JP5406241B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a wiring board for mounting electronic components.

  As electronic devices become smaller, thinner, and more functional, electronic components built into electronic devices are also becoming smaller, and the wiring of printed circuit boards (printed wiring boards) on which electronic components are mounted has become finer. .

  As a method for forming a fine wiring pattern, a pattern is transferred to a resin layer using a mold (stamper) having a pattern for forming the wiring pattern, and the transferred pattern is filled with a conductive material. An imprint method for forming a pattern is known (see, for example, Patent Document 1).

  In the imprint method, when the mold is released from the resin layer, the resin constituting the resin layer adheres to the mold, which may cause problems. In order to prevent this mold release failure, an imprint method using a mold (mold) in which a mold release layer that can be easily released from a resin layer is used is known (for example, see Patent Document 2).

JP 2001-320150 A JP 2007-243181 A

  However, the technique using a mold having a release layer has a problem that it is difficult to release the resin when it is thermally imprinted at a high temperature.

  The objective of this invention is providing the manufacturing method of the wiring board which can improve a mold release property when releasing a metal mold | die from a resin layer, and can form a fine pattern.

  According to one aspect of the present invention, a step of preparing a mold having a convex portion on one side, a step of forming a conductive thin film on one side of the mold so as to be peelable from the mold, and a step of forming the convex portion on the conductive thin film A step of press-fitting into the resin layer, a step of curing the resin layer to form a recess in which the shape of the protrusion is transferred to the resin layer, a step of closely attaching the resin layer and the conductive thin film, and a mold There is provided a method for manufacturing a wiring board including a step of peeling from a conductive thin film and a step of filling a concave portion with a conductive material via a conductive thin film.

  In one embodiment of the present invention, in the step of forming a conductive thin film, the conductive thin film may be formed by applying any one of conductive nano ink, a conductive paste, and a conductive polymer.

  In one embodiment of the present invention, the step of filling the conductive material may be filled with the conductive material by electrolytic plating using the conductive thin film as a seed layer.

  In one aspect of the present invention, the mold includes a support portion, a first convex portion disposed on the support portion, and a second convex portion disposed on the first convex portion. Forming the first and second concave portions in which the shapes of the first and second convex portions are respectively transferred to the resin layer, and filling the conductive material with the first and second concave portions. Each of the first wiring layer and the first wiring layer may be formed by being filled with a conductive material.

  In one embodiment of the present invention, the method may further include a step of forming a second wiring layer electrically connected to the via on the lower surface of the resin layer.

  In one embodiment of the present invention, the step of forming the conductive thin film has a curvature in at least one of a connection portion between the first protrusion and the second protrusion and a connection portion between the first protrusion and the support. Then, a conductive thin film may be formed.

  According to another aspect of the present invention, a step of preparing a mold having a convex portion on one surface, a step of forming a conductive thin film on one surface of the mold so as to be peelable from the mold, and a first resin A step of preparing a substrate having a layer and a wiring layer embedded in one surface of the first resin layer, a step of laminating a second resin layer on one surface of the first resin layer, and conducting the protrusion The conductive resin thin film is press-fitted into the second resin layer together with the conductive thin film, the conductive thin film located at the tip of the convex portion is brought into contact with the wiring layer, and the second resin layer is cured to thereby protrude the second resin layer. Forming a concave portion to which the shape of the portion is transferred, contacting the second resin layer and the conductive thin film, peeling the mold from the conductive thin film, and conducting the conductive material in the concave portion via the conductive thin film. And a method of manufacturing a wiring board including a step of filling a material.

  ADVANTAGE OF THE INVENTION According to this invention, while releasing a metal mold | die from a resin layer, while being able to improve a mold release property, the manufacturing method of the wiring board which can form a fine pattern can be provided.

