JP6382574B2 - Suspended metal mask and method of manufacturing suspend metal mask - Google Patents

Description

  The present invention relates to a suspend metal mask and a manufacturing method thereof.

  Suspended metal masks are made by bringing a metal screen mesh such as SUS or tungsten into close contact with a patterned metal mask made of nickel or nickel alloy, and from that state, nickel plating or nickel alloy plating is applied. By this, it is a mesh-integrated metal mask in which a screen mesh and a metal mask are bonded together, and due to its structure, the durability at the time of printing is high compared to conventional screen printing plates patterned with photosensitive resin on the screen mesh, It is characterized by excellent dimensional stability by suppressing dimensional elongation due to changes over time during printing. The suspend metal mask manufacturing method includes a step of forming a pattern resist film on the surface of the electroforming mother mold and an electrodeposition layer corresponding to the mask substrate on the surface not covered with the pattern resist film of the electroforming mother mold. A process of electrodeposition formation, a process of tightly polymerizing a conductive mesh on the surface of the electrodeposition layer and the pattern resist film, and a process of integrally bonding the mesh and the electrodeposition layer by applying plating from the mesh direction (pasting) There is a method for producing a mesh-integrated metal mask (a plating process) and a process of peeling the electrodeposition layer from the electroforming mother mold together with the mesh (see, for example, Patent Document 1). Further, as a suspend metal mask and a method for manufacturing the same, a mesh screen is fixed to a rectangular frame, a metal mesh screen having a smaller elasticity than the mesh screen is disposed at a substantially central portion of the mesh screen, An outer peripheral portion of the mesh screen is fixed to the mesh screen, and only the mesh screen portion that is not fixed and overlaps the metal mesh screen is cut out, and then the metal mesh screen and the metal mask are electroplated. In the combination suspend metal mask plate produced by fixing (attaching plating) with, the nickel plating thickness of the portion where the metal mesh screen and the metal mask are fixed is grown at an appropriate thickness, and the other portions are grown. Is only very thin Combination suspended metal mask plate having a high opening ratio high opening ratio can be obtained by not growing the plating (see, for example, references 2) is present.

JP-A-8-183151 (refer to the claims section, detailed description section, and FIGS. 1 to 6) JP 2005-125547 A (refer to the claims section, detailed description section, and FIGS. 5 to 8)

