JP2001011683A - Method for joining members - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out joining suited to vacuum parts as well as fine parts with low heat resistance by bringing a second member into contact with a first member with electric conductivity and forming an electroforming layer on the first member in the above state to fix the second member to the first member. SOLUTION: A second member 2a, composed of glass or ceramic material of about 0.3 mm thick, is disposed in an arbitrary position of a first member 1a composed of copper sheet with electric conductivity so that they are in contact with each other. In this state, an electroforming layer 3a composed of nickel, etc., is grown by means of electroforming on the first member 1a to about 35 mm thick, by which the second member 2a can be fixed on the first member 1a. Because the electroforming layer 3a can be formed at a temperature as low as about 20-80 deg.C and requires no high-temperature steps for joining, even materials with low heat resistance can be bonded. Further, because joining is performed by using the electroforming layer 3a composed of metallic material, corrosion resistance superior to that of an adhesive can be provided and this joining method is suitable for joining of vacuum parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining method for fixing a plurality of members, and more particularly to a joining method using an electroforming method.

[0002]

2. Description of the Related Art There are many situations in which a plurality of members are required to be joined in the manufacture of a device or in the manufacture of components constituting the device. Therefore, many joining methods have been devised so far. Among them, brazing joining, soldering joining, welding, joining with an adhesive, joining with a UV (ultraviolet) curing agent, thermocompression bonding, and the like are generally well known, and are widely used joining methods.

[0003] Among the above-mentioned joining methods, brazing joining and soldering joining are methods of joining members by melting a metal material serving as an adhesive. In general, soldering and brazing are distinguished by the temperature at which the metal is melted and joined. Soldering is 200 to 450 ° C, and brazing is 450 ° C or higher.

[0004] Welding is also a joining method utilizing melting of a metal at a high temperature. Unlike brazing joining and soldering joining, welding is a joining method in which a member to be joined itself is melted.

[0005] Bonding with an adhesive is generally called adhesion, and the members are joined via an adhesive.

[0006] The joining with a UV curing agent is a joining using a UV curing agent having a property of changing from a liquid to a solid when exposed to ultraviolet rays, and is characterized by being able to be joined at room temperature.

[0007] Thermocompression bonding is a joining method in which members are brought into contact with each other and a high temperature and a high pressure are applied thereto so that the interfaces between the members are reacted to be bonded.

[0008]

Among the above joining methods, except for joining with an adhesive and joining with a UV curing agent,
In any of the joining methods, the joining is performed under a high temperature state of several hundred degrees or more. Also, in bonding with an adhesive, an adhesive bonded at a temperature of 100 ° C. or higher is often used in order to increase the bonding strength. As described above, most of the joining methods are performed at a high temperature of 100 ° C. or more. Therefore, the members to be joined need to have heat resistance higher than the processing temperature at the time of joining, and the materials that can be selected as members have been limited.

When a material having poor heat resistance is used as a member, bonding with an adhesive or a UV curing agent is often used, but these have drawbacks such as poor corrosion resistance to organic solvents and alkaline chemicals. . Further, unlike a metal material, it is not suitable for use as a vacuum component because it easily stores moisture and gas inside.

[0010] Further, it is difficult for all the conventional bonding methods to form a pattern and bond only an arbitrary portion, and for that reason, it is not particularly suitable for bonding fine parts.

An object of the present invention is to provide a bonding method which enables bonding at a low temperature of 20 to 80 ° C. and can bond even a material having low heat resistance.

It is a further object of the present invention to provide a joining method which is excellent in corrosion resistance because a plurality of members are joined by a metal material having good corrosion resistance, and is suitable for vacuum parts.

It is a further object of the present invention to provide a joining method suitable for joining fine parts.

[0014]

In order to solve the above-mentioned problems, a bonding method according to the present invention provides a bonding method in which a second member is brought into contact with an arbitrary position of a first member having conductivity. By forming an electroformed layer on the first member having electroconductivity by an electroforming method, the second member is formed by the electroformed layer on the first member.
It is characterized by being fixed to a member.

Further, the bonding method of the present invention is characterized in that the electroformed layer is patterned into a desired shape.

Further, the bonding method of the present invention is characterized in that an electroformed layer is formed by an electroforming method at a processing temperature of 20 to 80 ° C.

Further, the bonding method according to the present invention is characterized in that a ceramic material is used for the second member.

Further, the bonding method according to the present invention is characterized in that a plastic material is used for the second member.

The bonding method according to the present invention is characterized in that the first member having conductivity has a structure in which a conductive film is formed at an arbitrary position on a non-conductive material.

[0020] In the bonding method according to the present invention, the second member may include:
It is characterized by having a structure in which an insulating film is formed at an arbitrary position on a conductive material.

(Operation) According to the present invention, an electroformed layer made of a metal material is formed in a desired shape on a conductive first member by the above means, and the second member is fixed by the electroformed layer. By doing so, the first member and the second member are joined.

As a result, the electroformed layer is formed at a low temperature of 20 to 80 ° C., and a high-temperature process is not required for bonding, so that bonding can be performed even with a material having low heat resistance.

Further, since the present invention joins using an electroformed layer made of a metal material, the present invention has better corrosion resistance than an adhesive and is suitable for vacuum parts.

Further, according to the present invention, since the electroformed layer can be formed in an arbitrary shape, it is possible to form the electroformed layer only on the portion to be joined and join it. As a result, it is suitable for joining a micro component that requires joining of a minute area.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 is a view showing a first embodiment of a joining method according to the present invention. The first member 1a is a plate-shaped member made of conductive copper (Cu), that is, a copper plate. A second member 2a made of a 0.3 mm thick plate-like glass (ceramic material) is placed in contact with an arbitrary position of the first member, and in this state, nickel (Ni) is formed by electroforming. Electroforming layer 3
a was formed. Note that the electroforming method is a method of forming a desired shape by using an electroplating method, and the principle thereof is that, similarly to the electroplating method, a metal material is electrically attracted to a conductive material by attracting metal ions. It grows in one direction. In particular, the electroforming method is characterized in that a metal material can be formed into a thick film. In the first embodiment, the electroformed layer 3a is grown on the first member 1a to a thickness of 0.35 mm.
When the thickness of the electroformed layer 3a exceeds the thickness (0.3 mm) of the second member 2a as shown in FIG. 1, the electroformed layer 3a grows so as to cover the second member 2a. The joining method of the present invention utilizes the effect of fixing the second member 2a to the first member 1a with the electroformed layer 3a formed continuously on the second member 2a. As a result of the joining performed as described above, in the first embodiment, the first
The second member 2a made of glass was firmly joined to the member 1a of the above by the electroformed layer 3a made of Ni.

As described above, in the first embodiment, the electroforming method for growing nickel (Ni) (hereinafter referred to as Ni electroforming method) is used. The Ni electroforming method is the most common electroforming method. In the first embodiment, a nickel sulfamate bath is used as a bath solution, and a current of 5 A / dm 2 is obtained at a temperature of 50 ° C. The treatment was performed at the density for 7 hours. As described above, the bonding method of the present invention is characterized in that high-temperature processing is not used. Therefore, although glass is used for the second member 2a in the present embodiment, a plastic material having low heat resistance can be used.

In addition, copper (Cu), cobalt (C
o), palladium (Pd), tin (Sn), gold (Au),
Electroforming methods such as silver (Ag) and platinum (Pt) can be used, but the bonding method of the present invention can be applied to any other materials that can be formed by the electroforming method. .

Among the above-listed materials, Sn has the lowest electroforming temperature, and is electroformed at a temperature of 20 ° C. On the other hand, Pt has the highest electroforming temperature, but even in the case of Pt electroforming, electroforming can be performed at a temperature of 80 ° C. Thus, even if an electroforming method other than Ni is used, the electroforming process can be performed at a temperature of 20 to 80 ° C., which also indicates that the joining method of the present invention is very different from other joining methods. It can be seen that bonding can be performed at a low temperature.

Further, as shown in the first embodiment, the joining of metal and ceramics, which is generally considered to be difficult to join, could be easily joined while maintaining sufficient joining strength. This is also one of the features of the joining method of the present invention.

