JP2012077332A - Method of forming base part on metal substrate by etching - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of processing a metal substrate capable of flattening the bottom surface of a recessed part of a base, in a metallic member including a base having an opening and a frame body located on both sides of the base.SOLUTION: First, a first resist layer 21 including a pattern corresponding to an opening 11 is formed on one surface 20A of a metal substrate 20, and a second resist layer 22 including a pattern corresponding to a recessed part 14 defining the outline of the base 12 is formed on the other surface 20B of the metal substrate 20. Next, a first etching-resistant resin layer 23 is formed on the first resist layer 21, and the recessed part 14 is formed on the metal substrate 20 by performing etching from the other surface 20B side of the metal substrate 20. Next, a second etching-resistant resin layer 24 is formed on the second resist layer 22, and the opening 11 is formed by performing etching from the one surface 20A side of the metal substrate 20. The inner diameter A of the opening 11 satisfies B/10≤A≤B/4 with respect to the inner diameter B of the recessed part 14.

Description

  The present invention relates to a method of processing a metal substrate for producing a metal member having a pedestal having an opening and frame bodies positioned on both sides of the pedestal.

  In recent years, there is a metal member having a pedestal having an opening and frame bodies located on both sides of the pedestal. When producing such a member, it is conceivable to simultaneously etch the front and back surfaces of the metal substrate.

  Thus, by performing etching simultaneously from the front surface and the back surface of the substrate, the accuracy of opening can be increased. However, when the area of the recess that defines the outer shape of the pedestal is increased, the shape of the recess is swelled, so that the flatness is impaired. In particular, since the pedestal has openings, the flatness of the recesses around the openings is likely to be impaired due to chemical corrosion.

  Conventionally, when forming fine holes in the shadow mask or fine pitching the lead frame, etching is performed separately on the front and back surfaces of the substrate to tighten the dimensional accuracy of the holes formed in the substrate. There is a technique to perform (Patent Document 1). However, Patent Document 1 describes a technique for improving the dimensional accuracy of the opening, but does not describe a technique for improving the flatness of the recess.

Japanese Patent Laid-Open No. 5-28912

  The present invention has been made in consideration of such points, and in a metal member having a base having an opening and a frame body located on both sides of the base, the bottom surface of the recess of the base can be flattened. An object of the present invention is to provide a method for processing a metal substrate.

  The present invention relates to a metal substrate processing method for producing a metal member having a pedestal having an opening and a frame body positioned on both sides of the pedestal, a step of preparing the metal substrate, and a surface of the metal substrate. Providing a first resist layer including a pattern corresponding to the opening, and providing a second resist layer including a pattern corresponding to a recess defining an outer shape of the base on the other surface of the metal substrate; Forming a first etching-resistant resin layer on the first resist layer on the side, forming a recess in the metal substrate by etching from the other surface side of the metal substrate, and the other surface side of the metal substrate A step of providing a second etching-resistant resin layer on the second resist layer, and a step of etching from one side of the metal substrate to form an opening. For the inner diameter B of the recess forming Is 0 ≦ A ≦ B / 4 and the metal substrate processing method characterized by comprising.

  The present invention relates to a metal substrate processing method for producing a metal member having a pedestal having an opening and a frame body positioned on both sides of the pedestal, a step of preparing the metal substrate, and a surface of the metal substrate. Providing a first resist layer including a pattern corresponding to the opening, and providing a second resist layer including a pattern corresponding to a recess defining the outer shape of the base on the other surface of the metal substrate; A step of providing a second etching-resistant resin layer on the second resist layer on the surface side, a step of etching from one surface side of the metal substrate to form an opening, and a first surface on the first surface side of the metal substrate. A step of providing a first etching-resistant resin layer on the resist layer, and a step of etching from the other surface side of the metal substrate to form a recess in the metal substrate. For the inner diameter B of the recess forming Is 0 ≦ A ≦ B / 4 and the metal substrate processing method characterized by comprising.

  The present invention is the method for processing a metal substrate, wherein the opening is located in the center of the pedestal.

  The present invention is a method for processing a metal substrate, characterized in that R portions having a predetermined radius of curvature in the cross section are formed at both ends of the concave portion of the pedestal.

  The present invention is the method for processing a metal substrate, wherein the radius of curvature of the R portion is 50 μm to 150 μm.

  The present invention is the metal substrate processing method, wherein the metal substrate is made of stainless steel.

  ADVANTAGE OF THE INVENTION According to this invention, the bottom face of the recessed part of a base can be planarized in the metal member which has the base which has an opening, and the frame located in the both sides of a base.

