JP2014162109A - Method for manufacturing screen printing plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a screen printing plate, the method being capable of suppressing unevenness of the surface of a second resist layer.SOLUTION: A method for manufacturing a screen printing plate comprises: (i) forming a first photosensitive resist layer on a reference surface 2a, and then exposing and developing the first photosensitive resist layer to form a first covering part 21 having a through-hole 21p; (ii) forming a first metal layer 12 having a mesh hole 13 and a dummy metal layer 18 disposed within the mesh hole 13, by electrolytic plating; (iii) after removing the first covering part, forming a second photosensitive resist layer, and then exposing and developing the second photosensitive resist layer to form a second covering part; (iv) forming a second metal layer 14 having a pattern printing hole 15, by electrolytic plating; and (v) after removing the second covering part, with the dummy metal layer 18 remaining formed on the reference surface 2a, peeling the first metal layer 12 away from the reference surface 2a, then taking out a laminate 10 having the second metal layer 14 laminated on the first metal layer 12.

Description

  The present invention relates to a method for producing a screen printing plate, and more particularly to a method for producing a screen printing plate including a metal layer formed by electrolytic plating.

  In the manufacturing process of electronic parts, when a conductive pattern such as an electrode pad or wiring is formed by screen printing, a screen printing plate is used.

  For example, as shown in the cross-sectional view of FIG. 12, the screen printing plate 1 includes a first metal layer 131 and a second metal layer 132 formed on the first metal layer 131. The mesh holes 142 formed in the first metal layer 131 and the pattern printing holes 141 formed in the second metal layer 132 communicate with each other. The paste is supplied from the first metal layer 131 side, and the paste filled in the pattern printing holes 141 through the mesh holes 142 is transferred to the substrate.

  This screen printing plate 1 is produced, for example, by the process shown in the cross-sectional view of FIG. That is, as shown in FIG. 13A, a photosensitive resist layer is formed on the substrate 110, exposed and developed, and the first covering portion 121 corresponding to each mesh hole through which the paste passes is formed. Form. Next, as shown in FIG. 13B, a metal film is grown by electroplating to form a first metal layer 131 having mesh holes. Next, as shown in FIG. 13C, a photosensitive resist layer is formed on the first metal layer 131, exposed and developed, so that the second covering portion 122 corresponding to the pattern printing hole 15 is formed. Form. Next, as shown in FIG. 13D, a second metal layer 132 is formed by electroplating. Next, when the first and second cover portions 121 and 122 are peeled off and the first and second metal layers 131 and 132 are separated from the substrate 110, the first and second metal layers 131 and 132 are integrated. A screen printing plate can be produced using the resulting laminate (see, for example, Patent Document 1).

JP 2004-025709 A

  As shown in FIGS. 13B and 13C, the first cover 121 protrudes from the first metal layer 131 and the second cover 132 is formed. When a photosensitive resist layer is formed using a resist, irregularities are formed on the surface of the resist layer for forming the second covering portion.

  For example, as shown in the explanatory diagram of FIG. 11, when the original mask 32 is brought into close contact with the surface 22 u of the resist layer 22 y formed on the first covering portion 121 and the first metal layer 131 and exposed, If unevenness is formed on the surface 22u of the resist layer 22y near the figure edge 33 (the boundary between the light shielding portion and the light transmitting portion) of the mask 32, the light beam for exposure is refracted on the surface 22u of the resist layer 22y. The outer shape of the second covering portion cannot be formed with high accuracy, and the shape of the pattern printing hole of the second metal layer is disturbed.

  In order to cope with the downsizing of electronic components, it is necessary to form a high-accuracy second covering portion in order to further reduce the size and accuracy of the screen printing plate. It is necessary to suppress unevenness on the surface of the resist layer to be formed.

  If the heights of the first covering portion 121 and the first metal layer 131 are made uniform, unevenness on the surface of the resist layer for forming the second covering portion can be suppressed. However, it is not easy to align the heights of the first covering portion 121 and the first metal layer 131 with high accuracy.

  Therefore, a method of forming a resist layer for forming the second covering portion after removing the first covering portion can be considered. In this case, as a result of the removal of the first covering portion, the surface of the resist layer for forming the second covering portion has unevenness due to the influence of the depression of the mesh hole portion of the first metal layer. It becomes easier to form.

  In view of such circumstances, the present invention intends to provide a method for producing a screen printing plate capable of suppressing unevenness on the surface of a resist layer for forming a second covering portion.

  In order to solve the above problems, the present invention provides a method for producing a screen printing plate having the following configuration.

  In the method for producing a screen printing plate, a second metal layer is laminated on a first metal layer, and mesh holes 13 formed in the first metal layer and a pattern formed in the second metal layer. This is a method for producing a screen printing plate in communication with the printing holes 15. The method for producing a screen printing plate includes first to fifth steps. In the first step, a photosensitive first resist layer is formed on the reference surface, exposed and developed, and has an outer peripheral surface corresponding to the inner peripheral surface of the mesh hole. A through-hole through which the reference surface is exposed is formed in at least one of the first covering portions on the inner side of the outer peripheral surface of the first covering portion. In the second step, in the state where the first covering portion is formed, by electroplating, (a) on the portion of the reference surface outside the first covering portion, the first covering portion is formed. Forming the first metal layer in which the inner peripheral surface of the mesh hole is formed along the outer peripheral surface of one covering portion, and (b) from the first covering portion of the reference surface A dummy metal layer is formed on a portion exposed from the through hole on the inner side. In the third step, after removing the first covering portion, a photosensitive second resist layer is formed on the first metal layer and the mesh hole, and is exposed and developed. A second covering portion having an outer peripheral surface corresponding to the inner peripheral surface of the pattern printing hole is formed. In the fourth step, the pattern is formed on the first metal layer along the outer peripheral surface of the second covering portion by electrolytic plating in a state where the second covering portion is formed. The second metal layer on which the inner peripheral surface of the printing hole 15 is formed is formed. In the fifth step, after removing the second covering portion, the first metal layer is peeled from the reference surface while the dummy metal layer is formed on the reference surface, A stacked body in which the second metal layer is stacked on the first metal layer is taken out.

  In the above method, the dummy metal layer is formed in the mesh hole of the first metal layer with a space between the inner peripheral surface of the mesh hole by the first covering portion in which the through hole is formed. . The second covering portion may cover only a part or all of the mesh hole. The second covering portion may be in contact with or separated from the reference surface exposed from the mesh hole. The second covering portion may or may not cover the dummy metal layer.

  According to the above method, by forming the dummy metal layer in the mesh hole of the first metal layer, the unevenness of the surface of the second resist layer for forming the second covering portion can be suppressed. .

  Preferably, in the first step, a width between the outer peripheral surface of the first covering portion in which the through hole is formed and the inner peripheral surface of the through hole is set to be equal to that of the first covering portion. The thickness is 0.5 times or more and 1.0 times or less of the thickness.

  If the width of the first covering portion is 0.5 times or more of the thickness, the first covering portion remaining between the first metal layer and the dummy metal layer can be easily removed. If the width of the first covering portion is 1.0 times or less of the thickness, the unevenness on the surface of the resist layer for forming the second covering portion can be sufficiently suppressed.

  In a preferred aspect, in the first step, a width between the outer peripheral surface of the first covering portion in which the through hole is formed and the inner peripheral surface of the through hole is 10 μm or more and 20 μm. Below.

  In this case, the current density at the time of plating becomes substantially uniform in the vicinity of the first covering portion, and the thickness of the first metal layer and the dummy electrode 18 can be made more uniform. Therefore, the unevenness of the surface 22s of the second resist layer 22 can be suppressed.

  Preferably, in the third step, when viewed through from the normal direction of the first metal layer, the mesh hole is completely covered with the second covering portion, and the outer shape of the mesh hole and the second The shortest distance from the outer shape of the covering portion is set to 0 μm or more and 10 μm or less.

  In this case, a screen printing plate having a minimum distance of 10 μm or less between the mesh hole and the pattern printing hole 15 that has been difficult to manufacture can be manufactured without adding a special process.

  According to the present invention, unevenness on the surface of the resist layer for forming the second covering portion can be suppressed, and the second covering portion can be formed with higher accuracy. This makes it possible to produce a screen printing plate that is further miniaturized and made highly accurate.