It is sectional drawing which shows an example of the wiring board which concerns on the 1st Embodiment of this invention. It is process sectional drawing for demonstrating an example of the manufacturing method of the wiring board which concerns on the 1st Embodiment of this invention. It is a one part perspective view of the metal mold | die which concerns on the 1st Embodiment of this invention. FIG. 6 is a process cross-sectional view subsequent to FIG. 2 for describing an example of the method for manufacturing the wiring board according to the first embodiment of the present invention. FIG. 5 is a process cross-sectional view subsequent to FIG. 4 for describing an example of the method for manufacturing the wiring board according to the first embodiment of the present invention. FIG. 6 is a process cross-sectional view subsequent to FIG. 5 for describing an example of the method for manufacturing the wiring board according to the first embodiment of the present invention. FIG. 7 is a process cross-sectional view subsequent to FIG. 6 for describing an example of the method for manufacturing the wiring board according to the first embodiment of the present invention. FIG. 8 is a process cross-sectional view subsequent to FIG. 7 for describing an example of the method for manufacturing the wiring board according to the first embodiment of the present invention. FIG. 9 is a process cross-sectional view subsequent to FIG. 8 for illustrating the example of the method for manufacturing the wiring board according to the first embodiment of the present invention. It is sectional drawing which shows an example of the wiring board which concerns on the 2nd Embodiment of this invention. It is process sectional drawing for demonstrating an example of the manufacturing method of the wiring board which concerns on the 2nd Embodiment of this invention. FIG. 12 is a process cross-sectional view subsequent to FIG. 11 for describing an example of the method for manufacturing the wiring board according to the second embodiment of the present invention. FIG. 13 is a process cross-sectional view subsequent to FIG. 12 for illustrating the example of the method for manufacturing the wiring board according to the second embodiment of the present invention. FIG. 14 is a process cross-sectional view subsequent to FIG. 13 for describing an example of the method of manufacturing the wiring board according to the second embodiment of the present invention.

  Next, first and second embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  The first and second embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention. The technical idea of the present invention The material, shape, structure, arrangement, etc. are not specified below. The technical idea of the present invention can be variously modified within the scope of the claims.

(First embodiment)
As shown in FIG. 1, the wiring board according to the first embodiment of the present invention includes a resin layer 10, first wiring layers 11 to 17 embedded in the upper surface of the resin layer 10, and a resin layer 10. Second wiring layers 21 and 22 disposed on the lower surface, vias 18 and 19 that conduct the first wiring layers 12 and 16 and the second wiring layers 21 and 22, respectively, and the first wiring layers 11 to 11 17 and the vias 18 and 19 and the conductive thin film 3 disposed between the resin layer 10.

  There are no interfaces between the first wiring layer 12 and the via 18 and between the first wiring layer 16 and the via 19, respectively. The first wiring layer 12 and the via 18 and the first wiring layer 16 and the via 19 are Each is integrally formed.

  The thickness of the resin layer 10 is about 30 μm. As a material of the resin layer 10, for example, a thermoplastic resin such as a liquid crystal polymer can be used.

  Among the first wiring layers 11 to 17, the line width of the line and space portion is about 5 μm, the interval is about 5 μm, and the land diameter is about 30 μm. Of the second wiring layers 21 and 22, the line width of the line and space portion is about 10 μm, the interval is about 10 μm, and the land diameter is about 80 μm. The diameters of the vias 18 and 19 are about 10 μm and the height is about 25 μm. The thickness of the conductive thin film 3 is preferably about 10 nm to 10 μm.

  As materials for the first wiring layers 11 to 17, the vias 18 and 19, the second wiring layers 21 and 22, and the conductive thin film 3, copper (Cu), silver (Ag), or the like can be used. The first wiring layers 11 to 17, the vias 18 and 19, and the second wiring layers 21 and 22 may be made of the same material or different materials.

  According to the wiring board according to the first embodiment of the present invention, since the first wiring layers 11 to 17 are embedded in the upper surface of the resin layer 10, it is possible to obtain high flatness when multilayered. it can.

  Next, an example of a method for manufacturing a wiring board according to the first embodiment of the present invention will be described with reference to FIGS.

