WO2014098118A1

WO2014098118A1 - Suspended metal mask for printing and manufacturing method therefor

Info

Publication number: WO2014098118A1
Application number: PCT/JP2013/083863
Authority: WO
Inventors: 秀樹仁科
Original assignee: 株式会社ボンマーク
Priority date: 2012-12-20
Filing date: 2013-12-18
Publication date: 2014-06-26
Also published as: KR101723321B1; TW201446533A; JPWO2014098118A1; CN104884264A; KR20150095867A; JP5970561B2; CN104884264B; TWI564162B

Abstract

In the present invention, obtained is a suspended metal mask for printing with which bleeding does not occur even in thin line portions and for which it does not take time to detach a resist for forming a printing opening pattern. The suspended metal mask for printing is provided with a plate frame (3), a mesh having a metal mesh (1) at least the middle portion of which is electrically conductive and the outer periphery of which is attached and fixed to the inner side of the plate frame so as to be in a stretched state, and a base metal (5) that is tightly adhered and polymerized with the metal mesh and integrally bonded therewith by bond plating and that is provided with a printing opening pattern (5b), wherein overhanging brim parts (5c) are formed at an upper end of the printing opening pattern formed on the base metal, and when the base metal and the metal mesh are integrally bonded by bond plating, a gap (5d) is formed due to the existence of the brim parts between the metal mesh and the upper end of the resist for forming the printing opening pattern.

Description

Suspended metal mask for printing and manufacturing method thereof

The present invention relates to a suspend metal mask for printing and a method for manufacturing the same.

Conventionally, a conductive stainless steel mesh stretched in a tensioned state with respect to an enclosure frame is superposed and adhered to one side of a mask substrate having a large number of openings patterned in a desired printing pattern by electroforming. There is known a mesh-integrated metal mask that is integrally bonded to each other (see, for example, Patent Document 1).

As another conventional technique, a suspend metal mask in which a metal frame is stretched with a Tetron mesh and a stainless mesh and a metal mask is formed on the stainless mesh is known (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 8-183151 Japanese Unexamined Patent Publication No. 2007-245560

In conventional mesh-integrated metal masks or suspend metal masks, when the metal mask and stainless steel mesh are superposed and bonded together by plating, the resist for forming the printing opening pattern exists up to the vicinity of the joint. There was a problem that it was difficult to join. Further, when the resist for forming the printing opening pattern is peeled off, the resist may remain without being peeled off, so that bleeding is likely to occur particularly in the thin line portion. Furthermore, there is a problem that it takes too much work time to remove the resist for forming the printing opening pattern.

The present invention has been made in order to solve the above-described problems, and is a print suspend in which bleeding does not occur even in a thin line portion, and it does not take time to remove a resist for forming a print opening pattern. A metal mask and a manufacturing method thereof are provided.

In the suspending metal mask for printing according to the present invention, a plate frame, a mesh that is stretched by bonding and fixing the outer periphery to the inside of the plate frame, and has a conductive metal mesh at least in the center, and a metal mesh A base metal provided with an opening pattern for printing, which is integrally bonded to each other by bonding, and formed with an overhang at the upper end of the opening pattern for printing formed on the base metal. When the base metal and the metal mesh are integrally joined by joint plating, a gap is formed between the upper end of the printing opening pattern forming resist and the metal mesh due to the presence of the flange.

Further, in the method for producing a suspending metal mask for printing according to the present invention, a mesh having a plate frame and a metallic mesh that is stretched by bonding and fixing the outer periphery to the inside of the plate frame, at least in the center. And a suspending metal mask for screen printing having a base metal provided with an opening pattern for printing that is integrally bonded to a metal mesh and bonded integrally by bonding plating. Applying a resist for pattern formation, plating from above, and forming a base metal having an overhanging collar on the upper end of the resist for forming a print opening pattern; a base metal having a collar and a metal mesh; Between the upper end of the resist for forming the printing opening pattern and the metal mesh It is obtained and a step to be formed a gap by the presence.

In the method for manufacturing a suspending metal mask for printing according to the present invention, a resist for forming a printing opening pattern is applied on a base material, plating is performed thereon, and the upper end of the resist for forming a printing opening pattern is overhanged. In the step of forming the base metal having the flange, the resist for forming the printing opening pattern is thickly applied on the base material, and the first plating is performed so as to be thinner than the resist for forming the printing opening pattern from above, Next, the upper end portion of the resist for forming a printing opening pattern protruding upward from the first plating is polished and removed, and a resist for forming a printing opening pattern having the same height as the upper surface of the first plating is obtained. The second plating is performed from the top of the first plating and the top of the resist for forming the printing opening pattern, which is the same height as the first plating. And it forms a base metal having a overhanging portion overhanging the upper end portion of the over emissions forming resist.