Further, in the first embodiment, since a very corrosion-resistant metal material such as Ni is used for the bonding, the bonding portion is formed with a chemical such as an organic solvent as in the bonding using an adhesive. The feature is that there is no danger of deterioration. As a result, it is possible to sufficiently perform cleaning with the organic solvent, and the reliability of the device or component is improved. Also, since no adhesive is used,
There is no need to worry about outgassing in a vacuum, and the present invention is applicable to components used in a vacuum.

(Second Embodiment) FIG. 2 is a diagram showing a second embodiment of the present invention. Also in the second embodiment, a copper plate is used for the first member 1b, and 0.3 mm is used for the second member 2b.
Thick glass was used. However, the first member 1b has the second
Is engraved to a depth of 0.3 mm so that the member 2b of the first member 1b can be accommodated without a gap. As shown in FIG. 2, the second member 2b is disposed at the engraving of the first member 1b.
By performing electroforming in that state, the electroformed layer 3b becomes the first
Although it grows on the member 1b, it is formed so as to gradually cover the second member 2b as shown in FIG. In this manner, the first embodiment is also used in the second embodiment.
The member 1b and the second member 2b could be joined.

Although the Ni electroforming method is used in the second embodiment as in the first embodiment, the electroforming layer 3b is formed to a thickness of 0.05 mm in the second embodiment. ,
The time required for the electroforming process was one hour.

(Third Embodiment) FIG. 3 is a view showing a third embodiment of the present invention. In the third embodiment, the second
A plastic plate having a thickness of 0.3 mm with a hole having a diameter of 1 mm was used for the member 2c. As the first member 1c, a copper plate was used as in the first embodiment. In FIG. 3, the thickness of the second member 2c is exaggerated for easy understanding of the present invention. Here, a plastic material is used for the second member 2c because the hole processing is easy, but a ceramic material such as glass can be used as in the first and second embodiments. .
The second member 2c is arranged in a state of being superimposed on the first member 1c.

In the third embodiment, the electroformed layer 3c is formed inside a 1 mm diameter hole formed in the second member 2c. When the electroformed layer 3c exceeds the thickness of the second member 2c, the electroformed layer 3c starts growing in the horizontal direction as shown in FIG. By doing so, a rivet structure composed of the electroformed layer 3c can be formed, and the first member 1c and the second
Member 2c could be joined.

(Fourth Embodiment) FIG. 4 is a view showing a fourth embodiment of the present invention. The fourth embodiment is similar to the third embodiment.
This is a joining method for forming a rivet structure by electroforming and joining in the same manner as in the embodiment. However, in the fourth embodiment, a projection is provided on the first member 1d, and the projection is formed so as to be accurately fitted into a hole formed in the second member 2d. By performing the electroforming method in a state where the projection provided on the first member 1d is fitted into the hole formed in the second member 2d, the electroformed layer 3d is formed only at the tip of the projection, and the first Is joined to the second member 2d.

In the fourth embodiment, a copper plate having a thickness of 5 mm is used for the first member 1d, and a diameter of 1 mm is formed by cutting.
A projection having a height of 0.3 mm was formed. The second member 2d
As in the third embodiment, a plastic plate having a thickness of 0.3 mm and a hole having a diameter of 1 mm was used similarly to the third embodiment, and the two could be joined as shown in FIG.

As a method for forming the projection of the first member 1d, various processing methods such as an etching method, a press processing, a sand blast method, and a laser processing method can be applied in addition to the cutting processing.

(Fifth Embodiment) FIG. 5 is a view showing a fifth embodiment of the present invention. In the fifth embodiment, the first member 1e comprises a non-conductive member 11 having a conductive film 12 formed at an arbitrary position. In this embodiment, a glass plate is used as the non-conductive member 11, and nickel (Ni) is formed on the non-conductive member 11 by a sputtering method.
Was formed in a thickness of 0.2 μm.
A glass plate having a thickness of 0.3 mm was used for the second member 2e. The first member 1e and the non-conductive second member 2e are arranged in contact with each other at a predetermined position.
An electroforming process is performed on the conductive film 12. Then, the conductive film 12
The electroformed layer 3e grows thereon, and gradually the second member 2e
Formed so as to cover By doing so, the first member 1e and the second member 2e composed of the conductive film 12 and the non-conductive member 11 are joined. In the present embodiment, the electroformed layer 3e made of Ni is formed on the conductive film 12 made of Ni by using the Ni electroforming method. By using the same material for the conductive film 12 and the electroformed layer 3e, good bonding can be expected.

In the present embodiment, the conductive film 12 is formed by a sputtering method, but any film forming method such as a vapor deposition method, a CVD method, or an electroless plating method may be used. Further, the structure of the conductive film 12 does not necessarily have to be a single-layer film, and may be a stacked film structure in which a plurality of materials are stacked.

(Sixth Embodiment) FIG. 6 is a view showing a sixth embodiment of the present invention. In a sixth embodiment,
The second member 2f is made of a conductive member 21 having an insulating film 22 formed at an arbitrary position. In this embodiment, a copper plate is used as the conductive member 21, and an insulating film 22 made of SiO 2 is formed on the conductive member 21 by a sputtering method to a thickness of 0.2 μm. The first member 1f is also made of a copper plate. The second member 2f and the conductive first member 1f are arranged in contact with each other at a predetermined position, and an electroforming process is performed on the first member 1f in this state. Then, the electroformed layer 3f is formed on the first member 1f and the second member 2f.
And finally formed so as to cover the second member 2f as shown in FIG. In this way, the first member 1f and the second member 2f are joined. In the case of the sixth embodiment, the bonding strength can be further increased by growing and forming the electroformed layer 3f also on the side surface of the second member 2f.

(Seventh Embodiment) FIG. 7 shows a seventh embodiment of the present invention and a method thereof. The seventh embodiment is similar to the second embodiment, except that the electroformed layer 3g is patterned into a desired shape.

First, as shown in FIG.
g and the second member 2g are arranged. On the first member 1g and the second member 2g arranged as described above, a resist 4 as a photosensitive material is formed in a desired shape by photolithography. In this embodiment, the first member 1g and the second member 2g are made of copper (C
u), and the resist 4 is an insulating material.

When electroforming is performed in this state, the first member 1
The electroformed layer 3g is formed only on the portions of the second member 2g and the second member 2g that are not covered with the resist 4, and the state shown in FIG. 7A is completed.

Thereafter, as shown in FIG. 7B, if the resist 4 is removed with an organic solvent, only a predetermined portion can be joined by the patterned electroformed layer 3g. By using the advantage that such a joint can be patterned, the joining method of the present invention is also suitable for joining fine components.

Next, several application examples using the bonding method of the present invention will be described.

(Application Example 1) FIG. 8 is a view showing an example of joining timepiece parts according to the present invention. More specifically, this is an example of joining a case 100 for incorporating a clock module and a windshield 200 for protecting the clock face of the clock. To fix the case 100 and the windshield 200 of a general watch,
A mechanical fitting method and a bonding method using an adhesive have been used. However, the method of mechanically fitting has a disadvantage that the bonding strength is weak and easily detached, while the method of bonding with an adhesive has many steps, and further has a disadvantage that the adhesive is protruded and the aesthetic appearance is impaired. . Here, an application example in which the joining method of the present invention is used to achieve joining with high joining strength and excellent aesthetics will be described.

The first application example is an example in which the second embodiment and the seventh embodiment are applied. FIG. 8 shows a plan view and a sectional view of the case 100 and the windshield 200 joined by the joining method of the present invention. The case 100 is made of stainless steel (SUS-304), and has a shape such that a disk-shaped windshield 200 having a diameter of 2.6 mm and a thickness of 0.3 mm is fitted without any gap.

As shown in FIG. 8, the windshield 200 is arranged so as to fit into the case 100. afterwards,
The electroformed layer 30 is formed by using the method described in the seventh embodiment.
Is formed by patterning. In this application example, before electroforming, the case 100 made of stainless steel was immersed in hydrochloric acid for 10 minutes. Thereafter, the electroforming process is immediately performed, so that the electroformed layer 3 is firmly formed on the case 100. The electroforming process is
First, an Ni electroformed layer was formed on the case 100 made of stainless steel by nickel (Ni) electroforming, and subsequently, an Au electroformed layer was formed on the Ni electroformed layer by gold (Au) electroforming.

