CN104884264B - Printing suspended metal mask and its manufacture method - Google Patents
Printing suspended metal mask and its manufacture method Download PDFInfo
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- CN104884264B CN104884264B CN201380064893.XA CN201380064893A CN104884264B CN 104884264 B CN104884264 B CN 104884264B CN 201380064893 A CN201380064893 A CN 201380064893A CN 104884264 B CN104884264 B CN 104884264B
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- Prior art keywords
- openings
- protective layer
- substrate metal
- metal
- printing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
- B41C1/142—Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of printing suspended metal mask is obtained, even if the stripping that will not be also oozed out at thin thread part and print patterns of openings formation protective layer does not also expend the time.Printing is included with suspended metal mask：Chase (3)；Be adhesively fixed for its periphery and the inner side of chase is located at by net (1), the net (1), and at least includes conductive wire netting in central portion；And substrate metal (5); the substrate metal (5) is close to overlap with wire netting and is integrally bonded them using plating is engaged; and the substrate metal (5) is provided with printing patterns of openings (5b); wherein; it is formed on the brim part (5c) of the upper end pendency of the printing patterns of openings of substrate metal; when using engaging plating and being integrally bonded substrate metal and wire netting, gap (5d) is formed between the upper end of printing patterns of openings formation protective layer and wire netting because there is brim part.
Description
Technical field
The present invention relates to a kind of printing suspended metal mask and its manufacture method.
Background technology
Conventionally, there is known a kind of one-piece type metal mask of net, the one-piece type metal mask of the net by by stainless (steel) wire with cover
One surface side of mould substrate overlaps and is close to and is integrally bonded it using plating, wherein, the stainless (steel) wire is relative to peripheral frame
Laid with tensioned state and conductive, aforementioned mask substrate forms required printed patterns using electroforming and with multiple
Opening portion mask (see, for example patent document 1).
In addition, as another prior art, it is known to a kind of suspended metal mask, set on metal frame Te Duolong nets and
Stainless (steel) wire, and metal mask mask is formed with stainless (steel) wire (referring for example to patent document 2).
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 8-183151 publications
Patent document 2：Japanese Patent Laid-Open 2007-245560 publications
The content of the invention
The technical problems to be solved by the invention
In the existing one-piece type metal mask of net or suspended metal mask, metal mask is overlapped with stainless (steel) wire and be close to
And when being integrally bonded it using plating, because printing patterns of openings formation protective layer is present near junction surface, therefore,
There are problems that producing engagement and hinder and be difficult to engage such.In addition, being peeled off with protective layer by printing patterns of openings formation
When, protective layer is not peeled off and remains sometimes, therefore, particularly it is susceptible to ooze out at thin thread part.Additionally, there are stripping
From the long such problem of the activity duration needed for printing patterns of openings formation protective layer.
The present invention makees to solve the above problems, will not also be oozed out at thin thread part its object is to provide one kind,
And the not time taking printing suspended metal mask of stripping and its manufacture method of printing patterns of openings formation protective layer.
Solve the technical scheme that technical problem is used
Printing suspended metal mask of the invention, including：Chase；Be adhesively fixed for its periphery and be located at by net, the net
The inner side of chase, and at least include conductive wire netting in central portion；And substrate metal, the substrate metal and metal
Net is close to overlap and is integrally bonded them using plating is engaged, and above-mentioned substrate metal is provided with printing patterns of openings, wherein,
Be formed on substrate metal printing patterns of openings upper end pendency brim part, using engage plating make base material gold
When category is integrally bonded with wire netting, the upper end of patterns of openings formation protective layer and metal are being printed because there is brim part
Gap is formed between net.
In addition, the manufacture method of printing suspended metal mask of the invention, screen painting suspended metal mask bag
Include：Chase；Be adhesively fixed for its periphery and the inner side of the chase is located at by net, the net, and at least includes having in central portion
The wire netting of electric conductivity；And substrate metal, the substrate metal is close to overlap and makes it using plating is engaged with the wire netting
Be integrally bonded, and above-mentioned substrate metal is provided with printing patterns of openings, wherein, above-mentioned manufacture method includes：Substrate metal shape
Into operation, in the substrate metal formation process, printing patterns of openings formation protective layer is set on mother metal, and enters thereon
Row plating, being formed in the upper end of printing patterns of openings formation protective layer has the substrate metal of brim part of pendency；And
Gap formation process, in the gap formation process, substrate metal and wire netting with brim part is made when being electroplated using engagement
When being integrally bonded, printed between the upper end of patterns of openings formation protective layer and wire netting in advance because there is brim part
Form gap.
