CN111818736B - Circuit board exposure method using screen printing solder mask window - Google Patents
Circuit board exposure method using screen printing solder mask window Download PDFInfo
- Publication number
- CN111818736B CN111818736B CN202010559204.4A CN202010559204A CN111818736B CN 111818736 B CN111818736 B CN 111818736B CN 202010559204 A CN202010559204 A CN 202010559204A CN 111818736 B CN111818736 B CN 111818736B
- Authority
- CN
- China
- Prior art keywords
- screen printing
- solder mask
- circuit board
- screen
- silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a circuit board exposure method for a solder mask window by using a screen printing plate, which comprises the following steps: preparing a 36T white screen plate and a 77T solder resist dot screen plate; step two: manufacturing a solder mask silk screen printing window on two sides of the 77T solder mask point silk screen printing plate in the first step to obtain a 77T solder mask point silk screen printing plate; step three: placing the double-sided printing solder mask oil of the 36T white screen printing plate into a tunnel furnace for baking; step four: applying the 77T solder mask dot silk-screen printing plate in the step two, and using black silk-screen printing ink to make a 36T exposure screen plate through a double-sided silk-screen solder mask window of the 36T white screen plate in the step three; step five: and C, placing the 36T exposure screen in the fourth step into an exposure machine to expose the circuit board. According to the invention, black silk-screen printing ink is used for printing the solder mask window on the double surfaces of the 36T white screen, and the circuit board is aligned to the 36T exposure screen in the exposure process, so that alignment exposure is not required, and the production efficiency is high.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board exposure method using a screen printing solder mask window.
Background
The current photosensitive solder mask exposure method of the circuit board comprises the steps of grinding the circuit board, screen printing, pre-baking, film alignment exposure, developing and character baking, in the manufacturing process, the film alignment takes a long time, only one circuit board can be exposed in each frame, and the production efficiency is low. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the circuit board exposure method with high production efficiency by using the screen printing solder mask window.
The invention is realized by the following technical scheme:
a circuit board exposure method using screen printing solder mask window comprises the following steps,
the method comprises the following steps: preparing a 36T white screen plate and a 77T solder resist dot screen plate;
step two: manufacturing a solder mask silk screen printing window on two sides of the 77T solder mask point silk screen printing plate in the first step to obtain a 77T solder mask point silk screen printing plate;
step three: placing the double-sided printing solder mask oil of the 36T white screen printing plate on a drying rack, placing the drying rack in a tunnel furnace for baking at the baking temperature of 70-80 ℃ for 45-50 min, and standing after baking;
step four: applying the 77T solder mask dot silk-screen printing plate in the step two, placing black silk-screen printing ink on the double-sided silk-screen solder mask window of the 36T white screen printing plate in the step three, and airing to prepare a 36T exposure screen printing plate;
step five: placing the 36T exposure screen in the fourth step into an exposure machine to expose the circuit board;
step six: and developing the circuit board exposed in the step five, and developing and washing the position of the circuit board except the solder resist window by using a developing solution to obtain a finished product of the circuit board.
Further, the baking temperature in the third step is 75 ℃.
Further, the baking time in the third step is 47 min.
Further, the standing time in the third step is more than 15 min.
Further, the airing time in the fourth step is more than 20 min.
Further, the black silk-screen printing ink in the fourth step is self-drying black silk-screen printing ink.
Compared with the prior art, the black silk-screen printing ink is used for silk-screen welding resistance windows on the two sides of the 36T white screen, when the circuit board is exposed, the exposed part of the circuit board corresponding to the welding resistance window cannot be exposed, and in the exposure process, the circuit board is directly aligned to the 36T exposure screen, so that the alignment exposure is not needed, the exposure space is saved, a plurality of circuit boards can be exposed simultaneously, and the production efficiency is high.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A circuit board exposure method using screen printing solder mask window comprises the following steps,
the method comprises the following steps: preparing a 36T white screen plate and a 77T solder resist dot screen plate;
step two: manufacturing a solder mask silk screen printing window on two sides of the 77T solder mask point silk screen printing plate in the first step to obtain a 77T solder mask point silk screen printing plate;
step three: placing the double-sided printing solder mask oil of the 36T white screen printing plate on a drying rack, placing the drying rack in a tunnel furnace for baking at the baking temperature of 70-80 ℃ for 45-50 min, and standing after baking;
step four: applying the 77T solder mask dot silk-screen printing plate in the step two, placing black silk-screen printing ink on the double-sided silk-screen solder mask window of the 36T white screen printing plate in the step three, and airing to prepare a 36T exposure screen printing plate;
step five: placing the 36T exposure screen in the fourth step into an exposure machine to expose the circuit board;
step six: and developing the circuit board exposed in the step five, and developing and washing the position of the circuit board except the solder resist window by using a developing solution to obtain a finished product of the circuit board.
As a specific embodiment, the baking temperature in step three is 75 ℃.
As a specific embodiment, the baking time in step three is 47 min.
And standing for more than 15min in the third step to ensure that the solder mask oil is stably cooled and uniformly distributed on the surface of the 36T white screen plate, so that the solder mask oil is prevented from being broken under stress.
And the air drying time in the fourth step is more than 20min, so that the black silk-screen printing ink can be completely dried.
The black silk-screen printing ink in the fourth step is self-drying black silk-screen printing ink, so that the production cost is saved, and the airing speed is high.