In the suspend metal mask, the adhesion between the screen mesh and the metal mask is very important because it directly affects the durability. This adhesion can be improved by increasing the contact portion between the screen mesh and the metal mask, that is, the contact portion between the intersection portion of the screen mesh and the metal mask.
Suspended metal masks take advantage of the high durability and dimensional stability that are their characteristics, for example, the internal circuit element film formation process for chip-type multilayer ceramic electronic components such as capacitors and inductors, and the current collector electrode formation process for crystalline silicon solar cells Etc. are suitably used.
In recent years, chip-type multilayer ceramic electronic components such as multilayer ceramic capacitors, multilayer inductors, multilayer piezoelectric components, and the like have become increasingly light and thin. When manufacturing a multilayer ceramic electronic component, a plurality of ceramic green sheets are prepared, and these ceramic green sheets are stacked. On a specific ceramic green sheet, depending on the function of the multilayer ceramic electronic component to be obtained, such as a resistance film for constituting a capacitor, resistor, inductor, varistor, filter, etc., or a conductive film such as an internal electrode The internal circuit element film is formed by a screen printing method using a screen printing plate. As described above, chip-type multilayer ceramic electronic components are becoming lighter, thinner, and smaller, and further downsizing, and ceramic green sheets are being made thinner and multilayered in order to achieve higher performance. For example, in the case of a multilayer ceramic capacitor, the ceramic green sheet can be reduced in size and increased in capacity by thinning and multilayering. However, as the ceramic green sheet becomes thinner and multi-layered, the thickness of the internal circuit element film has a greater influence. That is, when an internal circuit element film is formed on a ceramic green sheet and these ceramic green sheets are stacked, a step due to the thickness of the internal circuit element film is formed between a portion where the internal circuit element film is formed and a portion where the internal circuit element film is not formed. Because of the accumulation of pressure, in the process of pressing the laminate obtained by stacking ceramic green sheets, the pressure is not uniformly applied in the main surface direction of the ceramic green sheets, causing delamination (delamination) of the laminate, etc. It may become. In addition, the surface of the laminate may partially swell and do not become a flat surface, and cracks may occur in the swelled portion in the subsequent firing stage.
In order to solve such a problem, it has been proposed to eliminate a step on the ceramic green sheet by screen-printing a ceramic paste in a region where the internal circuit element film on the ceramic green sheet is not formed. The print pattern when printing the ceramic paste in the area where the internal circuit element film is not formed by the screen printing method is completely opposite to the pattern used when printing the internal circuit element film. That is, it is necessary to produce a screen printing plate having a pattern that masks the internal circuit element film portion.
As described above, chip-type multilayer ceramic electronic components are becoming lighter, thinner, and smaller, and internal circuit element films such as internal electrodes must be formed very small and thin. It is necessary to form a plurality of very small and narrow openings. On the other hand, the pattern in the case of screen printing of ceramic paste on the area where the internal circuit element film is not formed, which is the reverse pattern, must mask the internal circuit element film part, so the mask part is very small and thin It becomes. Therefore, when a screen printing plate for printing a ceramic paste is manufactured using a suspend metal mask, a portion to be a metal mask has a shape in which a plurality of very thin patterns are formed in an island shape. Due to the structure of the suspend metal mask, the screen mesh and the metal mask are attached by plating in a state where the intersection of the screen mesh and the metal mask are in close contact with each other. When multiple very small and thin patterns are formed in an island shape, the area where the screen mesh and the metal mask are in close contact with each other is very small, so the metal mask is peeled off the screen mesh by repeating printing, and the suspended metal mask In some cases, the printing durability, which is one of the characteristics of the above, cannot be sufficiently obtained.
Accordingly, an object of the present invention is to provide a suspend metal mask having high durability and good adhesion between the metal mask and the screen mesh.

A first invention of the present invention capable of achieving the above object is a suspend metal mask as described in claim 1, and is as follows.
A suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting and plating, a pattern portion formed by further pasting the metal mask and the screen mesh, and the metal mask on the screen mesh. Electrolytic plating is performed by convection of the electrolytic plating solution by creating a difference in the flow of the electrolytic plating solution to the pattern opening portion that is not formed by sticking and the side of the metal mask that is not in contact with the screen mesh. In the obtained suspend metal mask, at least the pattern portion formed by attaching the metal mask and the screen mesh, the pattern opening portion and the metal not formed by attaching the metal mask to the screen mesh Mask of the mask In have no side and the contact with the Nmesshu precipitation amount of the electrolytic plating are different configurations.

A second invention of the present invention capable of achieving the above object is a suspend metal mask as described in claim 2 and is as follows.
In addition to the invention described in claim 1, a pattern formed by further attaching the metal mask and the screen mesh to a suspend metal mask obtained by attaching a metal mask and a screen mesh by attaching plating . A difference in the flow of the electrolytic plating solution between the portion, the pattern opening portion where the metal mask is not formed on the screen mesh, and the side of the metal mask not in contact with the screen mesh. in suspend metal mask obtained the plating solution by performing electrolytic plating by convection, at least the electrolytic plating, the the said pattern opening portion and the metal mask screen mesh Interview with the metal mask is not formed sticks than the side not in contact with the screen mesh, Serial to said pattern parts metal mask and the screen mesh is formed by sticking a configuration that more precipitation.

A third invention of the present invention capable of achieving the above object is a suspend metal mask as described in claim 3, which is as follows.
In addition to the invention according to claim 1 or claim 2, in suspended metal mask obtained paste Paste plating a metal mask and the screen mesh, stick further the screen mesh and the metal mask The difference in the flow of the electrolytic plating solution between the formed pattern portion, the pattern opening portion not formed by attaching the metal mask to the screen mesh, and the side of the metal mask not in contact with the screen mesh In a suspended metal mask obtained by convection with the electrolytic plating solution and performing electrolytic plating, at least the electrolytic plating has a thickness in the pattern portion formed by attaching the metal mask and the screen mesh. Almost no precipitation in the direction, It is a configuration.

