CN101754592A - Method for manufacturing a conductive projection and a circuit board structure with conductive projection - Google Patents
Method for manufacturing a conductive projection and a circuit board structure with conductive projection Download PDFInfo
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- CN101754592A CN101754592A CN200810182006A CN200810182006A CN101754592A CN 101754592 A CN101754592 A CN 101754592A CN 200810182006 A CN200810182006 A CN 200810182006A CN 200810182006 A CN200810182006 A CN 200810182006A CN 101754592 A CN101754592 A CN 101754592A
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Abstract
The invention relates to a method for manufacturing a conductive projection and a circuit board structure with the conductive projection. The method comprises the following steps of: firstly, providing a circuit board, wherein the circuit board is provided with a surface, and the surface is provided with a plurality of connecting pads which are arranged at intervals; forming a welding prevention layer on the circuit board, wherein the welding prevention layer covers the surface and is provided with a plurality of openings, and the connecting pad exposes out of the opening; carrying out a electroless plating process to form a thick metal layer on the surface of the connecting pad, wherein the thickness of the thick metal layer is greater than 1/5 of the height of the welding prevention layer, but is smaller than the height of the welding prevention layer; forming a protecting layer on the thick metal layer; then, forming a plurality of solder projections on the protecting layer by a bumping or printing method, wherein the solder projection is covered on the protecting layer, and protrudes out of the opening; finally, reflowing the solder protections.
Description
Technical field
The invention relates to a kind of board structure of circuit (circuit board structure), and particularly have the board structure of circuit of conductive projection (conductive bump) and a manufacture method of this conductive projection relevant for a kind of.
Background technology
In recent years, along with making rapid progress of electronic technology, and the coming out one after another of high-tech electronic industry, make electronic product more humane, with better function constantly weed out the old and bring forth the new, and stride forward towards light, thin, short, little trend.Following in this trend, because circuit board has that wiring is fine and closely woven, assembling is compact and advantage such as functional, so circuit board (for example: chip) and make one of main media that these electronic components are electrically connected to each other just becomes a plurality of electronic components of carrying.
Crystal covering type (flip chip) encapsulation is a kind of mode of chip and circuit board encapsulation.Have a plurality of connection pads on the circuit board, and circuit board can electrically connect by the scolder that is disposed on the connection pad with the mode and the chip of reflow.In recent years, because the signal of required transmission increases day by day between the electronic component (for example chip), so the also increase day by day of the required connection pad number that has of circuit board, yet, space on the circuit board is limited, so the spacing between the connection pad develops towards little spacing (fine pitch).
Fig. 1 is the generalized section of known a kind of board structure of circuit.Please refer to Fig. 1, in known techniques, board structure of circuit 10A comprises a circuit board 10, a plurality of connection pad 14 (only schematically illustrating two among Fig. 1), a welding resisting layer 16 and a plurality of solder projection 18.Circuit board 10 has a surface 12, and these connection pads 14 are disposed on the surface 12 of circuit board 10.The surface 12 of welding resisting layer 16 covering boards 10, and (wherein these openings 17 expose these connection pads 14 respectively for Solder Mask Defined, SMD) opening 17 (only schematically painting among Fig. 1 is two) to have a plurality of weldering cover definition types.These solder projections 18 (only schematically illustrating two among Fig. 1) are covered on these connection pads 14 respectively and protrude in respectively outside these openings 17.
In follow-up technology, be that the mode with reflow makes board structure of circuit 10A electrically be connected with structural by these solder projections 18 that are disposed between the two with chip (not illustrating).。In addition, the aperture of the opening 17 of welding resisting layer 16 above these connection pads 14 of little spacing dwindles, and causes the aspect ratio of opening 17 to increase, and more is unfavorable for printing or implants large-sized solder projection 18.Simultaneously, when engaging in the mode of reflow when the large-sized solder projection 18 of configuration on these connection pads 14 and with chip, these solder projections 18 can be heated because of reflow and present molten condition, since these connection pads 14 be with little spacing arrangement on the surface of circuit board 10, bridge joint (as the P place of Fig. 1) phenomenon and short circuit problem take place in the solder projection 18 that therefore causes easily being molten condition in the reflow process, and the electric connection structure of little spacing can't be provided.
