JP2006086153A - Flexible wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a flexible wiring board which is provided with a highly accurate projection. <P>SOLUTION: In the flexible wiring board 1a, a base film 11 is deformed together with a wiring film 15, and a projection 18 is formed in the wiring film 15. At the same time, a recess 17 is formed at the rear position of the projection 18 of the base film 11. A resin material 22 is arranged within the recess 17, of which space is made small. Thus, even if any load is applied to the projection 18 when an electric part 4 is connected to the flexible wiring board 1a, the flexible wiring board 1a is hard to be deformed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to the technical field of flexible wiring boards, and more particularly to a flexible wiring board having protrusions formed on a wiring film.

Conventionally, a method of electrically connecting a wiring board and an electrical component via a protrusion has been widely used to connect the wiring board and the electrical component.
As a conventional method for forming protrusions, a method in which solder balls are mounted on the surface of the wiring film with a ball mounter is known. However, since each solder ball is mounted one by one, the operation time becomes long.

  A method of forming metal bumps on the surface of the wiring film by an etching method is also known, but this method has a problem that etching unevenness is likely to occur and the height accuracy of the metal bumps is poor.

  In addition, it is also known to form gold bumps one by one on the wiring film by a wire bonding method, but this method is not only troublesome because it forms gold bumps one by one, The height accuracy is poor, and it is necessary to align the height of each bump (leveling), which increases the number of work steps for forming the protrusions.

  Press the wiring board against the mold with the recesses for processing, and press the wiring board toward the mold while heating, so that the wiring film bulges on the recesses for processing and forms protrusions on the wiring film. The method of doing is well-known (for example, refer patent document 1).

  However, in recent years, with the refinement of electric devices, a thin flexible wiring board (for example, the total film thickness of the base film and the wiring is 12.5 μm or more and 75 μm or less) is required. When the bulge is bulged by pressing, the entire flexible wiring board is deformed and a large recess is formed on the base film side.

  If other electrical components such as semiconductor elements are mounted in the state where the recess is formed in the base film, the load on the protrusion will escape by the space of the recess, causing connection failure or causing the flexible wiring board to be greatly deformed. Become.

Also, when forming the protrusions, if heating is performed at a temperature higher than the glass transition temperature of the resin constituting the base film, the amount of deformation of the base film becomes excessively large, resulting in misalignment of the wiring film and the film thickness distribution of the base film. Causes non-uniformity.
Japanese Unexamined Patent Publication No. 2000-4940447

  The present invention was created to solve the above-described disadvantages of the prior art, and an object thereof is to form metal bumps of a flexible wiring board with high accuracy.

