WO2014076762A1

WO2014076762A1 - Suspended metal mask for printing and method for producing same

Info

Publication number: WO2014076762A1
Application number: PCT/JP2012/079384
Authority: WO
Inventors: 秀樹仁科
Original assignee: 株式会社ボンマーク
Priority date: 2012-11-13
Filing date: 2012-11-13
Publication date: 2014-05-22
Also published as: JPWO2014076762A1; KR101723320B1; KR20150076240A; CN104822534B; JP5919391B2; CN104822534A

Abstract

This suspended metal mask for printing is provided with: a plate frame (3); a mesh that is provided in a stretched manner by means of the outer perimeter thereof being adhered/affixed to the inside of the plate frame and that has an electrically conductive metal mesh (1) at least at the center portion thereof; and a base metal (5) that is integrally joined by means of being contacted/stacked and then joined/plated onto the metal mesh (1), and to which an opening pattern (5b) for printing is provided. Of the base metal (5), the area of the metal portion of the base metal (5) is reduced by means of the metal portion at the periphery of the portion at which the opening pattern (5b) for printing is formed remaining and the metal portions at other portions unrelated to printing being eliminated as much as possible. A plurality of metal-area-reducing holes (5d) are formed at the metal portions at the portions unrelated to printing, and an emulsion (14) fills the metal-area-reducing holes to occlude the holes.

Description

Suspended metal mask for printing and manufacturing method thereof

The present invention relates to a suspend metal mask for printing and a method for manufacturing the same.

Typical structures of known patterning masks are shown in FIGS. The structure of this patterning mask is the same as that described in FIGS. 1 to 3 of Japanese Patent No. 3560042. The patterning mask 26 includes a mesh layer 21 made of a metal wire. The mesh layer 21 has a two-dimensional regular pattern of openings 28 separated by solid elements. A patterned print layer 22 is disposed partially surrounding the mesh layer 21. The print layer 22 is formed of two parts, a stencil layer 23 and a seal layer 24, and both

parts

23 and 24 are patterned to have the same pattern. The stencil layer 23 is made of a standard photoresist material used in lithography, and the stencil layer 23 is patterned by a standard lithography process. The seal layer 24 of the print layer 22 has exactly the same pattern as the stencil layer 23, except that it is substantially elastic. The seal layer 24 is bonded to the stencil layer 23, and forms the print layer 22 together with this layer. The print layer 22 is mechanically fixed to the mesh layer 21. The material of the stencil layer 23 may be formed by electroplating nickel, for example. The mesh layer 21 can be made of a material such as metal or polymer. A material such as a polymer, a resist, or a metal can be used for the stencil layer 23. The patterning mask 26 comprising the two-part printing layer 22 and the mesh layer 21 can be used as a patterning tool for the printing process shown in FIG. For this purpose, the patterning mask 26 is lowered onto a substantially flat surface of the substrate 25. Thereafter, when the ink 27 is injected into the printing layer 22, the ink 27 flows into the orifice of the printing layer 22 through the opening of the mesh layer 21. When the patterned print layer 22 is in contact with the substrate 25, the interface between the substrate 25 and the print layer 22 can be filled with the orifice 29 of the patterned print layer 22, and the seal against the ink 27 reaching the substrate 25. I will provide a. The ink 27 is confined in the area of each orifice 29.

FIG. 17 shows another embodiment of the patterning mask 26. Here, the print layer 22 does not partially surround the mesh layer 21 but is only attached to the lower side of the mesh layer 21, which is different from the embodiment of FIGS. 15 to 16. It can be made thinner than the stencil layer and the mesh layer. Furthermore, here the orifice 29 is smaller than the opening 28 of the mesh layer 21.

FIG. 18 shows the structure of a known suspending metal mask for printing. The structure of the suspending metal mask for printing is the same as that shown in FIG. 3 of Japanese Patent Application Laid-Open No. 11-157042. In the suspend metal mask for printing, the metal mask 32 is bonded and fixed to the center of the printing surface of the screen mesh 31 whose outer periphery is bonded and fixed to a plate frame (not shown), and the resin 33 is applied and solidified on the squeegee surface side of the screen mesh 31. Then, through holes 33 a are formed on the photosensitive emulsion 33 by printing or the like in accordance with the image through holes 32 a of the metal mask 32. The through hole 33a may be formed by any means, and is formed slightly wider than the image through hole portion 32a of the metal mask 32.