  (A) A mold 6 is prepared as shown in FIG. The mold 6 includes a support part 30 and a two-stage convex part (convex pattern) arranged on the support part 30. The two-stage convex pattern includes first convex portions 31 to 37 for forming a wiring layer, and second convex portions (projections) 38 for forming vias disposed on the first convex portions 32 and 36. 39. The mold 6 can be manufactured by various methods. When a fine size is particularly required, a resist is applied on a silicon (Si) substrate on which a seed layer is formed, and the resist is applied to an electron beam (EB). ), Ultraviolet rays (UV) or laser to draw and develop and pattern. The metal mold 6 can be produced by repeating this series of steps, filling the uneven portion of the patterned resist with a conductive material by plating using nickel (Ni), copper (Cu), or the like, and then removing the resist. . In the first embodiment of the present invention, the resist is patterned by i-line exposure, and the vias 18 and 19 shown in FIG. 1 have a diameter of 10 μm, a height of 25 μm, and the line-and-lines of the first wiring layers 11 to 17. -The line width of the space portion was 5 μm, the interval was 5 μm, and the land diameter was 30 μm. The surface of the mold 6 can be subjected to mold release treatment with a commercially available fluorine silane coupling agent so that the mold can be easily released as necessary. The material of the mold 6 is not particularly limited, but is preferably a material that is easy to release, and for example, silicon (Si), ceramics, metal, polymer, or the like can be used. FIG. 3 shows a perspective view of a part of the support part 30 of the mold 6, the first convex part 36 and the second convex part 39 as seen from the upper surface side. 3 corresponds to a part of the cross-sectional view of FIG.

  (B) As shown in FIG. 2, the surface of the mold 6 on which the first convex portions 31 to 37 and the second convex portions 38 and 39 are provided faces upward. Then, the conductive material 3 is formed on the surface of the mold 6 on which the first convex portions 31 to 37 and the second convex portions 38 and 39 are provided by screen printing using the squeegee 4, spin coating method, spray coating method, or the like. Apply. Examples of the conductive material 3 include a conductive nano ink using nanoparticles such as copper (Cu) or silver (Ag) as a metal filler, a conductive paste such as a copper (Cu) paste or a silver (Ag) paste, or a conductive polymer. Etc. can be used.

  (C) Thereafter, as shown in FIG. 4, the conductive material 3 is dried or heated (fired), whereby the conductive thin film 3 is formed on the surface of the mold 6 so as to be peelable from the mold 6. The thickness of the conductive thin film 3 is preferably about 10 nm to 10 μm. When the conductive material 3 is a conductive nano ink, the dispersant is decomposed by heating and the metal fillers are fused together, and the solvent is evaporated to obtain a substantially pure metal. Further, when the conductive material 3 contains an organic solvent such as alcohol, the dispersant is decomposed and the metal fillers are fused without heating. In addition, by controlling the content of the metal filler in the ink, the volume of the conductive material 3 can be shrunk by 50% or more during sintering.

  (D) As shown in FIG. 5, a resin layer 10 such as a thermoplastic resin is prepared, and the mold 6 having the conductive thin film 3 and the resin layer 10 are opposed to each other. In the first embodiment of the present invention, a liquid crystal polymer film is used as the resin layer 10. As shown in FIG. 6, the mold 6 having the conductive thin film 3 is pressed into the resin layer 10 while being heated by a press or the like. When the softened resin layer 10 completely follows the pattern of the mold 6, the mold 6 and the resin layer 10 are cooled, and the resin layer 10 is cured. When a liquid crystal polymer film is used as the resin layer 10, the pressing condition is, for example, 270 ° C. and 10 MPa for 10 minutes. Separately, it takes 30 minutes to heat up to 270 ° C. and 60 minutes to cool to room temperature after heating. The resin layer 10 includes first concave portions 41 to 47 to which the first convex portions 31 to 37 of the mold 6 are transferred, and second concave portions (holes) 48 to which the second convex portions 38 and 39 are transferred. , 49. The second recesses 48 and 49 are continuous with the first recesses 42 and 46 and have a depth deeper than that of the first recesses 41 to 47. Moreover, the resin layer 10 functions as an adhesive, and the resin layer 10 and the conductive thin film 3 can be adhered to each other. Thereafter, if necessary, a part of the resin layer 10 is removed in the thickness direction by polishing or etching, and the conductivity located from the surface of the resin layer 10 to the tips of the second convex portions 38 and 39. A part of the thin film 3 may be exposed.

