JP3120130B2 - Manufacturing method of metal mask plate for printing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, a cream solder for mounting various primary mounted components on a printed wiring board in a mounting process on the printed wiring board, and further mounting a secondary mounted component on the printed wiring board. The present invention relates to a method for producing a printing metal mask plate used for printing or the like.

[0002]

2. Description of the Related Art This type of printing metal mask plate is disclosed, for example, in Japanese Utility Model Laid-Open Publication No. 61-7067 or 61-9980.
No. 1 on a printed wiring board as disclosed in
In order to escape from the next mounted component, a concave portion having a shape corresponding to the thickness and height of the component is formed. The concave portion for escaping the primary mounted component is formed by etching or the like in the thickness of the printing metal mask plate. Things. However, in this case, the depth of the recess for mounting component escape is limited to the thickness of the metal mask plate for printing, so the height of the primary mounting component is limited,
To obtain a deeper recess for mounting component escape, the thickness of the printing metal mask plate must be increased.If the printing metal mask plate is made thicker, the printing thickness becomes unnecessarily thick. There is a problem that cannot be set.

In order to solve such problems, as disclosed in Japanese Patent Application Laid-Open No. 2-129993, a large number of inks for discharging conductive ink or cream solder paste (hereinafter referred to as ink paste) are used. There is a method in which a part of a printing metal mask plate having the above-mentioned opening is formed by drawing by press working to form a recess for escaping a primary mounted component. According to this, it is possible to form a primary mounting component escape concave portion that can escape from a primary mounting component having a thickness or height greater than the plate thickness.

[0004]

However, in a method of forming a recess for escaping a primary mounting component by drawing a part of a metal mask plate for printing by pressing with a press, a recess for escaping a primary mounting component during the drawing is used. Since the periphery of the hole expands and contracts, the opening located in the vicinity thereof is deformed or misaligned, which tends to cause a decrease in accuracy.

An object of the present invention is to make it possible to form a recess for escaping a primary mounting component having a depth greater than the plate thickness by electroforming, particularly by devising the shape of an electroformed mold. A method of manufacturing a metal mask plate for printing that can be manufactured with high precision is not provided.

[0006]

According to a method of manufacturing a metal mask plate for printing of the present invention, a resist film 13 having a desired opening pattern is formed on the surface of an electroforming mold 10 as shown in the drawing. The conductive convex portions 14 corresponding to the primary mounting component escape concave portions 3 are formed. Then, the substrate 1 is formed by electroforming on the surface of the electroformed matrix 10 that is not covered with the resist film 13. Thereafter, the substrate 1 is peeled from the electroformed mold 10.

[0007]

According to the above-mentioned electroforming, a printing metal mask plate having a recess 3 and an opening 2 for escaping a primary mounting component with high precision is obtained. Since the primary mounting component escape concave portion 3 is formed by electrodeposition along the outer shape of the conductive convex portion 14 of the electroformed matrix 10, the primary mounting component escape concave portion is formed by pressing as in the conventional case described above. However, there is no fear that the opening 2 in the vicinity thereof is deformed or misaligned.

[0008]

Therefore, according to the present invention, a resist film 13 having a desired opening pattern is formed on the surface of the electroformed mold 10 and the conductive protrusions 14 corresponding to the recesses 3 for escaping the primary mounting component are formed. After forming, a metal mask plate for printing having the recessed portion 3 for escaping the primary mounting component and the opening 2 can be manufactured with high precision and easily by electroforming. By adjusting the height and outer shape of the conductive projections 14 of the electroformed mold 10, various primary mounting component escape recesses 3 corresponding to the thickness, height, and shape of the primary mounting component can be formed. . The use of this high-precision metal mask plate for printing enables precise printing.

[0009]

An embodiment of the present invention will be described with reference to the drawings.
FIG. 3 shows an example of usage of a printing metal mask plate to which the present invention is applied. As shown in FIG. And the recess 3 for escaping the primary mounting component. Reference numeral 4 denotes a printed wiring board on which the primary mounting components 5 are already mounted, and reference numeral 6 denotes a squeegee for scraping the ink paste 7 placed on the printing metal mask plate in the secondary mounting process.

FIGS. 2A to 2F show steps until the metal mask plate for printing is obtained by electroforming. First, FIG.
As shown in (A), a film-shaped photoresist 11 is laminated on the surface of an electroformed mold 10 made of stainless steel (SUS304) used for this electroforming. Next, as shown in FIG. 3B, a desired aperture pattern film 12 is brought into close contact with the photoresist 11 on the front side, and each processing such as baking, development and drying is performed. As shown in FIG. 2, a resist film 13 having a desired opening pattern (for example, 2
00 μm).

