CN108495488B - A kind of production method of multilayer printed circuit board - Google Patents
A kind of production method of multilayer printed circuit board Download PDFInfo
- Publication number
- CN108495488B CN108495488B CN201810499316.8A CN201810499316A CN108495488B CN 108495488 B CN108495488 B CN 108495488B CN 201810499316 A CN201810499316 A CN 201810499316A CN 108495488 B CN108495488 B CN 108495488B
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- Prior art keywords
- substrate plate
- soft substrate
- circuit board
- multilayer
- printed circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production methods of multilayer printed circuit board, set calibration point on the equivalent position point of multilayer soft substrate plate, and carry out multilayer positioning according to calibration point before drilling, form via hole according to five-pointed star distribution drilling on soft substrate plate；By the pattern exposure on original image on photosensitive bottom plate, develop, and single side plate surface is etched, setting signal line group；Multiport connecting pin is respectively set at both ends, in the at a temperature of bent circuit board of thermoplastic, and fast cooling is formed；It corresponding to setting connection pin on the position of via hole on multilayer board, and is electrically connected by enameled wire with pin is connect in corresponding via hole, the signal line group of different layers position is connected also by via hole；Spatial stability is very good, and convenient for forming three-dimensional Multi-layer circuit board structure, directly progress fold, rotation and sizing can be employed many times the production that identical template realizes mass, simplify technique, improve production efficiency.
Description
Technical field
The present invention relates to circuit board technology field, specially a kind of production method of multilayer printed circuit board.
Background technique
Flexible printed circuit board has the characteristics that thin thickness, light weight, route be intensive, bent, deflection, extensive
Applying electronic device field.Flexible printed circuit board, which has been widely used in, provides cloth for the movable part of electronic device
Line.In addition, with the reduction of sizes of electronic devices and the improvement of electronic apparatus functions, it is used for by by several flexibilities
The flexible printed circuit board that printed circuit board connects.Flexible printed circuit board even can in some concrete applications
At least two flexible printed circuit boards are welded as an integrated flexible printed circuit board.
Obviously the thickness of integrated flexible print circuit welding position is greater than the thickness of integrated flexible printed circuit board other positions
Degree.In this way, the scolding tin protrusion for welding is obviously provided projectingly relative to the surface of integrated flexible printed circuit board, it is easy to produce
Integrated flexible printed circuit board fractures in welding position, leads to the failure of integrated flexible printed circuit board.
In summary technical solution and reality there are the problem of, and combine the technical solution being widely used at present, also
Existing major defect is mainly reflected in the following aspects: thermal conductivity and poor radiation, the transformation of space structure and specific
Size is difficult to control, and is directly resulted in its reliability and is also difficult to be promoted；Further, it because spatial stability is very poor, is routed close
It spends low, is also not easy to that multi-layer board is made, and in the prior art, use mechanical punching and machine in multi-layer flexible circuit board production
When the mode of tool cutting, it is easy to produce the slag particle of various partial sizes, influences the performance of circuit board.
Summary of the invention
In order to overcome the shortcomings of that prior art, the present invention provide a kind of production method of multilayer printed circuit board, energy
The problem of effective solution background technique proposes.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of production method of multilayer printed circuit board, includes the following steps:
Step 100, multilayer positioning, set calibration point on the equivalent position point of multilayer soft substrate plate, and before drilling
Multilayer positioning is carried out according to calibration point, is locked after the positioning, production obtains soft substrate plate, and presses on soft substrate plate
Several via holes are formed according to five-pointed star distribution drilling；
Step 200, etching development and wiring, by the pattern exposure on original image on photosensitive bottom plate, develop,
And single side plate surface is etched, setting signal line group；
Multiport connecting pin is respectively set at both ends in step 300, port closed and molding, and with signal line group pair
It should connect, in the at a temperature of bent circuit board of thermoplastic, and fast cooling is formed；
Step 400, the three-dimensional of multilayer drilling are docked, and are connected on multilayer board corresponding to setting on the position of via hole
Pin is connect, and is electrically connected by enameled wire with pin is connect in corresponding via hole, the signal line group of different layers position is also by mistake
Hole connection.
