JPH10305670A - Metal mask and its manufacture - Google Patents

Metal mask and its manufacture

Info

Publication number
JPH10305670A
JPH10305670A JP13587997A JP13587997A JPH10305670A JP H10305670 A JPH10305670 A JP H10305670A JP 13587997 A JP13587997 A JP 13587997A JP 13587997 A JP13587997 A JP 13587997A JP H10305670 A JPH10305670 A JP H10305670A
Authority
JP
Japan
Prior art keywords
metal mask
electroformed
mold
photoresist
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13587997A
Other languages
Japanese (ja)
Other versions
JP3786313B2 (en
Inventor
Masayuki Kawakami
賢行 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyushu Hitachi Maxell Ltd
Maxell Holdings Ltd
Original Assignee
Kyushu Hitachi Maxell Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu Hitachi Maxell Ltd, Hitachi Maxell Ltd filed Critical Kyushu Hitachi Maxell Ltd
Priority to JP13587997A priority Critical patent/JP3786313B2/en
Publication of JPH10305670A publication Critical patent/JPH10305670A/en
Application granted granted Critical
Publication of JP3786313B2 publication Critical patent/JP3786313B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To enhance a printing accuracy by improving plate removability of ink paste of a metal mask, and improving adhesive properties of a material to be printed. SOLUTION: A pattern film 12 is brought into close contact with a photoresist 11 laminated on a surface of an electroforming matrix 10, exposed, and developed to form a pattern resist film 13. Then, electrodeposition metal 24 is electrodeposited on a surface which is not covered with the film 13 of the matrix 10. Then, the metal 24 is released from the matrix 10. In the method for manufacturing such a metal mask, in the case of exposing, parallel rays are emitted obliquely to the photoresist 11 via the film 12 on a surface of the matrix 10 to expose it while rotating the matrix 10 around an axial center Q perpendicular to the matrix surface. Thus, the mask 1 having a through hole 2 of a tapered sectional shape in which a hole diameter of the matrix surface side 1a is larger than that of the electroforming surface side 1b can be easily obtained.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば各種電子部
品等を実装する配線パターンプリント基板等の被印刷物
上に、半田ペースト等の印刷物を塗布形成するためなど
に使用される、印刷用のメタルマスク及びその製造方法
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing metal used for applying a printed material such as a solder paste on a printed material such as a wiring pattern printed circuit board on which various electronic components are mounted. The present invention relates to a mask and a method for manufacturing the mask.

【0002】[0002]

【従来の技術】この種のメタルマスクは、C、Au、A
gやCuなどの導電性インキや蒸着物あるいは導電性ペ
ースト(以下、インキ・ぺーストという。)を通すため
の所望パターンの透孔を有するが、その製造法として電
鋳によるものがある。
2. Description of the Related Art This type of metal mask is composed of C, Au, A
It has through holes of a desired pattern through which a conductive ink such as g or Cu, a deposit or a conductive paste (hereinafter, referred to as an ink paste) passes, and there is an electroforming method as a manufacturing method thereof.

【0003】その電鋳工程の一例を図13に示す。ま
ず、図13(A)に示すように電鋳母型10の表面にド
ライフィルムによるフォトレジスト11を数層、ラミネ
ートし、次いで図13(B)のようにフォトレジスト1
1の上に、パターンフィルム12を密着させて、露光、
現像処理して、図13(C)に示すごとく所望パターン
のパターンレジスト膜13を形成する。次いで、図13
(D)に示すように電鋳母型10のパターンレジスト膜
13で覆われていない表面に電着金属24を電着させ、
しかるのち、図13(E)のように電着金属24の表面
を機械的研磨や電解研磨によって研磨する。最後に、図
13(F)に示すように電着金属24を電鋳母型10か
ら剥離し、パターンレジスト膜13を除去することによ
り、所望パターンの透孔2を有するメタルマスク1(2
4)の電鋳製品を得る。
FIG. 13 shows an example of the electroforming process. First, several layers of a photoresist 11 of a dry film are laminated on the surface of the electroformed matrix 10 as shown in FIG. 13A, and then the photoresist 1 is laminated as shown in FIG.
1, a pattern film 12 is brought into close contact with the
By performing a developing process, a pattern resist film 13 having a desired pattern is formed as shown in FIG. Then, FIG.
As shown in (D), an electrodeposition metal 24 is electrodeposited on the surface of the electroforming mold 10 that is not covered with the pattern resist film 13,
Thereafter, the surface of the electrodeposited metal 24 is polished by mechanical polishing or electrolytic polishing as shown in FIG. Finally, as shown in FIG. 13 (F), the electrodeposited metal 24 is peeled off from the electroformed mold 10 and the pattern resist film 13 is removed, so that the metal mask 1 (2
4) An electroformed product is obtained.

【0004】このようにして得るメタルマスク1の透孔
2の断面形状は、電鋳母型面側1aの孔径が小さく、電
鋳面側1bの孔径が大きいテーパー状に形成される。こ
れは、フォトレジスト11が表面層から下層へ行くほど
指数関数的に光線(紫外線)の吸収が行われ、この結果
電鋳母型10に面する側にまで光線が充分に達しにくい
ことが原因であると考えられる。このような透孔2のテ
ーパー状化の傾向は紫外線透過率の小さいフォトレジス
トを使用するほど顕著に現れる。
The cross-sectional shape of the through-hole 2 of the metal mask 1 thus obtained is formed in a tapered shape in which the hole diameter on the electroformed mold surface 1a is small and the hole diameter on the electroformed surface 1b is large. This is because light (ultraviolet light) is absorbed exponentially as the photoresist 11 goes from the surface layer to the lower layer, and as a result, the light beam hardly reaches the side facing the electroformed mold 10. It is considered to be. Such a tendency of the through hole 2 to be tapered becomes more remarkable as a photoresist having a lower ultraviolet transmittance is used.

【0005】かかるメタルマスク1を用いて印刷するに
は、一般に、図14に示すごとくメタルマスク1を上下
反転させてその電鋳面側1bを被印刷体3の上に密着さ
せ、メタルマスク1の電鋳母型面側1aをスキージかけ
面にしてこの上にインキ・ペーストPをのせ、スキージ
Sをかけてインキ・ペーストPを透孔2内に充填する。
メタルマスク1を上下反転させて使用するのは、前述し
たように透孔2の電鋳面側1bの孔径の方が大きくて、
被印刷体3へのインキ・ペーストPの版抜け性が良好に
なるからである。
In order to perform printing using the metal mask 1, generally, the metal mask 1 is turned upside down as shown in FIG. The ink paste P is put on the squeegee surface with the electroformed mold side 1a being the squeegee mounting surface, and the squeegee S is applied to fill the ink paste P into the through hole 2.
When the metal mask 1 is used upside down, the hole diameter of the electroformed surface side 1b of the through hole 2 is larger as described above.
This is because the ink-paste P on the printing medium 3 can be easily removed from the printing plate.

【0006】[0006]

【発明が解決しようとする課題】しかし、上記のように
インキ・ペーストPの版抜け性のみを主眼としてメタル
マスク1を上下反転させて印刷すると、メタルマスク1
の電鋳面側1bは表面研磨しても電鋳母型面側1aほど
の平滑面を得ることができないため、被印刷体3の表面
との密着性が悪く、またメタルマスク1の透孔パターン
の粗密の差などにより電鋳時におけるマスク厚の差が生
じている場合、印刷時にかすれやにじみが生じるため、
きれいに印刷できない。
However, as described above, when the metal mask 1 is printed upside down with only the object of the ink paste P as the main object, the metal mask 1
Since the electroformed surface side 1b cannot obtain as smooth a surface as the electroformed mold surface side 1a even if the surface is polished, the adhesion to the surface of the printing substrate 3 is poor, and the through-hole of the metal mask 1 is formed. If there is a difference in mask thickness during electroforming due to differences in pattern density, etc., blurring or bleeding occurs during printing,
Cannot print cleanly.