A fourth invention of the present invention capable of achieving the above object is a suspend metal mask as described in claim 4 and is as follows.
In addition to the invention according to any one of claims 1 to 3, wherein the suspended metal mask obtained paste Paste plating a metal mask and the screen mesh, and further the metal mask screen mesh An electroplating solution on a pattern portion formed by adhering, a pattern opening portion not formed by adhering the metal mask to the screen mesh, and a side of the metal mask not contacting the screen mesh. in the suspend metal mask obtained by performing electroless plating difference is convection to the electrolytic plating solution to make a flow, the said electrolytic plating, the formed stick is metal mask before kissing clean mesh in the pattern portion, with little precipitation in the thickness direction, gently the surface direction It is a configuration that out.

A fifth invention of the present invention capable of achieving the above object is a method of manufacturing a suspend metal mask as described in claim 5, and is as follows.
In the manufacturing method of a suspend metal mask obtained by further performing electrolytic plating on a suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting, when performing the electrolytic plating, the metal mask and The pattern portion formed by attaching the screen mesh, the pattern opening portion not formed by attaching the metal mask to the screen mesh, and the side of the metal mask not in contact with the screen mesh, The electroplating is performed by making a difference in the flow of the electroplating solution to convect the electroplating solution .

Since the suspend metal mask and the suspend metal mask manufacturing method according to the present invention have the configuration as described above, the following effects can be obtained.
(1) Since the portion where the screen mesh of the suspend metal mask and the metal mask portion are attached increases, the metal mask portion is hardly peeled off from the screen mesh.
(2) Since plating can be preferentially deposited on the area where the screen mesh of the suspend metal mask and the metal mask part are adhered, the aperture ratio of the screen mesh at the pattern opening is kept high. The metal mask portion of the suspend metal mask can be made difficult to peel off.
(3) At the part where the screen mesh and metal mask are attached, almost no electrolytic plating is deposited in the thickness direction, and electrolytic plating is deposited in the surface direction of the metal mask, so the plating grows in a gentle curve. To do. Therefore, it is possible to suppress resistance applied during squeezing during printing.
(4) At the part where the screen mesh and the metal mask are attached, almost no electrolytic plating is deposited in the thickness direction, and electrolytic plating is deposited in the surface direction of the metal mask, so the plating is deposited in a gentle curve To do. Therefore, clogging of the paste during printing can be suppressed.
(5) Since only a new electrolytic plating process is added to the conventional suspend metal manufacturing process, the manufacturing cost can be minimized.
(6) Since the screen mesh and the metal mask portion are difficult to peel off, it is possible to prevent the metal mask portion of the fine pattern portion from being peeled off by being scratched with a waste cloth or the like during cleaning.

  In a suspend metal mask obtained by further electrolytic plating on a suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting, at least the metal mask and the screen mesh are pasted and formed. The suspended metal mask differs in the amount of deposition of the electrolytic plating in the region where the metal mask is not attached to the screen mesh.

An example of the suspend metal mask of this invention is shown, (a) is principal part schematic sectional drawing which shows what was produced with the prior art, (b) shows the suspend metal mask of this invention, (a It is a principal part schematic sectional drawing which shows what deposited electrolytic plating further on the suspend metal mask of (). 1 shows one embodiment of the suspend metal of the present invention, (a) is a schematic enlarged front view showing a suspend metal mask of the prior art, (b) is a suspend metal mask of the present invention, It is a general | schematic enlarged front view which shows what further deposited electrolytic plating on the suspend metal mask.

Hereinafter, an embodiment of the suspend metal mask of the present invention will be described with reference to the drawings.
In the suspend metal mask of the present invention, an opening pattern of the suspend metal mask is obtained by re-depositing electrolytic plating on a suspend metal mask manufactured by a known method of attaching a metal mask to a screen mesh and integrating with a plating 8. It is characterized in that the screen mesh portion 2 and the metal mask portion 3 are more difficult to be peeled off while hardly changing the aperture ratio of the screen mesh of the portion 4.
For example, a suspend metal mask (see FIG. 1 (a)) produced by stretching a rectangular frame (not shown) by a known method is electroplated on the side where the metal mask portion 3 is not attached, that is, on the screen mesh side 2. It is immersed in the electroplating bath toward the anode side of the bath.
Next, electrolytic plating is deposited on the suspended metal mask 1 at an appropriate current density using the suspended metal mask 1 as a cathode. At this time, electrolytic plating is deposited while performing a treatment such that the plating solution in the electrolytic plating bath is convected (see FIG. 1B).
Any method may be used to convect the plating solution. For example, a method using a jig such as a shielding plate, a method of partially stirring the plating solution in the electrolytic plating bath, a method of positively creating a flow of the plating solution in the electrolytic plating bath, and the like can be mentioned. .