The perspective view which shows the metal members produced with the processing method of the metal substrate by one embodiment of this invention. Sectional drawing which shows the metal member produced with the processing method of the metal substrate by one embodiment of this invention (II-II sectional view taken on the line of FIG. 1). The figure which shows the processing method of the metal substrate by one embodiment of this invention. The figure which shows the modification of the processing method of the metal substrate by one embodiment of this invention. The figure which shows the comparative example of the processing method of a metal substrate.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 4 are diagrams showing an embodiment of the present invention.

(Configuration of metal parts)
First, with reference to FIGS. 1 and 2, the structure of a metal member produced by the metal substrate processing method according to the present embodiment will be described.

  As shown in FIGS. 1 and 2, the metal member 10 includes a pedestal 12 having an opening 11 and frame bodies 13 located on both sides of the pedestal 12. The metal member 10 has one surface 10 </ b> A and the other surface 10 </ b> B, and one surface 10 </ b> A is formed flat except for the opening 11.

  On the other hand, the other surface 10B of the metal member 10 is provided with a recess 14 for forming the pedestal 12 by half etching. The concave portion 14 has a flattened bottom surface 16, and the bottom surface 16 is formed flat as a whole, as will be described later.

  The opening 11 has a planar circular shape and is located at the center of the pedestal 12. In this case, the size of the recess 14 is sufficiently larger than the size of the opening 11. Specifically, as shown in FIG. 2, when the inner diameter of the opening 11 is A and the inner diameter of the recess 14 forming the pedestal 12 is B, the relationship B / 10 ≦ A ≦ B / 4 holds. For example, when the inner diameter A of the opening 11 is 0.05 mm to 1.5 mm, the inner diameter B of the recess 14 is 0.2 mm to 15 mm.

  As shown in FIG. 2, R portions 15 having a predetermined radius of curvature C in the cross section are formed at both ends of the recess 14 of the base 12. In this case, the radius of curvature C of each R portion 15 is 50 μm to 150 μm.

  Although not limited thereto, the thickness E of the metal member 10 can be 50 μm to 150 μm, and the depth D of the recess 14 is 10% to 60% of the thickness E of the metal member 10. It can be.

  Various materials can be used as a material constituting such a metal member 10, and examples thereof include stainless steel, 42 alloy, copper, and copper alloy, and among these, stainless steel can be preferably used. . This is because stainless steel has a slow etching corrosion rate and can finely adjust the conditions for forming the member. The use of the metal member 10 is not limited, and examples thereof include an ink jet channel member, a semiconductor device inspection probe base, a HDD (hard disk drive) suspension member, and a fuel cell channel member. .

(Metal substrate processing method)
Next, a method for processing a metal substrate according to the present embodiment (a method for forming a base portion etching on the metal substrate) will be described with reference to FIGS. FIGS. 3A to 3G are views showing a metal substrate processing method according to the present embodiment.

  First, as shown in FIG. 3A, a flat metal substrate 20 that is not etched is prepared. The metal substrate 20 has one surface 20A and the other surface 20B. In addition, as a material of such a metal substrate 20, stainless steel can be mentioned, for example.

  Next, as shown in FIG. 3B, a first resist layer 21 including a predetermined pattern corresponding to the opening 11 described above is provided on one surface 20A of the metal substrate 20. In the first resist layer 21, an opening 21a is formed at a location corresponding to the opening 11, and one surface 20A of the metal substrate 20 is exposed from the opening 21a. In this case, the first resist layer 21 is provided on the entire surface 20A of the metal substrate 20, and the first resist layer 21 is exposed to the first resist layer 21 through a photomask and then developed. An opening 21a is formed in the substrate. The opening 21 a is positioned at the center of the portion of the metal substrate 20 that forms the base 12.

  Further, a second resist layer 22 including a predetermined pattern corresponding to the concave portion 14 that defines the outer shape of the base 12 is provided on the other surface 20B of the metal substrate 20. In the second resist layer 22, an opening 22a is formed at a location corresponding to the recess 14, and the other surface 20B of the metal substrate 20 is exposed from the opening 22a. In this case, the second resist layer 22 is provided on the entire other surface 20B of the metal substrate 20, and the second resist layer 22 is exposed through a photomask and then developed, whereby the second resist layer 22 is developed. An opening 22 a is formed in 22. In order for the relationship between the inner diameter A of the opening 11 and the inner diameter B of the recess 14 to satisfy B / 10 ≦ A ≦ B / 4 (see FIG. 2), the inner diameter of the opening 22a is that of the recess 14. It is preferable to set it to be 4 to 10 times the inner diameter.

  The first resist layer 21 and the second resist layer 22 are made of, for example, a resin that can be peeled off by an alkali, an acid, a solvent, or the like, and are made of, for example, a photosensitive and chemical-resistant resin such as an acrylic resin.

