JP2013235878A - Electronic component mounting substrate, case unit, and manufacturing method of electronic component mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate which is manufactured in an easy process while maintaining excellent heat radiation characteristics, a case unit housing the electronic component mounting substrate, and a manufacturing method of the electronic component mounting substrate.SOLUTION: An electronic component mounting substrate 10 is composed of: a substrate 20 where at least a part is formed by a metal; an insulation layer 12 formed on the substrate; and a conductor layer 13 formed on the insulation layer 12. The electronic component mounting substrate 10 has a linear shape formed by forming multiple electronic component mounting parts along a longitudinal direction (a Y axis direction). At least a part of a cross section is formed into a substantially M shape when viewed in a transverse direction (an X axis direction), and a bottom surface 32a of a first recessed part 30 located at the center of the M shape forms the electronic component mounting part.

Description

  The present invention relates to an electronic component mounting board, a case unit, and an electronic component mounting board manufacturing method.

  A substrate on which electronic components are mounted (electronic component mounting substrate) preferably has high heat dissipation characteristics in order to prevent deterioration of the electronic components due to heat. For example, Patent Document 1 discloses one in which a part of an electronic component mounting substrate is formed of ceramic having excellent heat dissipation characteristics to improve heat dissipation characteristics.

JP 2005-166937 A

  Although the electronic component mounting substrate described in Patent Document 1 has excellent heat dissipation characteristics, a part of the electronic component mounting substrate is formed of ceramic, so that the manufacturing process becomes complicated.

  An object of the present invention is to provide an electronic component mounting substrate, a case unit, and an electronic component mounting substrate manufacturing method that can be manufactured by a simple process while maintaining excellent heat dissipation characteristics.

In order to achieve the above object, an electronic component mounting board according to the first aspect of the present invention includes:
A plurality of electronic component mounting portions are formed along the longitudinal direction, the substrate including at least a part of a metal, an insulating layer formed on the substrate, and a conductor layer formed on the insulating layer. A linear electronic component mounting board,
At least a part of the cross section in the short direction is formed to be substantially M-shaped,
The bottom surface of the first concave portion at the center of the M-shape constitutes the electronic component mounting portion.

  It is preferable that the wall surface sandwiching the bottom surface of the first recess functions as a reflector.

  The angle formed between the bottom surface of the first recess and the wall surface is preferably in the range of 120 ° to 150 °.

At least a part of the cross section in the longitudinal direction is formed to be substantially U-shaped,
It is preferable that the bottom surface of the second concave portion at the center of the U-shape coincides with the bottom surface of the first concave portion.

  It is preferable that the wall surface sandwiching the bottom surface of the second recess functions as a reflector.

  The angle formed between the bottom surface of the second recess and the wall surface is preferably in the range of 120 ° to 150 °.

  The thickness of the substrate at the bottom of the first recess is preferably greater than the thickness of the substrate at the wall of the first recess.

  It is preferable that metal portions of the substrate are exposed at both end surfaces in the short direction.

A first extending portion formed to extend downward from an upper end of the wall surface of the first recess in the short direction;
A second extending portion formed by bending inward from the first extending portion in the short direction;
It is preferable to have.

  It is preferable that the end surface of the second extending portion is bent so as to face upward.

The conductor layer has wiring for electronic components,
One first end of the wiring is disposed on the bottom surface of the first recess,
Preferably, a first conductor pad is formed on the first end of the wiring.

The other second end of the wiring is pulled out from the bottom surface of the first recess, and is disposed in the first extending portion,
A second conductor pad is formed on the second end of the wiring,
It is preferable that the second end portion does not reach a bent portion between the first extending portion and the second extending portion.

  It is preferable that the wiring is covered with a solder resist except in the vicinity of a portion where the first conductor pad is formed.

  The solder resist is preferably made of a material that reflects light.

The substrate is made of aluminum and is formed from a plate member having a maximum thickness of 0.1 to 0.5 mm.
It is preferable to have elasticity that expands and contracts in the short direction.

  The substrate preferably includes a base substrate and a reflective film formed on the base substrate.

The reflective film is made of silver,
The base substrate is preferably made of copper.

The case unit according to the second aspect of the present invention is:
An electronic component mounting board according to a first aspect;
A fitting portion for fitting at least both ends in the longitudinal direction of the electronic component mounting board is formed, and a case in which the electronic component mounting board is stored;
A case unit having
The electronic component mounting board is fixed to the case by the fitting portion.

An electronic component mounting board according to a third aspect of the present invention is:
An electronic component mounting board comprising a substrate made of at least a part of a metal, an insulating layer formed on the substrate, and a conductor layer formed on the insulating layer, wherein an electronic component mounting portion is formed. There,
One cross section is formed to be substantially M-shaped,
The bottom surface of the central concave portion of the M-shape constitutes the electronic component mounting portion.

An electronic component mounting board manufacturing method according to a fourth aspect of the present invention includes:
A method of manufacturing a linear electronic component mounting board in which a plurality of electronic component mounting portions are formed along the longitudinal direction,
Preparing a substrate at least partially made of metal;
Forming a conductor layer on the substrate via an insulating layer made of an adhesive;
Pressing at least a part of the cross section of the substrate in the short direction so as to be substantially M-shaped, and setting the bottom surface of the first concave portion at the center of the M-shape as the electronic component mounting portion; ,
including,
It is characterized by that.

  In the pressing process, it is preferable that the first recess is formed by an overhanging process.

In the formation of the conductor layer,
While adhering a part of the conductor layer to the central part of the short side direction of the substrate, the part other than the part of the conductor layer is not adhered to the substrate,
It is preferable that the unbonded portion of the conductor layer slides on the substrate with the overhanging process.

  In the press working, it is preferable that an angle formed by the bottom surface and the wall surface of the first recess is in a range of 120 ° to 150 °.

  In the pressing, it is preferable that the thickness of the substrate at the bottom of the first recess is larger than the thickness of the substrate at the wall of the first recess.

The press working is
In the short direction, a first press working to form a first extending portion extending downward from the upper end of the wall surface of the first recess;
A second press forming a second extending portion bent inward from the first extending portion in the short direction;
It is preferable to contain.

  The first press process and the second press process are each preferably a bending process.

  It is preferable that the end surface of the second extending portion is bent so as to face upward by the press work or after the press work.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electronic component mounting board | substrate which can be manufactured with a simple process, a case unit, and an electronic component mounting board | substrate can be provided, maintaining the outstanding heat dissipation characteristic.