Japanese Patent No. 3560042 Japanese Unexamined Patent Publication No. 11-157042

Conventionally, a so-called emulsion plate, in which a photosensitive emulsion for forming a printing pattern is applied to a mesh layer made of metal wire, is flexible and comes in line contact with the substrate during squeezing. Air retention due to squeezing is small and the plate separation is good, but the metal wire of the mesh layer is thin, so the durability is poor. On the other hand, since the metal mask plate has many metal parts, the entire mask is hard, and the surface comes into contact with the substrate during squeezing, so that there is more air accumulation due to squeezing than the emulsion plate, and the plate separation is poor.

In the case of a suspend metal mask for printing, in which a combination mesh is stretched on a square plate frame, and a base metal made of nickel or the like is joined to the stainless steel mesh provided at the center of the combination mesh by joint plating, the metal portion of the base metal Therefore, when the touch panel pattern or the like is printed, printing rubbing occurs due to a delay in the separation of the plate. In particular, printing rubbing due to a delay in plate separation occurs remarkably in a large area of the pattern. Further, since the pattern includes a thin line portion and a large area portion, there is a problem that variation in plate thickness is likely to occur during plating.

The present invention has been made in order to solve the above-described problems. A suspending metal mask for printing which has improved plate separation by reducing the area of the metal portion of the base metal and making it flexible, and its A manufacturing method is provided.

In the suspending metal mask for printing according to the present invention, the plate frame, the combination mesh that is stretched by bonding and fixing the outer periphery to the inside of the plate frame, and the metal mesh is provided in the center, and the metal mesh is in close contact In the base metal provided with a base metal provided with an opening pattern for printing that is integrally bonded by joint plating and provided with an opening pattern for printing, the metal portion around the portion where the opening pattern for printing is formed, The area of the metal portion of the base metal is reduced by removing as much as possible the metal portion that is not related to printing other than that.

Also, the ratio of the metal part to be removed is 10 to 90% in the metal part that is not related to printing.

Also, the area of the metal part of the base metal is reduced so that it is in line contact with the printed circuit board.

In addition, the base metal leaves the metal part around the part where the opening pattern for printing is formed, and forms a large number of dummy holes for reducing the metal area in the metal part that is not related to printing, The metal area reduction dummy holes are filled with emulsion to close the holes so as not to be printed.

The dummy hole for reducing the metal area is a circular hole.

In addition, the base metal leaves the metal part around the part where the opening pattern for printing is formed, removes all other metal parts not related to printing, and does not have the metal part of the base metal. In the metal mesh, the mesh opening is filled with an emulsion to close the opening so as not to be printed.

According to the present invention, the metal portion around the portion where the opening pattern for printing of the base metal is formed is left, and the metal portion other than the portion not related to printing is removed as much as possible. Since the area of the metal portion is reduced, the flexibility of the base metal is improved, the air release property is improved, and the separation of the plate can be improved.

It is a perspective view which isolate | separates and shows each component required for the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the joining plating process of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state which the junction plating of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention was complete | finished. It is sectional drawing which shows the state which canceled the set from the joining state of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state which has peeled the SUS base material from the base metal of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the state before peeling the opening resist of the base metal of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is sectional drawing which shows the suspend metal mask for printing completed by peeling the opening resist of the base metal of the manufacturing method of the suspend metal mask for printing in Embodiment 1 of this invention. It is a top view which shows the structure of the base metal of the suspend metal mask for printing in Embodiment 1 of this invention. It is an enlarged plan view which shows the principal part structure of the base metal of the suspend metal mask for printing in Embodiment 1 of this invention. It is a top view which shows the structure of the base metal of the conventional suspend metal mask for printing. In the first embodiment of the present invention, the plate separation state is compared between the case where the base metal of the suspending metal mask for printing (point contact) is used and the case where the base metal of the suspending metal mask for conventional printing is used (surface contact). It is explanatory drawing shown. It is a top view which shows the structure of the base metal of the suspend metal mask for printing in Embodiment 2 of this invention. It is a microscope picture which shows the state which roughened the SUS base material surface for base metals of the suspend metal mask for printing in Embodiment 3 of this invention by bead blasting etc. FIG. It is a microscope picture which further expands and shows the state which roughened the SUS base material surface for base metals of the suspend metal mask for printing in Embodiment 3 of this invention by bead blasting etc. FIG. It is the cross-sectional view and top view which show the conventional patterning mask. It is a cross-sectional view showing a patterning mask on a substrate in a conventional printing step. It is sectional drawing which shows the other example of the conventional patterning mask. It is sectional drawing which shows the conventional suspend metal mask for printing.

