CN106783548B - Wafer gum application method - Google Patents
Wafer gum application method Download PDFInfo
- Publication number
- CN106783548B CN106783548B CN201611264362.7A CN201611264362A CN106783548B CN 106783548 B CN106783548 B CN 106783548B CN 201611264362 A CN201611264362 A CN 201611264362A CN 106783548 B CN106783548 B CN 106783548B
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- Prior art keywords
- wafer
- adhesive film
- outer edge
- film
- exposing
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- 238000000034 method Methods 0.000 title claims description 25
- 239000002313 adhesive film Substances 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer gum coating method. The wafer gum coating method comprises the following steps: providing a wafer to be back-glued; providing a glue film made of a photosensitive material; attaching a glue film to the back side of the wafer; exposing the adhesive film along the outer edge of the wafer; and cleaning the exposed adhesive film by using a developing solution to remove the adhesive film on the periphery of the outer edge of the wafer. The invention can form a complete adhesive film on the back side of the wafer, thereby avoiding adhesive leakage.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a wafer gum coating method.
Background
At present, the commonly used coating method of the back glue is glue brushing. As shown in fig. 1, a wafer 11 is placed below a die plate, and a back surface of the wafer 11 is coated with a glue. Wherein the clamp 12 is used for clamping the wafer 11, the clamp 12 clamps a part of the back surface of the wafer 11, so that the outer edge of the wafer 11 can not be glued. The wafer 11 after being glued is pasted on the bearing film for cutting, and the edge of the wafer 11 cannot be completely attached due to the fact that no glue is applied to the edge of the back face of the wafer 11. During the cutting process of the wafer 11, the unadhered chips may fly off, which may affect the cutting process, such as generating a knife.
In the prior art, a cutting mode is adopted, so that a chip at the edge of the wafer 11 is easily separated from a carrier film to cause damage of a cutting knife, and other subsequent processes are relatively complex and poor in effect, as shown in fig. 2, similar burrs occur at the edge of the wafer 11.
In the prior art, the carrier film and the wafer 11 are offset by cutting the carrier film in advance and then attaching the carrier film to the wafer 11 after being glued, as shown in fig. 3.
Disclosure of Invention
The invention mainly solves the technical problem of providing a wafer gum-applying method which can avoid the wafer from gum leakage.
In order to solve the technical problems, the invention adopts a technical scheme that: a wafer back gluing method is provided, which comprises the following steps:
providing a wafer to be back-glued;
providing a glue film made of a photosensitive material;
attaching a glue film to the back side of the wafer;
exposing the adhesive film along the outer edge of the wafer;
and cleaning the exposed adhesive film by using a developing solution to remove the adhesive film on the periphery of the outer edge of the wafer.
Wherein, one side of the adhesive film is provided with a release layer;
the step of attaching the adhesive film to the back side of the wafer comprises:
and attaching the other side of the adhesive film, which is far away from the release layer, to the back side of the wafer.
Wherein, after the step of utilizing the developing solution to wash the glue film after the exposure, further include:
and tearing off the release layer from one side of the adhesive film.
Wherein, before the step of exposing the glue film along the outer edge of the wafer, the method further comprises the following steps:
and cutting the adhesive film to be in the same shape as the wafer, wherein the outer edge of the adhesive film is positioned at the periphery of the outer edge of the wafer.
Wherein, the step of exposing the glue film along the outer edge of the wafer comprises:
and controlling the exposure area of the adhesive film so that the outer edge of the adhesive film which is remained after being cleaned by the developing solution is flush with the outer edge of the wafer.
Wherein, the step of exposing the glue film along the outer edge of the wafer comprises:
the wafer and the exposure source are arranged on the same side of the adhesive film, and the adhesive film on the back side of the wafer is shielded by the wafer.
Wherein, the step of exposing the glue film along the outer edge of the wafer comprises:
and controlling the wafer and the exposure source to rotate relatively around the outer edge of the wafer, and further gradually exposing the adhesive film along the outer edge of the wafer.
Wherein the step of controlling the wafer and the exposure source to rotate relatively around the outer edge of the wafer comprises:
fixing the exposure source and controlling the wafer to rotate around the axis of the wafer.
Wherein the step of controlling the wafer and the exposure source to rotate relatively around the outer edge of the wafer comprises:
the exposure source is controlled to be kept in contact with the outer peripheral surface of the wafer during the relative rotation of the wafer and the exposure source around the outer edge of the wafer.
Wherein the method further comprises: the wafer after being glued is used for being pasted on the bearing film, and the wafer pasted on the bearing film is cut.
