CN210430134U

CN210430134U - Can avoid electroplating electronic components metal of bonding die and draw forth end

Info

Publication number: CN210430134U
Application number: CN201921731971.8U
Authority: CN
Inventors: 张甦; 龚建; 杨涛; 董福兴; 仇利民
Original assignee: Semitel Electronics Co Ltd
Current assignee: Semitel Electronics Co Ltd
Priority date: 2019-10-16
Filing date: 2019-10-16
Publication date: 2020-04-28
Anticipated expiration: 2029-10-16

Abstract

The utility model discloses an electronic components metal of can avoiding electroplating the bonding die draws forth end, this metal draws forth end includes the substrate, this substrate is disk structure or L shape sheet structure, the surface of this substrate is equipped with anti-sticking structure, this anti-sticking structure is for interweaving the grid structure that forms by horizontal slot and vertical slot, perhaps for drawing the cloth point structure that the bump of the substrate surface of end constitutes by a plurality of evenly distributed in the metal, or for the graphic structure by the soldering tin groove formation that sets up according to soldering tin pattern design, horizontal slot and vertical slot in the anti-sticking structure are followed to the plating solution, perhaps between the bump, perhaps the soldering tin groove flows. The utility model discloses a structural design avoids the emergence of bonding die phenomenon to guarantee going on smoothly of electroplating process, guarantee the product quality after electroplating, very big reduction the product disability rate.

Description

Can avoid electroplating electronic components metal of bonding die and draw forth end

Technical Field

The utility model relates to an electronic components technical field, in particular to can avoid electroplating the electronic components metal of bonding die and draw forth the end.

Background

Electronic components often use metal terminals as electrode terminals, usually copper, copper alloy or other metals, and then a plating process is used to form a solderable plating on the metal terminal substrate, so that subsequent processes can be successfully soldered to a circuit board or a decorative plating can be formed.

However, because the volume and the surface area of the metal leading-out terminal base materials are small, the metal leading-out terminal base materials are easy to stick together and cannot be separated (commonly called as lamination) during electroplating, so that scrapping is caused, electroplating liquid cannot easily enter between the metal leading-out terminal base materials, an electroplating process cannot be realized, an electroplated layer meeting requirements cannot be obtained, and a product is poor.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, an object of the utility model is to provide an electronic components metal leading-out end that can avoid electroplating the bonding die avoids the emergence of bonding die phenomenon through structural design to guarantee going on smoothly of electroplating process, guarantee the product quality after electroplating, very big reduction the product disability rate.

For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes: the utility model provides an electronic components metal of can avoiding electroplating the bonding die draws forth end, this metal draws forth end includes the substrate, this substrate is disk structure or L shape sheet structure, the surface of this substrate is equipped with anti-sticking structure, this anti-sticking structure is the grid structure that is interweaved by horizontal slot and vertical slot and forms, or for the cloth point structure that the bump that the substrate surface of end constitutes is drawn forth to the metal by a plurality of evenly distributed, or for the graphic structure who forms by soldering tin groove that sets up according to the design of soldering tin pattern, horizontal slot and vertical slot in anti-sticking structure are followed to the plating solution, or between the bump, or the soldering tin groove flows.

Furthermore, if the anti-sticking structure is a grid structure formed by interweaving the transverse grooves and the longitudinal grooves, the cross sections of the transverse grooves and the longitudinal grooves are both V-shaped structures, and the depths of the transverse grooves and the longitudinal grooves are different.

Furthermore, if the anti-sticking structure is a grid structure formed by interweaving the transverse grooves and the longitudinal grooves, the cross sections of the transverse grooves are of a V-shaped structure, and the cross sections of the longitudinal grooves are of a rectangular structure with an upper opening.

Furthermore, if the anti-sticking structure is a point distribution structure formed by a plurality of salient points uniformly distributed on the surface of the metal leading-out end, the salient points are arc-shaped salient point structures.

Further, if the anti-sticking structure is a pattern structure formed by the solder grooves according to the solder pattern design, the depth of the solder grooves is consistent with the solder height of the solder pattern design.

The utility model has the advantages that:

if the anti-sticking structure in the utility model is a grid structure formed by interweaving the transverse grooves and the longitudinal grooves, the electroplating solution can flow along the transverse grooves and the longitudinal grooves; the transverse grooves and the longitudinal grooves can destroy the surface tension of the electroplating solution, and the continuous flow of the electroplating solution is matched, so that the adhesion between the base materials of the metal leading-out end is avoided; moreover, the different depths or the different cross-sectional structures between the transverse grooves and the longitudinal grooves can also bring about the tension change of the electroplating solution in the flowing process, thereby further achieving the anti-sticking effect.

The utility model provides an anti-sticking structure if for drawing forth the cloth point structure that the bump that holds substrate surface constitutes by a plurality of evenly distributed in the metal, then the bump not only can draw forth the metal that is close to hold the substrate separation to a certain extent, can make the plating solution flow between the bump of distribution moreover, also can destroy the surface tension of plating solution, prevents the emergence of bonding die phenomenon.

The utility model provides an anti-sticking structure if for the graphic structure who is formed by soldering tin groove according to the design of soldering tin pattern sets up, the soldering tin groove can be used for subsequent soldering tin to control the soldering tin volume, prevent tin overflow, can realize the plating solution again simultaneously and flow wherein, destroy the surface tension of plating solution, in order to prevent the bonding die.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.

Fig. 2 is a front view of fig. 1.

Fig. 3 is a schematic structural diagram of embodiment 3 of the present invention.

Fig. 4 is a front view of fig. 3.

FIG. 5 is a schematic structural diagram of embodiment 4 of the present invention

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

Example 1

As shown in fig. 1 and fig. 2, a metal leading-out terminal of an electronic component capable of avoiding electroplating adhesive sheets, the metal leading-out terminal includes a substrate 1, the substrate 1 is in a wafer structure, an anti-sticking structure is arranged on the surface of the substrate 1, and the anti-sticking structure is a grid structure formed by interweaving a transverse groove 11 and a longitudinal groove 12; the cross section of the transverse groove 11 is of a V-shaped structure, and the cross section of the longitudinal groove 12 is of a rectangular structure with an upper opening; during electroplating, the electroplating solution flows along the transverse grooves 11 and the longitudinal grooves 12 in the anti-adhesive structure.

Example 2

A can avoid the metal leading-out terminal of the electronic component which electroplates the sticking piece, the metal leading-out terminal includes the substrate, the substrate is the disk structure, the surface of the substrate has anti-sticking structures, the anti-sticking structure is the grid structure interweaved by horizontal slot and longitudinal slot; the cross sections of the transverse grooves and the longitudinal grooves are both V-shaped structures, and the depths of the transverse grooves and the longitudinal grooves are different; during electroplating, the electroplating solution flows along the lateral and longitudinal grooves in the anti-adhesion structure.

Example 3

As shown in fig. 3 and 4, the metal leading-out terminal of the electronic component capable of avoiding electroplating adhesive sheets comprises a substrate 1, wherein the substrate 1 is in an L-shaped sheet structure, the surface of the substrate 1 is provided with an anti-sticking structure, and the anti-sticking structure is a grid structure formed by interweaving a transverse groove 11 and a longitudinal groove 12; the cross section of the transverse groove 11 is of a V-shaped structure, and the cross section of the longitudinal groove 12 is of a rectangular structure with an upper opening; during electroplating, the electroplating solution flows along the transverse grooves 11 and the longitudinal grooves 12 in the anti-adhesive structure.

Example 4

As shown in fig. 5, the metal leading-out end of the electronic component capable of avoiding electroplating adhesive sheets comprises a substrate 1, wherein the substrate 1 is in a wafer structure, an anti-sticking structure is arranged on the surface of the substrate 1, the anti-sticking structure is a point distribution structure formed by a plurality of salient points 11 uniformly distributed on the surface of the substrate of the metal leading-out end, and the salient points 11 are arc-shaped salient point structures; during electroplating, electroplating solution flows among the salient points distributed on the surface of the metal leading-out terminal base material.

Example 5

The metal leading-out end of the electronic component capable of avoiding electroplating adhesive sheets comprises a substrate, wherein the substrate is in a wafer structure, the surface of the substrate is provided with an anti-sticking structure, the anti-sticking structure is a graphic structure formed by soldering tin grooves according to the design of soldering tin patterns, and the depth of the soldering tin grooves is consistent with the soldering tin height designed by the soldering tin patterns; during electroplating, the electroplating solution flows along the soldering tin groove in the anti-sticking structure.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. The utility model provides a can avoid electroplating the electronic components metal of bonding die and draw forth end which characterized in that: this end is drawn forth to metal includes the substrate, and this substrate is disk structure or L shape sheet structure, and the surface of this substrate is equipped with anti-sticking structure, and this anti-sticking structure is the grid structure that is interweaved by horizontal slot and vertical slot and forms, or for the cloth point structure that the bump that comprises the substrate surface that the end was drawn forth to metal by a plurality of evenly distributed, or for the graphic structure who forms by soldering tin groove formation that sets up according to soldering tin pattern design, the plating solution is along horizontal slot and vertical slot in the anti-sticking structure, or between the bump, or the soldering tin groove flows.

2. The metal leading-out terminal of the electronic component capable of avoiding the electroplating of the adhesive sheet as claimed in claim 1, which is characterized in that: if the anti-sticking structure is a grid structure formed by interweaving the transverse grooves and the longitudinal grooves, the cross sections of the transverse grooves and the longitudinal grooves are both V-shaped structures, and the depths of the transverse grooves and the longitudinal grooves are different.

3. The metal leading-out terminal of the electronic component capable of avoiding the electroplating of the adhesive sheet as claimed in claim 1, which is characterized in that: if the anti-sticking structure is a grid structure formed by interweaving the transverse grooves and the longitudinal grooves, the cross sections of the transverse grooves are of a V-shaped structure, and the cross sections of the longitudinal grooves are of a rectangular structure with an upper opening.

4. The metal leading-out terminal of the electronic component capable of avoiding the electroplating of the adhesive sheet as claimed in claim 1, which is characterized in that: if the anti-sticking structure is a point distribution structure formed by a plurality of salient points uniformly distributed on the surface of the base material of the metal leading-out end, the salient points are arc-shaped salient point structures.

5. The metal leading-out terminal of the electronic component capable of avoiding the electroplating of the adhesive sheet as claimed in claim 1, which is characterized in that: if the anti-sticking structure is a pattern structure formed by the soldering tin grooves according to the design of the soldering tin patterns, the depth of the soldering tin grooves is consistent with the height of the soldering tin designed by the soldering tin patterns.