate has more characteristics such as high temperature resistant, high humidity simultaneously, key property wherein is an insulator, therefore can be used as line carrier plate, before substrate 2 is done through hole, be equipped with a detachment film 20 prior to substrate 2 both sides.
Then carry out step b), to the substrate 2 that is bonded with detachment film 20, carry out laser processing in its predetermined surface, make the detachment film 20 of substrate 2 and substrate 2 two sides all be formed with the identical through hole in position 22, laser light can be used such as optical fiber laser, CO2 Lasers, YAG laser, excimers laser etc.
Then carry out step c), the substrate 2 that forms through hole 22 is placed in (drawing does not show) on the board, then conducting resinl 3 is filled in through hole 22,3 of conducting resinls can be spilled over to detachment film 20 surfaces simultaneously.When filled conductive glue 3, can carry out the single face filling by substrate 2; Also can simultaneously carry out filling synchronously in substrate 2 two sides, make conducting resinl 3 can stablize and filling positively in through hole 22, by this mode, can not only reach antipollution purpose, need not use shielding work aligning step again.
Then carry out step d), after finishing the filling of above-mentioned conducting resinl 3, then the detachment film 20 of substrate 2 both sides can be peeled off respectively, this moment, the former part that is provided with detachment film 20 then presented complete free of contamination state around the through hole 22 of substrate 2, therefore also need not carry out the cleaning surfaces of substrate 2.
Then carry out step e), substrate 2 surfaces that break away from detachment film 20 are deposited (this is example with the sputter) to form a metal conducting layer 24, be beneficial at substrate 2 electro-coppering circuits, because sputter is to utilize the argon ion bombardment target, hit target atom and become gas phase and analyse and be plated on the substrate 2, therefore have advantages such as pollution-free, that tack is good.
Then carry out step f), after finishing metal conducting layer 24 sputters on aforesaid substrate 2 surfaces, then use little shadow technology to be formed with a specific model pattern 26, with negative photoresistance is example, when carrying out micro-photographing process, utilize the energy of light to make photoresistance (photoresist) character that is subjected to illumination change the generation bond, thereby when developing (develop) not the photoresistance of irradiation part fall dissolved, be subjected to the illumination part then to form pattern, form specific model pattern 26 to reach at metal conducting layer 24 by this technology.
Then carry out step g), in aforementioned substrates 2 with formed specific model pattern 26 on the utilization electrochemical techniques be formed with a metallic circuit layer 28, because aforesaid metallic circuit layer 28 forms with plating mode, this line layer 28 can have suitable thickness, therefore constitute basic circuit embryo, because this step g) is to electroplate direct formation metallic circuit layer 28, so possess desirable characteristics of electrical conductivity and radiating effect.
Utilize pottery can not only promote radiating effect, use micro-photographing process to form little live width metallic circuit simultaneously, can promote LED assembly layout density as the base material 2 and the metallic circuit layer 28 of arranging in pairs or groups.
Then carry out step h), shown in accompanying drawing 7 and accompanying drawing 8, the conductive method of aforesaid base plate 2 through holes 22 can be included in again and form after this metallic circuit layer 28, should remove by specific model pattern 26, to expose this metal conducting layer 24, then carry out etch process again, make the conducting wire of this metallic circuit layer 28 have insulation effect to each other with this metal conducting layer 24 that removal exposes.
Claims (5)
1. the conductive method of a substrate through-hole is characterized in that: a) be equipped with a detachment film in substrate two side faces branch; B) on this substrate, be formed with and run through the respectively through hole of this detachment film respectively; C) in each through hole filled conductive glue; D) aforementioned respectively this detachment film is peeled off respectively; E) this substrate surface of this detachment film deposits a metal conducting layer in breaking away from respectively; F) be formed with a specific model pattern in this base material that deposits this metal conducting layer; G) on this base material, be formed with a metallic circuit layer in addition; H) remove specific model pattern and metal conducting layer.
2. the conductive method of substrate through-hole according to claim 1, it is characterized in that: wherein this substrate is a ceramic substrate.