According to the invention, black silk-screen printing ink is used for printing the solder mask window on the double surfaces of the 36T white screen, when the circuit board is exposed, the exposed part of the circuit board corresponding to the solder mask window cannot be exposed, and in the exposure process, the circuit board is directly aligned to the 36T exposure screen, so that alignment exposure is not required, the exposure space is saved, a plurality of circuit boards can be exposed simultaneously, and the production efficiency is high.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. A circuit board exposure method using a screen printing solder mask window is characterized in that: comprises the following steps of (a) carrying out,
the method comprises the following steps: preparing a 36T white screen plate and a 77T solder resist dot screen plate;
step two: manufacturing a solder mask silk screen printing window on two sides of the 77T solder mask point silk screen printing plate in the first step to obtain a 77T solder mask point silk screen printing plate;
step three: placing the double-sided printing solder mask oil of the 36T white screen printing plate on a drying rack, placing the drying rack in a tunnel furnace for baking at the baking temperature of 70-80 ℃ for 45-50 min, and standing after baking;
step four: applying the 77T solder mask dot silk-screen printing plate in the step two, placing black silk-screen printing ink on the double-sided silk-screen solder mask window of the 36T white screen printing plate in the step three, and airing to prepare a 36T exposure screen printing plate;
step five: placing the 36T exposure screen in the fourth step into an exposure machine to expose the circuit board;
step six: and developing the circuit board exposed in the step five, and developing and washing the position of the circuit board except the solder resist window by using a developing solution to obtain a finished product of the circuit board.
2. The method for exposing a circuit board through a screen printing solder mask window according to claim 1, wherein the method comprises the following steps: the baking temperature in the third step is 75 ℃.
3. The method for exposing a circuit board through a screen printing solder mask window according to claim 1, wherein the method comprises the following steps: the baking time in the third step is 47 min.
4. The method for exposing a circuit board through a screen printing solder mask window according to claim 1, wherein the method comprises the following steps: the standing time in the third step is more than 15 min.
5. The method for exposing a circuit board through a screen printing solder mask window according to claim 1, wherein the method comprises the following steps: and the airing time in the fourth step is more than 20 min.
6. The method for exposing a circuit board through a screen printing solder mask window according to claim 1, wherein the method comprises the following steps: and the black silk-screen printing ink in the fourth step is self-drying black silk-screen printing ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010559204.4A CN111818736B (en) | 2020-06-18 | 2020-06-18 | Circuit board exposure method using screen printing solder mask window |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010559204.4A CN111818736B (en) | 2020-06-18 | 2020-06-18 | Circuit board exposure method using screen printing solder mask window |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111818736A CN111818736A (en) | 2020-10-23 |
| CN111818736B true CN111818736B (en) | 2021-09-17 |
Family
ID=72845923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010559204.4A Active CN111818736B (en) | 2020-06-18 | 2020-06-18 | Circuit board exposure method using screen printing solder mask window |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111818736B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IES960037A2 (en) * | 1996-01-17 | 1996-03-20 | Belfield Mfg Ltd | "A circuit board production process" |
| CN103969946A (en) * | 2014-05-04 | 2014-08-06 | 王�琦 | Method adopting jet printing technology to manufacture photoresistance layer to manufacture printing screen plate |
| CN107450281A (en) * | 2017-08-30 | 2017-12-08 | 郑州华美彩印纸品有限公司 | A kind of printing down technique of accurate high quality |
| CN108495488B (en) * | 2018-05-23 | 2019-06-21 | 深圳市汇芯线路科技有限公司 | A kind of production method of multilayer printed circuit board |
-
2020
- 2020-06-18 CN CN202010559204.4A patent/CN111818736B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111818736A (en) | 2020-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103660652B (en) | For the silk-screen printing technique of printed circuit board (PCB) | |
| CN109041440B (en) | Manufacturing method of wet film full-coverage PCB gold-plated board | |
| CN103249252A (en) | Control method for solder resist ink exposure precision | |
| US12027504B2 (en) | Method for improving the colour difference of LED display screen | |
| CN108966520B (en) | Anti-plagiarism shielding type PCB printing process | |
| CN102883546A (en) | Thick copper plate solder resistance process | |
| CN111818736B (en) | Circuit board exposure method using screen printing solder mask window | |
| CN107708322B (en) | Rework repairing method for solder resisting bridge falling | |
| CN108513451A (en) | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% | |
| CN105916305A (en) | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad | |
| CN107128091A (en) | One kind improves wet film dirty oil plate and falls oily technique | |
| CN110572952A (en) | Film covering method of ultrathin 5G copper-clad plate and preparation method of copper-clad plate | |
| CN112867278A (en) | Solder mask manufacturing method for printed circuit sheet | |
| CN103763865A (en) | Solder resist ink entry hole processing method | |
| CN109275278B (en) | Solder mask process method for improving solder mask ghost | |
| CN106817849A (en) | A kind of thick copper plate solder resistance process | |
| CN114449764A (en) | Circuit board silk-screen method | |
| CN211429664U (en) | Exposure film of PCB solder mask | |
| CN112004329B (en) | Processing method for avoiding false copper exposure of circuit board | |
| CN110248463A (en) | A kind of method of printed circuit board and preparation method thereof and its printing identification | |
| CN114980518A (en) | Production process of flexible circuit board | |
| CN114364150A (en) | Processing technology of solder resist ink for thick copper surface | |
| CN106922086A (en) | A kind of circuit board explosionproof hole method | |
| CN114126222A (en) | Processing method of PCB solder mask plug hole and PCB | |
| CN117580264A (en) | Circuit board carbon oil silk screen printing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |