CN117545178A

CN117545178A - Mini-LED backlight core board and preparation method thereof

Info

Publication number: CN117545178A
Application number: CN202311424944.7A
Authority: CN
Inventors: 颜怡锋; 吴世平; 刘勇; 陈洋
Original assignee: Shenzhen Sunshine Circuit Technology Co ltd
Current assignee: Shenzhen Sunshine Circuit Technology Co ltd
Priority date: 2023-10-31
Filing date: 2023-10-31
Publication date: 2024-02-09

Abstract

The invention discloses a preparation method of a mini-LED backlight core board, which comprises the steps of performing flash etching copper reduction on the core board before electroplating copper deposition, wherein the flash etching copper reduction comprises the following steps: and repairing the copper layer on the surface of the core plate in a height difference manner, so that the copper layer on the surface of the core plate is flush in height, and reducing copper in the repaired copper layer on the surface of the core plate. According to the mini-LED backlight core board and the preparation method thereof, the copper layer is repaired in a height difference mode before copper reduction, so that the copper layer on the surface of the core board is flush, the thickness uniformity of the thinned copper layer is ensured, and the uniformity of electroplating copper deposition is improved. The mini-LED backlight core board prepared by the method can ensure consistency of electroplated copper layers and effectively improve signal transmission performance and product stability of the mini-LED backlight core board.

Description

Mini-LED backlight core board and preparation method thereof

Technical Field

The invention relates to the field of semiconductor carrier plates, in particular to a mini-LED backlight core plate and a preparation method thereof.

Background

Mini LEDs, also known as "sub-millimeter light emitting diodes," mean the problem of LEDs with die sizes of approximately 100 microns. Mini LEDs have been widely paid attention to since birth, and their downstream applications can cover many fields such as RGB display screens, notebook computer backlights, television backlights, cell phone backlights, vehicle displays, etc.

The LCD display screen of Mini LED backlight technology is far superior to the current LCD display in brightness, contrast, color reduction and energy saving, even can compete with AMOLED, and can control the production cost, so that the application of the Mini LED backlight core board in the fields of display screens and the like is more and more extensive.

When copper is deposited after drilling, the Mini LED backlight core board can cause different thickness of copper layers at the hole edges, and at the moment, if copper is directly electroplated and deposited, the height of the electroplated copper layer is uneven, so that the subsequent signal transmission is affected. In the prior art, the copper layer is thinned before electroplating copper deposition, so that the thickness of the copper layer is basically consistent during electroplating copper deposition. However, due to the fact that the size of the mini-LED backlight core board is small, the area of the copper layer between the holes is small, the uniform copper layer cannot be obtained by adopting the existing thinning measure, and further uniformity of electroplating copper deposition cannot be ensured, and signal transmission performance and product stability of a finished product of the mini-LED backlight core board are affected.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the invention aims to provide a mini-LED backlight core board and a preparation method thereof, wherein the copper layer is repaired in a height difference way before copper reduction, so that the copper layer on the surface of the core board is flush in height, the thickness uniformity of the thinned copper layer is ensured, and the uniformity of electroplating copper deposition is further improved.

In order to achieve the above purpose, the present application adopts the following technical scheme: the preparation method of the mini-LED backlight core board comprises the steps of performing flash etching copper reduction on the core board before electroplating copper deposition, wherein the flash etching copper reduction comprises the following steps:

repairing the copper layer on the surface of the core plate in a height difference manner so that the copper layer on the surface of the core plate is level;

and (5) copper reduction is carried out on the copper layer of the core plate surface after the repair.

Further, the flash etching copper reduction process specifically comprises the following steps:

placing a core plate in a first repair groove, wherein the first repair groove contains an additive, and the additive enables the potential of a thin copper layer in the core plate to be greater than that of a thick copper layer; the copper layer on the surface of the core plate is leveled by repairing copper deposition;

and placing the core plate in a second etching groove, wherein the second etching groove contains an etchant for thinning the copper layer on the surface of the core plate.

Further, the additive is a gloss agent and/or an inhibitor.

Further, the copper layer on the surface of the core plate is repaired by adopting a chemical copper deposition method in the first repair groove.

