CN110719698A - Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module - Google Patents
Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module Download PDFInfo
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- CN110719698A CN110719698A CN201911187843.6A CN201911187843A CN110719698A CN 110719698 A CN110719698 A CN 110719698A CN 201911187843 A CN201911187843 A CN 201911187843A CN 110719698 A CN110719698 A CN 110719698A
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- manufacturing
- copper
- gold
- tin
- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
The invention relates to a manufacturing method for manufacturing prefabricated gold and tin on a copper-clad plate in a 5G optical module, which perfectly solves the problem of smooth surface photoetching and strong pit filling capacity by utilizing the characteristics of a dry film, is convenient to operate, greatly improves the photoetching yield, ensures the effect of subsequent gold and tin treatment by the easy removal capacity of the dry film, provides convenience for realizing mass production, abandons the traditional glue evening or glue spraying mode, adopts the dry film to directly press a film on the surface of the copper-clad plate, can disregard deep grooves on the surface, completely covers the surface of a product, does not worry about the problem that the surface is possibly uneven caused by glue evening or glue spraying, and can be used for photoetching a gold and tin pattern on the copper surface with the deep grooves by exposure and development.
Description
Technical Field
The invention relates to the field of ceramic products, in particular to a manufacturing method for manufacturing prefabricated gold tin on a copper-clad plate in a 5G optical module.
Background
At present, gold-tin film solder is difficult to be made on a ceramic copper-clad plate, because gold-tin components are unstable, and most of the thickness of the existing copper-clad plate exceeds 100 micrometers, the traditional photoresist homogenizing photoetching process or photoresist spraying photoetching process cannot achieve good effect. At present, the depth of a surface groove is too thick, a large amount of photoresist is needed to fill the groove with the photoresist, and the uniformity of the surface photoresist is difficult to ensure by the photoresist homogenizing; after the gold and tin plating is finished, the temperature of the gold and tin plating is generally kept at about 190 ℃ for a long time, so that the photoresist is completely fixed, the photoresist and the gold and tin in the groove are difficult to remove after the gold and tin plating is finished on the whole surface, and the finished product rate is seriously influenced. Therefore, a manufacturing method for manufacturing prefabricated gold tin on a copper-clad plate in a 5G optical module, which is convenient to operate and greatly improves the yield of photoetching, is needed.
Disclosure of Invention
The invention aims to provide a manufacturing method for manufacturing prefabricated gold and tin on a copper-clad plate in a 5G optical module, which can solve the problem of photoetching gold and tin on the copper-clad plate with the size of more than 100 microns and ensure the yield by a removing scheme after gold and tin plating.
In order to realize the technical purpose, the technical scheme of the invention is as follows: the invention relates to a manufacturing method for manufacturing prefabricated gold tin based on a copper-clad plate in a 5G optical module, which comprises the following steps:
s1, firstly, sticking the dry film on the surface of a copper-clad plate by a special film pressing machine;
s2, exposing through a mercury lamp, and developing a pattern on the copper surface in a spraying mode;
s3: plating gold and tin on the dry film after the development is finished within 72 hours generally by vacuum evaporation;
s4: and finally, removing the dry film by using acetone and the like or other organic solutions to obtain the gold-tin pattern.
The method has the advantages that the problem of surface photoetching flatness and strong pit filling capacity are perfectly solved by utilizing the characteristics of the dry film, the operation is convenient, the photoetching yield is greatly improved, the effect and the efficiency of subsequent gold and tin treatment are ensured by the easy removal capacity of the dry film, and convenience is brought to large-batch mass production.
Further, the step S1 further includes the following steps:
a1 keeping the film pressing force at 12.5 kg at 90 deg.C + -5 deg.C and 80 mm/s.
Further, the step S2 includes the following steps:
b1, after the dry film covering is finished, the film is exposed for 400s by a mercury lamp after being placed for one hour;
b2, after exposure, standing for more than 30 min;
b3-after standing, it was developed with a developer.
In actual operation, abandon traditional even glue or spout gluey mode, adopt the dry film directly to press the film on copper clad laminate surface, can be regardless of the deep trouth on surface, intact with product surface all cover, and do not worry even glue or spout the probably inhomogeneous problem in surface that the glue brought, the copper face photoetching that can take the deep trouth of rethread exposure and development goes out the gold tin figure.
