CN109788654A - A kind of production method for the flexible circuit board improving etching factor - Google Patents
A kind of production method for the flexible circuit board improving etching factor Download PDFInfo
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- CN109788654A CN109788654A CN201811540180.7A CN201811540180A CN109788654A CN 109788654 A CN109788654 A CN 109788654A CN 201811540180 A CN201811540180 A CN 201811540180A CN 109788654 A CN109788654 A CN 109788654A
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- dry film
- electroless nickel
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- nickel layer
- production method
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Abstract
The present invention provides a kind of production method of flexible circuit board for improving etching factor, comprising the following steps: (1) chemical nickel plating；(2) dry film presses；(3) dry film ultraviolet exposure；(4) dry film develops；(5) copper etches；(6) dry film is removed；(7) electroless nickel layer removes.The present invention also provides the products that the production method obtains.The present invention can effectively improve the etching factor of fine-line, to be conducive to be promoted the yield of fine-line.
Description
Technical field
The present invention relates to a kind of production methods of flexible circuit board and products thereof for improving etching factor.
Background technique
With the micromation of electronic product, higher and higher, thinner line width is required to the high-density wiring of flexible circuit board
Line-spacing becomes the development trend of existing market.Domestic flexible circuit board industry mostly uses greatly etching method to make route, loses at present
Lithography can produce line width/line-spacing 25 by using high-res dry film, high-accuracy glass egative film and two fluid etching machines
Micron/25 microns and fine-line below, but there is a problem of that etching factor is lower, the fine lines Louis of low etching factor
There is route base copper to remain and product yield is caused to decline, etching factor calculation formula are as follows: etching factor=substrate copper foil
Thickness/route line width difference up and down half, it can be seen that etching factor is lower if wide gap is bigger above and below route, existing
The etching factor of some fine-lines is 2.5 or so.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of production method of flexible circuit board for improving etching factor, energy
The etching factor of fine-line is effectively improved, to be conducive to be promoted the yield of fine-line.
In order to solve the above technical problems, the technical scheme is that
A kind of production method for the flexible circuit board improving etching factor, comprising the following steps:
(1) chemical nickel plating: upper copper foil layer is set in the upper surface of polyimides middle layer, under polyimides middle layer
Substrate is made after lower copper foil layer is arranged in surface, the upper electroless nickel layer of uniform deposition in the upper surface chemical plating of upper copper foil layer,
The lower electroless nickel layer of uniform deposition in the lower surface chemical plating of lower copper foil layer；
(2) dry film presses: pressing to form upper dry film in the upper surface of upper electroless nickel layer, in the following table face pressure of lower electroless nickel layer
It closes and forms lower dry film；
(3) partial illumination, quilt on upper and lower dry film dry film ultraviolet exposure: are carried out respectively to upper and lower dry film using ultraviolet light
The irradiated part of ultraviolet light occurs polymerization crosslinking and forms upper and lower dry film exposed portion, and remaining part is on upper and lower dry film
Upper and lower dry film unexposed portion, upper and lower dry film exposed portion and upper and lower dry film unexposed portion have multiple and in X-direction one
One interval；
(4) dry film develops: by the removal of upper and lower dry film unexposed portion and the upper and lower electroless nickel layer in exposed portion；
(5) copper etches: to electroless nickel layer and upper copper foil layer below, lowerization on the part exposed after step (5)
The lower copper foil layer for learning nickel layer and its top is etched, until exposing polyimides middle layer；
(6) dry film is removed: all upper and lower dry film exposed portions are removed；
(7) electroless nickel layer removes: will be by remaining upper and lower electroless nickel layer removal on step (6) treated substrate.
Further, in the step (1), the thickness of upper copper foil layer and lower copper foil layer is 0.1-100 microns.
Further, in the step (1), the thickness of upper electroless nickel layer and lower electroless nickel layer is 0.01-10 microns.
Further, in the step (2), the mode of pressing is that hot-rolling presses, and the thickness of upper dry film and lower dry film is
10-25 microns.