【0007】この後者について更に言及すると、透孔パ
ターンによっては、図15(a)に示すように、一枚の
メタルマスク1において、透孔2自体の面積が大きかっ
たり、あるいは多数の透孔2が小ピッチで密集するなど
して透孔密度の大きい領域Aと、透孔2が疎らに並ぶな
どして透孔密度の小さい領域Bとが併存することがあ
る。こうした場合は、電着法において単位面積当たりに
電着される金属量(電着量)はほぼ一定であるため、電
鋳時に電流密度の差が生じ、マスク厚が透孔密度の大き
い領域Aで厚く、透孔密度の小さい領域Bで薄くなる、
というマスク厚の差が生じる。このようなメタルマスク
1では、これを前述したように上下反転させて印刷する
と、図15(b)に示すように、透孔密度の小さい領域
Bの電鋳面側(印刷面側)1bが被印刷体3の表面から
浮く状態になって、インキ・ペーストP′がメタルマス
ク1の印刷面側1bにまわり込み、これが原因してにじ
みやかすれが生じてきれいに印刷できないことになる。
Referring to the latter, depending on the through hole pattern, as shown in FIG. 15A, the area of the through hole 2 itself is large in one metal mask 1 or a large number of through holes 2 are formed. Are densely arranged at a small pitch, and a region A having a large hole density is present together with a region B having a small hole density because the holes 2 are sparsely arranged. In such a case, the amount of metal electrodeposited per unit area (electrodeposition amount) in the electrodeposition method is substantially constant, so that a difference in current density occurs at the time of electroforming, and the mask A has a region A having a large through-hole density. Thicker, and thinner in the region B with a small hole density.
This causes a difference in the mask thickness. In such a metal mask 1, when the metal mask 1 is printed upside down as described above, as shown in FIG. 15B, the electroformed surface side (printed surface side) 1 b of the region B having a low hole density is reduced. The ink paste P 'floats from the surface of the printing substrate 3 and reaches the printing surface side 1b of the metal mask 1, which causes bleeding and blurring, thereby making it impossible to print finely.

【0008】また、フォトレジスト11の露光に際し、
光線の平行直進性を向上させた平行露光機を使用した場
合、図13(B)に示すごとく光線が電鋳母型10に対
し全面にわたって垂直に進行するため、パターンフィル
ム12の微細部分までを忠実にパターンレジスト膜13
に写し出すよう露光してしまう。従って、パターンフィ
ルム12に描かれた透孔内周縁に相当する部分はミクロ
ンオーダーで見れば微細なギザギザがあるが、このギザ
が性能の良い平行露光機によりパターンレジスト膜13
に忠実に写し出される。この結果、このパターンレジス
ト膜13を用いてメタルマスク1を電鋳した場合、この
メタルマスク1の透孔2の内面に、図13(F)中の拡
大図で示すごとき微細な条溝2aが形成される。このた
め、印刷時にインキ・ペーストPが透孔2から完全に抜
けることなく、その内面に付着残留し、印刷性低下の原
因となる。
Further, when exposing the photoresist 11,
In the case of using a parallel exposure machine in which the parallel straightness of the light beam is improved, the light beam travels perpendicularly to the entire surface of the electroforming mold 10 as shown in FIG. Faithfully the pattern resist film 13
Exposure to project on Therefore, the portion corresponding to the inner peripheral edge of the through-hole drawn on the pattern film 12 has fine knurls when viewed on the order of microns, but this knurl is caused by the pattern resist film 13
Will be faithfully projected. As a result, when the metal mask 1 is electroformed using the pattern resist film 13, fine grooves 2a as shown in an enlarged view in FIG. 13F are formed on the inner surface of the through hole 2 of the metal mask 1. It is formed. For this reason, the ink paste P does not completely come out of the through hole 2 during printing, but remains on the inner surface thereof, causing a deterioration in printability.

【0009】本発明の目的は、上記のようなメタルマス
クの透孔の断面形状に工夫を凝らすことにより、インキ
・ペーストの版抜け性を確保しながら被印刷体への密着
性に優れ、またマスク厚差がある場合も精度の高い印刷
を可能にする優れたメタルマスクを提供することにあ
る。本発明の目的は、このようなインキ・ペーストの版
抜け性、印刷精度に優れるメタルマスクを容易に得るこ
とができ、さらにメタルマスクの透孔断面のテーパーを
任意角度に制御することができるメタルマスクの製造方
法を提供することにある。
An object of the present invention is to improve the cross-sectional shape of the through-holes of the metal mask as described above, thereby ensuring excellent adhesion of the ink paste to the printing medium while ensuring the plate-removing property of the ink paste. An object of the present invention is to provide an excellent metal mask that enables high-precision printing even when there is a difference in mask thickness. An object of the present invention is to provide a metal mask which can easily obtain a metal mask excellent in such an ink / paste plate removability and printing accuracy, and which can control a taper of a cross section of a through hole of the metal mask to an arbitrary angle. An object of the present invention is to provide a method for manufacturing a mask.

【0010】[0010]

【課題を解決するための手段】本発明のうち請求項1記
載の発明は、図1に例示するように、電鋳法により製作
され、所望パターンのインキ・ぺースト通し用の透孔2
を有するメタルマスクにおいて、透孔2の断面形状が、
電鋳母型面側1aの孔径が大きく、電鋳面側1bの孔径
が小さくなるようテーパー状に形成されていることを特
徴とする。
According to the first aspect of the present invention, as shown in FIG. 1, the through hole 2 is formed by an electroforming method to pass a desired pattern of ink paste.
In the metal mask having
It is characterized in that it is tapered so that the hole diameter on the electroformed mold surface 1a is large and the hole diameter on the electroformed surface 1b is small.

【0011】請求項2記載の発明は、電鋳母型10の表
面にラミネート又は塗布したフォトレジスト11の上
に、パターンフィルム11を密着させて露光、現像処理
して、パターンレジスト膜13をパターンニング形成す
る工程と、電鋳母型10のパターンレジスト膜13で覆
われていない表面に電着金属24を電着形成する工程
と、電鋳母型10から電着金属24を剥離する工程を経
てメタルマスクを得るメタルマスクの製造方法におい
て、前記露光に際し、電鋳母型10をこの母型表面と垂
直な軸心Qまわりに回転させながら、電鋳母型10の表
面上のパターンフィルム12を介してフォトレジスト1
1に対し光線を斜め方向に照射させて露光することを特
徴とする。
According to a second aspect of the present invention, a pattern film 11 is brought into close contact with a photoresist 11 laminated or coated on the surface of an electroforming mold 10 and exposed and developed to form a pattern resist film 13 into a pattern. A step of forming an electrodeposited metal 24 on the surface of the electroformed master 10 that is not covered with the pattern resist film 13, and a step of peeling the electrodeposited metal 24 from the electroformed master 10. In the method of manufacturing a metal mask for obtaining a metal mask through the above process, the pattern film 12 on the surface of the electroformed mold 10 is rotated while rotating the electroformed mold 10 around an axis Q perpendicular to the surface of the mold during the exposure. Through the photoresist 1
1 is characterized by irradiating a light beam in an oblique direction to expose.

【0012】請求項3記載の発明は、請求項2記載のメ
タルマスクの製造方法において、露光に際し、図5また
は図6に示すように電鋳母型10を水平面に対し或る角
度だけ傾斜する姿勢下に置いて電鋳母型10の表面と垂
直な軸心Qまわりに回転させながら、水平面に向かって
直進する光線を電鋳母型10の表面上のパターンフィル
ム12を介してフォトレジスト11に照射させて露光す
ることを特徴とする。
According to a third aspect of the present invention, in the method of manufacturing a metal mask according to the second aspect, upon exposure, the electroformed mold 10 is inclined at a certain angle with respect to a horizontal plane as shown in FIG. 5 or FIG. While being placed in the posture, while rotating around the axis Q perpendicular to the surface of the electroformed mold 10, light rays that go straight toward the horizontal plane are exposed to the photoresist 11 through the pattern film 12 on the surface of the electroformed mold 10. And is exposed.

【0013】請求項4記載の発明は、請求項2記載のメ
タルマスクの製造方法において、露光に際し、図8に示
すように電鋳母型10を水平姿勢下に置いて電鋳母型1
0の表面と垂直な軸心Qまわりに回転させながら、電鋳
母型10の表面上のパターンフィルム12を介してフォ
トレジスト11に対し光線を斜め方向から照射させて露
光することを特徴とする。
According to a fourth aspect of the present invention, in the method for manufacturing a metal mask according to the second aspect, the electroforming master 10 is placed in a horizontal position as shown in FIG.
While rotating around an axis Q perpendicular to the surface of the mold 0, the photoresist 11 is exposed to light by obliquely irradiating the photoresist 11 through the pattern film 12 on the surface of the electroformed mold 10. .

【0014】請求項5記載の発明のメタルマスクの製造
方法は、上記メタルマスクの製造方法において、露光に
際し、図9(B)に示すように電鋳母型10の表面上の
パターンフィルム12の上に、入射光を一方向にのみ屈
折させてパターンフィルム12を通してフォトレジスト
11に対し一定の斜め方向に出射する偏光フィルター2
5を平行に配置させて、該偏光フィルター25を電鋳母
型10の表面と垂直な軸心Qまわりに回転させながら露
光することを特徴とする。
According to a fifth aspect of the present invention, there is provided a method of manufacturing a metal mask according to the first aspect of the present invention, wherein the pattern film 12 on the surface of the electroformed mold 10 is exposed as shown in FIG. Above, a polarizing filter 2 that refracts incident light in only one direction and emits the light through the pattern film 12 in a certain oblique direction to the photoresist 11.
5 are arranged in parallel, and exposure is performed while rotating the polarizing filter 25 around an axis Q perpendicular to the surface of the electroformed mold 10.

【0015】請求項6記載の発明のメタルマスクの製造
方法は、平板からなるベース26の表面上にフォトレジ
スト11を剥離可能にラミネート又は塗布する工程と、
フォトレジスト11の上にパターンフィルム12を重
ね、ベース26に対し垂直に直進する光でフォトレジス
ト11を露光する工程と、パターンフィルム12を剥が
して、フォトレジスト11を電鋳母型10側に転写する
工程と、現像、乾燥処理してパターンレジスト膜13を
電鋳母型10の上に形成する工程と、電鋳母型10のパ
ターンレジスト膜13で覆われていない表面に電着金属
24を形成する工程と、電着金属24を電鋳母型10か
ら剥離する工程とからなる。
According to a sixth aspect of the present invention, there is provided a method of manufacturing a metal mask, comprising the steps of laminating or coating a photoresist 11 on a surface of a base 26 made of a flat plate in a releasable manner;
A step of exposing the photoresist film 11 with light that is superimposed on the photoresist film 11 and traveling straight perpendicular to the base 26; and removing the pattern film 12 and transferring the photoresist film 11 to the electroforming mold 10 side. Forming the pattern resist film 13 on the electroformed matrix 10 by developing and drying, and depositing the electrodeposited metal 24 on the surface of the electroformed matrix 10 not covered with the pattern resist film 13. It comprises a step of forming and a step of peeling the electrodeposited metal 24 from the electroformed mold 10.

【0016】[0016]

【作用】請求項1記載の発明のように、メタルマスク1
の断面テーパー形状の透孔2の電鋳母型面側1aの孔径
を、電鋳面側1bの孔径よりも大きく形成してあると、
電鋳面側1bをスキージ面として、平滑で密着性に優れ
る電鋳母型面側1aを被印刷体3に高い密着度で密着さ
せて印刷することができ、またインキ・ペーストの版抜
け性が良好であるばかりか、マスク厚の差があるような
場合もかすれやにじみ等がなく、きれいに印刷すること
ができる。
According to the present invention, a metal mask is provided.
When the diameter of the through hole 2 having a tapered cross section of the electroformed mold side 1a of the through hole 2 is formed larger than the diameter of the hole on the electroformed surface 1b,
By using the electroformed surface side 1b as a squeegee surface, the electroformed mold surface side 1a, which is smooth and excellent in adhesion, can be adhered to the printing substrate 3 with a high degree of adhesion, and printing can be performed with ink and paste. Is good, and even in the case where there is a difference in mask thickness, fine printing can be performed without blurring or bleeding.

【0017】請求項2ないし4記載の発明によれば、電
鋳母型面側1aの孔径を、電鋳面側1bの孔径よりも大
きくする断面テーパー形状の透孔2をもつメタルマスク
1を容易に得ることができる。また、電鋳母型10の傾
き角度、またはパターンフィルム12に対する光線の傾
斜角度を変えることによって、透孔2のテーパー角度を
任意に調節することができる。このように透孔2のテー
パー角度を任意に調節できるため、例えば、図12に示
すごとく、このメタルマスク1を電鋳面側1bを被印刷
体3と対向させて蒸着用マスクとして利用する場合にお
いても、透孔2のテーパーをより鋭角的なものとするこ
とができ、蒸着マスクとしての性能を向上させることが
できる。なお図12中、32は被印刷体3に蒸着されつ
つある蒸着物を示す。
According to the second to fourth aspects of the present invention, there is provided a metal mask 1 having a through-hole 2 having a tapered cross section in which the hole diameter of the electroformed mold surface 1a is larger than the hole diameter of the electroformed surface 1b. Can be easily obtained. The taper angle of the through hole 2 can be arbitrarily adjusted by changing the inclination angle of the electroformed mold 10 or the inclination angle of the light beam with respect to the pattern film 12. Since the taper angle of the through hole 2 can be arbitrarily adjusted in this way, for example, as shown in FIG. 12, when the metal mask 1 is used as a vapor deposition mask with the electroformed surface side 1b facing the printing medium 3 In this case, the taper of the through hole 2 can be made more acute, and the performance as a vapor deposition mask can be improved. In FIG. 12, reference numeral 32 denotes a deposited material being deposited on the printing medium 3.

【0018】さらに、電鋳母型10を回転させながら露
光するので、パターンフィルム12描かれた透孔内周縁
に相当する部分に微細なギザギザがある場合も、このギ
ザギザがパターンレジスト膜13に写し出されるような
ことがなく、従ってメタルマスク1の透孔2の内面は、
図13(F)に示すごとき微細な条溝2aの無い平滑面
に形成することができ、印刷時に透孔2の内面にインキ
・ペーストPが付着残留することなく、吐出が良好にな
り、印刷性を向上でき、また印刷後の洗浄効果も高めら
れる。
Furthermore, since the exposure is performed while rotating the electroformed mold 10, even if there is a minute indentation in a portion corresponding to the inner peripheral edge of the through-hole drawn in the pattern film 12, the indentation is reflected on the pattern resist film 13. Therefore, the inner surface of the through hole 2 of the metal mask 1
As shown in FIG. 13 (F), it can be formed on a smooth surface without the fine grooves 2a, the ink paste P does not adhere and remain on the inner surface of the through-hole 2 at the time of printing, and the ejection becomes good, and the printing is performed. And the cleaning effect after printing can be enhanced.

【0019】請求項5記載の発明においても、電鋳母型
面側1aの孔径を、電鋳面側1bの孔径よりも大きくす
る断面テーパー形状の透孔2をもつメタルマスク1を容
易に得ることができ、また偏光フィルター25の出射角
度をそれぞれ選択することで、テーパー角度を任意に調
節することができる。さらに、偏光フィルター25を回
転させながら露光するので、メタルマスク1の透孔2の
内面に微細な条溝2aの無い平滑面に形成することがで
きる。
According to the present invention, the metal mask 1 having the through-hole 2 having a tapered cross section in which the hole diameter of the electroformed mold surface 1a is larger than the hole diameter of the electroformed surface 1b can be easily obtained. The taper angle can be arbitrarily adjusted by selecting the output angles of the polarizing filter 25, respectively. Further, since the exposure is performed while rotating the polarizing filter 25, the metal mask 1 can be formed on a smooth surface without the fine grooves 2a on the inner surface of the through hole 2.

【0020】請求項6記載の発明においては、ベース2
6の表面上に剥離可能にラミネート又は塗布したフォト
レジスト11を露光し、この露光したフォトレジスト1
1を電鋳母型10側に転写させて電鋳するので、これに
おいても電鋳母型面側1aの孔径を、電鋳面側1bの孔
径よりも大きくする断面テーパー形状の透孔2をもつメ
タルマスク1を容易に得ることができる。
In the invention according to claim 6, the base 2
Expose photoresist 11 laminated or applied releasably on the surface of
1 is transferred to the electroforming mold 10 side and electroformed, so that the through-hole 2 having a tapered cross-section that makes the hole diameter of the electroforming mold surface 1a larger than the hole diameter of the electroforming surface 1b also in this case. Metal mask 1 can be easily obtained.

【0021】[0021]

【発明の実施の形態】本発明に係る電鋳製メタルマスク
の実施例を図1ないし図3に基づき説明する。図1にお
いて、このメタルマスク1はインキ・ぺースト通し用の
透孔2を所望の印刷パターンに対応させてパターンニン
グ形成している。その透孔2の断面形状は、電鋳母型面
側1aの孔径が大きく、電鋳面側1bの孔径が小さくな
るようテーパー状に形成したものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electroformed metal mask according to the present invention will be described with reference to FIGS. In FIG. 1, a metal mask 1 is formed by patterning a through hole 2 for passing an ink paste so as to correspond to a desired print pattern. The cross-sectional shape of the through hole 2 is tapered so that the hole diameter on the electroformed mold surface 1a is large and the hole diameter on the electroformed surface 1b is small.

【0022】このような断面形状の透孔2をもつメタル
マスク1は、例えば、図2に示すように、被印刷体3の
表面上に電鋳母型面側1aを下側にして置き、電鋳面側
1bをスキージかけ面4としてこの上にインキ・ぺース
トPをのせ、スキージSをかけてインキ・ぺーストPを
透孔2内に充填するのである。その際、透孔2は電鋳母
型面側1aの孔径が電鋳面側1bの孔径よりも大きく形
成されているので、インキ・ぺーストPは被印刷体3へ
の版抜け性が良好である。またメタルマスク1の電鋳母
型面側1aは平滑面に形成されているので、被印刷体3
の表面との密着性を良好にする。また、メタルマスク1
が図3に示すごとく透孔パターンの粗密差などによりマ
スク厚の差があるような場合も、その平滑な電鋳母型面
側1aを被印刷体3の表面上に密着させて印刷すること
ができ、かすれやにじみ等がなく、精度の高い印刷がで
きるに至った。
For example, as shown in FIG. 2, a metal mask 1 having a through-hole 2 having such a cross-sectional shape is placed on the surface of a printing substrate 3 with an electroformed mold surface 1a facing downward. The electrocast surface 1b is used as a squeegee mounting surface 4 on which an ink paste P is placed, and a squeegee S is applied to fill the ink paste P into the through-hole 2. At this time, the through-hole 2 is formed such that the hole diameter of the electroformed mold surface 1a is larger than the hole diameter of the electroformed surface 1b, so that the ink paste P has good plate removability to the printing material 3. It is. Further, since the electroformed mold side 1a of the metal mask 1 is formed as a smooth surface,
To improve the adhesion to the surface. Also, metal mask 1
However, even when there is a difference in the mask thickness due to the difference in the density of the through-hole pattern as shown in FIG. 3, the smooth electroformed mold surface side 1a should be adhered to the surface of the printing substrate 3 for printing. This has resulted in high-precision printing without blurring or bleeding.

【0023】以下、上記メタルマスクの電鋳による製造
方法について第1実施例ないし第5実施例を挙げる。
Hereinafter, first to fifth embodiments of the method for producing the metal mask by electroforming will be described.

【0024】(第1実施例)図4は本発明の製造方法の
第1実施例を示す。まず、図4(A)に示すようにステ
ンレス鋼製の電鋳母型10の表面にドライフィルムによ
るフォトレジスト11を数枚ラミネートして、例えば2
00μmの均一な膜を形成する。フォトレジスト11は
ドライフィルムに代えて、液状フォトレジストを塗布す
ることもできる。
(First Embodiment) FIG. 4 shows a first embodiment of the manufacturing method of the present invention. First, as shown in FIG. 4A, several photoresists 11 of a dry film are laminated on the surface of an electroformed mold 10 made of stainless steel.
A uniform film of 00 μm is formed. The photoresist 11 may be a liquid photoresist instead of a dry film.

【0025】次いで、図4(B)に示すようにフォトレ
ジスト11の上に、所望のマスクパターンに相当するパ
ターンをもつパターンフィルム(ネガタイプ)12を密
着させ、紫外線ランプを照射して露光、現像、乾燥の各
処理を行って、図4の(C)に示すようにパターンレジ
スト膜13を形成する。
Next, as shown in FIG. 4B, a pattern film (negative type) 12 having a pattern corresponding to a desired mask pattern is brought into close contact with the photoresist 11, and exposed and developed by irradiation with an ultraviolet lamp. Then, the respective processes of drying and drying are performed to form a pattern resist film 13 as shown in FIG.

【0026】その露光に際しては、平行露光機を用いる
が、この際、フォトレジスト11の上にパターンフィル
ム12を密着させた電鋳母型10は、図5に示すよう
に、露光機内の水平面上に任意角度だけ傾斜する状態に
設置した回転台14の上に載置する。回転台14は傾斜
状の載置台板16の下側に減速機付きのモータ15を備
えており、この載置台板16の上に前記電鋳母型10が
載置される。平行露光機内には、光源17を設置すると
ともに、この光源17の下方に平面反射板19を上向き
傾斜状に設置し、かつ、回転台14の真上に曲面反射板
20を平面反射板19に相対して設置する。曲面反射板
20及び回転台14と、光源17との間には、遮光板2
1を設置することで、光源17からの直接光が回転台1
4に作用しないようにする。
At the time of the exposure, a parallel exposure machine is used. At this time, the electroforming mold 10 in which the pattern film 12 is adhered to the photoresist 11 is placed on a horizontal plane in the exposure machine as shown in FIG. Is placed on a turntable 14 installed at an angle of an arbitrary angle. The turntable 14 is provided with a motor 15 with a speed reducer below the inclined mounting table 16, and the electroformed mold 10 is mounted on the mounting table 16. In the parallel exposure machine, a light source 17 is installed, and a flat reflecting plate 19 is installed below the light source 17 in an inclined upward direction, and a curved reflecting plate 20 is placed on the flat reflecting plate 19 directly above the turntable 14. Install them facing each other. A light-shielding plate 2 is provided between the light source 17 and the curved reflecting plate 20 and the turntable 14.
1 allows direct light from the light source 17 to be
No effect on 4

【0027】かくして、光源17からの光はレンズ22
を通って平面反射板19で反射し、この反射光を曲面反
射板20に投光し、曲面反射板20で反射した平行光を
電鋳母型10上のパターンフィルム12を介してフォト
レジスト11に照射する。これと同時に回転台14を電
鋳母型10の表面と垂直な軸心Qまわりに回転させて露
光する。図5中の拡大図にフォトレジスト11への平行
光線の透過状態を示すように、平行光線m・nは電鋳母
型10の傾斜角度に対応してフォトレジスト11内にレ
ジスト厚方向に対し斜交する方向に透過する。平行光線
mは電鋳母型10の回転方向の或る位置で透過する光線
を、平行光線nは電鋳母型10が前記位置から更に18
0°回転した後における光線を示す。このように平行光
をパターンフィルム12を介してフォトレジスト11に
斜めに透過させ、同時に回転させながら露光するため、
フォトレジスト11の電鋳母型10面側ではパターンフ
ィルム12面側よりも広くなるよう露光して断面台形状
の露光部11aを硬化させる。その露光部11aにはパ
ターンフィルム12の透孔内周縁に相当する部分に微細
なギザギザがある場合も、電鋳母型10を回転させなが
ら露光するため、そのギザギザが電鋳母型10上のパタ
ーンレジスト膜13に写し出されるようなことがない。
Thus, the light from the light source 17 is
Then, the reflected light is reflected by a plane reflecting plate 19, the reflected light is projected on a curved reflecting plate 20, and the parallel light reflected by the curved reflecting plate 20 is passed through a pattern film 12 on an electroforming mold 10 to form a photoresist 11 Irradiation. At the same time, the turntable 14 is rotated about an axis Q perpendicular to the surface of the electroformed mold 10 to perform exposure. As shown in the enlarged view of FIG. 5, the parallel light beams mn correspond to the inclination angle of the electroforming mold 10 in the photoresist 11 with respect to the resist thickness direction. Transmit in oblique directions. The parallel light beam m is a light beam that is transmitted at a certain position in the rotation direction of the electroforming mold 10, and the parallel light beam n is that the electroforming master device 10 is further moved by 18 from the position.
The ray after rotation by 0 ° is shown. As described above, the parallel light is transmitted obliquely to the photoresist 11 through the pattern film 12 and is exposed while rotating at the same time.
The exposed portion 11a having a trapezoidal cross section is cured by exposing the photoresist 11 on the side of the electroformed mold 10 on the side of the electroformed matrix 10 to be wider than the side of the pattern film 12 on the side. Even when the exposed portion 11a has a fine indentation in a portion corresponding to the inner peripheral edge of the through hole of the pattern film 12, the exposure is performed while rotating the electroforming master 10, so that the indentation is formed on the electroforming master 10. It does not appear on the pattern resist film 13.

【0028】平面反射板19及び曲面反射板20を用い
て平行光線を放つに代えて、図6に示すように放物面反
射板23を用いて平行光線を放つこともできる。
Instead of emitting parallel rays using the plane reflector 19 and the curved reflector 20, a parallel ray can be emitted using a parabolic reflector 23 as shown in FIG.

【0029】しかるのち、現像により未露光部11bを
溶解除去する。これにより図4(C)に示すごとくパタ
ーンレジスト膜13が形成される。
Thereafter, the unexposed portion 11b is dissolved and removed by development. Thus, a pattern resist film 13 is formed as shown in FIG.

【0030】次いで、常套手段通り、電鋳母型10をス
ルファミン酸ニッケル浴などの電鋳槽に移し、ニッケ
ル、あるいはニッケル−コバルト合金で電鋳を行って、
図4(D)に示すように電鋳母型10のパターンレジス
ト膜13で覆われていない表面に電着金属24を形成す
る。電鋳後、図4(E)に示すごとく電着金属24の表
面を機械的研磨や電解研磨により研磨する。
Next, the electroforming mold 10 is transferred to an electroforming tank such as a nickel sulfamate bath and electroformed with nickel or a nickel-cobalt alloy as usual.
As shown in FIG. 4D, an electrodeposited metal 24 is formed on a surface of the electroformed mold 10 that is not covered with the pattern resist film 13. After the electroforming, the surface of the electrodeposited metal 24 is polished by mechanical polishing or electrolytic polishing as shown in FIG.

【0031】最後に、パターンレジスト膜13を除去し
た後、電着金属24を電鋳母型10から剥離することに
より、図4(F)に示すように透孔2の断面形状が電鋳
母型面側1aの孔径を電鋳面側1bの孔径よりも大きく
するテーパー状に形成し、また透孔2の内周面を図13
(F)に示すごとき条溝2aの無い平滑面にするメタル
マスク1の電鋳製品を得る。
Finally, after the pattern resist film 13 is removed, the electrodeposited metal 24 is peeled off from the electroforming master 10 so that the cross-sectional shape of the through-hole 2 becomes as shown in FIG. The hole diameter on the mold surface side 1a is formed to be tapered so as to be larger than the hole diameter on the electroformed surface side 1b.
An electroformed product of the metal mask 1 having a smooth surface without the groove 2a as shown in FIG.

【0032】(第2実施例)図7及び図8は本発明の製
造方法の第2実施例を示す。この第2実施例では、表面
にフォトレジスト11及びパターンフィルム12をのせ
た電鋳母型10を、露光機内に水平に設置した回転台1
4の上に載置し、回転台14を電鋳母型10の表面と垂
直な軸心Qまわりに回転させながら、電鋳母型10の表
面上のパターンフィルム12を介してフォトレジスト1
1に対し平行光線を斜め方向から照射させて露光する以
外は、第1実施例の場合と同様である。
(Second Embodiment) FIGS. 7 and 8 show a second embodiment of the manufacturing method of the present invention. In the second embodiment, an electroforming mold 10 having a surface coated with a photoresist 11 and a pattern film 12 is mounted on a turntable 1 horizontally set in an exposure machine.
4 while rotating the turntable 14 about an axis Q perpendicular to the surface of the electroformed mold 10, the photoresist 1 is moved through the pattern film 12 on the surface of the electroformed mold 10.
This is the same as the case of the first embodiment, except that exposure is performed by irradiating a parallel beam to 1 from an oblique direction.

【0033】この方法においても、透孔2の断面形状が
電鋳母型面側1aの孔径を電鋳面側1bの孔径よりも大
きくするテーパー状に形成し、また透孔2の内周面を平
滑面にするメタルマスク1の電鋳製品を得ることができ
る。
Also in this method, the cross-sectional shape of the through hole 2 is formed in a tapered shape so that the hole diameter of the electroformed mold surface 1a is larger than the hole diameter of the electroformed surface 1b. An electroformed product of the metal mask 1 having a smooth surface can be obtained.

