JP2011119522A - Printed wiring board and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form clear and discriminative symbols on the surface of a solder resist of a printed wiring board independent of silk printing and ink jet printing. <P>SOLUTION: This invention relating to a method of manufacturing the printed wiring board comprises the steps of coating, for example, a solder resist 13 with a thermosetting property on a base material surface (a surface of an outermost layer insulating layer 11 including an outermost layer wiring pattern 12) of a printed wiring board 10, performing half-drying or a half-curing of the coated solder resist 13, pressing a surface of the half-dried or half-cured solder resist 13 with a pressing jig for forming symbols expressing the information of the printed wiring board 10, and curing the pressed solder resist 13, wherein a depression character 14 of each symbol expressing the information of the printed wiring board 10 is formed on the surface of the solder resist 13 by changing the thickness of the solder resist 13. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a printed wiring board and a manufacturing method thereof, and more particularly, to display of information on a printed wiring board used in an electronic apparatus.

  FIG. 12 shows a cross-sectional view of a general printed wiring board. However, in order to simplify the drawing, FIG. 12 shows only the outer part from the outermost insulating layer including the outermost conductive pattern related to the solder resist to which the present invention is focused, and shows the insulation below it. Layers and inner layers are omitted.

  In an ordinary printed wiring board 100, the solder resist 103 is used to insulate and protect the outermost wiring pattern 102 and prevent solder adhesion to solder bridges and extra portions when mounting components. Specifically, it is formed on the surface of the outermost insulating layer 101 including the outermost conductor pattern 102.

  The solder resist 103 is often an epoxy resin colored, and an ink-like material is printed in a desired shape, or a resin imparted with photosensitivity is pasted into a film shape, or an ink-like material is used. After the photosensitive resin is printed, exposure and development are performed through a phototool (also referred to as a photomask).

  Conventionally, information on components mounted on the printed wiring board, specifications / ratings, names of terminals, etc., as well as characters representing information such as names, lot numbers, and manufacturer names of printed wiring boards, A symbol 104 indicating a processing direction and a mark 104 such as marks are printed on the surface of the solder resist 103 with ink having a color different from that of the solder resist.

  Characters, codes, marks, and the like representing this information are generally referred to as silk characters. This is because the screen printing method has been conventionally used for printing such characters, codes, marks, and the like. Of course, a photo printing method using a photosensitive material may be used to form the silk character.

  In this case, if the screen printing method or photo printing method is adopted, it is necessary to recreate the screen version and photo tool every time the content of information changes, and it is not suitable for displaying lot numbers that need to be changed frequently. Then, printing by an ink jet method that does not require a screen plate or a photo tool is also frequently used.

  The problem here is the print quality of the silk letters.

  First, the solder resist uses a relatively difficult-to-adhere material for its purpose and character, and often has a smooth and glossy surface. For this reason, silk characters printed on the surface of the solder resist often have low adhesion strength of the ink. Further, the solder resist may repel ink for silk printing.

  Under such circumstances, there is a problem in that the ink for silk printing is poorly printed at the time of printing, and the ink or the ink may be repelled and characters or marks may not be displayed accurately. In addition, the finished printed wiring board also rubs or collides with other parts in the middle of handling, and there is a problem that a part of the raised silk letters are missing or peeled off.

  In view of this, as a simplest method for solving such a problem, a method of displaying a character or the like representing information as a character extracted from a solder resist has been proposed (for example, see Patent Document 1). However, if the solder resist is removed, the wiring pattern will be exposed if there is a wiring pattern below it. In addition, when the printed wiring board area is small and the mounting density is high as in recent years, it is difficult to secure a place for removing the wiring pattern and forming a letter, and this method is actually applied. Is often difficult. Furthermore, even if there is no wiring pattern in the extracted character portion, there is a problem that the exposed insulating layer is likely to absorb moisture.

  In order to solve these problems, a method has been proposed in which the exposed portion is eliminated by applying silk printing to the extracted character portion (see, for example, Patent Document 2).

Japanese Utility Model Publication No. 62-8669 Japanese Utility Model Publication No. 61-182062

  However, when silk printing is performed on the extracted character portion, it is difficult to align the position, and there is a problem that it is not a realistic method when the extracted character is a fine character, code, mark, etc. .

  In addition, in the ink jet system that is frequently used in recent years, there are many cases where ink is repelled due to restrictions on the properties of the ink that can be used, and the thickness of the printed characters tends to be thicker than that of the screen printing method. For this reason, there is a problem in that the ink is poorly printed and the ink or the ink is repelled or the characters and marks may not be displayed (printed) correctly. Further, the printed wiring board after completion has a problem that it is rubbed or bumped into another part during handling, and some of the raised characters are missing or peeled off.

