CN102650762A - Mother board of liquid crystal display panel and manufacturing method for mother board - Google Patents
Mother board of liquid crystal display panel and manufacturing method for mother board Download PDFInfo
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- CN102650762A CN102650762A CN201110223377XA CN201110223377A CN102650762A CN 102650762 A CN102650762 A CN 102650762A CN 201110223377X A CN201110223377X A CN 201110223377XA CN 201110223377 A CN201110223377 A CN 201110223377A CN 102650762 A CN102650762 A CN 102650762A
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- crystal display
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Abstract
The invention discloses a mother board of a liquid crystal display panel and a manufacturing method for the mother board. The mother board of the liquid crystal display panel is designed in order to mainly fully utilize the space of the mother board and reduce the manufacturing cost of the liquid crystal display panel. The mother board of the liquid crystal display panel is provided with more than two unit liquid crystal display panels; all the unit liquid crystal display panels on the mother board of the liquid crystal display panel comprise unit liquid crystal display panels of at least two types; and moreover, orientation layers on at least one substrate mother board in the areas of the unit liquid crystal display panels of one type and orientation layers on substrate mother boards in the areas of the unit liquid crystal display panels of other types are different in thickness. According to the mother board of the liquid crystal display panel, the requirement of a box clearance design for the unit liquid crystal display panels of different types on the same mother board is met through coating the orientation layers with different thicknesses into the areas of different unit liquid crystal display panels, therefore, the use ratio of the mother board of the liquid crystal display panel is increased, and further, the manufacturing cost of the liquid crystal display panel is reduced.
Description
Technical field
The present invention relates to a kind of technical field of liquid crystal display, relate in particular to a kind of display panels motherboard and manufacturing approach thereof.
Background technology
The display panels motherboard comprises: colored optical filtering substrates motherboard, array base palte motherboard and the liquid crystal layer between the two substrates motherboard; Its preparation process generally is: earlier the array base palte motherboard of whole piece and the colored optical filtering substrates motherboard of whole piece are carried out box; Again liquid crystal layer is sealed in therebetween, and then forms display panels motherboard with a plurality of units display panels; Again this display panels motherboard is cut afterwards, finally form a plurality of independently display panels.
The layout of traditional display panels motherboard (Glass layout) design is as shown in Figure 1, arranges the identical unit display panels of a plurality of models on it.In recent years, the user is more and more to the demand of large scale liquid crystal display panel, and the manufacturing of display panels is also developing towards the large scale direction.In the production run of reality, the inventor finds to produce large-sized display panels, and the utilization factor of its motherboard is also just low more, and opposite manufacturing cost is also just high more.Its main cause is: produce on the line in the manufacturing of available liquid crystal display; The motherboard size of the display panels that can make is certain; To on the certain motherboard of size, produce large-sized display panels and just must cause the waste of mother glass substrate, and then increase the manufacturing cost of display panels.
Summary of the invention
To the problems referred to above, the present invention provides a kind of waste that can effectively reduce the mother glass substrate, reduces the display panels motherboard and the manufacturing approach thereof of display panels manufacturing cost.
For achieving the above object; Display panels motherboard according to the invention; Be furnished with plural unit display panels on it; The unit display panels that has two kinds of models in all unit display panels on the described display panels motherboard at least, and wherein the oriented layer thickness on the substrate motherboard in the unit display panels zone of the oriented layer at least one the substrate motherboard in a kind of unit display panels zone of model and other kind model is different.
Further, in the said unit display panels zone of model of the same race the two substrates motherboard on oriented layer thickness identical.
For achieving the above object, the manufacturing approach of display panels motherboard according to the invention comprises the steps:
Make the array basal plate motherboard;
Make a subtend substrate motherboard;
Utilize transfer plate on said array base palte motherboard and subtend substrate motherboard, to apply one deck oriented layer respectively, and to being orientated friction on the said oriented layer; And,
Formation include array base palte motherboard, subtend substrate motherboard and be sealed in this array base palte motherboard and subtend substrate motherboard between the display panels motherboard of liquid crystal layer;
Wherein, described transfer plate is made up of base plate and the APR layer that is arranged on the base plate, and described APR layer is made up of the salient point of several regular arrangement; Described APR layer comprises at least two zones, and the bump height that is in the same area is identical, and the bump height that is in the zones of different is different; Oriented layer thickness in this transfer plate is coated in the unit display panels zone of different model on said array base palte motherboard and/or the subtend substrate motherboard is different.