In addition, additionally, in the manufacture method of printing suspended metal mask of the invention, setting printing is opened on mother metal
Mouth pattern formation protective layer, the upper end electroplated thereon and be formed in printing patterns of openings formation protective layer has
In the operation of the substrate metal of the brim part of pendency, printing patterns of openings formation protective layer is set thicker on mother metal,
The first time plating of the thickness of thin than printing patterns of openings formation protective layer is carried out thereon, then, will be than first time plating more
The upper end of prominent printing patterns of openings formation protective layer is ground and is removed upward, as the upper table with first time plating
Face identical printing patterns of openings formation protective layer, it is then, in first time plating and mutually level with first time plating
Patterns of openings formation is printed with second plating is carried out on protective layer, so as to form the upper of printing patterns of openings formation protective layer
End has the substrate metal of the brim part of pendency.
Invention effect
According to the present invention, when printing patterns of openings formation protective layer is peeled off, protective layer is easily peeled off without remaining
In in the printing patterns of openings of substrate metal.Additionally, have can solve the problem that particularly as thin thread part is susceptible to ooze out
The effect of problem.Furthermore it is possible to significantly shorten the activity duration needed for peeling off printing patterns of openings formation protective layer.
Brief description of the drawings
Fig. 1 is will by required each composition in the manufacture method of the printing suspended metal mask of embodiment of the present invention 1
The stereogram that part is represented after separating.
Fig. 2 is the engagement galvanizer in the manufacture method of the printing suspended metal mask for representing embodiment of the present invention 1
The sectional view of sequence.
Fig. 3 is that the engagement in the manufacture method of the printing suspended metal mask for representing embodiment of the present invention 1 has been electroplated
The sectional view of the state after.
Fig. 4 is to represent the joint shape from the manufacture method of the printing suspended metal mask in embodiment of the present invention 1
State releases the sectional view of the state after setting.
Fig. 5 is in the manufacture method of the printing suspended metal mask for representing embodiment of the present invention 1, from substrate metal
Peel off the sectional view of the state of SUS mother metals.
Fig. 6 is in the manufacture method of the printing suspended metal mask for representing embodiment of the present invention 1, peeling base gold
The sectional view of the state before the opening protective layer of category.
Fig. 7 is in the manufacture method of the printing suspended metal mask for representing embodiment of the present invention 1, by substrate metal
Opening protective layer peel off after state sectional view.
Fig. 8 is that the printing patterns of openings formation of the substrate metal of the printing suspended metal mask for representing prior art is protected
The sectional view of the state before the stripping of sheath.
Fig. 9 is by the major part amplification view of the major part enlarged representation of Fig. 8.
Figure 10 is the printing patterns of openings formation protection of the substrate metal for representing existing printing suspended metal mask
The sectional view of the state after layer stripping.
Figure 11 is the printing patterns of openings of the substrate metal of the printing suspended metal mask for representing embodiment of the present invention 1
Formation with protective layer peel off before state sectional view.
Figure 12 is the major part amplification view represented after the major part of Figure 11 is amplified.
Figure 13 is the printing patterns of openings of the substrate metal of the printing suspended metal mask for representing embodiment of the present invention 1
Formation with protective layer peel off after state main portion sectional view.
Figure 14 is to represent that the substrate metal in the printing suspended metal mask of embodiment of the present invention 2 applies printing opening
After pattern formation protective layer, the sectional view of the state after the first time plating of thickness of thin than protective layer is carried out.
Figure 15 is to represent to protect the printing patterns of openings formation more prominent more towards the top than first time plating by grinding etc.
The upper end of sheath removes and is formed as the sectional view with the mutually level state in upper surface of first time plating.
Figure 16 is to represent that will print the upper end of patterns of openings formation protective layer removes and turn into and the by grinding etc.
After the identical height in upper surface once electroplated, on the upper surface of first time plating and printing patterns of openings formation protective layer
Form the sectional view of the state after second plating.
