CN101852951A - Active assembly array substrate, display panel and display panel manufacturing method - Google Patents
Active assembly array substrate, display panel and display panel manufacturing method Download PDFInfo
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- CN101852951A CN101852951A CN 201010197236 CN201010197236A CN101852951A CN 101852951 A CN101852951 A CN 101852951A CN 201010197236 CN201010197236 CN 201010197236 CN 201010197236 A CN201010197236 A CN 201010197236A CN 101852951 A CN101852951 A CN 101852951A
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Abstract
The invention discloses an active assembly array substrate, a display panel and a display panel manufacturing method. The display penal has a first area and a second area and mainly comprises the active assembly array substrate, an opposite substrate, a display medium which is positioned between the active assembly element substrate and the opposite substrate, and a conductive material. The active assembly element substrate comprises an active assembly array, a bonding pad which is positioned in the second area and a first alignment film which is covered on the first and second areas. The opposite substrate comprises an electrode layer and a second alignment film which covers the electrode layer. The ratio of the thickness of the first or second alignment film in the second area to the thickness of the first or second alignment film in the first area is more than and equal to or about equal to 0.43. The conductive material is positioned in the second area and corresponds to the bonding pad, and the conductive material is connected with the electrode layer and the bonding pad by penetrating through the first and second alignment films respectively.
Description
Technical field
The present invention is about a kind of structure and manufacture method of display panel, and particularly designs structure and manufacture method with the display panel of avoiding light leak relevant for a kind of at alignment film and associated component thereof.
Background technology
Known display panels process technique is in response to the product demand of narrow frame (slim bezel) or in order to promote the panel space utilization factor; usually can adjust the alignment film of upper substrate and infrabasal plate and the relative position of fluid sealant (sealant), to meet the demand of narrow frame.Yet, when dwindling frame, also must consider the setting and the issuable light leak problem of the signal path between the upper and lower base plate.
The alignment film of available liquid crystal display panel is with uniform thickness and size and be formed on the upper and lower base plate comprehensively.Yet, when the upper and lower base plate contraposition is offset,, and make the electrode layer of upper substrate to be conducted by the connection pad of the conduction material in the fluid sealant with infrabasal plate with the obstruct of possibility because of alignment film, perhaps cause Liquid Crystal Molecules Alignment unusual, and produce the light leak problem because alignment film misplaces.
In addition, also have in the prior art on the position of alignment film to form perforate, for the technology of conduction material conducting upper and lower base plate corresponding to the conduction material.Yet the light leak problem takes place in this kind design equally easily on position of opening, and influences display quality.
On the other hand, existing partly display panels can directly be produced on driving circuit on the active assembly array substrate, and is destroyed yet this driving circuit is subjected to the compressing of the separation material in the display panels easily after the display panels group is upright.For example, the upper and lower conductive layer in the driving circuit may be subjected to the crimp of separation material and be in contact with one another, and is short-circuited.
Summary of the invention
The invention provides a kind of display panel, it can be when meeting narrow frame design requirement, make the conduction material can not be subjected to stopping of alignment film and connection electrode layer and connection pad smoothly, and can guarantee that alignment film can provide effective orientation at conduction material joint, to avoid the display dielectric layer molecule, for example: liquid crystal molecule, arrangement cause light leak unusually.
The invention provides a kind of display panel, it can avoid the driving circuit on separation material extruding and the destruction active assembly array substrate.
The present invention provides a kind of active assembly array substrate that is applied to aforesaid display panel in addition.
The present invention also provides a kind of method for making of aforesaid display panel.
For specifically describing content of the present invention, at this a kind of display panel is proposed, it has a first area and a second area.Described display panel mainly is made up of an active assembly array substrate, a subtend substrate, a display medium and a conduction material.Active assembly array substrate comprises an active assembly array, is positioned at a connection pad and one first alignment film of second area.First alignment film is covered on first area and the second area, wherein the thickness of first alignment film in the first area is approximately greater than the thickness of first alignment film in the second area, and the thickness ratio of the thickness of first alignment film in the second area and first alignment film the first area in be greater than zero and approximately less than or approximate 0.43.In addition, subtend substrate and active assembly array substrate are oppositely arranged.The subtend substrate comprises an electrode layer and one second alignment film.Second alignment film is covered on the electrode layer, wherein the thickness of second alignment film in the first area is approximately greater than the thickness of second alignment film in the second area, and the thickness ratio of the thickness of second alignment film in the second area and second alignment film the first area in be greater than zero and approximately less than or approximate 0.43.Display medium is disposed between active assembly array substrate and the subtend substrate.The conduction material is disposed between active assembly array substrate and the subtend substrate, and conducts electricity that material is positioned at second area and corresponding to connection pad.The conduction material passes first alignment film and second alignment film respectively and connection electrode layer and connection pad.
In one embodiment, described first area comprises a viewing area, and second area is positioned at the periphery circuit region outside the viewing area, and active assembly array is positioned at the viewing area.
In one embodiment, described display panel more comprises a fluid sealant, and it is disposed in the periphery circuit region, and the conduction material is positioned at fluid sealant.
In one embodiment, described display medium is a liquid crystal layer.
In one embodiment, described display panel has more one the 3rd zone, and active assembly array substrate comprises that also one drive circuit is positioned at the 3rd zone, and first alignment film more covers the 3rd zone.The thickness of first alignment film in the 3rd zone is greater than the thickness of first alignment film in first area or the second area.
In one embodiment, the first area comprises a viewing area, and active assembly array is positioned at the viewing area, and the 3rd zone is positioned at the periphery circuit region outside the viewing area.
Propose a kind of active assembly array substrate in addition at this, it has a first area and a second area.Active assembly array substrate comprises an active assembly array, is positioned at a connection pad and one first alignment film of second area.First alignment film covers on first area and the second area, wherein the thickness of first alignment film in the first area is approximately greater than the thickness of first alignment film in the second area, and the thickness ratio of the thickness of first alignment film in the second area and first alignment film the first area in be greater than zero and approximately less than or approximate 0.43.
In one embodiment, the first area comprises a viewing area, and second area is positioned at the periphery circuit region outside the viewing area, and active assembly array is positioned at the viewing area.
In one embodiment, described active assembly array substrate also has one the 3rd zone, and active assembly array substrate comprises that also one drive circuit is positioned at the 3rd zone, and first alignment film also covers the 3rd zone.The thickness of first alignment film in the 3rd zone is approximately greater than the thickness of first alignment film in first area or the second area.
In one embodiment, the first area comprises a viewing area, and active assembly array is positioned at the viewing area, and the 3rd zone is positioned at the periphery circuit region outside the viewing area.
At this a kind of method for making of display panel is proposed also.At first, provide an active assembly array substrate.Have a first area and a second area on the active assembly array substrate, and active assembly array substrate comprises an active assembly array, is positioned at a connection pad and one first alignment film of second area.First alignment film is covered on first area and the second area, wherein the thickness of first alignment film in the first area is approximately greater than the thickness of first alignment film in the second area, and the thickness ratio of the thickness of first alignment film in the second area and first alignment film the first area in be greater than zero and approximately less than or approximate 0.43.Then, provide a subtend substrate, this subtend substrate and active assembly array substrate are oppositely arranged.Described subtend substrate comprises an electrode layer and one second alignment film.Described second alignment film is covered on the electrode layer, wherein the thickness of second alignment film in the first area is approximately greater than the thickness of second alignment film in the second area, and the thickness ratio of the thickness of second alignment film in the second area and second alignment film the first area in be greater than zero and approximately less than or approximate 0.43.Then, provide a display medium between active assembly array substrate and subtend substrate, and dispose a conduction material between active assembly array substrate and subtend substrate, the material that wherein conducts electricity is positioned at second area and corresponding to connection pad, and engage active assembly array substrate and subtend substrate, make that conducting electricity material passes first alignment film and second alignment film respectively and connection electrode layer and connection pad.
In one embodiment, the method that forms described first alignment film or second alignment film comprises by an alignment film printing plate (Asahi Photosensitive Resin printing plate, APR printing plate) with material transferring on active assembly array substrate or subtend substrate, to form first alignment film or second alignment film.
In one embodiment, described alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the distribution density of described a plurality of transfer printing projectioies of second area less than distribution density corresponding to described a plurality of transfer printing projectioies of first area.
In one embodiment, described alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the height of described a plurality of transfer printing projectioies of second area approximately less than height corresponding to described a plurality of transfer printing projectioies of first area.
In one embodiment, the method that forms described first alignment film or second alignment film comprises ink jet printing method.
In one embodiment, described first area comprises a viewing area, and described second area is positioned at the periphery circuit region outside the viewing area, and active assembly array is positioned at the viewing area.
In one embodiment, the method for making of described display panel also is included in and engages before active assembly array substrate and the subtend substrate, forms a fluid sealant in periphery circuit region, and wherein fluid sealant centers on the viewing area, and will conduct electricity material and be disposed in the fluid sealant.
In one embodiment, active assembly array substrate also has one the 3rd zone, and active assembly array substrate comprises that also one drive circuit is positioned at the 3rd zone, and first alignment film also covers the 3rd zone.The thickness of first alignment film in the 3rd zone is approximately greater than the thickness of first alignment film in first area or the second area.
In one embodiment, the first area comprises a viewing area, and active assembly array is positioned at the viewing area, and the 3rd zone is positioned at the periphery circuit region outside the viewing area.
In one embodiment, alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the distribution density of the transfer printing projection of first area approximately less than distribution density corresponding to the transfer printing projection in the 3rd zone.
In one embodiment, alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the height of the transfer printing projection of first area approximately less than height corresponding to the transfer printing projection in the 3rd zone.
Based on above-mentioned, owing to come thinly corresponding to the thickness of connection pad and the alignment film of conduction material than the thickness of other regional alignment film, the material that therefore conducts electricity can not be subjected to stopping of alignment film and can pass alignment film smoothly, with connection electrode layer and connection pad.In addition, this kind design can guarantee that the part of alignment film beyond conduction material joint keep completely, still can provide effective orientation, and not have the display dielectric layer molecule, and for example: Liquid Crystal Molecules Alignment causes the doubt of light leak unusually.
Moreover, for fear of the extruding of separation material the driving circuit on the active assembly array substrate is damaged, more can increase the thickness of first alignment film on the corresponding region.That is the thickness that makes pairing first alignment film of driving circuit is approximately greater than the thickness of first alignment film in other zone, provides the effect of buffering with the extruding to separation material, prevents that driving circuit is subjected to the extruding of separation material and is damaged.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the part sectioned view according to a kind of display panel of one embodiment of the invention;
Fig. 2 is the top view of the active assembly array substrate in the display panel of Fig. 1;
Fig. 3 A is a kind of part sectioned view that is used to form the alignment film printing plate of alignment film according to one embodiment of the invention;
Fig. 3 B is for being used to form the part sectioned view of the alignment film printing plate of alignment film according to the another kind of one embodiment of the invention;
Fig. 4 is for being used to form the part sectioned view of the alignment film printing plate of alignment film according to another of one embodiment of the invention;
Fig. 5 A-5D is respectively the partial enlarged drawing of connection pad and surrounding structure thereof;
Fig. 6 is the top view according to a kind of display panel of another embodiment of the present invention;
Fig. 7 is the part sectioned view of the display panel of Fig. 6 along A-A ' line;
Fig. 8 is a kind of part sectioned view that is used to form the alignment film printing plate of alignment film according to another embodiment of the present invention;
Fig. 9 is for being used to form the part sectioned view of the alignment film printing plate of alignment film according to the another kind of another embodiment of the present invention.
Wherein, Reference numeral:
100: display panel
102: the first area
104: second area
110: active assembly array substrate
112: active assembly array
114: connection pad
116: the first alignment films
120: the subtend substrate
122: electrode layer
124: the second alignment films
130: display medium
140: the conduction material
150: fluid sealant
H1: the thickness of first alignment film in the first area
H2: the thickness of first alignment film in the second area
T1: the thickness of second alignment film in the first area
T2: the thickness of second alignment film in the second area
300: the alignment film printing plate
312,314: the transfer printing projection
350: the alignment film printing plate
352,354: the transfer printing projection
400: the alignment film printing plate
412,414: the transfer printing projection
600: display panel
602: the first area
604: second area
606: the three zones
610: active assembly array substrate
612: active assembly array
614: connection pad
616: the first alignment films
620: the subtend substrate
624: the second alignment films
630: display medium
650: fluid sealant
660: driving circuit
670: separation material
800: the alignment film printing plate
812,814,816: the transfer printing projection
900: the alignment film printing plate
912,914,916: the transfer printing projection
Embodiment
The present invention designs the alignment film thickness of zones of different on the display panel, wherein corresponding to connection pad with the conduction material alignment film thickness less than other regional alignment film thickness, make active assembly array substrate with after the subtend substrate engages, the conduction material can pass the alignment film on active assembly array substrate and the subtend substrate respectively, with connection electrode layer and connection pad, form the signal path between active assembly array substrate and the subtend substrate.
Below enumerate embodiment design of display panel of the present invention and preparation method thereof is described.
Fig. 1 is the part sectioned view according to a kind of display panel of one embodiment of the invention, and Fig. 2 is the top view of the active assembly array substrate in the display panel of Fig. 1.As Fig. 1 and shown in Figure 2, display panel 100 mainly is made up of active assembly array substrate 110, subtend substrate 120, display medium 130 and conduction material 140.Active assembly array substrate 110 comprises active assembly array 112, at least one connection pad 114 (Fig. 1 illustrates a plurality of) and first alignment film 116.Display panel 100 has first area 102 and second area 104, and wherein the zone corresponding to connection pad 114 is put under second area 104, and all the other then are first area 102 partly.In addition, first alignment film 116 is covered on first area 102 and the second area 104.
In the present embodiment, as shown in Figure 2, connection pad 114 for example is the transmission pad (transfer pad) that is positioned at the periphery circuit region of active assembly array substrate 110 peripheries, its viewing area around active assembly array substrate 110 central authorities is provided with, in order to transmit signal between active assembly array substrate 110 and subtend substrate 120.112 viewing areas that are positioned at assembly array substrate 110 central authorities of active assembly array.In other words, the defined first area 102 of present embodiment comprises the viewing area, and second area 104 is positioned at periphery circuit region.
Yet the first area 102 of present embodiment and the position of second area 104 only are usefulness for example, and can be different along with design requirement.For example, the division of first area 102 and second area 104 can be depending on the position of connection pad 114, i.e. different along with connection pad 114 functions and position, first area 102 and second area 104 may be positioned at the viewing area simultaneously, or are positioned on other the position.
Refer again to Fig. 1 and 2, subtend substrate 120 is oppositely arranged with active assembly array substrate 110, and wherein subtend substrate 120 comprises an electrode layer 122 and one second alignment film 124.Electrode layer 122 for example is as shared electrode, and second alignment film 124 is covered on the electrode layer 122.Display medium 130 is disposed between active assembly array substrate 110 and the subtend substrate 120.In addition, conduction material 140 also is disposed between active assembly array substrate 110 and the subtend substrate 120, and conducts electricity that material 140 is positioned at second area and corresponding to connection pad 114.
Present embodiment does not limit the kenel of display panel 100, and wherein along with the difference of display medium 130, display panel 100 has different mechanism of action.For example, display medium 130 can be liquid crystal material or other has the material of orientation demand equally.When display medium 130 was liquid crystal material, then display panel 100 was called display panels.Following embodiment will describe as example with display panels, yet those skilled in the art will be understood that the design concept of those embodiment still can reasonably be applied in the display panel of other type.
In addition, in the present embodiment, active assembly array substrate 110 for example is a thin-film transistor array base-plate, and subtend substrate 120 for example is the colored optical filtering substrates with chromatic filter layer 126 and black matrix 128.In other embodiments, active assembly array substrate 110 also can be to have integrated chromatic filter layer 126 in the COA substrate on the active assembly array 112 or further integrated the BOA substrate of black matrix 128 on active assembly array 112, or has integrated the AOC substrate of active assembly array 112 on chromatic filter layer 126.At this moment, must not make chromatic filter layer on the subtend substrate 120.
Refer again to Fig. 1 and 2, for after making active assembly array substrate 110 and subtend substrate 120 engaging, conduction material 140 can pass first alignment film 116 of active assembly array substrate 110 and second alignment film 124 on the subtend substrate 120 respectively, with connection electrode layer 122 and connection pad 114, present embodiment designs first alignment film 116 of zones of different on the display panel 100 and the thickness of second alignment film 124, wherein corresponding to the thickness of first alignment film 116 of connection pad 114 and conduction material 140 and second alignment film 124 less than first alignment film 116 in other zone and the thickness of second alignment film 124.
More specifically, present embodiment will reduce corresponding to connection pad 114 and first alignment film 116 of conduction material 140 and the thickness of second alignment film 124, but be not to remove fully, make active assembly array substrate 110 with after subtend substrate 120 engages, conduction material 140 can pass first alignment film 116 and second alignment film 124 smoothly, and connection electrode layer 122 and connection pad 114.Wherein, the ratio of the thickness H1 of first alignment film 116 in the second area 104 in the thickness H2 of first alignment film 116 of (that is, corresponding to connection pad 114) and the first area 102 is greater than zero, and approximately less than or approximate 0.43.If estimate with existing common alignment film, first alignment film 116 in the first area 102 is kept existing thickness, its thickness H1, for example: approximately greater than or approximate 700 dusts (angstrom), and the thickness H2 of first alignment film 116 in the second area 104 should be the thickness of first alignment film 116 in the first area 102 and is multiplied by aforementioned ratio, 0.43 to be example, promptly for example: approximately less than or approximate 300 dusts.Similarly, the ratio of the thickness T 1 of second alignment film 124 in the thickness T 2 of second alignment film 124 in the second area 104 and the first area 102 be greater than zero, and approximately less than or approximate 0.43.If estimate with identical principle, second alignment film 124 in the first area 102 is kept existing thickness, its thickness T 1, for example: approximately greater than or approximate 700 dusts, and the thickness T 2 of second alignment film 124 in the second area 104 should be the thickness of first alignment film 116 in the first area 102 and is multiplied by aforementioned ratio, 0.43 to be example, promptly approximately less than or approximate 300 dusts.
In addition, the display panel 100 of present embodiment more comprises a fluid sealant 150, it is disposed in the periphery circuit region of display panel 100, in order to around the viewing area of display panel 100, and display medium 130 is sealed between active assembly array substrate 110 and the subtend substrate 120.In the present embodiment, described conduction material 140 for example is to be positioned at fluid sealant 150.In other embodiment, conduction material 140 can be positioned at outside the fluid sealant 150.Conduction material 140 can be any form, as elargol, conducting particles (Au ball), conductive projection (transfer member) etc.That is conduction material 140 can be made by conductive material, or is megohmite insulant inside, and this megohmite insulant surface coverage layer of conductive material.Present embodiment does not limit the composition of conduction material 140.
Moreover the present invention does not limit the position of conduction material, and except the conduction material 140 that is positioned at fluid sealant 150 that present embodiment is carried, the conduction material of other embodiment can also be positioned on any possible position.Position as aforesaid first area 102 and second area 104 can be different along with design requirement, and the position of conduction material 140 can be depending on the position of connection pad 114 together with the division of first area 102 and second area 104.That is along with the difference of connection pad 114 positions, conduction material 140 may be positioned at the viewing area, and is not positioned at fluid sealant 150.
Hold above-mentioned, the method for making of the display panel of previous embodiment is that 120 groups of described active assembly array substrate 110 and subtend substrates is upright, and between forms after the display medium 130, make conduction material 140 can pass first alignment film 116 of active assembly array substrate 110 and second alignment film 124 on the subtend substrate 120 respectively, with connection electrode layer 122 and connection pad 114, form the signal path between active assembly array substrate 110 and the subtend substrate 120.In addition, before engaging active assembly array substrate 110 and subtend substrate 120, comprise more forming fluid sealant 150 in the periphery circuit region of display panel 100 that make fluid sealant 150 around the viewing area, the material 140 that wherein conducts electricity is disposed in the fluid sealant 150.
Present embodiment in order to the method that forms first alignment film 116 or second alignment film 124 for example be alignment film printing plate by the resin material with material transferring on active assembly array substrate 110 or subtend substrate 120, have first alignment film 116 of different-thickness or have second alignment film 124 of different-thickness with formation.More specifically, present embodiment can be by the design to the surface micro-structure of alignment film printing plate, reaches first alignment film 116 that forms different-thickness in one print steps simultaneously or the effect of second alignment film 124.
Fig. 3 A is a kind of part sectioned view that is used to form the alignment film printing plate of first alignment film 116 or second alignment film 124 according to one embodiment of the invention.As shown in Figure 3A, alignment film printing plate 300 surfaces have a plurality of transfer printings projection 312 and 314, and corresponding to the height of the transfer printing projection 314 of second area 104 approximately less than height corresponding to the transfer printing projection 312 of first area 102.The transfer printing of indication herein projection 312 is meant relative difference in height with 314 height relationships, wherein can change by the substrate height of control transfer printing projection 312 and 314 bottoms, being about to transfer printing projection 312 and 314 is arranged on the plane of differing heights, or, adjust difference in height by the length variations of transfer printing projection 312 and 314 own.
Certainly, the present invention also can cause aforementioned difference in height merely by the length that changes transfer printing projection itself.
Fig. 3 B is the another kind of part sectioned view that is used to form the alignment film printing plate of first alignment film 116 or second alignment film 124.Different with aforementioned alignment film printing plate 300 is, the alignment film printing plate 350 of present embodiment is that transfer printing projection 352 and 354 is provided with at grade, and by transfer printing projection 352 and 354 itself have different length form corresponding to the first area 102 and the transfer printing of the differing heights of second area 104 protruding 352 and 354, wherein corresponding to the height of the transfer printing projection 354 of second area 104 approximately less than height corresponding to the transfer printing projection 352 of first area 102.This alignment film printing plate 350 can reach and aforementioned alignment film printing plate 300 similar printing effects, promptly forms first alignment film 116 or second alignment film 124 of different-thickness in one print steps simultaneously.
Fig. 4 is for being used to form the part sectioned view of the alignment film printing plate of first alignment film 116 or second alignment film 124 according to the another kind of one embodiment of the invention.As shown in Figure 4, alignment film printing plate 400 surfaces have a plurality of transfer printings projection 412 and 414, and corresponding to the distribution density of the transfer printing projection 414 of second area 104 approximately less than distribution density corresponding to the transfer printing projection 412 of first area 102.In the present embodiment, for example be 200/unit area corresponding to the distribution density of the transfer printing projection 412 of first area 102, and for example be 100/unit area, but be not limited thereto corresponding to the distribution density of the transfer printing projection 414 of second area 104.
Fig. 3 and Fig. 4 adjust the amount that is built-up in the material on the alignment film printing plate when printing by the height and the distribution density of the surface micro-structure that changes the alignment film printing plate respectively, make that the material that is needed on the second area 104 is less, and then form the relatively thin alignment film of thickness.
Certainly, the method that the present invention has first alignment film 116 of different-thickness in order to formation or has second alignment film 124 of different-thickness is not limited to this, can also adopt other to make first alignment film 116 or second alignment film 124, give unnecessary details no longer one by one herein such as ink jet printing method, micro-photographing process or other suitable processing procedure, dry film attaching or above-mentioned combination.
In addition, under desirable situation, the engaging zones that the second area 104 described in the previous embodiment only need be contained connection pad 114 and conduction material 140 gets final product.Yet; consider the degree of accuracy and the issuable bit errors of printing process or other processing procedure; usually the size of second area 104 can be set at approximately greater than or approximate the size of connection pad 114; can pass first alignment film 116 and second alignment film 124 in the second area 104 smoothly to guarantee to conduct electricity material 140, and connection electrode layer 122 and connection pad 114.As scheme shown in the partial enlarged drawing of l, the size of second area 104 is greater than the size of connection pad 114, and contains complete connection pad 114.In addition, the shape of second area 104 also can be different along with the shape of connection pad 114.Just showed multiple difform second area 104 in the connection pad that Fig. 5 A-5D is illustrated and the partial enlarged drawing of surrounding structure thereof.On processing procedure,, then can adjust the arrangement of microstructure in response to difform second area 104 if select to adopt the alignment film printing plate to form alignment film.If adopt micro-photographing process then can change cover curtain pattern, to form difform second area 104.
In addition, please in those embodiment, connection pad 114 the trellis pattern can be designed to, increasing conductive area, and the effect that engages of conduction material 140 and connection pad 114 can be improved simultaneously with reference to Fig. 1 and Fig. 5 A-5D.
Certainly, the present invention does not limit the feature such as shape, function, position, size of connection pad.Such as be applied in the display panel, and and need be undertaken by the conduction material connection pad of bridge joint between the subtend substrate, all can adopt technology of the present invention.That is, on corresponding to the position of connection pad, form the relatively thin both alignment layers of thickness,, and connection pad is connected to the circuit of subtend substrate so that the conduction material can pass alignment film smoothly.
Except structure and processing procedure that previous embodiment disclosed, also may exist in the display panel of the present invention in order to keep the separation material (spacer) of gap of liquid crystal cell (cell gap), and may directly be manufactured with driving circuit on the periphery circuit region of active assembly array substrate, as assemblies such as gate drivers.Be subjected to the compressing of separation material and destroyed for fear of this driving circuit, the present invention can also increase the thickness of first alignment film of corresponding this driving circuit, and the effect of buffering is provided with the extruding to separation material.
Fig. 6 is the top view according to a kind of display panel of another embodiment of the present invention, and Fig. 7 is the part sectioned view of the display panel of Fig. 6 along A-A ' line.Accept the content of previous embodiment, present embodiment is only stated with regard to the distinct portions of this two embodiment, yet the described content of previous embodiment all can be incorporated in the present embodiment, as a reference.
As Fig. 6 and shown in Figure 7, except connection pad 614, the display panel 600 of present embodiment has more one drive circuit 660 in periphery circuit region, and it comprises parts such as gate drivers and backguy.One the 3rd zone 606 corresponding to this driving circuit 660 is more divided at the edge of display panel 600.In other words, display panel 600 has first area 602, second area 604 and the 3rd zone 606, and wherein active assembly array 612 is positioned at first area 602 (for example being the viewing area).Connection pad 614 for example is the transmission pad (transfer pad) that is positioned at the periphery circuit region of display panel 600 peripheries, its viewing area around display panel 600 central authorities is provided with and is positioned at second area 604, in order to transmit signal between active assembly array substrate 610 and subtend substrate 620.Driving circuit 660 is positioned at the 3rd zone 606.First alignment film 616 and second alignment film 624 cover first area 602, second area 604 and the 3rd zone 606.
The compressing that driving circuit 660 on active assembly array substrate 610 is subjected to separation material 670 is and destroyed, and the present embodiment increase is positioned at the thickness of first alignment film 616 in the 3rd zone 606, and the effect of buffering is provided with the extruding to separation material 670.In the present embodiment, be positioned at the thickness of first alignment film 616 in second area 604, first area 602 and the 3rd zone 606, comply with by little and big arrangement, for example be respectively approximately less than 300 dusts, approximate 900 dusts and approximately greater than 1500 dusts.
More specifically, as shown in Figure 6, because present embodiment has increased the thickness of first alignment film 616 in the 3rd zone 606, therefore between separation material above the driving circuit 660 670 and driving circuit 660, there is the first thicker alignment film 616, the extruding power that helps the suffered separation material 670 of buffering drive circuit 660, and make the upper and lower conductive layer in the driving circuit 660 be unlikely to be in contact with one another because of distortion, be short-circuited, or other partial structure of driving circuit 660 wrecks because of distortion.
Present embodiment in order to the method that forms first alignment film 616 or second alignment film 624 as shown in the previous embodiment, can by the alignment film printing plate of resin material with material transferring on active assembly array substrate 610 or subtend substrate 620, have first alignment film 616 of different-thickness or have second alignment film 624 of different-thickness with formation.More specifically, present embodiment can be by the design to the surface micro-structure of alignment film printing plate, reaches first alignment film 616 that forms different-thickness in one print steps simultaneously or the effect of second alignment film 624.
Fig. 8 is a kind of part sectioned view that is used to form the alignment film printing plate of first alignment film 616 according to one embodiment of the invention.As shown in Figure 8, because first alignment film 616 of present embodiment has three kinds of thickness, therefore alignment film printing plate 800 surfaces have a plurality of transfer printing projectioies 812,814 and 816 of the differing heights that corresponds respectively to first area 602, second area 604 and the 3rd zone 606, wherein corresponding to the height of the transfer printing projection 814 of second area 604 approximately less than height corresponding to the transfer printing projection 812 of first area 602, and corresponding to the height of the transfer printing projection 816 in the 3rd zone 606 approximately greater than height corresponding to the transfer printing projection 812 of first area 602.
Consider the embodiment that earlier figures 3A and Fig. 3 B are illustrated in light of actual conditions, the transfer printing projection 812 and 814 of present embodiment is arranged on the plane of differing heights, and has different relative heights.Certainly, the present invention also can be disposed at transfer printing projection 812 and 814 on the same plane shown in Fig. 3 B,, causes aforementioned difference in height, and reaches similar printing effect by the length that changes transfer printing projection itself with merely.
In addition, Fig. 9 is for being used to form the part sectioned view of the alignment film printing plate of first alignment film 616 or second alignment film 624 according to the another kind of one embodiment of the invention.As shown in Figure 9, alignment film printing plate 900 surfaces have a plurality of transfer printing projectioies 912,914 and 916 that correspond respectively to first area 602, second area 604 and the 3rd zone 606, wherein corresponding to the distribution density of the transfer printing projection 914 of second area 604 approximately less than distribution density corresponding to the transfer printing projection 912 of first area 602, and corresponding to the distribution density of the transfer printing projection 916 in the 3rd zone 606 approximately greater than distribution density corresponding to the transfer printing projection 612 of first area 602.
Fig. 8 and Fig. 9 adjust the amount that is built-up in the material on the alignment film printing plate when printing by the height and the distribution density of the surface micro-structure that changes the alignment film printing plate respectively, make that to be needed on the material that the material on the second area 604 is needed on the first area 602 few, and make that to be needed on the material that the material on the 3rd zone 606 is needed on the first area 602 many, and then form first alignment film 616 with variation in thickness.
Certainly, this enforcement utilizes the method that has first alignment film 616 of different-thickness or have second alignment film 624 of different-thickness with formation to be not limited to this, can also adopt other to make first alignment film 616 or second alignment film 624, give unnecessary details no longer one by one herein such as ink jet printing method, micro-photographing process or other suitable processing procedure, dry film attaching or above-mentioned combination.
In addition, if only focus on the problem that separation material may destroy driving circuit that solves, whether material is subjected to stopping of alignment film and can't connection electrode layer and connection pad and do not consider to conduct electricity, then in of the present invention one embodiment that does not illustrate, also can only increase the thickness of first alignment film in the 3rd zone, and make first alignment film (or second alignment film) in first area and the second area keep identical in fact thickness.So, relevant detailed structure and previous embodiment are similar, repeat no more herein.
In sum, the present invention designs the alignment film thickness of zones of different on the display panel, wherein corresponding to connection pad with the conduction material alignment film thickness less than other regional alignment film thickness, make active assembly array substrate with after the subtend substrate engages, the conduction material can pass the alignment film on active assembly array substrate and the subtend substrate respectively, with connection electrode layer and connection pad, form the signal path between active assembly array substrate and the subtend substrate.Owing to, therefore can not take place, and make the problem that electrode layer can't be conducted by conduction material and connection pad because alignment film intercepts corresponding to the thinner thickness of alignment film of connection pad with the conduction material.In addition, this kind design can guarantee that the part of alignment film beyond conduction material joint keep completely, and does not have the display dielectric layer molecule, and for example: Liquid Crystal Molecules Alignment causes the doubt of light leak unusually.On the other hand, extruding for fear of separation material damages the driving circuit on the active assembly array substrate, the present invention can increase the thickness corresponding to first alignment film of driving circuit, provide the effect of buffering with extruding, prevent that driving circuit is subjected to the extruding of separation material and is damaged separation material.
Though the present invention with embodiment openly as above; but it is not in order to limit the present invention; any the technical staff in the technical field; without departing from the spirit and scope of the present invention; when doing a little change and modification, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (22)
1. a display panel has a first area and a second area, it is characterized in that this display panel comprises:
One active assembly array substrate comprises:
One active assembly array;
One connection pad is positioned at this second area;
One first alignment film, be covered on this first area and this second area, the thickness of this first alignment film in this first area is approximately greater than the thickness of this first alignment film in this second area, and the thickness ratio of the thickness of this first alignment film in this second area and this first alignment film this first area in be greater than zero and approximately less than or approximate 0.43;
One subtend substrate is oppositely arranged with this active assembly array substrate, and this subtend substrate comprises:
One electrode layer;
One second alignment film, be covered on this electrode layer, the thickness of this second alignment film in this first area is approximately greater than the thickness of this second alignment film in this second area, and the thickness ratio of the thickness of this second alignment film in this second area and this second alignment film this first area in be greater than zero and approximately less than or approximate 0.43;
One display medium is disposed between this active assembly array substrate and this subtend substrate; And
One conduction material is disposed between this active assembly array substrate and this subtend substrate, and this conduction material is positioned at this second area and corresponding to this connection pad, and this conduction material passes this first alignment film respectively and is connected this electrode layer and this connection pad with this second alignment film.
2. display panel as claimed in claim 1 is characterized in that this first area comprises a viewing area, and this second area is positioned at an outer periphery circuit region of this viewing area, and this active assembly array is positioned at this viewing area.
3. display panel as claimed in claim 2 is characterized in that, also comprises a fluid sealant, be disposed in this periphery circuit region, and this conduction material is positioned at sealing glue.
4. display panel as claimed in claim 1 is characterized in that, this display medium is a liquid crystal layer.
5. display panel as claimed in claim 1, it is characterized in that, also has one the 3rd zone, this active assembly array substrate comprises that also one drive circuit is positioned at the 3rd zone, and this first alignment film also covers the 3rd zone, and wherein the thickness of this first alignment film in the 3rd zone is approximately greater than the thickness of this first alignment film in this first area or this second area.
6. display panel as claimed in claim 5 is characterized in that this first area comprises a viewing area, and this active assembly array is positioned at this viewing area, and the 3rd zone is positioned at an outer periphery circuit region of this viewing area.
7. an active assembly array substrate has a first area and a second area, it is characterized in that this active assembly array substrate comprises:
One active assembly array;
One connection pad is positioned at this second area; And
One first alignment film, cover on this first area and this second area, the thickness of this first alignment film in this first area is approximately greater than the thickness of this first alignment film in this second area, and the thickness ratio of the thickness of this first alignment film in this second area and this first alignment film this first area in be greater than zero and approximately less than or approximate 0.43.
8. active assembly array substrate as claimed in claim 7 is characterized in that this first area comprises a viewing area, and this second area is positioned at the periphery circuit region outside this viewing area, and this active assembly array is positioned at this viewing area.
9. active assembly array substrate as claimed in claim 7, it is characterized in that, also has one the 3rd zone, this active assembly array substrate comprises that also one drive circuit is positioned at the 3rd zone, and this first alignment film also covers the 3rd zone, and wherein the thickness of this first alignment film in the 3rd zone is approximately greater than the thickness of this first alignment film in this first area or this second area.
10. active assembly array substrate as claimed in claim 9 is characterized in that this first area comprises a viewing area, and this active assembly array is positioned at this viewing area, and the 3rd zone is positioned at the periphery circuit region outside this viewing area.
11. the method for making of a display panel is characterized in that, comprising:
One active assembly array substrate is provided, have a first area and a second area on this active assembly array substrate, and this active assembly array substrate comprises:
One active assembly array;
One connection pad is positioned at this second area;
One first alignment film, be covered on this first area and this second area, the thickness of this first alignment film in this first area is approximately greater than the thickness of this first alignment film in this second area, and the thickness ratio of the thickness of this first alignment film in this second area and this first alignment film this first area in be greater than zero and approximately less than or approximate 0.43;
One subtend substrate is provided, and this subtend substrate and this active assembly array substrate are oppositely arranged, and this subtend substrate comprises:
One electrode layer;
One second alignment film, be covered on this electrode layer, the thickness of this second alignment film in this first area is approximately greater than the thickness of this second alignment film in this second area, and the thickness ratio of the thickness of this second alignment film in this second area and this second alignment film this first area in be greater than zero and approximately less than or approximate 0.43;
Provide a display medium between this active assembly array substrate and this subtend substrate; And
Configuration one conduction material is between this active assembly array substrate and this subtend substrate, this conduction material is positioned at this second area and corresponding to this connection pad, and engage this active assembly array substrate and this subtend substrate, make this conduction material pass this first alignment film respectively and be connected this electrode layer and this connection pad with this second alignment film.
12. the method for making of display panel as claimed in claim 11, it is characterized in that, the method that forms this first alignment film or this second alignment film comprise by an alignment film printing plate with material transferring on this active assembly array substrate or this subtend substrate, to form this first alignment film or this second alignment film.
13. the method for making of display panel as claimed in claim 12, it is characterized in that, this alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the distribution density of those transfer printing projectioies of this second area less than distribution density corresponding to those transfer printing projectioies of this first area.
14. the method for making of display panel as claimed in claim 12, it is characterized in that, this alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the height of those transfer printing projectioies of this second area less than height corresponding to those transfer printing projectioies of this first area.
15. the method for making of display panel as claimed in claim 11 is characterized in that, the method that forms this first alignment film or this second alignment film comprises ink jet printing method.
16. the method for making of display panel as claimed in claim 11 is characterized in that, this first area comprises a viewing area, and this second area is positioned at the periphery circuit region outside this viewing area, and this active assembly array is positioned at this viewing area.
17. the method for making of display panel as claimed in claim 16, it is characterized in that, also be included in and engage before this active assembly array substrate and this subtend substrate, form a fluid sealant in this periphery circuit region, sealing glue is around this viewing area, and should conduct electricity material and be disposed in the sealing glue.
18. the method for making of display panel as claimed in claim 11, it is characterized in that, this active assembly array substrate also has one the 3rd zone, this active assembly array substrate comprises that also one drive circuit is positioned at the 3rd zone, and this first alignment film more covers the 3rd zone, and wherein the thickness of this first alignment film in the 3rd zone is approximately greater than the thickness of this first alignment film in this first area or this second area.
19. the method for making of display panel as claimed in claim 18 is characterized in that, this first area comprises a viewing area, and this active assembly array is positioned at this viewing area, and the 3rd zone is positioned at the periphery circuit region outside this viewing area.
20. the method for making of display panel as claimed in claim 18, it is characterized in that, the method that forms this first alignment film or this second alignment film comprise by an alignment film printing plate with material transferring on this active assembly array substrate or this subtend substrate, to form this first alignment film or this second alignment film.
21. the method for making of display panel as claimed in claim 20, it is characterized in that, this alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the distribution density of those transfer printing projectioies of this first area approximately less than distribution density corresponding to those transfer printing projectioies in the 3rd zone.
22. the method for making of display panel as claimed in claim 20, it is characterized in that, this alignment film printing plate surface has a plurality of transfer printing projectioies, and corresponding to the height of those transfer printing projectioies of this first area approximately less than height corresponding to those transfer printing projectioies in the 3rd zone.
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| CN 201010197236 CN101852951B (en) | 2009-10-23 | 2010-06-02 | Active assembly array substrate, display panel and display panel manufacturing method |
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| CN200910205445.2 | 2009-10-23 | ||
| CN200910205445A CN101673008A (en) | 2009-10-23 | 2009-10-23 | Active element array substrate, display panel and method for fabricating same |
| CN 201010197236 CN101852951B (en) | 2009-10-23 | 2010-06-02 | Active assembly array substrate, display panel and display panel manufacturing method |
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| CN201210433908.2A Division CN102955295B (en) | 2009-10-23 | 2010-06-02 | Active component array substrate, display panel and fabrication method of display panel |
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| CN101852951B CN101852951B (en) | 2013-05-22 |
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| CN106707625A (en) * | 2017-01-23 | 2017-05-24 | 武汉华星光电技术有限公司 | Alignment film printing plate and manufacturing method thereof |
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