JPS63169790A - Plastic molded unit with wiring network and manufacture of the same - Google Patents
Plastic molded unit with wiring network and manufacture of the sameInfo
- Publication number
- JPS63169790A JPS63169790A JP148587A JP148587A JPS63169790A JP S63169790 A JPS63169790 A JP S63169790A JP 148587 A JP148587 A JP 148587A JP 148587 A JP148587 A JP 148587A JP S63169790 A JPS63169790 A JP S63169790A
- Authority
- JP
- Japan
- Prior art keywords
- wiring network
- mold
- wiring
- molded body
- plastic molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004033 plastic Substances 0.000 title claims description 22
- 229920003023 plastic Polymers 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims description 24
- 238000000465 moulding Methods 0.000 claims description 17
- 239000003973 paint Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- 230000000873 masking effect Effects 0.000 claims description 9
- 238000004873 anchoring Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 8
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000007977 PBT buffer Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Communication Cables (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、電子、電気機器用などの配線網付プラスチ
ック成形体及びその製法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a plastic molded body with a wiring network for use in electronic and electrical equipment, and a method for producing the same.
従 来 の 技 術
従来、プラスチック成形体主体く別工８！によるエツチ
ング方式印刷配線板を組み付けた電子、電気機器用等の
プラスチック成形体は、前記組み付けに多くの工数を必
要とするばかりか、＃配線板の設置スペースが必要とな
ること等からして、これを低価格化、小型化することは
非常に困難であった。前記エツチング方式の印刷配線板
ｔこ代えて塗装配線ｔこよる配線板を使用する場合があ
る力９．塗装配線は、密着不充分で°矢線が起き易く、
また。Conventional technology Traditionally, plastic moldings were mainly made separately 8! Plastic molded bodies for electronic and electrical equipment, etc., which are assembled with etching printed wiring boards, not only require a large number of man-hours for the assembly, but also require a large amount of space to install the wiring boards. It was extremely difficult to reduce the cost and size of this device. 9. In some cases, a printed wiring board with painted wiring is used instead of the etched printed wiring board. Painted wiring tends to cause ° arrows due to insufficient adhesion.
Also.
塗料中の溶剤対端が厄介な問題となっている。Solvent dispersion in paints has become a troubling problem.
これらの問題点は、特開昭６１−２０８８９２号公報に
おいて解決済であるが、これ以外の有効な解消手段も見
逃すことはできない。Although these problems have been solved in Japanese Patent Laid-Open No. 61-208892, other effective solutions cannot be overlooked.
発明が解決しようとする問題点
複雑、大型であって工数を要するエツチング方式印刷配
線板、塗装配線による配線板等を組み付けた電子、１！
１機器用等のプラスチック成形体の構造を簡略、小型化
して価格を低減することにあり。Problems to be Solved by the Invention Electronic circuits that incorporate complicated, large, and time-consuming etching printed wiring boards, wiring boards with painted wiring, etc., 1!
The objective is to simplify and downsize the structure of plastic molded bodies for single equipment, etc., and reduce costs.
そして、導〒１品質、耐久性などを改善することにあり
、また、塗装配線によるものは、塗料中の溶剤が該成形
体その他に悪影響を及ぼすがこの点を解消することにあ
る。The purpose is to improve the quality, durability, etc. of conductors, and also to eliminate the problem that the solvent in the paint has an adverse effect on the molded body and other parts when using painted wiring.
問題点を解決するための手段
配線網状条部を有するプラスチック成形体、＃成形体条
部の表面には導電性塗料による塗工配線網が投錨塗着し
ていること、及び製法１こついては。Means for Solving the Problems: A plastic molded body having wiring net-like stripes, a wiring network coated with conductive paint on the surface of the molded body stripes, and manufacturing method 1.