Figure 17 is to represent that the substrate metal in the printing suspended metal mask of embodiment of the present invention 3 applies printing opening
After pattern formation protective layer, the sectional view of the state after the first time plating of thickness of thin than protective layer is carried out.
Figure 18 is to represent to protect the printing patterns of openings formation more prominent more towards the top than first time plating by grinding etc.
The upper end of sheath removes and is formed as the sectional view with the mutually level state in upper surface of first time plating.
Specific embodiment
In order to illustrate in greater detail the present invention, the present invention will be described referring to the drawings.In addition, in the various figures, to identical
Or suitable part mark identical symbol, its repeat specification suitably simplifies, or even omits.
Fig. 1 is table after each constitutive requirements necessary to the manufacture method of printing suspended metal mask of the invention are separated
The stereogram for showing, Fig. 2~Fig. 7 is the section view of the manufacturing process of the manufacture method for representing printing suspended metal mask of the invention
Figure, Fig. 8~Figure 10 is to represent to form the printing patterns of openings of the substrate metal of existing printing suspended metal mask respectively
The sectional view of the state before and after being peeled off with protective layer, Figure 11~Figure 13 is to represent to cover printing of the invention with suspended metal respectively
The sectional view of front and rear state is peeled off in the printing patterns of openings formation of the substrate metal of mould with protective layer.
As shown in figure 1, the required constitutive requirements of the manufacture method of printing suspended metal mask of the invention are by four sides
Shape metal plate-making frame 3, substrate metal 5, quadrangle engagement auxiliary metal plate-making frame 7 and sponge 8 constitute, wherein, on
State metal plate-making frame 3 and be provided with combinational network in inner side, the combinational network is made up of wire netting 1 and Te Duolong nets 2, above-mentioned metal net
1 centrally disposed portion is simultaneously made up of conductive stainless (steel) wire or nickel screen, above-mentioned Te Duolong nets 2 by conductive tape etc. with
Above-mentioned wire netting 1 is conducted and is arranged on the outside of wire netting 1, and above-mentioned substrate metal 5 is arranged on substrate metal SUS mother metals 4,
And it is provided with printing patterns of openings formation protective layer 5a, above-mentioned engagement auxiliary gold in the middle body for forming printing patterns of openings
Category plate-making frame 7 is provided with Te Duolong nets 6, and above-mentioned sponge 8 is installed in the Te Duolong nets 6 of above-mentioned engagement auxiliary metal plate-making frame 7
With substrate metal between SUS mother metals 4.Additionally, the net for being located at the metal plate-making frame 3 of quadrangle is preferably by the gold of central portion
The combinational network that category net 1 is constituted with the Te Duolong nets 2 in outside, but it is also possible to be not combinational network, but by the single-piece with wire netting 1
The single mesh of composition.Above-mentioned substrate metal 5 is formed with printing patterns of openings 5b in central portion.
As shown in Fig. 2 in the engagement electroplating work procedure of the manufacture method of printing suspended metal mask, four are configured on right side
The metal plate-making frame 3 of side shape, in the engagement auxiliary metal plate-making frame 7 of left side configuration quadrangle.Then, substrate metal 5 is matched somebody with somebody
It is set to and is overlapped with the position of wire netting 1 of metal plate-making frame 3, makes metal plate-making frame 3 and engage the plate-making phase mutual respect of frame 7 of auxiliary metal
Merging adhesive tape 9 etc. is fastened and fixed, and substrate metal 5 is set across substrate metal SUS mother metals 4 and sponge 8 with wire netting 1
It is set to and is mutually close to state.The above-mentioned component for being positioned against state is connected and be powered with negative electrode 10, sulfamic acid is accommodated in
Nickel bathe or watt bath etc. nickel-plating liquid electroplating bath 11 in, by the way that anode-supported portion (ア ノ ー De バ ッ Network will be accommodated in) nickel
12 are connected with anode 13, and engagement plating is carried out between substrate metal 5 and wire netting 1, are integrally bonded both.Above-mentioned engagement
The usual side of plating amount is 2 μm, and identical galvanoplastic are electroplated using with electroforming.In addition, anode and cathode-current density are about 0.1
~2.0A/dm2, by preferably 0.25~1.0A/dm2Low current, can thereby improve engagement plating amount uniformity and prevent
The broken string of wire netting 1.
