CN1980530A - Method for making circuit-board conductive lug structure - Google Patents
Method for making circuit-board conductive lug structure Download PDFInfo
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- CN1980530A CN1980530A CN 200510125649 CN200510125649A CN1980530A CN 1980530 A CN1980530 A CN 1980530A CN 200510125649 CN200510125649 CN 200510125649 CN 200510125649 A CN200510125649 A CN 200510125649A CN 1980530 A CN1980530 A CN 1980530A
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Abstract
This manufacture method includes the following steps: (1) it offers at least one circuit board (CB) with several electric connecting pads (ECP) on its surface. An isolated protecting layer with several openings covers CB. (2) A conductive layer (CL) is formed on the surface of CB and openings. (3) A adhering layer (AL) is formed on the openings of the resistant layer (RL). (4) The metal layer (ML) and CL covered by RL and RL itself are removed. Only the part of ML and CL under AL on the place corresponding to ECP survives. A conductive protrusion structure is formed on ECP. This invention solves the problems of the uneven protrusion, the poor reliability of electric connection manufacture procedure, the smaller proportion of electric plating area and the deeper hole of the plating area. This invention can form effectively a conductive structure for electric connecting on an ECP with tiny space between. This invention reduces the consumption of tin and is good to environment protection.
Description
Technical field
The invention relates to a kind of method for making of circuit-board conductive lug structure, particularly about a kind of manufacture method that on the electric connection pad of circuit board, forms conductive lug structure.
Background technology
For making packaging part more compact, production has the fine rule that dwindles line width and weld pad size has become the industry ongoing effort apart from (Fine-pitch) product target, such as BGA, Flip Chip, chip size packages (CSP, Chip size package) with multi-chip module (MCM, Multi chipmodule) etc. can dwindle integrated circuit area and have high density and the packaging part of many pins characteristic, day by day become the main flow on the encapsulation market.With the Flip Chip is example, existing Flip Chip is to dispose electronic pads (Electrode pads) on the surface of semiconductor integrated circuit (IC) chip, and on circuit board, be formed with corresponding electric connection pad, by solder bump (Solder bump) or other conductive adhesive material are set between this chip and circuit board, provide this chip to be arranged on this circuit board in the ventricumbent mode of electrical contact.
In existing Flip Chip, the surface of semiconductor integrated circuit (IC) chip has electronic pads (Electrode pads), circuit board also has corresponding electric connection pad, at the electronic pads of this chip or the electric connection pad of circuit board solder bump or other conductive adhesive material can be set, this chip is to connect in the ventricumbent mode of electrical contact to place on this circuit board, wherein, this solder bump or conductive adhesive material provide the connection of the electrical I/O (I/O) between this chip and circuit board.
The electronic pads of this chip or the electric connection pad of circuit board form solder bump or conductive adhesive material, be to form now in the mode of printing, but along with the electric connection pad gap continues reduction, the size of electric connection pad is dwindled more, cause follow-up formation solder bump to be difficult for attached on this electric connection pad, cause the adhesion between soldering tin material and the electric connection pad not good, simultaneously because soldering tin material support strength deficiency, cause the soldering tin material of melted by heating when reflow also to have the phenomenon of overflow.
For solving above-mentioned drawback, on circuit board, form the technology of soldering tin material with plating mode, can realize the purpose on fine rule road.Compare higher precision is arranged owing to electroplate to form the mode of the mode of pre-scolding tin and printing coating, thereby can realize the fine rule road, can high-density wiring and can dwindle board area.Before on the electric connection pad of circuit board, forming plated solder with plating mode, on this electric connection pad, form conductive layer earlier, on this conductive layer, to form plated solder.Form the technology of plated solder on the electric connection pad of circuit board, shown in Figure 1A to Fig. 1 F.
See also Figure 1A, have one and form a welding resisting layer 11 (Solder mask) on the circuit board 10 of a plurality of electric connection pads 100.