In order to solve the above-mentioned problems, the invention according to claim 1 is a method for manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board, and is patterned on a base film. A wiring film is disposed, a processing protrusion is brought into contact with a predetermined position of the base film at a portion where the wiring film and the base film are disposed, and the base film is pressed by the processing protrusion, and the wiring film Bulges to form the projections, and a method of manufacturing a flexible wiring board in which a resin material is disposed in a recess of the base film formed on the back side of the projections.
The invention according to claim 2 is a method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on the wiring film of the wiring board, wherein the base film disposed on the conductive film is processed into a predetermined position. A plurality of projections are formed by pressing the base film with the processing projections, bulging the conductive film, and resin is formed in the recesses of the base film formed on the back side of the projections. After the material is disposed, a resist layer having a predetermined shape is disposed on the surface of the conductive film on which the protrusion is formed, and a portion exposed from the resist layer of the conductive film is removed, and the wiring film is formed. It is a manufacturing method of the flexible wiring board to form.
The invention according to claim 3 is a method for manufacturing a flexible wiring board for producing a flexible wiring board having protrusions formed on the wiring film of the wiring board, wherein the base film disposed on the conductive film is processed at a predetermined position. A plurality of projections are formed by pressing the base film with the processing projections and bulging the conductive film, and a predetermined surface is formed on the surface of the conductive film where the projections are formed. A resist layer having a shape is disposed, a portion exposed from the resist layer of the conductive film is removed, the wiring film is formed, and a resin material is disposed in a recess of the base film formed on the back surface side of the protrusion. This is a method for manufacturing a flexible wiring board.
Invention of Claim 4 is a manufacturing method of the flexible wiring board of any one of Claim 1 thru | or 3, Comprising: The arrangement | positioning of the said resin material is the same kind of resin as the main component of the said base film This is a method for manufacturing a flexible wiring board using the resin material containing as a main component.
Invention of Claim 5 is a manufacturing method of a flexible wiring board which manufactures a flexible wiring board by which a projection was formed on a wiring film of a wiring board, and in a predetermined position of a conductive film arranged on a carrier film, A processing projection is brought into contact, the conductive film is pressed by each of the processing projections, the conductive film is bulged to form a plurality of the projections, and the surface of the conductive film on the side where the projections are formed is A resist layer having a predetermined shape is disposed on the opposite surface, and the wiring film is formed by etching away a portion of the conductive film exposed from the resist layer. After removing the resist layer, the back side of the protrusion A method of manufacturing a flexible wiring board, in which a resin material is disposed in a recess of the wiring film formed on the substrate, a base film that is in close contact with the wiring film is formed, and then the carrier film is removed.
The invention according to claim 6 is a method for manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on the wiring film of the wiring board, wherein the processing protrusion is brought into contact with a predetermined position of the conductive film, The conductive film is pressed by each processing protrusion, the conductive film is expanded to form a plurality of protrusions, a carrier film is disposed on the surface of the conductive film on which the protrusion is formed, and the conductive film A resist layer having a predetermined shape is disposed on a surface opposite to the surface on which the protrusion is formed, and a portion of the conductive film exposed from the resist layer is removed by etching to form the wiring film. After removing the layer, a resin material is disposed in the concave portion of the wiring film formed on the back surface side of the protrusion, and after forming a base film in close contact with the wiring film, the carrier film is removed. Manufacturing It is the law.
The invention according to claim 7 is a method for manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on the wiring film of the wiring board, wherein a predetermined portion of the conductive film is pressed with a processing protrusion, After forming a plurality of the protrusions by expanding the conductive film, a resin film is disposed in the concave portion of the conductive film formed on the back surface side of the protrusions to form a base film, and the protrusions of the conductive film are formed. After the resist layer having a predetermined shape is disposed on the surface of the conductive film, a portion of the conductive film exposed from the resist layer is removed by etching to form the wiring film.
Invention of Claim 8 is a manufacturing method of the flexible wiring board of any one of Claim 1 thru | or 7, Comprising: The arrangement | positioning of the said resin material is the resin material arrange | positioned on a base material sheet. A method of manufacturing a flexible wiring board in close contact with the recess.
Invention of Claim 9 is a manufacturing method of the flexible wiring board of Claim 8, Comprising: After making the said resin material closely_contact | adhere to the said recessed part, the flexible wiring board which peels the said base material sheet from the said resin material Production method.
Invention of Claim 10 is a manufacturing method of the flexible wiring board of any one of Claim 1 thru | or 7, Comprising: The arrangement | positioning of the said resin material is a flexible wiring board which apply | coats the resin material to the said recessed part. It is a manufacturing method.
Invention of Claim 11 is a manufacturing method of the flexible wiring board of any one of Claim 1 thru | or 10, Comprising: After arrange | positioning the said resin material in the said recessed part, the said resin material is hardened. It is a manufacturing method of a flexible wiring board.
The invention according to claim 12 is a method for manufacturing a flexible wiring board, wherein the first processing projection, the first mold having the first processing recess formed therein, and the first processing projection. A second processing recess is formed at a position where the second processing protrusion is formed, and a second mold is formed between the first processing recess and a position where the second processing protrusion is formed. A first conductive film positioned on the surface of the base film of the laminate is positioned between the first processing protrusion and the second processing recess, and on the back surface of the base film A second conductive film is positioned between the second processing protrusion and the first processing recess, and the stacked body is sandwiched between the first and second molds. A method for producing a flexible wiring board, wherein convex portions and concave portions are formed on the front surface, and convex portions and concave portions are formed on the back surface of the laminate. It is.
A thirteenth aspect of the present invention is the method for manufacturing a flexible wiring board according to the twelfth aspect, wherein a through hole is formed in the base film, and the first and second conductive materials are filled with the through hole. This is a method for manufacturing a flexible wiring board in which the laminated body is sandwiched between the first and second molds after electrically connecting the conductive films.
Invention of Claim 14 is a manufacturing method of the flexible wiring board of any one of Claim 12 or Claim 13, Comprising: On the recessed part formed in the surface of the said laminated body, and the back surface of the said laminated body This is a method for manufacturing a flexible wiring board in which a resin material is disposed in a formed recess.
The invention according to claim 15 is a flexible wiring board having a base film and a wiring film disposed on the base film and patterned into a predetermined shape, wherein a protrusion is formed on the wiring film, On the surface of the base film opposite to the wiring film, a concave portion is formed in a portion where the protrusion is located, and a flexible wiring board in which a resin material is disposed in the concave portion.
A sixteenth aspect of the present invention is the method for manufacturing a flexible wiring board according to the fifteenth aspect, wherein the base film and the resin material are flexible wiring boards mainly composed of the same type of resin.
The invention according to claim 17 is a flexible wiring board having a base film and a wiring film disposed on the base film and patterned in a predetermined manner, and a protrusion is formed on the surface of the wiring film, It is a flexible wiring board in which a recess is provided on the back side of the projection of the wiring film, and a resin material is disposed in the recess.
The invention according to claim 18 is the flexible wiring board according to claim 17, wherein the resin material is a part of the base film.
The invention according to claim 19 is the flexible wiring board according to any one of claims 15 to 18, wherein the base film is a flexible wiring board made of a flexible resin film.
The invention according to claim 20 is the flexible wiring board according to claim 19, wherein the base film is a flexible wiring board whose main component is a resin having a glass transition temperature of 300 ° C. or higher.
The invention according to claim 21 is the flexible wiring board according to any one of claim 19 or claim 20, wherein the base film is a flexible wiring board mainly composed of a polyimide resin.
A twenty-second aspect of the invention is the flexible wiring board according to any one of the fifteenth to twenty-first aspects, wherein the base film has a thickness of 8 μm or more and 25 μm or less.
A twenty-third aspect of the present invention is the flexible wiring board according to any one of the fifteenth to twenty-second aspects, wherein the wiring film has a thickness of 8 μm to 35 μm.
Invention of Claim 24 is the flexible wiring board of any one of Claim 15 thru | or 23, Comprising: The height from the surface of the other part of the said wiring film of the front-end | tip of the said connection part is It is a flexible wiring board having a size of 10 μm or more and 20 μm or less.

The present invention is configured as described above, and the protrusion is formed by directly or indirectly pressing the wiring film or the conductive film with the processing protrusion.
Protrusion (for example, 10 μm in height) that is 0.27 times or more and 0.8 times or less in height from the other part of the wiring film with respect to the film thickness of the flexible wiring board (for example, film thickness of 12.5 μm or more and 75 μm or less) When the flexible wiring board is deformed so that a thickness of 20 μm or less is formed, a large recess is formed on the back surface of the protrusion by the deformation. In the present invention, after forming the protrusion, a resin material is disposed in the recess. As a result, the space inside the recess is reduced.

  By providing a plurality of processing projections on one surface of the mold and pressing the surface of the mold on which the processing projections are disposed against the conductive film or the wiring film, a plurality of portions are pressed simultaneously by the plurality of processing projections. As a result, a plurality of protrusions are formed simultaneously.

  If the processing projection and the processing recess are fitted with the conductive film or the wiring film sandwiched therebetween, the conductive film or the wiring film swells into a shape corresponding to the shape of the processing processing recess, so that the height Accurate protrusions are formed. If the shape and size of each processing recess are the same and the shape and size of each processing projection are the same, multiple projections of the same shape and size are formed at the same time. The process of aligning the thickness becomes unnecessary.

  According to the present invention, since the protrusion is formed simply by pressing the wiring film with the processing protrusion, the process of forming the protrusion is easy. In addition, since the resin material is disposed in the recess that is formed at the position directly behind the protrusion when the protrusion is formed, the base film is deformed by the load applied to the protrusion when the protrusion is pressed against the land portion of another electrical component. hard.

  Reference numeral 10 in FIG. 1A shows an example of a laminate used in the present invention. The laminate 10 includes a base film 11 and a wiring film 15 disposed on the base film 11.

The wiring film 15 includes a plurality of elongated wiring portions (not shown here) and a plurality of connection portions 16 wider than the wiring portions. Here, the connection part 16 is circular, and the diameter is set to 100 μm or more and 200 μm or less, and each connection part 16 is connected to an end part in the longitudinal direction of the wiring board.