Then, after the completion of electroplating work procedure is engaged, the above-mentioned component (reference for being positioned against state is taken out from electroplating bath 11
Fig. 3), adhesive tape 9 is removed, and releases the component (reference picture 4) of the state that is positioned against.Then, from the peeling base of substrate metal 5
Metal is with SUS mother metals 4 (reference picture 5 and Fig. 6).Then, substrate metal 5 is made to be engaged with the junction surface of wire netting 1 from using plating
Printing patterns of openings formation is peeled off on the substrate metal 5 of integral metal plate-making frame 3 and use protective layer 5a, so as to form printing open
Mouth pattern 5b (reference picture 7).Additionally, the printing patterns of openings of substrate metal 5 is formed with protective layer 5a and printing patterns of openings 5b
Only it is simplifiedly to illustrate image, it is variant with material object.
Using Fig. 8~Figure 10, the general structure to the substrate metal of existing printing suspended metal mask is illustrated.
The substrate metal of existing printing suspended metal mask is first in substrate metal setting printing patterns of openings on SUS mother metals 24
Protective layer 25a is used in formation, and nickel plating is carried out thereon to make substrate metal 25, and the upper surface of substrate metal 25 generally utilizes sand
Belt grinding etc. carries out leveling.Engagement plating is carried out between above-mentioned substrate metal 25 and wire netting 21, makes substrate metal 25 with gold
Category net 21 is combined into one (reference picture 8, Fig. 9).Then, protected by peeling off the formation of printing patterns of openings from substrate metal 25
Layer 25a, printing patterns of openings 25b (reference picture 10) is formed in central portion.As shown in Figure 8, Figure 9, what is constituted as described above is existing
The printing patterns of openings of substrate metal 25 of printing suspended metal mask form upper end and wire netting with protective layer 25a
21 have contact, therefore, in the case of the braiding of wire netting 21 is uneven, the protuberance and protective layer of wire netting 21 in engagement
25a is touched, in the case that protective layer 25a is not ground into flat part, it may occur that protective layer 25a turns into obstruction and do not allow
Easily carry out engaging such problem.In addition, when patterns of openings formation is printed with stripping metal net 21 on protective layer 25a, the guarantor
A part of sheath 25a is not stripped and residues on the printing patterns of openings 25b of substrate metal 25 sometimes, therefore, deposit
It is susceptible to ooze out such problem at thin thread part particularly.In addition, printing patterns of openings formation protective layer when peeling off
During 25a, overburden operation expends 2~3 hours, so as to there are problems that it is long such that the activity duration is expended.
Then, 11~Figure 13 of reference picture, the base of the printing suspended metal mask of the invention to solving existing problem
The making step of material metal and the major part structure of substrate metal are illustrated.In the present invention, first, used in substrate metal
Printing patterns of openings formation is set on SUS mother metals 4 and uses protective layer 5a, nickel plating is carried out thereon, the side diffusion using plating is existing
As in the printing patterns of openings formation upper end of protective layer 5a, utilizing electroforming to make the base material of the brim part 5c with pendency
Metal 5.
The length of brim part 5c and the relation substantially 1 of thickness：1.That is, the length of brim part 5c with from protective layer top
Prominent thickness of slab is equal.The upper surface of substrate metal 5 is typically different, and the polishing grinding that is carried out using non-woven fabrics and ceramic-like is entered
Row leveling, therefore, reduce the damage to substrate metal 5.Enter between the substrate metal 5 and wire netting 1 with brim part 5c
Row engagement is electroplated and is allowed to be combined into one.It can be seen that brim part 5c makes substrate metal 5 increase with the bonding area of wire netting 1
Greatly (11~Figure 13 of reference picture).Now, as shown in Figure 11, Figure 12, in wire netting 1 and printing patterns of openings formation protective layer 5a
Upper end between, formed because there is brim part 5c make both separate gap 5d.Cause that printing is open using gap 5d
The upper end of pattern formation protective layer 5a is not appeared near the junction surface engaged with wire netting 1, thus, it is possible to eliminate connect
Unfavorable condition as obstacle during conjunction, so that engagement becomes easy.Additionally, by the way that patterns of openings formation protective layer will be printed
5a is peeled off from substrate metal 5, and printing patterns of openings 5b (reference picture 13) is formed in central portion.What is constituted as described above is of the invention
The substrate metal 5 of printing suspended metal mask will printing patterns of openings formation is peeled off with protective layer 5a when, because of wire netting 1 and
It is formed with space and easily enters stripper between protective layer 5a, protective layer is easily peeled off without residuing in substrate metal 5
Printing patterns of openings 5b on, therefore, it is possible to the pattern defect solved particularly at thin thread part during printing and be susceptible to ooze
The problems such as going out.In addition, also foreshortened within 30 points for peeling off the activity duration of printing patterns of openings formation protective layer 5a, from
And the time can be greatly shortened.