See also Figure 1B, be formed with perforate 110, with the electric connection pad 100 that manifests this circuit board 10 at this welding resisting layer 11.
See also Fig. 1 C, then 100 surfaces of the electric connection pad in these welding resisting layer 11 surfaces and perforate 110 thereof form a conductive layer 12 (seed layer).
See also Fig. 1 D, also on this conductive layer 12, form a resistance layer 13 (resister layer), and be formed with perforate 130, to expose outside the conductive layer 12 that is overlying on the electric connection pad 100 with respect to electric connection pad 100 places of circuit board 10.
See also Fig. 1 E, carry out electroplating process then, as the path of electroplating, on the electric connection pad 100 of this circuit board 10, form conductive projection 14 by this conductive layer 12.
See also Fig. 1 F, the conductive layer 12 that removes this resistance layer 13 afterwards and covered, and, protect this conductive projection 14 at these conductive projection 14 surface formation coat of metals 15.
Right this conductive projection 14 of face is formed in the perforate 130 of the perforate 110 of welding resisting layer 11 and resistance layer 13, and this perforate 110 and the 130 stacked holes that constitute are darker, form conductive projection 14 in the darker hole of hole shape, has increased the difficulty of electroplating process.
Moreover, in perforate 110,130, form conductive projection 14, the region area that will electroplate because of this conductive layer 12 is little, so the current density that is provided is difficult for keeping stable, make the conductive projection 14 of these formation highly differ, cause planarization poor, influence the carrying out of successive process.
Therefore, how to avoid prior art to reach the region area that to electroplate more deeply and hour form a conductive projection, cause the not good problem that influences successive process of planarization, become the problem that needs to be resolved hurrily at present at hole shape.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of method for making of circuit-board conductive lug structure, avoids producing the problem that not good and subsequent conditioning circuit plate of the planarization of circuit board surface conductive projection and exterior electrical components electrically connect the processing procedure poor reliability.
A further object of the present invention is to provide a kind of method for making of circuit-board conductive lug structure, can avoid in the prior art causing problems such as electroplating process difficulty increase because the plating area area is little or the plating area hole shape is darker.
Another object of the present invention is to provide a kind of method for making of circuit-board conductive lug structure, can reduce the soldering tin material use amount and help environmental issue.
Of the present invention again again a purpose be to provide a kind of circuit-board conductive lug structure and method for making thereof, on the electrically connected mat of circuit board of thin space, form effectively and outwards make the conductive structure that is electrically conducted.
For reaching above-mentioned and other purpose, the invention provides a kind of method for making of circuit-board conductive lug structure, the method for making of circuit-board conductive lug structure of the present invention may further comprise the steps: provide an at least one surface to be formed with the circuit board of a plurality of electric connection pads, and on this circuit board, cover an insulating protective layer, and make this insulating protective layer form a plurality of openings to expose outside this electric connection pad; Form a conductive layer at this insulating protective layer and open surfaces, and on this conductive layer, electroplate formation one metal level, make this metal level be filled in the opening of this insulating protective layer; On this metal level, cover a resistance layer, and make this resistance layer be formed with opening exposed portions serve metal level in addition corresponding to this electric connection pad position; In this resistance layer opening, form an adhesion coating; And remove this resistance layer and metal level that is covered and conductive layer, and keep under this adhesion coating corresponding to the part metals layer and the conductive layer of this electric connection pad position, on this electric connection pad, form conductive lug structure.Wherein, if this adhesion coating is soldering tin material, carry out back welding process follow-up also comprising, make this for example the adhesion coating of soldering tin material be coated on the exposed surface of this metal level.
The invention still further relates to a kind of method for making of circuit-board conductive lug structure, the method for making of this circuit-board conductive lug structure may further comprise the steps: provide an at least one surface to be formed with the circuit board of a plurality of electric connection pads, and on this circuit board, cover an insulating protective layer, and make this insulating protective layer be formed with a plurality of openings to expose outside this electric connection pad; Form a conductive layer at this insulating protective layer and open surfaces thereof, and on this conductive layer, electroplate formation one metal level, and this metal level is filled in this insulating protective layer opening; On this metal level, cover a resistance layer, and this resistance layer is carried out patterning, make this resistance layer only cover part metals layer corresponding to this electric connection pad position; Remove is not metal level and the conductive layer that this resistance layer covered; And remove this resistance layer, and on this metal level exposed surface, form an adhesion coating.
Therefore; the method for making of circuit-board conductive lug structure of the present invention is to form the insulating protective layer of a plurality of openings of tool to expose outside the electric connection pad of this circuit board surface on circuit board; then form a conductive layer at this insulating protective layer and open surfaces; do not cover by this conductive layer surface and to put resistance layer; make this conductive layer appear surface area fully; provide bigger plating area to form a metal level on this conductive layer, to electroplate; the conductive layer that removes the part metals layer again and covered; only keep to should electric connection pad the metal level and the conductive layer of part; form an adhesion coating on its surface again, on the electric connection pad of this circuit board surface, form conductive lug structure.The present invention can avoid in the existing electroplating process area current density too small, that provided in plating area to be difficult for keeping stable institute and cause problem such as electroplating process difficulty increase; and metal level of the present invention is that first holomorphism is formed in the surface and opening of this insulating protective layer; make this layer on surface of metal smooth, the metal level that removes part afterwards is to form highly consistent conductive lug structure.Prior art is in electroplating process; directly in the stacked opening of insulating protective layer and resistance layer, electroplate and form conductive projection; owing to will in the darker hole of hole shape, form conductive projection; increased the difficulty of electroplating process; cause conductive projection height consistency uncontrollable, cause circuit board and extraneous electronic component can't effectively finish electric connection.
Simultaneously; the method for making of circuit-board conductive lug structure of the present invention is to form conductive layer and metal level on the insulating protective layer of circuit board surface successively; behind the conductive layer that removes the part metals layer and covered; form adhesion coating again; so as on the electric connection pad of this circuit board, forming conductive projection; avoid prior art on insulating protective layer, to form conductive layer; on conductive layer, form resistance layer again; in the opening of insulating protective layer and resistance layer, electroplate when forming conductive projection then, cause problems such as electroplating process difficulty increase because of the plating area excessive height.
In addition, the present invention can be by material cost lower and electroplating velocity faster for example copper plated material electroplate out copper metal level, shortened the processing procedure required time, and can carry out electroplating process by bigger plating area and reduce the electroplating process difficulty, form then material cost higher for example be the adhesion coating of soldering tin material, shortened the processing procedure required time, reduce material cost and environmental issue by the use amount that reduces soldering tin material, and can avoiding in the reflow process too much simultaneously, the soldering tin material fusion causes arch formation and short circuit problem, the electric connection pad of thin space is provided, and avoids the mould printing technology to form conductive projection size and the restriction of adjacent electric connection pad spacing and the bottleneck on the process technique.
Description of drawings
Figure 1A to Fig. 1 F is the generalized section that forms electric conductive projection on the electric connection pad of available circuit plate;
Fig. 2 A to Fig. 2 L is the generalized section of the method for making embodiment 1 of circuit-board conductive lug structure of the present invention; And
Fig. 3 A to Fig. 3 G is the generalized section of the method for making embodiment 2 of circuit-board conductive lug structure of the present invention.
Embodiment
Embodiment 1
See also Fig. 2 A to Fig. 2 L, it is the generalized section of the method for making embodiment 1 of circuit-board conductive lug structure of the present invention.What must note a bit is herein, these accompanying drawings are the schematic diagram of simplification, it only illustrates basic framework of the present invention in a schematic way, therefore it only shows the formation relevant with the present invention, and shown formation be not number when implementing, shape with reality, and dimension scale draw, number, shape and dimension scale during its actual enforcement is a kind of optionally design, and its formation arrangement form may be more complicated.
See also Fig. 2 A to Fig. 2 D, at first provide the surface to be formed with the circuit board of a plurality of electric connection pads.Shown in Fig. 2 A, it is to form conductive layer 42 on a circuit board surface insulating barrier 41, this conductive layer 42 is mainly as the required current conduction path of follow-up electroplating metal material, it can be made of metal or precipitation number layer metal level, as be selected from single or multiple lift structures such as copper, tin, nickel, chromium, titanium, copper-chromium or tin-lead, maybe can use for example conducting polymer composites such as polyacetylene, polyaniline or organic sulfur polymer; Shown in Fig. 2 B, then on this conductive layer 42, form a resistance layer 43, this resistance layer 43 can be for example a photoresist layer such as dry film or liquid photoresistance (Photoresist) or a non-sensitization resistance layer, it is to utilize modes such as printing, spin coating or applying to be formed at this conductive layer 42 surfaces, relend by modes such as exposure, development or laser patterning in addition, make this resistance layer 43 be formed with a plurality of openings 430 that expose outside partially conductive layer 42; Shown in Fig. 2 C, electroplate (Electroplating) processing procedure, the conductive characteristic that has by this conductive layer 42, when electroplating, can be used as current conduction path, to electroplate in the opening 430 to electroplate at this and be formed with electric connection pad 440, also can electroplate the conducting wire (not marking) that is formed with circuit board surface certainly simultaneously; Shown in Fig. 2 D, then be removable with this resistance layer 43 and by the conductive layer 42 of these resistance layer 43 coverings.
See also Fig. 2 E, then, form an insulating protective layer 45 at this circuit board surface.Be to utilize printing, spin coating or arbitrary mode of fitting in the present embodiment, this insulating protective layer 45 is coated in this circuit board surface, relend by patterning process and make this electric connection pad 440 be emerging in this insulating protective layer 45.Wherein, this insulating protective layer 45 can for example be that the welding resisting layer material is made, and by modes such as exposure, development or laser patterning in addition, makes this insulating protective layer 45 be formed with a plurality of openings 450, exposes outside this electric connection pad 440.
See also Fig. 2 F, form a conductive layer 46 at this insulating protective layer 45 and opening 450 surfaces thereof.This conductive layer 46 mainly is as the required current conduction path of follow-up electroplating metal material, and it can be made of metal, alloy or precipitation number layer metal level, maybe can use for example conducting polymer composite.
See also Fig. 2 G; then carry out electroplating process; by this conductive layer 46 as current conduction path; and by this bigger plating area, conductive layer 46 surfaces; form a metal level 47 on this conductive layer 46, to electroplate comprehensively; and this metal level 47 is filled in the opening 450 of this insulating protective layer 45, to keep this metal level 47 surfacings.Wherein, the material of this metal level 47 can be metal or its alloys such as lead, tin, silver, copper, and according to the experience of practical operation, because that copper is ripe plated material and cost is lower, therefore, this metal level 47 is preferable by the electro-coppering constitutor, but non-as limit.
See also Fig. 2 H, on this metal level 47, form a resistance layer 48, and carry out patterning process and form a plurality of openings 480, expose outside the metal level 47 of part.Be to utilize printing, spin coating and arbitrary mode of fitting in the present embodiment, this resistance layer 48 is covered this metal level 47 surfaces, relend by patterning process and make this metal level 47 of part be emerging in this resistance layer opening 480, and the opening 480 of this resistance layer 48 is to electric connection pad 440 positions that should circuit board surface.
See also Fig. 2, in the opening 480 of this resistance layer 48, form an adhesion coating 49.The material of this adhesion coating 49 is to be selected from copper, tin, lead, silver, nickel, gold, platinum or its alloy, and can directly form by plating mode.
See also Fig. 2 J, then utilize modes such as chemical etching or physical removal to remove this resistance layer 48.
See also Fig. 2 K, then remove the part metals layer 47 and the conductive layer 46 that are not covered by this adhesion coating 49, only stay this adhesion coating 49 times part metals layer 47 and conductive layers 46, on this electric connection pad 440, form conductive lug structure corresponding to these electric connection pad 440 positions.
See also Fig. 2 L, if this adhesion coating 49 when being soldering tin material, then can carry out back welding process, this is formed at metal level 47 exposed surfaces on this electric connection pad 440 to make the complete coating of this soldering tin material.
Embodiment 2
See also Fig. 3 A to Fig. 3 G, it is the generalized section of the method for making embodiment 2 of circuit-board conductive lug structure of the present invention.
See also Fig. 3 A, at first provide an at least one surface to be formed with the circuit board 50 of a plurality of electric connection pads 510.
See also Fig. 3 B, then on this is formed with the circuit board 50 of electric connection pad 510, cover an insulating protective layer 55.Be to utilize printing, spin coating or arbitrary mode of fitting covers this insulating protective layer 55 on this circuit board 50 in the present embodiment, relend by patterning process and form a plurality of openings 550, this electric connection pad 510 is emerging in the opening 550 of this insulating protective layer 55.
See also Fig. 3 C, form a conductive layer 56 at this insulating protective layer 55 and opening 550 surfaces thereof.This conductive layer 56 is as the needed current conduction path of follow-up electroplating metal material.
See also Fig. 3 D; carry out electroplating process; by this conductive layer 56 as current conduction path; by this bigger plating area, conductive layer 56 surfaces; on this conductive layer 56, electroplate to form a metal level 57, and this metal level 57 is filled in the opening 550 of this insulating protective layer to keep this metal level 57 surfacings.
See also Fig. 3 E, form a resistance layer 58 on this metal level 57, the material of this resistance layer 58 can be dry film or liquid photoresistance.Be to utilize arbitrary mode of printing, spin coating or applying that this resistance layer 58 is overlayed on this metal level 57 surfaces in the present embodiment, relend by patterning process and make this resistance layer 58 only cover metal level 57 corresponding to electric connection pad 510 positions on these circuit board 50 surfaces.
See also Fig. 3 F, remove the part metals layer 57 and the conductive layer 56 that do not cover, keep this resistance layer 58 times part metals layer 57 and conductive layers 56 corresponding to electric connection pad 510 positions on these circuit board 50 surfaces for this resistance layer 58.
See also Fig. 3 G, then utilize chemical scavenging mode or physical removal mode to remove this resistance layer 58, so as on these metal level 47 exposed surfaces, forming an adhesion coating 59 in the electroless-plating mode.
Therefore; the method for making of circuit-board conductive lug structure of the present invention is to form the insulating protective layer of a plurality of openings of tool to expose outside the electric connection pad of this circuit board surface on circuit board; then form a conductive layer at this insulating protective layer and open surfaces; because of covering, this conductive layer surface do not put resistance layer; provide conductive layer that bigger exposed surface area is arranged; provide bigger plating area on this conductive layer, to electroplate and form a metal level; the conductive layer that removes the part metals layer again and covered; only keep to should electric connection pad the metal level and the conductive layer of part; form an adhesion coating on its surface again; on the electric connection pad of this circuit board surface, form conductive lug structure; can avoid the area too small electroplating process difficulty increase that causes in plating area in the existing electroplating process; and this metal level is that first holomorphism is formed in the surface and opening of this insulating protective layer in the present invention; make this layer on surface of metal smooth, the metal level that removes part thereafter is to form highly consistent conductive lug structure.Existing electroplating process is to form resistance layer on conductive layer, cause the stacked hole shape of opening, in this stacked opening, electroplate then and form conductive projection, because of the plating area hole shape darker, the region area that makes the electroplating process difficulty increase and will electroplate is little, causes the current density of processing procedure to be difficult for keeping stable, and the height after making these conductive projections form differs, cause planarization poor, have influence on the carrying out of successive process and electrically connect with extraneous electronic component.