The electroformed layer 30 thus completed is patterned as graduations and characters indicating time, as shown in the plan view of FIG. That is, the windshield 200 of the timepiece also has a dial. As a result, since the normal dial is eliminated, effects such as a reduction in the number of parts and a reduction in the thickness of the timepiece can be expected. Also, patterns for decoration other than characters may be patterned. The feature of this application example is that not only is the electroformed layer 30 used as a bonding material, but it is also used for time display, and furthermore, by forming an Au electroformed layer on the surface, it also has decorativeness. is there. Also, since no adhesive is used, it has excellent corrosion resistance.

(Application Example 2) In the recent information society,
Optical communication is one of the most important information transmission means. The feature of this optical communication is that a large amount of information can be transmitted quickly and accurately. For that purpose, a small and high-precision optical communication system is required. A micromirror is one of the components constituting such an optical communication system, and is a component for accurately transmitting optical information. This application example relates to a method of joining the micromirrors.

FIG. 9 is a diagram comparing an example of joining a micromirror according to the present invention with an example of joining a conventional micromirror. FIG. 9B shows a conventional general micromirror junction.
As shown in FIG. 7, a micro mirror 210 made of glass having a Cr film formed on a mirror surface is bonded to a fixing base 110 made of stainless steel via an adhesive 40. Adhesive 40
Has a thickness of 50 to 100 μm, and the thickness is not uniform. Therefore, as shown in FIG. 9B, there have been many problems that the micromirror 210 is not accurately joined to the fixed base 110 at a predetermined angle. The mounting angle between the micromirror 210 and the fixed base 110 is very important for accurately transmitting optical information. When the mounting angle of the micromirror 210 changes as shown in FIG. Light is transmitted in a direction different from the predetermined direction.

When the bonding method of the present invention is used, FIG.
As shown in (a), the micro mirror 210 and the fixed base 110 are joined. This application example is an example in which the first embodiment of the present invention is applied. In the case of the joining according to the present invention in FIG.
The micro mirror 210 is fixed to the fixing base 11 by the electroformed layer 31.
It is fixed (joined) with a force equal to zero, and has a structure in which no gap is formed between the fixing base 110 and the micromirror 210. Therefore, the micromirror 210 is always joined to the fixed base 110 at a predetermined angle as designed, and as a result, it is possible to accurately transmit incident light in a predetermined direction. Electroforming is performed so that electroforming is not performed on the mirror surface of the micromirror on which the Cr film is formed. This application example is an example utilizing the advantage of the present invention that members can be joined together without using an adhesive.

(Application Example 3) FIG. 10 is a diagram in which a micro gear used for a timepiece or a micromachine is fixed by the fixing method according to the present invention. This application example is an example in which the fourth embodiment is applied. Hereinafter, the fixing method will be described.

The metal axle 120 is provided with a step for fixing the gear 220 at an arbitrary position, and the gear 220 is incorporated into the axle 120. The gear 220 is made of metal, but is electrically insulated because the resist 50 is applied to the entire surface. By performing an electroforming process in a state where the gear 220 is incorporated, an electroformed layer 32 is formed at the tip of the axle 120. In this state, the gear 220 is axle 1
20 (the state of FIG. 10A). Although the electroformed layer 32 is not formed on the side surface of the axle 120 in FIG. 10, this application example can be applied even if it is formed.

Next, as shown in FIG.
The resist 50 applied to 0 is dissolved and completely removed by an organic solvent or the like. Then, a gap is formed between the gear 220 and the electroformed layer 32, and a step between the gear 220 and the axle 120, so that the gear 220 can rotate. However, the gear 220 is not displaced by the electroformed layer 32.
This application example is an example that utilizes the advantage of the present invention that it is suitable for joining fine parts.