It is a perspective view which shows the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention. It is a perspective view which expands and shows a part of FIG. It is a top view which expands and shows a part of FIG. It is AA sectional drawing of FIG. 2B. It is sectional drawing (the 1) which expands and shows a part of FIG. 3A. It is sectional drawing (the 2) which expands and shows a part of FIG. 3A. It is BB sectional drawing of FIG. 2B. It is sectional drawing which expands and shows a part of FIG. 4A. It is a top view which expands and shows a part of FIG. 2B. It is CC sectional drawing of FIG. 2B. It is sectional drawing which expands and shows the part pointed by the arrow E of FIG. It is sectional drawing which expands and shows the part pointed by the arrow F of FIG. It is DD sectional drawing of FIG. 2B. It is sectional drawing (the 1) which expands and shows a part of FIG. 9A. It is sectional drawing (the 2) which expands and shows a part of FIG. 9A. In the manufacturing method of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention, it is a figure which shows the starting material which consists of aluminum foil. It is a figure for demonstrating the process of arrange | positioning a conductor member on the aluminum foil shown to FIG. 10A. It is a figure for demonstrating the process of performing an overhang | projection process to the aluminum foil shown to FIG. 10B. It is a figure of the transversal direction for demonstrating the process of forming a cavity in the aluminum foil shown to FIG. 11A. It is a figure of the longitudinal direction for demonstrating the process of forming a cavity in the aluminum foil shown to FIG. 11A. It is a figure for demonstrating the process of performing a 1st bending process to the aluminum foil shown to FIG. 11B. It is a figure for demonstrating the process of performing a 2nd bending process on the aluminum foil shown in FIG. It is a figure for demonstrating the process of performing the 3rd bending process on the aluminum foil shown in FIG. It is a figure for demonstrating the process of performing a lamination process to the board | substrate and conductor layer which are shown in FIG. It is a figure for demonstrating the process of adhere | attaching the board | substrate and conductor layer which are shown to FIG. 15A. It is a figure for demonstrating the process of forming a soldering resist. It is a figure for demonstrating the process of forming a conductor pad. It is a top view which shows the electronic component mounting board | substrate with which the light emitting element was mounted. It is sectional drawing which shows the light-emitting device using an electronic component mounting board | substrate. It is a perspective view which shows the case unit which concerns on Embodiment 2 of this invention. 10 is a plan view showing a case unit according to Embodiment 2. FIG. It is a figure which shows the modification of the case unit which concerns on Embodiment 2. FIG. It is a perspective view which shows the electronic component mounting board | substrate which concerns on Embodiment 3 of this invention. It is a top view for demonstrating the dimension of the electronic component mounting board | substrate which concerns on Embodiment 3, and a cavity. It is sectional drawing of the transversal direction of the electronic component mounting board | substrate which concerns on Embodiment 3. FIG. It is sectional drawing of the longitudinal direction of the electronic component mounting board | substrate which concerns on Embodiment 3. FIG. It is FIG. (1) for demonstrating the manufacturing method of the electronic component mounting board | substrate which concerns on Embodiment 3. FIG. FIG. 11 is a diagram (No. 2) for explaining the method of manufacturing the electronic component mounting board according to the third embodiment. It is sectional drawing of the transversal direction of the mounting part of the electronic component mounting board | substrate which concerns on Embodiment 4 of this invention. It is a perspective view of the electronic component mounting board | substrate which concerns on Embodiment 5 of this invention.

(Embodiment 1)
Hereinafter, an electronic component mounting board 10 according to Embodiment 1 of the present invention will be described with reference to FIGS. In the figure, the Y-axis direction corresponds to the longitudinal direction of the electronic component mounting substrate 10, and the X-axis direction corresponds to the short direction of the electronic component mounting substrate 10. In the drawing, the + Z direction corresponds to the upper side of the electronic component mounting board 10, and the −Z direction corresponds to the lower side of the electronic component mounting board 10.

  FIG. 1 is a perspective view showing an electronic component mounting board 10 according to Embodiment 1 of the present invention. As shown in FIG. 1, the electronic component mounting substrate 10 is formed in a linear shape.

  2A is an enlarged perspective view showing a part of FIG. 1, and FIG. 2B is a plan view showing an enlarged part of FIG. As shown in FIGS. 2A and 2B, the electronic component mounting substrate 10 includes one of a substrate 20, an insulating layer 12, a conductor layer 13, a first conductor pad 14, a second conductor pad 15, and a conductor layer 13. And a solder resist 16 covering the portion.

  The substrate 20 is formed, for example, by press molding a metal foil. The substrate 20 has a plurality of mounting portions P1 and a plurality of connecting portions P2. The mounting parts P1 and the connecting parts P2 are alternately arranged along the Y-axis direction (longitudinal direction of the linear outer shape). The mounting part P1 is a part on which electronic components (for example, LEDs) are mounted. The connecting part P2 is located between the adjacent mounting parts P1, and connects the mounting parts P1 to each other. The number of mounting parts P1 is 71, for example.

FIG. 3A is a cross-sectional view taken along the line AA in FIG. 3B and 3C are partially enlarged views of FIG. 3A.
The cross section in the short direction of the mounting portion P1 is formed to be substantially M-shaped as shown in FIG. 3A. The M-shaped central first concave portion 30 includes a bottom portion 32 and wall portions 33 and 34. The bottom surface 32a of the first recess 30 constitutes an electronic component mounting part for mounting an electronic component. The cross section of the mounting portion P1 in the short direction is formed symmetrically with respect to the short direction about the bottom portion 32. The bottom surface 32a is sandwiched between a + X side wall surface 33a and a -X side wall surface 34a. The wall surfaces 33a and 34a function as a reflector when an electronic component is mounted on the bottom surface 32a. The reflectance of the reflector constituted by the wall surfaces 33a and 34a is, for example, 80% or more for light having a wavelength of 400 mm to 700 mm. More preferably, it is 92% or more. When the reflectance of the reflector is 92% or more, the irradiation performance of the electronic component mounting board 10 on which the electronic component (LED) is mounted can be improved. The angle θ1 formed by the wall surfaces 33a, 34a and the bottom surface 32a is in the range of 120 ° to 150 °. Preferably, it exists in the range of 130 degrees-140 degrees. When the angle θ1 is within this range, the light emitted from the electronic component can be gathered upward, and the directivity of the light can be improved. The bottom 32 of the first recess 30 is formed such that its thickness T1 is greater than the thickness T2 of the walls 33 and 34 of the first recess 30.

  First extending portions 40 and 41 are formed on the upper ends E1 and E2 (+ Z side ends) of the wall surfaces 33a and 34a of the first recess 30, respectively. The first extending portion 40 is formed so as to be directed downward (−Z direction) from the upper end E1 (+ Z side end) of the wall surface 33a. Similarly, the first extending portion 41 is formed so as to be directed downward (−Z direction) from the upper end E2 (+ Z side end) of the wall surface 34a. In addition, the downward direction indicates a direction opposite to the opening direction of the mounting portion P1. Further, a second extending portion 42 formed by bending inwardly (-X direction) from the first extending portion 40 is formed at the lower end E3 (−Z side end) of the first extending portion 40. Has been. Similarly, a second extending portion 43 formed by bending inward (+ X direction) from the first extending portion 41 is formed at the lower end E4 (−Z side end) of the first extending portion 41. Has been. End surfaces 42a and 43a of these second extending portions 42 and 43 are bent so as to face upward (+ Z direction). Note that “up” indicates the opening direction of the mounting portion P1.

4A is a cross-sectional view taken along the line BB in FIG. 2B (a cross-sectional view in the longitudinal direction of the electronic component mounting substrate 10). 4B is an enlarged cross-sectional view of a part of FIG. 4A.
As shown in FIGS. 4A and 4B, a part of the cross section in the longitudinal direction of the electronic component mounting substrate 10 is formed to have a substantially U shape. The U-shaped central second concave portion 31 includes a bottom portion 32 and wall portions 35 and 36. The bottom surface 32a of the second recess 31 coincides with the bottom surface 32a of the first recess 30 at the center of the M shape. The bottom surface 32a is sandwiched between a -Y side wall surface 35a and a + Y side wall surface 36a. The wall surfaces 35a and 36a function as a reflector when an electronic component is mounted on the bottom surface 32a. The reflectance of the reflector constituted by the wall surfaces 35a and 36a is, for example, 80% or more for light having a wavelength of 400 to 700 mm. More preferably, it is 92% or more. When the reflectance of the reflector is 92% or more, the irradiation performance of the electronic component mounting board 10 on which the electronic component (LED) is mounted can be improved. An angle θ2 formed by the bottom surface 32a and the wall surfaces 35a and 36a is in a range of 120 ° to 150 °. Preferably, it exists in the range of 130 degrees-140 degrees. When the angle θ2 is within this range, the light emitted from the electronic component can be collected upward, and the directivity of the light can be enhanced. The bottom 32 of the second recess 31 is formed such that its thickness T1 is larger than the thickness T3 of the walls 35 and 36 of the second recess 31. Further, the thickness T3 of the wall portions 35 and 36 of the second recess 31 is equal to the thickness T2 of the walls 33 and 34 of the first recess 30.