成形型々面に配線網状条部の型面部を設けて配線網状条
部を有するプラスチック成形体成形用の成形金型を構成
し、これの型面に配線網状切抜部を有するマスキング材
を密着状Ｃ−被覆し、その切抜部より露出する前記型面
部に導電性塗料を剥離可能に塗工して、該型面部に前記
切抜部と同等の塗工配線網を口前し、この成形金型内に
前記成形体成形用のプラスチック素材を充填して後該充
填素材に高圧をかけて配線網状条部を有するプラスチッ
ク成形体を成形し、かつ条部の表面に前記配線網を投錨
前することにある。A molding die for molding a plastic molded article having a wiring net-like strip is provided by providing a mold surface portion of the wiring net-like strip on each mold surface, and a masking material having a wiring net-like cutout is tightly attached to the mold surface. C- coat, releasably apply a conductive paint to the mold surface exposed from the cutout, apply a coated wiring network equivalent to the cutout to the mold surface, and apply this molding die to the mold surface. Filling the molded body with a plastic material for molding the molded body, applying high pressure to the filling material to form a plastic molded body having a wire network strip, and before anchoring the wire network on the surface of the strip. It is in.
作 用
配線網状条部を有するプラスチック成形体の成形と同時
にその条部表面に論工配線網を投錨前せしめることで、
これの製作工数は削減され、かつ成形体の小型化、簡略
化がはかれるものであり、また、配線網は、破損、剥離
することなく耐久１強力に密着しており、そして、配線
網は良好な導電性を発揮するものである。At the same time as molding a plastic molded body having working wiring net-like stripes, a logic wiring network is placed on the surface of the strips before anchoring.
The manufacturing man-hours are reduced, the molded body is made smaller and simpler, and the wiring network has strong adhesion for durability without damage or peeling, and the wiring network is in good condition. It exhibits excellent conductivity.
実 施 例
この発明の配線組付プラスチック成形体及びその製法を
例示図によって詳述する。第１．６図は要部を誇張した
この発明成形体の断面図、第２．７図は成形金型の断面
図、第８．８図は要造過程の略示的。EXAMPLE The plastic molded article with wiring assembly of the present invention and its manufacturing method will be described in detail with reference to illustrative drawings. Fig. 1.6 is a sectional view of the molded article of the present invention with the main parts exaggerated, Fig. 2.7 is a sectional view of the molding die, and Fig. 8.8 is a schematic representation of the manufacturing process.
説明図、第４図はこの発明成形体要部の平面図。The explanatory drawing and FIG. 4 are plan views of essential parts of the molded article of the present invention.
第５図は第４図円線部分の拡大断面図である。FIG. 5 is an enlarged sectional view of the circle line portion in FIG. 4.
図中１は条部、２は条部を有するプラスチック成形体、
８は塗工配線網、５はこの発明の成形体である。In the figure, 1 is a striped part, 2 is a plastic molded body having a striped part,
8 is a coated wiring network, and 5 is a molded body of the present invention.
第１．６図において、この発明の配線組付デフスチフク
成形体５は１表面に配線網状条部１を有する熱可塑性プ
ラスチック成形体２．＃成形体２条部１０表面には熱可
塑性樹脂をバインダ８６としこれに導電性粗粉末３ｂ、
溶剤を混入複合化した導電性塗料３ａｔＣよる塗工配線
網８が投錨前している。この実施例では前記条部１は、
成形体２の表面より突出する突出条部１ｍ、表面に仕切
溝４．４を並列凹設してその間に浮彫条部１ｂを設けた
場合を例示したが、該条部１は形状、大きさなどはこれ
に限定するものでない。In FIG. 1.6, a wiring assembly differential stiffener molded body 5 of the present invention is a thermoplastic plastic molded body 2 having a wiring mesh strip 1 on one surface. # On the surface of the two-striped part 10 of the molded body, a thermoplastic resin is used as a binder 86, and conductive coarse powder 3b is applied to the binder 86.
A coating wiring network 8 made of conductive paint 3atC mixed with a solvent is placed before anchoring. In this embodiment, the strip portion 1 is
The case is illustrated in which a protruding strip 1m protrudes from the surface of the molded body 2, partition grooves 4.4 are recessed in parallel on the surface, and an embossed strip 1b is provided between them. etc. are not limited to this.
この発明の成形体６は、配線網８が成形体２０条部ｌＩ
Ｃ耐久１強力に投錨前していて破損、剥離することがな
く良好な導電性を示すものである。In the molded body 6 of the present invention, the wiring network 8 is formed in the molded body 20 strip portion lI.
C Durability 1: Strongly anchored and exhibits good electrical conductivity without breakage or peeling.
この発明の製法について説明すると、６は配線網状条部
を有するプラスチック成形体成形用の成形金型で、該金
型６は固定型７及び可動型８からなる。そして、この成
形金型６の型面、この例では可動型８の型面ｇａｃは、
前記条部１（条部１ａ、ｌｂ）を成形するための型面部
８ｂまたは８ｅが設けである。型面部８ｂは条部−の成
形型面部、型面部８ｃは条部１ｂｌＦ）成形型面部で並
列仕切溝４を成形する凸条８ｄ開を型面部とする。To explain the manufacturing method of the present invention, reference numeral 6 denotes a molding die for molding a plastic molded article having a wiring network strip, and the die 6 consists of a fixed die 7 and a movable die 8. The mold surface of this molding die 6, in this example, the mold surface gac of the movable mold 8, is
A mold surface portion 8b or 8e for molding the strip portion 1 (strip portions 1a, lb) is provided. The mold surface portion 8b is the mold surface portion of the striped portion, and the mold surface portion 8c is the mold surface portion of the striped portion 1blF.
＊ ａ、 Ｓ図において、＊工前工程人においては、可
動型８の型面９ｓ ｅｃ 、これの型面部８ｂまたは８
ｃと対応する配線網状切抜部９ａを有するマスキング材
９を夫々要部を一致させて密着状に被覆する。塗工々程
Ｂにおいては、前記切抜部９龜より露出する型面部８ｂ
または型面部８１１１Ｃ導電性塗料１例えば、導電性粗
粉末８ｂとして銅粗粉末、バインダ８ｏとしてアクリル
樹脂、溶剤として酢酸エチ〜の各所要量を使用し複合化
した導電性塗料８１を平均膜厚５０〜２００ミクロンに
て剥離可能に塗工し、その塗工被膜６中の溶剤を揮発さ
せて固化せしめる。前記導電性塗料３畠のバインダ樹脂
としては、前記アクリル系のはかＣ，ウレタン、塩化ビ
ニル系などがあげられる。また、この塗料９ｓ Ｃは、
導電性付与剤として鋼を用いたが、これに代えてＡＩ等
の金属粉、または、カーポンプフック、グラフ１イト等
の粗粉末を用いてもよい。これらの粗粉末ｓｂ＃ｔ、ア
ンカー効果をもたせるために、その粗粉末８ｂの平均粒
子径を１０〜１００ミクロン、望ましくは、２０〜５０
ミクロンとし、そして、その粒子の形状をプントフィト
（樹枝）形状とするのが遡当である。マスキング材取外
工程Ｃにおいては、該マスキング材９を除去して、その
型面部８ｂまたは８Ｃ上に内部の粗粉末８ｂに起因する
後述の投錨可能な凹凸表面８′を設けた切抜部９ａと同
等の塗工配線網（内部の粗粉末は均等に散在）８を形成
する。成形工程りでは、該固定型７側に可動型８を移動
して型締め（型締圧１５０ｔ）Ｌ、この成形型６の型内
ｇａｃ充填孔６ｂよりデフスチフク成形体成形用熱可塑
性溶融プラスチック素材２例えばＡＢＳ樹脂（セビアン
Ｖ：ダイセμ化学工業■）を充填して後該充填素材に高
圧をかけて配線網状条部１を有するプラスチック成形体
２を成形し、かつ素材熱及び素材圧で配線網８を可塑化
してその肉厚をこれの４０〜８０チまで圧ａ（この実施
例では平均肉厚６０ミクロンに圧縮）して、その成形体
２０条部１表面に配線１１！１８を投錨前転位せしめる
。前記素材にはＡＢＳ樹脂を用いたが、その他、ポリプ
ロピレン等のオレフィン系、ポリスチレン、ＰＢＴ樹脂
等があげられる。配線網ａＣは１例えば金寞ビン等によ
る端子が同時に設置できる。脱型工程Ｅでは、配線網８
を有する成形体２．即ち、配線網付プラスチック成形体
５を型開して取り出す、この発明製法は９以上の各工程
Ａ乃至Ｅからなり、この各工程を順次経て成形体５が得
られる。前記投錨前転位については、該配線網８の凹凸
表面８′に成形体２素材が投錨し、なおかつ素材とバイ
ンダ８６とが両者の当接面において融着するものである
。この実施例では配線網８は、成形体２の凹表面に投錨
前せしめたがこれに限定するものでない。配線網８の厚
さはその都度決定する。なお、後処理として、配線網８
１Ｃは、メッキ処理を行うことができる。*In the figures a and S, *In the pre-processing process, the mold surface 9sec of the movable mold 8, the mold surface part 8b or 8 of this
A masking material 9 having a wiring mesh cutout 9a corresponding to c is closely covered with the main parts aligned. In the coating step B, the mold surface portion 8b exposed from the cutout portion 9
Or mold surface part 8111C conductive paint 1 For example, conductive paint 81 is composited using required amounts of copper coarse powder as conductive coarse powder 8b, acrylic resin as binder 8o, and ethyl acetate as a solvent, with an average film thickness of 50. A peelable coating is applied at a thickness of ~200 microns, and the solvent in the coated film 6 is evaporated to solidify. Examples of the binder resin for the conductive paint 3 include the acrylic base C, urethane, and vinyl chloride. Also, this paint 9s C is
