JP2009032798A - Wiring structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure the adhesion of wiring to an insulating substrate and to prevent peeling in a wiring structure for which a mixed layer comprising a metal and a resin is formed in a pattern shape. <P>SOLUTION: As the wiring structure, the mixed layer is provided between wiring and a substrate. Thus, the adhesion of the wiring and the mixed layer by metal bonding is strengthened, and the excellent adhesion is secured by the compatibility of the resin of the mixed layer and the substrate. Also, since there is no need of roughening the surface of the substrate in order to secure the adhesion unlike conventional wiring structures, it is suitable for a fine pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring structure in which conductive wiring of a wiring pattern is in close contact with an insulating substrate, and a method of manufacturing a wiring substrate that transfers a functional conductive wiring pattern structure using injection molding of the insulating substrate It can be used for.

  The following first and second prior arts are related to a wiring structure using a printed wiring board or a similar wiring board.

1. First Prior Art (1) Japanese Patent No. 3528924 (Patent Document 1)
Patent Document 1 discloses that inner layer circuits 40A and 40B and outer layer circuits 61A and 61B on insulating layer 47 are connected via blind via hole 45 of insulating layer 47 provided on inner layer circuits 40A and 40B. When connecting, a multilayer printed wiring board in which a copper paste layer 52 is applied on the insulating layer 47 and an electric copper plating 51 is applied on the copper paste layer to form outer layer circuits 61A and 61B. Thus, the cost can be reduced and the electroless plating can be omitted. Further, the process can be simplified, the material cost can be reduced, and the adhesion strength of the circuit pattern can be improved.
However, the code | symbol in this paragraph is a code | symbol in patent document 1 (hereinafter, the same in this section).

(2) JP 2006-222408 A (Patent Document 2)
In order to improve the adhesion between the plastic substrate and the conductor wiring without the need for special processing and processing involving complicated man-hours and various problems, the one described in Patent Document 2 Provided is a conductor wiring structure in which a base catalyst can be firmly bonded to a plastic substrate and a method for producing the same, and a conductor wiring structure in which a continuous conductor wiring pattern 3 is formed on the surface of a plastic substrate 2. The catalyst particle group 4 formed in a predetermined pattern in an embedded state embedded in the plastic substrate or / and an embedded state partially exposed on the surface of the plastic substrate, and integrated with the catalyst particle group Conductor wiring pattern.

2. Second prior art
As the second prior art, there are the following known documents (3) to (6).
(3) JP 2005-244039 A (Patent Document 3)
What is described in Patent Document 3 provides a printed wiring board in which peeling does not occur in a conductor circuit. The conductor circuit is composed of two or more types of metal layer portions, and at least a first metal portion on the outer layer side. This is a printed wiring board in which the width of the second metal portion on the inner layer side is larger than the width of the printed wiring board. And in the method of manufacturing a printed circuit board by the transfer method, after forming two or more kinds of metal layer portions on the metal carrier by plating, the width of the first metal portion at least on the outer layer side of the metal layer portion is: The metal part is etched to form a conductor circuit so as to be smaller than the width of the second metal part on the inner layer side.

(4) JP 2002-4077 A (Patent Document 4)
The object described in Patent Document 4 is to provide a resin layer transfer type electroformed product that requires high density and high accuracy, and a method for manufacturing the same, and it is an electric circuit having a predetermined pattern. In an electroformed product in which the cast substrate 1 is covered with a resin layer 3 and the back surface of the electroformed substrate 1 is exposed from the resin layer 3, the protrusion 2 having a bowl-shaped cross section is formed on the periphery of the upper end of the electroformed substrate 1. In which the resist pattern layer 7 is formed on the main surface of the mother die 4 and the exposure defined by the resist pattern layer 7 of the mother die 4 is formed. An electroformed base 1 having a predetermined pattern in which a protrusion 2 having a bowl-shaped cross section is integrally formed on the periphery of the upper end by electrodepositing electrocast metal on the surface exceeding the thickness of the resist pattern layer 7. Forming the resist pattern layer 7 on the matrix 4; After the removal, an electroformed product having a step of covering the electroformed substrate 1 with the resin layer 3 and a step of removing the matrix 4 and exposing the back surface of the electroformed substrate 1 from the resin layer 3 It is a manufacturing method (in addition, the code | symbol in this paragraph is a code | symbol in well-known literature 4).