  Furthermore, since printing of small characters is difficult with the printing method, the device is downsized as in recent years, the size of the printed wiring board is reduced, the component mounting density and wiring density are increased, and only a small printing area can be secured. If not, there are many cases where it is difficult to arrange the characters themselves.

  The present invention was devised to solve such problems, and its purpose is not to rely on silk printing or ink-jet printing, but to clearly and distinguishable characters, symbols, marks, and other symbols. An object of the present invention is to provide a printed wiring board that can be formed on the surface of a solder resist of a board and a method for manufacturing the same.

  In order to solve the above-mentioned problems, a method for manufacturing a printed wiring board according to the present invention is a method of forming a solder resist on a substrate surface of a printed wiring board, and changing the thickness of the solder resist by changing the thickness of the solder resist. The method further includes a step of forming a symbol representing information on the printed wiring board.

  According to the present invention, a symbol such as a lot number, which is information on a printed wiring board, can be clearly displayed in an uneven shape on the surface of the solder resist without depending on silk printing or ink jet printing. Accordingly, problems such as ink repelling, blurring, and chipping do not occur as compared with a method of printing symbols on the surface of the solder resist by a screen printing method.

  The symbols used in the present invention are used as a wide concept including characters, figures, patterns, codes, marks, and the like.

  Moreover, the method for producing a printed wiring board according to the present invention includes a step of applying a thermosetting solder resist to the substrate surface of the printed wiring board, a step of semi-drying or semi-curing the solder resist after application, A pressing step of pressing with a pressing jig for forming a symbol representing information of the printed wiring board on the surface of the solder resist that has been semi-dried or semi-cured, and the solder resist after pressurization is cured And a process.

  Moreover, the method for producing a printed wiring board according to the present invention includes a step of applying a photosensitive solder resist to the substrate surface of the printed wiring board, a step of semi-exposing the solder resist after the application, and a half-exposure. A pressing step of pressing with a pressing jig for forming a symbol representing information of the printed wiring board on the surface of the solder resist, a step of re-exposing the solder resist after pressing, and after re-exposure And a step of developing and post-curing to cure the solder resist.

  According to the present invention, by applying pressure to the surface of the solder resist with a pressurizing jig, a symbol representing information of the printed wiring board can be formed as a dent symbol on the surface of the solder resist. That is, a symbol such as a lot number, which is information on the printed wiring board, can be formed on the surface of the solder resist without depending on silk printing or ink jet printing. Accordingly, problems such as ink repelling, blurring, and chipping do not occur as compared with a method of printing symbols on the surface of the solder resist by a screen printing method. Further, it is possible to easily express symbols such as fine patterns, thin lines, and small characters, which are difficult with conventional screen printing. Also, in the ink jet printing method, ink is often repelled due to restrictions on the properties of the ink, and the printed symbols tend to be thicker than the screen printing method. There are problems such as rubbing against or colliding with other objects in the middle of handling, part of the raised symbol or chipping or peeling, but according to the manufacturing method of the present invention, such a problem occurs. do not do.

  Moreover, the method for producing a printed wiring board according to the present invention includes a step of applying a thermosetting solder resist to a substrate surface of the printed wiring board, a step of drying or curing the solder resist after application, A pressurizing step of pressurizing the surface of the hardened solder resist with a pressurizing jig for forming a symbol representing information of the printed wiring board.

  According to the present invention, since the pressurizing step is performed after the solder resist is completely cured, a step such as semi-drying or semi-curing of the solder resist in the thermosetting solder resist forming step is not required. The manufacturing process can be simplified correspondingly, and as a result, the manufacturing efficiency can be improved.

  Further, the method for producing a printed wiring board according to the present invention includes a step of applying a photosensitive solder resist to a substrate surface of the printed wiring board, a step of exposing the solder resist after application, and the exposed solder. A pressurizing step of pressing the surface of the resist with a pressurizing jig for forming a symbol representing information of the printed wiring board; and a step of curing the solder resist by performing development and post-cure after pressurization; It is characterized by including.

  According to the present invention, since the pressurizing process is performed after the solder resist is completely cured, a process such as a half-exposure of the solder resist in the photosensitive solder resist forming process is not required. It is possible to simplify the process, and as a result, the manufacturing efficiency can be improved.

  Moreover, according to the manufacturing method of the printed wiring board which concerns on this invention, it is good also as a structure which pressurizes in the said pressurization process in the state which heated the part which contacts the said soldering resist of the said pressurization jig | tool.

  With such a configuration, by performing the pressurizing process in a state where the portion of the pressurizing jig that contacts the solder resist is heated, the solder resist is softened by heat and is easily deformed. In combination with the pressure applied by the jig, information can be clearly formed with a concave symbol on the surface of the solder resist. Therefore, even a small symbol can be displayed so as to be distinguishable. That is, when the symbol is, for example, a character, even a small character can be displayed in a legible manner.