The invention has the beneficial effects as follows: the demand that realizes different display panels boxes gap (Cell Gap) design on the same motherboard through the oriented layer that in display panels zone, the unit of different model, applies different-thickness; Further realized on same motherboard, arranging the unit display panels of multiple model or particular cartridge gap design demand; Effectively raise the utilization factor of display panels motherboard, and then reduced the manufacturing cost of display panels.
Description of drawings
Fig. 1 is a structural representation of arranging the unit display panels of a plurality of same model on the available liquid crystal display panel motherboard;
Fig. 2 is the structural representation of a specific embodiment of the unit display panels of a plurality of different models of layout on the display panels motherboard;
Fig. 3 is the phantom view of Fig. 2.
Fig. 4 is the structural representation that is used on the glass substrate of motherboard, forming oriented layer equipment;
Fig. 5 is the synoptic diagram that is printed with orientation liquid of transfer plate according to the invention;
Fig. 6 is the synoptic diagram that adopts the thickness of the oriented layer that transfer plate shown in Figure 5 forms on the glass substrate of motherboard;
Fig. 7 is the synoptic diagram that on the transfer plate base plate, applies the APR layer;
Fig. 8 is the synoptic diagram that on the base plate that is coated with the APR layer, applies photoresist;
Fig. 9 is the synoptic diagram that adopts the intermediate tone mask plate that said photoresist is made public;
Figure 10 is the synoptic diagram that said photoresist is developed;
Figure 11 etches away the synoptic diagram that photoresist is removed the APR layer in zone fully fully through etching;
Figure 12 is the synoptic diagram through the photoresist of cineration technics removal first time photoresist half reserve area;
Figure 13 be through the second time cineration technics get rid of the synoptic diagram of the part A PR layer of no photoresist;
Figure 14 gets rid of photoresist remaining on the base plate through stripping technology, forms the structural representation of the different transfer plate of zones of different bump height.
Embodiment
Below in conjunction with Figure of description the present invention is done further description.
As shown in Figures 2 and 3; Display panels motherboard 34 according to the invention; Be furnished with more than one unit display panels on it; The unit display panels (the unit display panels of two kinds of models shown in 24 and 25 as shown in Figure 2) that has two kinds of models in all unit display panels on the described display panels motherboard at least, and wherein the oriented layer thickness on the substrate motherboard in the unit display panels zone of the oriented layer at least one the substrate motherboard in a kind of unit display panels zone of model and other kind model is different.The box spacing of the unit display panels 25 that size as shown in the figure is little is less than the big unit display panels 24 of size, so oriented layer 51 thickness at least one the substrate motherboard in little unit display panels 25 zones of size should be greater than oriented layer 52 thickness on the substrate motherboard in big unit display panels 24 zones of size.Preferably shown in 3, in the said unit display panels zone of model of the same race the two substrates motherboard on oriented layer thickness identical.
In addition, the different model described in the present invention can be the LCDs that varies in size (as 30 o'clock, 46 o'clock or the like) or the LCDs that meets the concrete model of specific design requirements (like the particular cartridge gap).
In a specific embodiment; As shown in Figure 3, oriented layer 51 thickness on two substrate motherboards up and down of the unit display panels 25 that size is little among this embodiment are all greater than the thickness of the oriented layer 52 on two substrate motherboards up and down of the big unit display panels 24 of size.
The manufacturing approach of said display panels motherboard comprises the steps:
Make the array basal plate motherboard, the pixel region that this array base palte motherboard has the controlling grid scan line that intersects anyhow and data line and limited controlling grid scan line and data line, and each pixel region comprises a film transistor device and pixel electrode at least;
Make a subtend substrate motherboard;
Utilize transfer plate on said array base palte motherboard and subtend substrate motherboard, to apply one deck oriented layer respectively, and on said oriented layer, be orientated friction; And,
Formation include array base palte motherboard, subtend substrate motherboard and be sealed in this array base palte motherboard and subtend substrate motherboard between the display panels motherboard of liquid crystal layer;
Wherein, described transfer plate is made up of base plate and the APR layer that is arranged on the base plate, and described APR layer is made up of the salient point of several regular arrangement; Described APR layer comprises at least two zones, and the bump height that is in the same area is identical, and the bump height that is in the zones of different is different; Oriented layer thickness in this transfer plate is coated in the unit display panels zone of different model on said array base palte motherboard and/or the subtend substrate motherboard is different.
