JP2010242141A - Vapor deposition mask, and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vapor deposition mask by which a working process is shortened by improving joining strength between a mask body and a frame to eliminate the occurrence of wrinkles and to facilitate the handling of the vapor deposition mask. <P>SOLUTION: The vapor deposition mask includes: the mask body 2 with a thin plate shape in which a vapor deposition pattern comprising a plurality of vapor deposition passage holes 5 is formed in a pattern region 4; a reinforcing frame 3 composed of a material with a low thermal expansion coefficient, which is superposed on the nearly entire surface of the mask body, which has openings 6 with a dimension larger than the pattern region arranged on positions corresponding to the pattern regions of the mask body, and which has a plurality of micropores for joining provided on the entire surface thereof; and a metal plating layer which is formed on the upper face and the side face of the reinforcing frame and the upper face of the mask body with plating by utilizing the plurality of micropores for joining provided on the reinforcing frame, and integrally joins the mask body and the reinforcing frame. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an evaporation mask used when an electrode for organic EL (electroluminescence) or an organic light-emitting substance is formed on a glass substrate by an evaporation mask method, and a manufacturing method thereof.

  As a conventional technology, vapor deposition is performed using a mask body made of a material having a coefficient of thermal expansion different from that of the substrate to be deposited, and in order to improve the dimensional accuracy of the deposition part and the cumulative accuracy of the deposition position, A thin plate-shaped mask body in which a pattern is formed as a through hole in the pattern formation area, and a frame portion having a shape corresponding to the adhesion area that is the outer periphery of the pattern formation area in the mask body The frame body is formed so as to have a sufficient thickness than the mask body using a coefficient material, and the mask body and the frame body are integrated in close contact by a method using an adhesive that is stable against temperature changes. A vapor deposition mask is known (for example, see Patent Document 1).

  Also, as another conventional technique, there is no problem such as alteration of the adhesive layer interposed between the mask body and the frame, and in order to maintain a good bonding state between the mask body and the frame for a long time The mask body is provided with a vapor deposition pattern consisting of a large number of independent vapor deposition holes in the pattern formation region, and the mask body is disposed on the outer periphery of the mask body and is a reinforcement frame for the mask body made of a material having a low coefficient of thermal expansion. Further, a vapor deposition mask is known in which the outer peripheral edge of the pattern formation region of the mask body and the frame body are joined together in an integrated manner through an electrodeposited metal layer formed by electroforming (for example, Patent Documents). 2).

JP 2002-371349 A JP 2005-15908 A

  In a conventional vapor deposition mask in which a mask body and a frame are bonded to each other using an adhesive layer that is stable against temperature changes, the adhesive layer is easily altered by an organic solvent, and between the mask body and the frame. There is a problem that the bonding strength decreases. In addition, in the case of a vapor deposition mask in which the conventional mask body and frame are joined together without separation through an electrodeposited metal layer formed by electroforming, wrinkles are generated around the reinforcing frame when the product is completed. As a result, there was a problem that wrinkles generated when the film was actually set in a vapor deposition machine could not be removed and a gap was formed between the vapor deposition mask and the glass substrate as the vapor deposition target.

  The present invention was made to solve the above-described problems, improves the bonding strength between the mask body and the frame, and facilitates the handling of the vapor deposition mask without the occurrence of wrinkles. It is an object of the present invention to provide a vapor deposition mask capable of shortening the processing steps and a method for manufacturing the same.

  In the vapor deposition mask according to the present invention, a vapor deposition pattern composed of a large number of vapor deposition passage holes is superposed on the entire surface of the thin plate-like mask body formed in the pattern region, and corresponds to the pattern region of the mask main body. A reinforcing frame made of a material having a low coefficient of thermal expansion in which an opening having a size larger than that of the pattern region is provided at a position and a large number of small holes for bonding are provided on the entire surface, and a large number of joints provided on the reinforcing frame A metal plating layer formed by plating on the upper surface and side surfaces of the reinforcing frame and the upper surface of the mask body by using a small hole, and integrally joining the mask body and the reinforcing frame. It is provided.

  Further, a round (R) portion for preventing wrinkles is provided at the corner of the opening of the reinforcing frame.

  In addition, a large number of small holes for joining the reinforcing frame are provided on the entire surface.

