JPH08183151A - Manufacture of mesh-integrated metal mask - Google Patents

Abstract

PURPOSE: To attempt improvement of stability in a printing size and prevention of occurrence of a pit by a method wherein an aspect ratio is taken high in manufacture of a mesh-integrated metal mask in which a mask substrate of a printing pattern is integrally formed by electrodeposition on one side of the mesh. CONSTITUTION: A pattern resist film 13 is formed on a surface of an electroformed matrix 10. An electrodeposited layer 14 corresponding to a mask substrate 3 is formed by electrodeposition on a surface not covered by the pattern resist film 13 of the electroformed matrix. Then, the electroformed matrix is placed on a flat plate jig 15 via an elastic matte 16. Besides, a mesh 5 having electrical conductivity with an enclosing frame on its periphery is superimposed close onto surfaces of the electrodeposited layer 14 and the pattern resist film 13 under a state of pushing the mesh by applying tension. Then, the mesh 5 is integrally bonded to the electrodeposited layer 14 by plating from the mesh 5 direction. Lastly, the electrodeposited layer 14 together with the mesh 5 is separated from the electroformed matrix 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, ICs and LSIs.
The present invention relates to a method for manufacturing a mesh-integrated metal mask, which is preferably used for screen printing of printed wiring for automobiles.

[0002]

2. Description of the Related Art This type of mesh-integrated metal mask has, for example, a large number of openings patterned by electroforming into a desired print pattern as disclosed in JP-A-6-234202. There is one in which a mask substrate is integrally electrodeposited on a conductive mesh. Such an electroformed mesh-integrated metal mask has excellent chemical resistance and wear resistance as compared with a mask formed of a photosensitive resin or the like on the mesh, and the dimensional change due to the squeegee printing pressure is extremely high. It is possible to achieve sharp printing that is small and has relatively high accuracy.
In addition, even if compared with a mask in which a thin metal foil is integrally connected by electroplating on a mesh and the metal foil is etched on one side into a desired printing pattern, the total thickness of the mask can be easily adjusted. A variety of different metal masks can be easily obtained, the aspect ratio (total thickness / opening width) is relatively high, and the mask cross section rises vertically to obtain a high-resolution printed pattern. And enables fine line printing,
There is an advantage.

[0003]

However, in the above-mentioned conventional electroformed mesh-integrated metal mask, the pattern resist film is formed on the mesh during the electroforming. Since the mesh exposes the areas of the film that require exposure, unexposed areas tend to occur, and these unexposed areas are removed together with the unexposed areas that should be removed during development. The degree of aperture cannot be sufficiently obtained, the aperture ratio is changed, the aspect ratio is lowered, and insufficient adhesion between the photoresist film and the mesh is likely to occur. Therefore, although double-sided exposure is adopted, the present inventor has found that it is still not possible to sufficiently prevent the generation of an unexposed portion which becomes a shadow due to the mesh and the insufficient adhesion of the photoresist film. Further, since the photoresist film is floated from the surface of the electroforming master due to the mesh, or is easily peeled off, a mesh holding layer having viscoelasticity is adopted as a measure for this, but the present inventors have found that this is not sufficient either. I found out. further,
If the mesh is made by knitting stainless fine wires, when the squeegee is applied, misalignment occurs between the knitting lines of the mesh exposed in the opening of the mask substrate, and the stitches tend to change, so the printing size is still unclear. There was instability.
In addition, since electroconductive mesh is used as an electrode (cathode) during electroforming, electroforming will grow from the mesh, but at this time electroforming growth may be delayed near the center of the mesh stitches. Therefore, pits are likely to occur on the surface of the mask substrate. In particular, this pit generation was likely to occur when a thin metal mask (thickness of 20 μm or less) was electroformed.

The object of the present invention is to solve these problems, and in the method of manufacturing a mesh-integrated metal mask in which the mask substrate is integrally electrodeposited on one side of the mesh as described above, the aspect ratio is It is also possible to increase the printing cost and to improve the printing dimensional stability. Another object of the present invention is to prevent the occurrence of pits.