Although steel is used as the conductivity imparting agent, metal powder such as AI or coarse powder such as car pump hook or graphite may be used instead. In order to provide these coarse powders sb#t with an anchor effect, the average particle diameter of the coarse powders 8b is 10 to 100 microns, preferably 20 to 50 microns.
Retrospection is to make the particles micron and to make the shape of the particles puntophyte (dendritic). In the masking material removal step C, the masking material 9 is removed, and a cutout portion 9a is formed on the mold surface portion 8b or 8C with an uneven surface 8' that allows anchoring, which will be described later, due to the coarse powder 8b inside. An equivalent coating wiring network (coarse powder inside is evenly scattered) 8 is formed. In the molding process, the movable mold 8 is moved to the fixed mold 7 side and the mold is clamped (mold clamping pressure 150t) L, and the thermoplastic molten plastic material for forming the defust molded body is poured from the in-mold GAC filling hole 6b of the mold 6. 2 For example, after filling ABS resin (Sevian V: Daise μ Chemical Industry ■), high pressure is applied to the filled material to form a plastic molded body 2 having wiring network strips 1, and wires are formed using material heat and material pressure. The net 8 is plasticized and compressed to a thickness of 40 to 80 inches (in this embodiment, the average thickness is 60 microns), and the wiring 11! 18 is anchored on the surface of the 20 strips 1 of the molded body. Forward dislocation. Although ABS resin was used as the material, other materials include olefin resins such as polypropylene, polystyrene, PBT resin, and the like. In the wiring network aC, terminals such as metal pins can be installed at the same time. In the demolding process E, the wiring network 8
Molded body having 2. That is, the manufacturing method of this invention, in which the plastic molded body 5 with wiring network is opened and taken out, consists of nine or more steps A to E, and the molded body 5 is obtained through each of these steps in sequence. Regarding the dislocation before anchoring, the material of the molded body 2 is anchored on the uneven surface 8' of the wiring network 8, and the material and the binder 86 are fused at the abutting surfaces of the two. In this embodiment, the wiring network 8 is anchored on the concave surface of the molded body 2, but the present invention is not limited thereto. The thickness of the wiring network 8 is determined each time. In addition, as a post-processing, the wiring network 8
1C can be plated.
図中１０は、スプレーガンである。10 in the figure is a spray gun.
前記塗工々程１１１ｃおいては、型面部Ｂｂ、または８
６Ｃ＠工配線網８が正確に被着できるが、これにより、
ｍ品の情度１品質は一段と向上するものである。マスキ
ング材取外工程ＣＣおいては、該マスキング材９の除去
時に塗工配線網８を破損したりしない。また、成形工程
ＤＣおいては、！！Ｉ工配線網８は充填樹脂流によって
変形、破損することがない。In the coating step 111c, the mold surface portion Bb or 8
6C@works wiring network 8 can be applied accurately, but as a result,
The quality of ``m'' products will further improve. In the masking material removal process CC, the coated wiring network 8 is not damaged when the masking material 9 is removed. Also, in the molding process DC,! ! The I-works wiring network 8 is not deformed or damaged by the flow of the filling resin.