(5) Japanese Patent Laid-Open No. 11-17314 (Patent Document 5)
What is described in Patent Document 5 is a highly accurate and high-density conductor wiring pattern in a concave portion of an insulating substrate having a three-dimensional shape, which has high reliability against dropping of the conductor wiring and has a large current capacity. In this case, a photocurable resin is applied on the temporary substrate (1), exposed and developed to form a reverse pattern opposite to the conductor wiring pattern, and then the reverse pattern. Conductor wiring (4...) Is formed on the electric circuit (3...) Formed in the gap by electroplating, and then the obtained temporary substrate is placed in a mold on the wiring pattern forming surface. After the insulating substrate is molded, the temporary substrate (1) is removed from the molded body, and the insulating mask (2) is transferred onto the molded body surface together with the conductor wiring pattern.

(6) JP 2005-322834 A (Patent Document 6)
What is described in Patent Document 6 constitutes a pattern shape body in which the pattern can have good adhesion to the support member, and such a pattern shape body is inexpensive and relatively easy to manufacture. A pattern composed of granular aggregates and a support member supporting the pattern, and at the interface where the support member and the pattern are in contact, On the premise of a pattern-shaped body in which a mixed layer of granular aggregates constituting the pattern and the support member is formed, the size of particles existing in a portion excluding the mixed layer in the pattern is determined by the mixing. It is larger than the particles present in the layer.
Japanese Patent No. 3528924 JP 2006-222408 A JP 2005-244039 A JP 2002-4077 A Japanese Patent Laid-Open No. 11-17314 JP 2005-322834 A

[Problems of the prior art]
As a method for reducing the size of functional parts and functional modules, there is board-less wiring formation and mounting. As a typical example, a wiring called MID (Molded Interconnect Device), which is formed on the surface of the molded body and mounted with components, can be reduced in size by eliminating the substrate. As the wiring becomes finer, securing the wiring adhesion becomes an issue.

(1) Problems of the First Prior Art In the prior art disclosed in Japanese Patent No. 3528924 (Patent Document 1), the inner layer circuit 40A is passed through the blind via hole 45 of the insulating layer 47 provided on the inner layer circuits 40A and 40B. , 40B and the outer layer circuits 61A, 61B on the insulating layer 47 are connected, a copper paste layer 52 is applied on the insulating layer 47, and the copper electroplating 51 is applied on the copper paste layer, thereby forming the outer layer circuits 61A, 61B. There is a multilayer printed wiring board formed. In such a structure, since the pattern is formed by screen printing or the like, the printed shape is blurred or blurred, and therefore, it is difficult to apply to a fine pattern having a width of 10 μm or less.

  Moreover, in the prior art of Unexamined-Japanese-Patent No. 2006-222408 (patent document 2), in the conductor wiring structure in which the continuous conductor wiring pattern 3 was formed in the surface of the plastic base material 2, it embedded in the plastic base material. And / or catalyst particle group 4 formed in a predetermined pattern in a buried state in which a part of the surface of the plastic substrate is exposed, and a conductor wiring pattern integrated with the catalyst particle group To ensure adhesion. However, in order to exert the catalytic function, it is necessary to remove the portion where the catalyst is covered with resin, and since the adhesion force is due to the weak intermolecular force due to the anchor effect, it forms a strong wiring adhesion force It is difficult.

(2) Problems with the second prior art
In the prior art disclosed in Japanese Patent Laying-Open No. 2005-244039 (Patent Document 3), the conductor circuit is composed of two or more types of metal layer portions, and at least the second metal portion on the inner layer side is wider than the width of the first metal portion on the outer layer side. In a method of manufacturing a printed wiring board by a transfer method using a printed wiring board having a larger width, after forming two or more types of metal layer portions on a metal carrier by plating, at least the metal layer portions The conductor circuit is formed by etching the metal part so that the width of the first metal part on the outer layer side is smaller than the width of the second metal part on the inner layer side. In such a structure, when fine wiring is formed, there is a problem that the wiring pitch is limited by the wiring width on the interior side, and the wiring width becomes narrow. In addition, there is a problem that the effective area becomes small in places such as connection terminal pads.