Further, the step (3) are as follows: upper and lower glass negative is covered each by upper and lower dry film, upper and lower glass
Egative film respectively includes the upper and lower transparent region and upper and lower black region being spaced one by one in X-direction, each upper and lower transparent region
X to size be 20-200 microns, the X of each upper and lower black region to size be 10-25 microns, using ultraviolet light to covering
Be stamped upper and lower glass negative upper and lower dry film be irradiated exposure after remove upper and lower glass negative, on upper and lower dry film by it is upper,
The part of lower transparent region covering is upper and lower dry film exposed portion, the part covered on upper and lower dry film by upper and lower black region
For upper and lower dry film unexposed portion.
Further, in the step (3), the quantity of upper and lower transparent region is 3, and the quantity of upper and lower black region is 2.
Further, in the step (5), the etching solution that when etching uses is copper chloride/hydrochloric acid system etching solution.
The present invention also provides the products that the production method obtains.
Compared with prior art, the invention has the following advantages:
The present invention, by one layer of electroless nickel layer of electroless deposition, is chemical nickel at the initial stage of etching on the copper foil layer of substrate
Layer is etched, until exposing copper foil layer, then electroless nickel layer and copper foil layer are etched together, due to the etch-rate of electroless nickel layer
Lower than copper foil layer, so the etch-rate of the part on copper foil layer close to electroless nickel layer can be pulled low, thus after reducing etching
The gap of the line width up and down of the i.e. route of the copper foil layer left, and then the etching factor of fine-line is improved, be conducive to promote essence
The yield of fine rule road；By taking the substrate of 12 micron thickness as an example, dry film spacing is 15 microns after development, with the erosion of existing method
Route spacing after quarter is 20 microns, and etching factor is 2.5 or so, and uses dry film spacing after method development of the invention
With route spacing after etching with the above existing method, but etching factor can be improved to 4 or more.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, not
Inappropriate limitation of the present invention is constituted, in the accompanying drawings:
Fig. 1 is the structural schematic diagram of substrate of the present invention；
Fig. 2 is the structural schematic diagram of step of the present invention (1)；
Fig. 3 is the structural schematic diagram of step of the present invention (4)；
Fig. 4 is the structural schematic diagram of step of the present invention (5)；
Fig. 5 is the structural schematic diagram of step of the present invention (6)；
Fig. 6 is the structural schematic diagram of step of the present invention (7).
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described in detail, herein illustrative examples and explanation of the invention
For explaining the present invention, but it is not as a limitation of the invention.
Embodiment 1
The flexible circuit board for improving etching factor, is made by following steps:
(1) chemical nickel plating: upper copper foil layer 2 is set in the upper surface of polyimides middle layer 1, in polyimides middle layer 1
Lower surface lower copper foil layer 5 is set after substrate is made, the upper chemical nickel of uniform deposition in the upper surface chemical plating of upper copper foil layer 1
Layer 3, the lower electroless nickel layer 6 of uniform deposition in the lower surface chemical plating of lower copper foil layer 5, the thickness of upper copper foil layer 2 and lower copper foil layer 5
Degree is 12 microns, and the thickness of upper electroless nickel layer 3 and lower electroless nickel layer 6 is 0.7 micron；
(2) dry film presses: pressing to form upper dry film 4 in the upper surface hot-rolling of upper electroless nickel layer 3, in lower electroless nickel layer 6
Lower surface hot-rolling presses to form lower dry film 7, and the thickness of upper dry film 4 and lower dry film 7 is 15 microns；
(3) dry film ultraviolet exposure: upper and lower glass negative is covered each by upper dry film 4, lower dry film 7, upper and lower glass
Glass egative film respectively includes the upper and lower transparent region and upper and lower black region being spaced one by one in X-direction, each upper and lower transparent region
X to size be 25 microns, the X of each upper and lower black region to size be 15 microns, using ultraviolet light to being covered with
Upper dry film 4, the lower dry film 7 of upper and lower glass negative remove upper and lower glass negative, upper dry film 4, lower dry film 7 after being irradiated exposure
On the part that is covered by upper and lower transparent region be upper and lower dry film exposed portion, by upper and lower black on upper dry film 4, lower dry film 7
The part of region overlay is upper and lower dry film unexposed portion；
(4) dry film develops: by electroless nickel layer 3, lower chemical nickel on the removal of upper and lower dry film unexposed portion and exposed portion
Layer 6；
(5) copper etches: to electroless nickel layer 3 on the part exposed after step (5) and upper copper foil layer 2 below, under
The lower copper foil layer 5 of electroless nickel layer 6 and its top is etched, until exposing polyimides middle layer 1；
(6) dry film is removed: all upper and lower dry film exposed portions are removed；
(7) electroless nickel layer removes: will be by remaining upper electroless nickel layer 3, lower chemical nickel on step (6) treated substrate
Layer 6 removes.