Claims (16)
1. the method for making of a circuit-board conductive lug structure is characterized in that, the method for making of this circuit-board conductive lug structure comprises:
The circuit board that provides an at least one surface to be formed with a plurality of electric connection pads, and on this circuit board, cover an insulating protective layer, and make this insulating protective layer form a plurality of openings to expose outside this electric connection pad;
Form a conductive layer at this insulating protective layer and open surfaces, and on this conductive layer, electroplate formation one metal level, make this metal level be filled in the opening of this insulating protective layer;
On this metal level, cover a resistance layer, and make this resistance layer be formed with opening exposed portions serve metal level in addition corresponding to this electric connection pad position;
In this resistance layer opening, form an adhesion coating; And
Remove this resistance layer and metal level that is covered and conductive layer, keep under this adhesion coating, on this electric connection pad, form conductive lug structure corresponding to the part metals layer and the conductive layer of this electric connection pad position.
2. the method for making of circuit-board conductive lug structure as claimed in claim 1 is characterized in that, the processing procedure of this electric connection pad comprises:
On the circuit board surface insulating barrier, form conductive layer;
On this conductive layer, form resistance layer, and make this resistance layer form a plurality of openings exposed portions serve conductive layer in addition; And
In this resistance layer opening, electroplate and form electric connection pad.
3. the method for making of circuit-board conductive lug structure as claimed in claim 2 is characterized in that, the method for making of this circuit-board conductive lug structure also comprises and removing in order to resistance layer that electroplate to form this electric connection pad and the conductive layer that is covered thereof.
4. the method for making of circuit-board conductive lug structure as claimed in claim 1 is characterized in that, this adhesion coating is to be formed on this metal level by plating or coating method.
5. the method for making of circuit-board conductive lug structure as claimed in claim 1 is characterized in that, this adhesion coating material be selected from tin, silver, gold, copper, nickel, lead, platinum and the alloy thereof a kind of.
6. the method for making of circuit-board conductive lug structure as claimed in claim 5 is characterized in that, this adhesion coating is to overlay on this metal level exposed surface through reflow with complete packet.
7. the method for making of circuit-board conductive lug structure as claimed in claim 1 is characterized in that, this metal level material is to be selected from lead, tin, silver, copper and alloy thereof to constitute in the group a kind of.
8. the method for making of circuit-board conductive lug structure as claimed in claim 1 is characterized in that, this conductive layer is that metal material is made.
9. the method for making of circuit-board conductive lug structure as claimed in claim 1 is characterized in that, this conductive layer is that high-molecular organic material is made.
10. the method for making of a circuit-board conductive lug structure is characterized in that, the method for making of this circuit-board conductive lug structure comprises:
The circuit board that provides an at least one surface to be formed with a plurality of electric connection pads, and on this circuit board, cover an insulating protective layer, and make this insulating protective layer be formed with a plurality of openings to expose outside this electric connection pad;
Form a conductive layer at this insulating protective layer and open surfaces thereof, and on this conductive layer, electroplate formation one metal level, and this metal level is filled in this insulating protective layer opening;
On this metal level, cover a resistance layer, and this resistance layer is carried out patterning, make this resistance layer only cover part metals layer corresponding to this electric connection pad position;
Remove is not metal level and the conductive layer that this resistance layer covered; And
Remove this resistance layer, and on this metal level exposed surface, form an adhesion coating.
11. the method for making of circuit-board conductive lug structure as claimed in claim 10 is characterized in that, the processing procedure of this electric connection pad comprises:
On the surface insulation layer of circuit board, form conductive layer;
On this conductive layer, form resistance layer, and make this resistance layer form a plurality of openings exposed portions serve conductive layer in addition; And
In this resistance layer opening, electroplate and form electric connection pad.