As a preferred technical solution of the present invention, in step 100, the specific steps of drilling are as follows:
Step 101 demarcates five-pointed star distribution figure on soft substrate plate, and avoids track road sign on soft substrate plate
Fixed drilling position, the soft substrate plate for having demarcated drilling position is projected, retaining projection egative film is spare；
Step 102 drills according to the drilling position of calibration, is rinsed after drilling by dehydrated alcohol, and by nothing
Water-ethanol drying；
Step 103, filling tackifying resin closes via hole in via hole, and is polished on two surfaces of via hole, makes
Hole end surface was obtained to flush with soft substrate plate surface；
Step 104 is fixed with hard fold sheath at soft substrate plate both ends, and center toughness item is embedding by wave strip fixation
Enter in hard fold sheath, and it is embedding on soft substrate plate and center toughness item several punching presses to be arranged by stamping device
Enter hole.
As a preferred technical solution of the present invention, in step 200, by the pattern exposure on original image photosensitive
Specific steps on bottom plate are as follows:
Step 201 cleans to soft substrate plate, and greasy dirt, oxidation film and its sweat stain including soft substrate plate surface are removing
It rinses and dries by dehydrated alcohol after miscellaneous；
Step 202, preparation standard picture and text silk printing screen version, fix standard picture and text silk printing screen version after spraying photoresists 4-5 times
It is bonded on soft substrate plate, is directly exposed development；
Step 203 carries out artificial glue less than the place of glue to product edge position and spray, until the metal portion of product
Position is baked to spare without exposing phenomenon.
As a preferred technical solution of the present invention, in step 300, the key step of port closed are as follows: firstly, will
Multiport connecting pin is bonded on soft substrate plate, and by its T font edge and soft substrate plate to chimeric；Secondly, by multiport
Connecting pin corresponds and is electrically connected with signal line group, and multiport is connected end seal by thermoplastic resin insulating layer later
It closes.
As a preferred technical solution of the present invention, in step 300, the key step of sizing are as follows: to having already passed through
The soft substrate plate progress low temperature of port closed is warm slowly, and average heating rate is 2-4 DEG C/min, and being heated to temperature is 50-60
DEG C, keep this temperature-resistant, and its temperature fluctuation is no more than 5 DEG C of above-mentioned temperature range, at such a temperature to soft substrate plate into
Row slowly bending and rotation, forms it slowly, and the Mean Speed of bending and rotation is 1-2cm/min, is protected after formation
Fast cooling after above-mentioned position 5-8min is held, the Mean Speed of cooling is 10-12 DEG C/min.
It further include compacting joint face, on the slim bracket of cross hard as a preferred technical solution of the present invention
Connection structure is suppressed, and is fixed on soft substrate plate.
It further include multilayer board, including soft substrate plate as a preferred technical solution of the present invention, it is described soft
Matter substrate is equipped with thermoplastic resin insulating layer on two surfaces, it is characterised in that: insulate in soft substrate plate and thermoplastic resin
The signal line group being parallel to each other is equipped between layer, the signal line group is fixed by thermoplastic resin；
It further include center toughness item, the center toughness item is fixedly mounted on soft substrate plate central axis, the center
The length of toughness item is greater than the long axis length of soft substrate plate, and passes through wave strip and soft substrate plate at the both ends of center toughness item
Fixed bonding connection, is uniformly coated with hard fold sheath, the soft base in the junction of the soft substrate plate and wave strip
Several punching press embedded holes are equipped on plate and center toughness item.
As a preferred technical solution of the present invention, thermoplastic resin insulating layer outer surface is bonded by hot melt adhesive
There is EMI electromagnetic shielding film, and the connecting sewing for being located at two sides EMI electromagnetic shielding film passes through soldering airtight connection.
As a preferred technical solution of the present invention, it is fixedly installed with and signal line group electricity at the both ends of signal line group
Property connection multiport connecting pin, the multiport connecting pin is in that T font is embedded in soft substrate plate end, and the signal wire
Signal wire in group, which is corresponded with several separate ports of multiport connecting pin, to be electrically connected.
As a preferred technical solution of the present invention, the soft substrate plate includes polyimides or polyester film material
Base sheet, and fixed in above-mentioned base sheet and be bonded with copper clad laminate, the copper clad laminate back side and front are set respectively
There are stiffening plate and cover film protection film, wherein the stiffening plate is in hollow rectangular box-like, and in copper clad laminate and basic piece
Material is equipped with several via holes being distributed at Five-pointed star.