FIG. 5 is an enlarged cross-sectional view of a part of FIG. 2B.
In the electronic component mounting substrate 10 of the present embodiment, as shown in FIGS. 3A, 4B, and 5, the space defined by the bottom surface 32a and the wall surfaces 33a, 34a, 35a, 36a is a cavity R. The shape of the cavity R is, for example, a truncated pyramid shape. However, it is not restricted to this, The shape of the cavity R is arbitrary, For example, a rectangular parallelepiped may be sufficient.

  Hereinafter, preferable dimensions of the electronic component mounting substrate 10 and the cavity R will be described with reference to FIGS. 4B and 5. Of the dimensions of the cavity R, the dimension in the longitudinal direction (Y-axis direction) is referred to as the length, and the dimension in the short direction (X-axis direction) is referred to as the width.

  In FIG. 5, the total length L (longitudinal dimension) of the electronic component mounting board 10 is, for example, 200 to 1500 mm, and the width W (short dimension) of the electronic component mounting board 10 is, for example, 3.0. -7.0 mm. In FIG. 4B, the thickness d16 of the electronic component mounting substrate 10 is, for example, 0.5 to 2.0 mm.

  In FIG. 5, the length d11 of the cavity R (= the length of the mounting portion P1) is, for example, 2.0 to 4.0 mm. The length d12 of the bottom surface 32a of the cavity R is, for example, 0.6 to 2.0 mm, the width d21 of the cavity R is, for example, 1.5 to 6.0 mm, and the width d22 of the bottom surface 32a of the cavity R. Is, for example, 0.2 to 0.7 mm. An interval d13 (= length of the connecting portion P2) between the adjacent cavities R is, for example, 0.2 to 1.5 mm. The pitch d14 of the cavities R in the longitudinal direction is, for example, 2.5 to 5.5 mm. Further, in FIG. 4B, the depth d15 of the cavity R is, for example, 0.5 to 1.2 mm. However, the depth d15 of the cavity R is smaller than the thickness d16 of the electronic component mounting board 10. In the present embodiment, all the cavities R are formed with the same dimensions. However, the present invention is not limited to this, and some of the plurality of cavities R included in the electronic component mounting substrate 10 may have dimensions different from those of the others.

  6 is a cross-sectional view taken along the line C-C in FIG. As shown in FIG. 6, the cross section of the connecting portion P2 in the short direction is formed to have a substantially C shape, and the connecting portion P2 does not have the cavity R and is different from the mounting portion P1. Is different. The connecting portion P2 has an upper surface 45 parallel to the XY plane. The cross section in the short direction of the connecting portion P2 is formed symmetrically in the short direction with the upper surface 45 as the center. First extending portions 40 and 41 are formed on the + X side end portion and the −X side end portion of the upper surface 45, respectively. Further, second extending portions 42 and 43 formed by bending inward from the first extending portions 40 and 41 are formed at lower ends (ends on the −Z side) of the first extending portions 40 and 41. Has been. End surfaces 42a, 43a of the second extending portions 42, 43 are bent so as to face upward (+ Z direction).

  FIG. 7 is an enlarged cross-sectional view showing the surface on the + Z side of the substrate 20 (a cross-sectional view showing an enlarged portion indicated by an arrow E in FIG. 6). As the substrate 20, for example, MIRO (registered trademark) of Aranod, aluminum reflector Vega (trademark) of Armeco, etc. can be used. As shown in FIG. 7, the substrate 20 includes a base substrate 21 and a reflective film 23 formed on the base substrate 21. Note that the intermediate layer 22 may be provided when the bonding property between the base substrate 21 and the reflective film 23 is poor.

  The base substrate 21 is made of aluminum, for example. However, the base substrate 21 is not limited to this, and the base substrate 21 has malleability and ductility, is easily bent, and is a material excellent in workability, durability, or the like, and a metal other than aluminum (Al) (copper (Cu ), Silver (Ag), nickel (Ni), etc.). Moreover, you may consist of nonmetals. In the embodiment of the present invention, the metal includes a metal or an alloy containing a small amount of impurities other than the metal.

  The reflective film 23 is formed, for example, by subjecting the + Z side surface of the base substrate 21 to an alumite treatment. However, the method is not limited to this, and the method of forming the reflective film 23 is arbitrary. By forming the reflective film 23 by alumite treatment, the corrosion resistance can be improved.

  The reflective film 23 may be configured by laminating a reflective film body 24 and a coating film 25 on the base substrate 21. Since the coating film 25 is provided, it is possible to prevent the reflection film main body from being deteriorated.

  The reflective film body 24 is made of, for example, aluminum having a purity of 99.9% or more. However, the present invention is not limited to this, and a metal other than aluminum (copper (Cu), silver (Ag), nickel (Ni), etc.) may be used, or a nonmetal may be used. The reflective film body 24 is formed by, for example, a vacuum deposition method. However, the present invention is not limited to this, and it may be formed by a CVD (Chemical Vapor Deposition) method, a sputtering method, or the like.

  In the present embodiment, both the base substrate 21 and the reflective film body 24 are made of aluminum. That is, the base substrate 21 and the reflective film body 24 are made of the same metal species. However, the present invention is not limited to this, and the base substrate 21 and the reflective film body 24 may be made of different metal species. For example, the base substrate 21 may be made of copper, and the reflective film body 24 may be made of silver having a purity of 99.9% or more. In this case, the intermediate layer 22 may be made of nickel.

The coating film 25 is an insulating film. The coating film 25 is configured, for example, by laminating a titanium dioxide (TiO ₂ ) film 25 a and a silicon dioxide (SiO ₂ ) film 25 _b on the reflective film body 24. Specifically, the silicon dioxide film 25b is formed on the reflective film body 24, and the titanium dioxide film 25a is formed on the silicon dioxide film 25b. The coating film 25 improves the reflectivity and durability of the reflective film body 24.
In addition, the coating film 25 can use a thin transparent urethane resin or silicone resin of about 1 to 10 μm. This is because these urethane resins and silicone resins are rich in ductility and do not break even when stretched by 10% to 50%.

  The angle θ3 formed by the direction of the second extending portions 42 and 43 and the XY plane is within a range of 15 to 90 °, for example, as shown in FIGS. 3B and 3C. If the angle θ3 is less than 15 °, when the electronic component mounting substrate 10 is mounted on another substrate, the other substrate and the metal portion exposed from the end faces 42a and 43a of the second extending portions 42 and 43 (substrate 20). This is because the base substrate 21 and the reflecting film body 24) are close to each other, so that it is necessary to consider not to short-circuit. On the other hand, when the angle θ3 exceeds 90 °, the reflective film 23 on the surfaces of the lower ends E3 and E4 of the first extending portions 40 and 41 is likely to be cracked, and solder used for mounting the electronic component mounting substrate 10 or the like. This is because the risk of conduction with the bonding material increases.

  Hereinafter, the preferable dimension of the board | substrate 20 is demonstrated using FIG. The thickness d42 of the reflective film body 24 is, for example, 0.3 to 0.6 μm. The thickness d43 of the silicon dioxide film 25b of the coating film 25 is, for example, 0.2 to 0.3 μm, and the thickness d44 of the titanium dioxide film 25a of the coating film 25 is, for example, 0.1 to 0.15 μm. is there.