In order to explain the present invention in more detail, this will be described with reference to the attached drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified or abbreviate | omitted suitably.

Embodiment 1.
FIG. 1 is a perspective view showing components necessary for a method for manufacturing a suspending metal mask for printing according to the present invention, and FIGS. 2 to 7 show manufacturing steps of the method for manufacturing a suspending metal mask for printing according to the present invention. It is sectional drawing. FIG. 8 is a plan view showing the structure of the base metal of the suspending metal mask for printing according to the present invention, FIG. 9 is an enlarged plan view showing the structure of the main part of the base metal of the suspending metal mask for printing according to the present invention, and FIG. FIG. 11 is a plan view showing the structure of the base metal of the suspending metal mask for printing. FIG. 11 shows the case where the base metal of the suspending metal mask for printing of the present invention is used (point contact) and the base metal of the conventional suspending metal mask for printing. It is explanatory drawing which compares and shows the plate separation state when there exists (surface contact).

As shown in FIG. 1, the constituent elements necessary for the method for producing a suspending metal mask for printing according to the present invention include a metal mesh 1 made of stainless steel or nickel mesh having conductivity and provided at the center, and this metal Formed on a square metal plate frame 3 in which a combination mesh composed of a Tetron mesh 2 provided on the outside of the mesh 1 is stretched on the inside and a SUS base material 4 for a base metal, forming an opening pattern for printing A base metal 5 having a printing opening pattern forming resist 5a applied to a portion to be formed, a quadrilateral joining auxiliary metal plate frame 7 in which a tetron mesh 6 is stretched, and a tetron of the joining auxiliary metal plate frame 7 It is comprised from the sponge 8 interposed between the mesh 6 and the SUS base material 4 for base metals. The mesh stretched on the rectangular metal plate frame 3 is preferably a combination mesh composed of a metal mesh 1 at the center and an outer tetron mesh 2 but is not a combination mesh and has electrical conductivity. A single piece of metal mesh 1 may be used. In addition to the printing opening pattern forming resist 5a, a large number of metal area reducing dummy hole forming resists (see FIG. 5) are formed in the base metal 5 in order to form many dummy holes for reducing the area of the metal portion. (Not shown). By forming a large number of metal area reducing dummy holes (not shown) in the base metal 5, the area of the metal portion is reduced and the flexibility of the base metal 5 can be improved. The base metal 5 has a squeegee surface on the plating growth side and a surface in contact with the printing surface on the SUS base material 4 side for the base metal. For example, when printing on a film-like printed circuit board, if the surface that contacts the printing surface of the base metal 5 is smooth without roughness (close to a mirror surface), there is a risk that the air will not be able to pass and will adhere. is there. Therefore, when the surface of the base metal SUS base material 4 is mirror-finished, the surface that comes into contact with the printed surface of the base metal 5 is later roughened by polishing with a nonwoven fabric containing sandpaper or an abrasive. It is possible. On the other hand, when the surface of the SUS base material 4 for base metal is roughened by bead blasting, buffing or the like in advance, the surface that comes into contact with the printing surface of the base metal 5 is later polished with a nonwoven fabric containing sandpaper or abrasive. By doing so, it is not necessary to roughen.