It is sectional drawing which shows the manufacturing process of a screen printing plate. Example 1 It is sectional drawing which shows the manufacturing process of a screen printing plate. Example 1 It is sectional drawing which shows the manufacturing process of a screen printing plate. Example 1 It is a perspective view which shows the manufacturing process of a screen printing plate. Example 1 It is a top view of the original mask for mesh hole formation. Example 1 It is sectional drawing which shows the manufacturing process of a screen printing plate. (Comparative Example 1) It is sectional drawing which shows the manufacturing process of a screen printing plate. (Comparative Example 1) It is sectional drawing which shows the manufacturing process of a screen printing plate. (Comparative Example 1) It is a perspective view which shows the manufacturing process of a screen printing plate. (Comparative Example 1) It is a top view of the original mask for mesh hole formation. (Comparative Example 1) It is sectional drawing in the manufacturing process of a screen printing plate. (Example) It is sectional drawing of a screen printing plate. (Conventional example 1) It is sectional drawing which shows the manufacturing process of a screen printing plate. (Conventional example 1)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The manufacturing method of the screen printing plate of Example 1 is demonstrated, referring FIGS. 1-3 is sectional drawing which shows the manufacturing process of a screen printing plate. FIG. 4 is a perspective view showing a manufacturing process of the screen printing plate. 1 to 3 are cut views taken along line XX of FIG.

  As shown in FIGS. 3K and 4D, the screen printing plate includes a laminate 10 in which a second metal layer 14 is laminated on a first metal layer 12. A mesh hole 13 is formed in the first metal layer 12. A pattern printing hole 15 corresponding to a printed figure is formed in the second metal layer 14. The mesh hole 13 and the pattern printing hole 15 communicate with each other.

  The laminate 10 of the screen printing plate can be manufactured by the following steps.

(1) First Step As shown in FIG. 1A, a photosensitive first resist layer 20 is formed on the reference surface 2 a of the base material 2.

  For example, a stainless steel base material 2 having a reference surface 2a having a surface roughness Ra of 0.01 μm to 1 μm is prepared, and after the surface treatment such as alkali degreasing, water washing, acid treatment, water washing, drying, etc., the photoresist solution is used as a reference. The surface 2a is spin-coated, or a dry film resist is bonded to the reference surface 2a with a laminator.

  The first resist layer 20 is thicker than the first metal layer 12. In the process to be described later, when the plating film is grown to form the first metal layer 12, if the first coating portion 21 is lower than the first metal layer 12, the plating film is the first coating. It is formed so as to protrude from the upper surface 21 s of the portion 21, and the opening size accuracy of the mesh hole 13 cannot be guaranteed. This is to prevent this. The first resist layer 20 is preferably about 2 μm to 10 μm higher than the thickness of the first metal layer 12.

  Next, as shown by an arrow in FIG. 1B, the first resist layer 20 is exposed through the original mask 30. Next, the first resist layer 20 is developed to form a first covering portion 21 on the reference surface 2a as shown in FIGS. 1C and 4A.

  FIG. 5A is a plan view of the original mask 30. As shown in FIG. 5A, the original mask 30 is formed with a rectangular frame-shaped figure 31. An outer shape 31 k of the graphic 31 corresponds to the opening shape of the mesh hole 13. A broken line 15 x is the opening shape 15 k of the corresponding pattern printing hole 15.

  When the first covering portion 21 is formed by the exposed portion of the first resist layer 20, the portion of the figure 31 is a light transmitting portion that transmits light, and the shaded portion is a light shielding portion that blocks light. is there. An outer peripheral surface 21 a of the first covering portion 21 is formed by the outer shape 31 k of the graphic 31. A slanting portion 31 p is formed inside the figure 31.

  Like the original mask 30a shown in the plan view of FIG. 5B, corresponding to the opening shape 15k of the pattern printing hole 15, rhomboid or triangular light transmitting portions 31a, 31b are formed, and the light transmitting portions 31a, 31b are formed. The light shielding portions 31q and 31r may be disposed inside the. The translucent part may have another shape such as a sector shape or a honeycomb shape. The original mask may include a light-transmitting portion corresponding to the opening shape 15k of the pattern printing hole 15 in which the light shielding portion is not disposed.