  (E) As shown in FIG. 7, the mold 6 is released from the resin layer 10. At this time, since the conductive thin film 3 has higher adhesion to the resin layer 10 than the mold 6, the conductive thin film 3 is peeled off from the mold 6 and transferred to the resin layer 10 side.

  (F) As shown in FIG. 8, electrolytic plating is performed using the conductive thin film 3 as a seed layer, and copper (Cu) or silver (Ag) or the like is formed on the first recesses 41 to 47 and the second recesses 48 and 49. The first wiring layers 11 to 17 and the vias 18 and 19 are formed by filling the conductive materials, respectively. In addition, without using the conductive thin film 3 as a seed layer, the first recesses 41 to 47 and the second recesses 48 and 49 are filled via the conductive thin film 3 by printing or the like with a conductive material such as a conductive paste. And may be sintered.

  (G) Excess portions of the conductive material other than the portions filled in the first concave portions 41 to 47 and the second concave portions 48 and 49 by polishing or etching, and the first concave portions 41 to 47 and the second concave portions. Excess portions of the conductive thin film 3 other than the portions positioned on 48 and 49 are removed as shown in FIG.

  (H) As shown in FIG. 1, the second wiring layers 21 and 22 are formed on the lower surface of the resin layer 10 so as to be in contact with the vias 18 and 19, respectively. For example, in the semi-additive method, after forming a seed layer on the lower surface of the resin layer 10, a resist is applied, the resist is patterned using a photolithography technique, electrolytic copper plating is performed, and then the resist and the seed layer are removed. Thus, the second wiring layers 21 and 22 are formed. Alternatively, the second wiring layers 21 and 22 may be formed by printing and sintering a conductive paste on the lower surface of the resin layer 10 using a printing plate. In the first embodiment of the present invention, the line width of the line and space portion is 10 μm, the wiring interval is 10 μm, and the land diameter is 80 μm by the semi-additive method. Thereafter, a solder resist or a coverlay may be provided on the surface layer of the wiring board.

  According to the method for manufacturing a wiring board according to the first embodiment of the present invention, the first wiring layers 11 to 17 and the vias 18 and 19 are collectively formed using the two-stage mold 6. Can do. As a result, it is not necessary to align the first wiring layers 11 to 17 and the vias 18 and 19 as compared with the case of laser via formation.

  Further, since the conductive thin film 3 is formed by applying a conductive material as shown in FIG. 2, the conductive thin film 3 can be formed thicker than when the conductive thin film 3 is formed by sputtering, for example.

  Further, when the mold 6 is released from the resin layer 10, the conductive thin film 3 is peeled off from the mold 6, so that even if the resin layer 10 is formed by heating, it is formed on the mold 6. By peeling off the conductive thin film 3, it is possible to prevent the conventional resin adhesion (mold release failure).

  Further, the conductive thin film 3 can be used as a seed layer for plating performed to fill the first concave portions 41 to 47 and the second concave portions 48 and 49 with a conductive material, and a seed layer is separately formed. A process becomes unnecessary. Furthermore, in order to adhere the conductive thin film 3 and the resin layer 10 by curing the softened thermoplastic resin 10, compared to the case where a seed layer is separately formed on the surface of the resin layer 10 by electroless plating or the like, The adhesion between the conductive thin film 3 as the seed layer and the resin layer 10 can be improved.

(Second Embodiment)
As shown in FIG. 10, the wiring board according to the second embodiment of the present invention is a multilayer substrate including a first base material 1 and a second base material 2.

  The first substrate 1 is disposed on the first resin layer 10, the first wiring layers 11 to 17 embedded in the upper surface of the first resin layer 10, and the lower surface of the first resin layer 10. The first wiring layers 21 and 22, the first wiring layers 12 and 16 and the first wiring layers 21 and 22, respectively, the first vias 18 and 19, and the first wiring layers 11 to 17 and The first conductive thin film 3 is provided between each of the first vias 18 and 19 and the first resin layer 10.