  FIG. 8 is an enlarged cross-sectional view showing the surface of the substrate 20 (a cross-sectional view showing an enlarged portion indicated by an arrow F in FIG. 6). As shown in FIG. 8, the metal portion of the substrate 20 configured as described above is exposed at both end surfaces in the short direction. Specifically, the base substrate 21 and the reflective film main body 24 of the substrate 20 are exposed from the end face 42 a of the second extending portion 42. Similarly, the base substrate 21 and the reflective film main body 24 of the substrate 20 are also exposed from the end face 43 a of the second extending portion 43. In the case of the present embodiment, the substrate 20 (metal foil) before being pressed can be easily obtained by, for example, cutting a predetermined dimension from a metal plate having a large area.

9A is a cross-sectional view taken along the line DD of FIG. FIG. 9B is an enlarged cross-sectional view (part 1) of a part of FIG. 9A. FIG. 9C is an enlarged cross-sectional view (part 2) of a part of FIG. 9A.
The insulating layer 12 is formed on the substrate 20 as shown in FIGS. 9A to 9C. The insulating layer 12 is made of, for example, an adhesive material. The insulating layer 12 preferably has a first component that increases adhesion and a second component that increases flexibility. With such a configuration, the insulating layer 12 having both adhesiveness and flexibility can be easily formed. The first component is preferably at least one of methacrylic acid, methyl methacrylate, and glycidyl methacrylate, and the second component is an olefin resin (such as polyethylene or polypropylene), a fluorine resin, and a silicone resin. It is preferable that it is at least one of these. In the present embodiment, the insulating layer 12 is made of a copolymer of polyethylene (first component) and methyl methacrylate (second component). The ratio (weight ratio) of polyethylene contained in the copolymer is, for example, in the range of 75 to 95%. When the proportion of polyethylene contained in the copolymer is less than 75%, the insulating layer 12 is likely to be discolored by the light emitted from the LED, the reflectance is lowered, and the color of the emitted light is changed. When the ratio of polyethylene contained in the copolymer exceeds 95%, the insulating layer 12 is easily deformed by heat, and is easily short-circuited. However, it is not restricted to this, The material of the insulating layer 12 is arbitrary.

  The conductor layer 13 is formed on the insulating layer 12. The conductor layer 13 is made of, for example, copper. However, it is not restricted to this, The material of the conductor layer 13 is arbitrary. Moreover, the conductor layer 13 has the wiring 13a (conductor pattern) of an electronic component, as shown in FIG. One first end 13 b of the wiring 13 a is disposed on the bottom surface 32 a of the first recess 30. As shown in FIG. 9A, the other second end 13c of the wiring 13a is drawn out from the bottom surface 32a of the first recess 30 and disposed in the second extending portions 42 and 43. The second end portion 13 c is formed so as not to reach the bent portion 1001 a between the first extending portions 40 and 41 and the second extending portions 42 and 43. That is, the lowermost end of the second end portion 13c is at a position higher than the lower ends E3 and E4 of the first extending portions 40 and 41. When the electronic component mounting substrate 10 is installed on the XY plane, the height H from the XY plane to the lowest end of the second end portion 13c is, for example, approximately 0.2 mm.

  As shown in FIG. 9B, the first conductor pad 14 is formed on the first end portion 13b of the wiring 13a. The 1st conductor pad 14 is comprised from the pad part main body 14a and the coating | coated part 14b which covers the surface of the pad part main body 14a. The pad portion main body 14a is made of, for example, nickel (Ni), and the covering portion 14b is made of, for example, gold (Au). The first conductor pads 14 are formed to partially harden the surface of the conductor layer 13 and facilitate wire bonding. The material of the first conductor pad 14 is arbitrary.

  As shown in FIG. 9C, the second conductor pad 15 is formed on the second end portion 13c of the wiring 13a. Similar to the first conductor pad 14, the second conductor pad 15 includes a pad portion main body 15a and a covering portion 15b that covers the surface of the pad portion main body 15a. The pad portion main body 15a is made of, for example, nickel (Ni), and the covering portion 15b is made of, for example, gold (Au). The second conductor pad 15 is formed to partially harden the surface of the conductor layer 13 and facilitate wire bonding. The material of the second conductor pad 15 is arbitrary.

  As shown in FIGS. 5, 9A, and 9B, the solder resist 16 is an insulating layer that covers the wiring 13a and prevents current leakage. The solder resist 16 is made of a white material that reflects light in the visible light region, and covers the wiring 13a except in the vicinity of the portion where the first conductor pad 14 and the second conductor pad 15 are formed. Further, as can be seen with reference to FIG. 5, the solder resist 16 is formed so that the area thereof is as small as possible with respect to the total area of the portion functioning as the reflector in the electronic component mounting substrate 10. . Specifically, the area of the solder resist 16 is the total area of the portion functioning as a reflector (the total of the area of the bottom surface 32a excluding the area where the electronic component is mounted and the area of the wall surfaces 33a, 34a, 35a, 36a). ) To 20% or less. By reducing the area of the solder resist 16 as much as possible, the reflectance of the electronic component mounting substrate 10 is prevented from decreasing as a whole. Moreover, the reflectance of the material of the solder resist 16 is reduced by 75% when, for example, 40000 hours have passed. On the other hand, since the reflectance of the reflective film 23 of the substrate 20 is reduced only by 5% even after 40000 hours, the reflectance of the material of the solder resist 16 is greatly reduced. In the present embodiment, since the area of the solder resist 16 in plan view is made as small as possible, the reflectance of the electronic component mounting board 10 after a certain time has also been prevented from decreasing as a whole.

  Hereinafter, a method for manufacturing the electronic component mounting substrate 10 according to the present embodiment will be described with reference to FIGS. 10A to 17.

First, as shown to FIG. 10A, the aluminum foil 1001 (plate member) which makes an X-axis direction a longitudinal direction is prepared. The aluminum foil 1001 includes a base substrate 21, an intermediate layer 22 formed on the + Z side surface of the base substrate 21, and a reflective film 23 formed on the + Z side surface of the intermediate layer 22. The thickness T0 of the aluminum foil 1001 is, for example, in the range of 0.1 to 0.5 mm. The thickness T0 of the aluminum foil 1001 is preferably 0.2 mm.
Subsequently, the prepared aluminum foil 1001 is subjected to heat treatment. Thereby, the aluminum foil 1001 becomes soft to H10. The temperature of the heat treatment is preferably lower than the annealing temperature of the base substrate 21 of the aluminum foil 1001. In this embodiment, heating is performed at a temperature lower than the annealing temperature (500 ° C.) of aluminum. Specifically, in this embodiment, heating was performed at 230 ° C. for 24 hours. As a result, the ductility of the aluminum foil 1001 increased, and a cavity R having a depth of about 1 mm could be formed during the overhanging process described later.

  Subsequently, as illustrated in FIG. 10B, the conductor member 1003 is disposed on the aluminum foil 1001 via the adhesive material 1002. The adhesive 1002 is made of, for example, a copolymer of polyethylene (first component) and methyl methacrylate (second component). The conductor member 1003 is made of copper foil. At this time, a part of the conductor member 1003 is bonded to the vicinity of the center of the aluminum foil 1001 in the short direction. Specifically, the end of the conductor member 1003 is bonded to the vicinity of the center of the aluminum foil 1001 in the short direction. The portions other than the bonded end portions are not bonded to the aluminum foil 1001. Hereinafter, a portion of the conductor member 1003 that is bonded to the aluminum foil 1001 is referred to as an bonded portion 1003a, and a portion that is not bonded to the aluminum foil 1001 is referred to as an unbonded portion 1003b.