[0005]

The invention according to claim 1 of the present invention comprises a step of forming a patterned resist film 13 on the surface of an electroformed mold 10 as illustrated in the manufacturing process of FIG. A step of electrodeposition forming an electrodeposition layer 14 corresponding to the mask substrate 3 on the surface of the electroforming mother die 10 not covered with the pattern resist film 13, and conducting on the surfaces of the electrodeposition layer 14 and the pattern resist film 13. Process of closely polymerizing the mesh 5 having the property, a process of integrally plating the mesh 5 and the electrodeposition layer 14 by plating from the direction of the mesh 5, and the electroforming mold 10.
And a step of peeling the electrodeposited layer 14 together with the mesh 5.

In the invention according to claim 2 of the present invention, as illustrated in the drawing, the step of forming the pattern resist film 13 on the surface of the electroformed mold 10 and the electroformed mold 10 are illustrated.
Of electrodeposited layer 14 corresponding to the mask substrate 3 on the surface not covered with the patterned resist film 13, and the electroformed mother die 10 on the plate jig 15 and the elastic mat 16
And the conductive mesh 5 with the surrounding frame 4 attached to the outer surfaces of the electrodeposited layer 14 and the patterned resist film 13 is tensioned and pressed onto the surface of the electrodeposited layer 14 and the patterned resist film 13 for adhesion polymerization. Process and mesh 5
It is characterized by comprising a step of integrally plating the mesh 5 and the electrodeposition layer 14 by plating from the direction, and a step of peeling the electrodeposition layer 14 together with the mesh 5 from the electroforming mold 10.

In the invention according to claim 3 of the present invention, the step of forming the pattern resist film 13 on the surface of the electroformed mother die 10 and the electroformed mother die 10 are exemplified as shown in FIG.
Of the electrodeposition layer 14 corresponding to the mask substrate 3 on the surface not covered with the pattern resist film 13 of the above step, and the whole surface of the surface of the electrodeposition layer 14 and the pattern resist film 13 20 is peelably attached, the step of peeling the electrodeposition layer 14 together with the pattern resist film 13 and the solid resist 20 from the electroforming mold 10, and the step of attaching the electrodeposition layer 14 and the pattern resist film 13 to the solid resist 20 side are performed. The conductive mesh 5 is placed on the flat plate jig 15 via the elastic mat 16 and has a conductive frame 5 on the surfaces of the electrodeposition layer 14 and the pattern resist film 13 with the surrounding frame 4 attached thereto. A step of applying a tension for adhesion polymerization in a state of being pressed; a step of integrally plating the mesh 5 and the electrodeposition layer 14 by plating from the mesh 5 direction; 0 Kara electrodeposited layer 14 mesh 5
And a step of peeling the whole.

In the invention according to claim 4 of the present invention, as shown in the manufacturing process in FIG. 6, a step of forming a pattern resist film 13 on the surface of the electroformed mother die 10 thicker than the thickness of the mask substrate 3. And electroforming mother die 10 pattern resist film 13
The step of first electrodepositing the throwing electrodeposition layer 21 thinner than the thickness of the pattern resist film 13 on the surface not covered with the mask, and performing the peeling treatment on the surface of the throwing electrodeposition layer 21 and then the mask substrate 3 And a step of secondarily electrodepositing the electrodeposition layer 14 corresponding to the step of placing the electroforming mother die 10 on the flat plate jig 15 with the elastic mat 16 interposed therebetween. A step of contact-polymerizing a conductive mesh 5 having a surrounding frame 4 attached to the outer periphery thereof with a tension applied to the mesh 5, and plating from the direction of the mesh 5 and the mesh 5 and the electrodeposition layer 14 for integrally joining the electrodeposited layer 21 to the electrodeposited layer 14 and the mesh 5
And a step of peeling the whole.

[0009]

According to the first aspect of the invention, since the pattern resist film 13 is formed on the surface of the electroforming mother die 10, the pattern resist film 13 is formed on the mesh as in the prior art described above, and the pattern resist film 13 is formed during development. Problems such as the generation of unexposed portions that become shadows due to the mesh and insufficient adhesion of the resist film are solved, and the aspect ratio can be increased. Even when the mesh 5 is formed by knitting fine metal wires, the intersections of the mesh 5 braiding lines are integrally joined by plating, so that the size of the stitches can be prevented from changing due to the squeegee, and the printing size can be reduced. Can be stabilized.
Since the electrodeposition layer 14 corresponding to the mask substrate 3 is formed by electrodeposition on the surface of the electroforming mold 10 which is not covered with the pattern resist film 13, it is possible to obtain the no-pit surface of the mask substrate 3.

According to the invention of claim 2, the mesh 5
Before the mesh 5 and the electrodeposition layer 14 are integrally joined by plating from the direction, the electroforming mother die 10 is placed on the flat plate jig 15 via the elastic mat 16 and the electrodeposition layer 14 is formed.
Further, since the mesh 5 is adhered and polymerized on the surface of the patterned resist film 13 while applying tension to the surface of the pattern resist film 13, the mesh 5 and the electrodeposition layer 14 can be surely integrally joined by plating.

In the electroforming method, the amount of metal electrodeposited per unit area (the amount of electrodeposition) is substantially constant, so that the portions where a large number of openings 2 are densely arranged and the openings 2 are sparsely arranged. A plate thickness difference is likely to occur between the exposed part and The dense portion of the opening 2 is thick and the sparse portion of the opening 2 is thin. This difference in plate thickness is likely to occur remarkably when the metal mask is thick (thickness of 50 μm or more). Further, after electroforming, it is considered that the plate thickness of the electrodeposition layer 14 is made uniform by electrolytic polishing, or electrolytic polishing is performed after mechanical polishing to remove burrs generated by polishing and to relax stress. However, the electrolytically polished surface is rough and it is difficult for the plating to adhere. However, claim 3
According to the invention of claim 1, after electroforming, this is peeled from the electroforming mother die 10, and this is turned over to bring the mesh 5 into close contact with the surface which was in contact with the electroforming mother die 10 which is a smooth surface. Since the plating is performed, the mesh 5 and the electrodeposition layer 14 can be more securely and integrally joined to each other regardless of the difference in the plate thickness on the surface side of the electrodeposition layer 14 or the surface condition.

In recent years, for example, in order to screen-print a bar code or the like, it is required to reduce the printing thickness, and accordingly, the mesh-integrated metal mask used for the screen-printing is necessarily extremely thin, For example, 10
A thickness of less than μm is required. However, in order to electroform such an ultrathin metal mask, an ultrathin film type photoresist having a thickness of 10 μm or less is required, but there is a limit to the thinness of this type of film resist. In addition, a special device is required to apply the liquid resist to a thickness of 10 μm or less, and it is not easy to apply it uniformly. Moreover, the thinner the resist film is, the more easily pinholes are generated in the resist film, which causes a defect. Further, since this type requires that the mesh be plated in close contact with the metal mask, it is necessary to grow the metal mask by electrodeposition up to almost the same thickness as the resist film when forming the metal mask. When there was a demand for thickness, it was necessary to prepare resists of various thicknesses according to the demand. However, according to the invention of claim 4, first, the throwing electrodeposition layer 21 having a thickness equal to or less than the thickness of the pattern resist film 13 is first electrodeposited, and then the throwing electrodeposition layer 21.
After the peeling treatment is applied to the surface of the electrode, the electrodeposition layer 14 corresponding to the mask substrate 3 is secondarily electrodeposited. After that, electrodeposition layer 14
Is removed from the electrodeposition layer 21, so that an ultrathin electrocast mask substrate 3 can be obtained even with a resist having a thickness of 10 μm or more. Further, the electrodeposited layer 14 corresponding to the mask substrate 3 is peeled off together with the mesh 5 from the discarded electrodeposited layer 21, and the electrodeposited layer 14 and the mesh 5 stretched in a tension state with respect to the surrounding frame 4. Since it has already been integrally joined by plating, even if the electrodeposition layer 14 is extremely thin, it can be peeled off without deformation or wrinkling. Furthermore, even when forming an ultrathin metal mask, a resist having a certain thickness or more can be used, pinholes and the like are less likely to occur, and the thickness of the throwing electrodeposition layer 21 can be changed. Thus, the thickness of the secondary electrodeposition layer 14 corresponding to the mask substrate 3 can be variously controlled, and it is not necessary to use various resists more than necessary.