The invention has the beneficial effects that: unlike the prior art, the present invention is provided by attaching a glue film to the backside of a wafer; exposing the adhesive film along the outer edge of the wafer; cleaning the exposed adhesive film by using a developing solution to remove the adhesive film on the periphery of the outer edge of the wafer, so that a completely attached adhesive film can be formed on the back side of the wafer, and the adhesive leakage is avoided; the wafer after the gum can completely laminate on the carrier film, and when the wafer laminated on the carrier film is cut, the chips which are not laminated can be prevented from flying out and being broke.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be adopted in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of the structure of a wafer of the prior art with adhesive backed;
FIG. 2 is a schematic representation of the presence of flash after the wafer of FIG. 1 is backed with adhesive;
FIG. 3 is a schematic illustration of the wafer of FIG. 1 showing offset after being gum backed;
FIG. 4 is a flow chart of a method for applying adhesive to a wafer according to an embodiment of the present invention;
fig. 5-9 are schematic views of the manufacturing process corresponding to the method for applying the adhesive on the wafer in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 4-9, fig. 4 is a flowchart illustrating a method for applying adhesive on a wafer according to an embodiment of the invention; fig. 5-9 are schematic views of the manufacturing process corresponding to the method for applying the adhesive on the wafer in fig. 4. The wafer back gluing method disclosed by the embodiment is used for back gluing the wafer, and the wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit. As shown in fig. 4, the method includes the steps of:
s11: providing a wafer to be back-glued;
as shown in fig. 5, a wafer 20 to be back-glued is provided.
S12: providing a glue film made of a photosensitive material;
as shown in fig. 6, a film 21 is provided, the film 21 is made of a photosensitive material. Wherein, one side of the adhesive film 21 can be provided with a release layer.
S13: attaching a glue film 21 to the back side of the wafer 20;
as shown in fig. 6, the other side 211 of the adhesive film 21 away from the release layer is attached to the back side of the wafer 20.
S14: exposing the glue film 21 along the outer edge of the wafer 20;
the adhesive film 21 is further cut before exposing the adhesive film 21 along the outer edge of the wafer 20.
Specifically, the adhesive film 21 is cut into the same shape as the wafer 20 and the outer edge of the adhesive film 21 is located at the periphery of the outer edge of the wafer 20, as shown in fig. 7. The cut adhesive film 21 is slightly larger than the edge of the wafer 20, so that the adhesive film 21 can be completely attached to the back side of the wafer 20.
The exposing the glue film 21 along the outer edge of the wafer 20 may specifically include: the exposure area 212 of the glue film 21 is controlled so that the outer edge of the glue film 21 remaining after subsequent cleaning with the developer is flush with the outer edge of the wafer 20, as shown in fig. 8.
The wafer 20 is disposed on the same side of the adhesive film 21 as the exposure source 22, and the adhesive film 21 on the back side of the wafer 20 is shielded by the wafer 20 to prevent exposure to the adhesive film 21 on the back side of the wafer 20.
The wafer 20 and the exposure source 22 are controlled to rotate relatively around the outer edge of the wafer 20, so as to gradually expose the glue film 21 along the outer edge of the wafer 20. Wherein the exposure source 22 can be fixed and the wafer 20 can be controlled to rotate around its axis. In other embodiments, one skilled in the art may fix the wafer 20 and control the exposure source 22 to rotate around the axis of the wafer 20.
Controlling the relative rotation of the wafer 20 and the exposure source 22 about the outer edge of the wafer 20 further comprises: the exposure source 22 is controlled to maintain contact with the outer peripheral surface of the wafer 20 during relative rotation of the wafer 20 and the exposure source 22 about the outer edge of the wafer 20.
S15: cleaning the exposed adhesive film 21 by using a developing solution to remove the adhesive film 21 on the periphery of the outer edge of the wafer 20;
as shown in fig. 9, the exposed adhesive film 21 is cleaned by a developing solution to remove the adhesive film 21 on the outer periphery of the outer edge of the wafer 20, thereby ensuring the integrity of the film on the wafer 20.
After the exposed adhesive film 21 is cleaned with a developing solution, the release layer is peeled off from one side of the adhesive film 21.
The present embodiment is formed by attaching a glue film 21 to the backside of the wafer 20; exposing the glue film 21 along the outer edge of the wafer 20; the exposed adhesive film 21 is cleaned by the developing solution to remove the adhesive film 21 on the periphery of the outer edge of the wafer 20, so that the completely attached adhesive film 21 can be formed on the back side of the wafer 20, and the adhesive leakage is avoided.
S16: the wafer 20 after being glued is used for being pasted on the bearing film, and the wafer 20 pasted on the bearing film is cut.
