CN110248463A - A kind of method of printed circuit board and preparation method thereof and its printing identification - Google Patents
A kind of method of printed circuit board and preparation method thereof and its printing identification Download PDFInfo
- Publication number
- CN110248463A CN110248463A CN201910452051.0A CN201910452051A CN110248463A CN 110248463 A CN110248463 A CN 110248463A CN 201910452051 A CN201910452051 A CN 201910452051A CN 110248463 A CN110248463 A CN 110248463A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- character block
- solder mask
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of methods of printed circuit board printing identification, and nontransparent character block is printed on substrate, and character block is greater than mark outer profile；Nontransparent solder mask is covered on the character block, solder mask and the character block have colour contrast or contrastive feature；Mark required for going out in the solder mask uplifting window.Character block has opened a window from solder mask and has partially revealed, and forms the shape of mark, and this method avoid the surfaces that mark is in printed circuit board, are greatly reduced to make to identify by the probability to rub, reduces mark and falls oil and cause to identify unclear risk.Invention also provides a kind of production methods of printed circuit board, it includes the method for above-mentioned printing identification；And it provides using printed circuit board made of above-mentioned print circuit plates making method.
Description
Technical field
The present invention relates to print circuit plates making field, in particular to a kind of printed circuit board and preparation method thereof and
The method of its printing identification.
Background technique
In printed circuit board during manufacturing, in order to preferably identify the essential information of printed circuit board, often
It needs to print some marks on a printed circuit, these marks include but is not limited to date of manufacture, basic of printed circuit board
Configuration parameter, the tick lables of welding etc..
The method of existing printed circuit board printing identification is: utilizing ready-made figure halftone, compels under the effect of the pressure
Make ink from the mesh exudation in halftone, so that mark is bitten on the surface of printed circuit board.Since mark is printed
On surface, surface is collided with vulnerable to friction during production and application, be there is the risk that mark falls oil, is caused to identify unclear.
Summary of the invention
One of in order to solve the above problem, the purpose of the present invention is to provide a kind of method of printed circuit board printing identification,
It avoids mark from being in the surface of printed circuit board, is greatly reduced to make to identify by the probability to rub, reduce mark and fall oil
And cause to identify unclear risk.
To achieve the above object, technical scheme is as follows:
Technical solution one:
A kind of method of printed circuit board printing identification comprising following steps:
Nontransparent character block is printed on substrate, the character block is greater than mark outer profile；
Cover nontransparent solder mask on the character block, the solder mask and the character block have colour contrast or
Contrastive feature；
Mark required for going out in the solder mask uplifting window.
Character block has opened a window from solder mask and has partially revealed, and forms the shape of mark, in order to enable mark is easily distinguished,
Solder mask and the character block is asked to have colour contrast or contrastive feature, colour contrast or contrastive feature refer to solder mask and word
Symbol block visually has easy distinction, such as can be morning-night, Bai Jiahong etc. has the combination of colour contrast, also may belong to
Same colour system but weight are different and cause contrastive feature.
Further, the substrate is paper base plate.Paper base plate has the advantages that cheap, advantageously reduces and is produced into
This.
Further, the character block is formed by UV ink silk screen printing.Paper base plate is thermo-labile, and the solidification of UV ink is without adding
Heat avoids the processing weakness of paper base version.
Further, the solder mask is coated by photosensitive solder resist oil.Cost is relatively low for photosensitive solder resist oil, is conducive into one
The cost optimization of step.
Further, the back segment baking process of the photosensitive solder resist oil is to toast 40 minutes at 150 DEG C.Photosensitive solder resist oil is often
Back segment baking process is to toast 60~90 minutes under 150 DEG C of high temperature, if using paper base plate, in order to reduce to paper base plate
Heat injury, reduce and stick up the possibility of version, adjustment ink component is constituted, and baking time is shorten to 40 minutes.
Further, the solder mask is coated by UV solder resist.Can it be evaded to avoid baking sheet using UV solder resist
To the heat injury of paper base plate.
Technical solution two:
A kind of production method of printed circuit board, which is characterized in that the production method of the printed circuit board includes above-mentioned
Method described in technical solution one.
Technical solution three:
A kind of printed circuit board, which is characterized in that printed circuit board production described in two according to the above technical scheme
Method is made.
The beneficial effects of the present invention are: the present invention provides a kind of methods of printed circuit board printing identification, on substrate
Nontransparent character block is printed, character block is greater than mark outer profile；
Nontransparent solder mask is covered on the character block, solder mask and the character block have colour contrast or comparison
Characteristic；Mark required for going out in the solder mask uplifting window.Character block has opened a window from solder mask and has partially revealed, and forms mark
The shape of knowledge, this method avoid the surfaces that mark is in printed circuit board, are subtracted significantly to make to identify by the probability to rub
It is small, it reduces mark and falls oil and cause to identify unclear risk.Invention also provides a kind of production sides of printed circuit board
Method, it includes the method for above-mentioned printing identification；And it provides using printing electricity made of above-mentioned print circuit plates making method
Road plate.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of embodiment schematic diagram of the method for printed circuit board printing identification in the present invention；
In figure, 1- substrate, 2- character block, 3- solder mask.
Specific embodiment
With reference to the accompanying drawing 1 and embodiment the present invention is further illustrated, be presently preferred embodiments of the present invention below.
Embodiment one:
A kind of method of printed circuit board printing identification, comprising the following steps:
It is glass substrate that step 1), which selects substrate 1, and the silk-screen character block 2 on glass substrate, character block 2 is solid non-
Bright color shape, character block 2 are greater than above-mentioned mark outer profile.Glass substrate is used in the present embodiment, and glass substrate is with epoxy
Resin makees adhesive, while making reinforcing material with glass fabric；The operating temperature that glass substrate is suitable for is higher, by environment shadow
Very little is rung, so the character block 2 of silk-screen above it there can be more ink selection, all using photosensitive-ink and UV ink
It can.The color of character block 2 there is no limit, in this embodiment, as preferably one of, select the photosensitive-ink of black, photosensitive-ink
It is obtained with easy, economical and practical advantage.
Step 2) coats solder mask 3 on the character block 2 for having been cured completion, and solder mask 3 is completely covered character block 2,
It asks solder mask 3 nontransparent, and has colour contrast or contrastive feature with the character block 2, the character block 2 to reflect in this present embodiment
For black, in order to seek colour contrast, solder mask 3 selects the photosensitive oil of welding resistance of white to be coated.Because of the base in the present embodiment
Plate 1 is glass substrate, has the advantages that photosensitive solder resist oil resistant to high temperature, preferably common, and photosensitive solder resist oil, which has, easily to be obtained, economical
The advantage of material benefit.
Step 3) is opened a window the solder mask 3 above character block 2 by way of contraposition exposure, and windowing shape is to identify
Shape.Specifically, being washed out the photosensitive oil of the welding resistance for the position that opens a window with development liquid medicine, exposes beneath partial character block 2, formed bright
Aobvious mark shape.
Embodiment two:
A kind of method of printed circuit board printing identification, comprising the following steps:
It is paper base plate that substrate 1 is selected in step 1) the present embodiment, and the silk-screen character block 2 on paper base plate, which is real
Nontransparent black of the heart is blocky, and character block 2 is greater than above-mentioned mark outer profile, and in the present embodiment, the design of character block 2 is than mark
Unilateral big 0.5mm.Character uses black UV ink, and solidification process is solidified using UV, and UV energy is 1600-2200mj.
Use paper base plate in the present embodiment, paper base plate has and can be punched out processing, at low cost, cheap, opposite
The features such as density is small, such as in the present embodiment, using the FR-2 paper base plate easily obtained.
Step 2) coats the UV solder resist conduct of white on having been cured character block 2 made of the black UV ink of completion
Character block 2 is completely covered in solder mask 3, solder mask 3, and white UV solder resist has covering power, and there are face with the character block 2 of black
Color contrast has contrastive feature.
Step 3) is in 3 uplifting window of solder mask: covering under welding resistance film is placed in ultraviolet light and exposes on solder mask 3, exposes
After remove welding resistance film, the UV solder resist of no black shield portions is hardened, and the UV solder resist being blocked is still liquid
, absolute alcohol or banana oil are stained with cotton swab and wipes the UV solder resist of liquid, until the character block 2 of black reveals, have been filled
The influence for dividing the part of exposure not will receive alcohol or banana oil, windowing shape are the shape identified.
Embodiment three:
A kind of method of printed circuit board printing identification, comprising the following steps:
It is paper base plate that step 1), which selects substrate 1, and the silk-screen character block 2 on paper base plate, which is solid nontransparent
Black it is blocky, character block 2 is greater than above-mentioned mark outer profile, in the present embodiment, the design of character block 2 than identify it is unilateral greatly
0.5mm.Character block 2 is formed using the UV ink silk screen printing of black, and solidification process is solidified using UV, and UV energy is 1600-2200mj.
Use paper base plate in the present embodiment, paper base plate has and can be punched out processing, at low cost, cheap, opposite
The features such as density is small, such as in the present embodiment, using the FR-2 paper base plate easily obtained.
Step 2) coats the welding resistance sense of white on the black character block 2 made of the UV ink for the black for having been cured completion
For gloss oil as solder mask 3, character block 2 is completely covered in solder mask 3, and the photosensitive oil of white welding resistance has covering power, the word with black
According with block 2, there are colour contrasts, have contrastive feature.
Step 3) is opened a window the solder mask 3 above character block 2 by way of contraposition exposure, and windowing shape is to identify
Shape.Specifically, the photosensitive oil of the welding resistance for the position that opens a window is washed out with development liquid medicine, expose the character block 2 of beneath part black,
Form apparent mark shape.
Because the substrate 1 in the present embodiment is paper base plate, paper base plate is easy to be affected by temperature, and easily occurs plate in process of production
It sticks up, the baking time sticks up after needing to shorten welding resistance to improve plate, is kept for 40 minutes at a temperature of being selected in 150 DEG C.Photosensitive solder resist oil
Common back segment baking process is to toast 60~90 minutes under 150 DEG C of high temperature, if using paper base plate, in order to reduce to paper base plate
Heat injury, reduce and stick up the possibility of version, adjustment ink component is constituted, and baking time is shorten to 40 minutes.
Example IV:
The embodiment of the present invention four provides a kind of production method of printed circuit board, which includes above-described embodiment
The method that any embodiment provides in one to three.
Embodiment five:
The embodiment of the present invention five provides a kind of printed circuit board, the system which is provided by above-described embodiment 4
It is made as method.
The present invention relates to contraposition exposure, silk-screen, the solidification process of UV ink, the solidification process of photosensitive-ink, UV resistance
Solder flux solidification process, photosensitive solder resist oil welding resistance after the technological means such as to dry be technological means commonly used in the art, be all extremely simple
Single, it can easily be realized by existing mature technology, nor innovation of the invention, is less protected object of the invention.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (8)
1. a kind of method of printed circuit board printing identification, comprising the following steps:
Nontransparent character block is printed on substrate, the character block is greater than mark outer profile；
Nontransparent solder mask is covered on the character block, the solder mask and the character block have colour contrast or comparison
Characteristic；
Mark required for going out in the solder mask uplifting window.
2. a kind of method of printed circuit board printing identification according to claim 1, it is characterised in that: the substrate is paper
Substrate.
3. a kind of method of printed circuit board printing identification according to claim 2, it is characterised in that: the character block by
UV ink silk screen printing forms.
4. a kind of method of printed circuit board printing identification according to claim 3, it is characterised in that: the solder mask by
Photosensitive solder resist oil coats.
5. a kind of method of printed circuit board printing identification according to claim 4, it is characterised in that: the photosensitive solder resist
The back segment baking process of oil is to toast 40 minutes at 150 DEG C.
6. a kind of method of printed circuit board printing identification according to claim 3, it is characterised in that: the solder mask by
UV solder resist coats.
7. a kind of production method of printed circuit board, it is characterised in that: the production method of the printed circuit board is wanted comprising right
Seek any method of 1-6.