  Subsequently, as shown in FIG. 11A and FIG. 11B, an overhanging process is performed using a mold 1010 having a convex portion corresponding to the cavity R (first concave portion 30). Thereby, the cavity R is formed in the aluminum foil 1001. The elongation ratio of the material of the walls 33, 34, 35, and 36 of the cavity R during the overhanging process is approximately 40%. By extending the material from the state before processing, the thickness T2 of the wall portions 33 and 34 and the thickness T3 of the wall portions 35 and 36 are reduced. As the cavity R is formed, the bonding portion 1003a of the conductor member 1003 bonded to the vicinity of the center of the aluminum foil 1001 in the short direction is drawn into the cavity R. Along with the movement of the bonded portion 1003a, the unbonded portion 1003b is pulled in the direction in the cavity R while sliding on the + Z side surface of the aluminum foil 1001. When the unbonded portion 1003b is slid during the overhanging process, the conductor member 1003 can be prevented from being damaged. In this embodiment, as shown in FIG. 11C, the mold 1010 has four convex portions along the longitudinal direction (Y-axis direction), and four cavities R are formed simultaneously. However, the number of convex portions formed on the mold 1010 is arbitrary. Three or less may be sufficient and five or more may be sufficient.

  Subsequently, as shown in FIG. 12, the end portion in the short direction of the aluminum foil 1001 in which the cavity R is formed is bent using a mold 1011 formed so that the pressing surface is a curved surface. Do. By moving the mold 1011 in the −Z direction, both ends of the aluminum foil 1001 in the short direction are bent along the pressing surface of the mold 1011. Thereby, the bending part 1001a is formed in the aluminum foil 1001. The elongation percentage of the material of the bent portion 1001a formed by the mold 1011 is approximately 10%.

  Subsequently, as shown in FIG. 13, the aluminum foil 1001 is bent by pressing both ends in the short direction of the conductor member 1003 from the upper side (+ Z side) with the mold 1012. The pressing surface of the mold 1012 is an inclined surface provided at an angle of about 45 ° with respect to the XY plane. By moving the mold 1012 in the −Z direction, a bent portion 1001b is formed inside the bent portion 1001a of the aluminum foil 1001. The conductor member 1003 also has a bent portion corresponding to the bent portion 1001b. The elongation percentage of the material of the bent part 1001b formed by the mold 1012 is approximately 10%.

  Subsequently, as shown in FIG. 14, the end of the conductor member 1003 opposite to the bonded portion 1003 a is pressed from the side with a mold 1013 to bend the aluminum foil 1001. For example, the mold 1013 is provided so as to move to the side as the mold 1014 moves from above. By moving the mold 1013 to the side, the bending angle of the bent portion 1001b of the aluminum foil 1001 is further increased. The elongation percentage of the material of the bent part 1001b accompanying the bending process of the mold 1013 is approximately 20%. By the bending process, the end faces 42a and 43a of the second extending portions 42 and 43 are bent so as to face upward (+ Z direction). The angle formed by the direction of the end faces 42a and 43a and the XY plane is, for example, in the range of 15 ° to 90 °. Further, after this, bending may be performed so that the end faces 42a and 43a face upward (+ Z direction).

  By performing the above three types of bending processes, the substrate 20 having the first extending portions 40 and 41 and the second extending portions 42 and 43 is formed at both ends in the short direction. In the embodiment of the present invention, the pressing includes bending and overhanging.

  Subsequently, as shown in FIGS. 15A and 15B, the conductor layer 13 is bonded to the substrate 20 by a vacuum laminator. For example, as shown to FIG. 15A, it arrange | positions in the chamber 1015 of a vacuum laminator. Then, the non-bonded portion 1003 b of the conductor member 1003 is bonded to the substrate 20 by making the chamber 1015 into a vacuum state. As a result, all the parts of the conductor member 1003 are bonded to the substrate 20, and the insulating layer 12 is formed on the substrate 20 and the conductor layer 13 is formed on the insulating layer 12 as shown in FIG. 15B. The The second end portion 13c of the conductor layer 13 is formed so as not to reach the bent portion 1001a.

  Subsequently, as shown in FIG. 16, a solder resist 16 is formed on the conductor layer 13. For example, a liquid or dry film photosensitive resist is applied or laminated on the substrate 20. Then, the mask film is brought into close contact with the surface of the photosensitive resist. Subsequently, the photosensitive resist is exposed to ultraviolet light and developed with an aqueous alkaline solution. Thereby, the solder resist 16 is formed on the conductor layer 13. In addition to this, the solder resist 16 can also employ a method of directly covering the conductor layer 13 and the vicinity of the conductor layer 13 by inkjet printing or a dispenser. The solder resist 16 is made of, for example, a material that reflects light in the visible light region.

  Subsequently, as shown in FIG. 17, the first conductor pad 14 is formed on the first end portion 13 b of the conductor layer 13, and the second conductor pad 15 is formed on the second end portion 13 c of the conductor layer 13. Form. The first conductor pad 14 and the second conductor pad 15 are formed by plating, for example. Thus, the electronic component mounting board 10 is completed.

  The first conductor pad 14 and the second conductor pad 15 may be formed on the conductor member 1003 in advance. Specifically, after a dry film is formed on the conductor member 1003, an opening is provided at a necessary place by exposure and development. In this opening, Ni plating with a thickness of 20 μm or more and gold plating with a thickness of 0.5 μm or more are formed. The thickness of the Ni plating is preferably at least 10 μm. When the thickness of the Ni plating is 10 μm or more, it is possible to use a soft copper foil as the conductor member 1003. In addition, the soft insulating layer 12 is hardly affected. Further, it is possible to facilitate bonding of a wire such as a gold wire extending from an electronic component (for example, LED). Desirably, if the thickness of the Ni plating is 15 μm, more desirably 20 μm, good bonding can be achieved. The conductor member 1003 in which the first conductor pad 14 and the second conductor pad 15 are formed in this manner is partially machined, for example, cut by a Thomson die and attached to the substrate 20.

Hereinafter, the light emitting device 100 as an example of use of the electronic component mounting substrate 10 according to the first embodiment will be described. FIG. 18A is a plan view of the electronic component mounting board 10 on which the light emitting element 110 is mounted. FIG. 18B is a cross-sectional view showing a light emitting device 100 using the electronic component mounting board 10.
The light emitting device 100 includes the electronic component mounting substrate 10 described above, a plurality of light emitting elements 110, and a wiring substrate 120 for mounting the electronic component mounting substrate 10.

  As shown in FIG. 18A, the light emitting element 110 is mounted on each mounting portion P <b> 1 of the electronic component mounting substrate 10. The light emitting element 110 is made of, for example, a blue LED. However, the present invention is not limited to this, and instead of the blue LED, another color LED, EL (Electro Luminescence), or laser diode may be used as the light emitting element 110. The light emitting element 110 is electrically connected to the first conductor pad 14 by wire bonding. The wire 111 for wire bonding is made of, for example, gold (Au). However, the mounting method of the light emitting element 110 is not limited to this and is arbitrary.

  The electronic component mounting substrate 10 on which the light emitting element 110 is mounted is mounted on, for example, a wiring substrate 120 as shown in FIG. 18B. The conductor pattern formed on the upper surface of the wiring board 120 is electrically connected to the second conductor pad 15 by the solder 121. However, the mounting method of the electronic component mounting substrate 10 is not limited to this and is arbitrary. For example, wire bonding or the like may be used.

  In the first embodiment, the end faces 42a and 43a of the second extending portions 42 and 43 are bent so as to face upward (+ Z direction). Thereby, the metal part (the base substrate 21 of the board | substrate 20, the reflective film main body 24) exposed from the end surfaces 42a and 43a of the 2nd extension parts 42 and 43, and the conductor of the wiring board 120 with which the electronic component mounting board | substrate 10 was mounted. It becomes difficult for the pattern to conduct (short).

  In the first embodiment, the second end portion 13c of the conductor layer 13 is formed so as not to reach the bent portion between the first extending portions 40 and 41 and the second extending portions 42 and 43. Yes. This makes it difficult for the solder 121 to enter the second extending portions 42 and 43 during the soldering process. As a result, the second end portion 13c of the conductor layer 13 and the conductor pattern of the wiring board 120 on which the electronic component mounting board 10 is mounted are less likely to conduct (short-circuit).

  Thus, the light emitting device 100 is completed. The light emitting device 100 can be used as a lighting device, for example. However, the application of the light emitting device 100 is not limited to this, and is arbitrary.

  As described above, in the electronic component mounting substrate 10 according to the first embodiment, a part of the cross section in the short direction is pressed so as to be substantially M-shaped. For this reason, it can manufacture by a simple process, maintaining the outstanding heat dissipation characteristic. Further, since a part of the cross section in the longitudinal direction is pressed so as to be substantially U-shaped, similarly, it can be manufactured by a simple process while maintaining excellent heat dissipation characteristics.

  In addition, since a part of the cross section in the short direction is substantially M-shaped or substantially U-shaped, the electronic component mounting board 10 is easily elastically deformed in the short direction (elasticity in the short direction). Have). Thereby, the electronic component mounting substrate 10 can function as an elastic body that expands and contracts in the lateral direction. Since it can function as an elastic body, it can be easily held and easily handled in the process of mounting the electronic component mounting board 10 on the wiring board 120 or the like.

  In the first embodiment, the conductor layer 13 is formed only on one surface (the surface on the + Z side) of the substrate 20. For this reason, the structure can be simplified.

  In the first embodiment, the bottom surface 32a of the M-shaped central first concave portion 30 constitutes an electronic component mounting portion, and the wall surfaces 33a and 34a of the first concave portion 30 function as a reflector. In addition, the bottom surface 32a of the U-shaped central second concave portion 31 constitutes an electronic component mounting portion, and the wall surfaces 35a and 36a of the first concave portion 30 function as a reflector. For this reason, when the LED is mounted on the bottom surface 32a, finger light emitted from the LED can be efficiently dispersed. This makes it possible to emit light that is totally blurred. However, the components mounted on the bottom surface 32a are not limited to LEDs, and the same effects can be achieved as long as they are electronic components that emit light. Moreover, since the wall surfaces 33a, 34a, 35a, and 36a that function as reflectors are formed integrally with the substrate 20, material costs can be reduced compared to the case where the reflector is formed of another material or the like.

  In the first embodiment, the aluminum foil 1001 to be press-formed has the reflective film 23 in advance. For this reason, the process of forming a reflective film becomes unnecessary.

  In the first embodiment, the angle θ1 formed between the bottom surface 32a and the wall surfaces 33a, 34a and the angle θ2 formed between the bottom surface 32a and the wall surfaces 35a, 36a are in the range of 120 ° to 150 °, respectively. For this reason, when the LED is mounted on the bottom surface 32a, the light emitted from the side of the LED (the direction parallel to the XY plane) is reflected by the wall surfaces 33a, 34a, 35a, 36a, and upward (+ Z direction). ).

  In the first embodiment, since the thickness T1 of the bottom 32 of the first recess 30 is larger than the thickness T2 of the walls 33 and 34 of the first recess 30, the electronic component mounting constituted by the bottom surface 32a of the first recess 30 is used. The insulation of the part can be improved. Similarly, since the thickness T1 of the bottom 32 of the second recess 31 is larger than the thickness T3 of the walls 34 and 35 of the second recess 31, the insulation of the electronic component mounting portion formed by the bottom surface 32a of the second recess 31 is used. Can increase the sex.

  In the first embodiment, the substrate 20 has the reflective film 23 formed on the base substrate 21 via the intermediate layer 22. Thereby, the process of forming a reflection part on the bottom surface 32a on which the LED is mounted and the wall surfaces 33a, 34a, 35a, and 36a surrounding the bottom surface 32a becomes unnecessary.

  In the first embodiment, the reflective film 23 has an insulating coating film 25. This makes it difficult for the conductor layer 13 and the substrate 20 to conduct (short-circuit).

  In the first embodiment, the substrate 20 is formed from an aluminum foil 1001. For this reason, the electronic component mounting substrate 10 can function as an elastic body that expands and contracts in the short direction (has elasticity to expand and contract in the short direction). Since it can function as an elastic body, it can be easily held and easily handled in the process of mounting the electronic component mounting board 10 on the wiring board 120 or the like.

(Embodiment 2)
Next, a case unit 200 according to Embodiment 2 of the present invention will be described with reference to FIGS. 19A and 19B. In the figure, the Y-axis direction corresponds to the longitudinal direction of the case unit 200, and the X-axis direction corresponds to the short direction of the case unit 200.

  19A and 19B are views showing a case unit 200 according to Embodiment 2 of the present invention. The case unit 200 includes the electronic component mounting board 10 according to the first embodiment and a case 201 in which the electronic component mounting board 10 is stored.

  The case 201 is a container formed in a substantially rectangular parallelepiped with the Y-axis direction as a longitudinal direction, and a storage space 201a for storing the electronic component mounting board 10 is formed. A plurality of electronic component mounting boards 10 are stored in the storage space 201a. In the present embodiment, for example, four electronic component mounting boards 10 are accommodated in parallel. However, the number of electronic component mounting boards 10 to be stored is arbitrary, and may be 3 or less, or 5 or more. For example, when the number of electronic component mounting boards 10 is 12, the total number of cavities of the electronic component mounting boards 10 accommodated in the case 201 is 852 (= 12 electronic component mounting boards 10 × electronic parts). The number of mounting portions P1 of the mounting substrate 10 is 71). A fitting portion 202 for fitting the end portion on the −Y side in the longitudinal direction of the electronic component mounting board 10 is formed on the −Y side of the storage space 201a. The fitting portion 202 is formed to be dented on the −Y side. Similarly, a fitting portion 203 for fitting the end portion on the + Y side of the electronic component mounting board 10 is formed on the + Y side of the storage space 201a. The fitting portion 203 is formed to be dented on the + Y side.

  As described above, in the case unit 200 according to the second embodiment, the plurality of electronic component mounting boards 10 are accommodated in the case 201 in parallel. For this reason, many electronic components can be mounted simultaneously. As a result, many light emitting devices 100 using the electronic component mounting substrate 10 can be manufactured at the same time. Moreover, manufacturing cost can be suppressed.

  In the second embodiment, the case 201 is formed with fitting portions 202 and 203 for fitting both end portions of the electronic component mounting board 10 in the longitudinal direction. For this reason, the electronic component mounting substrate 10 can be fixed in the case 201. Thereby, the mounting operation of the electronic component can be performed efficiently.

  In addition, the electronic component mounting substrate 10 according to the first embodiment is easily elastically deformed in the short direction because a part of the cross section in the short direction is substantially M-shaped or substantially U-shaped. For this reason, since the electronic component mounting substrate 10 functions as an elastic body that expands and contracts in the short direction (because it has elasticity that expands and contracts in the short direction), the electronic component mounting board 10 can be easily attached to the fitting portions 202 and 203 of the case 201. Can be fitted.

  In the second embodiment, the fitting portions 202 and 203 of the case 201 are formed at both ends in the Y-axis direction of the storage space 201a. However, it is not limited to both ends in the Y-axis direction, and may be formed near the center in the Y-axis direction of the storage space 201a, for example, as shown in FIG. Moreover, the fitting part may be formed in places other than these.

(Embodiment 3)
Next, an electronic component mounting board 300 according to Embodiment 3 of the present invention will be described with reference to FIGS. In the drawing, the Y-axis direction corresponds to the longitudinal direction of the electronic component mounting board 300, and the X-axis direction corresponds to the short direction of the electronic component mounting board 300.

  FIG. 21A is a perspective view showing an electronic component mounting board 300 according to Embodiment 3 of the present invention. As shown in FIG. 21A, the electronic component mounting substrate 300 covers the substrate 320, the insulating layer 12, the conductor layer 13, the first conductor pad 14, the second conductor pad 15, and a part of the conductor layer 13. And a solder resist 16.

  For example, the substrate 320 is formed by press-molding a metal foil. The substrate 320 has only one mounting part P1. Since there is only one mounting part P1, the substrate 320 does not have a connecting part. The board 320 is different from the board 20 of the electronic component mounting board 10 according to the first embodiment in the number of mounting portions P1. The electronic component mounting board 300 is formed so as to have the same shape and dimensions as the electronic component mounting board 10 according to the first embodiment, except for the total length L.

  FIG. 21B is a plan view for explaining the dimensions of the electronic component mounting board 300. FIG. 22 is a cross-sectional view of the electronic component mounting board 300 in the short-side direction. FIG. 23 is a longitudinal sectional view of the electronic component mounting board 300. The electronic component mounting board 300 is formed so as to have the same shape and dimensions as the electronic component mounting board 10 according to the first embodiment, except for the total length L. Specifically, in FIG. 21B, the total length L2 (longitudinal dimension) of the electronic component mounting board 300 is, for example, 3.0 to 7.0 mm, and the width W (short dimension) of the electronic component mounting board 10 is. Is, for example, 3.0 to 7.0 mm. In FIG. 22, the thickness d16 of the electronic component mounting substrate 10 is, for example, 0.5 to 2.0 mm.

  In FIG. 21B, the length d11 of the cavity R (= the length of the mounting portion P1) is, for example, 2.0 to 4.0 mm. The length d12 of the bottom surface 32a of the cavity R is, for example, 0.6 to 2.0 mm, the width d21 of the cavity R is, for example, 1.5 to 6.0 mm, and the width d22 of the bottom surface 32a of the cavity R. Is, for example, 0.2 to 0.7 mm.

  A cross section in the short direction of the electronic component mounting substrate 300 is formed to be substantially M-shaped as shown in FIG. The bottom surface 32a of the first concave portion 30 at the center of the M shape forms an electronic component mounting portion for mounting an electronic component. The bottom surface 32a is sandwiched between a + X side wall surface 33a and a -X side wall surface 34a. The wall surfaces 33a and 34a function as a reflector when an electronic component is mounted on the bottom surface 32a. The angle θ1 formed by the wall surfaces 33a, 34a and the bottom surface 32a is in the range of 120 ° to 150 °. Preferably, it is 135 degrees. The bottom 32 of the first recess 30 is formed such that its thickness T1 is greater than the thickness T2 of the walls 33 and 34 of the first recess 30.

  First extending portions 40 and 41 are formed on the upper ends (+ Z side ends) of the wall surfaces 33a and 34a of the first recess 30, respectively. The first extending portion 40 is formed so as to be directed downward (−Z direction) from the upper end (+ Z side end) of the wall surface 33a. Similarly, the first extending portion 41 is formed so as to be directed downward (−Z direction) from the upper end (+ Z side end) of the wall surface 34a. In addition, the downward direction indicates a direction opposite to the opening direction of the mounting portion P1. Further, second extending portions 42 and 43 formed by bending inward from the first extending portions 40 and 41 are formed at lower ends (ends on the −Z side) of the first extending portions 40 and 41. Has been. Specifically, the second extending portion 42 is formed by bending inward (−X direction) from the first extending portion 40. Similarly, the second extending portion 43 is formed by being bent inward (+ X direction) from the first extending portion 41. End surfaces 42a and 43a of the second extending portions 42 and 43 are bent so as to face upward (+ Z direction). Note that “up” indicates the opening direction of the mounting portion P1.

  A cross section in the longitudinal direction of the electronic component mounting board 300 is formed to be substantially U-shaped as shown in FIG. The bottom surface 32 a of the U-shaped central second recess 31 coincides with the bottom surface 32 a of the M-shaped central first recess 30. The bottom surface 32a is sandwiched between a -Y side wall surface 35a and a + Y side wall surface 36a. The wall surfaces 35a and 36a function as a reflector when an electronic component is mounted on the bottom surface 32a. An angle θ2 formed by the bottom surface 32a and the wall surfaces 35a and 36a is in a range of 120 ° to 150 °. Preferably, it is 135 degrees. The bottom 32 of the second recess 31 is formed such that its thickness T1 is larger than the thickness T3 of the walls 35 and 36 of the second recess 31. Further, the thickness T3 of the wall portions 35 and 36 of the second recess 31 is equal to the thickness T2 of the walls 33 and 34 of the first recess 30.

  The electronic component mounting board 300 is formed, for example, by cutting the electronic component mounting board 10 according to the first embodiment for each predetermined dimension. Specifically, as shown in FIGS. 24A and 24B, the electronic component mounting board 300 is formed by cutting the connecting portion P2 of the electronic component mounting board 10 in the short direction.

  As described above, in the electronic component mounting substrate 300 according to the third embodiment, a part of the cross section in the short-side direction is pressed so as to be substantially M-shaped. For this reason, like the electronic component mounting substrate 10 according to the first embodiment, it can be manufactured by a simple process while maintaining excellent heat dissipation characteristics. Further, since a part of the cross section in the longitudinal direction is pressed so as to be substantially U-shaped, similarly, it can be manufactured by a simple process while maintaining excellent heat dissipation characteristics.

  In addition, since the electronic component mounting board 300 according to the third embodiment has a smaller overall length L2 (dimension in the longitudinal direction) than the electronic component mounting board 10 according to the first embodiment, the electronic component mounting board 300 is replaced with another board or the like. Can be easily implemented.

  In the third embodiment, the electronic component mounting board 300 is formed by cutting the electronic component mounting board 10 according to the first embodiment for each predetermined dimension. For this reason, the electronic component mounting substrate 300 can be obtained easily. In addition, before cutting the electronic component mounting board 10, it is preferable that the electronic component is mounted in advance on the mounting portion P1 of the electronic component mounting board 10.

  The configurations (components, dimensions, material, shape, number of layers, arrangement, etc.) of the electronic component mounting substrate and the case unit described above can be arbitrarily changed or omitted without departing from the spirit of the present invention.

(Embodiment 4)
For example, in the electronic component mounting substrate 10 according to the first embodiment, the end faces 42a and 43a of the second extending portions 42 and 43 are bent so as to face upward (+ Z direction) (see FIG. 3A). However, the present invention is not limited to this, and the end faces 42a and 43a may not be bent so as to face upward (+ Z direction) as in the electronic component mounting substrate 400 shown in FIG. Also in the fourth embodiment, similarly to the first and third embodiments, it is possible to obtain an effect that the solder hardly enters the second extending portions 42 and 43 during the soldering process. Note that “up” indicates the opening direction of the mounting portion P1.

(Embodiment 5)
In addition, in the electronic component mounting board 10 according to the first embodiment and the electronic component mounting board 300 according to the third embodiment, a part of the cross section in the longitudinal direction is formed to be substantially U-shaped. However, the present invention is not limited to this, and a part of the cross section in the longitudinal direction does not have to be substantially U-shaped as in the electronic component mounting substrate 500 shown in FIG. In this case, the cavity R is formed long in the Y-axis direction.

  The method for manufacturing an electronic component mounting board of the present invention is not limited to the contents and order shown in the embodiment of the present invention, and the contents and order can be arbitrarily changed without departing from the spirit of the present invention. Can do. Moreover, you may omit the process which is not required according to a use etc.

  The embodiment of the present invention has been described above. However, various modifications and combinations required for design reasons and other factors are not limited to the invention described in the “claims” or the “mode for carrying out the invention”. It should be understood that it is included in the scope of the invention corresponding to the specific examples described in the above.

  The electronic component mounting board according to the present invention is suitable for realizing illumination or a liquid crystal display. Moreover, the method for manufacturing an electronic component mounting board according to the present invention is suitable for manufacturing such an electronic component mounting board. The case unit according to the present invention is suitable for housing such an electronic component mounting board.

10, 300, 400, 500 Electronic component mounting substrate 12 Insulating layer 13 Conductor layer 13a Wiring 13b First end portion 13c Second end portion 14 First conductor pad 14a, 15a Pad portion main body 14b, 15b Cover portion 15 Second conductor pad 16 Solder resist 20, 320 Substrate 21 Base substrate 22 Intermediate layer 23 Reflective film 24 Reflective film body 25 Coating film 25a Titanium dioxide film 25b Silicon dioxide film 30 First recess 31 Second recess 32 Bottom 32a Bottom 33, 34, 35, 36 Wall portion 33a, 34a, 35a, 36a Wall surface 40, 41 First extending portion 42, 43 Second extending portion 42a, 43a End surface 45 Upper surface 100 Light emitting device 110 Light emitting element 111 Wire 120 Wiring substrate 121 Solder 200 Case unit 201 Case 201a Storage space 202, 20 Fitting part 1001 Aluminum foil 1001a, 1001b Bending part 1002 Adhesive material 1003 Conductive member 1003a Adhered part 1003b Unadhered part 1010, 1011, 1012, 1013, 1014 Mold 1015 Chamber P1 Mounting part P2 Connecting part R Cavity L, L2 Total length W , D21, d22 Width d11, d12, Length d13 Spacing d14 Pitch d15 Depth d16 Thickness d42, d43, d44 Thickness T0, T1, T2, T3 Thickness H Height θ1, θ2, θ3 Angle

Claims (27)

A plurality of electronic component mounting portions are formed along the longitudinal direction, the substrate including at least a part of a metal, an insulating layer formed on the substrate, and a conductor layer formed on the insulating layer. A linear electronic component mounting board,
At least a part of the cross section in the short direction is formed to be substantially M-shaped,
The electronic component mounting board, wherein the bottom surface of the first concave portion at the center of the M-shape constitutes the electronic component mounting portion.   The electronic component mounting board according to claim 1, wherein the wall surface sandwiching the bottom surface of the first recess functions as a reflector.   3. The electronic component mounting board according to claim 2, wherein an angle formed between the bottom surface of the first recess and the wall surface is in a range of 120 ° to 150 °. At least a part of the cross section in the longitudinal direction is formed to be substantially U-shaped,
4. The electronic component mounting board according to claim 1, wherein a bottom surface of the second concave portion at the center of the U shape coincides with a bottom surface of the first concave portion. 5.   The electronic component mounting board according to claim 4, wherein a wall surface sandwiching a bottom surface of the second recess functions as a reflector.   The electronic component mounting board according to claim 5, wherein an angle formed between the bottom surface of the second recess and the wall surface is in a range of 120 ° to 150 °.   The thickness of the said board | substrate of the bottom part of a said 1st recessed part is larger than the thickness of the said board | substrate of the wall part of the said 1st recessed part, The electronic component mounting board as described in any one of Claim 1 thru | or 6 characterized by the above-mentioned. .   The electronic component mounting board according to any one of claims 1 to 7, wherein a metal portion of the board is exposed at both end faces in the short-side direction. A first extending portion formed to extend downward from an upper end of the wall surface of the first recess in the short direction;
A second extending portion formed by bending inward from the first extending portion in the short direction;
The electronic component mounting board according to claim 8, further comprising:   The electronic component mounting board according to claim 9, wherein an end face of the second extending portion is bent so as to face upward. The conductor layer has wiring for electronic components,
One first end of the wiring is disposed on the bottom surface of the first recess,
The electronic component mounting board according to claim 9 or 10, wherein a first conductor pad is formed on the first end of the wiring. The other second end of the wiring is pulled out from the bottom surface of the first recess, and is disposed in the first extending portion,
A second conductor pad is formed on the second end of the wiring,
The electronic component mounting board according to claim 11, wherein the second end portion does not reach a bent portion between the first extending portion and the second extending portion.   The electronic component mounting board according to claim 11 or 12, wherein the wiring is covered with a solder resist except in the vicinity of a portion where the first conductor pad is formed.   The electronic component mounting board according to claim 13, wherein the solder resist is made of a material that reflects light. The substrate is made of aluminum and is formed from a plate member having a maximum thickness of 0.1 to 0.5 mm.
The electronic component mounting substrate according to claim 1, wherein the electronic component mounting substrate has elasticity that expands and contracts in the lateral direction.   16. The electronic component mounting substrate according to claim 1, wherein the substrate includes a base substrate and a reflective film formed on the base substrate. The reflective film is made of silver,
The electronic component mounting substrate according to claim 16, wherein the base substrate is made of copper. Electronic component mounting substrate according to any one of claims 1 to 17,
A fitting portion for fitting at least both ends in the longitudinal direction of the electronic component mounting board is formed, and a case in which the electronic component mounting board is stored;
A case unit having
The electronic component mounting board is fixed to the case by the fitting portion. An electronic component mounting board comprising a substrate made of at least a part of a metal, an insulating layer formed on the substrate, and a conductor layer formed on the insulating layer, wherein an electronic component mounting portion is formed. There,
One cross section is formed to be substantially M-shaped,
The electronic component mounting board, wherein a bottom surface of the M-shaped central recess constitutes the electronic component mounting portion. A method of manufacturing a linear electronic component mounting board in which a plurality of electronic component mounting portions are formed along the longitudinal direction,
Preparing a substrate at least partially made of metal;
Forming a conductor layer on the substrate via an insulating layer made of an adhesive;
Pressing at least a part of the cross section of the substrate in the short direction so as to be substantially M-shaped, and setting the bottom surface of the first concave portion at the center of the M-shape as the electronic component mounting portion; ,
including,
An electronic component mounting board manufacturing method characterized by the above.   21. The method of manufacturing an electronic component mounting substrate according to claim 20, wherein in the pressing, the first recess is formed by overhanging. In the formation of the conductor layer,
While adhering a part of the conductor layer to the central part of the short side direction of the substrate, the part other than the part of the conductor layer is not adhered to the substrate,
The method for manufacturing an electronic component mounting substrate according to claim 21, wherein the unbonded portion of the conductor layer slides on the substrate in accordance with the overhanging process.   The electronic component mounting according to any one of claims 20 to 22, wherein, in the pressing, an angle formed between a bottom surface and a wall surface of the first recess is in a range of 120 ° to 150 °. A method for manufacturing a substrate.   The thickness of the board | substrate of the bottom part of the said 1st recessed part is made larger than the thickness of the said board | substrate of the wall part of the said 1st recessed part in the said press work, The one of Claim 20 thru | or 23 characterized by the above-mentioned. The manufacturing method of the electronic component mounting board | substrate of description. The press working is
In the short direction, a first press working to form a first extending portion extending downward from the upper end of the wall surface of the first recess;
A second press forming a second extending portion bent inward from the first extending portion in the short direction;
The method for manufacturing an electronic component mounting board according to any one of claims 20 to 24, comprising:   26. The method of manufacturing an electronic component mounting board according to claim 25, wherein each of the first press process and the second press process is a bending process.   27. The method of manufacturing an electronic component mounting board according to claim 25 or 26, wherein an end face of the second extending portion is bent so as to face upward by the press work or after the press work.

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