Make above-mentioned method embodiment illustrated in fig. 3; Basic step is the same; Just utilizing transfer plate on said array base palte motherboard and subtend substrate motherboard, to apply respectively in this step of one deck oriented layer; Employed transfer plate (APR Plate:Asai Kasai Photosenstive Resin Plate), shown in figure 14, process by polymeric material.This transfer plate (APR Plate) has the double-layer structure that the base plate (Base Film) 10 that is formed by polyester material and the APR layer 9 that is formed by unsaturated polyester butylene resin material constitute, and wherein, described APR layer 9 is made up of the salient point of several regular arrangement; Described APR layer comprises at least two zones (two zones 20 shown in Figure 14 and 21), and the bump height that is in the same area is identical, and the bump height that is in the zones of different is different.The display panels motherboard of certain corresponding different designs demand; Bump height in the area dividing of the APR layer on the said transfer plate, regional number and each zone all can be done corresponding adjustment, so just can on the glass substrate of motherboard, apply the oriented layer thickness that satisfies design requirement easily.
Wherein, oriented layer applies through coating apparatus shown in Figure 4, and the concrete course of work is following:
At first, through divider (Dispenser) 1 PI (polyimide) is discharged on the distributor rollers (Anilox Roll) 3.At this moment, through scraper 2 (Doctor Roll (Blade)) PI that discharges is coated on the distributor rollers 3 equably.
Then, the PI that has been coated with is printed onto transfer plate 4 (the APR Plate that is pre-formed the differing heights salient point; Asai Kasai Photosenstive Resin Plate) on, at this moment, the PI amount that carry in two zones on the transfer plate 4 is as shown in Figure 5.
At last, the transfer plate that has been printed with PI is applied to PI on the glass substrate 7 of the motherboard that is in applicator roll 6 belows through the applicator roll 6 (Coating Roll) that rotates, and forms two zones 18 and 19 highly different oriented layer 5, and is as shown in Figure 6.Transfer plate as shown in Figure 5; Because of the difference of the bump height in the APR layer zones of different on it; Therefore, PI amount 15 entrained between each salient point in the variant zone is different, shown in figure; The height of the salient point in the first area on this transfer plate is 10um, and the height of the salient point in the second area is 18um.Adopt the glass substrate 7 of the motherboard after this transfer plate coating oriented layer as shown in Figure 6, the oriented layer 5 of two kinds of thickness of formation in two display panels zones 18 and 19 is respectively 0.2um and 0.35um respectively.
The preparation method of this transfer plate, comprises the steps: to shown in Figure 14 like Fig. 7
On base plate 10, evenly be coated with APR layer 9 and photoresist 11 successively, like Fig. 7 and shown in Figure 8;
Adopt 12 pairs of said photoresists 11 of intermediate tone mask plate make public (ultraviolet ray 13 (UV) exposure) develop; On base plate 10, form photoresist and remove zone, photoresist half reserve area (below of the top intermediate tone mask plate 12 of this photoresist half reserve area is provided with semi-permeable diaphragm 14) and the complete reserve area of photoresist fully, like Fig. 9 and shown in Figure 10;
Etch away the APR material that photoresist is removed the zone fully fully through etching, shown in figure 11;
Through the photoresist and the part A PR material of cineration technics ashing removal photoresist half reserve area, like Figure 12 and shown in Figure 13;
Get rid of photoresist remaining on the base plate through stripping technology, form zones of different 20 transfer plate different with 31 bump height, shown in figure 14.
Wherein, photoresist and part A PR material through cineration technics ashing removal photoresist half reserve area specifically comprise the steps:
Through the photoresist of cineration technics removal first time photoresist half reserve area, shown in figure 12;
Through the second time cineration technics get rid of the part A PR of no photoresist, shown in figure 13.