  Reference numerals 31 and 32 in FIG. 1B denote first and second molds. A plurality of conical processing projections 36 are formed on one surface of the first mold 31, and the second mold On one surface of the mold 32, a plurality of processing concave portions 37 similar to the processing projections 36 are provided at positions corresponding to the processing projections 36.

  The first and second molds 31 and 32 are arranged so that the surface on which the processing protrusion 36 is disposed and the surface on which the processing recess 37 is disposed are opposed to each other, and the laminate 10 is disposed on the base film 11 side. Between the first and second molds 31 and 32 so that the surface faces the surface where the processing projections 36 are arranged and the surface on the wiring film 15 side faces the surface where the processing recesses 37 are arranged. To place.

  The first and second molds 31 and 32 and the laminated body 10 are formed such that the processing projections 36 and the processing recesses 37 face each other and the connection portions 16 face each other. After positioning so as to be positioned between the first and second molds 31 and 32 (FIG. 1 (b)), when the laminated body 10 is sandwiched, the tip of the processing projection 36 becomes the base. The base film 11 is pressed by the processing projections 36 by being pressed against the position directly behind the connecting portion 16 of the film 11.

  The base film 11 is made of a flexible resin such as a polyimide resin, and the film thickness is such that the base film 11 has flexibility (8 μm to 25 μm). The base film 11 is pushed and bent toward the connection portions 16, and each connection portion 16 is pressed by the processing projections 36 through the base film 11.

  The wiring film 15 is made of a metal foil such as a copper foil, and has a thickness that can be deformed by pressing (8 μm or more and 35 μm or less). , Each connecting portion 16 rises to the opposite side of the base film 11 and bulges in the processing recess 37.

  The volume of the processing recess 37 is larger than the volume of the processing projection 36, and the shape of the processing recess 37 is such that the processing projection 36 is placed in the processing recess 37 while the base film 11 and the wiring film 15 are sandwiched together. When fitted, the connection portion 16 bulges from the other portion of the wiring film 15 at a height of 10 μm or more and 20 μm or less, and a gap is formed between the surface of the bulged connection portion 16 and the inner wall of the processing recess 37. Does not occur.

  Accordingly, each connection portion 16 is simultaneously formed with a protrusion 18 having a height from 10 μm to 20 μm from the surface of the other part of the wiring film 15 to the tip and corresponding to the shape of the processing recess 37. (FIG. 1C).

FIG. 1 (d) shows a state in which the laminate 10 is taken out between the first and second molds 31, 32 and the load due to the processing projections 36 is eliminated. The state where 18 is formed is maintained.
Since the back portion of the protrusion 18 of the base film 11 is in close contact with the connecting portion 16, the deformed state is maintained together with the connecting portion 16, and the concave portion 17 is formed.

  Reference numeral 20 in FIG. 1D indicates a laminated film, and the laminated film 20 includes a base sheet 21 and a layered resin material 22 disposed on the surface of the base sheet 21. When the surface of the laminated film 20 on which the resin material 22 is disposed is pressed against the surface of the laminated body 10 on the base film 11 side, the resin material 22 is in close contact with the surface of the base film 11 on which the concave portion 17 is formed. To do.

  In this state, the whole is heated, and when the laminated film 20 is pressed toward the laminated body 21 in a state where the restoring force of the resin material 22 is reduced by heating, the portion between the concave portion 17 and the concave portion 17 on the surface of the base film 11 At the same time as the resin material 21 comes into close contact, a part of the resin material 22 enters the recess 17 and the recess 17 is filled with no gap.

  The film thickness of the resin material 22 is so thick that the entire resin material 22 is hardly deformed even when the recess 17 is partially filled with the resin material 22, so the surface of the resin material 22 on the opposite side of the base film 11. In this case, no new recess is formed and is kept flat (FIG. 2E).

  The resin material 22 is mainly composed of a polyimide precursor, which is a thermosetting resin, and when the recess 17 is filled with the resin material 22 and heated above the polymerization temperature at which the polyimide precursor is polymerized, the polyimide precursor becomes Polymerization is performed and the resin material 22 is cured in a state where the recess 17 is filled.

  As described above, the base film 11 is made of a polyimide resin. Accordingly, since the cured resin material 22 contains the same type of resin as the base film 11, the affinity of the cured resin material 22 to the base film 11 is high, and the cured resin material 22 is firmly attached to the base film 11. Glued to.

  Here, the base material sheet 21 is composed of a release film, and the adhesive force between the base material sheet 21 and the cured resin material 22 is the adhesion between the cured resin material 22 and the base film 11. Since it is weaker than the force, when the base sheet 21 is peeled off, peeling occurs at the interface between the base sheet 21 and the resin material 22, the base sheet 21 is removed, and the cured resin material 22 remains on the base film 11. Remain in.

  The code | symbol 1a of FIG.2 (f) has shown the flexible wiring board of this invention 1 example after peeling the base material sheet 21. FIG. Next, a process for connecting an electrical component to the flexible wiring board 1a will be described.

  Reference numeral 4 in FIG. 3A denotes an electrical component such as a semiconductor chip, and the electrical component 4 has a component body 41. A land portion 42 is disposed on one surface of the component main body 41, and the land portion 42 is connected to an internal circuit of the component main body 41.

  An anisotropic conductive adhesive film 45 is disposed on the surface of the flexible wiring board 1a on which the projections 18 are formed, and the electrical component 4 and the flexible wiring board 1a are aligned so that the land portions 42 and the projections 18 face each other. I do.

  Next, when the electrical component 4 is brought into close contact with the anisotropic conductive adhesive film 45 and heated and pressed, the binder resin 46 of the anisotropic conductive adhesive film 45 is heated and softened, and the binder resin 46 in which the protrusions 18 are softened by the pressing. The conductive particles 47 dispersed in the binder resin 46 are sandwiched between the tips of the protrusions 18 and the land portions 42.

  Despite the thin film thickness of 16 μm to 60 μm, the laminate 10 is greatly deformed so that the height of the protrusion 18 is 10 μm to 20 μm, and there is a space (void) directly behind the protrusion 18. When the protrusion 18 is pressed against the land portion 42 in this state, the flexible wiring board 1a changes. However, since the recess 17 is filled with the resin material 22 with no gap as described above, the flexible wiring board 1a is not deformed. .

  The binder resin 46 includes a thermosetting resin such as an epoxy resin. When the heating and pressing are further continued, the binder resin 46 is cured in a state where the conductive particles 47 are sandwiched between the protrusions 18 and the land portions 42. .

  Reference numeral 2 in FIG. 3B denotes an electric device in a state where the binder resin is cured. In this electrical device 2, the conductive film 47 is sandwiched between the protrusion 18 and the land portion 42 so that the wiring film of the flexible wiring board 1 a is electrically connected to the internal circuit of the electrical component 4. 46 is also mechanically connected.

  Although the above demonstrated the case where the base film 21 was peeled after sticking the laminated | multilayer film 20 to the laminated body 10, this invention is not limited to this, The recessed part 17 is resin material 22 by the process mentioned above. After the filling, the base material sheet 21 may be left attached to the laminate 10 together with the resin material 22 without peeling off the base material sheet 21 from the resin material 22.

  4 indicates a flexible wiring board according to a second example of the present invention in which the base sheet 21 is attached to the laminate 10 together with the resin material 22. In this case, the substrate sheet 21 is preferably not a release film but a material having high adhesion to the cured resin material 22.

  Moreover, the filling method of the recessed part 17 is not limited to the case where the resin material 22 is stuck. For example, a laminate 10 in a state in which a filling resin which is a polyimide resin precursor and a solvent are mixed to create a liquid resin material and the protrusions 18 are formed in the steps of FIGS. When the resin material is applied to the surface of the concave portion 17, the concave portion 17 is filled with the resin composition, and an application layer of the resin material is formed on the base film 11.

  Next, when the coating layer is heated to evaporate excess solvent from the coating layer and polymerize the polyimide precursor in the coating layer, the resin material constituting the coating layer is cured. Reference numeral 1 c in FIG. 5 indicates the flexible wiring board of the third example of the present invention in a state where the liquid resin material 39 is cured on the base film 11.

  The case where the wiring film 15 after patterning is expanded has been described above, but the present invention is not limited to this. Reference numeral 50 in FIG. 6A shows a second example of the laminate used in the present invention. The laminate 50 is arranged on the base film 51 and the base film 51 and is made of a metal foil such as a copper foil. The conductive film 52 is provided.

  The first and second molds 31 and 32 described above are arranged so that the surface on which the processing protrusions 36 are disposed and the surface on which the processing recesses 37 are disposed are opposed to each other, and the laminate 50 is formed on the base film 51. Of the first and second molds 31 and 32 so that the surface on the side faces the surface on which the processing protrusions 36 are arranged and the surface on the conductive film 52 side faces the surface on which the processing recesses 37 are arranged. Place between.

  The first and second molds 31 and 32 and the laminated body 50 are processed such that the processing projections 36 and the processing recesses 37 face each other, and the portions of the conductive film 52 where the connection portions described later are formed face each other. Positioning is performed so as to be positioned between the projection 36 and the processing recess 37 (FIG. 6B).

  As in the case of the laminated body 10 of the first example described above, the base film 51 of the laminated body 50 has flexibility, and the conductive film can be deformed by pressing. When the laminated body 50 is sandwiched between the molds 31 and 32, the conductive film 52 is pressed by the processing projection 36 through the base film 11 and bulges toward the processing recess 37.

  The size of the processing recesses 37 and the processing protrusions 36 is such that when the conductive film 52 is fitted therebetween, the surface of the conductive film 52 rises to a height of 10 μm or more and 20 μm or less from the surface of the other part. Thus, no gap is formed between the raised portion and the inner wall of the processing recess 37.

  Therefore, when the processing concave portion 37 and the processing projection 36 are fitted with the laminated body 50 being sandwiched, the height of the conductive film 52 is 10 μm or more and 20 μm or less, and the projection has a shape corresponding to the shape of the processing concave portion 37. 58 is formed.

  FIG. 6D shows a state in which the stacked body 50 is taken out between the first and second molds 31 and 32. The conductive film 52 is plastically deformed and the state where the protrusions 58 are formed is maintained, and the portion directly behind the protrusions 58 of the base film 51 is deformed together with the conductive film 52 to form the recesses 57.

  Next, after filling the recess 57 with the resin material 22 by any of the methods shown in FIGS. 1D to 2F, 4 and 5, the projection 58 of the conductive film 52 is formed. A resist layer 25 is formed on the opposite surface (FIG. 6E).

  The resist layer 25 is left so that the elongated resist layer 25 remains at a predetermined position of the conductive film 52, and the wide resist layer 25 remains at a position on the protrusion 58 at the longitudinal end of the elongated resist layer 25. 25 exposure and development (patterning).

  FIG. 7F shows a state in which the patterned resist layer 25 is disposed on the conductive film 52. When the conductive film 52 exposed between the patterned resist layers 25 is removed by etching, the conductive film 52 is removed. The portion where the wide resist layer 25 remains is left as the connection portion 56, the portion where the elongated resist layer 25 remains is left as the wiring portion, and the wiring film 55 having the connection portion 56 and the wiring portion is formed. Reference numeral 1d in FIG. 7G shows the flexible wiring board of the fourth example of the present invention in a state where the resist layer 25 is removed from the wiring film 55.

  Although the case where the conductive film 55 is patterned after filling the recess 57 with the resin material 22 has been described above, the present invention is not limited to this. For example, FIGS. After forming the protrusions 58 on the conductive film 52 in the process shown in FIG. 6 and before filling the recess 57, the resist layer 25 is disposed on the conductive film 52, and the above-described FIG. 6 (e) and FIG. The resist layer 25 is exposed and developed in the steps shown (FIG. 8A).

  After the conductive film 52 exposed between the resist layers 25 is removed by etching and the resist layer 25 is removed, the concave portions are formed by any of the methods shown in FIGS. 1 (d) to 2 (f), FIG. 4, and FIG. If the resin material 22 is filled in 57, the flexible wiring board of the fifth example of the present invention as shown by reference numeral 1e in FIG.

Although the above has described the case where the conductive film 52 is pressed by the processing projection 36 via the base film 11, the present invention is not limited to this.
FIG. 9A shows a laminated body 60 of a third example used in the present invention, and this laminated body 60 has a carrier film 61 and a conductive film 62 disposed on the carrier film 61.