According to the present invention, when the resist for forming the printing opening pattern is peeled off, the resist is easily peeled off and does not remain in the opening pattern for printing of the base metal. In addition, there is an effect that the problem that bleeding is likely to occur particularly in the thin line portion can be solved. Moreover, the working time for removing the resist for forming the printing opening pattern can be greatly shortened.

It is a perspective view which isolate | separates and shows each component required for the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the joining plating process of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state which the junction plating of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention was complete | finished. It is sectional drawing which shows the state which canceled the set from the joining state of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state which has peeled the SUS base material from the base metal of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state before peeling the opening resist of the base metal of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state which peeled the opening resist of the base metal of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state before peeling the resist for printing hole pattern formation of the base metal of the conventional suspend metal mask for printing. It is a principal part expanded sectional view which expands and shows the principal part of FIG. It is sectional drawing which shows the state after peeling the resist for printing hole pattern formation of the base metal of the conventional suspend metal mask for printing. It is sectional drawing which shows the state before peeling the resist for forming the printing opening pattern of the base metal of the suspending metal mask for printing in Embodiment 1 of this invention. It is a principal part expanded sectional view which expands and shows the principal part of FIG. It is principal part sectional drawing which shows the state after peeling the resist for printing hole pattern formation of the base metal of the suspend metal mask for printing in Embodiment 1 of this invention. FIG. 5 is a cross-sectional view showing a state in which the first plating is performed so as to be thinner than the thickness of the resist after applying the resist for forming the printing opening pattern of the base metal of the suspending metal mask for printing in the second embodiment of the present invention. is there. It is sectional drawing which shows the state which removed the upper end part of the resist for forming a printing opening pattern which protrudes upwards rather than 1st time plating by the grinding | polishing etc., and made it the same height as the upper surface of 1st time plating. After removing the upper end of the resist for forming the printing aperture pattern by polishing or the like to make it the same height as the upper surface of the first plating, the second plating is performed on the upper surface of the first plating and the resist for forming the printing aperture pattern. It is sectional drawing which shows the state which formed. FIG. 7 is a cross-sectional view showing a state in which the first plating is performed so as to be thinner than the resist thickness after applying the resist for forming the printing opening pattern of the base metal of the suspending metal mask for printing in Embodiment 3 of the present invention. is there. It is sectional drawing which shows the state which removed the upper end part of the resist for forming a printing opening pattern which protrudes upwards rather than 1st time plating by the grinding | polishing etc., and made it the same height as the upper surface of 1st time plating.

In order to explain the present invention in more detail, this will be described with reference to the attached drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified or abbreviate | omitted suitably.

Embodiment 1.
FIG. 1 is a perspective view showing components necessary for a method for manufacturing a suspending metal mask for printing according to the present invention, and FIGS. 2 to 7 show manufacturing steps of the method for manufacturing a suspending metal mask for printing according to the present invention. 8 to 10 are sectional views showing states before and after removing the resist for forming the printing opening pattern of the base metal of the conventional suspending metal mask for printing, and FIGS. 11 to 13 are suspending for printing according to the present invention. It is sectional drawing which shows the state before and behind peeling the resist for printing opening pattern formation of the base metal of a metal mask, respectively.

As shown in FIG. 1, the constituent elements necessary for the method for producing a suspending metal mask for printing according to the present invention include a metal mesh 1 made of stainless steel or nickel mesh having conductivity and provided at the center, and this metal A square metal plate frame 3 in which a combination mesh composed of a tetron mesh 2 provided outside is electrically connected to the mesh 1 by a conductive tape or the like, and an SUS base material for base metal A base metal 5 provided on 4 and having a printing opening pattern forming resist 5a at a central portion where a printing opening pattern is formed, and a quadrilateral joining auxiliary metal plate in which a tetron mesh 6 is stretched. It is interposed between the frame 7 and the tetron mesh 6 of the metal plate frame 7 for joining assistance and the SUS base material 4 for base metal. It consists of sponge 8. The mesh stretched on the rectangular metal plate frame 3 is preferably a combination mesh composed of a metal mesh 1 at the center and an outer tetron mesh 2 but is not a combination mesh and has electrical conductivity. A single piece of metal mesh 1 may be used. The base metal 5 has a printing opening pattern 5b formed at the center.

In the bonding plating step of the method for producing a suspending metal mask for printing, as shown in FIG. 2, a rectangular metal plate frame 3 is arranged on the right side, and a rectangular bonding auxiliary metal plate frame 7 is arranged on the left side. . Then, the base metal 5 is disposed so as to be overlapped with the metal mesh 1 of the metal plate frame 3, the metal plate frame 3 and the joining auxiliary metal plate frame 7 are overlapped with each other, and fastened and fixed with an adhesive tape 9 or the like, The base metal 5 and the metal mesh 1 are set so as to be in close contact with each other via the base metal SUS base material 4 and the sponge 8. The set in the close contact state is connected to the cathode 10 and electrically connected, and is accommodated in a plating tank 11 built in a nickel plating solution such as a nickel sulfamate bath or a watt bath, and accommodated in an anode back. By connecting the nickel 12 to the anode 13, bonding plating is performed between the base metal 5 and the metal mesh 1, and both are integrally bonded. This bonding plating amount is usually 2 μm on one side, and the same plating method as electroforming plating is used. Further, by using a low current of positive / cathode current density of about 0.1 to 2.0 A / dm ² , preferably 0.25 to 1.0 A / dm ² , it is possible to improve the uniformity of the bonding plating amount and to make the metal Disconnection of the mesh 1 can be prevented.

Next, when the bonding plating step is completed, the one set in the above-mentioned close contact state is taken out from the plating tank 11 (see FIG. 3), and the adhesive tape 9 is removed and the one set in the close contact state is released (see FIG. 4). Next, the base metal SUS base material 4 is peeled from the base metal 5 (see FIGS. 5 and 6). Thereafter, the printing opening pattern forming resist 5a is peeled off from the base metal 5 of the metal plate frame 3 in which the joining portions of the base metal 5 and the metal mesh 1 are integrally joined by plating, whereby the printing opening pattern 5b. Is formed (see FIG. 7). The printing opening pattern forming resist 5a and the printing opening pattern 5b of the base metal 5 are simplified and show only images, and are different from actual ones.

The general structure of the base metal of the conventional suspend metal mask for printing will be described with reference to FIGS. As a base metal of a conventional suspend metal mask for printing, first, a resist 25a for forming a printing opening pattern is applied on a SUS base material 24 for base metal, and then nickel plating is performed on the resist to form a base metal 25. The upper surface of 25 is usually leveled by belt polishing or the like. Bonding plating is performed between the base metal 25 and the metal mesh 21, and the base metal 25 and the metal mesh 21 are integrally coupled (see FIGS. 8 and 9). Then, by removing the printing opening pattern forming resist 25a from the base metal 25, a printing opening pattern 25b is formed at the center (see FIG. 10). As shown in FIGS. 8 and 9, the base metal 25 of the conventional suspend metal mask for printing configured as described above is configured so that the upper end portion of the printing opening pattern forming resist 25 a and the metal mesh 21 are in contact with each other. Therefore, when the weave of the metal mesh 21 is not flat, the protrusion of the metal mesh 21 hits the resist 25a at the time of joining, or when the resist 25a is not polished to the flat portion, the resist 25a There was a problem that it was difficult to join. Further, when the metal is peeled off from the printing opening pattern forming resist 25a, a part of the resist 25a may remain in the printing opening pattern 25b of the base metal 25 without being peeled off. There was a problem that bleeding was likely to occur. Further, when the resist for forming the print opening pattern 25a is peeled off, it takes 2 to 3 hours for the peeling work, and there is a problem that it takes too much work time.