  The second substrate 2 includes a second resin layer 20 disposed on the first resin layer 10, third wiring layers 51 to 57 embedded in the upper surface of the second resin layer 20, The third wiring layers 52 and 56 and the first wiring layers 12 and 16, respectively, the second vias 58 and 59, and the third wiring layers 51 to 57 and the second vias 58 and 59, respectively. And the second conductive thin film 5 disposed between the two resin layers 20.

  Since the structure of the 1st base material 1 and the 2nd base material 2 is substantially the same as the wiring board shown in FIG. 1, the overlapping description is abbreviate | omitted. The components of the first base material 1 and the second base material 2 may use the same material or different materials.

  According to the wiring board according to the second embodiment of the present invention, the first wiring layers 11 to 17 and the third wiring layers 51 to 57 are formed of the first resin layer 10 and the second resin layer 20. Since they are embedded in the upper surface, high flatness can be obtained.

  Next, an example of a method for manufacturing a wiring board according to the second embodiment of the present invention will be described with reference to FIGS.

  (A) First substrate 1 is prepared in advance as shown in FIG. The 1st base material 1 is producible with the manufacturing process similar to the wiring board shown, for example in FIGS.

  (B) On the other hand, as shown in FIG. 11, on the support part 60, the first convex parts 61 to 67 for forming the wiring layer disposed on the support part 60, and the first convex parts 62 and 66, respectively. A mold 7 having second vias (projections) 68 and 69 for forming vias is prepared. When the third wiring layers 51 to 57 and the second vias 58 and 59 shown in FIG. 10 have the same shape as the first wiring layers 11 to 17 and the first vias 18 and 19, the mold 7 is used. You may use the same thing as the metal mold | die 6 shown in FIG. As shown in FIG. 11, the conductive material 5 is applied to the surface of the mold 7 on which the first convex portions 61 to 67 and the second convex portions 68 and 69 are provided, and the conductive material 5 is dried or heated ( By baking, the second conductive thin film 5 is formed so as to be peelable from the mold 7.

  (C) As shown in FIG. 11, the second resin layer 20 is laminated (laminated) on the surface of the first substrate 1 on which the first wiring layers 11 to 17 are provided. In the second embodiment of the present invention, the second resin layer 20 is vacuum laminated at 250 ° C., 1 MPa, and 1 minute. The mold 7 is opposed to the second resin layer 20, and the first wiring layers 12 and 16 of the first substrate 1 and the second protrusions 68 and 69 of the mold 7 are formed by image recognition or pin alignment. Align.

  (D) As shown in FIG. 12, the mold 7 is press-fitted into the second resin layer 20 while being heated by a press or the like, and the tips of the first wiring layers 12 and 16 and the second convex portions 68 and 69 are pressed. The second conductive thin film 5 located in the part is brought into contact. As a result, the second resin layer 20 is cured, and the first concave portions 71 to 77 and the second concave portions 78 and 79 are formed in the second resin layer 20, and the first base material 1 and the second base material 2 are formed. The base material 2 is integrated. Moreover, the 2nd resin layer 20 functions as an adhesive agent, and the 2nd resin layer 20 and the 2nd electroconductive thin film 5 can be stuck. As shown in FIG. 12, when the mold 7 is press-fitted into the second resin layer 20, sufficient connection reliability between the second conductive thin film 5 and the first wiring layers 12 and 16 is obtained. If not, the second resin layer 20 located at the tip of the second protrusions 68 and 69 by polishing or the like before press-fitting the mold 7 into the second resin layer 20 as shown in FIG. May be removed in advance to expose the second conductive thin film 5.

  (E) As shown in FIG. 13, the mold 7 is released from the second resin layer 20. At this time, since the second conductive thin film 5 has higher adhesion to the second resin layer 20 than the mold 7, the second conductive thin film 5 is peeled off from the mold 7 and transferred to the second resin layer 20 side.

  (F) As shown in FIG. 14, electrolytic plating is performed using the second conductive thin film 5 as a seed layer, and copper (Cu) or silver (Ag) is applied to the first concave portions 71 to 77 and the second concave portions 78 and 79. The third wiring layers 51 to 57 and the second vias 58 and 59 are formed.

  (G) Excess portions of the conductive material other than the conductive material filled in the first concave portions 71 to 77 and the second concave portions 78 and 79 by polishing or etching, and the first concave portions 71 to 77 and the second concave portions. Excess portions of the second conductive thin film 5 other than the portions located on the portions 78 and 79 are removed as shown in FIG. 10 to complete the multilayer substrate.

  According to the method for manufacturing a wiring board according to the second embodiment of the present invention, the third wiring layers 51 to 57 and the second vias 58 and 59 are collectively formed using the two-stage mold 7. Can be formed. As a result, it is not necessary to align the third wiring layers 51 to 57 and the second vias 58 and 59 as compared with the case of laser via formation.

  Furthermore, as shown in FIG. 11, since the second conductive thin film 5 is formed by applying a conductive material, the second conductive thin film 5 is formed as compared with the case where the second conductive thin film 5 is formed by sputtering, for example. The thin film 5 can be formed thick.

  Further, when the mold 7 is released from the second resin layer 20, the second conductive thin film 5 is peeled off from the mold 7 so that the second resin layer 20 is formed by heating. Even so, by peeling off the conductive thin film 5 formed on the mold 7, it is possible to prevent conventional resin adhesion (mold release failure).

  Further, the second conductive thin film 5 can be used as a seed layer for plating performed to fill the first recesses 71 to 77 and the second recesses 78 and 79 with a conductive material. The process of forming is eliminated. Furthermore, in order to make the 2nd conductive thin film 5 and the 2nd resin layer 20 adhere | attach by hardening the 2nd resin layer 20, it seeds separately on the surface of the 2nd resin layer 20 by electroless plating etc. Compared with the case of forming, the adhesion between the second conductive thin film 5 as the seed layer and the second resin layer 20 can be improved.

(Other embodiments)
As described above, the present invention has been described according to the first and second embodiments. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, in the first and second embodiments of the present invention, the case where a thermoplastic resin is used as the material of the resin layer 10 has been described, but a semi-cured thermosetting resin such as an epoxy resin can also be used. . In this case, as shown in FIG. 6, the mold 6 having the conductive thin film 3 is pressed into the resin layer 10 made of a semi-cured thermosetting resin while being heated by a press or the like. As the resin layer 10, for example, an epoxy film is used, and the pressing condition is 100 ° C. and 0.3 MPa for 1 minute. Separately, it takes 10 minutes to heat up to 100 ° C. and 20 minutes to cool to room temperature after heating. Before releasing the mold 6, the resin layer 10 is completely cured by baking in an oven at 180 ° C. for 30 minutes and then cooling. Accordingly, the first concave portions 41 to 47 to which the first convex portions 31 to 37 of the mold 6 are transferred and the second concave portions to which the second convex portions 38 and 39 are transferred are formed on the resin layer 10. (Hole) 48 and 49 are formed. Moreover, the resin layer 10 functions as an adhesive, and the resin layer 10 and the conductive thin film 3 can be adhered to each other. Thereafter, the mold 6 is released from the resin layer 10 as shown in FIG.

  In the first embodiment of the present invention, as shown in FIG. 4, by applying a conductive material to the surface of the mold 6, a connecting portion between the first convex portions 31 to 37 and the support portion 30, In addition, at least one of the connecting portions (the root portions of the second convex portions 38 and 39) between the first convex portions 32 and 36 and the second convex portions 38 and 39 has a tapered curvature and is conductive. The thin film 3 may be formed. Thereby, when the mold 6 is released from the resin layer 10 as shown in FIG. 7, the connecting portions between the first convex portions 31 to 37 and the support portion 30, and the first convex portions 32 and 36 The concentration of force on the portion having the curvature of at least one of the connecting portions with the second convex portions 38 and 39 can be suppressed, and damage such as turning up of the conductive thin film 3 can be prevented. it can. Further, at least one of the corner portions of the first wiring layers 11 to 17 and the root portions of the vias 18 and 19 which are transfer patterns of the first convex portions 31 to 37 and the second convex portions 38 and 39 has a curvature. By having it, it is possible to realize a wiring board having excellent high-frequency characteristics. These can be similarly applied to the second embodiment of the present invention.