8. a kind of printed circuit board, it is characterised in that: the printed circuit board production method system according to claim 7
At.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910452051.0A CN110248463A (en) | 2019-05-28 | 2019-05-28 | A kind of method of printed circuit board and preparation method thereof and its printing identification |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910452051.0A CN110248463A (en) | 2019-05-28 | 2019-05-28 | A kind of method of printed circuit board and preparation method thereof and its printing identification |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110248463A true CN110248463A (en) | 2019-09-17 |
Family
ID=67885221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910452051.0A Pending CN110248463A (en) | 2019-05-28 | 2019-05-28 | A kind of method of printed circuit board and preparation method thereof and its printing identification |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110248463A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554690A (en) * | 2020-11-24 | 2022-05-27 | 深圳市好又高电子科技有限公司 | Circuit board manufacturing process |
| CN114666994A (en) * | 2020-12-23 | 2022-06-24 | 北京梦之墨科技有限公司 | Circuit board and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU5867386A (en) * | 1985-05-10 | 1986-12-04 | Boorman, Paul Anthony | Printed circuit boards and transfers therefor |
| CN104175737A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Manufacturing method of characters on PCB (Printed Circuit Board) |
| CN104244575A (en) * | 2014-09-24 | 2014-12-24 | 晏石英 | Circuit board provided with multi-color solder mask layers |
| CN205071466U (en) * | 2015-10-20 | 2016-03-02 | 广州视源电子科技股份有限公司 | Circuit board |
| CN206226828U (en) * | 2016-12-08 | 2017-06-06 | 厦门大学嘉庚学院 | A kind of PCB single sided boards |
-
2019
- 2019-05-28 CN CN201910452051.0A patent/CN110248463A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU5867386A (en) * | 1985-05-10 | 1986-12-04 | Boorman, Paul Anthony | Printed circuit boards and transfers therefor |
| CN104175737A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Manufacturing method of characters on PCB (Printed Circuit Board) |
| CN104244575A (en) * | 2014-09-24 | 2014-12-24 | 晏石英 | Circuit board provided with multi-color solder mask layers |
| CN205071466U (en) * | 2015-10-20 | 2016-03-02 | 广州视源电子科技股份有限公司 | Circuit board |
| CN206226828U (en) * | 2016-12-08 | 2017-06-06 | 厦门大学嘉庚学院 | A kind of PCB single sided boards |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554690A (en) * | 2020-11-24 | 2022-05-27 | 深圳市好又高电子科技有限公司 | Circuit board manufacturing process |
| CN114666994A (en) * | 2020-12-23 | 2022-06-24 | 北京梦之墨科技有限公司 | Circuit board and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105159502B (en) | A kind of contact panel and preparation method thereof | |
| CN110248463A (en) | A kind of method of printed circuit board and preparation method thereof and its printing identification | |
| CN103660652B (en) | For the silk-screen printing technique of printed circuit board (PCB) | |
| CN102523698A (en) | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening | |
| CN104777665B (en) | The preparation method of black matrix" | |
| EP0182914B1 (en) | Color filter | |
| CN106277813A (en) | A kind of manufacture method of pattern cover plate | |
| DE102014104628B4 (en) | Method of manufacturing a touch-sensitive screen from a single sheet of glass | |
| CN103331995B (en) | A kind of calibration equipment of screen printing of ceramic tiles and use its method | |
| CN108585537B (en) | Preparation method of gradual change glass | |
| CN108017288B (en) | Glass plate containing dazzling printing ink layer and preparation method thereof | |
| WO2014132974A1 (en) | Substrate manufacturing method, substrate, and mask film | |
| CN109275278B (en) | Solder mask process method for improving solder mask ghost | |
| CN103496261A (en) | Screen painting method for thick copper plate | |
| CN206684702U (en) | Ink print structure and touch-screen | |
| KR20190086882A (en) | Screen printing plate using laser cutting and screen printing plate manufactured by the same | |
| CN201936119U (en) | Novel solder-proof green oil film for printed circuit board | |
| JP2011119522A (en) | Printed wiring board and manufacturing method of the same | |
| CN209710454U (en) | It is a kind of improve welding resistance ghost catch point net production use film | |
| JP5728109B1 (en) | Substrate manufacturing method, substrate and mask film | |
| CN211429664U (en) | Exposure film of PCB solder mask | |
| CN104731408B (en) | Panel construction and preparation method thereof | |
| CN107835269A (en) | Screen cover plate processing method | |
| CN114630488A (en) | PCB conductor area mimeograph structure, PCB and preparation method | |
| JP5885342B2 (en) | Electronic component module and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190917 |
|
| RJ01 | Rejection of invention patent application after publication |