In the bonding plating step of the method for producing a suspending metal mask for printing, as shown in FIG. 2, a rectangular metal plate frame 3 is arranged on the right side, and a rectangular bonding auxiliary metal plate frame 7 is arranged on the left side. . Then, the base metal 5 is disposed so as to be overlapped with the metal mesh 1 of the metal plate frame 3, the metal plate frame 3 and the joining auxiliary metal plate frame 7 are overlapped with each other, and fastened and fixed with an adhesive tape 9 or the like, The base metal 5 and the metal mesh 1 are set so as to be in close contact with each other via the base metal SUS base material 4 and the sponge 8. The base metal 5 is connected to the cathode 10 while being electrically connected and accommodated in a plating tank 11 containing a nickel sulfamate bath, and nickel 12 is connected to the anode 13. And metal mesh 1 are bonded and bonded together. This bonding plating amount is usually 2 μm on one side, and the same plating method as electroforming plating is used. Further, by using a low current of about 0.5 A / dm ² for the positive / cathode current density, it is possible to improve the uniformity of the bonding plating amount and to prevent the metal mesh 1 from being disconnected.

Next, when the bonding plating step is completed, the one set in the above-mentioned close contact state is taken out from the plating tank 11 (see FIG. 3), and the adhesive tape 9 is removed and the one set in the close contact state is released (see FIG. 4). Next, the base metal SUS base material 4 is peeled from the base metal 5 (see FIGS. 5 and 6). The base metal 5 has a squeegee surface on the plating growth side and a surface in contact with the printing surface on the base metal SUS base material 4 side. For example, when printing on a film-like printed circuit board, if the surface that contacts the printing surface of the base metal 5 is smooth without roughness (close to a mirror surface), there is a risk that the air will not be able to pass and will adhere. is there. Therefore, when the surface of the base metal SUS base material 4 is mirror-finished, the surface that comes into contact with the printed surface of the base metal 5 is later roughened by polishing with a nonwoven fabric containing sandpaper or an abrasive. It is possible. In addition, the surface of the SUS base material 4 for base metal is previously roughened by bead blasting, buffing or the like, and the surface that comes into contact with the printing surface of the base metal 5 is later polished with a nonwoven fabric containing sandpaper or an abrasive. This may be omitted. Thereafter, a resist 5a for forming a printing opening pattern and a resist for forming a metal area reduction dummy hole (see FIG. 5) from the base metal 5 of the metal plate frame 3 in which the joint between the base metal 5 and the metal mesh 1 is integrally joined by plating. By peeling off (not shown), a printing opening pattern 5b and a metal area reduction dummy hole (not shown) are formed. Thereby, the suspend metal mask for printing according to the first embodiment of the present invention is completed (see FIG. 7). 1 to 7, the printing opening pattern forming resist 5a and the printing opening pattern 5b of the base metal 5 are simplified and show only images. Also, many metal area reduction dummy hole forming resists and metal area reduction dummy holes are not shown.

FIG. 8 schematically shows the structure of the base metal 5 and is different from the actual one. FIG. 9 is an enlarged view of the structure of the base metal 5. 8 to 9, the base metal 5 is configured such that the metal portion around the portion where the printing opening pattern 5b is formed leaves about several millimeters. In addition, metal parts that are not necessary and are not related to other printing are removed as much as possible. That is, a large number of metal area reduction dummy circular holes 5d having a diameter of about 30 mm are provided in a metal part which is not necessary regardless of printing, and the interval between the adjacent dummy circular holes 5d is about 5 mm. Thus, the area of the metal portion of the base metal 5 is reduced. The dummy circular holes 5d are formed in one row in the vertical direction with an angle of about 30 ° with respect to the vertical line, and with an angle of about 60 to 67.5 ° with respect to the horizontal line. It is formed so as to form one row in an oblique direction. The dummy circular holes 5d are arranged so that the dummy circular holes 5d arranged adjacent to the left and right sides of the dummy circular holes 5d are not in the same horizontal position but are staggered in the vertical direction. ing. The dummy circular holes 5d may be formed in a straight line in the vertical and horizontal directions without making an angle with respect to the vertical and horizontal lines. The ratio of the metal portion to be removed by forming the dummy circular hole 5d is theoretically 1 to 99%, but is actually preferably about 10 to 90%, 20 to 80%, 30 to 70%, It may be 40 to 60% or around 50%. As a result, the flexibility of the base metal 5 is improved by reducing the metal portion, and the flexibility and air escape of the base metal 5 itself can be improved to improve the separation of the plate. The formed circular circular hole 5d for reducing the metal area is initially open as shown in the left half of FIG. 8, but after forming, it is used for reducing the metal area as shown in the right half of FIG. The dummy circular hole 5d is filled with the photosensitive emulsion 14 to close the opening, thereby preventing printing. Further, the photosensitive emulsion 14 filled in the metal area reduction dummy circular hole 5d has a concave shape without flattening the surface due to capillary action. Therefore, since the surface of the base metal 5 and the surface of the photosensitive emulsion 14 are not flush with each other, there is a step, and it is possible to prevent the base metal 5 from coming into close contact with the printing substrate 15 and becoming difficult to separate. Further, since the metal area reduction dummy circular hole 5d is a circular hole, the current density at the time of plating and the elongation in the vertical and horizontal directions are the same. However, it may be a slit hole or a lattice hole. Further, the metal area reducing dummy circular hole 5d has an angle of 22.5 ° so that the contact of the squeegee is shifted in the traveling direction.

FIG. 10 schematically shows the structure of the base metal of the conventional suspend metal mask for printing, which is different from the actual one. In FIG. 10, the base metal 5 has only a part of the part where the printing opening pattern 5b is formed, and the metal part remains in all other parts. Therefore, the base metal 5 itself has a hard configuration due to the large number of metal portions, and the base metal 5 lacks flexibility.

FIG. 11 shows a comparison between plate separation states when the base metal of the suspending metal mask for printing of the present invention is used (point contact) and when the base metal of the suspending metal mask for printing is used (surface contact). It is explanatory drawing. In the conventional case, since much metal portion of the base metal 5 remains, the flexibility is also lacking. Therefore, as shown in FIG. 11a, the base metal 5 is curved and comes into surface contact with the printed board 15, Although the separation of the plate is deteriorated, according to the present invention, since the metal portion of the base metal 5 is reduced and the flexibility is improved, the base metal 5 bends at an angle rather than a curve as shown in FIG. As a result, the printing substrate 15 is brought into point contact, and the separation of the plate is improved. Thereby, for example, damage to a specially shaped substrate can be reduced.

Embodiment 2.
FIG. 12 is a plan view showing the structure of the base metal of the suspend metal mask for printing in the second embodiment of the present invention.

In the first embodiment, the base metal 5 has a metal portion around the portion where the printing opening pattern 5b is formed, leaving about several millimeters, and other metal portions that are not necessary regardless of printing, By forming a large number of dummy circular holes 5d for reducing the metal area with a diameter of about 30 mm so that the distance between the adjacent dummy circular holes 5d is about 5 mm, the area of the metal portion of the base metal 5 is reduced. In the second embodiment, as shown in FIG. 12, although the base metal 5 has a metal portion around the portion where the printing opening pattern 5b is formed, a few mm is left. All other metal parts are eliminated from the parts which are not necessary because they are not related to printing. That is, there is no metal portion of the base metal 5 other than a few mm around the portion where the printing opening pattern 5b is formed, and only the metal mesh 1 is present. Accordingly, the flexibility of the base metal 5 is improved as much as the metal portion of the base metal 5 is eliminated, and the flexibility and air escape of the base metal 5 itself can be improved and the separation of the plate can be improved. . In addition, although the metal mesh 1 located in the part other than the circumference of several mm around the part where the opening pattern 5b for printing is formed is shown in the left half of FIG. 12, the metal mesh 1 is initially opened. As shown in the right half of FIG. 12, the metal mesh 1 that is not related to printing is prevented from being printed by filling the opening of the metal mesh 1 with photosensitive emulsion 14 and closing the mesh opening. ing. The base metal of the suspending metal mask for printing according to the second embodiment is more flexible than the base metal of the suspending metal mask for printing according to the first embodiment, but the strength is weakened accordingly. .