[0013]

【Example】

(First Embodiment) An embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 2, the mesh-integrated metal mask 1 obtained according to the present invention has an enclosure frame on one side of a mask substrate 3 having a large number of openings 2 patterned into a desired print pattern by electroforming. The conductive mesh 5 stretched in tension with respect to 4 is closely polymerized and integrally joined by plating. A method of using the mesh-integrated metal mask 1 is, for example, screen printing. In this case, the surface of the mask substrate 3 opposite to the mesh 5 is brought into close contact with an object to be printed such as a wiring board, and an ink paste is used. Is placed on the surface of the mesh 5 and a squeegee is applied to eject it from the opening 2 to adhere it to the printing object.

FIGS. 1A to 1E show process charts for obtaining such a mesh-integrated metal mask by electroforming. When electroforming the mesh-integrated metal mask 1, first, as shown in FIG. 1 (A), a negative type liquid photoresist is uniformly applied to the surface of a stainless electroforming mother die 10 to a thickness of 20 μm, for example. Apply and dry,
A film-shaped photoresist 11 having a thickness of 20 μm is laminated. Then, a negative type print pattern film 12 corresponding to the pattern of the mask substrate 3 is brought into close contact with the photoresist 11, and each process of baking, developing and drying is performed to obtain a desired pattern as shown in FIG. The patterned resist film 13 is formed. Of course, as the photoresist 11 and the print pattern film 12,
A positive type may be used instead of the negative type.

Next, the electroforming mold 10 with the patterned resist film 13 is transferred to an electrodeposition tank, and nickel or nickel-cobalt alloy is electroformed, as shown in FIG. An electrodeposition layer 14 is formed on the surface of the casting mold 10 that is not covered with the pattern resist film 13. The electrodeposition layer 14 corresponds to the mask substrate 3, and is formed to have the same height as the pattern resist film 13 and a thickness of 20 μm. In this case, an example of the composition of the nickel sulfamate bath and plating conditions for nickel electroforming will be shown below. Nickel sulfamate 450 g / l Boric acid 30 g / l Bath temperature 50 ° C. pH 4.0-4.5 Current density 5-8 A / dm ²

After electroforming, the electroconductive mesh 5 is bonded and integrated with the surface of the electrodeposition layer 14 by plating while the electrodeposition layer 14 and the pattern resist film 13 are left on the electroforming mold 10. As shown in FIG. 2, the mesh 5 is formed by tensioning a mesh formed by knitting stainless fine wires or an electroformed mesh on the surrounding frame 4. As shown in FIG. 4D and FIG. 4, the electroformed mother die 10 is placed on the flat plate jig 15 with the electrodeposition layer 14 and the pattern resist film 13 attached, via an elastic mat 16 such as a sponge. Place. Then, the mesh 5 is covered on the entire surfaces of the electrodeposition layer 14 and the pattern resist film 13 and pressed in the direction of the flat plate jig 15,
Set in tension. At the time of this setting, the surrounding frame 4 is fixed to the flat plate jig 15 with the stoppers 17. In addition, in FIG. 4, 18 shows an electrode. Under this set state, plating, for example nickel plating, is applied from the mesh 5 direction. By this plating, a plating film 19 is formed on the mesh 5 as shown in FIG. 3, and the electrodeposition layer 14 and the mesh 5 are integrally joined. The thickness of the plating film 19 is adjusted arbitrarily, but for example, 3 to 5
The thickness is about μm. However, before plating, it is desirable to pretreat the mesh 5 by electrolytic pickling (cathodic pickling) in order to enhance the adhesion of the plating. At the time of the plating, the outer peripheral portion 5a between the outer periphery of the electrodeposition layer 14 and the surrounding frame 4 is masked M to perform the above-mentioned plating, so that the outer peripheral portion 5a is not plated. It is possible to keep the frame tension tension pressure of the mesh 5 constant.

Finally, the electrodeposited layer 14 is peeled off together with the mesh 5 from the electroforming mother die 10 and the pattern resist film 13 to form a mesh-integrated metal mask electroformed product as shown in FIG. Is obtained.

(Second Embodiment) When the mesh-integrated metal mask has a thin thickness of about 20 to 30 μm, particularly when the metal mask has a uniform pattern, it can be manufactured by the manufacturing method of the first embodiment. However, if it is a mesh-integrated metal mask (about 50 μm thick) thicker than that,
When the pattern changes depending on the mask position, the thickness of the electrodeposition layer 14 varies due to the difference in the density of the patterns. Further, in order to eliminate the variation, electrolytic polishing may be applied after electroforming, or electrolytic polishing may be added after mechanical polishing, but the plate thickness of the surface of the electrodeposition layer 14 is not uniform. However, the adhesion of the plating to the electrolytically polished surface may be poor. But,
Such a problem can be solved by the method of the second embodiment described below. In this embodiment, as shown in the manufacturing process of FIG. 5, a patterning process of the pattern resist film 13 ((A) and (B) of the same figure) and a forming process of the electrodeposition layer 14 ((C) of the same figure). Up to () are the same as in the first embodiment, and the subsequent steps are different.

That is, as in the first embodiment, the electroformed mold 1
After forming the electrodeposition layer 14 on the surface of No. 0, the plate thickness of the electrodeposition layer 14 is made uniform by electrolytic polishing as shown in FIG.
In this electrolytic polishing, the electrodeposition layer 14 is immersed in, for example, a phosphoric acid-based electrolytic solution, this is connected to a positive electrode, and electrolytic polishing is performed as an anode. In this case, by performing mechanical polishing prior to electrolytic polishing, it is possible to remove large irregularities that cannot be easily removed by electrolytic polishing, and it is possible to activate electrolytic polishing, which is advantageous. In addition, since the micro stress concentration portion generated by mechanical polishing can be electrolytically removed without generating stress by electrolytic polishing after mechanical polishing, internal stress generated by mechanical polishing is removed and relaxed,
The flatness can be increased without warpage. Then
As shown in (E) of the same figure, a solid resist 20 is peelably attached to the surface of the electrodeposition layer 14 that has been electropolished, and is exposed to ultraviolet light to cure. Then, the electrodeposition layer 14 is peeled off together with the pattern resist film 13 from the electroforming mold 10. Then, as shown in (F) of the same figure, as in the case of the first embodiment, an elastic mat 16 such as sponge is placed on the solid resist 20 side of the electrodeposition layer 14 and the pattern resist film 13 as in the case of the first embodiment. The surface of the electrodeposition layer 14 and the pattern resist film 13 that was in contact with the electroforming mother die 10 is placed on the surface of the electrodeposited layer 14 and the mesh 5 is applied with tension, and the mesh 5 is plated as an electrode. . Finally, the solid resist 20 is peeled off to obtain a thick mesh-integrated metal mask electroformed product as shown in FIG. In the second embodiment,
After the formation of the electrodeposition layer 14, the step (E) in the figure may be directly performed without performing mechanical polishing or electrolytic polishing.

In this thick mesh-integrated metal mask, the pattern resist film 13 is formed thick by laminating a plurality of film resists to correspond to the mask thickness. In such a case, the exposed portion (the electrodeposition layer 14) is formed. Opening 2
The cross-sectional shape of the portion corresponding to (1) tends to become an inverted trapezoid which becomes thinner on the electroforming mother die 10 side as shown in FIG. 5 (E). This is an exponential absorption of light rays (ultraviolet rays) by stacking two or three layers of film resist.
As a result, it is difficult for light rays to reach the position of the electroforming mother die 10. For this reason, the cross-sectional shape of the opening 2 has a larger dimension a on the side in contact with the printing object than the dimension b on the side of the mesh 5 on which the squeegee is applied (see (G) in FIG. 5), and therefore the ink paste is discharged. Will be good.

(Third Embodiment) FIGS. 6A to 6E.
Shows a manufacturing process drawing of the third embodiment. This embodiment is suitable for obtaining an ultrathin mesh-integrated metal mask. First, as shown in FIGS. 6A and 6B, the pattern resist film 13 is patterned on the surface of the electroforming mother die 10 as in the case of the first embodiment. The thickness of 13 is made thicker than the thickness of the mask substrate 3. For example, when the thickness of the mask substrate 3 is 5 μm, the pattern resist film 13 having a thickness of 15 μm, which is thicker than that, is formed. Then, the film is transferred to an electrodeposition tank, and as shown in FIG. 7C, the discarded electrodeposition layer 21 is formed on the surface of the electroforming mother die 10 not covered with the pattern resist film 13 by primary electroforming. The thickness is less than or equal to. The thickness of the discarded electrodeposition layer 21 is, for example, 10 μm.

Then, the surface of the throwing electrodeposition layer 21 is stripped with selenous acid or dichromic acid, and then the surface of the throwing electrodeposition layer 21 is covered with a mask substrate as shown in FIG. The electrodeposition layer 14 corresponding to No. 3 is subjected to secondary electroforming until the height becomes the same level as the pattern resist film 13, that is, the thickness of 5 μm as described above. Next, as shown in (D) of the same figure, the electroformed mother die 10 is left on the flat plate jig 15 with the electrodeposition layers 14 and 21 and the pattern resist film 13 attached, as in the case of the first embodiment. Then, the elastic mat 16 is placed. Then, the electrodeposition layer 14 and the pattern resist film 13
The whole surface of is covered with a mesh 5 with tension and plated. Finally, the pattern resist film 13 is swollen by immersing it in an alkaline solution, and then the electrodeposition layer 14 is peeled off together with the mesh 5 from the discarded electrodeposition layer 21 as shown in FIG. A metal mask electroformed product with an integrated mesh of the mold is obtained. In this embodiment, the thickness of the waste electrodeposition layer 21 is variously changed, so that the plate thickness of the secondary electrodeposition layer 14 formed thereabove can be arbitrarily adjusted and changed. For example, when the pattern resist film 13 having a thickness of 15 μm is formed and the thickness of the waste electrodeposition layer 21 is 8 μm, the secondary electrodeposition layer 14 has a thickness of about 7 μm.
It can be set to a thickness of μm. Further, even though the thin metal mask is formed, the thickness of the pattern resist film 13 can be kept at a certain level or more, so that there is no fear that pinholes or the like will occur in the pattern resist film 13 and the occurrence of defects will occur. Also few.

[0023]

According to the invention of claim 1, since the patterned resist film 13 is formed on the surface of the electroforming mold 10 during electroforming, the aspect ratio can be made high and fine patterning (line The width is obtained, and the mask cross-sectional shape is also a right angle. In addition, the pattern resist film 13
After the formation, the electrodeposition layer 14 corresponding to the mask substrate 3 is formed by electrodeposition, and the mesh 5 is adhered and polymerized on the electrodeposition layer 14 and integrally joined by plating, so that a no-pit mesh-integrated metal mask is obtained. As a result, fine line printing such as electrodes for liquid crystal displays and printed wiring for hybrid ICs, which are required to have high dimensional accuracy, can be realized. Further, even in the exposure from only one direction, it is possible to obtain a mask cross-sectional shape with higher verticality. Even when the mesh 5 is formed by knitting fine metal wires, the intersections of the mesh 5 braiding lines are integrally joined by plating, so that the size of the stitches can be prevented from changing due to the squeegee, and the printing size can be reduced. Can be stabilized.

According to the invention of claim 2, in addition to the effect obtained by the invention of claim 1, the mesh 5 can be securely and integrally bonded to the electrodeposition layer 14 by plating. The effect of being able to prevent peeling off and being excellent in durability is exhibited.

According to the third aspect of the present invention, in addition to the above effects obtained by the second aspect of the invention, the mesh 5 is also securely and integrally bonded to the mask substrate 3 having a uniform thickness. An effect that a thick mesh-integrated metal mask can be obtained is obtained.

According to the invention of claim 4, in addition to the above effects obtained by the invention of claim 2, an ultra-thin mesh-integrated metal mask can be easily obtained, and a waste electric charge can be obtained. The thickness of the mask substrate 3 can be arbitrarily adjusted by changing the thickness of the attachment layer 21.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of a mesh-integrated metal mask of a first embodiment.

FIG. 2 is a sectional view of the mesh-integrated metal mask of the first embodiment.

FIG. 3 is an enlarged cross-sectional view of a part of the mesh-integrated metal mask of the first embodiment.

FIG. 4 is an overall view corresponding to FIG. 1 (D).

FIG. 5 is a manufacturing process drawing of the mesh-integrated metal mask of the second embodiment.

FIG. 6 is a manufacturing process diagram of the mesh-integrated metal mask of the third embodiment.

[Explanation of symbols]

 3 Mask Substrate 4 Enclosing Frame 5 Mesh 10 Electroforming Mother Mold 13 Pattern Resist Film 14 Electrodeposition Layer 15 Flat Plate Jig 16 Elastic Mat 20 Solid Resist 21 Waste Electrodeposition Layer

Claims (4)

[Claims] 1. A step of forming a pattern resist film 13 on the surface of an electroforming mother die 10, and an electrodeposition layer corresponding to the mask substrate 3 on the surface of the electroforming mother die 10 not covered with the pattern resist film 13. Electrodeposition forming step 14, a step of contact-polymerizing conductive mesh 5 on the surfaces of electrodeposition layer 14 and pattern resist film 13, mesh 5 and electrodeposition layer 14 by plating from the mesh 5 direction And a step of peeling the electrodeposition layer 14 together with the mesh 5 from the electroforming mother die 10, and a method of manufacturing a mesh-integrated metal mask. 2. A step of forming a pattern resist film 13 on the surface of the electroforming mother die 10, and an electrodeposition layer corresponding to the mask substrate 3 on the surface of the electroforming mother die 10 not covered with the pattern resist film 13. 14 is electrodeposited, and the electroforming mother die 10 is placed on the flat plate jig 15 via the elastic mat 16, and is formed on the surface of the electrodeposition layer 14 and the pattern resist film 13 and on the outer periphery thereof. A step of contact-polymerizing the mesh 5 having conductivity with the surrounding frame 4 in a state where it is pressed by applying tension to the mesh 5, and a step of integrally plating the mesh 5 and the electrodeposition layer 14 by plating from the mesh 5 direction And a step of peeling the electrodeposition layer 14 together with the mesh 5 from the electroforming mother die 10. 3. A step of forming a pattern resist film 13 on the surface of the electroforming mother die 10, and an electrodeposition layer corresponding to the mask substrate 3 on the surface of the electroforming mother die 10 which is not covered with the pattern resist film 13. 14 electrodeposition forming, a step of peelably sticking the solid resist 20 on the entire surface of the electrodeposition layer 14 and the surface of the patterned resist film 13, and a pattern of the electrodeposition layer 14 from the electroforming master 10. Resist film 13
And the step of peeling the solid resist 20 together, and the solid resist 20 side of the electrodeposition layer 14 and the pattern resist film 13 is placed on the plate jig 15 via the elastic mat 16 and the electrodeposition layer 14 and the pattern resist A step of contact-polymerizing a conductive mesh 5 having a surrounding frame 4 attached to the outer periphery of the film 13 with tension applied to the mesh 5, and plating from the direction of the mesh 5 to form the mesh 5; A method for producing a mesh-integrated metal mask, comprising a step of integrally joining the electrodeposition layer 14 and a step of peeling the electrodeposition layer 14 together with the mesh 5 from the electroforming mother die 10. 4. A step of forming a pattern resist film 13 on the surface of the electroformed mold 10 to be thicker than the thickness of the mask substrate 3, and a pattern resist on the surface not covered with the pattern resist film 13 of the electroformed mold 10. A step of primary electrodeposition of a throwing electrodeposition layer 21 thinner than the thickness of the film 13, and a step of subjecting the surface of the throwing electrodeposition layer 21 to a peeling treatment, and then a secondary deposition of the electrodeposition layer 14 corresponding to the mask substrate 3. The step of electrodeposition, and the electroforming mother die 10 is placed on the flat plate jig 15 via the elastic mat 16, and on the surfaces of the electrodeposition layer 14 and the pattern resist film 13, the outer peripheral frame 4 is provided. The step of contact-polymerizing the mesh 5 having conductivity attached thereto with tension applied thereto, the step of integrally plating the mesh 5 and the electrodeposition layer 14 by plating from the mesh 5 direction, From the dressing layer 21 Mesh-integrated method for producing a metal mask, characterized by comprising a sealable layer 14 and a step of separating each section 5.