Next, a procedure for producing a base metal of a suspending metal mask for printing according to the present invention that has solved the conventional problems and a configuration of the main part of the base metal will be described with reference to FIGS. In the present invention, first, a printing opening pattern forming resist 5a is applied on the base metal SUS base material 4, and nickel plating is performed thereon, and the upper end portion of the printing opening pattern forming resist 5a due to the side spread phenomenon of plating. A base metal 5 having a flange 5c overhanged by overelectroforming is prepared. The relationship between the length and thickness of the flange 5c is approximately 1: 1. That is, the length of the flange portion 5c is equal to the plate thickness protruding from the upper part of the resist. Unlike the normal case, the upper surface of the base metal 5 is leveled by buffing with a non-woven fabric and a ceramic system, so that damage to the base metal 5 is reduced. The base metal 5 having the flange 5c and the metal mesh 1 are bonded and integrally bonded. It can be seen that the flange 5c increases the bonding area between the base metal 5 and the metal mesh 1 (see FIGS. 11 to 13). At this time, a gap 5d is formed between the metal mesh 1 and the upper end of the printing opening pattern forming resist 5a as shown in FIGS. 11 and 12, due to the presence of the flange 5c. It will be. Because of the gap 5d, the upper end portion of the printing opening pattern forming resist 5a does not exist in the vicinity of the joint portion with the metal mesh 1, so that it is possible to eliminate the inconvenience that it becomes an obstacle during joining, and joining is easy. Become. Then, the printing opening pattern 5b is formed at the center by peeling the printing opening pattern forming resist 5a from the base metal 5 (see FIG. 13). The base metal 5 of the suspending metal mask for printing according to the present invention thus configured has a space between the metal mesh 21 and the resist 25a when the printing opening pattern forming resist 5a is peeled off. Since it is easy to enter and the resist is easily peeled off and does not remain in the printing opening pattern 5 b of the base metal 5, it is possible to solve the problem that pattern chipping and bleeding are likely to occur particularly in the thin line portion. Furthermore, the work time for removing the resist 5a for forming the printing opening pattern is within 30 minutes, and the time can be greatly shortened.
The resist used in this embodiment is usually a dry film type. However, when there is no dry film having a target thickness, the resist may be formed to a target resist thickness using a liquid resist, an electrodeposition resist, or the like. The length and thickness of the flange 5c are 1 to 5 μm, preferably 2 to 3 μm.
In this embodiment, the upper end of the printing opening pattern forming resist 5a applied on the base metal SUS base material 4 is made larger than the lower end, and the opening shape of the base metal printing opening pattern is changed to the upper end ( The opening size on the printing medium side) is larger than the opening size on the lower end (printing side).

Embodiment 2.
FIG. 14 shows a state in which the first plating is performed so as to be thinner than the thickness of the resist after applying the resist for forming the printing opening pattern of the base metal of the suspending metal mask for printing in the second embodiment of the present invention. FIG. 15 is a cross-sectional view showing a state in which the upper end portion of the resist for forming a printing opening pattern protruding upward from the first plating is removed by polishing or the like so as to have the same height as the upper surface of the first plating. In FIG. 16, the upper end portion of the resist for forming the printing opening pattern is removed by polishing or the like to make it the same height as the upper surface of the first plating, and then the second plating is performed on the upper surface of the first plating. It is sectional drawing which shows the state which has the collar part overhanged by the side spread phenomenon.

In the second embodiment, first, the printing opening pattern forming resist 5a is applied to the base metal SUS base material 4 so as to be slightly thick, and then the thickness is made thinner than the printing opening pattern forming resist 5a. First nickel plating 5-1 is performed (see FIG. 14). Then, the upper end portion of the printing opening pattern forming resist 5a protruding upward from the first nickel plating 5-1 is polished and removed, and the printing opening having the same height as the upper surface of the first plating 5-1 is removed. The pattern forming resist 5a-1 is used (see FIG. 15). Next, the second nickel plating is performed on the first nickel plating 5-1 and the printing opening pattern forming resist 5a-1, and the printing opening pattern forming resist 5a-1 is formed by the side spread phenomenon of plating. A base metal 5 having a flange portion 5c overhanged by overelectroforming at the upper end portion is manufactured (see FIG. 16). And the point where the relationship between the length and thickness of the flange portion 5c is approximately 1: 1, the point that the base metal 5 having the flange portion 5c and the metal mesh 1 are joined and integrally bonded, The flange 5c increases the bonding area between the base metal 5 and the metal mesh 1, and between the metal mesh 1 and the upper end of the printing opening pattern forming resist 5a-1 is the flange 5c. The gap 5d that separates the two due to the presence of is formed in the same manner as in the first embodiment.
According to the second embodiment, although labor is increased, there is an advantage that the thickness of the plating can be adjusted without being caught by the thickness of the resist 5a for forming the printing opening pattern. In addition, by polishing the upper end of the resist 5a for forming the printing opening pattern, it can be made the same height as the upper surface of the first plating, so that the in-plane variation during the second plating can be suppressed. There are advantages.
Also, the upper end portion of the printing opening pattern forming resist 5a protruding above the first nickel plating 5-1 is polished and removed, and the printing opening having the same height as the upper surface of the first plating 5-1 is removed. After forming the resist 5a-1 for pattern formation, the surface of the first nickel plating 5-1 may be activated with an acid or the like so as to improve the adhesion with the second plating.
In addition, the flange 5c overhanging the opening is formed on the first resist in order to set the length of the flange 5 to the desired length after the first nickel plating 5-1. It can be manufactured by forming a resist for adjusting the thickness separately and then performing the second plating.