In JP 2002-4077 A (Patent Document 4), an electroformed substrate 1 having a predetermined pattern is covered with a resin layer 3, and the back surface of the electroformed substrate 1 is exposed from the resin layer 3. In the electroformed product formed, the electroformed product is characterized in that a protrusion 2 having a bowl-shaped cross-section is integrally formed on the periphery of the upper end of the electroformed substrate 1. A step of forming the resist pattern layer 7 and electrodepositing the electroformed metal beyond the thickness of the resist pattern layer 7 on the exposed surface defined by the resist pattern layer 7 of the matrix 4, so that the cross-section is formed at the upper edge. A step of forming the electroformed substrate 1 having a predetermined pattern in which the bowl-shaped protrusions 2 are integrally formed, and after removing the resist pattern layer 7 on the matrix 4, the electroformed substrate 1 is replaced with a resin. A step of covering with a layer 3 and removing the matrix 4 to form a resin layer Kara electroforming to expose the rear surface of the substrate 1 is a manufacturing method of electroforming product having a step formed by.
Also in this method, the problem of narrowing the wiring width at the time of fine wiring and the problem of reducing the pad area occur similarly.

  In JP-A-11-17314 (Patent Document 5), a photocurable resin is applied on a temporary substrate, exposed and developed to form an inverted pattern opposite to the conductor wiring pattern, and then inverted. Conductor wiring is formed by electroplating on the electric circuit formed between the patterns, and then the obtained temporary substrate is placed in a mold and an insulating substrate is molded on the wiring pattern forming surface. By removing the insulating mask along with the conductor wiring pattern from the molded body and transferring the insulating mask to the surface of the molded body, the wiring adhesion is ensured. However, as described above, there is a problem that the area cannot be obtained effectively with respect to the wiring width and the pad area.

〔Task〕
In light of the above-mentioned problems of the prior art, the present invention secures the adhesion of the wiring to the insulating substrate and prevents the peeling of the wiring structure in which the mixed layer made of metal and resin is formed in a pattern. Is the issue.

[First means]
The first means for solving the above problem is to provide a mixed layer between the wiring and the substrate as a wiring structure, thereby strengthening the adhesion between the wiring and the mixed layer by metal bonding, Good adhesion can be ensured by the compatibility between the resin of the mixed layer and the substrate. Further, since it is not necessary to roughen the surface of the substrate in order to ensure adhesion, it is suitable for a fine pattern.

[Second Means]
A second means for solving the above-described problem is to partially embed the wiring structure in an insulating substrate, thereby ensuring adhesion. In particular, the present invention can control the adhesion of individual wirings to wirings having various wiring widths and lengths and fine patterns.

The effects of the invention according to each claim are as follows.
1. 1st invention (Inventions 1-8)
(1) The invention according to claim 1 The mixed layer forms a metal bond with the material contained in the metal wiring, and is bonded to the resin substrate by resin penetration during molding, so the wiring adhesion is extremely high. Is prevented from peeling from the substrate.

(2) Invention of Claim 2 Since the mixed layer has conductivity, wiring can be formed in a pattern by electrolytic plating.

(3) Invention according to claim 3 Since a strong metal bond is obtained, wiring adhesion is extremely high.

(4) Invention according to claim 4 Good bonding between the resins is obtained, and therefore the wiring adhesion is high.

(5) Invention according to claim 5 Since not only a thermosetting resin having good adhesion but also high adhesion can be obtained in the present invention, a thermoplastic resin can be applied, and the material selectivity is high. .

(6) Invention of Claim 6 A mixed layer having excellent wiring adhesion can be formed by a simple method.

(7) Invention of Claim 7 Since the side surface part is also bonded to the resin, an excellent wiring adhesion can be obtained.

(8) Invention of Claim 8 Miniaturization can be achieved by incorporating functional parts in the structure.

2. Second invention (claims 9 to 14)
(1) The invention according to claim 9 Since the wiring portion embedded in the insulating substrate exists, the wiring adhesion is high, and therefore, the wiring is prevented from peeling off from the substrate.

(2) The invention according to claim 10 Since the wiring is flush with the insulating substrate, the connection height at the connection portion such as an electrode can be ensured. In addition, when a wiring for connecting a wiring on the substrate and another wiring (or functional component) is formed by printing, there is no step, so the occurrence of cracks at the boundary between the wiring on the substrate and the resin is suppressed. Can do.

(3) Invention of Claim 11 Strong wiring adhesion can be ensured by embedding an end portion of the wiring that is easy to peel off in the substrate surface.

(4) Invention of Claim 12 By embedding the fine wiring that connects the terminals of the conductive wiring, it is possible to reliably prevent disconnection due to the damage of the fine wiring.