After the glue film 21 on the outer periphery of the outer edge of the wafer 20 is removed, the wafer 20 is formed after being glued. Wafer 20 after the gum pastes on the carrier film, cuts wafer 20 pasting on the carrier film, because the dorsal part of wafer 20 forms complete attached glued membrane 21, wafer 20 after consequently the gum can completely laminate on the carrier film, is pasting during the wafer cutting on the carrier film, can avoid not being flown out by the chip of laminating and cut, and then can avoid the fringe to appear in the edge of wafer 20 or carrier film and wafer 20 to produce the skew.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A wafer gum coating method is characterized by comprising the following steps:
providing a wafer to be back-glued;
providing a glue film made of a photosensitive material;
attaching the adhesive film to the back side of the wafer;
exposing the adhesive film along the outer edge of the wafer;
and cleaning the exposed adhesive film by using a developing solution to remove the adhesive film on the periphery of the outer edge of the wafer.
2. The method according to claim 1, wherein one side of the adhesive film is provided with a release layer;
the step of attaching the adhesive film to the back side of the wafer comprises:
and attaching the other side of the adhesive film, which is far away from the release layer, to the back side of the wafer.
3. The method according to claim 2, wherein after the step of cleaning the exposed adhesive film with a developer, the method further comprises:
and tearing off the release layer from one side of the adhesive film.
4. The method of claim 1, wherein the step of exposing the glue film along the outer edge of the wafer is preceded by the step of:
and cutting the adhesive film to cut the adhesive film into the shape same as that of the wafer, wherein the outer edge of the adhesive film is positioned on the periphery of the outer edge of the wafer.
5. The method of claim 1, wherein the exposing the glue film along the outer edge of the wafer comprises:
and controlling the exposure area of the adhesive film so that the outer edge of the adhesive film which is remained after being cleaned by the developing solution is flush with the outer edge of the wafer.
6. The method of claim 1, wherein the exposing the glue film along the outer edge of the wafer comprises:
and arranging the wafer and an exposure source on the same side of the adhesive film, and further shielding the adhesive film on the back side of the wafer by using the wafer.
7. The method of claim 1, wherein the exposing the glue film along the outer edge of the wafer comprises:
and controlling the wafer and the exposure source to rotate relatively around the outer edge of the wafer, and further gradually exposing the adhesive film along the outer edge of the wafer.
8. A method as claimed in claim 7, wherein the step of controlling the relative rotation of the wafer and exposure source about the outer edge of the wafer comprises:
and fixing the exposure source and controlling the wafer to rotate around the axis of the wafer.
9. A method as claimed in claim 7, wherein the step of controlling the relative rotation of the wafer and exposure source about the outer edge of the wafer comprises:
and controlling the exposure source to be kept in contact with the outer peripheral surface of the wafer in the process of relatively rotating the wafer and the exposure source around the outer edge of the wafer.
10. The method of claim 1, further comprising:
the wafer after being glued is used for being pasted on the bearing film, and the wafer pasted on the bearing film is cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611264362.7A CN106783548B (en) | 2016-12-30 | 2016-12-30 | Wafer gum application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611264362.7A CN106783548B (en) | 2016-12-30 | 2016-12-30 | Wafer gum application method |
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| Publication Number | Publication Date |
|---|---|
| CN106783548A CN106783548A (en) | 2017-05-31 |
| CN106783548B true CN106783548B (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611264362.7A Active CN106783548B (en) | 2016-12-30 | 2016-12-30 | Wafer gum application method |
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| Country | Link |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI655694B (en) * | 2018-07-17 | 2019-04-01 | 奇景光電股份有限公司 | Glue sealing apparatus and glue sealing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102150240A (en) * | 2009-01-13 | 2011-08-10 | 东丽先端素材株式会社 | Adhesive film for a wafer support for processing a wafer of a semiconductor thin film |
| CN105336581A (en) * | 2015-11-04 | 2016-02-17 | 株洲南车时代电气股份有限公司 | Manufacturing method and apparatus of power semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5751426B2 (en) * | 2010-06-07 | 2015-07-22 | 栗田工業株式会社 | Cleaning system and cleaning method |
| CN102479688B (en) * | 2010-11-29 | 2013-12-04 | 中芯国际集成电路制造(北京)有限公司 | Method of wafer surface photoresistance edge removal |
| CN103034062B (en) * | 2011-09-29 | 2014-11-26 | 中芯国际集成电路制造(北京)有限公司 | Method for edge exposure of wafer, optical modules and automatic focusing systems |
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2016
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102150240A (en) * | 2009-01-13 | 2011-08-10 | 东丽先端素材株式会社 | Adhesive film for a wafer support for processing a wafer of a semiconductor thin film |
| CN105336581A (en) * | 2015-11-04 | 2016-02-17 | 株洲南车时代电气股份有限公司 | Manufacturing method and apparatus of power semiconductor device |
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| Publication number | Publication date |
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| CN106783548A (en) | 2017-05-31 |
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