Embodiment 3.
FIG. 17 shows a state in which the first plating is performed so as to be thinner than the thickness of the resist after applying the resist for forming the printing opening pattern of the base metal of the suspending metal mask for printing in the third embodiment of the present invention. 18 is a cross-sectional view showing a state in which the upper end portion of the resist for forming a printing opening pattern protruding upward from the first plating is removed by polishing or the like so as to have the same height as the upper surface of the first plating. It is.

In the first and second embodiments, the upper end portion of the printing opening pattern forming resist 5a applied on the base metal SUS base material 4 is made larger than the lower end portion, and the opening shape of the base metal printing opening pattern is set. The opening size of the upper end (printed material side) is larger than the opening size of the lower end (printing side). In the third embodiment, printing performed on the base metal SUS base material 4 is performed. The lower end portion of the opening pattern forming resist 5a is made larger than the upper end portion, and the opening shape of the base metal printing opening pattern is set so that the opening size of the upper end portion (printed material side) is larger than the opening size of the lower end portion (printing side). Is also small.
According to the third embodiment, since the lower end portion of the printing opening pattern forming resist 5a is made larger than the upper end portion, the resist can be easily peeled off and the omission property during printing is improved. be able to.

DESCRIPTION OF SYMBOLS 1 Metal mesh 2 Tetron mesh 3 Metal plate frame 4 SUS base material for base metal 5 Base metal 5-1 First plating 5-2 Second plating 5a Printing opening pattern formation resist 5a-1 Printing opening after polishing Pattern formation resist 5b Printing opening pattern 5c Gutter 5d Gap 6 Tetron mesh 7 Metal plate frame for joining assistance 8 Sponge 9 Adhesive tape 10 Cathode 11 Plating tank 12 Nickel 13 Anode

Claims

Plate frame,
A mesh having a metal mesh that is electrically conductive at least in the center, and is stretched by bonding and fixing the outer periphery to the inside of the plate frame;
In a suspend metal mask for screen printing comprising a base metal provided with an opening pattern for printing, which is integrally bonded to the metal mesh and integrally bonded by bonding plating,
A resist for forming a printing opening pattern is formed when an overhanging ridge is formed on an upper end portion of the printing opening pattern formed on the base metal and the base metal and the metal mesh are integrally bonded by bonding plating. A suspended metal mask for screen printing, characterized in that a gap is formed between the upper end of the metal mesh and the metal mesh due to the presence of the flange.
2. The suspending metal mask for screen printing according to claim 1, wherein the opening shape of the opening pattern for printing formed on the base metal is such that the opening size on the upper end side is larger than the opening size on the lower end side.
The suspending metal mask for screen printing according to claim 1, wherein the opening shape of the opening pattern for printing formed on the base metal is such that the opening size on the upper end side is smaller than the opening size on the lower end side.
The suspending metal mask for screen printing according to any one of claims 1 to 3, wherein the length of the ridge portion of the base metal is equal to the plate thickness protruding from the upper part of the resist.
A plate frame, a mesh having an outer periphery bonded and fixed to the inside of the plate frame, and a mesh having an electrically conductive metal mesh at least in the center, and an adhesive polymerized to the metal mesh and integrally bonded by bonding plating A suspending metal mask for screen printing comprising a base metal provided with an opening pattern for printing,
Applying a resist for forming a printing opening pattern on a base material, plating from above, and forming a base metal having an overhanging collar on the upper end of the resist for forming a printing opening pattern;
When the base metal having the flange and the metal mesh are integrally bonded by bonding plating, a gap is formed between the upper end of the resist for forming the printing opening pattern and the metal mesh due to the presence of the flange. And a process for producing a suspending metal mask for screen printing, characterized by comprising the steps of:
The process of applying a resist for forming a printing opening pattern on a base material, plating from above, and forming a base metal having an overhanging collar on the upper end of the resist for forming a printing opening pattern is printed on the base material. Applying the resist for forming the opening pattern thickly, performing the first plating so as to be thinner than the thickness of the resist for forming the opening pattern for printing, and then the printing protruding above the first plating. The upper end portion of the opening pattern forming resist is polished and removed to form a printing opening pattern forming resist having the same height as the upper surface of the first plating, and the same height as the first plating and the first plating. The second plating from the top of the resist for forming the print opening pattern is performed, and the overhanging collar is formed on the upper end of the resist for forming the print opening pattern. Method for producing a screen printing suspended metal mask according to claim 5, wherein the forming a base metal to be.