発 明 の 効 果
この発明は、該成形体２の自由表面に条部１を介して配
線網８が投錨前できるので、電子、電気機器の簡略化、
小型化が雰易である。この発明は。Effects of the Invention In this invention, since the wiring network 8 can be formed on the free surface of the molded body 2 via the strip 1 before anchoring, it is possible to simplify electronic and electrical equipment.
Downsizing is the key. This invention.
投錨前転位した配線網８の表面は、！！Ｉ！面部８ｂま
たは８Ｃと同等でなめらか、美麗な表面をなして意匠性
を高める。この発明製法は、従来の工法より工数が少く
てよく、そして、マスキング材取外工程Ｃ１成形工程り
などでは塗工配線網８が破損したすせず、前記簡略化と
相俟って良質のものが低コストでつくれる利点がある。The surface of the wiring network 8 dislocated before anchoring is! ! I! It has a smooth and beautiful surface equivalent to that of the surface portion 8b or 8C and enhances the design. The manufacturing method of this invention requires fewer man-hours than the conventional manufacturing method, and the coating wiring network 8 is damaged in the masking material removal step C1 molding step, etc., and together with the simplification described above, it is possible to achieve high quality. It has the advantage of being able to produce things at low cost.
この発明は、該成形体２０条部１に配線網８が物理的に
投錨前するので、成形体２の素材とバインダ８６とは必
ずしも相溶性でなくてもよく０例えばバインダとしてア
クリル樹脂、素材としてポリプロピレン樹脂を使用する
ことができる。この発明は、塗工々程Ｂｃおけるめ工直
後に被膜軸′中の溶剤が揮発するので。In this invention, since the wiring network 8 is physically anchored to the 20-strip portion 1 of the molded body, the material of the molded body 2 and the binder 86 do not necessarily have to be compatible. Polypropylene resin can be used as the material. In this invention, the solvent in the coating shaft evaporates immediately after the coating process Bc.
従来のような溶剤対惰が不要となるばかりか、１１品の
品質を向上せしめる。この発明は、工８ＩＣ等において
、配線網８の修整が行える利点がある。Not only does it eliminate the need for solvents and inertia as in the past, but it also improves the quality of 11 products. This invention has the advantage that the wiring network 8 can be modified in the 8-IC and the like.
以上、この発明によれば、従来のこの［１１法の欠点で
ある小型化、低価格化、破損、Ｗ！着不充分。As described above, according to the present invention, the drawbacks of the conventional method [11] such as miniaturization, low cost, and damage, can be avoided. Insufficiently worn.
矢線及び溶剤対端等の関門点が解消できて、その効果は
大きい。The barrier points such as the arrow line and the opposite end of the solvent can be eliminated, and the effect is great.
第１．６図は要部を誇張したこの発明成形体の断面図、
第２．７図はこの発明で使用する成形金型の断面図、第
８．８図は夫々製造過程の略示的説明図。
第４図はこの発明成形体要部の平面図、第６図は第４図
円線部分の拡大断面図である。
１・・・条部 ２・・・プラスチック成形体 ８・・・
塗工配線網 ６・・・配線網付プラスチック成形体ＪＩ
Ｇ 図 第 図第 ７ 図
第 ２ 図
第 ４ 図
第８図
第３図Figure 1.6 is a cross-sectional view of the molded article of the invention with the main parts exaggerated;
Fig. 2.7 is a sectional view of a mold used in the present invention, and Fig. 8.8 is a schematic illustration of the manufacturing process. FIG. 4 is a plan view of the main part of the molded article of the invention, and FIG. 6 is an enlarged sectional view of the circle line portion in FIG. 1...Stripe portion 2...Plastic molded body 8...