  As shown in FIG. 1C and FIG. 4A, a through hole 21p is formed in the first covering portion 21 inside the outer peripheral surface 21a of the first covering portion 21 by the oblique light portion 31p. The reference surface 2a is exposed from the through hole 21p.

  If the width between the outer peripheral surface 21a of the first covering portion 21 and the inner peripheral surface 21b of the through hole 21p is 0.5 times or more the thickness of the first covering portion 21, the first metal layer The first covering portion 21 remaining between 12 and the dummy metal layer 18 can be easily removed. If the width of the first covering portion 21 is not more than 1.0 times the thickness of the first covering portion 21, the surface 20s of the first resist layer 20 for forming the second covering portion 21 (FIG. 1 (a)) can be sufficiently suppressed. Therefore, the width of the first covering portion 21 is preferably 0.5 times or more and 1.0 times or less the thickness of the first covering portion 21.

  For example, the width between the outer peripheral surface 21a of the first covering portion 21 and the inner peripheral surface 21b of the through hole 21p is such that the width of the first covering portion 21 is not less than 10 μm and not more than 20 μm. In this case, the current density at the time of plating becomes substantially uniform in the vicinity of the first covering portion 21, and the thicknesses of the first metal layer 12 and the dummy electrode 18 can be made more uniform. Therefore, the unevenness of the surface 22s (see FIG. 2F) of the second resist layer 22 described later can be suppressed.

(2) Second Step Next, as shown in FIG. 2D, in the state where the first covering portion 21 is formed on the reference surface 2a, the first of the reference surfaces 2a is formed by electrolytic plating. A plating film is grown on a portion not covered with the covering portion 21 to form the first metal layer 12 and the dummy metal layer 18. For example, the first metal layer 12 and the dummy metal layer 18 are formed to have a thickness of 10 μm to 50 μm by Ni plating using a sulfamic acid Ni bath that is superior in controlling the stress of the plating film.

  The first metal layer 12 is formed on a portion of the reference surface 2 a that is outside the first covering portion 21. An inner peripheral surface 13 a of the mesh hole 13 is formed on the first metal layer 12 along the outer peripheral surface 21 a of the first covering portion 21. The dummy metal layer 18 is formed on a portion of the reference surface 2a that is exposed from the through hole 21p inside the first covering portion 21. The dummy metal layer 18 is formed inside the mesh hole 13 of the first metal layer 12 with a space between the inner peripheral surface 13 a of the mesh hole 13.

  When the inner diameter of the mesh hole 13 (the outer diameter of the cylinder in contact with the inner peripheral surface 13a of the mesh hole 13) is 50 to 200 μm, the dummy metal layer 18 can be formed inside the mesh hole 13, and the mesh hole 13 The effect by having formed is acquired.

  When the plating film is formed, the change in current density due to the first covering portion 21 is reduced in the vicinity of the first covering portion 21, so that the amount of deposited metal becomes more uniform. As a result, the thicknesses of the first metal layer 12 and the dummy metal layer 18 are more uniformly formed as compared with the case where the through hole 21p is not formed in the first covering portion 21.

(3) Third Step Next, as shown in FIGS. 2E and 4B, the first covering portion 21 is removed. For example, the first covering portion 21 is completely removed by showering and immersing in an alkaline solution or an organic solvent-containing solution, and then the surface alkaline component is washed by a water washing treatment. As a result, a frame-shaped groove 19 is formed between the first metal layer 12 and the dummy metal layer 18.

  Next, as shown in FIG. 2F, a photosensitive second resist layer 22 is formed on the first metal layer 12 and the mesh hole 13 (that is, the dummy metal layer 18 and the groove 19). To do.

  For example, a liquid resist is applied by a spin coater and then dried. Or a film resist is stuck using a laminator. The second resist layer 22 is thicker than the second metal layer 14.

  Since the dummy metal layer 18 is formed inside the mesh hole 13 of the first metal layer 12, there is no concave shape on the surface 22s, and a smooth and uniform second resist layer 22 can be formed. it can. That is, when the dummy metal layer 18 is not formed inside the mesh hole 13 of the first metal layer 12 as in Comparative Example 1 described later, a liquid resist is applied on the first metal layer 12. When the second resist layer 22 is formed, the surface of the second resist layer 22 is not in a smooth state due to the influence of the mesh holes 13 of the first metal layer 12 serving as a base. It becomes a concave shape at the corresponding location. On the other hand, when the dummy metal layer 18 is formed inside the mesh hole 13 of the first metal layer 12, the depression of the second resist layer 22 can be prevented by the dummy metal layer 18.