Compared with prior art, the beneficial effects of the present invention are:
The present invention meets the demand of single-layer-flex circuit, and protecting by the soft substrate plate of setting single layer first
While protection circuit hardened structure, additionally it is possible to realize the demand on spatial, spatial stability is very good, three-dimensional convenient for being formed
The Multi-layer circuit board structure of formula, since spatiality is good, thermally conductive and heat dissipation performance is greatly improved, and further,
By the way that in circuit board preparation process, directly progress fold, rotation and sizing ensure that the disposal molding of flexible circuit board,
The thickness and intensity that ensure that bending part edge are not susceptible to be broken, in production technology, phase can be employed many times in bending
Same template realizes the production of mass, simplifies technique, improves production efficiency.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is overlooking structure diagram of the present invention；
Fig. 3 is the cross slim supporting structure schematic diagram of hard of the present invention；
Fig. 4 is soft substrate plate structural schematic diagram of the present invention；
Fig. 5 is soft substrate plate the schematic diagram of the section structure of the present invention；
Fig. 6 is flow diagram of the invention；
Figure label: 1- soft substrate plate；2- thermoplastic resin insulating layer；3- signal line group；The center 4- toughness item；5- wave
Item；6- hard fold sheath 7- punching press embedded hole；8-EMI electromagnetic shielding film；9- multiport connecting pin；The cross hard of 10- is thin
Type bracket；11- oval depressions；The protrusion of 12- ellipse；The coarse point of 13-；
101- hard fold sheath；102- rotates band；103-U type film winding side；104- base sheet；105- copper foil base
Plate；106- stiffening plate；107- cover film protects film.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figures 1 to 5, described soft the present invention provides a kind of flexible printed circuit board, including soft substrate plate 1
Substrate is equipped with thermoplastic resin insulating layer 2 on 1 two surfaces, is equipped between soft substrate plate 1 and thermoplastic resin insulating layer 2
The signal line group 3 being parallel to each other, the signal line group 3 are fixed by thermoplastic resin.
Among the above, it should be further noted that soft substrate plate 1 is the basis of circuit board in present embodiment, lead
If being a kind of printed circuit board good with height reliability, pliability made of substrate polyimides or polyester film,
And thermoplastic resin insulating layer 2 therein is then capable of providing optimal insulating effect, protects internal electricity structure.
Specifically, in the present embodiment, line can also be sprayed as desired in 2 outer surface of thermoplastic resin insulating layer
Road plate marine glue, so that circuit board has hydrophobic moisture-proof, anti-radiation and anti-aging advantage.
As preferred embodiment, 2 outer surface of thermoplastic resin insulating layer has EMI electromagnetism by melt viscosity
Screened film 8, and be located at the connecting sewing of two sides EMI electromagnetic shielding film 8 by soldering airtight connection, among the above, although can be by
The function that wiring board marine glue can have waterproof need to be sprayed, but wiring board is very sensitive for extraneous electromagnetic radiation
, therefore, it is necessary to the shielding of electromagnetic signal is carried out, and the EMI electromagnetic shielding film 8 in present embodiment neither interferes other set
It is standby, while also not influenced by other equipment, in a lesser range, it can accomplish the independence of electromagnetic signal, that is,
Even when same circuit board on, electromagnetic signal will not be there is a situation where interfering with each other, the effect of shielded signal
Most preferably.
Wherein, the multiport connecting pin 9 being electrically connected with signal line group 3 is fixedly installed at the both ends of signal line group 3,
The multiport connecting pin 9 is embedded in 1 end of soft substrate plate in T font, and the signal wire in the signal line group 3 with it is more
Several separate ports of port connecting pin 9, which correspond, to be electrically connected.
Related signal line group 3 is specially that can be fine signal wire among the above, is also possible to directly pass through etching
Mode the foil section on circuit board is removed, to make characteristic impedance match in order to high-speed transfer, be exactly in a word so that
The main structure and signal transmission structure of circuit board distinguish, the scheme of other signal transmission for meeting the technical program
It is also possible.
Further include center toughness item 4, the center toughness item 4 is fixedly mounted on 1 central axis of soft substrate plate, it is described in
The length of heart toughness item 4 be greater than soft substrate plate 1 long axis length, and the both ends of center toughness item 4 pass through wave strip 5 with it is soft
The fixed bonding connection of matter substrate 1 is uniformly coated with hard fold sheath 6 in the junction of the soft substrate plate 1 and wave strip 5,
Several punching press embedded holes 7 are equipped on the soft substrate plate 1 and center toughness item 4.
An innovative point of the above-mentioned part as the application, which is characterized in that firstly, 4 one side of center toughness item of setting
The mechanical tenacity of whole circuit board can be improved in face, so that whole circuit board has preferable toughness, can satisfy in the application
In flexible circuit board demand.Due in the present embodiment, not only require nothing more than be single sided board circuit board, be also required of
Dual platen or even be multiple panel structure, therefore, in the demand of toughness, than general flexible printed circuit board flexibility requirements
It is much bigger.Another aspect, due to the structures such as the transmission that in this application, has also related to signal, therefore, peripheral device structure
General flexible printed board will be more than, and increased peripheral device structure relies solely on the structural strength hardly possible in flexible printing plate itself
To meet it in mechanical strength the needs of, therefore, if without enough support strengths, it will due to the intensity of structure itself
The shape in demand and moulding not enough is not achieved, can not meet the demand of flexible circuit board substantially.There are also be exactly to match
Installation center toughness item 4 is closed, matched hard fold sheath 6 is provided in 1 end of soft substrate plate, further improves circuit board
The mechanical protection ability at edge, avoids the breakage of board edge.
In addition, the soft substrate plate 1 is equipped with several irregular fold belts 101, and it is located at the hard fold at both ends
Sheath 101 is rotated on soft substrate plate 1 along two opposite directions around the long axis of spindle of soft substrate plate 1 and forms rotation band 102,
The back side and positive two sides of the rotation band 102 are equipped with U-shaped film winding side 103, among the above, the effect of fold belt 101
It is to improve the length of practical soft substrate plate 1, and rotation band 102 is formed by turning effort and then can be improved its lateral shear
Power enables whole circuit board that can meet the needs of flexible circuit board on horizontal and vertical upper and shear direction,
When ensure that circuit board has sufficiently ductile and anti-shearing force, so that it may specifically be produced as desired.
In the present embodiment, the soft substrate plate 1 includes the base sheet 104 of polyimides or polyester film material,
It is with polyimides or polyester film for the reason of basic material: there is height reliability, excellent pliability, printing electricity
Road plate has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.Fixation is bonded in above-mentioned base sheet 104
Copper clad laminate 105,105 back side of copper clad laminate and front are respectively equipped with stiffening plate 106 and cover film protection film 107,
In, for the stiffening plate 106 in hollow rectangular box-like, its role is to the mechanical strengths of reinforcement bottom plate, and surface actual load is facilitated to make
Industry, common thickness have 3mil to 9mil, and are equipped with several into Five-pointed star on copper clad laminate 105 and base sheet 104
The via hole of distribution, the via hole of setting are the multiple layer combinations for the ease of circuit board, after being provided with via hole, in the group of circuit board
When conjunction, directly internal circuit and signal line can be connected by via hole, avoid the electricity for being additionally provided with peripheral hardware in combination
Line structure.
Specifically, in the present embodiment, being respectively and fixedly provided with cross hard on the front and back in the soft substrate plate 1
Slim bracket 10, point is embroidered with several ellipses respectively on the upper slim bracket 10 of cross hard in the back side and front
12 shapes and sizes of protrusion one of the protrusion 12 of recess 11 and several ellipses, the oval depressions 11 and ellipse are a pair of
It answers, and is welded with several coarse points 13 on 11 inner surface of oval depressions.
In the above-mentioned slim bracket 10 of cross hard, its main function is to combine the circuit board of multilayer, still
After being provided with above structure, the mechanical strength of integrated circuit plate can also be improved by the slim bracket 10 of cross hard,
Being located at the external slim bracket 10 of cross hard can protect internal electrical components, and be located at internal ten for connection
On the one hand the slim bracket 10 of font hard provides the chimeric position of connection, another aspect is then to be to protect internally positioned electricity
Learn component.