Embodiment 3.
In Embodiment 3 described above, when the surface roughness of the base metal SUS base material 4 is small, the surface that comes into contact with the printed surface of the base metal 5 is less rough and close to a smooth mirror finish. For example, when printing on a film-like printed circuit board, there is a possibility that air will not be able to pass and will adhere. Therefore, when the surface roughness of the base metal SUS base material 4 is small, if the surface that comes into contact with the printed surface of the base metal 5 is later polished with a non-woven fabric containing an abrasive, Is less likely to occur and has excellent uniformity. In addition, it can also grind with a sandpaper instead of the nonwoven fabric containing the abrasive | polishing agent. Also, the surface of the base metal SUS base material 4 is roughened with bead blasting in advance, and the surface that comes into contact with the printed surface of the base metal 5 is later polished with a nonwoven fabric containing sandpaper or an abrasive. You may do it. The abrasive used for blasting can be a spherical object such as a steel ball in addition to beads. 13 is a photomicrograph showing the surface of the SUS base material for base metal of the suspend metal mask for printing in Embodiment 3 of the present invention roughened by bead blasting, etc. FIG. 14 is for printing in Embodiment 3 of the present invention. It is a microscope picture which further expands and shows the state which roughened the SUS base material surface for base metals of a suspend metal mask with bead blasting etc. The bead blasting is a thin film with a plating film of the base metal 5 of 2 to 25 μm, but is easily peeled off from the SUS base material 4.

As a comparative example, a metal mask polished with ceramic # 1000 was prepared. This metal mask has an arithmetic average roughness Ra: 0.072 μm, a maximum height Rmax: 1.516 μm, a ten-point average roughness Rz: 1.004 μm, and an average interval Sm: 92.3 μm. There has occurred. In contrast, Test Example 1 is a metal mask polished by belt # 1000, arithmetic average roughness Ra: 0.080 μm, maximum height Rmax: 2.112 μm, ten-point average roughness Rz: 0.852 μm, The average unevenness spacing Sm was 241.7 μm, and no rubbing occurred when printed. Test example 2 is a metal mask polished with sandpaper # 400, arithmetic average roughness Ra: 0.060 μm, maximum height Rmax: 1.756 μm, ten-point average roughness Rz: 0.812 μm, unevenness The average interval Sm was 286.8 μm, and no rubbing occurred when printed. Test Example 3 is a metal mask polished with sandpaper # 1000, arithmetic average roughness Ra: 0.096 μm, maximum height Rmax: 3.144 μm, ten-point average roughness Rz: 1.412 μm, unevenness The average interval Sm was 136.2 μm, and no rubbing occurred when printed. Test Example 4 is a case where the surface of the SUS base material 4 for base metal was previously roughened with bead blast 2.0, arithmetic average roughness Ra: 0.132 μm, maximum height Rmax: 2.904 μm, ten points. It was a metal mask having an average roughness Rz: 1.480 μm and an average unevenness interval Sm: 174.3 μm, and no rubbing occurred when printed. These Test Examples 1 to 4 are all free of rubbing and good printing results, but Test Example 1 has low reproducibility, and Test Examples 2 to 3 are freehand processing, so the stability is poor. However, in Test Example 4, the rubbing is improved, and at the same time, there is no disconnection of the fine line portion, and the printing result is good.

The present invention can be applied to a suspend metal mask for printing that reduces the area of the metal portion of the base metal to give flexibility and improve the separation of the plate.