  Moreover, according to the method for manufacturing a printed wiring board according to the present invention, the pressurizing jig may be configured such that an inverted symbol obtained by inverting a symbol displayed on the surface of the solder resist is formed in a convex shape.

  With such a configuration, the symbol formed on the surface of the solder resist becomes a concave regular symbol. In this case, the information of the printed wiring board is displayed as a dent symbol on the surface of the solder resist, so that the thickness of the symbol portion formed on the surface of the solder resist is formed thinner than the thickness of the other portions. . However, the symbol portion formed on the surface of the solder resist is only thinned, and the substrate surface of the printed wiring board including the wiring pattern (specifically, the outermost insulating layer including the outermost conductor pattern) ) Is never exposed. In general, solder resist is often colored transparent resin, and when its film thickness is reduced, its color becomes lighter, reflecting more colors of the underlying insulating layer and wiring pattern, and the color tone is also improved. Because it changes, it is easier to distinguish the symbol than a simple dent symbol. That is, when the symbol is, for example, a character, the character is easier to read than a simple dent character.

  Further, according to the method for manufacturing a printed wiring board according to the present invention, the pressurizing jig has an inversion symbol obtained by inverting a symbol representing information displayed on the surface of the solder resist at the tip of the pressing jig. It is good also as a structure formed in the convex shape.

  With such a configuration, by forming the inverted symbol in a shape in which only the rim portion is convex (so-called bag letter shape), the symbol formed on the surface of the solder resist after pressurization is the rim portion of the rim portion. Only the film thickness is formed thinner than the film thickness of other portions. In this case, only the film thickness of the border portion of the symbol formed on the surface of the solder resist is reduced, and the substrate surface (outermost wiring pattern or insulating layer) of the printed wiring board is not exposed. Moreover, since there are few dent parts compared with the case where the whole symbol is dented, the possibility that the surface of the printed wiring board is unexpectedly exposed by pressurization can be greatly reduced. In general, solder resist is often colored transparent resin, and when its film thickness is reduced, its color becomes lighter, reflecting more colors of the underlying insulating layer and wiring pattern, and the color tone is also improved. Because it changes, the symbol is easier to distinguish than a simple border symbol. That is, when the symbol is, for example, a character, the character is easier to read than a simple outline character.

  Further, according to the method for manufacturing a printed wiring board according to the present invention, the surface of the inversion symbol is unevenly formed in a fine parallel line shape, a fine random shape, or other texture shape, and the pressure after pressurization The surface of the symbol part formed on the surface of the solder resist may be formed in fine streaky irregularities, fine random irregularities, or other textures.

  With such a configuration, the surface of the symbol portion formed on the surface of the solder resist after pressurization is fine streaky unevenness, fine random unevenness, or other texture (such as satin or silky) ), The unevenness is reflected on the symbol formed on the surface of the solder resist, and the symbol is hatched, contrasted with other parts that are finished with a satin or silky finish, and have a glossy finish. Is more easily identified.

  Moreover, according to the method for manufacturing a printed wiring board according to the present invention, the pressurizing jig may be provided in an outer shape processing mold, and the pressing step may be performed simultaneously with the outer shape processing.

  With such a configuration, by performing the pressurizing step simultaneously with the outer shape processing, it is possible to suppress an increase in manufacturing steps, and as a result, it is possible to improve manufacturing efficiency.

  The printed wiring board manufacturing method according to the present invention includes a solder resist forming step for forming a solder resist on the substrate surface of the printed wiring board, and after performing the solder resist forming step until the outer shape processing is completed. Forming a symbol representing information on the printed wiring board on the surface of the solder resist, and the symbol forming step is a cutting process for scraping the surface of the solder resist into the shape of the symbol to be formed. A method for producing a printed wiring board, which is a process.

  According to the present invention, the cutting process for scraping the surface of the solder resist is an arbitrary process after the solder resist formation process is performed until the outer shape processing is completed (that is, until the final outer shape processing is performed). Therefore, the degree of freedom in carrying out the manufacturing process is increased.

  For external processing, “(1) One printed wiring board on the workpiece is removed by die machining and processed into the final finished wiring board shape. (2) Multiple printed boards on the workpiece. The wiring board is processed into a final finished wiring board-shaped piece by die processing. (3) A part of the outer shape of the printed wiring board placed on the workpiece (for example, a part with severe dimensional accuracy or (4) Process most of the outer shape of the printed wiring board placed on the workpiece, and use the remaining part of the printed wiring board as a workpiece or kit frame. (5) There are many cases such as (5) cutting the part left in (4) above and dividing it into individual pieces or kits. That is, all of cases where a part of the outer shape is processed, such as a substrate piece, a processed workpiece, and a spell, are collectively referred to as outer shape processing.