The protective layer used in the present embodiment usually dry-film type, in the case of the dry film without desired thickness,
Desired protection thickness can also be formed with liquid protective layer, electro-deposition protective layer etc..In addition, the length of brim part 5c and
Thickness is 1~5 μm, preferably 2~3 μm.
In the present embodiment, will put on printing patterns of openings formation protective layer 5a's on substrate metal SUS mother metals 4
Upper end is set to bigger than bottom, and the opening shape of the printing patterns of openings of substrate metal is set into upper end is (printed
Side) opening size more than bottom (printed side) opening size.
Implementation method 2
Figure 14 is to represent that the substrate metal in the printing suspended metal mask of embodiments of the present invention 2 forms printing and opens
After mouth pattern formation protective layer, the sectional view of the state that thickness is thinner than after the plating of the first time of the thickness of protective layer, figure are carried out
15 is the upper end for representing printing patterns of openings formation protective layer that will be more prominent more towards the top than first time plating by grinding etc.
Portion is removed, and is formed as the sectional view with the mutually level state in upper surface of first time plating, and Figure 16 is represented by grinding
Removed Deng the upper end that will print patterns of openings formation protective layer, and be formed as height identical with the upper surface of first time plating
Afterwards, second plating is carried out in the upper surface of first time plating, and there is the brim of a hat of pendency because of the side diffusion phenomena electroplated
The sectional view of the state in portion.
In present embodiment 2, first, protected with the formation of printing patterns of openings is formed on SUS mother metals 4 in substrate metal
Layer 5a and it is slightly thickeied, afterwards, carry out the first time that thickness is thinner than the thickness of printing patterns of openings formation protective layer 5a
Nickel electroplate 5-1 (reference picture 14).Then, the printing patterns of openings shape that will more towards the top be protruded than the nickel of first time plating 5-1
Removed into the upper end grinding with protective layer 5a, form printing mutually level with the upper surface of the plating 5-1 of first time and open
Mouth pattern is formed with protective layer 5a-1 (reference picture 15).Then, formed with printing patterns of openings on the nickel plating 5-1 of first time
With second nickel plating is carried out on protective layer 5a-1, using the side diffusion phenomena of plating in printing patterns of openings formation protective layer
The upper end of 5a-1 utilized electroforming and made the substrate metal 5 (reference picture 16) with the brim part 5c for dangling.Additionally, the brim of a hat
The length of portion 5c and the relation of thickness are about 1：1, by engaging between substrate metal 5 and wire netting 1 with brim part 5c
Electroplate and this point that is combined into one, above-mentioned brim part 5c make substrate metal 5 and wire netting 1 bonding area increase this point,
And formed because there is brim part 5c between the upper end of wire netting 1 and printing patterns of openings formation protective layer 5a-1 and make
The gap 5d that both are separate is on this point, identical with implementation method 1.
According to present embodiment 2, although increase man-hour number, but with not by printing patterns of openings formation with protective layer 5a's
Thickness is limited and can adjust the advantage of the thickness of plating.In addition, by printing the upper of patterns of openings formation protective layer 5a
End is ground, and can turn into the identical height in upper surface with first time plating, therefore, with can suppress to carry out second
The advantage of the inhomogeneities in face during plating.
Alternatively, it is also possible to the printing patterns of openings formation protruded more towards the top than the nickel of first time plating 5-1 is protected
The upper end grinding of layer 5a and remove, in the mutually level printing patterns of openings in upper surface of formation and the plating 5-1 of first time
After being formed with protective layer 5a-1, enter enforcement by making the surface active of the nickel plating 5-1 of first time with acid etc. and electroplate for second
Stickiness improve treatment.
In addition, when the brim part 5c of opening portion pendency is formed in, in order to make cap after the completion of the nickel of first time plating 5-1
The length of eaves portion reaches desired length, can separately be formed for adjusting the brim of a hat length by the protective layer of first time
The mode for carrying out second plating after protective layer again is manufactured.
Implementation method 3
Figure 17 is to represent that the substrate metal in the printing suspended metal mask of embodiment of the present invention 3 forms printing opening
Pattern formation with carried out after protective layer first time thinner than the thickness of protective layer electroplate after state sectional view, Figure 18 is table
Show the upper end removing of printing patterns of openings formation protective layer that will be more prominent more towards the top than first time plating by grinding etc.
Afterwards, the sectional view with the mutually level state in upper surface of first time plating is formed as.
In above-mentioned implementation method 1 and 2, protect the printing patterns of openings formation formed on substrate metal SUS mother metals 4
The upper end of sheath 5a is more than bottom, the opening shape of the printing patterns of openings of substrate metal (is printed as its upper end
Brush body side) opening size of the opening size more than bottom (printed side), but in present embodiment 3, use substrate metal
The printing patterns of openings formed on SUS mother metals 4 is formed and is more than upper end with the bottom of protective layer 5a, makes the printing of substrate metal
The opening shape of patterns of openings turns into the opening of the opening size less than bottom (printed side) of its upper end (printed side)
Size.
According to present embodiment 3, because the bottom for making printing patterns of openings formation protective layer 5a is more than upper end, because
This, can make the stripping of protective layer becomes easy, and deciduous when can improve printing.
Symbol description
1 wire netting
2 special many dragon nets
3 metals plate-making frame
4 substrate metals SUS mother metals
5 substrate metals
The plating of 5-1 first times
5a prints patterns of openings formation protective layer
Printing patterns of openings formation protective layer after 5a-1 grindings
5b prints patterns of openings
5c brim parts
5d gaps
6 special many dragon nets
7 engagement auxiliary metal plate-making frame
8 sponges
9 adhesive tapes
10 negative electrodes
11 electroplating baths
12 nickel
13 anodes
Claims (6)
1. a kind of screen painting suspended metal mask, including：
Chase；
Be adhesively fixed for its periphery and the inner side of the chase is located at by net, the net, and at least includes thering is conduction in central portion
The wire netting of property；And
Substrate metal, the substrate metal is close to overlap with the wire netting and is integrally bonded them using plating is engaged, and
The substrate metal is provided with printing patterns of openings,
Characterized in that,
The brim part of the upper end pendency of the printing patterns of openings of the substrate metal is formed on, using engagement
When plating makes the substrate metal be integrally bonded with the wire netting, patterns of openings shape is being printed because there is the brim part
Gap is formed with into between the upper end of protective layer and the wire netting.
2. screen painting suspended metal mask as claimed in claim 1, it is characterised in that
The opening shape for being formed at the printing patterns of openings of substrate metal is that the opening size of its upper end side is more than bottom side
Opening size.
3. screen painting suspended metal mask as claimed in claim 1, it is characterised in that
The opening shape for being formed at the printing patterns of openings of substrate metal is that the opening size of its upper end side is less than bottom side
Opening size.
4. screen painting suspended metal mask as claimed any one in claims 1 to 3, it is characterised in that
The length of the brim part of substrate metal is equal with the thickness of slab protruded from protective layer top.
5. a kind of manufacture method of screen painting suspended metal mask, the screen painting is included with suspended metal mask：Version
Frame；Be adhesively fixed for its periphery and the inner side of the chase is located at by net, the net, and at least includes in central portion conductive
Wire netting；And substrate metal, the substrate metal is close to overlap with the wire netting and engages them using plating is engaged
Integrally, and the substrate metal is provided with printing patterns of openings, it is characterised in that
The manufacture method includes：
Substrate metal formation process, in the substrate metal formation process, the formation of printing patterns of openings is set on mother metal and is protected
Sheath, and electroplated thereon, being formed in the upper end of printing patterns of openings formation protective layer has the brim part of pendency
Substrate metal；And
Gap formation process, in the gap formation process, the substrate metal with the brim part is made when being electroplated using engagement
When being integrally bonded with the wire netting, patterns of openings formation protective layer is printed described in advance because there is the brim part
Upper end and the wire netting between form gap.