  The same effect can be obtained when a dry film resist is applied with a laminator to form the second resist layer 22, and a uniform second resist layer 22 having a smooth surface and no stress can be formed. . In the case of using a dry film, the dry film is not filled in the groove portion between the inner peripheral surface of the mesh hole and the outer peripheral surface of the dummy metal layer, but no problem occurs.

  Next, as shown in FIG. 2G, exposure is performed through the second original mask 32.

  Next, the second resist layer 22 is developed to form a second covering portion 23 as shown in FIG. The second covering portion 23 has an outer peripheral surface 23 a corresponding to the inner peripheral surface 15 a of the pattern printing hole 15. The second covering portion 23 is also formed on the dummy metal layer 18 formed in the mesh hole 13 of the first metal layer 12 and is in contact with the dummy metal layer 18.

  The second resist layer 22 having a uniform surface and no dents is in a state of extremely excellent adhesion without a gap in the vicinity of the graphic edge 33 of the original mask 32 (the boundary between the light transmitting portion and the light shielding portion). Can be exposed. Therefore, the outer peripheral surface 23a of the second covering portion 23 obtained after development can be accurately formed, and the covering portion 23 in which the figure of the original mask 32 is accurately reflected can be formed.

  When the dummy metal layer 18 is formed, a recess is not formed on the surface 22s of the second resist layer 22, or even if it is formed, the inner surface 13a of the mesh hole 13 and the inner periphery of the pattern printing hole 15 are extremely small. The distance D between the surface 15a (see FIG. 3 (k)) can be made narrower. For example, the distance D can be set to 0 to 10 μm. As a result, the opening size of the mesh hole 13 can be increased, and the degree of freedom in designing the paste discharge amount that affects printing characteristics and quality is increased.

  When the screen printing plate having a distance D of 0 to 10 μm is seen through from the normal direction of the first metal layer 12 (vertical direction in FIG. 2 (h)), the mesh holes 13 are formed by the second covering portion 23. By covering completely, the shortest distance between the outer shape of the mesh hole 13 (that is, the inner peripheral surface 13a) and the outer shape of the second covering portion 23 (that is, the outer peripheral surface 23a) is 0 μm or more and 10 μm or less, Can be manufactured.

(4) Fourth Step Next, as shown in FIG. 3 (i), the second metal layer is formed on the first metal layer 12 by electrolytic plating in a state where the second covering portion 23 is formed. 14 is formed. In the second metal layer 14, the inner peripheral surface 15 a of the pattern printing hole 15 is formed along the outer peripheral surface 23 a of the second covering portion 23.

  For example, after acid cleaning is performed to activate a portion of the surface of the first metal layer that is not covered with the second covering portion, the plating films of the first metal layer and the dummy metal layer are grown. Similarly to the case, Ni plating using a sulfamic acid Ni bath is performed. The second metal layer 14 is formed to have a thickness of 10 μm to 100 μm.

(5) Fifth Step Next, as shown in FIG. 3 (j), the second covering portion 23 is removed. For example, after washing with water, the second covering portion 23 is peeled off and the surface is washed with water.

  Next, with the dummy metal layer 18 formed on the reference surface 2a, the first metal layer 12 is peeled off from the reference surface 2a, and the first metal layer 12 is removed as shown in FIG. The laminate 10 on which the second metal layer 14 is laminated is taken out to form a screen printing plate.

  Even if the laminated body 10 is pasted on a printing frame prepared by pasting a supporting ridge in advance to form a combination screen printing plate, the laminated body 10 is directly pasted on the printing frame without using a supporting ridge, A directly pasted screen plate may be formed.

  In the production of the combination screen plate, a tension is applied to the laminate 10 by bonding and drying the support rods to the outer periphery of the laminate 10 with an adhesive and cutting and removing the support rod screen inside the laminate 10. Thereafter, the first metal layer 12 of the laminate 10 is peeled off from the reference surface 2a of the base material 2 to complete a screen printing plate. At this time, since the first metal layer 12 and the dummy metal layer 18 are formed apart from each other on the reference surface 2a of the base material 2 and are independent from each other, the dummy metal layer 18 is peeled off from the base material 2. It remains on the reference surface 2a of the base material 2 without any problems. Therefore, the mesh hole 13 of the completed screen printing plate is secured with the opening hole size as originally designed.