  Moreover, the shape of the small hole for joining of the reinforcing frame is a circular shape, an oval shape, or a polygonal shape such as a triangle, a square, or a hexagon.

  Further, the small joining holes located on the outer peripheral portion of the reinforcing frame are partially opened to the outside, and the outer peripheral portion of the reinforcing frame has a jagged shape.

  Further, the outer shape of the mask main body and the outer shape of the reinforcing frame are made substantially the same size.

  Further, in the method for manufacturing a vapor deposition mask according to the present invention, a pattern resist having a resist layer corresponding to a large number of vapor deposition passage holes is formed on the surface of the conductive matrix using a photolithography method, and the matrix is formed. A step of forming a metal layer to be a primary mask body by electroforming an electrodeposited metal on a portion other than the resist layer, and on the surface side of the pattern region having the resist layer corresponding to the vapor deposition passage hole, being larger than the pattern region From the step of laminating a resist provided with openings for positioning the blindfold and reinforcing frame, the step of superposing and aligning the reinforcing frame on the surface of the primary mask body, and from the reinforcing frame side A process of plating and integrally joining the primary mask body and the reinforcing frame with a metal plating layer using a large number of small holes for bonding provided in the reinforcing frame; And thereby separating the primary mask body and the reinforcing frame body from the base material, in which a step of removing the resist layer and the blindfold resist for primary mask body.

  In addition, using a photolithography method on the surface of the conductive base material, a pattern resist having a resist layer corresponding to a large number of vapor deposition passage holes is formed, and a frame-like resist layer surrounding the outer periphery of the mask body is formed. A step of forming a metal layer to be a primary mask body by electroforming an electrodeposited metal in a portion other than the resist layer and the frame-like resist layer of the base material, and a pattern region having a resist layer corresponding to the vapor deposition passage hole A step of laminating a masking resist larger than the pattern area on the surface side, a step of superposing and positioning a reinforcing frame on the surface of the primary mask main body, and a plating from the reinforcing frame side for reinforcement A step of integrally joining the primary mask body and the reinforcing frame by a metal plating layer using a large number of small holes for joining provided in the frame, and an integrated primary The disk body and the reinforcing frame body with peeled from the base material, in which a step of peeling the resist layer of the primary mask body, a frame-shaped resist layer and blindfold resist.

  In addition, the step of positioning the reinforcing frame on the surface of the primary mask body is performed by placing a sponge on the lower surface of the base material of the primary mask body, and the reinforcing frame, the primary mask body, and the sponge from above. They are arranged in order, and these are sandwiched between frames with non-conductive ridges, and a pair of upper and lower frames are fastened and fixed, and plated from above.

  According to the present invention, it is possible to improve the bonding strength between the mask main body and the frame body, to easily handle the vapor deposition mask without generation of wrinkles, and to shorten the processing steps. .

It is a disassembled perspective view which shows the vapor deposition mask in Example 1 of this invention. It is a top view which shows the frame for reinforcement of the vapor deposition mask in Example 1 of this invention. It is the A section enlarged view of the reinforcement frame of FIG. It is a top view which shows the primary mask main body of the vapor deposition mask in Example 1 of this invention. It is a longitudinal cross-sectional view along the BB line of FIG. 4 which shows the manufacturing process of the primary mask main body of the vapor deposition mask in Example 1 of this invention. It is a longitudinal cross-sectional view which shows the manufacturing process of the vapor deposition mask in Example 1 of this invention. It is a longitudinal cross-sectional view which shows the integration process of the primary mask main body and reinforcement frame body in the vapor deposition mask in Example 1 of this invention.

Example 1.
1 is an exploded perspective view showing a vapor deposition mask according to Embodiment 1 of the present invention in a reinforcing frame and a mask body, FIG. 2 is a plan view showing the reinforcing frame of the vapor deposition mask, and FIG. FIG. 4 is an enlarged view showing part A of the reinforcing frame, FIG. 4 is a plan view showing the manufacturing process of the primary mask body of the vapor deposition mask, and FIG. FIG. 6 is a longitudinal sectional view showing a manufacturing process of a vapor deposition mask in Embodiment 1 of the present invention, and FIG. 7 is a primary mask main body and reinforcing frame of the vapor deposition mask in Embodiment 1 of the present invention. It is a longitudinal cross-sectional view which shows the integration process of a body.

  In FIG. 1 and FIG. 2, reference numeral 1 denotes a vapor deposition mask, which comprises a thin plate-like mask body 2 and a reinforcing frame 3 that is closely fixed to the entire surface of the mask body 2. The mask body 2 has, for example, a rectangular shape, and a square pattern region 4 is provided inside. In the pattern region 4, a vapor deposition pattern including a large number of vapor deposition passage holes 5 is formed. Here, nine square pattern regions 4 are shown, but the number is not limited to nine. The reinforcing frame 3 is made of a material having a low thermal expansion coefficient (invar material) having a thickness of about 0.1 mm, and is produced by, for example, etching, and its outer peripheral shape is substantially the same size as the mask body 2. It is. Nine openings 6 are provided in the reinforcing frame 3 at positions corresponding to the pattern areas 4 of the mask body 2, and the opening dimensions are formed larger than the pattern areas 4 of the mask body 2. Yes. In addition, the reinforcing frame 3 has a large number of circular small holes 7 having a diameter of about 0.5 mm and a uniform pitch of about 0.5 mm on the entire surface. 2 is a small hole for joining to the surface. The shape of the small hole 7 located on the outer peripheral portion of the reinforcing frame 3 is changed to a semicircular small hole 7a partially opened to the outside as shown in FIG. By making it jagged, the peripheral length of the joint becomes longer, and the joint strength with the mask body 2 can be further improved. The large number of small holes 7 for joining are not limited to a circular shape, and may be a polygon such as a quadrangle, a triangle, a hexagon, an ellipse, or the like. Further, a round (R) portion for preventing wrinkles is provided at a corner portion of the opening 6 of the reinforcing frame 3, and a current density difference generated during plating between the mask body 2 and the reinforcing frame 3 is provided. It prevents wrinkles caused by a stress difference due to (the current density of the edge portion is increased). Further, the processing of the reinforcing frame 3 may use laser processing. The size and pitch of the small holes 7 for bonding may be appropriately selected according to the required bonding strength, and several sizes may be mixed. Further, the pitch between the small holes may be increased or decreased according to the shape of the joining portion and the desired joining strength.

Next, the process of manufacturing the primary mask body 2a that is the basis of the mask body 2 will be described with reference to FIGS.
First, as shown in FIG. 5A, a pattern resist having a resist layer 9 corresponding to a large number of vapor deposition passage holes 5 is formed on the surface of a conductive base material 8 by using a normal photoresist method. At the same time, a frame-like resist layer 10 surrounding the outer periphery of the primary mask body 2a is formed. Then, the base material 8 is put in an electroforming tank, and an electrodeposited metal such as a nickel alloy is electroformed on a portion other than the resist layer 9 and the frame-like resist layer 10 on the surface of the base material 8, and the primary mask body 2 a. A metal layer 11 is formed. Next, as shown in FIG. 5B, a masking resist 12 and a frame larger than the pattern region are formed on the surface side (metal growth side) of the pattern region 4 having the resist layer 9 corresponding to a large number of vapor deposition passage holes 5. By laminating another frame resist layer 10a on the resist layer 10, a primary mask body 2a as shown in FIG. 4 is produced. 5A and 5B are schematic views and do not represent actual scale relationships. Further, when there is a resist protruding from the plating surface after the metal layer 11 is formed, the resist may be removed by polishing to have substantially the same thickness as the metal layer 11. In addition, before the plating process, the surface of the base material and the surface of the mask body 2 may be activated, or the adhesion may be improved by strike nickel and rough plating of the plating surface.