Summary of the invention
The invention provides a kind of manufacture method of conductive projection, it utilizes electroless-plating technology to form thick metal layers on connection pad, reduce the aspect ratio (ratio of the opening degree of depth/hatch bore diameter) of the opening of welding resisting layer relatively, the phenomenon of scolder bridge joint short circuit can be avoided when the reflow scolder, taking place, and then the production yield can be improved.
The invention provides a kind of board structure of circuit with conductive projection, it reduces the aspect ratio of the opening of welding resisting layer relatively by the height of the thick metal layers on the connection pad, can reduce the use amount of scolder.
The present invention proposes a kind of manufacture method of conductive projection.At first, provide a circuit board.Circuit board has a surface, and disposes a plurality of connection pads with spacing arrangement on the surface.Then, form a welding resisting layer on circuit board.Welding resisting layer covering surfaces and have a plurality of openings, wherein these openings expose these connection pads respectively.Then, carry out an electroless-plating technology, form a thick metal layers respectively with surface in these connection pads, wherein the thickness of thick metal layers greater than 4 microns or welding resisting layer height 1/5 and less than the height of welding resisting layer, form a protective layer then on thick metal layers.
In one embodiment of this invention; above-mentioned manufacture method forms a plurality of solder projections on each protective layer to plant ball or mode of printing again; wherein each solder projection covers each thick metal layers and protrudes in outside each opening, and these solder projections of reflow again cause melt solder and condense.
In one embodiment of this invention, the material of above-mentioned thick metal layers comprises copper.
In one embodiment of this invention, above-mentioned to plant ball or mode of printing when forming these solder projections, also comprise and carry out a soldered ball reflow and a process for pressing, these solder projections be pressed into coin (coin) and be covered on the thick metal layers.
The present invention proposes a kind of manufacture method of conductive projection.At first, provide a circuit board.Circuit board has a surface, and disposes a plurality of connection pads with spacing arrangement on the surface.Then, carry out an electroless-plating technology, form a thick metal layers respectively with surface in these connection pads.Form at least one welding resisting layer on circuit board.The surface of welding resisting layer covering board and thick metal layers protrude in outside the welding resisting layer, and wherein thick metal layers is a thickness greater than welding resisting layer and less than the column-like projection block of welding resisting layer height twice.Then, form a protective layer on thick metal layers.
In one embodiment of this invention, the material of above-mentioned thick metal layers comprises copper.
In one embodiment of this invention, the method for above-mentioned formation protective layer comprises wireless plating technology.
In one embodiment of this invention, above-mentioned welding resisting layer comprises one first welding resisting layer and one second welding resisting layer, and forms the step of welding resisting layer, at first, forms first welding resisting layer on circuit board, wherein the surface of the first welding resisting layer covering board.Afterwards, form second welding resisting layer on first welding resisting layer, wherein second welding resisting layer covers first welding resisting layer.
In one embodiment of this invention, above-mentioned formation first welding resisting layer on circuit board after, comprise and carry out a flatening process, first welding resisting layer is shone a laser beam, to remove first welding resisting layer local and the thick metal layers connection.
The present invention proposes a kind of board structure of circuit with conductive projection, and it comprises a circuit board, a welding resisting layer, a thick metal layers and a protective layer.Circuit board has the connection pad of a surface and a plurality of spacing arrangement.These connection pads are disposed on the surface.Welding resisting layer is disposed on the circuit board and covering surfaces.Welding resisting layer has a plurality of openings, and these openings expose these connection pads respectively.Thick metal layers is disposed at respectively on these connection pads.The thickness of thick metal layers greater than 4 microns or welding resisting layer height 1/5 and less than the height of welding resisting layer, protective layer covers these thick metal layers respectively.
In one embodiment of this invention, a plurality of solder projections cover each protective layer respectively and protrude in outside each opening.
In one embodiment of this invention, the material of above-mentioned thick metal layers comprises copper.