As can be understood by comparing (a) and (b) of FIG. 1, in the present invention, a region where the metal mask 3 is not attached to the screen mesh 2 of the suspend metal mask, that is, a pattern opening portion 4 through which the printed matter is transmitted during printing. By making the flow of the plating solution better than the flow of the plating solution in the portion where the screen mesh 2 and the metal mask 3 are adhered, that is, the pattern portion through which the printed matter does not pass during printing, By making a difference in the flow of the plating solution, it is possible to vary the deposition amount of the electrolytic plating.
That is, by convection of the plating solution, the electrolytic plating can be preferentially deposited on the portion where the screen mesh 2 and the metal mask 3 are adhered rather than the portion of the screen mesh 2 alone (the electrolytic plating is deposited thickly). Region 5). On the other hand, since the plating solution easily flows in the pattern opening portion 4 which is only the screen mesh 2, the electrolytic plating hardly deposits (region 6 where the electrolytic plating is thinly deposited).
In the region where the screen mesh 2 and the metal mask portion 3 are adhered, the plating solution can easily flow on the surface of the screen mesh 2 on the side where the screen mesh 2 and the metal mask portion 3 are not in contact with each other. No precipitation (region 6 where the electrolytic plating is thinly deposited).
Similarly, since the plating solution easily flows on the side of the metal mask portion 3 that does not face the screen mesh 2, the electrolytic plating hardly deposits (region 6 where the electrolytic plating is thinly deposited).
That is, when the plating solution is convected, electrolytic plating hardly deposits on the screen mesh 2 of the pattern opening 4, and in the region where the screen mesh 2 that is the pattern portion and the metal mask 3 are adhered, the thickness direction No electroplating is deposited on the surface of the metal mask, and the electroplating is deposited in the surface direction of the metal mask.
Therefore, in the region where the screen mesh 2 and the metal mask 3 as the pattern portion are adhered, the surface direction is deposited so as to draw a gentle curve from the screen mesh portion 2 toward the metal mask portion 3.

As described above, in the present invention, the screen mesh 2 and the metal mask are more than the conventional suspend metal mask in the state in which the aperture ratio of the screen mesh of the pattern opening 4 of the suspend metal mask and the total thickness of the suspend metal mask are hardly changed. A suspend metal mask 1 ′ that is difficult to peel off from the portion 3 can be obtained.
For example, assuming that the wire diameter of the screen mesh 2 of the pattern opening 4 formed by the normal suspend metal mask 1 is 36 μm and the wire diameter of the screen mesh 2 to which the screen mesh 2 and the metal mask portion 3 are attached is 37 μm, the present invention. The wire diameter of the screen mesh 2 of the pattern opening 4 formed by the suspend metal mask 1 ′ (hereinafter referred to as “power suspend metal”) in which plating is further deposited on the suspend metal mask is 39 μm, the screen mesh 2 and the metal mask portion 3. The wire diameter of the screen mesh 2 in the pattern portion to which is attached is 59 μm (see FIG. 2).
In this way, the electrolytic plating can be preferentially deposited in the region where the screen mesh portion 2 and the metal mask portion 3 are adhered, so that the suspending can be performed while the aperture ratio of the screen mesh 2 in the pattern opening 4 is secured. The screen mesh 2 and the metal mask portion 3 of the metal mask 1 can be made difficult to peel off.
Further, in the region where the screen mesh 2 and the metal mask portion 3 of the power suspend metal mask 1 ′ are attached, almost no electrolytic plating is deposited in the thickness direction, and electrolytic plating is deposited in the surface direction of the metal mask 3. Then, the plating deposits so as to draw a gentle curve without changing the total thickness of the suspend metal mask 1. Therefore, clogging of the paste during screen printing can be suppressed.