3. the conductive method of substrate through-hole according to claim 1 is characterized in that: after wherein this metallic circuit layer forms, then respectively this specific model pattern and metal conducting layer are removed, make the conducting wire of this metallic circuit layer have insulation effect to each other.
4. the conductive method of substrate through-hole according to claim 1, it is characterized in that: wherein this specific model pattern uses little shadow technology to form.
5. the conductive method of substrate through-hole according to claim 1 is characterized in that: wherein these metallic circuit layer utilization electrochemical techniques form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010514069 CN101976716A (en) | 2010-10-21 | 2010-10-21 | Electric conduction method of base plate through holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010514069 CN101976716A (en) | 2010-10-21 | 2010-10-21 | Electric conduction method of base plate through holes |
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| CN101976716A true CN101976716A (en) | 2011-02-16 |
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| CN 201010514069 Pending CN101976716A (en) | 2010-10-21 | 2010-10-21 | Electric conduction method of base plate through holes |
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| CN1274257A (en) * | 1999-05-18 | 2000-11-22 | 松下电器产业株式会社 | Shielding thin film, its mfg. method, and method for mfg. circuit substrate using such shielding film |
| CN1336789A (en) * | 2000-06-14 | 2002-02-20 | 松下电器产业株式会社 | Printed circuit plate and its mfg. method |
| CN1339941A (en) * | 2000-08-17 | 2002-03-13 | 松下电器产业株式会社 | Line board and its producing mehtod |
| CN1394465A (en) * | 2000-10-16 | 2003-01-29 | 松下电器产业株式会社 | Circuit forming board producing method, circuit foaming board, material for circuit forming board |
| CN1433253A (en) * | 2002-01-18 | 2003-07-30 | 松下电器产业株式会社 | Printed circuit board and its making process |
| CN1578589A (en) * | 2003-07-25 | 2005-02-09 | 松下电器产业株式会社 | Wiring substrate for intermediate connection and multi-layered wiring board and their production |
| CN1624906A (en) * | 2003-12-04 | 2005-06-08 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same, semiconductor package, component built-in module |
| CN101543149A (en) * | 2007-05-29 | 2009-09-23 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same |
| CN101765341A (en) * | 2008-12-26 | 2010-06-30 | 南亚电路板股份有限公司 | Molding structure and method for laser-assisting base plate line |
-
2010
- 2010-10-21 CN CN 201010514069 patent/CN101976716A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1211160A (en) * | 1997-07-16 | 1999-03-17 | 松下电器产业株式会社 | Wiring board and its producing method |
| CN1241894A (en) * | 1998-05-14 | 2000-01-19 | 松下电器产业株式会社 | Circuit board and its producing method |
| CN1274257A (en) * | 1999-05-18 | 2000-11-22 | 松下电器产业株式会社 | Shielding thin film, its mfg. method, and method for mfg. circuit substrate using such shielding film |
| CN1336789A (en) * | 2000-06-14 | 2002-02-20 | 松下电器产业株式会社 | Printed circuit plate and its mfg. method |
| CN1339941A (en) * | 2000-08-17 | 2002-03-13 | 松下电器产业株式会社 | Line board and its producing mehtod |
| CN1394465A (en) * | 2000-10-16 | 2003-01-29 | 松下电器产业株式会社 | Circuit forming board producing method, circuit foaming board, material for circuit forming board |
| CN1433253A (en) * | 2002-01-18 | 2003-07-30 | 松下电器产业株式会社 | Printed circuit board and its making process |
| CN1578589A (en) * | 2003-07-25 | 2005-02-09 | 松下电器产业株式会社 | Wiring substrate for intermediate connection and multi-layered wiring board and their production |
| CN1624906A (en) * | 2003-12-04 | 2005-06-08 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same, semiconductor package, component built-in module |
| CN101543149A (en) * | 2007-05-29 | 2009-09-23 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same |
| CN101765341A (en) * | 2008-12-26 | 2010-06-30 | 南亚电路板股份有限公司 | Molding structure and method for laser-assisting base plate line |
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Application publication date: 20110216 |