  Next, a first etching resistant resin layer 23 is provided on the first resist layer 21 on the one surface 20A side of the metal substrate 20 (FIG. 3C). In this case, the first etching resistant resin layer 23 covers the first resist layer 21 and enters the opening 21 a of the first resist layer 21. Examples of the material of the first etching resistant resin layer 23 include, for example, polyethylene, diene, acrylate copolymer, polyvinyl ether, polyurethane, or polyamide polymer, tackifier, plasticizer, and softening. And the like to which an agent, an adhesion regulator, an antioxidant, a stabilizer and the like are added.

  Subsequently, etching is performed from the other surface 20B side of the metal substrate 20 to corrode the metal substrate 20 in the opening 22a of the second resist layer 22, and the recess 14 is formed in the metal substrate 20 (FIG. 3D). )). At this time, R portions 15 are formed at both ends of the concave portion 14 respectively. Although the etching method is not particularly limited, for example, a wet etching method can be used. In this case, the etching solution used can be appropriately selected according to the type of the metal substrate 20. For example, when the metal substrate 20 is made of stainless steel, an iron chloride etching solution can be used as the etching solution.

  Next, the first etching-resistant resin layer 23 provided on the one surface 20A side of the metal substrate 20 is removed, and the second etching-resistant resin layer 22 is formed on the second resist layer 22 on the other surface 20B side of the metal substrate 20. A resin layer 24 is provided (FIG. 3E). In this case, the second etching resistant resin layer 24 covers the second resist layer 22 and fills the recess 14 through the opening 22 a of the second resist layer 22. The second etching resistant resin layer 24 can be the same as the first etching resistant resin layer 23.

  Subsequently, etching is performed from the one surface 20A side of the metal substrate 20 to corrode the metal substrate 20 in the opening 21a of the first resist layer 21 to form an opening 11 in the metal substrate 20 (FIG. 3F). )). In this case, the same etchant as that used in the step of forming the recesses 14 (FIG. 3D) can be used.

  Thereafter, the second etching-resistant resin layer 24 provided on the other surface 20B side of the metal substrate 20 is removed, and the first resist layer 21 and the second resist layer 22 are peeled off, whereby FIG. 1 and FIG. 2 is obtained. The metal member 10 has a pedestal 12 having an opening 11 and frame bodies 13 positioned on both sides of the pedestal 12, and the inner diameter A of the opening 11 is the inner diameter of the recess 14 forming the pedestal 12. For B, B / 10 ≦ A ≦ B / 4.

(Modified example of metal substrate processing method)
Next, a modification of the metal substrate processing method according to the present embodiment will be described with reference to FIGS. FIGS. 4A to 4G are diagrams showing a modification of the metal substrate processing method according to the present embodiment. 4 (a) to 4 (g) is a modification of the metal substrate processing method in which the opening 11 and the recess 14 are formed in the metal substrate 20 in a different order. The constituent materials and the like are the same as those in the embodiment shown in FIGS. 4 (a)-(g), the same parts as those in the embodiment shown in FIGS. 3 (a)-(g) are denoted by the same reference numerals, and detailed description thereof is omitted.

  First, as shown in FIG. 4A, a flat metal substrate 20 that is not etched is prepared.

  Next, as shown in FIG. 4B, a first resist layer 21 including a predetermined pattern corresponding to the opening 11 is provided on one surface 20A of the metal substrate 20, and a recess is formed on the other surface 20B of the metal substrate 20. A second resist layer 22 including a predetermined pattern corresponding to 14 is provided.

  Next, a second etching resistant resin layer 24 is provided on the second resist layer 22 on the other surface 20B side of the metal substrate 20 (FIG. 4C). In this case, the second etching resistant resin layer 24 covers the second resist layer 22 and enters the opening 22 a of the second resist layer 22.

  Subsequently, etching is performed from the one surface 20A side of the metal substrate 20 to corrode the metal substrate 20 in the opening 21a of the first resist layer 21, thereby forming the opening 11 in the metal substrate 20 (FIG. 4). (D)).

  Next, the second etching-resistant resin layer 24 provided on the other surface 20B side of the metal substrate 20 is removed, and the first etching-resistant layer is formed on the first resist layer 21 on the one surface 20A side of the metal substrate 20. A resin layer 23 is provided (FIG. 4E). In this case, the first etching-resistant resin layer 23 covers the first resist layer 21 and fills the opening 11 through the opening 21 a of the first resist layer 21.

  Subsequently, etching is performed from the other surface 20B side of the metal substrate 20 to corrode the metal substrate 20 in the opening 22a of the second resist layer 22, thereby forming the recess 14 in the metal substrate 20 (FIG. 4). (F)). At this time, R portions 15 are formed at both ends of the concave portion 14 respectively.

  Thereafter, the first etching resistant resin layer 23 provided on the one surface 20A side of the metal substrate 20 is removed, and the first resist layer 21 and the second resist layer 22 are peeled off, whereby FIG. 1 and FIG. The metal member 10 shown in FIG.