12. the method for making of circuit-board conductive lug structure as claimed in claim 11 is characterized in that, the method for making of this circuit-board conductive lug structure also comprises and removing in order to resistance layer that electroplate to form this electric connection pad and the conductive layer that is covered thereof.
13. the method for making of circuit-board conductive lug structure as claimed in claim 10 is characterized in that, this adhesion coating material is to be selected from tin, silver, gold, copper, nickel, lead, platinum and alloy thereof to constitute a kind of in the group.
14. the method for making of circuit-board conductive lug structure as claimed in claim 10 is characterized in that, this metal level material is to be selected from lead, tin, silver, copper and alloy thereof to constitute a kind of in the group.
15. the method for making of circuit-board conductive lug structure as claimed in claim 10 is characterized in that, this conductive layer is that metal material is made.
16. the method for making of circuit-board conductive lug structure as claimed in claim 10 is characterized in that, this conductive layer is that high-molecular organic material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510125649 CN1980530A (en) | 2005-11-30 | 2005-11-30 | Method for making circuit-board conductive lug structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510125649 CN1980530A (en) | 2005-11-30 | 2005-11-30 | Method for making circuit-board conductive lug structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1980530A true CN1980530A (en) | 2007-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510125649 Pending CN1980530A (en) | 2005-11-30 | 2005-11-30 | Method for making circuit-board conductive lug structure |
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| CN (1) | CN1980530A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101364586B (en) * | 2007-08-10 | 2010-06-23 | 全懋精密科技股份有限公司 | Construction for packaging substrate |
| CN102208383A (en) * | 2010-03-31 | 2011-10-05 | 南亚电路板股份有限公司 | Circuit board and formation method thereof |
| CN102237328A (en) * | 2010-04-27 | 2011-11-09 | 瑞鼎科技股份有限公司 | Die structure and die bonding method |
| CN101740403B (en) * | 2007-08-10 | 2011-12-14 | 欣兴电子股份有限公司 | Packaging baseplate structure and manufacture method thereof |
| CN102569098A (en) * | 2010-12-30 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Semiconductor packaging piece and semiconductor packaging method |
| CN103635035A (en) * | 2012-08-29 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and making method thereof |
| TWI512847B (en) * | 2009-09-29 | 2015-12-11 | Semiconductor Components Ind | Method of manufacturing a semiconductor component and structure |
| CN111315124A (en) * | 2020-02-27 | 2020-06-19 | 歌尔股份有限公司 | Circuit board assembly and electronic device |
-
2005
- 2005-11-30 CN CN 200510125649 patent/CN1980530A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101364586B (en) * | 2007-08-10 | 2010-06-23 | 全懋精密科技股份有限公司 | Construction for packaging substrate |
| CN101740403B (en) * | 2007-08-10 | 2011-12-14 | 欣兴电子股份有限公司 | Packaging baseplate structure and manufacture method thereof |
| TWI512847B (en) * | 2009-09-29 | 2015-12-11 | Semiconductor Components Ind | Method of manufacturing a semiconductor component and structure |
| CN102208383A (en) * | 2010-03-31 | 2011-10-05 | 南亚电路板股份有限公司 | Circuit board and formation method thereof |
| CN102208383B (en) * | 2010-03-31 | 2013-08-28 | 南亚电路板股份有限公司 | Circuit board and formation method thereof |
| CN102237328A (en) * | 2010-04-27 | 2011-11-09 | 瑞鼎科技股份有限公司 | Die structure and die bonding method |
| CN102569098A (en) * | 2010-12-30 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Semiconductor packaging piece and semiconductor packaging method |
| CN103635035A (en) * | 2012-08-29 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and making method thereof |
| CN111315124A (en) * | 2020-02-27 | 2020-06-19 | 歌尔股份有限公司 | Circuit board assembly and electronic device |
| CN111315124B (en) * | 2020-02-27 | 2021-06-18 | 歌尔光学科技有限公司 | Circuit board assembly and electronic device |
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