Next, the manufacturing method of the vapor deposition mask in Example 1 of this invention is demonstrated with reference to FIG. FIG. 6 is a schematic diagram and does not represent an actual scale relationship.
FIG. 6A corresponds to FIG. 5A, and nine pattern regions 4 having resist layers 9 corresponding to a large number of vapor deposition passage holes 5 are formed on the surface of the base material 8. FIG. 6B corresponds to FIG. 5B, and the mask area larger than the pattern area is formed on the surface side (metal growth side) of the pattern area 4 having the resist layer 9 corresponding to a large number of vapor deposition passage holes 5. This is a primary mask body 2a produced by laminating nine resists 12 for use. FIG. 6C shows a reinforcing frame 3 manufactured by an etching method, in which nine openings 6 are provided inside, and many small joining holes 7 are provided on the entire surface. FIG. 6D shows a step of superposing and positioning the reinforcing frame 3 of FIG. 6C on the surface of the primary mask body 2a of FIG. 6B. FIG. 6E shows that after the primary mask main body 2a and the reinforcing frame 3 are placed and aligned, approximately 20 μm plating is performed using the small joining holes 7 provided in the reinforcing frame 3. The process is performed and integrally joined between the primary mask main body 2a and the reinforcing frame 3 by the metal plating layer 13. Details of this integrated joining step will be described later with reference to FIG. The metal plating layer 13 is formed not only on the periphery of the joining small hole 7 of the reinforcing frame 3 and the upper surface of the primary mask main body 2a through it, but also on the upper surface and both side surfaces of the reinforcing frame 3. As a result, the bonding strength is further improved. Finally, in FIG. 6F, the base material 8 and the resists 9 and 10 are peeled off to complete the vapor deposition mask 1 of the present invention. The resist may be removed after the plating of the primary mask body 2a is completed. Moreover, the plating thickness at the time of joining is about 1-100 micrometers, and 10-30 micrometers is good when plating time and intensity | strength are considered, You may change plating thickness in view of required joint strength, plating time, etc. Further, when the diameter of the small hole is not more than twice the plating thickness, the entire hole is plated.

Next, an integration process of the primary mask body and the reinforcing frame body of the vapor deposition mask in Embodiment 1 of the present invention will be described with reference to FIG. FIG. 7A shows a state before contact, and FIG. 7B shows a state after contact. FIG. 7 is a schematic diagram and does not represent an actual scale relationship.
After the reinforcing frame 3 is placed on the surface of the primary mask main body 2a shown in FIG. 6 (d) and aligned, the lower surface of the base material 8 of the primary mask main body 2a as shown in FIG. 7 (a). Sponge 14 is laid, and the reinforcing frame 3, the primary mask body 2a, and the sponge 14 are arranged in this order from above, and a conductive copper tape (conductive tape) 20 is attached to the base material of the primary mask body 2a. These are sandwiched from above and below by a nonconductive rod 16 of an aluminum frame 15 with a nonconductive rod 16 attached thereto. After being sandwiched, the conductive tape 20 is joined to the aluminum frame 15 to conduct electricity. Next, as shown in FIG. 7B, the pair of upper and lower aluminum frames 15 of the non-conductive ridge 16 is polymerized and adhered. Fasten with tape 17 etc. Then, plating is carried out from the upper direction (arrow direction) by about 20 μm. As a result, as shown in FIG. 6 (e), plating is performed using the small joining holes 7 provided in the reinforcing frame 3, and the primary mask body 2 a and the reinforcing frame are formed by the metal plating layer 13. 3 is joined. The metal plating layer 13 is not only plated around the small hole 7 for bonding of the reinforcing frame 3 and the upper surface of the primary mask main body 2a through it, but also on the upper surface and both side surfaces of the reinforcing frame 3. Since the plating is formed, the bonding strength is further improved.

DESCRIPTION OF SYMBOLS 1 Deposition mask 2 Mask main body 2a Primary mask main body 3 Reinforcing frame body 4 Pattern area 5 Deposition passage hole 6 Opening 7 Small hole for joining 7a Semicircular small hole 8 Base material 9 Resist layer 10, 10a Frame-like resist layer 11 Metal layer 12 serving as a primary mask main body 12 Blindfold resist 13 Metal plating layer 14 Sponge 15 Aluminum frame 16 Non-conductive rod 17 Adhesive tape 18 Plating jig 20 Copper tape for current application

Claims (9)

A thin plate-shaped mask body in which a vapor deposition pattern consisting of a large number of vapor deposition passage holes is formed in the pattern region;
A material having a low thermal expansion coefficient that is superposed on almost the entire surface of the mask body, has openings larger in size than the pattern regions at positions corresponding to the pattern regions of the mask body, and has many bonding holes on the entire surface. A reinforcing frame comprising:
The mask main body and the reinforcing frame are formed by plating on the upper surface portion and the side surface portion of the reinforcing frame body and the upper surface portion of the mask main body using a large number of small holes for joining provided in the reinforcing frame. A metal plating layer that integrally bonds with the body;
A vapor deposition mask comprising:   The vapor deposition mask according to claim 1, wherein a round (R) portion for preventing wrinkles is provided at a corner portion of the opening of the reinforcing frame.   2. The vapor deposition mask according to claim 1, wherein a plurality of small holes for joining of the reinforcing frame are provided on the entire surface.   4. The vapor deposition mask according to claim 3, wherein the shape of the small holes for joining of the reinforcing frame is a circular shape, an elliptical shape, or a polygonal shape such as a triangle, a square, a hexagon, or the like.   The small hole for joining located in the outer peripheral part of the reinforcing frame is partially opened to the outside, and the outer peripheral part of the reinforcing frame is formed in a jagged shape. Deposition mask.   The vapor deposition mask according to any one of claims 1 to 5, wherein the outer shape of the mask body and the outer shape of the reinforcing frame have substantially the same dimensions. A vapor deposition pattern consisting of a large number of vapor deposition passage holes is superposed on the entire surface of the mask main body formed in the pattern region and the mask main body, and in a position corresponding to the pattern region of the mask main body, than the pattern region. A reinforcing frame made of a material having a low thermal expansion coefficient provided with large-sized openings and a large number of small holes for bonding on the entire surface, and a large number of small holes for bonding provided in the reinforcing frame. And a metal plating layer formed by plating on the upper surface and side surfaces of the reinforcing frame and the upper surface of the mask main body, and integrally joining the mask main body and the reinforcing frame. A method for manufacturing a mask, comprising:
A pattern resist having a resist layer corresponding to a large number of vapor deposition passage holes is formed on the surface of the conductive base material using a photolithography method, and an electrodeposited metal is electroformed on a portion other than the resist layer of the base material. And forming a metal layer to be a primary mask body,
Laminating a resist provided with an opening for positioning of a blindfold and a reinforcing frame larger than the pattern region on the surface side of the pattern region having a resist layer corresponding to the vapor deposition passage hole;
A step of superposing and positioning the reinforcing frame on the surface of the primary mask body; and
Plating is performed from the reinforcing frame body side, and the primary mask body and the reinforcing frame body are integrally joined by a metal plating layer using a large number of small holes for joining provided in the reinforcing frame body. And a process of
Peeling the integrated primary mask body and reinforcing frame from the base material, and peeling the resist layer and the blinding resist of the primary mask body;
A method for producing a vapor deposition mask, comprising: A vapor deposition pattern consisting of a large number of vapor deposition passage holes is superposed on the entire surface of the mask main body formed in the pattern region and the mask main body, and in a position corresponding to the pattern region of the mask main body, than the pattern region. A reinforcing frame made of a material having a low thermal expansion coefficient provided with large-sized openings and a large number of small holes for bonding on the entire surface, and a large number of small holes for bonding provided in the reinforcing frame. And a metal plating layer formed by plating on the upper surface and side surfaces of the reinforcing frame and the upper surface of the mask main body, and integrally joining the mask main body and the reinforcing frame. A method for manufacturing a mask, comprising:
A pattern resist having a resist layer corresponding to a large number of vapor deposition passage holes is formed on the surface of the conductive base material using a photolithography method, and a frame-shaped resist layer surrounding the outer periphery of the mask body is formed. A step of forming a metal layer to be a primary mask body by electroforming an electrodeposited metal on a portion other than the resist layer and the frame-shaped resist layer of the base material;
Laminating a masking resist larger than the pattern region on the surface side of the pattern region having a resist layer corresponding to the vapor deposition passage hole;
A step of superposing and positioning the reinforcing frame on the surface of the primary mask body; and
Plating is performed from the reinforcing frame body side, and the primary mask body and the reinforcing frame body are integrally joined by a metal plating layer using a large number of small holes for joining provided in the reinforcing frame body. And a process of
Peeling the integrated primary mask body and reinforcing frame from the base material, and peeling the resist layer, the frame-like resist layer and the blindfold resist of the primary mask body;
A method for producing a vapor deposition mask, comprising:   In the process of positioning the reinforcing frame on the surface of the primary mask body, the sponge is laid on the lower surface of the base material of the primary mask body, and the reinforcing frame, primary mask body, and sponge are arranged in this order from the top. The method of manufacturing a vapor deposition mask according to claim 7 or 8, wherein these are sandwiched between frames with non-conductive ridges, a pair of upper and lower frames are fastened and fixed, and plating is performed from above. .

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