Further, the electroplating copper deposition includes: the plurality of clamping heads are uniformly clamped on the surface of the core plate, the clamping heads are conductors, and the distances between the plurality of clamping heads and the anode are equal, so that the plurality of clamping heads are ensured to simultaneously copper-plate the surface of the core plate.

Further, the distances between the clamping heads and the electroplating cathode are all smaller than or equal to 1mm.

Further, the clamping head simultaneously clamps the core plate from the front side and the back side of the core plate, and the part, which is contacted with one end to be electroplated, of the surface of the core plate is a conductor.

Further, after the electroplating copper deposition, the method further comprises the following steps: pasting a dry film, exposing to form an etching pattern, and performing an etching process by adopting a soaking type flash etching process to perform AOI detection; wherein the immersion flash etching comprises: and sequentially placing the exposed core plate in a developing solution, etching solution and film stripping solution to complete the developing, etching and film stripping processes.

Further, the AOI detection further includes: solder resist printing, character spray printing and gold deposition.

The mini-LED backlight core board is prepared based on the preparation method of the mini-LED backlight core board.

Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the application flash corrosion copper reduction is carried out on the core plate before electroplating copper deposition, wherein the flash corrosion copper reduction comprises the following steps: firstly, repairing the copper layer on the surface of the core plate in a height difference manner so that the copper layer on the surface of the core plate is level; and then carrying out copper reduction on the copper layer of the core plate surface after the repair. According to the method, the copper layer after copper deposition is drilled on the surface of the core plate, the copper layer on the surface of the core plate is flush in height, the copper layer after the surface of the core plate is repaired is thinned, the copper layer with the same thickness can be obtained by thinning the copper layer through a conventional etching process, copper deposition is performed on the copper layer with the uniform thickness, consistency and stability of copper deposition can be guaranteed, and the electroplated copper layer with the uniform thickness is obtained.

The mini-LED backlight core board prepared by the method can ensure consistency of electroplated copper layers and effectively improve signal transmission performance and product stability of the mini-LED backlight core board.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.

In the accompanying drawings:

FIG. 1 is a flow chart of the preparation method in example 3.

Detailed Description

For a clearer understanding of technical features, objects and effects of the present invention, a detailed description of embodiments of the present invention will be made with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are merely for convenience of describing the present invention, not to indicate that the mechanism or element referred to must have specific directions, and thus should not be construed as limiting the present invention.

It should also be noted that unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first," "second," "third," and the like are used merely for convenience in describing the present invention and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," etc. may explicitly or implicitly include one or more such features. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

In the prior art, after drilling, copper needs to be deposited in the hole, and at this time, copper deposition is used for forming a thinner copper layer in the hole and on the surface of the core plate, so that the copper layer can be well attached to the previous copper layer when copper deposition is performed in subsequent electroplating. After preliminary copper deposition, the copper layer is thinned to within 15 microns, and then electroplated to ensure electroplating uniformity. Because the mini-LED backlight core board is thinner, the copper layer in the small-size core board cannot be effectively thinned by the etching copper-reducing process in the prior art, so that the copper layer thickness after electroplating copper deposition is uneven.

Example 1

According to the preparation method of the mini-LED backlight core board, the core board is subjected to flash etching and copper reduction before copper deposition by electroplating, wherein the flash etching and copper reduction comprises the following steps: repairing the copper layer on the surface of the core plate in a height difference manner so that the copper layer on the surface of the core plate is level; and (5) copper reduction is carried out on the copper layer of the core plate surface after the repair.

According to the method, the copper layer after copper deposition is drilled on the surface of the core plate, the copper layer on the surface of the core plate is flush in height, the copper layer after the surface of the core plate is repaired is thinned, the copper layer with the same thickness can be obtained by thinning the copper layer through a conventional etching process, copper deposition is performed on the copper layer with the uniform thickness, consistency and stability of copper deposition can be guaranteed, and the electroplated copper layer with the uniform thickness is obtained.

Example 2

Specifically, the flash etching copper reduction process specifically comprises the following steps:

firstly, placing a core plate in a first repairing groove, wherein the first repairing groove contains an additive, and the additive enables the potential of a thin copper layer in the core plate to be greater than that of a thick copper layer; the copper layer on the surface of the core plate is leveled by repairing the copper deposition.

And then placing the core plate in a second etching groove, wherein the second etching groove contains an etchant for thinning the copper layer on the surface of the core plate.

Further, the additive is a gloss agent and/or an inhibitor, the gloss agent and/or the inhibitor added in the first repair groove can be adsorbed on the surface of the copper layer, and the quantity of the additives adsorbed on the surface of the copper layer at different thicknesses or different heights is different, so that the potential of the thicker copper layer on the surface of the core plate is smaller, and the potential of the thinner copper layer on the surface of the core plate is larger. That is, the content of the additive adsorbed on the surface of the copper layer at different heights in the first repair tank is different, so that the potential of the surface of the copper layer at different heights decreases as the height of the copper layer increases. Note that: the height referred to herein refers to the height relative to the same horizontal plane at the center of the core and is understood to mean that the potential of the copper layer surface at different thicknesses of the core surface decreases as the copper layer thickness increases.

In this way, the first repair groove is essentially used for repairing the preliminarily deposited copper layer, in the repair process, the copper layer with larger thickness is basically not deposited with copper or is deposited with little copper layer, and the copper layer with smaller thickness is deposited with thicker copper layer in the first repair groove again, so that the thickness of the copper layer on the surface of the core plate is uniform after the copper layer is deposited in the first repair groove.

In the application, the first repair groove can be subjected to copper layer repair by adopting an electroplating method, and can also be subjected to copper layer repair by adopting a chemical copper deposition method.

As a specific example, the present application adopts electroless copper plating method to perform preliminary copper plating on the surface of the core plate and in the hole after drilling, and also adopts electroless copper plating method to repair the copper layer in the first repair groove.

The copper layer after restoration in the application adopts etching liquid to uniformly reduce copper, so that the thickness of the copper layer after copper reduction is uniform and consistent. Based on the copper layer with uniform thickness obtained after copper reduction, the copper layer with target thickness is obtained by adopting an electroplating copper deposition method, and a target pattern is formed after patterning.

Further, electroplating copper deposition in the present application includes: the plurality of clamping heads are uniformly clamped on the surface of the core plate, the clamping heads are conductors, and the distances between the plurality of clamping heads and the anode are equal, so that the plurality of clamping heads are ensured to simultaneously copper-plate the surface of the core plate.

The clamping head is used as a clamping tool for the core plate and is also used as a conductive electroplating tool for the core plate. If the core plate needs to be electroplated on both sides, the parts of the clamping heads, which are abutted against both sides of the core plate, are all electric conductors. If the core plate only needs one side to be electroplated, the part of the clamping head, which is contacted with the plate surface to be electroplated in the core plate, is an electric conductor.

The clamping head, which is an electrical conductor in the present application, is in contact with the core plate end face such that the core plate end face acts as a cathode, and an electrochemical reaction occurs together with the electroplating anode, forming an electroplated copper layer in the core plate end face. The clamping head of the conductor in the application is similar to the effect of a wire, the transmission rate of the conductor to current is larger than that of liquid in the electroplating bath to current, the current density of each position of the clamping head in the end face of the core plate can be ensured to be the same through uniform distribution of the clamping head on the end face of the core plate, and then copper is uniformly deposited at each position of the end face of the core plate.

Specifically, in this application, the clamping head is clamped at the edge of the core board, for example, the core board is in a cuboid structure, and then the clamping heads can be four, and respectively clamped at four corners of the cuboid, or the clamping heads are clamped at the center point of each side. Electroplating copper deposition is required to form a uniform copper layer on the surface of the core plate, and the contact area and the contact length of the clamping head and the end face to be electroplated can be adjusted according to actual requirements. For example, the length of the rectangular core plate is 4cm, the width of the rectangular core plate is 3cm, the clamping heads clamped on the four corners of the core plate extend towards the center point of the rectangular core plate, the distances from the center point are equal, and the extending lengths of the clamping heads are required not to touch each other.

Further, the distance between a plurality of clamping heads and the electroplating cathode can be set to be smaller than 1mm, electroplating current is uniformly distributed on the surface of the core plate through the wire effect of the plurality of clamping heads, and the purpose of uniform copper deposition of the core plate is achieved. Compared with the prior art, when the thickness of the electroplated copper deposit is 20 microns, the copper deposit thickness of different areas can be kept within 1 micron.

In the electroplating copper deposition process, a plurality of clamping heads are used as wires and are simultaneously connected to the surface of the core plate, so that the current density of each area on the surface of the core plate is ensured to be the same, and uniform copper deposition is realized.

Example 3

The preparation method of the mini-LED backlight core board provided by the application, as shown in figure 1, comprises the following steps:

cutting: the large sheet is cut to produce the appropriate size. The substrate made of Nanya new material NY8320ED is high in hardness, and the thin plate can also have good bearing property and flatness, good CTE performance and the like.

Drilling: and drilling through holes which are required to be conducted or radiating holes which are not required to be conducted by using a mechanical drill for the plate to be processed. The pore diameter may be, for example, about 0.1 mm.

Baking: and (5) baking the plate to stabilize the size of the plate, and drying the plate.

Copper deposition: and depositing a copper layer with a thinner thickness in the hole and on the surface of the core plate by adopting a chemical copper deposition method.

Flash etching copper reduction: firstly, placing a core plate in a first repairing groove, wherein the first repairing groove contains an additive, and the additive enables the potential of a thin copper layer in the core plate to be greater than that of a thick copper layer; the copper layer on the surface of the core plate is leveled by repairing the copper deposition. And then placing the core plate in a second etching groove, wherein the second etching groove contains an etchant for thinning the copper layer on the surface of the core plate. The additive is a gloss agent and/or an inhibitor, the gloss agent and/or the inhibitor added in the first repair groove can be adsorbed on the surface of the copper layer, and the quantity of the additives adsorbed on the surface of the copper layer at different thicknesses or different heights is different, so that the potential at the thicker copper layer on the surface of the core plate is smaller, and the potential at the thinner copper layer on the surface of the core plate is larger.

Electroplating copper deposition: the plurality of clamping heads are uniformly clamped on the surface of the core plate, the clamping heads are conductors, and the distances between the plurality of clamping heads and the anode are equal, so that the plurality of clamping heads are ensured to simultaneously copper-plate the surface of the core plate. The clamping head is used as a clamping tool for the core plate and is also used as a conductive electroplating tool for the core plate. If the core plate needs to be electroplated on both sides, the parts of the clamping heads, which are abutted against both sides of the core plate, are all electric conductors. If the core plate only needs one side to be electroplated, the part of the clamping head, which is contacted with the plate surface to be electroplated in the core plate, is an electric conductor.

The clamping head is adopted for electroplating, so that the aim of synchronous clamping and electroplating can be fulfilled, and the aim of clamping and double-sided electroplating can be further fulfilled. The core plate is clamped at any position in the electroplating pool by the clamping head through the structures such as the outer connecting rod and the like.

When the core plate needs double-sided electroplating, the clamping heads connected with the two sides of the core plate are conductors, and the clamping parts and insulators are abutted with the side edges of the core plate. When the core plate needs double-sided electroplating and the side edges need electroplating, the clamping parts on the two sides and the connecting part in the middle can be both conductors.

In this application a plurality of gripping head evenly distributed, the distance between the adjacent gripping head is equal or the clearance equals promptly. When the core plate is a round core plate, the included angles between the clamping heads are equal.

In the process of synchronously electroplating and copper deposition by adopting the plurality of clamping heads in the application, the uniformity and consistency of copper layers on the surface of the core plate before copper deposition by electroplating must be ensured. In the prior art, plating copper deposition is directly carried out after a copper layer with thinner thickness is deposited in a hole and on the surface of a core plate by adopting a chemical copper deposition method, and the application creatively adds a flash corrosion copper reduction process between the chemical copper deposition and the plating copper deposition, and the specific flash corrosion copper reduction process needs to repair the copper deposition in a first repair groove so that the copper layer on the surface of the core plate is level; and then thinning the copper layer in the second etching groove.

After the flash etching copper reduction, the core plate is matched with the electroplating structures of the clamping heads in the step, so that the purpose of uniformly depositing copper at each position in the end face of the core plate can be realized.

Horizontal vacuum resin plug hole: after the hole wall is plated with copper, the through hole is filled with epoxy resin, and the purpose of the resin hole filling is that the plate surface is dent-free, the hole can be conducted and the welding is not affected.

Removing surface resin: resin above the copper foil and the orifice is removed by the content of the resin softener and the softening thickness of the resin in unit time, and then the resin on the board surface is removed by the non-woven cloth with 4000 meshes.

Copper deposition horizontally: the voids from which the softening resin is removed are filled with copper, and the resin holes are covered with copper, whereby the color difference between the copper surface and the ink surface is reduced.

Flash plating: a copper layer is electrodeposited on the thin copper layer of the substrate.

Coarsening: the core surface is treated so that it remains an average and finely roughened surface.

And (3) sticking a dry film: according to the dry film, the AQ-1558 dry film is formed by rising, the dry film thickness is 15 microns, the resolution of the dry film is 20 microns, the adhesive force of sharp corners of 5 microns can be met, the etching pool effect can be reduced, and the etching capability of a product is improved.

Exposure: LDI exposure is adopted, and the exposure resolution is less than or equal to 10 microns. The sharp corners of the bonding pads are supplemented, so that the etching side etching quantity of the four corners of the etching bonding pads in the etching pass is met, and the bonding pads are smooth and complete;

DES: the application adopts a soaking type flash etching process, wherein the soaking type flash etching process comprises the following steps: and sequentially placing the exposed core plate in a developing solution, etching solution and film stripping solution to complete the developing, etching and film stripping processes. Because the copper thickness in the mini-led backlight core plate is generally lower than 20 microns, the copper thickness requirement is met by immersing copper etching, immersing etching is performed, the specific area of the liquid medicine contacted with the same surface and the effect brought by the circulation of the liquid medicine are consistent, and the etching interval of 20 microns can be met by lower tension of the liquid medicine through flash etching. Thereby ensuring the uniformity of etching effect of the same batch of products and the uniformity of etching.

AOI detection: and detecting the electrical property of the etched pattern after film removal.

Plasma cleaning: and removing impurities on the surface of the core plate through plasma gas.

Baking plate before solder mask: and (5) baking the plate to stabilize the size of the plate, and drying the plate.

And (3) solder resist printing: and (3) performing single-sided solder resist printing on one end face of the core plate. The solder resist printing is performed by adopting a 51T inclined screen printing plate and adopting a single-sided printing process.

Pre-baking: the plates were baked at 75℃for 20 minutes.

And (3) solder resist printing: and performing solder resist printing on the other end face of the core plate. The solder resist printing is performed by adopting a 51T inclined screen printing plate and adopting a single-sided printing process.

Pre-baking: the plates were baked at 75℃for 20 minutes.

And (5) performing LDI exposure of the solder resist.

Cavitation of halogen lamp exposure machine: the DI exposure machine has no high wave band of more than or equal to 420nm, and the halogen lamp exposure machine can thoroughly cure the ink by the empty exposure.

And (3) solder resist development: and displaying the circuit diagram in the core board.

Character spray printing: and printing characters on the surface of the core board.

Curing: the characters are cured.

And (3) depositing gold: and (5) carrying out gold precipitation treatment on the core plate. Specifically, the gold deposition process may specifically include: (1) Carrying out oil removal treatment on the surface of the mini-LED backlight core plate, namely placing the mini-LED backlight core plate in an oil removal groove, wherein an oil removal agent is contained in the oil storage groove, and removing greasy dirt on the surface of the mini-LED backlight core plate; (2) Washing the mini-LED backlight core plate after oil removal; (3) Carrying out microetching treatment on the mini-LED backlight core plate, specifically, soaking the mini-LED backlight core plate in a microetching agent which can be SPS, sulfuric acid, hydrogen peroxide and the like, and slightly etching the surface of the mini-LED backlight core plate to ensure that the surface of the mini-LED backlight core plate maintains a certain roughness; (4) washing the mini-LED backlight core board with water; (5) And placing the mini-LED backlight core board in an activation tank for activation treatment, wherein the activation tank comprises a chelating agent, and the chelating agent can couple and crosslink the copper layer to form a compact lattice layer, so that the subsequent deposition is facilitated. (6) The mini-LED backlight core after the activation treatment is again pre-soaked, the solution in the pre-soaking tank is the same as the solution in the activation tank, and the difference is that the concentration of the chelating agent in the pre-soaking tank is half of that in the activation tank, and the purposes of pre-soaking in the application are two: firstly, in order to prolong the reaction time of the chelating agent and the copper layer on the surface of the mini-LED backlight core plate, the chelating agent is ensured to have sufficient time to perform coupling and crosslinking reaction with the copper layer, so as to form a compact lattice layer; secondly, in order to reduce the concentration of chelating agent on the surface of the mini-LED backlight core plate, the defect that the water solution in the water tank is frequently replaced due to pollution to the water tank during direct water washing is avoided. And (7) washing the mini-LED backlight core board. (8) And (3) carrying out gold deposition treatment, namely carrying out liquid phase gold deposition on gold atoms, wherein the thickness of the gold layer deposited on the surface of the mini-LED backlight core plate is kept at 0.5 um+/-0.1 um. In the gold depositing process, the solution in the gold depositing tank is in a flowing state, the surface of the core plate to be deposited is opposite to the flowing direction of the solution in the gold depositing tank, for example, the solution in the gold depositing tank flows from bottom to top, so that the surface of the core plate to be deposited is downward, and the gold depositing efficiency is improved.

CCD molding: a charge coupled device is fabricated in the core.

Capacitance test: and carrying out capacitance test on the charge coupled device, and confirming that the capacitance test result meets the standard.

FQC: and detecting the quality of the mini-LED backlight core board.

Size measurement: and measuring whether the size of the mini-LED backlight core board is qualified or not.

Packaging and warehousing.

It is to be understood that the above examples only represent preferred embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the invention; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The preparation method of the mini-LED backlight core board is characterized in that the core board is subjected to flash etching and copper reduction before copper deposition by electroplating, wherein the flash etching and copper reduction comprises the following steps:

2. The preparation method of the mini-LED backlight core board according to claim 1, wherein the flash etching copper reduction process specifically comprises the following steps:

3. The method for preparing the mini-LED backlight core plate according to claim 2, wherein the additive is a gloss agent and/or an inhibitor.

4. The method for preparing the mini-LED backlight core plate according to claim 2, wherein the copper layer on the surface of the core plate is repaired in the first repairing groove by adopting a chemical copper deposition method.

5. The method for preparing the mini-LED backlight core as claimed in claim 1, wherein the electroplating copper deposition comprises: the plurality of clamping heads are uniformly clamped on the surface of the core plate, the clamping heads are conductors, and the distances between the plurality of clamping heads and the anode are equal, so that the plurality of clamping heads are ensured to simultaneously copper-plate the surface of the core plate.

6. The method for preparing the mini-LED backlight core plate according to claim 5, wherein the distances between the clamping heads and the electroplating cathode are all less than or equal to 1mm.

7. The method for manufacturing the mini-LED backlight core plate according to claim 5, wherein the clamping head simultaneously clamps the core plate from the front side and the back side of the core plate, and a part of the clamping head, which is contacted with one end to be electroplated, of the surface of the core plate is a conductor.

8. The method for preparing the mini-LED backlight core as claimed in claim 1, further comprising, after said electroplating copper deposition: pasting a dry film, exposing to form an etching pattern, and performing an etching process by adopting a soaking type flash etching process to perform AOI detection; wherein the immersion flash etching comprises: and sequentially placing the exposed core plate in a developing solution, etching solution and film stripping solution to complete the developing, etching and film stripping processes.

9. The method for preparing the mini-LED backlight core as claimed in claim 8, further comprising, after said AOI inspection: solder resist printing, character spray printing and gold deposition.

10. A mini-LED backlight core board, characterized in that it is prepared based on the preparation method of a mini-LED backlight core board according to any one of claims 1-9.