Further, the step B3 further includes the following steps:
c1, preparing the solution by using sodium carbonate powder with the concentration of 5 percent generally;
and C2, ensuring the temperature of the prepared solution to be 60 ℃, developing, and drying after the developing is clean.
Further, the step S4 further includes the following steps:
d1, directly soaking the gold and tin plated film in acetone or other organic solution to remove the dry film;
d2, removing the redundant gold tin by an ultrasonic cleaning device after the dry film is removed to obtain a final pattern.
In actual operation, the characteristic that the dry film is easy to dissolve in organic solution such as acetone is utilized, and the gold and tin are plated, and then the gold and tin are directly soaked and subjected to ultrasonic treatment, so that redundant gold and tin can be removed to obtain a final pattern.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a manufacturing method for manufacturing prefabricated gold tin based on a copper-clad plate in a 5G optical module.
Detailed Description
The present invention will be further described in detail with reference to the following specific examples:
the invention aims to provide a manufacturing method for manufacturing prefabricated gold and tin on a copper-clad plate in a 5G optical module, which can solve the problem of photoetching gold and tin on the copper-clad plate with the size of more than 100 microns and ensure the yield by a removing scheme after gold and tin plating.
As shown in fig. 1, to achieve the technical purpose, the technical solution of the present invention is: the invention relates to a manufacturing method for manufacturing prefabricated gold tin based on a copper-clad plate in a 5G optical module, which comprises the following steps:
s1, firstly, sticking the dry film on the surface of a copper-clad plate by a special film pressing machine;
s2, exposing through a mercury lamp, and developing a pattern on the copper surface in a spraying mode;
s3: plating gold and tin on the dry film after the development is finished within 72 hours generally by vacuum evaporation;
s4: and finally, removing the dry film by using acetone and the like or other organic solutions to obtain the gold-tin pattern.
The method has the advantages that the problem of surface photoetching flatness and strong pit filling capacity are perfectly solved by utilizing the characteristics of the dry film, the operation is convenient, the photoetching yield is greatly improved, the effect and the efficiency of subsequent gold and tin treatment are ensured by the easy removal capacity of the dry film, and convenience is brought to large-batch mass production.
Further, the step S1 further includes the following steps:
a1 keeping the film pressing force at 12.5 kg at 90 deg.C + -5 deg.C and 80 mm/s.
Further, the step S2 includes the following steps:
b1, after the dry film covering is finished, the film is exposed for 400s by a mercury lamp after being placed for one hour;
b2, after exposure, standing for more than 30 min;
b3-after standing, it was developed with a developer.
In actual operation, abandon traditional even glue or spout gluey mode, adopt the dry film directly to press the film on copper clad laminate surface, can be regardless of the deep trouth on surface, intact with product surface all cover, and do not worry even glue or spout the probably inhomogeneous problem in surface that the glue brought, the copper face photoetching that can take the deep trouth of rethread exposure and development goes out the gold tin figure.
Further, the step B3 further includes the following steps:
c1, preparing the solution by using sodium carbonate powder with the concentration of 5 percent generally;
and C2, ensuring the temperature of the prepared solution to be 60 ℃, developing, and drying after the developing is clean.
Further, the step S4 further includes the following steps:
d1, directly soaking the gold and tin plated film in acetone or other organic solution to remove the dry film;
d2, removing the redundant gold tin by an ultrasonic cleaning device after the dry film is removed to obtain a final pattern.
In actual operation, the characteristic that the dry film is easy to dissolve in organic solution such as acetone is utilized, and the gold and tin are plated, and then the gold and tin are directly soaked and subjected to ultrasonic treatment, so that redundant gold and tin can be removed to obtain a final pattern.