  As described above, according to the present embodiment, after the recess 14 is formed in the metal substrate 20 by etching, the second etching resistant resin layer 24 is filled in the recess 14, and in this state, the metal substrate 20 is etched. An opening 11 is formed in the substrate (FIGS. 3D to 3F). Alternatively, after forming the opening 11 in the metal substrate 20 by etching, the opening 11 is filled with the first etching-resistant resin layer 23, and in this state, the recess 14 is formed in the metal substrate 20 by etching (FIG. 4 (d)-(f)).

  Thereby, the corrosion due to the etching for forming the recess 14 can be promoted uniformly at any location on the bottom surface 16 of the recess 14. As a result, the bottom surface 16 of the recess 14 of the metal member 10 can be flattened. Specifically, the unevenness of the bottom surface 16 can be suppressed within ± 10 μm. In particular, the flatness around the opening 11 in the bottom surface 16 of the recess 14 can be enhanced.

(Comparative example of metal substrate processing method)
Next, a comparative example of a method for processing a metal substrate will be described with reference to FIGS. FIGS. 5A to 5D are diagrams illustrating a comparative example of a method for processing a metal substrate.

  In the comparative example shown in FIGS. 5A to 5D, etching is simultaneously performed from both surfaces of the metal substrate 110 to form the opening 101 and the recess 104. That is, first, a metal substrate 110 is prepared (FIG. 5A), and resist layers 111 and 112 are formed on both surfaces of the metal substrate 110 (FIG. 5B).

  Next, by performing etching from both sides of the metal substrate 110, the opening 101 and the concave portion 104 are simultaneously formed in the metal substrate 110 (FIG. 5C).

  Thereafter, the resist layers 111 and 112 are removed from the metal substrate 110 to obtain the metal member 100 having the pedestal 102 having the opening 101 and the frame bodies 103 positioned on both sides of the pedestal 102 (FIG. 5D )).

  In the comparative example shown in FIGS. 5A to 5D, when etching is performed (FIG. 5C), the portion 107 located around the opening 101 in the bottom surface 106 of the recess 104 is the other portion. Corrosion is likely to proceed compared to Therefore, undulation is likely to occur around the opening 101 in the bottom surface 106 and the bottom surface 106 is difficult to flatten.

  On the other hand, according to the present embodiment, as described above, the etching corrosion can be progressed uniformly within the bottom surface 16 of the recess 14, and the bottom surface 16 can be flattened.

DESCRIPTION OF SYMBOLS 10 Metal member 11 Opening hole 12 Base 13 Frame 14 Recessed part 15 R part 16 Bottom face 20 Metal substrate 21 1st resist layer 22 2nd resist layer 23 1st etching resistant resin layer 24 2nd etching resistant resin layer

Claims (6)

In the method of processing a metal substrate for producing a metal member having a base having an opening and a frame body located on both sides of the base,
Preparing a metal substrate;
Providing a first resist layer including a pattern corresponding to the opening on one surface of the metal substrate, and providing a second resist layer including a pattern corresponding to a recess defining the outer shape of the base on the other surface of the metal substrate; ,
Providing a first etching resistant resin layer on the first resist layer on the one surface side of the metal substrate;
Etching from the other side of the metal substrate to form a recess in the metal substrate;
Providing a second etching-resistant resin layer on the second resist layer on the other surface side of the metal substrate;
Etching from one side of the metal substrate to form a hole,
An inner diameter A of the opening is B / 10 ≦ A ≦ B / 4 with respect to an inner diameter B of the concave portion forming the pedestal. In the method of processing a metal substrate for producing a metal member having a base having an opening and a frame body located on both sides of the base,
Preparing a metal substrate;
Providing a first resist layer including a pattern corresponding to the opening on one surface of the metal substrate, and providing a second resist layer including a pattern corresponding to a recess defining the outer shape of the base on the other surface of the metal substrate; ,
Providing a second etching-resistant resin layer on the second resist layer on the other surface side of the metal substrate;
Etching from one side of the metal substrate to form an opening;
Providing a first etching resistant resin layer on the first resist layer on the one surface side of the metal substrate;
Etching from the other side of the metal substrate, and forming a recess in the metal substrate,
An inner diameter A of the opening is B / 10 ≦ A ≦ B / 4 with respect to an inner diameter B of the concave portion forming the pedestal.   3. The method for processing a metal substrate according to claim 1, wherein the opening is located in the center of the pedestal.   4. The method for processing a metal substrate according to claim 1, wherein R portions having a predetermined radius of curvature in the cross section are formed at both ends of the concave portion of the pedestal.   The metal substrate processing method according to claim 4, wherein the radius of curvature of the R portion is 50 μm to 150 μm.   The metal substrate processing method according to claim 1, wherein the metal substrate is made of stainless steel.

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