In addition, in the present invention, as shown in fig. 6, additionally providing a kind of production method of flexible printed circuit board, including such as
Lower step:
The processing of step 100, soft substrate plate, production obtain soft substrate plate, and according to five-pointed star point on soft substrate plate
Cloth drills to form several via holes.
In above-mentioned production stage, the soft substrate plate directly using production is referred to, and the basic composition of the soft substrate plate exists
There is detailed elaboration among the above, it may be assumed that the soft substrate plate 1 includes the base sheet of polyimides or polyester film material
104, and fixed in above-mentioned base sheet 104 and be bonded with copper clad laminate 105,105 back side of copper clad laminate and front point
Not She You stiffening plate 106 and cover film protect film 107, wherein the stiffening plate 106 is in hollow rectangular box-like, and in copper
Foil substrate 105 and base sheet 104 are equipped with several via holes being distributed at Five-pointed star.Using the excellent of above-mentioned soft substrate plate 1
Point is that hierarchical structure clearly demarcated with medium first is convenient for subsequent operation, in addition, in the present embodiment, just
In setting via hole, and the purpose that via hole is arranged is further to be convenient for forming multilayered structure.
Before carrying out step 100, further includes multilayer positioning, calibration is set on the equivalent position point of multilayer soft substrate plate
Point, and multilayer positioning is carried out according to calibration point before drilling, it is locked after the positioning.
So-called equivalent position point in the present embodiment, refers specifically to, opposite on the circuit board of different layers position
In the other circuit boards of circuit board, electrical functions are identical, and identical in electrical functions it is also desirable to ensure its position
The matching set.Understand in other words and is exactly that on adjacent two pieces of circuit boards, the identical position of electrical functions has very much, and in electricity
Function must also match specific position key point while identical, and such point is on a batch of circuit board
It is relatively unique.
In step 100, the specific steps of drilling are as follows:
Step 101 demarcates five-pointed star distribution figure on soft substrate plate, and avoids track road sign on soft substrate plate
Fixed drilling position, the soft substrate plate for having demarcated drilling position is projected, and retaining projection egative film is spare, and the autochrome retained
Can repeatedly utilize, again using when will not need to demarcate again, and mass directly can be carried out by projection
Production can also improve the harmony and uniformity of same batch production while simplifying process；
Step 102 drills according to the drilling position of calibration, is rinsed after drilling by dehydrated alcohol, and by nothing
Water-ethanol drying, the part free matter for rinsing its clast and being adsorbed on soft substrate plate reduce the remaining of impurity, reduce
Influence to subsequent production, and the use of dehydrated alcohol can be repeated several times；
Step 103, filling tackifying resin closes via hole in via hole, and is polished on two surfaces of via hole, makes
It obtained hole end surface to flush with soft substrate plate surface, why close via hole, its role is to make circuit board be in same
On potential surface, has preferable electromagnetic shielding capability in entire plane；
Step 104 is fixed with hard fold sheath at soft substrate plate both ends, and center toughness item is embedding by wave strip fixation
Enter in hard fold sheath, and it is embedding on soft substrate plate and center toughness item several punching presses to be arranged by stamping device
Enter hole, the punching press embedded hole of setting preferably plays punching press fixed function, and soft substrate plate and the fixation of center toughness item are formed one
Body structure.
In above-mentioned steps, the distribution figure of five-pointed star type why is selected, can be prolonged because five-pointed star type radioactivity is good
Malleability is good, and also has traceability while guaranteeing ductility, convenient for carrying out punching positioning on different circuit boards.
Step 200, etching development and wiring, by the pattern exposure on original image on photosensitive bottom plate, develop,
And single side plate surface is etched, setting signal line group.
In step 200, the specific steps by the pattern exposure on original image on photosensitive bottom plate are as follows:
Step 201 cleans to soft substrate plate, and greasy dirt, oxidation film and its sweat stain including soft substrate plate surface are removing
It rinses and dries by dehydrated alcohol after miscellaneous；
Step 202, preparation standard picture and text silk printing screen version, fix standard picture and text silk printing screen version after spraying photoresists 4-5 times
It is bonded on soft substrate plate, is directly exposed development；
Step 203 carries out artificial glue less than the place of glue to product edge position and spray, until the metal portion of product
Position is baked to spare without exposing phenomenon.
In above-mentioned steps, it should be noted that the specific steps of preparation standard picture and text silk printing screen version are as follows: first by picture and text
It is come out by flat image design software fair drawing, and by picture and text duplicate copy to printing plate output device, picture and text output is being moulded
Expect on film.
Multiport connecting pin is respectively set at both ends in step 300, port closed and molding, and with signal line group pair
It should connect, in the at a temperature of bent circuit board of thermoplastic, and fast cooling is formed.
The key step of port closed are as follows: firstly, multiport connecting pin is bonded on soft substrate plate, and by its T word
Type edge and soft substrate plate are to chimeric；Secondly, multiport connecting pin is corresponded and is electrically connected with signal line group, Zhi Houtong
Thermoplastic resin insulating layer is crossed to close multiport connecting pin.
Wherein, the key step of sizing are as follows: it is hot slowly to the soft substrate plate progress low temperature for having already passed through port closed, it is average to add
Hot rate is 2-4 DEG C/min, and being heated to temperature is 50-60 DEG C, keeps this temperature-resistant, and its temperature fluctuation is no more than upper
5 DEG C for stating temperature range, are slowly bent and are rotated to soft substrate plate at such a temperature, form it slowly, bending and
The Mean Speed of rotation is 1-2cm/min, keeps fast cooling after above-mentioned position 5-8min, the average speed of cooling after formation
Rate is 10-12 DEG C/min.
Further include following step before carrying out step 400: the three-dimensional docking of multilayer drilling, in multilayer board
Setting connection pin on the upper position corresponding to via hole, and be electrically connected by enameled wire with pin is connect in corresponding via hole,
The signal line group of different layers position is connected also by via hole.
Step 400, compacting joint face, suppress connection structure on the slim bracket of cross hard, and be fixed in
On soft substrate plate.
Based on above-mentioned, in this application, it is also necessary to further explanation, the binder resin etc. stated in above content
Adhesive is and to be included the fine grain anisotropic conductive adhesion of conductive extract based on tackifying resin and formed.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (10)
1. a kind of production method of multilayer printed circuit board, which comprises the steps of:
Step 100, multilayer positioning, set calibration point on the equivalent position point of multilayer soft substrate plate, will demarcate drilling position
Soft substrate plate projected, retaining projection egative film is spare, and before drilling according to calibration point carry out multilayer positioning, positioning
It is locked later, production obtains soft substrate plate, and forms several mistakes according to five-pointed star distribution drilling on soft substrate plate
Hole；
Step 200, etching development and wiring, by the pattern exposure on original image on photosensitive bottom plate, develop, and right
Single side plate surface is etched, setting signal line group；
Multiport connecting pin, and company corresponding with signal line group is respectively set at both ends in step 300, port closed and molding
It connects, in the at a temperature of bent circuit board of thermoplastic, and fast cooling is formed；
Step 400, the three-dimensional of multilayer drilling are docked, and are drawn on multilayer board corresponding to setting connection on the position of via hole
Foot, and be electrically connected by enameled wire with pin is connect in corresponding via hole, the signal line group of different layers position connects also by via hole
It connects.
2. a kind of production method of multilayer printed circuit board according to claim 1, which is characterized in that in step 100,
The specific steps of drilling are as follows:
Step 101 demarcates five-pointed star distribution figure on soft substrate plate, and avoids printed wire calibration on soft substrate plate and bore
Hole location projects the soft substrate plate for having demarcated drilling position, and retaining projection egative film is spare；
Step 102 drills according to the drilling position of calibration, is rinsed after drilling by dehydrated alcohol, and by anhydrous second
Alcohol drying；
Step 103, filling tackifying resin closes via hole in via hole, and is polished on two surfaces of via hole, so that mistake
Hole end surface is flushed with soft substrate plate surface；
Step 104 is fixed with hard fold sheath at soft substrate plate both ends, by center toughness item by wave strip it is fixedly embedded
In hard fold sheath, and several punching presses insertion is arranged by stamping device on soft substrate plate and center toughness item
Hole.
3. a kind of production method of multilayer printed circuit board according to claim 1, which is characterized in that in step 200,
By specific steps of the pattern exposure on original image on photosensitive bottom plate are as follows:
Step 201 cleans to soft substrate plate, greasy dirt, oxidation film and its sweat stain including soft substrate plate surface, in removal of impurities
It rinses and dries by dehydrated alcohol afterwards；
Step 202, preparation standard picture and text silk printing screen version, by the fixed bonding of standard picture and text silk printing screen version after spraying photoresists 4-5 times
On soft substrate plate, it is directly exposed development；
Step 203 carries out artificial glue less than the place of glue to product edge position and spray, until the metal position of product without
Exposing phenomenon, and be baked to spare.
4. a kind of production method of multilayer printed circuit board according to claim 1, which is characterized in that in step 300,
The key step of port closed are as follows: firstly, multiport connecting pin is bonded on soft substrate plate, and by its T font edge with
Soft substrate plate is mutually fitted into；Secondly, corresponding and being electrically connected multiport connecting pin with signal line group, pass through thermoplasticity later
Resin insulating barrier closes multiport connecting pin.
5. a kind of production method of multilayer printed circuit board according to claim 1, which is characterized in that in step 300,
The key step of sizing are as follows:, average heating rate 2-4 hot slowly to the soft substrate plate progress low temperature for having already passed through port closed
DEG C/min, and being heated to temperature is 50-60 DEG C, keeps this temperature-resistant, is carried out at such a temperature to soft substrate plate slowly curved
Folding and rotation, form it slowly, and the Mean Speed of bending and rotation is 1-2cm/min, after formation lasting 5-8min
Fast cooling afterwards, the Mean Speed of cooling are 10-12 DEG C/min.
6. a kind of production method of multilayer printed circuit board according to claim 1, which is characterized in that further include that compacting connects
Junction is suppressed connection structure on the slim bracket of cross hard, and is fixed on soft substrate plate.
7. a kind of production method of multilayer printed circuit board according to claim 1, further includes multilayer board,
It being characterized in that, including soft substrate plate (1), the soft substrate plate is equipped with thermoplastic resin insulating layer (2) on (1) two surface,
The signal line group (3) being parallel to each other, the signal line group are equipped between soft substrate plate (1) and thermoplastic resin insulating layer (2)
(3) it is fixed by thermoplastic resin；
It further include center toughness item (4), the center toughness item (4) is fixedly mounted on soft substrate plate (1) central axis, described
The length of center toughness item (4) is greater than the long axis length of soft substrate plate (1), and passes through wave at the both ends of center toughness item (4)
Unrestrained item (5) and soft substrate plate (1) fixed bonding connection, uniformly coat in the soft substrate plate (1) and the junction of wave strip (5)
There is hard fold sheath (6), several punching press embedded holes (7) are equipped on the soft substrate plate (1) and center toughness item (4).
8. a kind of production method of multilayer printed circuit board according to claim 7, which is characterized in that the thermoplastic resin
Rouge insulating layer (2) outer surface is had EMI electromagnetic shielding film (8) by melt viscosity, and is located at two sides EMI electromagnetic shielding film (8)
Connecting sewing pass through soldering airtight connection.
9. a kind of production method of multilayer printed circuit board according to claim 7, which is characterized in that in signal line group
(3) both ends are fixedly installed with the multiport connecting pin (9) being electrically connected with signal line group (3), the multiport connecting pin
(9) be embedded in soft substrate plate (1) end in T font, and the signal wire in the signal line group (3) with multiport connecting pin
(9) several separate ports, which correspond, to be electrically connected.
10. a kind of production method of multilayer printed circuit board according to claim 7, which is characterized in that the soft base
Plate (1) includes the base sheet (104) of polyimides or polyester film material, and fixed on above-mentioned base sheet (104)
It is bonded with copper clad laminate (105), copper clad laminate (105) back side and front are respectively equipped with stiffening plate (106) and cover film guarantor
It protects film (107), wherein the stiffening plate (106) is in hollow rectangular box-like, and in copper clad laminate (105) and base sheet
(104) several via holes being distributed at Five-pointed star are equipped with.
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| CN111818736B (en) * | 2020-06-18 | 2021-09-17 | 江门市众阳电路科技有限公司 | Circuit board exposure method using screen printing solder mask window |
| US11899498B2 (en) | 2020-10-29 | 2024-02-13 | Boe Technology Group Co., Ltd. | Flexible printed circuit and display apparatus |
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
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