Next, as shown in FIG. 1D, a conductive convex portion 14 (for example, a conductive convex portion 14 corresponding to a desired height and shape of the primary mounting component 5 is provided at a predetermined position on the surface of the electroformed mold 10. Height h
= 1.5-2.0 mm) at predetermined positions. In forming the conductive protrusions 14, for example, as shown in FIG. 4A, a conductive metal such as SUS304 formed corresponding to the height and shape of the primary mounting component 5 is used. The plate 15 is placed at a predetermined position on the surface of the electroformed mold 10, screws 16 are passed through several places thereof, and the plate 15 is fastened and fixed with a nut 17 on the back side of the electroformed mold 10. Next, as shown in FIG. 3B, a conductive paste 19 such as a copper paste is uniformly applied to the surface of the metal plate 15 where the heads of the screws 16 are exposed, to finish it flat. In this case, as shown in FIG. 5, it is also possible to set the screw 16 on the metal plate 15 in advance and apply the conductive paste 19, and then fix it to the electroformed mold 10. Besides that,
A metal plate 15 is formed on the surface of the electroformed mold 10 by a cladding method or the like.
Can be joined together by bonding or welding.

Next, the electroforming mold 10 having the resist film 13 and the conductive projections 14 is immersed in a glossy or matte nickel-cobalt sulfamate alloy bath to perform electroforming, as shown in FIG. As shown in (E) of FIG.
A μ-thick electrodeposited metal layer 25 is formed. However, this step is not always necessary.

Next, after the surface of the electrodeposited metal layer 25 is subjected to a release treatment, it is immersed in a nickel-cobalt sulfamate alloy bath and electroformed to a thickness of about 200 μm. As a result, the substrate 1 is electrodeposited on the surface of the electroforming mold 10 not covered with the resist film 13 as shown in FIG. At this time, the substrate 1 forms a convex portion 20 bulging along the outer shape of the conductive convex portion 14, and the concave portion 3 for escaping the primary mounting component is formed on the inner surface side of the convex portion 20. After electroforming, the substrate 1 is polished.

Finally, the substrate 1 is peeled from the peeled surface of the electrodeposited metal layer 25, so that the substrate 1 has an opening 2 and a depth of 1.5 to 2.0 mm as shown in FIG. To obtain an electroformed product of a printing metal mask plate having the recessed portion 3 for escaping the primary mounting component.

Instead of the nickel-cobalt alloy bath,
Plating slightly on the compressive stress side by using a nickel electroforming bath containing a sulfur-based additive (aromatic having a sulfonate group), such as sodium naphthalene / trisulfonate or sodium benzene / sulfonate Adjust the liquid. The printing metal mask plate electroformed in this bath is formed with an overall elongation, and is slightly larger than the pitch dimension of the aperture pattern film 12. Therefore, if the pitch between the pitches is abnormally long, such as those requiring a high-precision pitch, or those in which a metal mask plate for printing is large and many patterns are arranged,
A correction value is put in the aperture pattern film 12 in advance.
For example, the size of the metal mask plate for printing is 360 × 36
0 mm, the pitch of the aperture pattern film 12 is 100 mm.
The size of the metal mask plate for printing (electroformed product) is 10 mm
It extends from 0.025 to 100.35 mm. Therefore, the correction value (pattern size after correction) of the aperture pattern film 12 at this time is set to the design value ÷ 1.0003. In addition, the size of the metal mask plate for printing is 460 × 460 mm or 56
The dimension of the metal mask plate (electroformed product) for printing as an electroformed product is 100.045 to 100.055 mm, which is 0 × 560 mm and the pitch size of the aperture pattern film 12 is 100 mm. Therefore, the correction value of the aperture pattern film 12 at this time may be set to the design value ÷ 1.0005.

On the other hand, in the nickel-cobalt alloy bath, the plating solution is slightly adjusted to the tensile stress side. In this case, when the surface of the substrate 1 is polished while the substrate 1 is attached to the electroforming mold 10. In addition, there is a problem that the substrate 1 is easily peeled or warped with respect to the electroformed mold 10 and polishing accuracy is not improved. However, if a plating solution is slightly adjusted to a compressive stress side by using a nickel electroforming bath to which a sulfur-based additive is added, such a problem does not occur, which is advantageous.

As a means for forming the conductive protrusions 14 on the surface of the electroformed mold 10, instead of fixing the metal plate 15 by polymerization as described above, a flat electroformed mold 1 as shown in FIG.
0 can be formed by pressing itself. 7 (A) to 7 (E), a conductive convex portion 14 is formed on the surface of the electroformed master 10 by press working, and a metal mask plate for printing is formed using the master 10 in the same manner as in the above embodiment. An example of electroforming will be described.

That is, first, as shown in FIG. 7A, a predetermined thickness, for example, 1.5, is provided between the upper and lower press dies 21 and 22.
The SUS304 electroformed mold 10 having a thickness of 1 mm is sandwiched and pressed to form, for example, a 1.5 mm height according to the height and shape of the primary mounting component as shown in FIG. The conductive protrusions 14 are formed.

Next, as shown in FIG. 2C, a resist film 13 having a desired opening pattern is formed on the surface of the electroformed mold 10 on which the conductive projections 14 are formed. As shown in (D), the substrate 1 is formed by electroforming on the surface of the electroforming mold 10 which is not covered with the resist film 13, for example, 200
Electrodeposit to a thickness of μ. After electroforming, after polishing the surface,
By peeling the substrate 1 from the electroforming mold 10, the substrate 1 is provided with an opening 2 and a recess 3 for escaping a primary mounting component having a depth of about 1.5 mm as shown in FIG. To obtain a metal mask plate.

In this embodiment, after the electroforming mold 10 is formed with the conductive convex portions 14 by press working, the resist film 13 having a desired opening pattern is formed by patterning. As shown in FIG. 1A, after a resist film 13 having a desired opening pattern is formed on the surface of the electroformed master 10 by patterning, the electroformed master 10 is pressed to form a conductive convex portion 14. Can also. Thereafter, the substrate 1 is formed by electroforming using the matrix 10 (see (C) in the same figure), and the surface is polished after electroforming to peel the substrate 1 from the electroformed matrix 10. This is the same as in the above embodiment.

FIG. 9 shows another embodiment in which the conductive protrusions 14 and the resist film 13 are formed on the surface of the electroformed mold 10. In this embodiment, first, a recess 24 having a slight depth is formed on the surface of the electroformed mold 10 by etching as shown in FIG. Next, a resist film 13 having a desired opening pattern is formed on the surface of the electroformed mold 10 by patterning as shown in FIG. Next, FIG.
As shown in FIG. 3, a conductive convex portion 14 made of a conductive metal plate is fitted into a concave portion 24 on the surface of the electroformed mold 10, and the conductive convex portion 14 is screwed into a screw 16 and a nut 17 as shown in FIG.
Stop with. In this manner, the conductive protrusions 14 made of the conductive metal plate are fitted and fixed in the recesses 24 of the electroformed mother mold 10, so that the position shift of the conductive protrusions 14 can be prevented and the adhesion can be improved.

The material of the electroformed mold 10 is SUS3
Stainless steel or copper other than 04 may be used. If copper is selected as the material of the electroformed mold 10, it is advantageous because the conductive convex portions 14 can be easily formed at the time of press working with good spreadability.

When the primary mounting component escape recess 3 has a directionality as shown in FIG. 6, the squeegee 6 has a recess 23 corresponding to the outer shape of the projection 20 having the primary mounting component escape recess 3.
In printing, the squeegee 6 may be reciprocated in the Y direction along the longitudinal direction of the primary mounting component escape recess 3.

[Brief description of the drawings]

FIG. 1 is a main manufacturing process diagram.

FIG. 2 is an overall manufacturing process diagram.

FIG. 3 is a cross-sectional view showing an example of usage of a metal mask plate for printing.

FIG. 4 is a diagram showing a forming process of an example of a means for forming a convex portion on an electroformed mold.

FIG. 5 is a sectional view showing another modification of the metal plate shown in FIG.

FIG. 6 is a perspective view showing an example of a squeegee hanging direction.

FIG. 7 is a manufacturing process diagram showing another embodiment.

FIG. 8 is a manufacturing process diagram showing still another embodiment.

FIG. 9 is a process drawing showing still another embodiment of forming a conductive projection on an electroformed mold.

[Description of Signs ] 1 Substrate 2 Opening 3 Primary mounting component escape recess 10 Electroforming mold 13 Resist film 14 Conductive projection

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-122993 (JP, A) JP-A-53-36303 (JP, A) JP-A-50-110070 (JP, A) 11856 (JP, U) JP-B-57-1824 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , DB name) B41C 1/14 101 B41N 1/24

Claims (1)

(57) [Claims] When manufacturing a printing metal mask plate having an opening for discharging ink paste and a recess for escaping a primary mounting component, the printing paste is formed on a substrate by patterning a desired printing pattern. A resist film 13 having a desired opening pattern is formed on the surface of the electroformed mold 10, and a conductive convex portion 14 corresponding to the recess 3 for escaping the primary mounting component is formed. A method for manufacturing a metal mask plate for printing, comprising: forming a substrate 1 by electroforming on a surface not covered with a film 13; and thereafter peeling the substrate 1 from an electroformed matrix 10.