Above-mentioned transfer plate has formed highly different salient points through using the Exposure mode of HTM (half-tone Mask) through cineration technics in zones of different.Adopt this transfer plate in the variant model liquid crystal panel of the glass substrate of motherboard region, to form the oriented layer of different-thickness; Therefore in same cell processing procedure, on same display panels motherboard, can form the liquid crystal cell of different cell gap; Make and arrange that simultaneously the preparation of the unit liquid crystal panel of different model becomes a reality in the glass substrate of same motherboard; Effectively raise the utilization factor of motherboard, reduced manufacturing cost.
More than; Be merely preferred embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technician who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim was defined.
Claims (3)
1. display panels motherboard; Be furnished with plural unit display panels on it; It is characterized in that; The unit display panels that has two kinds of models in all unit display panels on the described display panels motherboard at least, and wherein the oriented layer thickness on the substrate motherboard in the unit display panels zone of the oriented layer at least one the substrate motherboard in a kind of unit display panels zone of model and other kind model is different.
2. according to the said display panels motherboard of claim 1, it is characterized in that, in the said unit display panels zone of model of the same race the two substrates motherboard on oriented layer thickness identical.
3. the manufacturing approach of a display panels motherboard is characterized in that, comprises the steps:
Make the array basal plate motherboard;
Make a subtend substrate motherboard;
Utilize transfer plate on said array base palte motherboard and subtend substrate motherboard, to apply one deck oriented layer respectively, and to being orientated friction on the said oriented layer; And,
Formation include array base palte motherboard, subtend substrate motherboard and be sealed in this array base palte motherboard and subtend substrate motherboard between the display panels motherboard of liquid crystal layer;
Wherein, described transfer plate is made up of base plate and the APR layer that is arranged on the base plate, and described APR layer is made up of the salient point of several regular arrangement; Described APR layer comprises at least two zones, and the bump height that is in the same area is identical, and the bump height that is in the zones of different is different; Oriented layer thickness in this transfer plate is coated in the unit display panels zone of different model on said array base palte motherboard and/or the subtend substrate motherboard is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110223377XA CN102650762A (en) | 2011-08-04 | 2011-08-04 | Mother board of liquid crystal display panel and manufacturing method for mother board |
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| CN201110223377XA CN102650762A (en) | 2011-08-04 | 2011-08-04 | Mother board of liquid crystal display panel and manufacturing method for mother board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105842897A (en) * | 2016-05-30 | 2016-08-10 | 深圳市华星光电技术有限公司 | Liquid crystal display mother board and orientation method thereof |
| CN108521795A (en) * | 2018-04-04 | 2018-09-11 | 京东方科技集团股份有限公司 | Manufacture the device and method of the display base plate of liquid crystal display panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08262444A (en) * | 1995-03-23 | 1996-10-11 | Citizen Watch Co Ltd | Liquid crystal display device |
| CN101221326A (en) * | 2008-02-02 | 2008-07-16 | 友达光电股份有限公司 | Motherboard of display panel and production method thereof |
| CN101852951A (en) * | 2009-10-23 | 2010-10-06 | 友达光电股份有限公司 | Active assembly array substrate, display panel and display panel manufacturing method |
-
2011
- 2011-08-04 CN CN201110223377XA patent/CN102650762A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08262444A (en) * | 1995-03-23 | 1996-10-11 | Citizen Watch Co Ltd | Liquid crystal display device |
| CN101221326A (en) * | 2008-02-02 | 2008-07-16 | 友达光电股份有限公司 | Motherboard of display panel and production method thereof |
| CN101852951A (en) * | 2009-10-23 | 2010-10-06 | 友达光电股份有限公司 | Active assembly array substrate, display panel and display panel manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105842897A (en) * | 2016-05-30 | 2016-08-10 | 深圳市华星光电技术有限公司 | Liquid crystal display mother board and orientation method thereof |
| CN105842897B (en) * | 2016-05-30 | 2019-01-29 | 深圳市华星光电技术有限公司 | Motherboard of liquid crystal display and its alignment method |
| CN108521795A (en) * | 2018-04-04 | 2018-09-11 | 京东方科技集团股份有限公司 | Manufacture the device and method of the display base plate of liquid crystal display panel |
| CN108521795B (en) * | 2018-04-04 | 2021-08-06 | 京东方科技集团股份有限公司 | Apparatus and method for manufacturing display substrate of liquid crystal display panel |
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Application publication date: 20120829 |