  The same applies to the production operation of the direct-bonding screen plate. A fixing metal frame serving as an auxiliary plate is prepared in advance on the printing frame, and the metal frame is pasted on the outer peripheral surface of the laminate 10 and dried, and then the mother frame is prepared. The laminate 10 is peeled off from the reference surface 2 a of the material 2. When the laminate 10 is peeled off, the dummy metal layer 18 remains on the reference surface 2a of the base material 2, so that the mesh hole 13 of the completed screen printing plate has an opening hole size as originally designed.

  Through the above steps, the unevenness of the surface 22s of the second resist layer 22 for forming the second covering portion 23 can be suppressed, and the screen printing plate can be processed more finely and accurately.

  <Comparative example 1> Manufacture of the screen printing plate of the comparative example 1 is demonstrated referring FIGS. 6-10.

(1) First Step As shown in FIG. 6A, a photosensitive first resist layer 20 is formed on the reference surface 2 a of the base material 2. 6B, the first resist layer 20 is exposed through the original masks 30x and 30y as indicated by arrows. Next, the first resist layer 20 is developed to form a first covering portion 21x on the reference surface 2a as shown in FIGS. 6C and 9A.

  10A and 10B are plan views of the original masks 30x and 30y. As shown in FIG. 10, light-transmitting portions 31x, 31y, and 31z for forming mesh holes 13 are formed in the original masks 30x and 30y. Unlike the first embodiment, no light shielding portion is formed inside the light transmitting portions 31x, 31y, and 31z. For this reason, the first covering portion 21x is not formed with a through hole through which the reference surface 2a is exposed.

(2) Second Step Next, as shown in FIG. 6D, in the state where the first covering portion 21 is formed on the reference surface 2a, the first of the reference surfaces 2a is formed by electrolytic plating. A plating film is grown on the portion not covered with the covering portion 21x to form the first metal layer 12. Since no through hole is formed in the first covering portion 21 x, no dummy metal layer is formed in the mesh hole 13 of the first metal layer 12.

(3) 3rd process Then, as shown in Drawing 7 (e), the 1st covering part 21 is removed. Next, as shown in FIG. 7F, a photosensitive second resist layer 22 x is formed on the first metal layer 12 and the mesh hole 13. Next, as shown in FIG. 7G, exposure is performed through the second original mask 32. Next, the second resist layer 22 is developed to form a second covering portion 23x as shown in FIG.

(4) Fourth Step Next, as shown in FIG. 8 (i), the second metal layer is formed on the first metal layer 12 by electrolytic plating in a state where the second covering portion 23 is formed. 14 is formed.

(5) Fifth Step Next, as shown in FIG. 8 (j), the second covering portion is removed. Next, with the dummy metal layer formed on the reference surface, the first metal layer 12 is peeled off from the reference surface, and the first metal layer 12 is formed on the first metal layer 12 as shown in FIG. The laminate 10 in which the two metal layers 14 are laminated is taken out.

  When a screen printing plate is produced without forming a dummy metal layer by the above process, the second resist layer 22x has irregularities formed on the surface 22t due to the influence of the mesh holes 13 formed in the first metal layer 12. Cheap.

  As shown in FIG. 7G, if irregularities are formed on the surface 22t of the resist layer 22x in the vicinity of the graphic edge 33 (the boundary between the light-shielding portion and the light-transmitting portion) of the original mask 32, exposure for exposure is performed. Since the light beam is refracted on the surface 22t of the resist layer 22x, the outer shape of the second covering portion 23 cannot be formed with high accuracy, and the shape of the pattern printing hole 15 of the second metal layer 14 is disturbed.

  On the other hand, in Example 1, since the irregularities on the surface of the second resist layer can be suppressed by forming the dummy metal layer, the pattern printing holes of the second metal layer are made finer and higher. It becomes easy to process to accuracy.