In the step (3), the quantity of upper and lower transparent region is 3, and the quantity of upper and lower black region is 2；The step
(5) in, the etching solution that when etching uses is copper chloride/hydrochloric acid system etching solution
Embodiment 2
Unlike the first embodiment: in step (1), upper copper foil layer 2 and lower copper foil layer 5 with a thickness of 6 microns, upper chemistry
Nickel layer 3 and the thickness of lower electroless nickel layer 6 are 0.5 micron；In step (2), the thickness of upper dry film 4 and lower dry film 7 is 10 micro-
Rice；In step (3), the X of each upper and lower transparent region and upper and lower dry film exposed portion 4 to size be 20 microns, Mei Geshang,
The X of lower black region and upper and lower dry film unexposed portion to size be 10 microns.
Embodiment 3
Unlike the first embodiment: in step (1), upper copper foil layer 2 and lower copper foil layer 5 with a thickness of 100 microns, upperization
The thickness for learning nickel layer 3 and lower electroless nickel layer 6 is 1 micron；In step (2), the thickness of upper dry film 4 and lower dry film 7 is 25 micro-
Rice；In step (3), the X of each upper and lower transparent region and upper and lower dry film exposed portion 4 to size be 200 microns, each
The X of upper and lower black region and upper and lower dry film unexposed portion to size be 25 microns.
Embodiment 4
Unlike the first embodiment: in step (1), upper copper foil layer 2 and lower copper foil layer 5 with a thickness of 50 microns, upper chemistry
Nickel layer 3 and the thickness of lower electroless nickel layer 6 are 0.7 micron；In step (2), the thickness of upper dry film 4 and lower dry film 7 is 20 micro-
Rice；In step (3), the X of each upper and lower transparent region and upper and lower dry film exposed portion 4 to size be 100 microns, each
The X of upper and lower black region and upper and lower dry film unexposed portion to size be 20 microns.
Embodiment 5
Unlike the first embodiment: in step (1), upper copper foil layer 2 and lower copper foil layer 5 with a thickness of 0.1 micron, upperization
The thickness for learning nickel layer 3 and lower electroless nickel layer 6 is 0.01 micron.
Embodiment 6
Unlike the first embodiment: in step (1), upper copper foil layer 2 and lower copper foil layer 5 with a thickness of 100 microns, upperization
The thickness for learning nickel layer 3 and lower electroless nickel layer 6 is 10 microns.
The principle of the present invention and effect is only illustrated in above-described embodiment, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (8)
1. a kind of production method for the flexible circuit board for improving etching factor, it is characterised in that: the following steps are included:
(1) chemical nickel plating: upper copper foil layer is set in the upper surface of polyimides middle layer, in the lower surface of polyimides middle layer
Substrate is made after lower copper foil layer is set, the upper electroless nickel layer of uniform deposition in the upper surface chemical plating of upper copper foil layer, in lower copper
The lower electroless nickel layer of uniform deposition in the lower surface chemical plating of layers of foil；
(2) dry film presses: pressing to form upper dry film in the upper surface of upper electroless nickel layer, presses shape in the lower surface of lower electroless nickel layer
At lower dry film；
(3) dry film ultraviolet exposure: carrying out partial illumination to upper and lower dry film using ultraviolet light respectively, ultraviolet on upper and lower dry film
The irradiated part of line occurs polymerization crosslinking and forms upper and lower dry film exposed portion, and remaining part is upper and lower on upper and lower dry film
Dry film unexposed portion, upper and lower dry film exposed portion and upper and lower dry film unexposed portion have it is multiple and X-direction one by one between
Every；
(4) dry film develops: by the removal of upper and lower dry film unexposed portion and the upper and lower electroless nickel layer in exposed portion；
(5) copper etches: to electroless nickel layer on the part exposed after step (5) and upper copper foil layer below, lower chemical nickel
Layer and its lower copper foil layer of top are etched, until exposing polyimides middle layer；
(6) dry film is removed: all upper and lower dry film exposed portions are removed；
(7) electroless nickel layer removes: will be by remaining upper and lower electroless nickel layer removal on step (6) treated substrate.