  In the first embodiment of the present invention, the tip portions of the vias 18 and 19 shown in FIG. 1 are curved surfaces, but the tip portions of the vias 18 and 19 may be flat. Moreover, although the case where the diameters of the vias 18 and 19 are reduced from the root part to the tip part is shown, the diameters of the vias 18 and 19 may be constant. These can be similarly applied to the second embodiment of the present invention.

  Moreover, although the multilayer substrate provided with the 1st base material 1 and the 2nd base material 2 as shown in FIG. 10 was demonstrated as a wiring board which concerns on the 2nd Embodiment of this invention, the 2nd base material Another base material laminated on 2 may be further provided.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

1, 2 ... Base material 3, 5 ... Conductive thin film (conductive material)
4 ... Squeegee 6, 7 ... Mold 10, 20 ... Resin layer 11-17, 21, 22, 51-57 ... Wiring layer 18, 19, 58, 59 ... Via 30, 60 ... Support part 31-37, 61- 67 ... 1st convex part 38, 39, 68, 69 ... 2nd convex part 41-47, 71-77 ... 1st recessed part 48, 49, 78, 79 ... 2nd recessed part

Claims (4)

Preparing a mold having a support part, a first convex part arranged on the support part, and a second convex part arranged on the first convex part on one side ;
Forming a conductive thin film on the one surface of the mold so as to be peelable from the mold by applying any one of conductive nano ink, conductive paste, and conductive polymer ;
The first and second convex portions are press-fitted together with the conductive thin film from one surface of the resin layer , and the conductive thin film located at the tip of the second convex portion reaches the other surface of the resin layer. Process,
By curing the resin layer, the resin layer and the conductive thin film are formed while forming the first and second recesses in which the shapes of the first and second protrusions are transferred to the resin layer, respectively. A step of adhering
Peeling the mold from the conductive thin film;
By conducting electroplating using the conductive thin film as a seed layer, the first and second recesses are filled with a conductive material via the conductive thin film, thereby conducting with the first wiring layer and the first wiring layer. A method of manufacturing a wiring board, comprising: forming each via . In the step of causing the conductive thin film positioned at the distal end portion of the second convex portion to reach the other surface of the resin layer, the conductive thin film positioned at the distal end portion of the second convex portion is the resin layer. Exposed from the other side,
The method for manufacturing a wiring board according to claim 1 , further comprising a step of forming a second wiring layer electrically connected to the via via the exposed conductive thin film on a lower surface of the resin layer. The step of forming the conductive thin film has a curvature in at least one of the connecting portion between the first protruding portion and the second protruding portion and the connecting portion between the first protruding portion and the supporting portion. a method for manufacturing a wiring board according to claim 1 or 2, characterized in that it comprises forming said conductive thin film. Preparing a mold having a support part, a first convex part arranged on the support part, and a second convex part arranged on the first convex part on one side ;
Forming a conductive thin film on the one surface of the mold so as to be peelable from the mold by applying any one of conductive nano ink, conductive paste, and conductive polymer ;
Preparing a base material having a first resin layer and a wiring layer embedded in one surface of the first resin layer;
Laminating a second resin layer on the one surface of the first resin layer;
The first and second convex portions are press-fitted together with the conductive thin film from one surface of the second resin layer , and the conductive thin film located at the tip of the second convex portion is inserted into the second resin layer. Reaching the other surface, contacting the conductive thin film located at the tip of the second convex portion with the wiring layer;
The second resin layer is cured to form first and second recesses in which the shapes of the first and second projections are transferred to the second resin layer, respectively, and the second A step of closely adhering the resin layer and the conductive thin film;
Peeling the mold from the conductive thin film;
By conducting electroplating using the conductive thin film as a seed layer, the first and second recesses are filled with a conductive material via the conductive thin film, thereby conducting with the first wiring layer and the first wiring layer. A method of manufacturing a wiring board, comprising: forming each via .

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