  For example, the distance D shown in FIGS. 3K and 8K, that is, the inner peripheral surface 13a of the mesh hole 13 of the first metal layer 12 and the pattern printing hole 15 of the second metal layer 14 are. As for the screen printing plate in which the distance D between the inner peripheral surface 15a and the inner peripheral surface 15a is 0 to 10 μm, in Comparative Example 1, it is difficult to manufacture a screen printing plate that satisfies the required accuracy. On the other hand, in Example 1, by forming the dummy metal layer 18, it is possible to manufacture a screen capable of screen printing that satisfies the same required accuracy in the same process as in Comparative Example 1.

  <Summary> As described above, by forming the dummy metal layer disposed inside the mesh hole of the first metal layer, the unevenness of the surface of the second resist layer can be suppressed. Thereby, the screen printing plate can be processed more finely and with high accuracy.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the second covering portion may cover the entire dummy metal layer, may cover only a part, or may not cover at all. Even when a plating film is formed around the dummy metal layer that is not covered with the second covering portion by electrolytic plating when forming the second metal layer, the base material is separated from the base material. If left on the side, there is no problem. In this case, it is possible to form the second metal layer 14 having a more uniform thickness as compared with the case where the dummy metal layer is covered with the second covering portion.

2 Base material 2a Reference surface 10 Laminated body 12 First metal layer 13 Mesh hole 13a Inner peripheral surface 14 Second metal layer 15 Pattern printing hole 15a Inner peripheral surface 15k Open shape 18 Dummy metal layer 19 Groove 20 First resist Layers 21 and 21x First covering portion 21a Outer peripheral surface 21b Inner peripheral surface 21p Through hole 21s Upper surface 22, 22x Second resist layer 22s, 22t, 22u Surface 23 Second covering portion 23a Outer peripheral surface 30, 30a, 30x, 30y original mask 31a, 31b, 31x, 31y, 31z translucent part 31k outer shape 31p, 31q, 31r light shielding part 32 original mask

Claims (4)

A screen in which a second metal layer is laminated on the first metal layer, and mesh holes 13 formed in the first metal layer communicate with pattern printing holes 15 formed in the second metal layer. A method for producing a printing plate, comprising:
A photosensitive first resist layer is formed on the reference surface, exposed and developed to form a first covering portion having an outer peripheral surface corresponding to the inner peripheral surface of the mesh hole, A first step of forming, in at least one of the first covering portions, a through hole in which the reference surface is exposed inside the outer peripheral surface of the first covering portion;
With the first covering portion being formed, by electroplating,
The first metal in which the inner peripheral surface of the mesh hole is formed along the outer peripheral surface of the first covering portion on a portion of the reference surface outside the first covering portion. Forming a layer,
A second step of forming a dummy metal layer on a portion of the reference surface that is exposed from the through hole inside the first covering portion;
After removing the first covering portion, a photosensitive second resist layer is formed on the first metal layer and the mesh hole, exposed to light, and developed. A third step of forming a second covering portion having an outer peripheral surface corresponding to the peripheral surface;
With the second covering portion formed, the inner peripheral surface of the pattern printing hole is formed on the first metal layer by electrolytic plating along the outer peripheral surface of the second covering portion. A fourth step of forming the second metal layer formed with:
After removing the second covering portion, the first metal layer is peeled off from the reference surface while the dummy metal layer is formed on the reference surface. A fifth step of taking out a laminate in which the second metal layer is laminated;
A method for producing a screen printing plate, comprising:   In the first step, the width between the outer peripheral surface of the first covering portion in which the through hole is formed and the inner peripheral surface of the through hole is set to 0 of the thickness of the first covering portion. The method for producing a screen printing plate according to claim 1, wherein the ratio is 5 times or more and 1.0 time or less.   In the first step, the width between the outer peripheral surface of the first covering portion in which the through hole is formed and the inner peripheral surface of the through hole is set to 10 μm or more and 20 μm or less. The method for producing a screen printing plate according to claim 1, wherein the screen printing plate is produced.   In the third step, when viewed through from the normal direction of the first metal layer, the mesh hole is completely covered with the second covering portion, and the outer shape of the mesh hole and the second covering portion are covered. The method for producing a screen printing plate according to any one of claims 1 to 3, wherein the shortest distance from the outer shape is set to 0 µm or more and 10 µm or less.

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