2. the production method of the flexible circuit board according to claim 1 for improving etching factor, it is characterised in that: the step
Suddenly in (1), the thickness of upper copper foil layer and lower copper foil layer is 0.1-100 microns.
3. the production method of the flexible circuit board according to claim 2 for improving etching factor, it is characterised in that: the step
Suddenly in (1), the thickness of upper electroless nickel layer and lower electroless nickel layer is 0.01-10 microns.
4. the production method of the flexible circuit board according to claim 3 for improving etching factor, it is characterised in that: the step
Suddenly in (2), the mode of pressing is that hot-rolling presses, and the thickness of upper dry film and lower dry film is 10-25 microns.
5. the production method of the flexible circuit board according to claim 4 for improving etching factor, it is characterised in that: the step
Suddenly (3) are as follows: upper and lower glass negative is covered each by upper and lower dry film, upper and lower glass negative respectively includes in X-direction one by one
The upper and lower transparent region and upper and lower black region at interval, the X of each upper and lower transparent region to size be 20-200 microns,
The X of each upper and lower black region to size be 10-25 microns, using ultraviolet light to be covered with upper and lower glass negative it is upper,
Lower dry film removes upper and lower glass negative after being irradiated exposure, is by the part that upper and lower transparent region covers on upper and lower dry film
Upper and lower dry film exposed portion, the part covered on upper and lower dry film by upper and lower black region is upper and lower dry film unexposed portion.
6. the production method of the flexible circuit board according to claim 5 for improving etching factor, it is characterised in that: the step
Suddenly in (3), the quantity of upper and lower transparent region is 3, and the quantity of upper and lower black region is 2.
7. the production method of the flexible circuit board according to claim 6 for improving etching factor, it is characterised in that: the step
Suddenly in (5), the etching solution that when etching uses is copper chloride/hydrochloric acid system etching solution.
8. the product that production method described in -7 any one obtains according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811540180.7A CN109788654A (en) | 2018-12-17 | 2018-12-17 | A kind of production method for the flexible circuit board improving etching factor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811540180.7A CN109788654A (en) | 2018-12-17 | 2018-12-17 | A kind of production method for the flexible circuit board improving etching factor |
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| Publication Number | Publication Date |
|---|---|
| CN109788654A true CN109788654A (en) | 2019-05-21 |
Family
ID=66497193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811540180.7A Withdrawn CN109788654A (en) | 2018-12-17 | 2018-12-17 | A kind of production method for the flexible circuit board improving etching factor |
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| Country | Link |
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| CN (1) | CN109788654A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493969A (en) * | 2019-08-19 | 2019-11-22 | 江苏上达电子有限公司 | A method of prevent second etch from leading to route lateral erosion |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176242A (en) * | 2000-12-05 | 2002-06-21 | Nikko Materials Co Ltd | Copper foil for electronic circuit and method for forming electronic circuit |
| CN101904228A (en) * | 2007-12-21 | 2010-12-01 | 日矿金属株式会社 | Copper foil for printed wiring board |
| CN206564726U (en) * | 2017-02-14 | 2017-10-17 | 苏州维信电子有限公司 | The FPC with ultra fine-line that Novel dry film makes |
-
2018
- 2018-12-17 CN CN201811540180.7A patent/CN109788654A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176242A (en) * | 2000-12-05 | 2002-06-21 | Nikko Materials Co Ltd | Copper foil for electronic circuit and method for forming electronic circuit |
| CN101904228A (en) * | 2007-12-21 | 2010-12-01 | 日矿金属株式会社 | Copper foil for printed wiring board |
| CN206564726U (en) * | 2017-02-14 | 2017-10-17 | 苏州维信电子有限公司 | The FPC with ultra fine-line that Novel dry film makes |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493969A (en) * | 2019-08-19 | 2019-11-22 | 江苏上达电子有限公司 | A method of prevent second etch from leading to route lateral erosion |
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Application publication date: 20190521 |