6. the manufacture method of screen painting suspended metal mask as claimed in claim 5, it is characterised in that
Printing patterns of openings formation protective layer is set on mother metal, is electroplated thereon and is formed in printing patterns of openings shape
Into in the operation of the substrate metal of the brim part with the upper end of protective layer with pendency, on mother metal setting printing thicker opens
Mouth pattern formation protective layer, carries out the first time electricity of the thickness of thin than the printing patterns of openings formation protective layer thereon
Plating, then, by the upper end of the printing patterns of openings formation protective layer more prominent more towards the top than first time plating
Grind and remove, as patterns of openings formation protective layer is printed with the upper surface of first time plating is mutually level, then,
First time plating it is upper and with the mutually level printing patterns of openings formation of first time plating with being carried out on protective layer for the second time
Plating, so that the upper end for forming printing patterns of openings formation protective layer has the substrate metal of the brim part of pendency.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-277576 | 2012-12-20 | ||
| JP2012277576 | 2012-12-20 | ||
| PCT/JP2013/083863 WO2014098118A1 (en) | 2012-12-20 | 2013-12-18 | Suspended metal mask for printing and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104884264A CN104884264A (en) | 2015-09-02 |
| CN104884264B true CN104884264B (en) | 2017-06-09 |
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ID=50978443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380064893.XA Active CN104884264B (en) | 2012-12-20 | 2013-12-18 | Printing suspended metal mask and its manufacture method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5970561B2 (en) |
| KR (1) | KR101723321B1 (en) |
| CN (1) | CN104884264B (en) |
| TW (1) | TWI564162B (en) |
| WO (1) | WO2014098118A1 (en) |
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| CN105116687B (en) * | 2015-10-10 | 2018-04-06 | 京东方科技集团股份有限公司 | A kind of half tone and preparation method thereof |
| JP6971579B2 (en) * | 2017-01-27 | 2021-11-24 | 株式会社村田製作所 | Combination screen version for contact printing |
| US10933679B2 (en) | 2017-03-27 | 2021-03-02 | Taiyo Yuden Co., Ltd. | Screen printing plate and manufacturing method of electronic component |
| JP7075217B2 (en) * | 2017-03-27 | 2022-05-25 | 太陽誘電株式会社 | Screen printing plate and manufacturing method of electronic parts |
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| CN2920648Y (en) * | 2006-05-30 | 2007-07-11 | 华为技术有限公司 | Circuit board printing device and steel net thereof |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
| CN102712193A (en) * | 2009-09-21 | 2012-10-03 | Dtg国际有限公司 | Printing screens and method of fabricating the same |
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| JPH08183151A (en) * | 1994-12-28 | 1996-07-16 | Kyushu Hitachi Maxell Ltd | Manufacture of mesh-integrated metal mask |
| JP3643004B2 (en) * | 2000-03-10 | 2005-04-27 | 日本重化学工業株式会社 | Printed wiring board manufacturing method and printed wiring board manufacturing mask |
| JP4671255B2 (en) * | 2000-12-20 | 2011-04-13 | 九州日立マクセル株式会社 | Method for producing electroformed metal mask |
| JP4607390B2 (en) * | 2001-08-28 | 2011-01-05 | 九州日立マクセル株式会社 | Solder ball suction mask and manufacturing method thereof |
| JP4786379B2 (en) * | 2006-03-16 | 2011-10-05 | モレックス インコーポレイテド | Screen mask |
| JP5118395B2 (en) * | 2007-06-21 | 2013-01-16 | 株式会社ボンマーク | Mask manufacturing method and mask |
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- 2013-12-18 KR KR1020157018884A patent/KR101723321B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2920648Y (en) * | 2006-05-30 | 2007-07-11 | 华为技术有限公司 | Circuit board printing device and steel net thereof |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
| CN102712193A (en) * | 2009-09-21 | 2012-10-03 | Dtg国际有限公司 | Printing screens and method of fabricating the same |
Also Published As
| Publication number | Publication date |
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| KR101723321B1 (en) | 2017-04-04 |
| TW201446533A (en) | 2014-12-16 |
| WO2014098118A1 (en) | 2014-06-26 |
| JPWO2014098118A1 (en) | 2017-01-12 |
| CN104884264A (en) | 2015-09-02 |
| KR20150095867A (en) | 2015-08-21 |
| JP5970561B2 (en) | 2016-08-17 |
| TWI564162B (en) | 2017-01-01 |
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