(Application Example 4) FIG. 11 is a view showing an example of joining an IC substrate and an FPC according to the present invention. Fine wirings 60 are formed on an IC substrate 130 made of a plastic material. Generally, copper (Cu) is often used for the wiring 60. On the other hand, the fine wiring 6 is also provided on the FPC 230 for extracting an electric signal from the IC substrate 130.
1 is formed. The FPC 230 is also made of a plastic material, and the wiring 61 is also made of copper (Cu). The IC substrate 130 and the FPC 230 must be joined so as not to be easily separated, and the wiring 60 and the wiring 61 must be electrically connected without any problem. In this application example, both the mechanical joining and the electrical connection are performed simultaneously.

The IC substrate 130 and the FPC 230 are electroformed while maintaining a predetermined positional relationship. At this time, wiring 6
The electroformed layer 33 is simultaneously formed on the wire 0 and the wiring 61, and the integrated electroformed layer 33 is finally completed. The electroformed layer 33 thus formed achieves not only the connection between the IC substrate 130 and the FPC 230 but also the electrical connection between the wiring 60 and the wiring 61 at the same time.

In this application example using the present invention, since the electroformed layer 33 is formed only on the wirings 60 and 61, it is very effective for connecting fine wirings. Further, since the bonding is performed at a low temperature, heat resistance is not required for the FPC 230, and
Materials can be freely selected. As a result, connection by the FPC 230 that is more flexible than before can be achieved.

[0059]

According to the joining method of the present invention, 20 to 80.
Bonding can be performed at a low temperature of ℃, and bonding is possible even with a material having low heat resistance.

Furthermore, since a plurality of members are joined with a metal material having good corrosion resistance, the members have excellent corrosion resistance and are suitable for vacuum parts.

Furthermore, it is possible to form a fine pattern at the joint, and as a result, it is suitable for joining fine parts.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

FIG. 3 is a diagram showing a third embodiment of the present invention.

FIG. 4 is a diagram showing a fourth embodiment of the present invention.

FIG. 5 is a diagram showing a fifth embodiment of the present invention.

FIG. 6 is a diagram showing a sixth embodiment of the present invention.

FIG. 7 is a diagram showing a seventh embodiment of the present invention and a method thereof.

FIG. 8 is a view showing an example of joining timepiece parts according to the present invention.

FIG. 9 is a diagram comparing a micromirror bonding example according to the present invention with a conventional micromirror bonding example.

FIG. 10 is a view showing a method for fixing a micro gear according to the present invention.

FIG. 11 is a view showing an example of joining an IC substrate and an FPC according to the present invention.

[Explanation of symbols]

1a, 1b, 1c, 1d, 1e, 1f, 1g First member 2a, 2b, 2c, 2d, 2e, 2f, 2g Second member 3a, 3b, 3c, 3d, 3e, 3f, 3g Electroformed layer Reference Signs List 4 resist 11 non-conductive member 12 conductive film 21 conductive member 22 insulating film 30, 31, 32, 33 electroformed layer 40 adhesive 50 resist 60, 61 wiring 100 case 110 fixing stand 120 axle 130 IC board 200 windshield Glass 210 Micro mirror 220 Gear 230 FPC

Claims (7)

[Claims] 1. A bonding method for fixing a plurality of members, wherein the second member is brought into contact with an arbitrary position of the first member having conductivity, and the second member is brought into contact with the second member. By forming an electroformed layer on one member by an electroforming method,
A method for joining members, comprising fixing the second member to the first member with the electroformed layer. 2. The method according to claim 1, wherein the electroformed layer is patterned in a desired shape. 3. The method according to claim 1, wherein the electroformed layer is formed by an electroforming method at a processing temperature of 20 to 80 ° C. 4. The member joining method according to claim 1, wherein a ceramic material is used for the second member. 5. The method according to claim 1, wherein a plastic material is used for the second member. 6. The structure according to claim 1, wherein the first member having conductivity has a structure in which a conductive film is formed at an arbitrary position on a non-conductive material. 3. The method for joining members according to item 1. 7. The member according to claim 1, wherein the second member has a structure in which an insulating film is formed at an arbitrary position on a conductive material. Joining method.