  According to the present invention, the cutting process for scraping the surface of the solder resist can be carried out in any process among such a wide variety of external shapes. However, depending on the content displayed on the solder resist, it may be necessary to perform before specific processing. For example, a product name may be used at any time, but in the case of an address mark indicating where a plurality of pieces are placed and manufactured in a processed workpiece, the piece is separated from the workpiece. It is necessary to display information on the surface of the solder resist (that is, to perform a cutting process for scraping the surface of the solder resist) before or before separating the workpiece from the kit.

  Moreover, according to the method for manufacturing a printed wiring board according to the present invention, the cutting step can be a step of forming a step at a depth at which the substrate surface of the printed wiring board including the wiring pattern is not exposed.

  With such a configuration, the depth of scraping the surface of the solder resist is limited to a depth at which the substrate surface (the uppermost wiring pattern or insulating layer) of the printed wiring board is not exposed. Generation | occurrence | production of the malfunction that the base-material surface will be exposed accidentally can be reduced. That is, the performance of the solder resist, which is the original purpose of the solder resist, such as insulation of the conductor pattern layer and protection of the base material is not hindered.

  Moreover, according to the method for manufacturing a printed wiring board according to the present invention, in the cutting step, the surface of the solder resist is scraped off by using an NC-controlled end mill processing device, a sand blasting device, or a liquid honing device. be able to.

  With such a configuration, it is possible to accurately cut fine symbols by using an NC-controlled end mill processing device, a sand blasting device, or a liquid honing device as a cutting process.

  Moreover, according to the method for manufacturing a printed wiring board according to the present invention, the cutting step includes a step of forming a processing resist on the solder resist having an opening in the shape of a symbol displayed on the surface of the solder resist. The method includes a step of polishing the solder resist in the opening not covered with the processing resist by a mechanical polishing process or a chemical polishing process, and a step of peeling the processing resist after polishing. it can.

  With such a configuration, as the cutting process, the solder resist in the opening not covered with the processing resist is polished by a mechanical polishing process such as sand blasting or liquid honing or a chemical polishing process using an alkaline solution. It is possible to accurately polish the shape of the symbol displayed on the resist surface. As a result, it is possible to accurately scrape even finely shaped symbols.

  Further, the printed wiring board manufacturing method according to the present invention includes a solder resist forming step of forming a solder resist on the surface of the printed wiring board, and the solder resist forming step forms a symbol representing the information of the printed wiring board. A solder resist is formed on the surface of the substrate of the printed wiring board using a screen plate that is provided with a symbol-shaped region for limiting the amount of ink permeated through the symbol-shaped region. The method includes a printing step of printing ink, a step of leveling the printed solder resist ink, and a step of curing the solder resist ink after leveling.

  According to the present invention, by performing screen printing of a solder resist using a screen plate with a limited amount of ink permeation in the symbol shape region, and then performing leveling, a concave symbol is formed on the surface of the solder resist. Yes. That is, since the conventional screen printing method can be applied as it is simply by devising the screen plate, the manufacturing cost for forming the concave symbol on the surface of the solder resist can be reduced.

  Here, leveling is performed by holding for an appropriate time in an appropriate temperature environment. The temperature environment and holding time vary depending on the type of ink used, the printing conditions, the printing environment, etc., but at least the difference in thickness is maintained and the substrate surface of the printed wiring board is exposed in the thin part. However, it is performed until the resist function (surface protection, solder adhesion prevention, etc.) can be exhibited. As a specific example, for example, leveling is performed by holding for about 5 to 15 minutes at an arbitrary temperature within a temperature range from room temperature to about 50 degrees.

  Further, according to the method for producing a printed wiring board according to the present invention, the screen plate is formed by forming an emulsion layer on a stainless steel or Tetron cage for screen printing, and the emulsion layer is formed in the symbol-shaped region. Can be formed into independent dots or dither patterns to limit the amount of ink transmitted.

  With such a configuration, a screen plate made of stainless steel or tetron made for screen printing with an emulsion layer formed thereon is used, and the emulsion layer is an independent dot or a collection of dots in the symbol shape region. By forming with a dither pattern, the amount of ink permeation can be easily limited. Thereby, a concave symbol can be easily and reliably formed on the surface of the solder resist.

  Further, according to the method for manufacturing a printed wiring board according to the present invention, the screen plate is a metal mask plate, and the symbol-shaped region is formed thicker or thinner than other regions, thereby limiting the amount of ink transmitted. It can be set as the structure to do.

  With such a configuration, by using a metal mask plate in which the symbol-shaped region is thicker or thinner than other regions and limiting the amount of ink transmitted, the surface of the solder resist has a concave or convex shape. Symbols can be formed easily and reliably.

  Moreover, the method for manufacturing a printed wiring board according to the present invention includes a solder resist forming step of forming a solder resist on the substrate surface of the printed wiring board, and the solder resist forming step is performed on the substrate surface of the printed wiring board. A step of applying a photosensitive solder resist; a step of exposing the applied solder resist using a photo tool; and a step of performing development and post-cure after exposure, wherein the photo tool includes the printed wiring A symbol shape region for forming a symbol representing the information on the plate is formed in a shape capable of changing the thickness of the solder resist with respect to other regions.

  According to the present invention, the symbol-shaped region is formed on the surface of the substrate of the printed wiring board using the phototool formed in a shape that can change the thickness of the solder resist with respect to other regions. By exposing the photosensitive solder resist, concave symbols can be formed on the surface of the solder resist. That is, since the conventional photo printing method can be applied as it is simply by devising a photo tool, the manufacturing cost for forming the concave symbol on the surface of the solder resist can be reduced.

  Further, according to the method for manufacturing a printed wiring board according to the present invention, the phototool has a configuration in which the symbol shape region is formed in a fine dot or dither pattern.

  With such a configuration, by using a phototool in which the symbol shape region is formed into fine dots or dither patterns, the photosensitive solder resist formed on the substrate surface of the printed wiring board is exposed. A concave symbol can be formed on the surface of the solder resist. That is, since the conventional photo printing method can be applied as it is simply by devising a photo tool, the manufacturing cost for forming the concave symbol on the surface of the solder resist can be reduced.

  Moreover, according to the method for manufacturing a printed wiring board according to the present invention, the phototool is configured to have a halftone in which the transparency of the symbol-shaped region is lower or higher than other regions.

  With such a configuration, the symbol-shaped region is formed on the surface of the substrate of the printed wiring board using a photo tool that has a lower halftone or a higher halftone than other regions. By exposing the photosensitive solder resist, concave or convex symbols can be formed on the surface of the solder resist. That is, since the conventional photo printing method can be applied as it is simply by devising the photo tool, the manufacturing cost for forming the concave or convex symbols on the surface of the solder resist can be reduced.

  Further, the method for producing a printed wiring board according to the present invention includes a step of applying a solder resist to the substrate surface of the printed wiring board, a step of semi-drying or semi-curing the solder resist after the application, and semi-drying or semi-drying. A step of further applying a solder resist to a symbol-shaped region forming a symbol representing information of the printed wiring board on the surface of the hardened solder resist, and a step of curing the solder resist after application It is characterized by that. In addition, according to the method for manufacturing a printed wiring board according to the present invention, the portion where the solder resist is overlapped is different from the portion where the color tone is not overlapped.

  According to the present invention, the same kind of solder resist is further formed on the symbol shape region of the surface of the solder resist that forms the symbol representing the information of the printed wiring board, thereby forming the convex symbol. That is, the present invention is a structure in which the same solder resist is formed in a double layer, and is not a combination of different materials such as a solder resist and silk ink as in the prior art. There is no problem. Therefore, even if a slight impact is applied to the convex symbol part from the outside, there is no worry that it will be easily chipped or peeled off. . Further, since the portion formed by overlapping the solder resist is different from the portion not formed by overlapping the color tone, even a finely shaped symbol can be easily discriminated.

  In addition, the printed wiring board manufactured using the manufacturing method of the present invention can easily and easily print the printed wiring board information such as the lot number on the surface of the solder resist by changing the thickness, color tone, and surface state of the solder resist. It can be displayed clearly.

  Since the present invention is configured as described above, by changing the thickness, color tone, and surface state of the solder resist, symbols representing printed wiring board information, such as character information such as lot numbers, can be used regardless of silk printing. It can be easily and clearly formed on the resist surface. As a result, all the problems associated with conventional silk printing and ink jet printing can be solved.

In Embodiment 1, it is sectional drawing of the printed wiring board which completed formation to the outer layer pattern. In Embodiment 1, it is sectional drawing of the printed wiring board which shows the state which apply | coated the soldering resist on the insulating layer. It is a perspective view of a stamping jig. It is a cross-sectional perspective view showing a state where a printed wiring board having a symbol formed on the surface of a solder resist is cut at a symbol portion by stamping with a stamping jig. It is a perspective view which shows the state which formed the symbol which is the information of a printed wiring board on the surface of a soldering resist. It is a perspective view of the stamping jig which shows the example which provided the fine uneven | corrugated pattern on the surface of the symbol shape part of a stamping jig. It is a perspective view which shows the state which formed the symbol which is the information of a printed wiring board on the surface of the soldering resist with the stamping jig shown to FIG. 6A. It is a perspective view of the stamping jig which shows the example which made the symbol shape part of the stamping jig the bag character shape. It is a cross-sectional perspective view which shows the state which cut | disconnected the printed wiring board which formed the symbol which is the information of a printed wiring board with the stamping jig | tool shown to FIG. 7A on the surface of a soldering resist. It is a schematic sectional drawing which shows the soldering resist formation process in the manufacturing method of Embodiment 4. It is sectional drawing which shows the state of the printed wiring board after the soldering resist formation process in the manufacturing method of Embodiment 4. It is sectional drawing which shows the state of the printed wiring board after the leveling in the manufacturing method of Embodiment 4. It is sectional drawing which shows the other state of the printed wiring board after the leveling in the manufacturing method of Embodiment 4. It is sectional drawing which shows the state by which the wiring pattern was formed on the insulating layer of the printed wiring board in the manufacturing method of Embodiment 5. It is sectional drawing which shows the state which formed the photosensitive soldering resist on the surface of the insulating layer shown to FIG. 9A. It is a schematic sectional drawing which shows the exposure process in the manufacturing method of Embodiment 5. It is sectional drawing which shows the state of the printed wiring board after the exposure in the manufacturing method of Embodiment 5. It is sectional drawing which shows the other state of the printed wiring board after the leveling in the manufacturing method of Embodiment 5. In the manufacturing method of Embodiment 6, it is sectional drawing which shows the state which further formed the solder resist in the shape of the symbol on the solder resist. In the manufacturing method of Embodiment 6, it is a cross-sectional perspective view which shows the state which cut | disconnected the printed wiring board which formed the convex-shaped symbol with another solder resist on the solder resist in the symbol part. It is sectional drawing of the printed wiring board manufactured by the manufacturing method of the conventional printed wiring board.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, the following embodiment is an example which actualized this invention, Comprising: The thing of the character which limits the technical scope of this invention is not.

  The method for manufacturing a printed wiring board according to the present invention includes the information on the printed wiring board on the surface of the solder resist by changing the thickness of the solder resist in the process of forming the solder resist on the substrate surface of the printed wiring board. It includes a step of forming a symbol representing. Here, as symbols representing information of the printed wiring board, there are figures, symbols, marks, marks, etc., in addition to characters, but in the following description, characters will be described as examples.

[Embodiment 1]
The first embodiment is an embodiment using a stamping jig as a method of forming a symbol (character) on the surface of a printed wiring board (hereinafter also simply referred to as “wiring board” in this specification). Hereinafter, a method for manufacturing a printed wiring board according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a cross-sectional view of a wiring board that has been formed up to the outer layer pattern. 2 is a sectional view showing a state in which a solder resist is applied on the insulating layer, FIG. 3 is a perspective view of a stamping jig, and FIG. 4 is a state in which symbols (characters) are formed on the surface of the solder resist. FIG. 5 is a perspective view showing a state in which symbols (characters) are formed on the surface of the solder resist. However, in FIGS. 1, 2, 4 and 5, only the outermost wiring pattern and the insulating layer immediately below (outermost layer) are shown for the sake of simplicity. Other wiring layers and patterns are not shown. The same applies to other embodiments described later.

  In the method for manufacturing a wiring board according to the first embodiment, first, the surface of the substrate of the wiring board 10 (see FIG. 1) that has been formed up to the outermost wiring pattern 12 (precisely, the outermost layer including the wiring pattern 12). A process of applying a solder resist (layer) 13 by printing a thermosetting solder resist ink by screen printing on the surface of the insulating layer 11 (hereinafter the same in this specification) is performed as usual. FIG. 2 shows this state. Although illustration is omitted, it goes without saying that printing of solder resist ink does not print on the mounting lands or terminal portions of the electronic components.

  Next, a step of semi-drying or semi-curing the solder resist ink is performed. However, here, the ink is temporarily stopped after being semi-dried or semi-cured to such an extent that the self-leveling of the ink hardly occurs.

  Next, a stamping jig (pressure jig) 20 shown in FIG. 3 is prepared.

  The stamping jig 20 is made of metal, resin, or a composite material thereof, and has a symbol shape that is an inverted symbol obtained by inverting a symbol representing information to be displayed on the wiring board 10 at the tip 21 thereof. A portion 22 is formed. In FIG. 3, as an example of the symbol, an inverted symbol (so-called mirror image character) obtained by inverting the lot symbol “E” is formed in a convex shape. The symbol shape portion 22 has a shape similar to the letterpress printing type conventionally used for printing books and the like. The stamping jig 20 can be manufactured by a casting method or molding with a photo-curing resin, as in the case of letterpress printing.