  The laminated body 60 is opposed to the surface on the conductive film 62 side and the surface on the side where the processing projections 36 are disposed, and the surface on the carrier film 61 side is opposed to the surface on the side where the processing recesses 37 are disposed. Are disposed between the first and second molds 31 and 32 described above, the processing projection 36 and the processing recess 37 are opposed to each other, and a portion of the conductive film 62 where a connection portion described later is formed is opposed. When the laminated body 60 is sandwiched between the first and second molds 31 and 32 so as to be positioned between the processing projection 36 and the processing recess 37, the conductive projection 62 has the processing projection 36. The conductive film 62 is pushed and bent to the carrier film 61 side, and the conductive film 62 bulges to the carrier film 61 side to form the protrusion 68. At the same time, the position directly behind the protrusion 68 is depressed, and the recess 67 is formed. (FIG. 9B).

  The carrier film 61 is made of a resin having flexibility, and the thickness thereof is thin enough to make the carrier film 61 flexible. Therefore, when the conductive film 62 is deformed, the carrier film 61 is also deformed together. To do.

  FIG. 9C shows the laminated body 60 in a state where the load is removed from between the first and second molds 31 and 32 and the load by the processing projections 36 is eliminated. The conductive film 62 is plastically deformed to form a protrusion 68 that bulges toward the carrier film 61, and maintains a state in which a recess 67 is formed at a position directly behind the protrusion 68. Is deformed.

  Next, a resist layer 25 is formed on the surface of the conductive film 62 opposite to the carrier film 61 (FIG. 9D). The elongated resist layer 25 remains at a predetermined position of the conductive film 62, and the wide resist layer 25 remains on the recess 67 at the longitudinal end of the elongated resist layer 25. Patterning is performed (FIG. 9E).

  When the conductive film 62 exposed between the patterned resist layers 25 is removed by etching, a portion of the conductive film 62 where the wide resist layer 25 remains remains as a wide connection portion 66, and a portion where the elongated resist layer 25 remains. Remains as an elongated wiring portion, and a wiring film having a connection portion 66 and a wiring portion is formed.

  FIG. 9F shows a state in which the wiring film 65 is formed. Since the carrier film 61 is not removed in the process of patterning the resist layer 25 and the process of removing the conductive film 62 by etching, the wiring film 65 is It is supported by the carrier film 61.

  A liquid resin material is prepared by mixing a filling resin that is a polyimide precursor and a solvent, and is applied to the surface of the carrier film 61 on which the wiring film 65 is formed. The recess 67 formed in the portion 66 is filled with a resin material, and a coating layer of the resin material that is in close contact with the wiring film 65 is formed.

Next, when the coating layer is heated, the filling resin is thermally polymerized, the resin material is cured in a state where the recess 67 is filled, and the base film 63 made of the effective resin material is formed (FIG. 10G).
Next, when the carrier film 61 is removed and the protrusions 68 are exposed, the flexible wiring 1d of the sixth example of the present invention as shown in FIG. 10 (h) is obtained.

  As described above, since the base film 63 is formed between the wiring films 65 and the resin material filled in the recesses 67 is cured, the base film 63 is disposed between the wiring films 65 and in the recesses 67. It is in the state that was done.

Although the above has described the case where the conductive film is deformed together with the base film and the carrier film to form the protrusions, the present invention is not limited to this.
Reference numeral 62 in FIG. 11A denotes a conductive film made of a metal foil. The conductive film 62 includes a surface on which the processing protrusions 36 of the first mold 31 are formed and a second mold 32. Between the first and second molds 31 and 32 and the conductive film 62, the processing projection 36 and the processing recess 37 face each other, and the conductive film After performing alignment so that a portion of a connecting portion 62 to be described later is formed between the processing protrusion 36 and the processing recess 37 facing each other, the first and second molds 31 and 32 are used. When the conductive film 62 is sandwiched, the conductive film 62 is directly pressed by the respective processing protrusions 36 and bulges toward the processing concave portion 37 side.

  The size of the processing recess 37 and the processing protrusion 36 is such that when the conductive film 62 is sandwiched and fitted, the surface of the conductive film 62 has a height of 10 μm to 20 μm from the surface of the other part. It swells to the side, and no gap is formed between the raised part and the inner wall of the processing recess 37.

  Accordingly, at the portion pressed by the processing projection 36 of the conductive film 62, a projection 68 having a height of 10 μm or more and 20 μm or less and having a shape corresponding to the processing projection 36 is formed. A concave portion 67 having a shape corresponding to the processing projection 36 is formed at the true back position.

  The conductive film 62 in which the protrusions 68 and the recesses 67 are formed is taken out of the first and second molds 31 and 32, and the carrier film 61 is disposed on the surface of the conductive film 62 on the side where the recesses 67 are formed. A predetermined portion of the conductive film 72 is removed by etching in the steps shown in FIGS. 9C to 9F to form a wiring film having a connection portion and a wiring portion. FIGS. When the base film is formed in the process shown, a flexible wiring board 1d as shown in FIG. 10 (h) is obtained.

The above describes the case where the base film is formed after the conductive film 72 is patterned, but the present invention is not limited to this.
FIG. 12A shows a state in which the protrusion 68 and the recess 67 are formed in the conductive film 62 in the process shown in FIGS. 11A and 11B, and the recess 67 of the conductive film 62 is formed. When the base film 71 is formed on the surface on the other side in the steps shown in FIGS. 10G and 10H, the recesses 67 are filled with the resin material constituting the base film 71 (FIG. 12B).

  Next, when a predetermined portion of the conductive film 62 is removed by etching in the steps shown in FIGS. 6E, 7F, and 7G, the wide connection portion 66 formed in the portion where the protrusion 68 is located. Then, a wiring film 65 composed of an elongated wiring portion connected to the connection portion is formed, and a flexible wiring board 1e as shown in FIG. 12C is obtained. In this flexible wiring board 1 e, the recess 67 of the wiring film 65 is filled with the resin material of the base film 71.

The case where the recess 67 is filled with the resin material constituting the base film 71 has been described above, but the present invention is not limited to this.
The flexible wiring board denoted by reference numeral 1f in FIG. 13 is arranged such that the surface of the wiring film 44 on which the protrusion 48 is formed is in close contact with the base film 40, and the portion located on the protrusion 48 of the base film 40 is Etching is removed, and the tip of the protrusion 48 protrudes from the surface of the base film 40.

  When the projection 48 is formed in the wiring film 44 in the steps shown in FIGS. 1B and 1C or FIGS. 6B and 6C described above, a recess 49 is formed at a position directly behind the projection 48. ing. On the surface of the base film 40 on which the wiring film 44 is disposed, the steps shown in FIGS. 1D, 2E, and 2F, the step shown in FIG. 4, or the step shown in FIG. The resin material 69 is disposed, and the inside of the recess 49 is filled with the resin material 69.

The above describes the case where the protrusion is formed on one surface of the flexible wiring board, but the present invention is not limited to this.
The code | symbol 80 of Fig.14 (a) has shown the laminated body. The laminate 80 has a base film 81, and first and second wiring films 85 a and 85 b made of a patterned metal film are arranged on the front and back surfaces of the base film 81. The base film 81 is provided with a through hole 82 filled with a conductive material 83, and the first and second wiring films 85 a and 85 b are electrically connected by the conductive material 83.

Reference numerals 91 and 92 in FIG. 14A indicate first and second molds, respectively.
On one surface of the first mold 91, when the laminate 90 is sandwiched between the first and second molds 91 and 92, the first processing recess is formed at a position where a projection should be formed on the surface of the laminate 80. 98 is formed, and a first processing projection 96 is formed at a position where a projection is to be formed on the back surface of the laminate 80.

  On the other hand, when the laminated body 80 is sandwiched between the first and second molds 91 and 92 on one surface of the second mold 92, the second processing is performed at a position where a protrusion should be formed on the surface of the laminated body 80. A projection 97 is formed, and a second processing recess 99 is formed at a position where the projection is to be formed on the back surface of the laminate 80.

  The first machining recess 98 is similar in shape to the second machining projection 97, and its volume is larger than the volume of the second machining projection 97, and the second machining recess 99 is the first machining recess 99. And the volume thereof is larger than the volume of the first processing projection 96, so that the laminate described above between the first and second molds 91, 92. When the laminated body 80 is sandwiched between the first and second molds 91 and 92 and the laminated body 80 is pressed, the first processing protrusion 96 and the second processing recess 99 are formed in the laminated body 80. The second processing projection 97 and the first processing recess 98 are fitted in a state where the laminate 80 is sandwiched.

  The first wiring film 85a is located on the front surface of the laminate 80, the second wiring film 85b is located on the back surface of the laminate 80, and the first and second wiring films 85a and 85b are patterned into a predetermined shape. The portion where the protrusion is to be formed is widened by the patterning, and the first and second connection portions 86a and 86b are formed.

  Accordingly, when the first processing projection 96 and the second processing recess 99 are fitted, the first processing projection 96 is located directly behind the first connecting portion 86a or the second wiring film. When 85b is pushed up, the first connecting portion 86a bulges toward the second processing recess 99, and the second processing projection 97 is fitted into the first processing recess 98, the second processing projection 97. Pushes up the base film 81 or the first wiring film 85a at a position directly behind the second connection portion 86b, and the second connection portion 86b bulges toward the first processing recess 98 side.

  The first processing projection 96 and the first processing recess 98 are formed in the same first mold 91, and the second processing projection 97 and the second processing recess 99 are formed in the same second mold. Since it is formed, the first connection portion 86a on the front surface side of the laminate 80 and the second connection portion 86b on the back surface side bulge together in one press, and the first and second protrusions 88a, 88b is formed (FIG. 14B).

  FIG. 14C shows a state after the laminated body 80 is taken out from the first and second molds 91 and 92 and the first and second processing projections 96 and 97 are removed from the laminated body 80. Yes. Since the first and second wiring films 85a and 85b are formed of a conductive film having malleability such as a metal film, the bulged portions of the first and second connection portions 86a and 86b are plastically deformed. However, the state in which the first and second protrusions 88a and 88b are formed is maintained.

  The base film 81 and the first and second wiring films 85a and 85b located directly behind the first and second protrusions 88a and 88b are recessed together when the first and second protrusions 88a and 88b are formed, Even after the first and second processing projections 96 and 97 are removed, the depressed state is maintained, and the first and second recesses 87a and 87b are formed.

  Therefore, in the state where it is taken out from the first and second molds 91 and 92, both the first protrusion 88a and the first recess 87a are formed on the surface of the laminate 80, and the second protrusion is formed on the back surface. Both 88b and the second recess 87b are formed.

  Next, a resin material is applied to the front and back surfaces of the laminate 80 by the steps shown in FIGS. 1D, 2E, and 2F, the step shown in FIG. 4, or the method shown in FIG. 95, and the first and second recesses 87a and 87b are filled with the resin material 95, then the tip portions of the first and second protrusions 88a and 88b are exposed, and the first and second protrusions 88a and 88b are exposed. If the resin material 95 is etched to such an extent that the resin material 95 filled in the recesses 87a and 87b remains, a flexible wiring board 1g is obtained (FIG. 14D).

  The above describes the case where the first and second protrusions 88a and 88b are formed on the first and second wiring films 85a and 85b that are patterned in advance, but the present invention is not limited to this. For example, first and second conductive films before patterning are arranged on the front and back surfaces of the base film to create a laminate, and the laminate is sandwiched between the first and second molds 91 and 92 described above. After the first protrusion and the first recess are formed on the surface, the second protrusion and the second recess are formed on the back surface, and then the first and second n conductive films are patterned into a predetermined shape. The flexible wiring board shown in FIG. 14 (d) can be obtained even when the resin material is filled in the first and second recesses in the steps described in FIGS. 14 (c) and 14 (d). .

  When manufacturing flexible wiring boards having protrusions on both sides, the thickness of the wiring film (first and second wiring films) and the conductive film is as thin as 8 μm to 35 μm, and the thickness of the base film is 8 μm to 25 μm. If it is thin, the laminate 80 is easily deformed, so that the load when pressing with the first and second processing projections 96 and 97 can be reduced.

  The above describes the case where the first and second processing projections 96 and 97 are in direct contact with the first and second wiring films 85a and 85b or the base film, but the present invention is not limited to this. If a cover film is affixed to the front surface and the back surface of the laminate 80 and the first and second processing projections 96 and 97 are pressed against the positions on the back surface side of the first and second connecting portions of the cover film, When the first and second protrusions are formed, the first and second processing protrusions 96 and 97 are not in direct contact with the first and second wiring films and the base film. Even if the load applied to 96 and 97 is increased, the first and second wiring films and the base film are not damaged.