The present invention proposes a kind of board structure of circuit with conductive projection, and it comprises a circuit board, a welding resisting layer, a thick metal layers, a protective layer.Circuit board has a surface and a plurality of connection pads with spacing arrangement.These connection pads are disposed on the surface.Welding resisting layer is disposed on the circuit board and covering surfaces.Welding resisting layer has a plurality of openings, and these openings expose these connection pads respectively.Thick metal layers is disposed at respectively on these connection pads.Thick metal layers protrudes in outside the welding resisting layer, and thick metal layers is a thickness greater than welding resisting layer and less than the column-like projection block of welding resisting layer height twice.Protective layer is covered on the surface that thick metal layers gives prominence to.
In one embodiment of this invention, the material of above-mentioned thick metal layers comprises copper.
In sum, because the manufacture method of conductive projection of the present invention is because of adopting electroless-plating technology, vapour deposition process, sputtering method, on the surface of connection pad, to form thick metal layers, so can reduce the aspect ratio (ratio of the opening degree of depth/hatch bore diameter) of the opening of welding resisting layer relatively, because of aspect ratio lower, so can reduce the use amount of scolder, thereby can avoid the phenomenon of scolder generation bridge joint short circuit when the reflow scolder, and then improve the technology yield of conductive projection and the reliability of board structure of circuit.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Fig. 1 is the generalized section of known a kind of board structure of circuit;
Fig. 2 is a kind of schematic diagram with board structure of circuit of conductive projection of one embodiment of the invention;
Fig. 3 A to Fig. 3 E is the schematic flow sheet of manufacture method of the conductive projection of Fig. 2;
Fig. 4 A is a kind of schematic diagram with board structure of circuit of conductive projection of another embodiment of the present invention;
Fig. 4 B is a kind of schematic diagram with board structure of circuit of conductive projection of another embodiment of the present invention;
Fig. 5 A to Fig. 5 G is the schematic flow sheet of manufacture method of the conductive projection of Fig. 4 B.
The main element symbol description
10A: board structure of circuit 10: circuit board
12: surface 14: connection pad
16: welding resisting layer 17: opening
18: solder projection 19: plating seed layer
100A, 100B, 100C: board structure of circuit
100: circuit board 102: surface
110: connection pad
120A, 120B, 120C: welding resisting layer
122A, 122B: opening
126: the second welding resisting layers of 124: the first welding resisting layers
130A, 130B: thick metal layers
140: solder projection 132,150: protective layer
170: the photoresist layer
L: laser beam P: bridge joint place
Embodiment
Fig. 2 is a kind of schematic diagram with board structure of circuit of conductive projection of one embodiment of the invention.Please refer to Fig. 2, in the present embodiment, the board structure of circuit 100A with conductive projection comprise a circuit board 100, a welding resisting layer 120A, a thick metal layers 130A and, a protective layer 132 and a plurality of solder projection 140.
Specifically, circuit board 100 has the connection pad 110 (only schematically illustrating two among Fig. 2) of a surface 102 and a plurality of spacing arrangement, wherein these connection pads 110 are disposed on the surface 102 of circuit board 100, and the spacing of wantonly two adjacent these connection pads 110 is between 50 microns (μ m) to 150 microns (μ m).In the present embodiment, the material of these connection pads 110 comprises copper, circuit board 100 for example be a printed circuit board (PCB) (Printed Circuit Board, PCB) or a support plate (IC Carrier).
These solder projections 140 (only schematically illustrating two among Fig. 2) cover each protective layer 132 respectively, and these welderings Dou projection 140 protrudes in respectively outside each opening 122A.In the present embodiment, the material of these solder projections 140 comprises leypewter or SAC alloy (lead-free alloy).Protective layer 132 covers the top of thick metal layers 130A, and wherein the material of protective layer 160 comprises tin, gold or silver-colored.
Because these solder projections 140 are to lay respectively on each protective layer 132; and the thickness of each thick metal layers 130A can reduce the aspect ratio (ratio of the opening degree of depth/hatch bore diameter) of each opening 122A of welding resisting layer 120A relatively; that is to say; thick metal layers 130A can reduce the degree of depth that these solder projections 140 are inserted these openings 122A; especially; the opening 122A of high aspect ratio is if no thick metal layers 130A reduces its aspect ratio; known scolder is difficult for by screen painting or plants mode such as ball filling in fully in the open bottom corner; and scolder fills in the amount of opening when obviously not enough; produce emptying aperture or defective at its bottom (joint of solder projection 18 and connection pad 14) easily, make the reliability of solder projection 18 reduce.