The plating bath used in the present invention is not particularly limited as long as it is an electrolytic plating bath.
Moreover, regarding the screen mesh and metal mask used in the present invention, any processing or shape may be applied as long as it has conductivity. Further, it goes without saying that the present invention can also be used in a suspend metal mask that is combined and a suspend metal mask that is not stretched on a frame.

  The plating deposition by the two plating baths, which is a feature of the present invention, can be used not only for a suspend metal mask but also for various screen printing plates using a screen mesh.

1 ... Suspended metal mask 1 '... Suspended metal mask with suspending metal mask 1 further electroplated 2 ... Screen mesh part 3 ... Metal mask part 4 ... Pattern Opening (area where the metal mask is not attached to the screen mesh)
5 ... Area where electrolytic plating is deposited thick 6 ... Area where electrolytic plating is thinly deposited 7 ... Area where metal mask and screen mesh are attached 8 ... Paste Plating

Claims (5)

A suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting and plating, a pattern portion formed by further pasting the metal mask and the screen mesh, and the metal mask on the screen mesh. Electrolytic plating is performed by convection of the electrolytic plating solution by creating a difference in the flow of the electrolytic plating solution to the pattern opening portion that is not formed by sticking and the side of the metal mask that is not in contact with the screen mesh. In the obtained suspend metal mask, at least the pattern portion formed by attaching the metal mask and the screen mesh, the pattern opening portion and the metal not formed by attaching the metal mask to the screen mesh Mask of the mask Suspend metal mask is optionally not side and the contact with the Nmesshu wherein the amount of precipitation of the electroless plating is different. A suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting and plating, a pattern portion formed by further pasting the metal mask and the screen mesh, and the metal mask on the screen mesh. Electrolytic plating is performed by convection of the electrolytic plating solution by creating a difference in the flow of the electrolytic plating solution to the pattern opening portion that is not formed by sticking and the side of the metal mask that is not in contact with the screen mesh. in suspend metal mask obtained, at least the electrolytic plating, the screen mesh than said side not in contact with the screen mesh of the pattern opening portion and the metal mask is not formed with the metal mask is adhered to Interview, the Metal mask and the screen The pattern portion where the mesh is formed by sticking, suspended metal mask according to claim 1, characterized in that it is more precipitation. A suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting and plating, a pattern portion formed by further pasting the metal mask and the screen mesh, and the metal mask on the screen mesh. Electrolytic plating is performed by convection of the electrolytic plating solution by creating a difference in the flow of the electrolytic plating solution to the pattern opening portion that is not formed by sticking and the side of the metal mask that is not in contact with the screen mesh. In the suspend metal mask to be obtained, at least the electrolytic plating is deposited in the surface direction with almost no deposition in the thickness direction in the pattern portion formed by attaching the metal mask and the screen mesh. Claim 1 or Claim 2 Suspend metal mask. A suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting and plating, a pattern portion formed by further pasting the metal mask and the screen mesh, and the metal mask on the screen mesh. Electrolytic plating is performed by convection of the electrolytic plating solution by creating a difference in the flow of the electrolytic plating solution to the pattern opening portion that is not formed by sticking and the side of the metal mask that is not in contact with the screen mesh. in suspend metal mask obtained, the electrolytic plating, the in the pattern portion where the metal mask before kissing clean mesh is formed by sticking, with little precipitation in the thickness direction, gently deposited in the surface direction Any one of claims 1 to 3, wherein Suspend metal mask according to one of claims. In the manufacturing method of a suspend metal mask obtained by further performing electrolytic plating on a suspend metal mask obtained by pasting a metal mask and a screen mesh by pasting, when performing the electrolytic plating, the metal mask and The pattern portion formed by attaching the screen mesh, the pattern opening portion not formed by attaching the metal mask to the screen mesh, and the side of the metal mask not in contact with the screen mesh, A method of manufacturing a suspend metal mask, wherein the electrolytic plating is performed by creating a difference in flow of the electrolytic plating solution and convection of the electrolytic plating solution .

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