Coated wiring network 6...Plastic molded body JI with wiring network
Figure G Figure Figure 7 Figure 2 Figure 4 Figure 8 Figure 3
Claims (1)
成形体、該成形体条部の表面には熱可塑性樹脂をバイン
ダとしこれに導電性粗粉末、溶剤を混入複合化した導電
性塗料による塗工配線網が投錨着していることを特徴と
する配線網付プラスチック成形体。 ２、固定型及び可動型からなる成形型の型面に配線網状
条部を成形するための型面部を設けて配線網状条部を有
するプラスチック成形体成形用の成形金型を構成し、該
金型の型面に前記型面部と対応する配線網状切抜部を有
するマスキング材を密着状に被覆し、その切抜部より露
出する前記型面部に熱可塑性樹脂をバインダとしこれに
導電性粗粉末、溶剤を混入複合化した導電性塗料を剥離
可能に塗工して固化せしめ、次いでマスキン材を除去し
て該型面部に前記切抜部と同等の塗工配線網を塗着し、
この成形金型内に前記成形体成形用の熱可塑性溶融プラ
スチック素材を充填して後該充填素材に高圧をかけて配
線網状条部を有するプラスチック成形体を成形し、かつ
充填素材熱及び成形圧により配線網を可塑化、圧縮して
、該条部の表面に前記配線網を投錨着せしめることを特
徴とする配線網付プラスチック成形体の製造方法。[Claims] 1. A thermoplastic plastic molded body having wiring network stripes on its surface, a thermoplastic resin being used as a binder on the surface of the molded body stripes, and conductive coarse powder and a solvent mixed therein to form a composite. A plastic molded body with a wiring network, characterized in that a wiring network coated with conductive paint is anchored. 2. A molding die for molding a plastic molded article having a wiring net-like strip is constructed by providing a mold surface for molding a wiring net-like strip on the mold surface of a mold consisting of a fixed mold and a movable mold; The mold surface of the mold is closely coated with a masking material having a wiring network cutout corresponding to the mold surface, and the mold surface exposed from the cutout is coated with a thermoplastic resin as a binder, conductive coarse powder, and a solvent. A conductive paint mixed with a composite conductive paint is releasably applied and solidified, and then the masking material is removed and a coated wiring network equivalent to the cutout is applied to the mold surface,
This mold is filled with the thermoplastic molten plastic material for molding the molded object, and then a high pressure is applied to the filled material to form a plastic molded object having wiring network stripes, and the filling material is heated and molded under pressure. 1. A method for producing a plastic molded article with a wiring network, comprising plasticizing and compressing the wiring network and anchoring the wiring network to the surface of the strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP148587A JPS63169790A (en) | 1987-01-07 | 1987-01-07 | Plastic molded unit with wiring network and manufacture of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP148587A JPS63169790A (en) | 1987-01-07 | 1987-01-07 | Plastic molded unit with wiring network and manufacture of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63169790A true JPS63169790A (en) | 1988-07-13 |
Family
ID=11502742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP148587A Pending JPS63169790A (en) | 1987-01-07 | 1987-01-07 | Plastic molded unit with wiring network and manufacture of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169790A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6817440B1 (en) | 2000-02-26 | 2004-11-16 | Mm Gear Co., Ltd. | Multi-channel headphones |
| JP2006253615A (en) * | 2005-03-14 | 2006-09-21 | Ricoh Co Ltd | Pattern shape body, wiring manufacturing method, and wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582489A (en) * | 1978-12-15 | 1980-06-21 | Matsushita Electric Works Ltd | Method of fabricating conductive foil sheet |
| JPS61208892A (en) * | 1985-03-13 | 1986-09-17 | 東海興業株式会社 | Manufacture of plastic molding with wire network |
| JPS61288489A (en) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | Manufacturing method of molded circuit board |
-
1987
- 1987-01-07 JP JP148587A patent/JPS63169790A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582489A (en) * | 1978-12-15 | 1980-06-21 | Matsushita Electric Works Ltd | Method of fabricating conductive foil sheet |
| JPS61208892A (en) * | 1985-03-13 | 1986-09-17 | 東海興業株式会社 | Manufacture of plastic molding with wire network |
| JPS61288489A (en) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | Manufacturing method of molded circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6817440B1 (en) | 2000-02-26 | 2004-11-16 | Mm Gear Co., Ltd. | Multi-channel headphones |
| JP2006253615A (en) * | 2005-03-14 | 2006-09-21 | Ricoh Co Ltd | Pattern shape body, wiring manufacturing method, and wiring board |
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