DESCRIPTION OF SYMBOLS 1 Metal mesh 2 Tetron mesh 3 Metal plate frame 4 SUS base material for base metal 5 Base metal 5a Resist for printing opening pattern formation 5b Printing opening pattern 5d Dummy circular hole for metal area reduction 6 Tetron mesh 7 Metal plate for joining assistance Frame 8 Sponge 9 Adhesive tape 10 Cathode 11 Plating tank 12 Nickel 13 Anode 14 Photosensitive emulsion 15 Print substrate 21 Mesh layer 22 Print layer 23 Stencil layer 24 Seal layer 25 Substrate 26 Patterning mask 27 Ink 28 Opening 29 Orifice 31 Screen mesh 32 Metal Mask 32a Image through-hole 33 Resin (photosensitive emulsion)
33a Through hole

Claims

Plate frame,
A mesh having a metal mesh that is electrically conductive at least in the center, and is stretched by bonding and fixing the outer periphery to the inside of the plate frame;
In a suspend metal mask for screen printing comprising a base metal provided with an opening pattern for printing, which is integrally bonded to the metal mesh and integrally bonded by bonding plating,
The base metal leaves the metal part around the part where the printing opening pattern is formed, and removes the metal part other than the part not related to printing as much as possible. Suspended metal mask for screen printing, characterized by a reduced area.
2. The suspending metal mask for screen printing according to claim 1, wherein a ratio of the metal part to be removed is 10 to 90% of the metal part which is not related to printing.
2. The suspending metal mask for screen printing according to claim 1, wherein the area of the metal portion of the base metal is reduced to be in line contact with the printed circuit board.
In the base metal, a metal portion around the portion where the opening pattern for printing is formed is left, and a plurality of dummy holes for reducing the metal area are formed in the metal portion which is not related to the printing, and the metal area The suspended metal mask for screen printing according to any one of claims 1 to 3, wherein printing is prevented by filling the reduction dummy holes with an emulsion to close the holes.
5. The suspending metal mask for screen printing according to claim 4, wherein the dummy hole for reducing the metal area is a circular hole.
Plate frame,
A mesh having a metal mesh that is electrically conductive at least in the center, and is stretched by bonding and fixing the outer periphery to the inside of the plate frame;
In a suspend metal mask for screen printing comprising a base metal provided with an opening pattern for printing, which is integrally bonded to the metal mesh and integrally bonded by bonding plating,
The base metal leaves the metal part around the part where the opening pattern for printing is formed, and eliminates all other metal parts not related to printing,
A suspending metal mask for screen printing, wherein a metal mesh of a portion where the metal portion of the base metal does not exist is not printed by filling the mesh opening with an emulsion to close the opening.
A plate frame, a mesh having an outer periphery bonded and fixed to the inside of the plate frame, and a mesh having an electrically conductive metal mesh at least in the center, and an adhesive polymerized to the metal mesh and integrally bonded by bonding plating A suspending metal mask for screen printing comprising a base metal provided with an opening pattern for printing,
A step of integrally bonding the base metal and the metal mesh, wherein a resist for forming a printing opening pattern is applied to a predetermined portion and a plurality of metal area reduction dummy hole forming resists are applied to other portions;
By removing the resist for forming a printing opening pattern and the resists for forming a plurality of metal area reduction dummy holes from the base metal, a printing opening pattern is formed in a predetermined portion of the base metal, and that of the base metal. Forming a large number of metal area reduction dummy holes in a portion other than
The opening pattern for printing formed in a predetermined portion of the base metal is left open, and a large number of dummy holes for reducing the metal area formed in other portions of the base metal are filled with emulsion to close the opening. A process of preventing printing,
A method for producing a suspending metal mask for screen printing, comprising:
A plate frame, a mesh having an outer periphery bonded and fixed to the inside of the plate frame, and a mesh having an electrically conductive metal mesh at least in the center, and an adhesive polymerized to the metal mesh and integrally bonded by bonding plating And a base metal provided with an opening pattern for printing, the base metal leaving a metal portion around the portion where the opening pattern for printing is formed, and the other portion of the metal not related to printing A method for producing a suspending metal mask for screen printing in which all parts are eliminated,
A step of integrally joining the base metal and the metal mesh that have been subjected to a resist for forming a printing opening pattern on a predetermined portion;
Forming a printing opening pattern on a predetermined portion of the base metal by peeling the printing opening pattern forming resist from the base metal;
Printing is performed by leaving the opening pattern for printing formed in a predetermined portion of the base metal open, and filling the opening of the metal mesh where the metal portion of the base metal does not exist with an emulsion to close the opening. The process of preventing it,
A method for producing a suspending metal mask for screen printing, comprising: