JP4861507B2 - Metal porous body and method for producing the same - Google Patents

Description

  The present invention relates to a metal porous body comprising a main body plate having a large number of independent through holes, a frame for reinforcing the main body plate disposed so as to surround the main body plate, and a method for producing the metal porous body. . This metal porous body can be applied to, for example, a printing metal mask or a dust removing filter.

  The porous metal body according to the present invention comprises a main body plate having a large number of independent through holes and a reinforcing frame disposed so as to surround the main body plate. In the field, how to join the main body plate and the frame body efficiently and securely is an important issue. For example, in a printing metal mask plate according to Patent Document 1, an elastic cloth is attached to a frame body in a tension state, and then an electroformed main body plate is attached to the central opening of the elastic cloth with an ultraviolet curable resin. ing. That is, the ultraviolet curable resin is used as a sticking element between the main body plate and the frame.

JP 57-138991 A

  According to Patent Document 1, since an ultraviolet curable resin is used as a sticking agent, a metal mask plate for printing can be efficiently manufactured in a short time compared to the case of using a general adhesive. In that respect, the present invention is useful.

  However, according to the joining method according to Patent Document 1, the resin as the adhesive is easily altered by the organic solvent used when cleaning the metal mask plate, and the joining strength between the main body plate and the elastic cloth is lowered. There is a fear. When the bonding strength is thus reduced, the shape suppressing function of the frame body with respect to the main body plate is not exhibited well, and the printing accuracy is lowered. In the worst case, the main body plate may peel off from the elastic cloth.

  Furthermore, according to the form described in the above publication, in order to attach and fix the main body plate to the elastic cloth stretched on the frame, the main body plate is mounted on the central opening of the elastic cloth without any positional deviation or angular deviation. However, it is extremely difficult to properly position each separately produced main body plate and the central opening of the elastic cloth. For this reason, there was a disadvantage that the manufacturing operation could not be performed quickly and easily, and it was inevitable that the manufacturing cost of the metal porous body would increase.

  The object of the present invention is to enable easy and quick positioning of the main body plate and the frame, to reduce the manufacturing cost, and to achieve a good bonding state between the main body plate and the frame. The object is to obtain a porous metal body that can be maintained over a long period of time and a method for producing the same.

  The present invention is a porous metal body comprising a main body plate 2 having a large number of independent through-holes 6 and a frame 3 for reinforcement of the main body plate 2 arranged so as to surround the main body plate 2. The outer peripheral edge of the plate 2 and the frame body 3 are joined together in a non-separable manner through a metal layer.

  The metal layer is formed by an electroforming method.

  The metal layer is preferably formed in a state where a tension is applied to pull the main body plate 2 toward the frame body 3 so that the tensile stress F1 acts. The application of the tensile stress F1 can be realized by adjusting the content ratio of the carbon and sulfur ratio of the second type brightener added to the electroforming tank when the metal layer is produced.

In addition, the present invention includes a main body plate 2 having a large number of independent through holes 6 as shown in FIG. 1 and a reinforcing frame 3 of the main body plate 2 arranged so as to surround the main body plate 2. In the method for producing a porous metal body , the metal layer is formed and joined in a state in which a tension is applied so that the tensile stress F1 acts, which pulls the main body plate 2 toward the frame body 3 side . A first patterning step in which a primary pattern resist 15 having a resist body 15 a is provided on the surface of the mother die 10, and an electrodeposited metal is electroformed on the mother die 10 using the primary pattern resist 15, and a main body plate 2, a first electroforming process for forming the primary electrodeposition layer 16 corresponding to 2, a frame body arranging process for arranging the frame body 3 on the matrix 10 so as to surround the primary electrodeposition layer 16, and the frame body 3. And the outer peripheral edge of the primary electrodeposition layer 16, In other words, a metal layer is formed so as to cover the surface of the outer peripheral edge 5 a of the through hole forming region 5 of the main body plate 2 including a large number of through holes 6, and the primary electrodeposition layer 16 and the frame 3 are formed by the metal layer. the door comprises a bonding step of inseparable integrally joined, primary electrodeposited layers 16 from the matrix 10, and a peeling step of peeling the integrated frame body 3 and the metal layer.

  According to this, the through-hole 6 is formed in the primary electrodeposition layer 16 with the removal of the resist body 15a. Further, the through-hole forming region 5 and the frame body 3 can be integrally and integrally joined by the metal layer formed by electroforming on the outer peripheral edge 5 a of the through-hole forming region 5. The pattern resist 15 can be formed by a lithography method using a photoresist or the like or any other method, and any means for forming the pattern resist 15 is acceptable.

  Including a step of forming a photoresist layer 17 for forming a resist body 17a covering the through hole forming region 5 on the surface of the primary electrodeposition layer 16 formed on the matrix 10, and the second electroforming step. The metal layer may be formed by electroforming using the resist body 17a.

  Further, in the frame body arranging step, the frame body 3 is temporarily fixed on the mother die 10 by utilizing the adhesiveness of the unexposed photoresist layer 17b. Two electroforming steps may be performed.

  According to the present invention, since the outer peripheral edge 5a of the through hole forming region 5 of the main body plate 2 and the frame body 3 are joined by the metal layer, the main body plate 2 and the frame body 3 are joined as in the conventional example. There is no inconvenience such as deterioration of the resin caused by the organic solvent used in the cleaning treatment or the like acting on the resin, which is unavoidable in the form of joining with the resin. A good bonding state between them can be reliably maintained over a long period of time.

  Further, when the main body plate 2 and the frame 3 are joined with a metal layer, the frame 3 can be positioned using the mother die 10 when forming the metal layer, so that the positioning work is easy. And it can be done quickly. Thus, the metal porous body can be manufactured at low cost, and the positional displacement and the angle shift of the main body plate 2 can be surely prevented. Therefore, the metal porous body can be manufactured with high accuracy and high yield. Such a metal layer can be formed by electroforming.

  In addition, since the main body plate 2 and the frame 3 can be joined easily and more quickly than the joining method by laser welding or electric resistance welding, a porous metal body having excellent joining strength can be manufactured at low cost. Compared to laser welding or electric resistance welding, no undulation due to thermal reaction occurs and the through holes 6 can be formed with high accuracy.

When a metal layer forms the shape in a state of tensile stress F1 as draw the body plate 2 to the frame 3 side is added tension as to act, the expansion amount of the main plate 2 with changes in ambient temperature, It can be absorbed by the tensile stress. Thereby, the position shift of the main body plate 2 with respect to the frame 3 by expansion | swelling and generation | occurrence | production of a wrinkle can be prevented.

According to the manufacturing method of a metal porous body according to the present invention, because it forms a Rukin genus layer to bond the present body plate 2 and the frame 3 has the advantage that can make to ensure Moreover productivity with high accuracy.

  When the primary electrodeposition layer 16 to be the main body plate 2 is formed on the mother die 10, the main body plate 2 and the frame 3 are integrated to produce a porous metal body. It becomes easy to properly position the frame body by using. Therefore, as compared with a mode in which the main body plate 2 is manufactured separately and then integrated with the frame body 3, it is possible to reliably prevent the positional displacement and angular deviation of the main body plate 2, and the yield of the metal porous body 1 is improved. To do.

  In the frame body arranging step, the frame body 3 is temporarily fixed on the mother die 10 by using the adhesiveness of the photoresist layer 17b, and the second electroforming step is performed in the temporarily fixed state. For example, there is an advantage that productivity can be ensured at low cost as compared with a mode in which an adhesive or the like is used to temporarily fix the frame 3.

1 is a longitudinal side view of a porous metal body (metal mask for printing) according to a first embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal porous body concerning a 1st embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal porous body concerning a 1st embodiment of the present invention. The perspective view of the metal porous body concerning a 1st embodiment of the present invention. Vertical side view of a porous metal body (metal mask for printing) according to a second embodiment of the present invention Vertical side view of a porous metal body (metal mask for printing) according to a third embodiment of the present invention Process explanatory drawing of the manufacturing method of the metal porous body concerning a 3rd embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal porous body concerning a 3rd embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal porous body concerning a 3rd embodiment of the present invention. Vertical sectional side view of a porous metal body (dust removal filter) according to a fourth embodiment of the present invention The perspective view of the metal porous body concerning a 4th embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal porous body concerning a 4th embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal porous body concerning a 4th embodiment of the present invention.

(First embodiment)
1 and 4 show a first embodiment in which a metal porous body according to the present invention is applied to a printing metal mask plate. In FIG. 1, a printing metal mask plate 1 includes a mask body (body plate) 2 formed by an electroforming method using a nickel alloy such as nickel or nickel cobalt, or other electrodeposited metal, and the mask body 2. And a frame 3 mounted so as to surround. In FIG. 4, the mask main body 2 is formed in a 400 × 400 mm square matrix region, for example, in a 310 × 310 mm square shape, and includes a through hole forming region 5 therein. As shown in FIG. 1, a mask pattern 7 including a large number of independent printing holes (through holes) 6 is formed in the through hole forming region 5.

  The thickness of the mask body 2 is preferably set to 25 μm in the present embodiment as a range of 20 μm or more. Each through hole 6 has, for example, a square shape of 30 × 30 μm in a plan view, and these through holes 6 have a plurality of through hole groups arranged in a straight line in the front-rear direction. A matrix-like mask pattern 7 arranged in parallel in the left-right direction was configured. Note that the longitudinal sectional view of FIG. 1 does not show the actual state of the mask pattern 7, but schematically shows it. Further, the opening dimension of the through hole 6 and the thickness dimension of the mask body 2 and the like in FIG. 1 and the like are shown in such dimensions for the convenience of drawing, and are greatly different from the actual dimensions. Further, the numerical aperture of the through hole 6 is also greatly different from the actual one.

  A frame 3 for reinforcement of the mask body 2 is attached to the upper surface side of the mask body 2. The frame 3 is a flat plate made of 42 alloy, Invar material, SUS430, and the like, and has one rectangular opening 3a corresponding to the mask body 2 at the center of the board surface, as shown in FIG. One mask body 2 is held by one frame 3. The frame 3 is a molded product that is thicker than the mask body 2, and is integrally and integrally joined to the outer peripheral edge 5 a of the through hole forming region 5 of the mask body 2 by an electrodeposited metal layer 9 formed by electroforming. Is done. Here, the thickness dimension of the frame 3 is, for example, about 0.4 to 1.0 mm, and is set to 0.4 mm in the present embodiment.

  The electrodeposited metal layer 9 is made of nickel, nickel-cobalt alloy, or the like, and is laminated on the upper surface of the mask body 2 related to the outer peripheral edge 5a of the through hole forming region 5 by electroforming. Specifically, the electrodeposited metal layer 9 includes an upper surface of the outer peripheral edge 5 a of the through hole forming region 5, a side surface facing the upper surface of the frame body 3 and the through hole forming region 5, and a gap portion between the mask body 2 and the frame body 3. Thus, the outer peripheral edge 5a of the through-hole forming region 5 and the opening peripheral edge of the opening 3a are joined together in an integrated manner.

  The printing metal mask plate 1 having the above-described configuration is used, for example, when screen-printing a printed material such as a solder paste on a printed substrate such as a wiring pattern printed board or a semiconductor wafer on which various electronic components are mounted. Is done. That is, the printing metal mask plate 1 is pressed against a substrate (not shown) such as a printed circuit board, a printing paste such as a cream solder paste is placed on the squeegee surface, which is the upper surface of the mask body 2, and each printing paste is applied with a squeegee. The through holes 6 are sequentially squeezed and filled. Finally, the metal mask plate 1 is separated from the printing material, and the printing paste is transferred onto the printing material.

  2 and 3 show a method for manufacturing the printing metal mask plate 1 according to this embodiment. First, as shown in FIG. 2A, a photoresist layer 11 is formed on the surface of a mother die 10 made of, for example, stainless steel or brass. This photoresist layer 11 was formed by laminating one or several negative photosensitive dry film resists according to a predetermined height, and then thermocompression bonding.

  Next, as shown in FIG. 2B, a pattern film 12 (glass mask) having a light transmitting hole 12 a corresponding to the through hole 6 is brought into close contact with the photoresist layer 11, and then the ultraviolet light lamp 13 is used. A straight resist body corresponding to the through-hole 6 as shown in FIG. 2 (c) by irradiating with ultraviolet light to perform exposure, developing and drying, and dissolving and removing unexposed portions. A primary pattern resist 15 having 15 a was formed on the mother die 10.

  Subsequently, the mother die 10 is put in an electroforming tank bathed under a predetermined condition, and within the height range of the previous resist member 15a as shown in FIG. A primary electrodeposition layer 16, that is, a layer to be the mask body 2 is formed on the uncovered surface by primary electroforming of an electrodeposited metal such as a nickel alloy in a range of preferably 20 μm or more, preferably 25 μm in this embodiment. did. Here, the primary electrodeposition layer 16 was formed over substantially the entire surface of the mother die 10. Next, the resist body 15a was dissolved and removed to obtain a mask body 2 having a mask pattern 7 made up of a large number of independent through-holes 6 as shown in FIG.

  As shown in FIG. 3A, a photoresist layer 17 was formed on the entire surface of the mother die 10 including the portion where the primary electrodeposition layer 16 (mask body 2) was formed. This photoresist layer 17 is formed by laminating one or several negative photosensitive dry film resists according to a predetermined height and thermocompression bonding. Here, the photoresist layer 17 is 28 μm thick. Formed. Subsequently, as shown in FIG. 3B, after a pattern film 19 having a light transmitting hole 19a corresponding to the through hole forming region 5 is adhered, exposure is performed by irradiating ultraviolet light with an ultraviolet lamp 13. went. Thus, as shown in FIG. 3C, a photoresist layer 17 was obtained in which the portion related to the through-hole forming region 5 was exposed (17a) and the other portions were unexposed (17b).

  Subsequently, as shown in FIG. 3C, the frame body 3 was disposed on the mother die 10 so as to surround the primary electrodeposition layer 16. Here, the frame 3 was temporarily fixed on the mother die 10 by using the adhesiveness of the unexposed photoresist layer 17b.

  Next, as shown in FIG. 3D, the unexposed photoresist layer 17b exposed on the surface was dissolved and removed to form a secondary pattern resist 21 having a resist body 21a covering the through hole forming region. . At this time, the unexposed photoresist layer 17 b existing on the lower surface of the frame 3 remains on the mother die 10.

  Next, as shown in FIG. 3 (e), the upper surface of the primary electrodeposition layer 16 exposed on the surface related to the outer peripheral edge 5 a of the through hole forming region 5, and the surface exposed between the frame 3 and the primary electrodeposition layer 16. An electrodeposited metal is electroformed on the surface of the mother die 10 and the surface of the frame 3 to form an electrodeposited metal layer 9, and the electrodeposited metal layer 9 forms the primary electrodeposition layer 16 and the frame 3. Joined. Here, the layer thickness is formed on the upper surface of the primary electrodeposition layer 16 exposed on the surface of the outer peripheral edge 5a of the through-hole forming region 5 and on the surface of the mother die 10 exposed on the surface between the frame 3 and the resist body 21a. The electrodeposited metal layer 9 was formed to have a thickness of 30 μm. At this time, the thickness of the primary electrodeposition layer 16 formed on the surface of the frame 3 was 20 μm. As described above, the thickness of the electrodeposited metal layer 9 is different between the electrodeposited metal layer formed on the surface of the matrix 10 and the electrodeposited metal layer 9 formed on the surface of the frame 3. When the electrodeposited metal layer 9 reaches the frame body 3 beyond the height of the unexposed photoresist layer 17b, the frame body 3 becomes conductive. This is because the electrodeposited metal layer 9 is formed on the surface of the frame 3.

  Finally, after removing the secondary pattern resist 21, the electrodeposited metal layers 16 and 9 and the frame 3 are peeled off from the matrix 10, and the unexposed photoresist layer 17 b is further removed to obtain the structure shown in FIG. A printing metal mask plate 1 as shown was obtained (FIG. 3 (f)).

  The electrodeposited metal layer 9 is formed with a primary electrodeposition layer 16, that is, a state in which a tension is applied so that a tensile stress F <b> 1 (see FIG. 1) acts to draw the mask main body 2 toward the frame 3. The application of the tensile stress F1 can be realized by adjusting the content ratio of carbon and sulfur in the second-type brightener added to the electroforming tank. As a result, the primary electrodeposition layer 16 is stretched in a state in which a tensile stress is tightly applied to the frame body 3 via the electrodeposited metal layer 9, so that variations in dimensional systems at the time of printing work hardly occur. This can contribute to the improvement of printing accuracy.

  Further, the mask body 2 is held by the frame body 3 via the electrodeposited metal layer 9 in a state where a tension is applied to the mask body 2 so that the stress F2 (see FIG. 1) in the direction of shrinking inward acts. ing. The application of the stress F2 can be realized by adjusting the content ratio of carbon and sulfur in the second type brightener added to the electroforming tank when the primary electrodeposition layer 16 to be the mask body 2 is produced. Further, the mold 10 is made of 42 alloy, Invar, SUS430 (stainless steel) or other material having a low coefficient of thermal expansion, and the temperature in the electroforming tank is increased when the primary electrodeposition layer 16 is formed. Due to this temperature difference, the primary electrodeposition layer peeled off from the mother die 10 due to the difference in the coefficient of thermal expansion between the mother die 10 and the electrodeposited metal such as nickel or nickel alloy formed on the mother die 10 It can also be realized by setting 16 to shrink inward at room temperature.

(Second Embodiment)
FIG. 5 shows a second embodiment in which a porous metal body according to the present invention is applied to a printing metal mask plate. In the printing metal mask plate 1 according to the second embodiment, the mask body 2 has a two-layer structure including a primary electrodeposition layer on the lower layer side and a secondary electrodeposition layer formed on the primary electrodeposition layer. There is a difference from the first embodiment. That is, the mask main body 2 has a two-layer structure including a primary electrodeposition layer 22 serving as a printing surface and a secondary electrodeposition layer 23 serving as a squeegee surface. Since other than that is equivalent to 1st Embodiment, the same code | symbol is attached | subjected to the same member and the description is abbreviate | omitted.

  In addition, in this embodiment, it is noted that the secondary electrodeposition layer is formed of a material harder than the primary electrodeposition layer. In this example, the lower primary electrodeposition layer 22 was made of nickel, and the upper secondary electrodeposition layer 23 was made of a nickel-cobalt alloy.

  As described above, when the secondary electrodeposition layer 23 is formed of a material harder than the primary electrodeposition layer 22, the primary electrodeposition layer 22 is formed of a soft material, so that the degree of adhesion with the substrate is improved. Further, since the secondary electrodeposition layer 23 is formed of a hard material, the strength of the squeegee surface to which the printing pressure is applied can be favorably secured, so that the metal porous body 1 is used as a printing metal mask plate. This is preferable.

(Third embodiment)
FIG. 6 shows a third embodiment in which the metal porous body according to the present invention is applied to a printing metal mask plate. In the present embodiment, the mask body 2 is a two-layer structure composed of the primary electrodeposition layer 22 and the secondary electrodeposition layer 23, and the step between the mask body 2 and the electrodeposition metal layer 9 is eliminated. That is, it is noted that the upper surface of the secondary electrodeposition layer 23 and the upper surface of the electrodeposited metal layer 9 are flush with each other. Since other than that is the same as that of the said embodiment, the same code | symbol is attached | subjected to the same member and the description is abbreviate | omitted.

  7 to 9 show a manufacturing method of the printing metal mask plate 1 according to the present embodiment. First, as shown in FIG. 7A, a photoresist layer 11 is formed on the surface of a matrix 10 made of, for example, stainless steel or brass having conductivity. This photoresist layer 11 was formed by laminating one or several negative photosensitive dry film resists according to a predetermined height, and then thermocompression bonding.

  Next, as shown in FIG. 7 (b), a pattern film 12 (glass mask) having a light transmitting hole 12 a corresponding to the through hole 6 is brought into close contact with the photoresist layer 11, and then the ultraviolet light lamp 13 is used. A straight resist body corresponding to the through-hole 6 as shown in FIG. 7C by exposing to ultraviolet light, performing development, drying, and dissolving and removing unexposed portions. A primary pattern resist 15 having 15 a was formed on the mother die 10.

  As shown in FIG. 7 (d), a film-like adhesive resist 25 is applied to the entire upper surface of the mother die 10 including the primary pattern resist 15, and then, as shown in FIG. After the pattern film 26 having the translucent hole 26a was brought into close contact with the boundary portion with the frame 3, exposure was performed by irradiating ultraviolet light with the ultraviolet lamp 13, and development and drying were performed. Thereafter, as shown in FIG. 8A, the frame 3 is temporarily fixed on the matrix 10 so as to surround the primary pattern resist 15 by using the adhesiveness of the adhesive resist 25, and then the adhesive resist 25. Unexposed portions were dissolved and removed. Thus, as shown in FIG. 8B, a secondary pattern resist 27 having a resist body 27 a on the inner peripheral edge of the opening of the frame 3 was formed on the matrix 10.

  Subsequently, the mother die 10 is placed in an electroforming bath bathed under a predetermined condition. As shown in FIG. 8C, the surface of the mother die 10 that is not covered with the resist bodies 15a and 27a is made of nickel or the like. The primary electrodeposition layer 22 was formed by electroforming a relatively soft electrodeposition metal. The thickness dimension of the primary electrodeposition layer 22 at this time was the same as the thickness dimension of the previous adhesive resist 25. Next, the resist body 27a exposed on the surface was dissolved and removed. At this time, the adhesive resist 25 and the resist body 15a existing on the lower surface of the frame 3 are left on the mother die 10. That is, in the dissolution and removal work of the resist body 27a, a remover that can dissolve and remove only the resist body 27a and does not act on the resist body 15a is used.

  Next, as shown in FIG. 8D, a photoresist layer 28 was formed over the entire opening of the frame 3. The photoresist layer 28 is formed by laminating one or several negative photosensitive dry film resists to a predetermined height and then thermocompression bonding, and the thickness dimension thereof is the same as that of the adhesive resist 25 described above. It was made equivalent to the thickness dimension. Subsequently, after a pattern film 30 having a light transmitting hole 30 a having a predetermined width is brought into close contact with the outer peripheral edge of the primary electrodeposition layer 22 facing the frame 3 on the photoresist layer 28, ultraviolet light is emitted by the ultraviolet light lamp 13. Were exposed to light. By removing the unexposed photoresist layer 28, a tertiary pattern resist 31 having a resist body 31a having a predetermined width on the outer peripheral edge of the primary electrodeposition layer 22 was obtained as shown in FIG.

  Subsequently, the mother die 10 is put in an electroforming tank bathed under a predetermined condition, and is covered with resist bodies 15a and 31a on the mother die 10 and the primary electrodeposition layer 22 as shown in FIG. 9A. A secondary electrodeposition layer 23 was formed by electroforming an electrodeposition metal harder than the electrodeposition metal constituting the primary electrodeposition layer 22 such as nickel-cobalt on a non-coating surface. The thickness dimension of the secondary electrodeposition layer 23 at this time was the same as the thickness dimension of the previous resist body 31a.

  Next, the resist body 31a was dissolved and removed. At this time, the adhesive resist 25 and the resist body 15a existing on the lower surface of the frame 3 are left on the mother die 10. That is, in the dissolution and removal operation of the resist body 31a, a remover that can dissolve and remove only the resist body 31a and does not act on the resist body 15a or the like is used.

  Next, as shown in FIG. 9B, a quaternary pattern resist 32 was formed. Here, UV light is applied to the photoresist layer formed inside the opening of the frame 3 through the pattern film in the same procedure as shown in FIGS. 8A and 8D. By irradiating, as shown in FIG. 9B, a quaternary pattern resist 32 made of a resist body 32a covering the through hole forming regions of the primary and secondary electrodeposition layers was formed.

  Next, as shown in FIG. 9C, electrodeposition is performed on the upper surfaces of the primary electrodeposition layer 22 and the secondary electrodeposition layer 23 exposed on the surface of the outer periphery of the through-hole forming region 5a and on the surface of the frame 3. An electrodeposited metal layer 9 was formed by electroforming metal, and the primary and secondary electrodeposition layers 22 and 23 and the frame 3 were joined by the electrodeposited metal layer 9. That is, the mask main body 2 and the frame 3 made of the primary and secondary electrodeposition layers 22 and 23 were joined by the electrodeposition metal layer 9. Here, the electrodeposition metal layer 9 is formed by electroforming so as to have a thickness dimension similar to the thickness dimension of the secondary electrodeposition layer 22, whereby the step between the mask body 2 and the electrodeposition metal layer 9 is formed. Was able to be eliminated.

  Finally, after removing the primary and quaternary pattern resists 15 and 32, the primary and secondary electrodeposition layers 22 and 23 and the frame body 3 are peeled off from the matrix 10, and the adhesive resist 25 is further removed. As a result, a printing metal mask plate 1 as shown in FIG. 9D and FIG. 6 was obtained.

  Thus, if the step between the mask body 2 and the electrodeposited metal layer 9 is eliminated and the upper surface thereof is flush, the squeegee will not come into contact with the electrodeposited metal layer 9 during the printing operation. Since the electrodeposited metal layer 9 is difficult to peel off, there is an advantage that a good bonded state between the mask main body 2 and the frame body 3 can be secured over a long period of time. In addition, if the secondary electrodeposition layer 23 is formed of a material harder than the primary electrodeposition layer 22, the primary electrodeposition layer 22 is formed of a soft material, so that it is possible to ensure good adhesion with the substrate. Moreover, since the secondary electrodeposition layer 23 is formed of a hard material, the strength of the squeegee surface to which the printing pressure is applied can be favorably ensured, so that the metal mask plate is suitable as a printing plate.

  In addition to the first to third embodiments, each through hole 6 is preferably formed in a tapered shape that is tapered toward the substrate side. This is because, when the through-hole 6 is straight, the release property when the metal mask plate 1 is separated from the printed material is deteriorated, so that the printing paste transferred and attached to the printed material is deformed. This is because the shape tends to be unstable. On the other hand, if each through-hole 6 is formed in a downwardly tapered shape as described above, the plate separation property is improved.

(Fourth embodiment)
10 and 11 show a fourth embodiment in which a metal porous body according to the present invention is applied to a filter for removing dust. This filter 1 is mounted so as to surround a filter body (plate body) 2 formed by an electroforming method using a nickel alloy such as nickel or nickel cobalt, or other electrodeposited metal, and a filter body 2. Frame 3. In FIG. 11, the filter body 2 has a horizontally long, substantially quadrangular shape whose left and right ends are chamfered in a circular arc shape, and includes a large number of independent through-holes 6 (FIG. 10).

  The thickness dimension of the filter body 2 is preferably set to 25 μm in the present embodiment as a range of 20 μm or more. Each through hole 6 has, for example, a square shape of 33 × 33 μm in a plan view, and these through holes 6 have a plurality of through hole groups arranged in a straight line in the front-rear direction. The matrix was arranged in parallel in the left-right direction. In addition, the longitudinal cross-sectional view of FIG. 10 does not show the state of the actual through-hole pattern, but schematically shows it. Further, the opening size of the through-hole 6 and the thickness size of the filter body 2 and the like in FIG. 10 and the like are shown in such dimensions for the convenience of drawing, and are greatly different from the actual dimensions. Further, the numerical aperture of the through hole 6 is also greatly different from the actual one.

  The frame 3 is a flat plate made of 42 alloy, Invar, SUS430, and the like, and has one opening corresponding to the filter main body 2 at the center of the board surface. The frame 3 is a molded product that is thicker than the filter body 2. A preferable thickness dimension of the frame 3 is about 0.4 to 1.0 mm, and is set to 0.4 mm in the present embodiment.

  In addition, in the present invention, the filter main body 2 and the frame 3 are joined together in an integrated manner through the electrodeposited metal layer 9 formed integrally with the primary electrodeposition layer 16 constituting the filter main body 2. Attention is paid to the points. That is, when the primary electrodeposition layer 16 constituting the filter body 2 is electroformed, the electrodeposition metal layer 9 for joining the filter body 2 and the frame 3 is simultaneously electroformed. . According to this, since the primary electrodeposition layer 16 and the electrodeposited metal layer 9 constituting the filter main body 2 are formed in separate steps, the manufacturing process can be reduced. It can contribute to the reduction of manufacturing cost.

  12 and 13 show a method for manufacturing the dust removing filter 1 according to this embodiment. First, as shown in FIG. 12A, a photoresist layer 11 is formed on the surface of a mother die 10 made of, for example, stainless steel or brass. This photoresist layer 11 was formed by laminating one or several negative photosensitive dry film resists according to a predetermined height, and then thermocompression bonding.

  Next, as shown in FIG. 12A, a pattern film 12 (glass mask) having a light transmitting hole 12 a corresponding to the through hole 6 is brought into close contact with the photoresist layer 11, and then the ultraviolet light lamp 13 is used. A straight resist body corresponding to the through-hole 6 as shown in FIG. 12 (b) by irradiating with ultraviolet light to perform exposure, developing and drying, and dissolving and removing unexposed portions. A primary pattern resist 15 having 15 a was formed on the mother die 10.

  As shown in FIG. 12C, a film-like adhesive resist 25 is applied to the entire upper surface of the mother die 10 including the primary pattern resist 15, and then the adhesive resist 25 is formed as shown in FIG. The frame 3 was temporarily fixed on the base 10 so as to surround the primary pattern resist 15 by using adhesiveness. Next, as shown in FIG. 13A, the adhesive resist 25 was dissolved and removed except for the adhesive resist 25 existing on the lower surface of the frame 3.

  Subsequently, the mother die 10 is put in an electroforming tank bathed under a predetermined condition, and the surface of the mother die 10 not covered with the resist body 15a and the surface of the frame 3 as shown in FIG. In addition, the electrodeposited metal was electroformed to integrally form the primary electrodeposition layer 16 constituting the filter body 2 and the electrodeposition metal layer 9 for joining the filter body 2 and the frame body 3 together. At this time, the thickness dimension of the primary electrodeposition layer 16 was set to be equal to or less than the thickness dimension of the previous resist body 15a.

  Finally, after removing the primary pattern resist 15, the primary electrodeposition layer 16, the electrodeposited metal layer 9, and the frame body 3 are peeled from the matrix 10, and the adhesive resist 25 is further removed, whereby FIG. ) And a filter for removing dust as shown in FIG.

  The electrodeposited metal layer 9 is formed in a state where a tension is applied so that the tensile stress F1 (see FIG. 10) acts to pull the primary electrodeposition layer 16, that is, the filter body 2 toward the frame 3 side. The application of the tensile stress F1 can be realized by adjusting the content ratio of carbon and sulfur in the second-type brightener added to the electroforming tank. As a result, the primary electrodeposition layer 16 is stretched in a state in which a tensile stress is applied to the frame body 3 via the electrodeposited metal layer 9.

  The form of the filter or printing metal mask plate is not limited to that shown in the above embodiment.

1 Metal porous body (metal mask plate for printing, filter)
2 Body plate (mask body, filter body)
DESCRIPTION OF SYMBOLS 3 Frame 5 Through-hole formation area 6 Through-hole 9 Electrodeposition metal layer 15 Primary pattern resist 15a Resist body 16 Primary electrodeposition layer 22 Primary electrodeposition layer 23 Secondary electrodeposition layer 25 Adhesive resist 27 Secondary pattern resist 27a Resist body 31 Tertiary pattern resist 31a Resist body 32 Quaternary pattern resist 32a Resist body

Claims (5)

A porous metal body comprising a main body plate (2) having a large number of independent through holes (6) and a reinforcing frame (3) for the main body plate (2) disposed so as to surround the main body plate (2). Body (excluding the evaporation mask),
The outer peripheral edge of the main body plate (2) and the frame body (3) are joined to each other through a metal layer .
A metal porous body, wherein the metal layer is formed in a state in which a tension is applied to pull the main body plate (2) toward the frame body (3) and a tensile stress (F1) acts . The metal porous body according to claim 1, wherein the metal layer is formed by an electroforming method. A metal plate includes a main body plate (2) having a large number of independent through holes (6) and a reinforcing frame (3) of the main body plate (2) arranged so as to surround the main body plate (2). The metal porous body is formed by applying a tension that causes the tensile stress (F1) to act, and the metal layer attracts the main body plate (2) to the frame body (3) side. (However, the vapor deposition mask is excluded)
A first patterning step of providing a primary pattern resist (15) having a resist body (15a) on the surface of the matrix (10);
A first electroforming process of forming a primary electrodeposition layer (16) corresponding to the main body plate (2) by electroforming an electrodeposition metal on the matrix (10) using the primary pattern resist (15). When,
A frame body disposing step of disposing the frame body (3) on the matrix (10) so as to surround the primary electrodeposition layer (16);
The outer peripheral edge (5a) of the surface of the frame (3) and the outer peripheral edge of the primary electrodeposition layer (16), that is, the through hole forming region (5) of the main body plate (2) comprising a plurality of through holes (6). Forming a metal layer so as to cover the surface, and joining the primary electrodeposition layer (16) and the frame body (3) with the metal layer in an integral manner;
A method for producing a metal porous body, comprising: a peeling step of integrally peeling the primary electrodeposition layer (16), the frame (3), and the metal layer from the matrix (10). Forming a resist body (17a) covering the through hole forming region (5) on the surface of the primary electrodeposition layer (16) formed on the matrix (10);
The method for producing a porous metal body according to claim 3, wherein in the second electroforming step, the metal layer is formed by electroforming using a resist body (17a). In the frame body arranging step, the frame body (3) is temporarily fixed on the matrix (10) using the adhesiveness of the unexposed photoresist layer (17b),
The method for producing a porous metal body according to claim 3 or 4, wherein the second electroforming step is performed in the temporarily fixed state.

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