  Next, a pressurizing step of pressurizing the tip 21 of the stamping jig 20 with a predetermined pressure is performed on the surface of the solder resist 13 that has been semi-dried or semi-cured. As shown in FIGS. 4 and 5, the pressure to be applied is such that the semi-cured solder resist 13 is depressed and the depth of the wiring pattern 12 of the wiring board 10 and the surface of the insulating layer 11 is not exposed. adjust.

  In this manner, after the surface of the solder resist 13 is processed into a concave shape in the shape of the symbol shape portion 22 of the stamping jig 20, a step of completely curing the solder resist 13 is performed. By this processing, information on the wiring board 10 is formed as a dent symbol (hereinafter referred to as a dent character) 14 on the surface of the solder resist 13 and can be read. Since the concave character 14 is concave, the conventional ink repelling, fading, and chipping problems do not occur. Further, since the stamping process is performed, ink bleeding does not occur, so that it is possible to easily form fine patterns, small characters, thin lines, etc., which were difficult with conventional printing.

  In general, many solder resist inks are colored transparent resin. Therefore, by forming the information on the wiring board 10 with the recessed characters 14 as in the first embodiment, if the ink thickness of that portion is reduced, the color of that portion becomes lighter, and the underlying insulating layer 11 and the wiring pattern 12 Since the color tone changes as more colors are reflected, the characters are easier to read than simply being indented.

  In the manufacturing method described above, the screen printing method is used as a method for forming the solder resist 13, but the solder resist 13 can be formed in exactly the same manner even when a photosensitive resin film is used.

  That is, a step of applying a photosensitive solder resist 13 to the substrate surface of the wiring board 10 (see FIG. 1) that has been formed up to the outermost wiring pattern 12 is performed (see FIG. 2).

  Next, a step of semi-exposing the solder resist 13 is performed. Then, stamping is performed on the semi-exposed surface of the solder resist 13 with a stamping jig 20 (see FIG. 3). That is, a step of pressurizing the stamping jig 20 with a predetermined pressure is performed. Thereafter, a step of performing re-exposure on the stamped solder resist 13 is performed, and then a step of developing and post-curing to completely cure the solder resist 13 is performed. By this processing, the information of the wiring board 10 is formed as the concave characters 14 on the surface of the solder resist 13 (see FIGS. 4 and 5) and can be read.

  By the way, the stamping process is not performed in the half-cured or half-exposure state of the solder resist 13 as described above, and is performed after the solder resist 13 is completely cured in the same manner as in a normal wiring board manufacturing process. May be.

  That is, a step of applying a thermosetting solder resist 13 to the surface of the substrate of the wiring board 10, a step of drying or curing the solder resist 13 after application, and a wiring on the surface of the dried or cured solder resist 13 You may make it implement the pressurization process pressurized with the stamping jig | tool 20 for forming the symbol showing the information of a board. Or the process of apply | coating the photosensitive solder resist 13 to the base-material surface of the wiring board 10, the process of exposing the solder resist 13 after application | coating, and the information of the wiring board 10 on the surface of the exposed solder resist 13 You may make it implement the pressurization process pressurized with the stamping jig | tool 20 for forming the symbol to represent, and the process which hardens the soldering resist 13 by performing image development and post-cure after pressurization.

  In this way, if the pressurizing step is performed after the solder resist is completely cured, the step of semi-drying or semi-curing the solder resist in the thermosetting solder resist forming step, or the photosensitive solder resist Since a process such as half-exposure of the solder resist in the forming process is not required, the manufacturing process can be simplified correspondingly, and thus the manufacturing efficiency can be improved.

  In this case, if the stamping jig 20 is incorporated in an outer shape mold used in the outer shape processing step and stamping is performed simultaneously with the outer shape processing, an increase in the manufacturing process can be suppressed, and as a result, the manufacturing efficiency is improved. Can be made.

  Here, for external machining, “one wiring board on the workpiece is removed by die machining and processed into a final finished wiring board shape.”, “A plurality of wiring boards on the workpiece. Are processed into molds in the final finished wiring board shape by die processing. "," A part of the outer shape of the wiring board arranged on the workpiece (for example, tolerance of parts with severe dimensional accuracy and burrs etc. Only a small portion) is processed. "," Make most of the outer shape of the wiring boards arranged on the workpiece, and connect the wiring board to the workpiece or kit frame with the remaining part. "There are many processes such as" cutting the part where the wiring board is connected to the workpiece or kit frame, and dividing it into individual pieces or kits. " Are collectively called external processing. That is, the stamping step can be performed in any processing step in such a wide variety of external shapes.

  However, depending on the content displayed on the solder resist, it may be necessary to perform before specific processing. For example, a product name may be used at any time, but in the case of an address mark indicating where a plurality of pieces are placed and manufactured in a processed workpiece, the piece is separated from the workpiece. It is necessary to display information on the surface of the solder resist (ie, perform a stamping step) before or before separating the workpiece from the kit.