  The above has described the case where the protrusions are formed on the first and second wiring films 85a and 85b that have been patterned in advance. However, the present invention is not limited to this, and the pattern before patterning is formed on both surfaces of the base film. After arranging the first and second conductive films and forming the first and second protrusions on the first and second conductive films, respectively, the first and second conductive films are patterned, The first and second wiring films with the second protrusions formed are obtained.

  The above describes the case where the first and second wiring films are electrically connected by the conductive material in the through hole, but the present invention is not limited to this, and the first and second The case where the wiring film is not electrically connected is also included in the present invention.

  The above has described the case where one or both of the front and back surfaces of the conductive film and wiring film are in direct contact with the processing protrusions 36 and the processing recesses 37 to form the protrusions. It is not limited to.

  If a protective film is affixed to the exposed portion of the conductive film surface of the laminate or conductive film described above and then pressed by the processing protrusions 36, the conductive film and the wiring film become the processing protrusions 36 and the processing recesses 37. Since the protrusions can be formed without being in direct contact with each other, damage to the conductive film and the wiring film can be prevented.

  The above is a case where a base film 11 containing a polyimide resin is used. However, the present invention is not limited to this, and a polyester resin can be used as long as it is a resin capable of forming a flexible base film. Various resins such as polyamide resin can be used, and these resins may be used alone or in combination of two or more.

  When using a thermosetting adhesive to connect the flexible wiring board and electrical components, if the glass transition temperature of the resin that is the main component of the base film is low, the flexible wiring board may be deformed. The glass transition temperature is preferably 300 ° C. or higher. Moreover, as long as it is a range which does not have flexibility, it is good also as the base film 11 by bonding together 2 or more resin films.

  When forming the protrusion, the laminate or the conductive film can be pressed with the processing protrusion 36 while being heated. The base film used in the present invention has a thin film thickness of 8 μm or more and 25 μm or less, and when heated at a high temperature, the base film may be broken. It is preferable that it is less than the glass transition temperature of resin which is a component.

The conductive material constituting the conductive film and the wiring film is not limited to copper, and various conductive materials such as aluminum can be used.
The resin of the resin material that fills the recess is not limited to the polyimide resin, and an epoxy resin or an acrylic resin can be used as long as the resin has high adhesion to the object (base film or conductive film) in which the recess is formed. Those containing various resins can be used.

  In the case where the resin material is cured by heating after the resin material is disposed in the recess, the heating temperature is preferably lower than the glass transition temperature that is the main component of the base film. Further, the method of curing the resin material is not limited to heating. For example, when a resin material contains a photopolymerizable resin, the resin material can be cured by light irradiation.

  When the resin material is disposed in the recess of the base film, the adhesion between the resin material and the base film is enhanced by using a resin material containing the same type of resin as the main component of the base film.

  Moreover, although the above demonstrated the case where the resin material was filled in the recessed part of a base film or a wiring film without gap, this invention is not limited to this, A flexible wiring board does not deform | transform when a protrusion is pressed on a land part. If it is about a degree, some space (void) may remain in the recess after the resin material is disposed.

  The kind of the base material sheet used for the arrangement of the resin material is not particularly limited, but when the base material sheet is left on the flexible wiring board without being peeled from the resin material, a flexible resin film is used. It is preferable.

  When the resin material is applied, the application method is not particularly limited, and it can be applied using various application devices such as a wire bar and a gravure coater. The resin material may be disposed on the entire surface of the laminate where the recesses are formed, or may be disposed only on the portion where the recesses are formed. Alternatively, a liquid resin material may be filled in a coating apparatus such as an ink jet printer, and the resin material may be discharged from the nozzle of the coating apparatus toward the concave portion, and the resin material may be disposed only in a portion where the concave portion is located.

  The electrical component connected to the flexible wiring board of the present invention is not limited to a semiconductor element, and various flexible wiring boards, rigid boards, resistors, and the like can be connected to the flexible wiring board of the present invention.

(A)-(d): Sectional drawing explaining the first half of the 1st example of the manufacturing process of the flexible wiring board of this invention. (E), (f): Sectional drawing explaining the latter half of the 1st example of the manufacturing process of the flexible wiring board of this invention. (A), (b): Sectional drawing explaining the process of connecting the flexible wiring board of this invention and an electrical component. Sectional drawing explaining the flexible wiring board created with the manufacturing method of the 2nd example of this invention Sectional drawing explaining the flexible wiring board created with the manufacturing method of this invention 3rd example (A)-(e): Sectional drawing of the first half of the 4th example of the manufacturing process of the flexible wiring board of this invention. (F), (g): Cross-sectional view of the latter half of the fourth example of the manufacturing process of the flexible wiring board of the present invention. (A)-(c): Sectional drawing explaining the 5th example of the manufacturing process of the flexible wiring board of this invention. (A)-(f): Sectional drawing of the first half of the 6th example of the manufacturing process of the flexible wiring board of this invention. (G), (h): Cross-sectional view of the latter half of the sixth example of the manufacturing process of the flexible wiring board of the present invention. (A)-(c): Sectional drawing explaining the 7th example of the manufacturing process of the flexible wiring board of this invention. (A)-(c): Sectional drawing explaining the 8th example of the manufacturing process of the flexible wiring board of this invention. Sectional drawing explaining the flexible wiring board created with the manufacturing method of the 9th example of this invention (A)-(d): Sectional drawing explaining the 10th example of the manufacturing process of the flexible wiring board of this invention.

Explanation of symbols

  1a, 1b, 1c, 1d, 1e, 1f, 1g ... Flexible wiring board 10, 50, 60, 80 ... Laminate 11, 51, 63, 71 ... Base film 15, 65, 55, 85a, 85b ... ... Wiring films 17, 57, 67 ... Recesses 18, 58, 68 ... Protrusions 36 ... Processing protrusions 37 ... Processing recesses 20 ... Laminated film 21 ... Base sheet 22, 39 ... Resin material 25 …… Resist layer 52, 62 …… Conductive film 61 …… Carrier film

Claims (24)

A method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board,
Place the patterned wiring film on the base film,
A processing projection is brought into contact with a predetermined position of the base film at a portion where the wiring film and the base film are disposed, the base film is pressed by the processing projection, and the wiring film is bulged to Forming protrusions,
The manufacturing method of the flexible wiring board which arrange | positions resin material in the recessed part of the said base film formed in the back surface side of the said protrusion. A method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board,
A processing protrusion is brought into contact with a predetermined position of the base film disposed on the conductive film, the base film is pressed with the processing protrusion, the conductive film is bulged to form a plurality of protrusions,
After placing a resin material in the recess of the base film formed on the back side of the protrusion,
A flexible wiring board that forms a wiring film by disposing a resist layer having a predetermined shape on a surface of the conductive film on which the protrusion is formed, and removing a portion of the conductive film exposed from the resist layer. Production method. A method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board,
A processing protrusion is brought into contact with a predetermined position of the base film disposed on the conductive film, the base film is pressed with the processing protrusion, the conductive film is bulged to form a plurality of protrusions,
A resist layer having a predetermined shape is disposed on the surface of the conductive film on which the protrusion is formed, and a portion exposed from the resist layer of the conductive film is removed to form the wiring film,
The manufacturing method of the flexible wiring board which arrange | positions resin material in the recessed part of the said base film formed in the back surface side of the said protrusion.   The method for manufacturing a flexible wiring board according to any one of claims 1 to 3, wherein the resin material is arranged using the resin material mainly composed of the same kind of resin as a main component of the base film. A method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board,
Forming a plurality of the protrusions by bringing a processing protrusion into contact with a predetermined position of the conductive film disposed on the carrier film, pressing the conductive film with each of the processing protrusions, and expanding the conductive film.
A resist layer having a predetermined shape is disposed on the surface of the conductive film opposite to the surface on which the protrusion is formed,
Etching and removing the portion of the conductive film exposed from the resist layer to form the wiring film, after removing the resist layer,
A method for manufacturing a flexible wiring board, comprising: disposing a resin material in a concave portion of the wiring film formed on the back surface side of the protrusion, forming a base film in close contact with the wiring film, and then removing the carrier film. A method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board,
A plurality of protrusions are formed by bringing a processing protrusion into contact with a predetermined position of the conductive film, pressing the conductive film with each of the processing protrusions, and expanding the conductive film;
A carrier film is disposed on a surface of the conductive film on which the protrusion is formed, and a resist layer having a predetermined shape is disposed on a surface opposite to the surface of the conductive film on which the protrusion is formed,
Etching and removing the portion of the conductive film exposed from the resist layer to form the wiring film, after removing the resist layer,
A method for manufacturing a flexible wiring board, comprising: disposing a resin material in a concave portion of the wiring film formed on the back surface side of the protrusion, forming a base film in close contact with the wiring film, and then removing the carrier film. A method of manufacturing a flexible wiring board for manufacturing a flexible wiring board having protrusions formed on a wiring film of the wiring board,
After pressing a predetermined portion of the conductive film with a processing protrusion, the conductive film is expanded to form a plurality of the protrusions,
A base material is formed by disposing a resin material in the concave portion of the conductive film formed on the back side of the protrusion,
A flexible wiring board that forms a wiring film by arranging a resist layer having a predetermined shape on the surface of the conductive film on which the protrusion is formed, and then etching away a portion of the conductive film exposed from the resist layer. Manufacturing method.   The method for producing a flexible wiring board according to any one of claims 1 to 7, wherein the resin material is disposed in such a manner that the resin material disposed on the base sheet is in close contact with the recess.   The method for producing a flexible wiring board according to claim 8, wherein the base material sheet is peeled from the resin material after the resin material is brought into close contact with the recess.   The method for manufacturing a flexible wiring board according to claim 1, wherein the resin material is disposed by applying a resin material to the recess.   The method for manufacturing a flexible wiring board according to claim 1, wherein the resin material is cured after the resin material is disposed in the recess. A first processing projection, a first mold formed with the first processing recess, and a second processing recess formed at a position where the first processing projection is fitted to the first processing projection, The laminate is disposed between the second mold in which the second processing projection is formed at a position where it fits with the one processing recess,
A first conductive film positioned on the surface of the base film of the laminate is positioned between the first processing protrusion and the second processing recess, and the second conductive film is positioned on the back surface of the base film. Positioning the conductive film between the second processing projection and the first processing recess, sandwiching the laminate with the first and second molds,
The manufacturing method of the flexible wiring board which forms a convex part and a recessed part in the surface of the said laminated body, and forms a convex part and a recessed part in the back surface of the said laminated body.   A through-hole is formed in the base film, and the first and second conductive films are electrically connected with a conductive material filled in the through-hole, and then the first and second molds are used to stack the laminate. The manufacturing method of the flexible wiring board of Claim 12 which pinches | interposes a body.   The manufacturing method of the flexible wiring board of any one of Claim 12 or Claim 13 which arrange | positions a resin material in the recessed part formed in the surface of the said laminated body, and the recessed part formed in the back surface of the said laminated body. A base film, and a wiring film disposed on the base film and patterned into a predetermined shape;
A flexible wiring board having protrusions formed on the wiring film,
A flexible wiring board in which a recess is formed in a portion where the projection is located on a surface of the base film opposite to the wiring film, and a resin material is disposed in the recess.   The flexible wiring board according to claim 15, wherein the base film and the resin material are mainly composed of the same type of resin. A base film, and a wiring film disposed on the base film and patterned in a predetermined manner;
A flexible wiring board having protrusions formed on the surface of the wiring film,
A flexible wiring board in which a recess is provided on the back side of the protrusion of the wiring film, and a resin material is disposed in the recess.   The flexible wiring board according to claim 17, wherein the resin material is constituted by a part of the base film.   The flexible wiring board according to claim 15, wherein the base film is made of a resin film having flexibility.   The flexible wiring board according to claim 19, wherein the base film is mainly composed of a resin having a glass transition temperature of 300 ° C. or higher.   The flexible wiring board according to claim 19, wherein the base film has a polyimide resin as a main component.   The flexible wiring board according to any one of claims 15 to 21, wherein a film thickness of the base film is 8 µm or more and 25 µm or less.   The flexible wiring board according to any one of claims 15 to 22, wherein a thickness of the wiring film is not less than 8 µm and not more than 35 µm.   The flexible wiring board according to any one of claims 15 to 23, wherein a height of a tip of the connection portion from a surface of another portion of the wiring film is 10 µm or more and 20 µm or less.

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