(5) Invention of Claim 13 By using a transfer plate, a wiring board having conductive wiring embedded therein can be formed at low cost.

(6) The invention according to claim 14 The functional component is included in the structure, so that the size can be reduced.

1. Examples 1 to 3 of the first invention will be described.

Example 1 is schematically shown in FIG. 1 (Example 1 corresponds to claims 1 to 6).
After applying polyimide to the transfer plate 10 of SUS304 to form the polyimide layer 11, patterning was performed with an excimer laser (FIG. 1A). The film thickness of the polyimide layer 11 is 10 μm on average. Then, after conducting a fluorine coating on the entire surface, a copper conductive wiring 12 having an average thickness of 5 μm is formed by electrolytic copper sulfate plating (FIG. 1B). Thereafter, a mixed layer 13 film having a thickness of about 5 μm is formed by eutectoid plating of copper and epoxy resin (FIG. 1C). Thereafter, the transfer plate 10 is set on a mold 14 and filled with a thermosetting epoxy resin 15 to form an insulating substrate 16 (FIG. 1D). When the mold 14 is released after cooling and the transfer plate 10 is peeled off, the wiring structure 1 is obtained (FIG. 1E).

In Example 1, the conductive layer 12 is formed and then the mixed layer 13 is formed. However, the transfer plate 10 is subjected to eutectoid plating of copper and epoxy resin, and after resin molding, electrolytic copper sulfate plating is performed. It is also possible to form a copper wiring.
In Example 1, the mixed layer 13 itself has conductivity, but the process can be similarly performed even when the mixed layer 13 does not have conductivity, and a method by electroless eutectoid plating is also possible.

In general, when bonding metal and resin, it is possible to improve the adhesion by roughening the metal surface by the anchor effect, but in this case, since the bond is weak, fine patterns and wiring It is difficult to obtain sufficient adhesion when the film thickness is small. On the other hand, in this Example 1, since the wiring is made of copper, and the eutectoid plating of the mixed layer 13 also uses copper, the plating of the conductive wiring 12 is directly deposited on the copper. The layer 13 is firmly bonded by metal bonding.
Moreover, since the mixed layer and the insulating substrate 16 are formed of epoxy resin, they are strongly bonded to each other due to their compatibility, and the wiring and the resin are bonded by the conventional anchor effect (anchor effect due to the roughening of the metal surface). Compared to the case, it is firmly bonded.

Conventionally, it has been difficult to transfer wiring at the time of substrate molding with a thermoplastic resin, but by providing the mixed layer 13 on the copper wire as in the present invention, an adhesion mechanism with the thermoplastic resin is expressed, This enables wiring transfer and can be used.
In this example, a method using electrolytic eutectoid plating is used as a method for producing a mixed layer, but the method is not limited to this method, and a metal and resin are mixed like a conductive adhesive. But you can.
As a supply method of the conductive adhesive, a supply method by screen printing is generally used for supply to a flat surface, and in the case of a three-dimensional shape, the initial purpose can be achieved even by a supply method using a dispenser.

Example 2 is schematically shown in FIG. 2 (Example 2 corresponds to claim 7).
Photoresist OFPR-800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was applied to the transfer plate 10 made of SUS304 to form a resist layer 21 having a thickness of 3 μm.
Thereafter, nickel conductive wiring 22 having an average thickness of 3 μm is formed by nickel sulfamate electrolytic plating, and then mixed layer 23 having a thickness of about 3 μm is formed by eutectoid plating of copper and epoxy.
After removing the resist layer 21, the transfer plate 10 is set in the mold 14, filled with a liquid crystal polymer 25 as a thermoplastic resin to form an insulating substrate 26, cooled, and then the mold 14 is released. The transfer plate 10 is peeled off. Thereby, the wiring structure 2 by the insulating substrate 26 is obtained (FIG. 2F).
If it does in this way, resin will osmose | permeate to a wiring side surface, and thereby, the contact surface area of wiring and resin will increase, and wiring adhesion | attachment force will become strong.

A third embodiment is schematically shown in FIG. 3 (note that the third embodiment corresponds to claim 8).
After the copper wiring 32 is formed in a pattern by electrolytic plating in the same manner as in Example 1, an epoxy-based conductive adhesive is supplied to the connection terminal portion 34 by dispensing, and then a functional component (for example, a semiconductor chip) 35 Is connected to the wiring pattern formed on the mold through a conductive adhesive, and the adhesive is cooled and cured at a cooling rate of 150 ° C. for 1 hour. Thereafter, the insulating substrate 36 is resin-molded in the same manner as in Example 1, and the mold is released, so that the functional component 35 is enclosed in the insulating substrate (molded body) 36, and the patterned copper wiring is exposed on the surface. The formed body 3 is formed.

  In Example 3, the connection material was supplied by dispensing, but other methods such as a method of supplying solder onto wiring and functional parts by plating, and a method of mounting functional parts equipped with solder bumps can be used. You can also.

2. Next, Examples 4 to 7 for the second invention will be described.

Example 4 is schematically shown in FIG. 4 (Note that Example 4 corresponds to claims 9 to 11). FIG. 4A shows a state in which a plurality of conductive wires having a predetermined length parallel to each other are arranged on the insulating substrate, and FIG. 4B shows a state in which each conductive wire is embedded in the insulating substrate. Yes.
The conductive wiring 41 is in close contact with the insulating substrate 46, but is embedded in the insulating substrate as a whole, and a part thereof is exposed on the surface. By adopting such a structure, the adhesion of the conductive wiring 41 to the insulating substrate 46 can be enhanced. This embedded form is a form in which the conductive wiring 41 is completely embedded in the insulating substrate 46 in a state where both ends of the conductive wiring 41 are obliquely pressed down. The conductive wiring 41 starts to peel from both end portions and expands to the center portion. However, since both end portions are completely embedded as in the fourth embodiment, both end portions are not peeled off. As shown in FIG. 4, the adhesive structure is strong against peeling as a whole, and is effective when it is difficult to secure the adhesion force by miniaturizing the conductive wiring.

Example 5 is schematically shown in FIG. 5 (Example 5 corresponds to claim 12). The conductive wiring of this embodiment has the same form as the conductive wiring of the fourth embodiment as a whole.
When the conductive wiring 51 has wide left and right end portions 51a and narrow connection portions 51e that connect both end portions, unlike the fourth embodiment, the end portion 51a has a large area, so that the wiring adhesion is ensured. Easy to be. On the other hand, the fine wiring portion 51b tends to be peeled off from a discontinuous singular portion such as a corner portion (corner portion) or a wiring and a short-lived boundary particularly when the wiring is long or complicated, but this embodiment The conductive wiring 5 has a structure in which the fine wiring portion 51b is embedded in the insulating substrate 56, and the contact area between the fine wiring portion and the resin can be increased, so that peeling of the fine wiring can be prevented.

  Further, in the case of a solder resist used for a printed circuit board, the wiring portion existing on the surface layer is covered with a coat layer having a certain thickness so that the solder does not spread out. This is quite different from the point that the flatness with the insulating substrate 56 is ensured. Especially when a functional component (for example, the functional component 35 in FIG. 3) is mounted on the wiring substrate (insulating substrate 56), there is a solder resist. In addition, since the effective connection height of the solder is reduced by the thickness of the solder resist, stress relaxation against thermal stress cannot be obtained sufficiently, and the reliability of the functional component may not be sufficiently secured. However, in this embodiment, the solder terminal height becomes an effective height, so that the stress relaxation mechanism is improved.

Example 6 is schematically shown in FIG. 6 (Example 6 corresponds to claim 13).
A photoresist OFPR-800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied onto the transfer plate 60 made of SUS304, a pattern is formed to form a resist layer, and then a 1 μm thick adhesion layer 68 is formed by Ni plating sulfamic acid. Form. Thereafter, the photoresist is removed, photoresist PMER-P-LA900PM (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied, exposed and developed to form the resist layer 61, and then the pattern of the conductive wiring 62 is formed. Thereafter, Cu is plated to a thickness of 15 μm on the exposed surface of SUS304 and Ni plating (adhesion layer 68) by copper sulfate plating (FIG. 6B), and then the resist layer 61 is peeled (FIG. 6). 6 (c)). Ni and Cu adhere well in this plating step, but the adhesion between SUS304 and Cu is small, so that peeling occurs at the SUS304 / Cu interface in the cleaning step for resist removal.

Next, the transfer plate 60 is set in a mold 64 of a molding apparatus, and thereafter, an epoxy resin G770-L (manufactured by Sumitomo Bakelite Co., Ltd.) 65 is filled and cured by transfer molding. When the mold 64 is released, an insulating substrate 66 is formed. At this time, the insulating substrate 66 has a structure in which the adhesion layer 68 mainly formed by Ni plating is exposed on the surface layer, and the peeled portion is embedded in the inside by penetration of the molding resin 65.
In the case of this method, since the adhesion is relative to the materials that are in close contact with each other, when a material that has excellent adhesion to the conductive wiring 62 of the transfer plate 60 is used, the surface of the transfer plate 60 is exposed. A release layer may be provided to reduce the wiring adhesion, and similar results can be obtained by doing so. Further, different materials such as the adhesion layer 68 do not necessarily have a layer structure, and the same effect can be obtained by providing a difference in surface roughness, for example.
Example 6 is an example of a method for manufacturing an insulating substrate 66 as a molded body. The transfer plate 60 is pressed against an insulating structure that generates fluidity by heating or application of pressure, and is in close contact with the transfer plate 60. It is also possible to form the wiring board by releasing the mold after the insulating material is infiltrated into the wiring peeling portion having a small force and cured.

Example 7 is schematically shown in FIG. 7 (Example 7 corresponds to claim 14).
In the same manner as in Example 6, after forming conductive wiring 72 in a pattern shape by electrolytic plating, an epoxy-based conductive adhesive is supplied to connection terminal portion 79 by a dispenser, and then a functional component (for example, a semiconductor chip) ) 75 is connected to the conductive wiring 72 (wiring pattern) on the mold via the conductive adhesive, and the adhesive is cured by heating at 150 ° C. for 1 hour. Thereafter, as in Example 6, the epoxy resin G770-L (manufactured by Sumitomo Bakelite Co., Ltd.) is filled, molded by transfer molding and cured, and the mold is released to enclose the functional component 75 in the molded body. As a result, an insulating substrate 76 having a patterned conductive wiring 72 exposed on the surface is obtained.
In the seventh embodiment, the connection material is supplied by dispensing. However, it is also possible to use a method of supplying solder onto the conductive wiring or functional component by plating or a method of mounting a functional component equipped with solder bumps. .

FIG. 2 is a schematic diagram of Example 1. FIG. 3 is a schematic diagram of Example 2. FIG. 3 is a schematic diagram of Example 3. (A) is typical top view of Example 4, (b) is BB sectional drawing in Fig. (A). (A) is a typical top view of Example 5, (b) is BB sectional drawing in Fig. (A). FIG. 4 is a schematic diagram of Example 6. Is a schematic diagram of Example 7.

Explanation of symbols

1, 2: Wiring structure 10: Transfer plate 11: Polyimide layer
12: conductive wiring 13: mixed layer 14: mold 15: thermosetting epoxy resin 16: insulating substrate 21: resist layer 22: conductive wiring 23: mixed layer 25: liquid crystal polymer 26: insulating substrate

Claims (14)

  A wiring structure, wherein a mixed layer made of a metal and a resin is formed in a pattern, and the mixed layer exists between a wiring and an insulating substrate.   2. The wiring structure according to claim 1, wherein the mixed layer itself has conductivity.   2. The wiring structure according to claim 1, wherein the metal contained in the mixed layer is the same as the metal used for the wiring.   2. The wiring structure according to claim 1, wherein the resin contained in the mixed layer is the same as the resin used for the insulating substrate.   5. The wiring structure according to claim 4, wherein the resin is a thermoplastic resin.   The wiring structure according to claim 1, wherein the mixed layer is formed by eutectoid plating.   2. The wiring structure according to claim 1, wherein the wiring surface layer forms the same surface as a resin surface constituting the structure.   2. The wiring structure according to claim 1, wherein functional parts are mounted therein.   A wiring structure comprising a conductive pattern on an insulating substrate, wherein a part of the conductive wiring is completely embedded in the insulating substrate.   10. The wiring structure according to claim 9, wherein the conductive wiring forms the same surface as the insulating substrate surface layer.   The wiring structure according to claim 9, wherein an end portion of the conductive wiring is embedded.   10. The wiring structure according to claim 9, wherein a portion between the conductive wirings is buried.   A wiring transfer plate, wherein a conductive pattern is formed on a transfer plate, and a close contact portion between the conductive pattern and the transfer plate is composed of two or more different regions with respect to the conductive wiring.   The wiring structure according to claim 9, wherein the wiring structure has a functional component therein.

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