In brief, the board structure of circuit 100A with conductive projection of present embodiment, the thickness of its thick metal layers 130A increase (being preferably the height 1/5 of welding resisting layer 120A or higher), can reduce the aspect ratio of these openings 122A of welding resisting layer 120A relatively.In addition; when these solder projections 140 cover each protective layer 132; the thickness of thick metal layers 130A can reduce the degree of depth that these solder projections 140 are inserted these openings 122A; make things convenient for the user to form solder projection 140 fast, can constitute the electric connection structure of little spacing with predetermined altitude to print or to plant the ball mode.Therefore, present embodiment can improve the reliability of these solder projections 140.
Below only introduce the board structure of circuit 100A with conductive projection of the present invention, do not introduce the manufacture method of conductive projection of the present invention.To this, below will illustrate as an example, and cooperate Fig. 3 A to Fig. 3 E that the manufacture method of conductive projection of the present invention is described in detail with the board structure of circuit 100A among Fig. 2 with conductive projection.
Fig. 3 A to Fig. 3 E is the schematic flow sheet of manufacture method of the conductive projection of Fig. 2.Please refer to Fig. 3 A, the manufacture method according to the conductive projection of present embodiment at first, provides a circuit board 100.Circuit board 100 has a surface 102, and dispose a plurality of connection pads 110 with spacing arrangement (only schematically illustrating two among Fig. 3 A) on the surface 102 of circuit board 100, the spacing of wherein wantonly two adjacent these connection pads 110 is between 50 microns (μ m) to 150 microns (μ m).
Please refer to Fig. 3 B, then, form a welding resisting layer 120A on circuit board 100.Specifically, the part of the surface of welding resisting layer 120A covering board 100 102 and these connection pads 110, and welding resisting layer 120A has a plurality of opening 122A (only schematically illustrating two among Fig. 3 B), and wherein these openings 122A exposes these connection pads 110 respectively.According to these openings 122A of welding resisting layer 120A expose the area size of these connection pads 110 respectively, can be divided into weldering cover definition type opening and two kinds of kenels of non-welding cover definition type opening.In the present embodiment, these openings 122A of welding resisting layer 120A is weldering cover definition type opening, and these connection pads 110 that these openings 122A is exposed respectively are weldering cover definition type connection pad.
Please refer to Fig. 3 C, then, carry out an electroless-plating technology, form a thick metal layers 130A respectively with surface in these connection pads 110, wherein the thickness of thick metal layers 130A be about welding resisting layer 120A height 1/5 or higher.Specifically, the electroless-plating technology that present embodiment carried out is to utilize the reducing agent that is added to make metal ion be reduced into metal, and is deposited on the surface of these connection pads 110, promptly constitute so-called thick metal layers 130A, wherein the material of thick metal layers 130A comprises copper.In brief, the thick metal layers 130A of present embodiment adopts the mode of chemical deposition to be formed on the surface of these connection pads 110.
Please refer to Fig. 3 D; then; form a protective layer 132 on thick metal layers 130A, and add reflow to form a plurality of solder projections 140 on each protective layer 132 to plant ball or mode of printing, wherein each solder projection 140 covers each protective layer 132 and protrudes in outside each opening 122A.Please refer to Fig. 3 E; then; when to plant ball or mode of printing when forming these solder projections 140; more can carry out a soldered ball process for pressing; so that these solder projections 140 more closely are pressed on the protective layer 132; forming the solder projection 140 of a coin (coin), and make these solder projections 140 fill up these openings 122A of welding resisting layer 120A respectively, with as the electric connection structure between subsequent conditioning circuit plate structure 100A and the chip (not illustrating).
Because these solder projections 140 are to be positioned on the thick metal layers 130A, and the thickness of thick metal layers 130A is for example greater than 4 microns, be about welding resisting layer 120A height 1/5 or higher, reduce these solder projections 140 and insert the degree of depth of these openings 122A, present embodiment make things convenient for the user to form solder projection fast, so can constitute electric connection structure on these connection pads 110 of little spacing arrangement with predetermined altitude to print or to plant the ball mode.In the present embodiment, the material of these solder projections 140 comprises leypewter or SAC alloy.So far, on board structure of circuit 100A, finish the making of conductive projection.
In brief, because the manufacture method of the conductive projection of embodiment is to adopt electroless-plating technology, need not use the high electroplating technology of high pollution and cost, on the surface of connection pad 110, to form thick metal layers 130A, wherein the thickness of thick metal layers 130A increases, so can reduce the aspect ratio (ratio of the opening degree of depth/hatch bore diameter) of the opening 122A of welding resisting layer 120A relatively.In addition, under the situation of circuit board structure 100A one whole predetermined altitude, because solder projection 140 is to be covered on the thick metal layers 130A, therefore can reduce the use amount of solder projection 140 by the thickness increase of thick metal layers 130A, and can avoid the known solder projection 118 that when reflow scolder 18, is molten condition that bridge joint phenomenon and short circuit problem (please refer to Fig. 1) take place, and then improve the technology yield of conductive projection and the reliability of board structure of circuit 100A.
Fig. 4 A is a kind of schematic diagram with board structure of circuit of conductive projection of another embodiment of the present invention.Please refer to Fig. 4 A, in the present embodiment, the board structure of circuit 100B with conductive projection comprises a circuit board 100, a welding resisting layer 120B, a thick metal layers 130B and a protective layer 150.
Specifically, circuit board 100 has the connection pad 110 (only schematically illustrating two among Fig. 4) of a surface 102 and a plurality of spacing arrangement, wherein these connection pads 110 are disposed on the surface 102 of circuit board 100, and the spacing of wantonly two adjacent these connection pads 110 is between 50 microns (μ m) to 150 microns (μ m).In the present embodiment, the material of these connection pads 110 comprises copper, and circuit board 100 for example is a printed circuit board (PCB) or support plate (IC Carrier).
Welding resisting layer 120B is disposed on the circuit board 100 and the surface 102 of covering board 100, and wherein welding resisting layer 120B has a plurality of opening 122B (only schematically illustrating two among Fig. 4), and these openings 122B exposes these connection pads 110 respectively.This mandatory declaration be, according to these openings 122B of welding resisting layer 120B expose the area size of these connection pads 110 respectively, can be divided into weldering cover definition type opening and two kinds of kenels of non-welding cover definition type opening.In the present embodiment, these openings 122B of welding resisting layer 120B is a non-welding cover definition type opening, and these connection pads 110 that these openings 122B is exposed respectively are non-welding cover definition type connection pad.
Fig. 4 B is a kind of schematic diagram with board structure of circuit of conductive projection of another embodiment of the present invention.Please also refer to Fig. 4 A and Fig. 4 B, the board structure of circuit 100C of Fig. 4 B is similar to the board structure of circuit 100B of Fig. 4 A, only the two main difference be in: the welding resisting layer 120C of the board structure of circuit 100C of Fig. 4 B comprises one first welding resisting layer 124 and one second welding resisting layer 126, wherein surface 102, the second welding resisting layers 126 of first welding resisting layer, 124 covering boards 100 cover first welding resisting layer 124.In the present embodiment, first welding resisting layer 124 is identical in fact with the material of second welding resisting layer 126.
In brief, board structure of circuit 100B, the 100C with conductive projection of present embodiment, its thick metal layers 130B protrudes in outside welding resisting layer 120B, the 120C, and thick metal layers 130B can for thickness greater than welding resisting layer 120B, 120C and less than welding resisting layer 120B, 120C the height twice column-like projection block, wherein the thickness of welding resisting layer is about between 5 microns～20 microns, the preferable column-like projection block that forms with wireless plating technology with predetermined altitude, need not use the high electroplating technology of high pollution and cost, can on the connection pad 110 of spacing arrangement, form electric connection structure.
Below only introduce the board structure of circuit 100B with conductive projection of the present invention, do not introduce the manufacture method of conductive projection of the present invention.To this, below will illustrate as an example, and cooperate Fig. 5 A to Fig. 5 G that the manufacture method of conductive projection of the present invention is described in detail with the board structure of circuit 100C among Fig. 4 B with conductive projection.
Fig. 5 A to Fig. 5 G is the schematic flow sheet of manufacture method of the conductive projection of Fig. 4 B.Please refer to Fig. 5 A, the manufacture method according to the conductive projection of present embodiment at first, provides a circuit board 100.Circuit board 100 has a surface 102, and dispose the connection pad 110 (only schematically illustrating two among Fig. 5 A) of a plurality of spacing arrangement on the surface 102 of circuit board 100, the spacing of wherein wantonly two adjacent these connection pads 110 is between 50 microns (μ m) to 150 microns (μ m).
Then, form a photoresist layer 170 on the surface 102 of circuit board 100, wherein photoresist layer 170 is higher than these connection pads 110, and does not cover these connection pads 110, and its purpose is to limit the form of the follow-up thick metal layers 130B that will form.
Please refer to Fig. 5 B, then, carry out an electroless-plating technology, form a thick metal layers 130B respectively with surface in these connection pads 110.Specifically, the electroless-plating technology that present embodiment carried out is to utilize the reducing agent that is added to make metal ion be reduced into metal, and is deposited on the surface of these connection pads 110, promptly constitute so-called thick metal layers 130B, wherein the material of thick metal layers 130B comprises copper.In brief, the thick metal layers 130B of present embodiment adopts the mode of chemical deposition to be formed on the surface of these connection pads 110.
Please refer to Fig. 5 C, then, remove photoresist layer 170 and form at least one welding resisting layer 120C on circuit board 100.Below form the embodiment of welding resisting layer 120C on circuit board 100 for introducing, but not as limit.In the present embodiment, welding resisting layer 120C comprises one first welding resisting layer 124 and one second welding resisting layer 126, and forms the step of welding resisting layer 120C, at first, form first welding resisting layer 124 on circuit board 100, wherein the surface 102 of first welding resisting layer, 124 covering boards 100.In the present embodiment, form the mode of first welding resisting layer 124 on circuit board 100 and comprise ink-jet method or screen painting method or Scroll (roll to roll).
Please also refer to Fig. 5 D and 5E, then, carry out a flatening process, to first welding resisting layer, 124 irradiations, one laser beam L, to remove first welding resisting layer 124 local and thick metal layers 130B connection.Specifically; when first welding resisting layer 124 is formed on the circuit board 100; because these connection pads 110 are spacing arrangement and because of capillary relation; make that the surface 102 of the connection be positioned at the thick metal layers 130B on wantonly two adjacent these connection pads 110 and first welding resisting layer 124 and circuit board 100 is not parallel; therefore irradiating laser light beam L is to remove first welding resisting layer 124 local and thick metal layers 130B connection; except can be so that having an even surface of first welding resisting layer 124 is outside the pale of civilization; following area and cleaning function is arranged in the time of can also increasing subsequent technique between protective layer 150 and the thick metal layers 130B helps subsequent technique.
Please refer to Fig. 5 F, afterwards, form second welding resisting layer 126 on first welding resisting layer 124, wherein second welding resisting layer 126 covers first welding resisting layer 124.Specifically, in the present embodiment, the surface 102 of first welding resisting layer, 124 covering boards 100, and thick metal layers 130B protrudes in outside second welding resisting layer 126, wherein thick metal layers 130B is a thickness greater than welding resisting layer 120C and less than the column-like projection block of welding resisting layer 120C height twice, the thickness of welding resisting layer 120C is about between 5 microns～20 microns.In addition, in the present embodiment, the mode that forms on second welding resisting layer 126 and first welding resisting layer 124 comprises ink-jet method or screen painting method or Scroll (roll to roll).
What deserves to be mentioned is that in other embodiment, welding resisting layer 120C can be a simple layer only also, that is to say, welding resisting layer 120C can be as the welding resisting layer 120B of Fig. 4 A.Therefore, it is one embodiment of the invention on circuit board 100 that Fig. 5 C to Fig. 5 F forms welding resisting layer 120C, is not in order to restriction the present invention.
Please refer to Fig. 5 G, then last, form a protective layer 150 on the surface that thick metal layers 130B is given prominence to.In the present embodiment; the method that forms protective layer 150 comprises wireless plating technology; utilize the reducing agent added to make metal ion be reduced into metal, and be deposited on the surface that thick metal layers 130B given prominence to, and the material of protective layer 150 comprises tin, silver, gold or ashbury metal.In addition, the scolder 150 of present embodiment also can be other protective layers, and its material comprises nickel gold or organic solderability preservative.So far, on board structure of circuit 100C, finish the making of conductive projection.
In brief, because the manufacture method of the conductive projection of embodiment is to adopt electroless-plating technology, on the surface of connection pad 110, to form thick metal layers 130B, this thick metal layers 130B protrudes in outside the welding resisting layer 120C, and thick metal layers 130B is a thickness greater than welding resisting layer 120C and less than the column-like projection block of welding resisting layer 120C height twice, so need not use the high electroplating technology of high pollution and cost, can on the connection pad 110 of spacing arrangement, form electric connection structure.In addition, when by the mode of reflow, the scolder generation bridge joint phenomenon and the short circuit problem that can keep from heat and be fusion, and then improve the technology yield of conductive projection and the reliability of board structure of circuit 100C.
In sum, because the manufacture method of conductive projection of the present invention is because of adopting electroless-plating technology, on the surface of connection pad, to form thick metal layers, so can reduce the aspect ratio (ratio of the opening degree of depth/hatch bore diameter) of the opening of welding resisting layer relatively, and the use amount of minimizing scolder, and then can avoid the scolder generation bridge joint phenomenon and the short circuit problem that when the reflow scolder, are heated and are fusion, and then improve the technology yield of conductive projection and the reliability of board structure of circuit.In addition, under the situation of circuit board structure 100A one whole predetermined altitude,, therefore can reduce the use amount of solder projection or scolder by the thickness of thick metal layers because solder projection or scolder are to be covered on the thick metal layers.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (16)
1. the manufacture method of a conductive projection comprises:
Circuit board is provided, and this circuit board has a surface, and should dispose a plurality of connection pads with spacing arrangement on the surface;
Form welding resisting layer on this circuit board, this welding resisting layer covers this surface and has a plurality of openings, and wherein those openings expose those connection pads respectively;
Carry out electroless-plating technology, form thick metal layers respectively with surface in those connection pads, the thickness of this thick metal layers greater than the height of this welding resisting layer 1/5 and less than the height of this welding resisting layer; And
Form protective layer on this thick metal layers respectively.
2. the manufacture method of conductive projection as claimed in claim 1 also comprises:
Form a plurality of solder projections on this protective layer respectively to plant ball or mode of printing, wherein respectively this solder projection covers respectively this protective layer and protrudes in respectively outside this opening; And
Those solder projections of reflow.
3. the manufacture method of conductive projection as claimed in claim 1, wherein the material of this thick metal layers comprises copper.
4. the manufacture method of conductive projection as claimed in claim 2 wherein to plant the ball mode when forming those solder projections, also comprises and carries out the soldered ball process for pressing, so that those solder projections are pressed on this protective layer.
5. the manufacture method of conductive projection as claimed in claim 1, wherein the thickness of this thick metal layers is greater than 4 microns.
6. the manufacture method of a conductive projection comprises:
Circuit board is provided, and this circuit board has a surface, and should dispose a plurality of connection pads with spacing arrangement on the surface;
Carry out electroless-plating technology, form thick metal layers respectively with surface in those connection pads;
Form at least one welding resisting layer on this circuit board, this surface and this thick metal layers that this welding resisting layer covers this circuit board protrude in outside this welding resisting layer, and wherein this thick metal layers is a thickness greater than this welding resisting layer and less than the column-like projection block of this welding resisting layer height twice; And
Form protective layer on this thick metal layers respectively.
7. the manufacture method of conductive projection as claimed in claim 6, wherein the material of this thick metal layers comprises copper.
8. the manufacture method of conductive projection as claimed in claim 6, the method that wherein forms this protective layer comprises wireless plating technology.
9. the manufacture method of conductive projection as claimed in claim 6, wherein this welding resisting layer comprises first welding resisting layer and second welding resisting layer, and forms the step of this welding resisting layer, comprising:
Form this first welding resisting layer on this circuit board, wherein this first welding resisting layer covers this surface of this circuit board; And
Form this second welding resisting layer on this first welding resisting layer, wherein this second welding resisting layer covers this first welding resisting layer.
10. the manufacture method of conductive projection as claimed in claim 9, wherein form this first welding resisting layer on this circuit board after, comprising:
Carry out flatening process, to this first welding resisting layer irradiating laser light beam, to remove this first welding resisting layer local and this thick metal layers connection.
11. the board structure of circuit with conductive projection comprises:
Circuit board has a surface and a plurality of connection pads with spacing arrangement, and those connection pads are disposed on this surface;
Welding resisting layer is disposed on this circuit board and covers this surface, and this welding resisting layer has a plurality of openings, and those openings expose those connection pads respectively;
Thick metal layers is disposed at respectively on those connection pads, the thickness of this thick metal layers greater than the height of this welding resisting layer 1/5 and less than the height of this welding resisting layer; And
Protective layer covers this thick metal layers respectively.
12. the board structure of circuit with conductive projection as claimed in claim 11 also comprises a plurality of solder projections, covers respectively this protective layer respectively and protrudes in respectively outside this opening.
13. the board structure of circuit with conductive projection as claimed in claim 11, wherein the material of this thick metal layers comprises copper.
14. the manufacture method of conductive projection as claimed in claim 11, wherein the thickness of this thick metal layers is greater than 4 microns.
15. the board structure of circuit with conductive projection comprises:
Circuit board has a surface and with the connection pad of a plurality of spacing arrangement, those connection pads are disposed on this surface;
Welding resisting layer is disposed on this circuit board and covers this surface, and this welding resisting layer has a plurality of openings, and those openings expose those connection pads respectively;
Thick metal layers is disposed at respectively on those connection pads, and this thick metal layers protrudes in outside this welding resisting layer, and this thick metal layers is a thickness greater than this welding resisting layer and less than the column-like projection block of this welding resisting layer height twice; And
Protective layer covers this thick metal layers respectively.
16. the board structure of circuit with conductive projection as claimed in claim 15, wherein the material of this thick metal layers comprises copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810182006A CN101754592A (en) | 2008-11-28 | 2008-11-28 | Method for manufacturing a conductive projection and a circuit board structure with conductive projection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810182006A CN101754592A (en) | 2008-11-28 | 2008-11-28 | Method for manufacturing a conductive projection and a circuit board structure with conductive projection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101754592A true CN101754592A (en) | 2010-06-23 |
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| CN200810182006A Pending CN101754592A (en) | 2008-11-28 | 2008-11-28 | Method for manufacturing a conductive projection and a circuit board structure with conductive projection |
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| CN102789995A (en) * | 2011-05-20 | 2012-11-21 | 稳懋半导体股份有限公司 | Method of manufacture procedures for manufacturing metal protrusion and fusion welded metal |
| CN103000542A (en) * | 2011-09-16 | 2013-03-27 | 南茂科技股份有限公司 | Solder cap bump in semiconductor package and method of manufacturing the same |
| CN103140042A (en) * | 2011-11-25 | 2013-06-05 | 苏州群策科技有限公司 | Surface processing method for electroless plating wire of printed circuit board |
| CN103416108A (en) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing same |
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| CN108289388A (en) * | 2017-12-07 | 2018-07-17 | 江门崇达电路技术有限公司 | The undesirable PCB production methods of tin in a kind of prevention |
| CN111385970A (en) * | 2018-12-28 | 2020-07-07 | 南亚电路板股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN111385970B (en) * | 2018-12-28 | 2021-09-21 | 南亚电路板股份有限公司 | Circuit board structure and manufacturing method thereof |
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Application publication date: 20100623 |