In the actual operation, a dry film is pasted on the surface of a copper-clad plate through a professional film pressing machine, film pressing is carried out at the speed of 80mm/s of film pressing speed at 90 ℃ to +/-5 ℃, the force of film pressing is kept at 12.5 kg, no bubble and other defects on the surface in the film pasting process are ensured, after the film is placed for one hour, the film is exposed for 400 seconds through a mercury lamp, after the exposure, the film is placed for more than 30 minutes, a pattern is developed in a spraying mode, a developing solution can be generally prepared by sodium carbonate powder with the concentration of 1%, the film can be developed and dried when the heating temperature is 60 ℃, the dry film is completely covered on a belt trough, a gold-tin pattern is developed on the copper surface, the developed dry film is plated with gold-tin through a vacuum evaporation process within 72 hours, finally, the dry film is removed by acetone and other organic solutions, the gold-tin pattern is obtained, the easy removability of the dry film and the integrity of the pattern, greatly improves the yield of the product and finally directly cuts the product into finished products.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. A manufacturing method for manufacturing prefabricated gold tin based on a copper-clad plate in a 5G optical module is characterized by comprising the following steps:
s1, firstly, sticking the dry film on the surface of a copper-clad plate by a special film pressing machine;
s2, exposing through a mercury lamp, and developing a pattern on the copper surface in a spraying mode;
s3: plating gold and tin on the dry film after the development is finished within 72 hours generally by vacuum evaporation;
s4: and finally, removing the dry film by using acetone and the like or other organic solutions to obtain the gold-tin pattern.
2. The manufacturing method of the prefabricated gold tin based on copper clad laminate for 5G optical module according to claim 1, wherein the step S1 further comprises the following steps:
a1 that in the film pressing process of a professional film pressing machine, the temperature is kept at 90 +/-5 ℃, film pressing is carried out at the speed of 80mm/s of film pressing speed, and the force of film pressing is kept at 12.5 kg.
3. The manufacturing method of the prefabricated gold tin based on copper clad laminate for the 5G optical module according to claim 1, wherein the step S2 further comprises the following steps:
b1, after the dry film covering is finished, the film is exposed for 400s by a mercury lamp after being placed for one hour;
b2, after exposure, standing for more than 30 min;
b3-after standing, it was developed with a developer.
4. The manufacturing method for manufacturing the prefabricated gold tin on the copper-clad plate for the 5G optical module according to claim 3, wherein the step B3 further comprises the following steps:
c1, preparing the solution by using sodium carbonate powder with the concentration of 5 percent generally;
and C2, ensuring the temperature of the prepared solution to be 60 ℃, developing, and drying after the developing is clean.
5. The manufacturing method of the prefabricated gold tin based on copper clad laminate for 5G optical module according to claim 1, wherein the step S4 further comprises the following steps:
d1, directly soaking the gold and tin plated film in acetone or other organic solution to remove the dry film;
d2, removing the redundant gold tin by an ultrasonic cleaning device after the dry film is removed to obtain a final pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911187843.6A CN110719698A (en) | 2019-11-28 | 2019-11-28 | Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911187843.6A CN110719698A (en) | 2019-11-28 | 2019-11-28 | Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module |
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| Publication Number | Publication Date |
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| CN110719698A true CN110719698A (en) | 2020-01-21 |
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| CN201911187843.6A Pending CN110719698A (en) | 2019-11-28 | 2019-11-28 | Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040061257A (en) * | 2002-12-30 | 2004-07-07 | 삼성전기주식회사 | A package substrate for electrolytic leadless plating, and its manufacturing method |
| CN101232782A (en) * | 2007-01-23 | 2008-07-30 | 李东明 | Printed circuit board mask hole electroplating molding process |
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN105282985A (en) * | 2014-05-26 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Circuit board single-sided local gold plating method and circuit board |
-
2019
- 2019-11-28 CN CN201911187843.6A patent/CN110719698A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040061257A (en) * | 2002-12-30 | 2004-07-07 | 삼성전기주식회사 | A package substrate for electrolytic leadless plating, and its manufacturing method |
| CN101232782A (en) * | 2007-01-23 | 2008-07-30 | 李东明 | Printed circuit board mask hole electroplating molding process |
| WO2008092309A1 (en) * | 2007-01-23 | 2008-08-07 | Dongming Li | Process for electroplating a printed circuit board with through-holes uncoverd by mask |
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN105282985A (en) * | 2014-05-26 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Circuit board single-sided local gold plating method and circuit board |
Non-Patent Citations (4)
| Title |
|---|
| 杨丁: "《金属蚀刻技术》", 31 January 2008, 国防工业出版社, pages: 75 * |
| 程婕: "《电子产品制造工程训练》", 7 March 2008, 西北工业大学出版社, pages: 89 - 91 * |
| 邵念勤，刘少平: "《机械制造基础》", 28 February 2007, 西安地图出版社, pages: 312 * |
| 龙立钦，周庆国: "《电子工艺技术》", 31 May 2009, 西南交通大学出版社, pages: 83 * |
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Application publication date: 20200121 |
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