【0034】(第3実施例)図9は本発明の製造方法の
第3実施例を示す。この第3実施例では、表面にフォト
レジスト11及びパターンフィルム12をのせた電鋳母
型10の表面上のパターンフィルム12の上に、入射光
を一方向にのみ屈折させてパターンフィルム12を通し
てフォトレジスト11に対し一定の斜め方向に出射する
偏光フィルター25を平行に配置させて、該偏光フィル
ター25を電鋳母型10の表面と垂直な軸心Qまわりに
回転させながら露光する以外は、第1実施例の場合と同
様である。
(Third Embodiment) FIG. 9 shows a third embodiment of the manufacturing method of the present invention. In the third embodiment, incident light is refracted in only one direction on the pattern film 12 on the surface of the electroformed mold 10 on which the photoresist 11 and the pattern film 12 are placed, and the photolithography is performed through the pattern film 12. A polarization filter 25 that emits light in a certain oblique direction with respect to the resist 11 is arranged in parallel, and the exposure is performed while rotating the polarization filter 25 around an axis Q perpendicular to the surface of the electroformed mold 10. This is the same as in the first embodiment.

【0035】この方法においても、透孔2の断面形状が
電鋳母型面側1aの孔径を電鋳面側1bの孔径よりも大
きくするテーパー状に形成し、また透孔2の内周面を平
滑面にするメタルマスク1の電鋳製品を得ることができ
る。
Also in this method, the cross-sectional shape of the through hole 2 is formed in a tapered shape so that the hole diameter of the electroformed mold surface 1a is larger than the hole diameter of the electroformed surface 1b. An electroformed product of the metal mask 1 having a smooth surface can be obtained.

【0036】(第4実施例)図10及び図11は本発明
の製造方法の第4実施例を示す。この第4実施例では、
まず、図10(A)に示すように、ガラス板やプラスチ
ック板などの平板からなるベース26の表面上に、捨て
フォトレジスト27をラミネートする。この捨てフォト
レジスト27は、両面に塩化ビニル樹脂などの保護シー
ト29が剥離自在に付いているドライフィルムレジスト
(20〜50μm厚)を用いるが、ラミネートに際し、
その上面側に保護シート29を付けたままラミネートす
る。次いで、保護シート29の上に、同じくドライフィ
ルムによるフォトレジスト11を所定厚になるよう数層
重ねてラミネートする。しかるのち、図10(B)に示
すように、フォトレジスト11の上にパターンフィルム
12を重ね、ベース26に対し垂直に直進する光でパタ
ーンフィルム12を介してフォトレジスト11を露光す
る。次いで、パターンフィルム12を剥がし、図10
(C)のようにフォトレジスト11の上方から電鋳母型
10を熱を加えながら押圧し、フォトレジスト11を電
鋳母型10側に転写する。その際、フォトレジスト11
は、ベース26側に捨てフォトレジスト27と共に残さ
れる保護シート29から容易に剥がされるため、電鋳母
型10側に変形したりすることなく、完全な形でそのま
ま転写し易い。
(Fourth Embodiment) FIGS. 10 and 11 show a fourth embodiment of the manufacturing method of the present invention. In the fourth embodiment,
First, as shown in FIG. 10A, a waste photoresist 27 is laminated on the surface of a base 26 made of a flat plate such as a glass plate or a plastic plate. For the discarded photoresist 27, a dry film resist (20 to 50 μm thick) having a protective sheet 29 made of vinyl chloride resin or the like on both sides is used in a releasable manner.
Lamination is performed with the protective sheet 29 attached to the upper surface side. Next, on the protective sheet 29, several layers of the photoresist 11 also made of a dry film are laminated so as to have a predetermined thickness. Thereafter, as shown in FIG. 10B, the pattern film 12 is overlaid on the photoresist 11 and the photoresist 11 is exposed through the pattern film 12 with light that travels straight perpendicular to the base 26. Next, the pattern film 12 was peeled off, and FIG.
As shown in (C), the electroforming mold 10 is pressed from above the photoresist 11 while applying heat to transfer the photoresist 11 to the electroforming master 10 side. At that time, the photoresist 11
Is easily peeled off from the protective sheet 29 which is discarded on the base 26 side and is left together with the photoresist 27, so that it is easy to transfer in perfect form as it is without being deformed to the electroforming mold 10 side.

【0037】次いで、現像、乾燥処理することにより、
図10(D)に示すごとくパターンレジスト膜13を電
鋳母型10の上に形成する。次いで、電鋳を行って、図
11(E)に示すように電鋳母型10のパターンレジス
ト膜13で覆われていない表面に電着金属24を形成す
る。
Next, by developing and drying,
As shown in FIG. 10D, a pattern resist film 13 is formed on the electroformed master 10. Next, electroforming is performed to form an electrodeposited metal 24 on the surface of the electroformed mold 10 that is not covered with the pattern resist film 13 as shown in FIG.

【0038】次いで、電着金属24を電鋳母型10から
剥離することにより、図4(F)に示すメタルマスク1
と同様な透孔2の断面形状が電鋳母型面側1aの孔径を
電鋳面側1bの孔径よりも大きくするテーパー状に形成
するメタルマスク1の電鋳製品を得る。
Next, the electrodeposited metal 24 is peeled off from the electroformed mold 10 to form the metal mask 1 shown in FIG.
An electroformed product of the metal mask 1 in which the cross-sectional shape of the through hole 2 is tapered so that the hole diameter on the electroformed mold surface 1a is larger than the hole diameter on the electroformed surface 1b.

【0039】上記すべての実施例において、電鋳後に引
続いて、例えば図11(F)〜(H)に示すようなハー
フエッチング作業を行うことにより、図11(H)に示
すごとくメタルマスク1のパターン部の或る一部を、他
の箇所よりも薄肉にする形の凹部31を有するメタルマ
スク1をも容易に得ることができる。すなわち、例え
ば、プリント基板等に半田付けする部品として超小型部
品から大型部品の混合されたものを高密度に実装する必
要があったり、また実装部品の電極及びパターンの極小
化に伴い、前記部品の形状に合わせてクリーム半田の印
刷量を調整する必要がある。こうした場合、同一メタル
マスク1のパターン部の或る一部を、他の箇所よりも薄
肉にする形の凹部31を形成することが要求される。か
かる要求に応えるべく、このメタルマスク1の電鋳後
に、図11(F)に示すごとくメタルマスク1の表面に
エッチングパターンフィルム30を重ね、図11(G)
に示すごとくエッチングすることで、図11(H)に示
すごときメタルマスク1のパターン部の或る一部を、他
の箇所よりも薄肉にする形の凹部31を有するメタルマ
スク1を得ることができる。
In all of the above embodiments, after the electroforming, a half-etching operation as shown in, for example, FIGS. 11F to 11H is performed to thereby form the metal mask 1 as shown in FIG. It is also possible to easily obtain the metal mask 1 having the concave portion 31 in which a part of the pattern portion is made thinner than other portions. That is, for example, as a component to be soldered to a printed circuit board or the like, it is necessary to mount a mixture of ultra-small components to large components at a high density, and with miniaturization of electrodes and patterns of the mounted components, It is necessary to adjust the print amount of cream solder according to the shape of the solder paste. In such a case, it is required to form a concave portion 31 that makes a part of the pattern part of the same metal mask 1 thinner than other parts. In order to meet such a demand, after the metal mask 1 is electroformed, an etching pattern film 30 is superimposed on the surface of the metal mask 1 as shown in FIG.
11 (H), a metal mask 1 having a concave portion 31 in which a part of a pattern portion of the metal mask 1 is made thinner than other portions as shown in FIG. it can.

【0040】これと同じ断面形状のメタルマスクを製造
する方法が特開平6−210817号公報に提案されて
いるが、この方法ではメタルマスクを一旦電鋳母型から
剥がし、上下反転させてその電鋳母型面側にエッチング
する方法であるため、工程数が増大し、またメタルマス
クを電鋳母型から剥がすときに変形を加えるおそれがあ
るが、本実施例によればメタルマスク1を電鋳母型10
の上に付けたままエッチングすることができるので、工
程数の減少、メタルマスク1を剥がすときの変形などが
なくて有利である。
A method of manufacturing a metal mask having the same cross-sectional shape is proposed in Japanese Patent Laid-Open No. Hei 6-210817. In this method, the metal mask is once peeled off from the electroforming mold, and then inverted upside down. Since the method is an etching method on the casting mold surface side, the number of steps is increased, and there is a possibility that the metal mask is deformed when the metal mask is peeled off from the electroforming mold. Casting mold 10
Since the etching can be performed with the metal mask 1 attached, there is no reduction in the number of steps and no deformation when the metal mask 1 is peeled off, which is advantageous.

【0041】[0041]

【発明の効果】本発明の請求項1記載の発明によれば、
メタルマスク1の断面テーパー形状の透孔2の電鋳母型
面側1aの孔径を、電鋳面側1bの孔径よりも大きく形
成してあるので、平滑で密着性に優れる電鋳母型面側1
aを被印刷体3に高い密着度で密着させて印刷すること
ができ、またインキ・ペーストの版抜け性が良好である
ばかりか、マスク厚の差があるような場合もかすれやに
じみ等がなく、精度の高いスクリーン印刷を可能にす
る。
According to the first aspect of the present invention,
Since the hole diameter of the through-hole 2 having a tapered cross section of the metal mask 1 on the electroforming mold side 1a is formed larger than the hole diameter on the electroforming side 1b, the electroforming master surface is smooth and excellent in adhesion. Side 1
a can be printed with a high degree of contact with the substrate 3 to be printed, and not only is the ink-paste excellent in plate removal, but also in cases where there is a difference in mask thickness, blurring or bleeding can occur. And enables high-precision screen printing.

【0042】請求項2ないし5記載の発明によれば、電
鋳母型面側1aの孔径を、電鋳面側1bの孔径よりも大
きくする断面テーパー形状の透孔2をもつメタルマスク
を容易に得ることができる。また、透孔2のテーパー角
度を任意に調節することができ、従って、例えば、蒸着
用メタルマスク等では透孔2の蒸着面側の孔径が極端に
大きくなるようにテーパー角度を大きくすることが要求
されるが、かかる要求に充分に対応できるものとなる。
さらに、透孔2の内面全周を平滑面に形成することがで
き、印刷時に透孔2の内面にインキ・ペーストが付着残
留することなく、この点でも吐出が良好になり、印刷性
を向上でき、また印刷後の洗浄効果も高められる。
According to the second to fifth aspects of the present invention, a metal mask having a through-hole 2 having a tapered cross section, in which the hole diameter on the electroformed mold surface 1a is larger than the hole diameter on the electroformed surface 1b, can be easily obtained. Can be obtained. In addition, the taper angle of the through hole 2 can be arbitrarily adjusted. Therefore, for example, in a metal mask for vapor deposition or the like, the taper angle may be increased so that the diameter of the through hole 2 on the deposition surface side becomes extremely large. Although it is required, it can sufficiently respond to such a request.
Further, the entire circumference of the inner surface of the through hole 2 can be formed as a smooth surface, and the ink paste does not remain on the inner surface of the through hole 2 during printing. The cleaning effect after printing can be enhanced.

【0043】請求項6記載の発明においても、電鋳母型
面側1aの孔径を、電鋳面側1bの孔径よりも大きくす
る断面テーパー形状の透孔2をもつメタルマスクを容易
に得ることができる。
According to the present invention, it is possible to easily obtain a metal mask having a through-hole 2 having a tapered cross section in which the hole diameter of the electroformed mold surface 1a is larger than the hole diameter of the electroformed surface 1b. Can be.

【図面の簡単な説明】[Brief description of the drawings]

【図1】メタルマスクの一部拡大断面図である。FIG. 1 is a partially enlarged cross-sectional view of a metal mask.

【図2】メタルマスクの使用例を示す断面図である。FIG. 2 is a cross-sectional view showing an example of using a metal mask.

【図3】他の実施例のメタルマスクの使用例を示す断面
図である。
FIG. 3 is a sectional view showing an example of use of a metal mask according to another embodiment.

【図4】第1実施例のメタルマスクの製造過程の工程説
明図である。
FIG. 4 is a process explanatory view of the manufacturing process of the metal mask of the first embodiment.

【図5】第1実施例のメタルマスクの製造過程における
露光装置の概略図である。
FIG. 5 is a schematic view of an exposure apparatus in a manufacturing process of the metal mask of the first embodiment.

【図6】第1実施例のメタルマスクの製造過程における
他の露光装置の概略図である。
FIG. 6 is a schematic view of another exposure apparatus in the course of manufacturing the metal mask of the first embodiment.

【図7】第2実施例のメタルマスクの製造過程の工程説
明図である。
FIG. 7 is an explanatory diagram of a process in a manufacturing process of the metal mask of the second embodiment.

【図8】第2実施例のメタルマスクの製造過程における
露光装置の概略図である。
FIG. 8 is a schematic view of an exposure apparatus in a process of manufacturing a metal mask according to a second embodiment.

【図9】第3実施例のメタルマスクの製造過程の工程説
明図である。
FIG. 9 is a process explanatory view of the manufacturing process of the metal mask of the third embodiment.

【図10】第4実施例のメタルマスクの製造過程のパタ
ーンレジスト膜形成工程までの工程説明図である。
FIG. 10 is an explanatory diagram of a process up to a step of forming a pattern resist film in a manufacturing process of the metal mask according to the fourth embodiment.

【図11】第4実施例のメタルマスクの製造過程の電鋳
工程からエッチング工程までの工程説明図である。
FIG. 11 is an explanatory diagram illustrating steps from an electroforming step to an etching step in the manufacturing process of the metal mask of the fourth embodiment.

【図12】メタルマスクを蒸着用マスクに使用して蒸着
している状態を示す断面図である。
FIG. 12 is a cross-sectional view showing a state where vapor deposition is performed using a metal mask as a vapor deposition mask.

【図13】従来例のメタルマスクの製造過程の工程説明
図である。
FIG. 13 is an explanatory diagram of a process in a manufacturing process of a conventional metal mask.

【図14】従来例のメタルマスクの使用例を示す断面図
である。
FIG. 14 is a cross-sectional view showing a usage example of a conventional metal mask.

【図15】(a)は他の従来例のメタルマスクの一部拡
大断面図、(b)はそのメタルマスクの使用例を示す断
面図である。
FIG. 15A is a partially enlarged cross-sectional view of another conventional metal mask, and FIG. 15B is a cross-sectional view showing an example of using the metal mask.

【符号の説明】[Explanation of symbols]

1 メタルマスク 2 透孔 3 被印刷体 10 電鋳母型 11 フォトレジスト 12 パターンフィルム 13 パターンレジスト膜 14 回転台 24 電着金属 25 偏光フィルター 26 ベース DESCRIPTION OF SYMBOLS 1 Metal mask 2 Through-hole 3 Printed body 10 Electroforming mold 11 Photoresist 12 Pattern film 13 Pattern resist film 14 Turntable 24 Electrodeposited metal 25 Polarizing filter 26 Base

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H05K 3/34 505 H05K 3/34 505D ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H05K 3/34 505 H05K 3/34 505D

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 電鋳法により製作され、所望パターンの
インキ・ぺースト通し用の透孔2を有するメタルマスク
において、 透孔2の断面形状が、電鋳母型面側1aの孔径が大き
く、電鋳面側1bの孔径が小さくなるようテーパー状に
形成されていることを特徴とするメタルマスク。
1. A metal mask manufactured by an electroforming method and having a through hole 2 for passing an ink paste of a desired pattern, wherein the cross sectional shape of the through hole 2 is such that the hole diameter of the electroforming mold surface side 1a is large. A metal mask formed in a tapered shape such that a hole diameter on an electroformed surface side 1b is reduced.
【請求項2】 電鋳母型10の表面にラミネート又は塗
布したフォトレジスト11の上に、パターンフィルム1
2を密着させて露光、現像処理して、パターンレジスト
膜13をパターンニング形成する工程と、 電鋳母型10のパターンレジスト膜13で覆われていな
い表面に電着金属24を電着形成する工程と、 電鋳母型10から電着金属24を剥離する工程を経てメ
タルマスクを得るメタルマスクの製造方法において、 前記露光に際し、電鋳母型10をこの母型表面と垂直な
軸心Qまわりに回転させながら、電鋳母型10の表面上
のパターンフィルム12を介してフォトレジスト11に
対し光線を斜め方向に照射させて露光することを特徴と
するメタルマスクの製造方法。
2. A pattern film 1 is formed on a photoresist 11 laminated or coated on the surface of an electroformed mold 10.
(2) a step of patterning the pattern resist film 13 by exposing and developing the substrate 2 in close contact, and an electrodeposition metal 24 formed on the surface of the electroformed mold 10 not covered by the pattern resist film 13. And a step of removing the electrodeposited metal 24 from the electroformed mold 10 to obtain a metal mask through the step of: exposing the electroformed mold 10 to an axis Q perpendicular to the surface of the mold during the exposure. A method of manufacturing a metal mask, comprising exposing a photoresist 11 to light by irradiating light obliquely through a pattern film 12 on the surface of an electroforming mold 10 while rotating the metal mask 10 around.
【請求項3】 前記露光に際し、電鋳母型10を水平面
に対し或る角度だけ傾斜する姿勢下に置いて電鋳母型1
0の表面と垂直な軸心Qまわりに回転させながら、水平
面に向かって直進する光線を電鋳母型10の表面上のパ
ターンフィルム12を介してフォトレジスト11に照射
させて露光することを特徴とする請求項2記載のメタル
マスクの製造方法。
3. The electroforming master 1 is placed at a position inclined at a certain angle with respect to a horizontal plane during the exposure.
The photoresist 11 is exposed by irradiating a photoresist 11 via a pattern film 12 on the surface of the electroforming mold 10 with a light beam traveling straight toward a horizontal plane while rotating about an axis Q perpendicular to the surface of the mold 0. The method for manufacturing a metal mask according to claim 2, wherein
【請求項4】 前記露光に際し、電鋳母型10を水平姿
勢下に置いて該母型表面と垂直な軸心Qまわりに回転さ
せながら、電鋳母型10の表面上のパターンフィルム1
2を介してフォトレジスト11に対し光線を斜め方向か
ら照射させて露光することを特徴とする請求項2記載の
メタルマスクの製造方法。
4. The pattern film 1 on the surface of the electroformed master 10 while placing the electroformed master 10 in a horizontal position and rotating it around an axis Q perpendicular to the surface of the master during the exposure.
3. The method according to claim 2, wherein the photoresist 11 is exposed by irradiating the photoresist 11 with a light beam obliquely through the second mask.
【請求項5】 電鋳母型10の表面にラミネート又は塗
布したフォトレジスト11の上に、パターンフィルム1
2を密着させて露光、現像処理して、パターンレジスト
膜13を形成する工程と、 電鋳母型10のパターンレジスト膜13で覆われていな
い表面に電着金属24を電着形成する工程と、 電鋳母型10から電着金属24を剥離する工程を経てメ
タルマスクを得るメタルマスクの製造方法において、 前記露光に際し、電鋳母型10の表面上のパターンフィ
ルム12の上に、入射光を一方向にのみ屈折させてパタ
ーンフィルム12を通してフォトレジスト11に対し一
定の斜め方向に出射する偏光フィルター25を平行に配
置させて、該偏光フィルター25を電鋳母型10の表面
と垂直な軸心Qまわりに回転させながら露光することを
特徴とするメタルマスクの製造方法。
5. A pattern film 1 is formed on a photoresist 11 laminated or coated on the surface of an electroformed mold 10.
Forming a pattern resist film 13 by exposing and developing the substrate 2 in close contact with each other; and forming an electrodeposited metal 24 on a surface of the electroformed mold 10 not covered with the pattern resist film 13. A method for manufacturing a metal mask, which obtains a metal mask through a step of peeling the electrodeposited metal 24 from the electroformed mold 10, wherein the light is incident on the pattern film 12 on the surface of the electroformed mold 10 during the exposure. Is polarized only in one direction, and a polarizing filter 25 that emits light in a certain oblique direction with respect to the photoresist 11 through the pattern film 12 is disposed in parallel with the polarizing filter 25 so that the polarizing filter 25 has an axis perpendicular to the surface of the electroformed mold 10. A method for manufacturing a metal mask, comprising exposing while rotating around a center Q.
【請求項6】 平板からなるベース26の表面上にフォ
トレジスト11を剥離可能にラミネート又は塗布する工
程と、 フォトレジスト11の上にパターンフィルム12を重
ね、ベース26に対し垂直に直進する光でフォトレジス
ト11を露光する工程と、 パターンフィルム12を剥がして、フォトレジスト11
を電鋳母型10側に転写する工程と、 現像、乾燥処理してパターンレジスト膜13を電鋳母型
10の上に形成する工程と、 電鋳母型10のパターンレジスト膜13で覆われていな
い表面に電着金属24を形成する工程と、 電着金属24を電鋳母型10から剥離する工程とからな
るメタルマスクの製造方法。
6. A step of laminating or coating the photoresist 11 on the surface of the base 26 made of a flat plate so as to be peelable, and a step of superimposing the pattern film 12 on the photoresist 11 and using light that travels straight and perpendicular to the base 26. A step of exposing the photoresist 11; removing the pattern film 12;
Transferring the resist to the electroforming mold 10 side, developing and drying to form a pattern resist film 13 on the electroforming master 10, and covering with the pattern resist film 13 of the electroforming master 10. A method for manufacturing a metal mask, comprising: a step of forming an electrodeposited metal 24 on a surface that is not present; and a step of peeling the electrodeposited metal 24 from the electroformed master 10.
JP13587997A 1997-05-08 1997-05-08 Metal mask manufacturing method Expired - Fee Related JP3786313B2 (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13587997A JP3786313B2 (en) 1997-05-08 1997-05-08 Metal mask manufacturing method

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Publication Number Publication Date
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JP3786313B2 JP3786313B2 (en) 2006-06-14

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ID=15161916

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