  Regardless of whether the solder resist 13 is semi-cured or fully cured, when performing stamping, the tip 21 portion including at least the symbol-shaped portion 22 of the stamping jig 20 may be heated. By heating the symbol-shaped portion 22, the solder resist 13 is softened by heat and is easily deformed. Therefore, in combination with the pressure applied by the stamping jig 20, the concave character 14 is more effective on the surface of the solder resist 13. Can be formed clearly. Therefore, even a small character can be displayed in a legible manner.

  According to the first embodiment, a symbol such as a lot number, which is information on the wiring board 10, can be formed on the surface of the solder resist 13 without depending on silk printing or ink jet printing. Accordingly, problems such as ink repelling, blurring, and chipping do not occur as compared with the method of printing information on the surface of the solder resist by the screen printing method. In addition, it is possible to easily form fine patterns, thin lines, small characters, etc., which were difficult with conventional screen printing. In addition, in an ink jet printing method, ink is often repelled due to restrictions on the properties of the ink, and printed characters (silk characters) tend to be thicker than the screen printing method. For this reason, there is a problem that some of the raised silk characters are chipped or peeled off due to rubbing against or colliding with other objects during the handling of the wiring board 10 (for example, during transportation). According to the manufacturing method according to the above, such a problem does not occur.

  Further, when a symbol representing necessary information is formed on the surface of the solder resist 13 of the wiring board 10, the method according to the first embodiment and the conventional silk printing method can be used in combination. For example, information that is used regularly or has relatively little change, such as product name, part name, part rating, etc. required for work such as mounting components on a completed wiring board and repair work, etc., or forming information with relatively little change is formed by conventional silk printing. . On the other hand, information such as manufacturing process traces and manufacturing management in case of emergency, and information such as lot numbers, history management bar codes, QR codes, etc. whose contents change frequently are formed by the method of the first embodiment. It can be used properly.

[Embodiment 2]
According to the method for manufacturing a wiring board according to the first embodiment, the resin is in a state in which fluidity has been lost to some extent by forming a dent by applying pressure with the stamping jig 20 to semi-cured or semi-exposed. Information (symbols) are displayed and can be expressed in a fairly fine shape.

  However, even if the characters such as the lot number are too small, they are difficult to read with the naked eye, and there is no merit. Thus, Embodiment 2 is a device for making the characters formed in this way easier to read. That is, the second embodiment is a method in which the surface treatment and the shape of the symbol shape portion 22 of the stamping jig 20 are devised in the manufacturing method of the first embodiment. Hereinafter, the second embodiment will be described with reference to FIGS. 6 and 7. Will be explained.

  In the second embodiment, the surface of the symbol shape portion 22 of the stamping jig 20 has fine irregularities, for example, irregularities composed of fine parallel straight lines, as a device for surface treatment and shape of the symbol shape portion 22 of the stamping jig 20. (Hatch line), or a concavo-convex pattern 24 such as random concavo-convex or a constant texture is provided. FIG. 6A shows an example in which unevenness (hatching lines) composed of fine parallel straight lines are provided as a fine unevenness pattern.

  In this way, by providing the fine uneven pattern 24 on the surface of the symbol-shaped portion 22 of the stamping jig 20, the wiring board 10 after completion is formed on the surface of the solder resist 13 as shown in FIG. 6B. The concave and convex pattern 14a is reflected on the surface of the concave character 14 itself, and the character is hatched, or the character is more easily read in comparison with other parts that are finished with a satin or silky finish and have a glossy finish.

  Further, as another shape of the symbol shape portion 22, as shown in FIG. 7A, only the rim portion 22a of the symbol shape portion 22 may be formed in a bag character shape that is convex.

  By forming the symbol-shaped portion 22 into a bag character shape in which only the edge portion is convex, as shown in FIG. 7B, the recessed character 14 formed on the surface of the solder resist 13 after the stamp is formed on the film of the edge portion 14b. Only the thickness is formed thinner than the film thickness of other portions. In this case, since only the film thickness of the edge portion 14b of the recessed character 14 formed on the surface of the solder resist 13 is reduced, the outermost wiring pattern 12 and the insulating layer 11 of the wiring board 10 are not exposed. Moreover, since there are few dent parts compared with the case where the whole character is dented, possibility that the surface of a wiring board will be exposed by a stamp can also be reduced significantly. In addition, since human eyes and optical sensors have high differential characteristics, characters are easier to read than simple outline characters.

  In addition, by using the manufacturing method of the first and second embodiments, the feature that can be expressed to a very fine shape is more actively used, and the information displayed on the surface of the wiring board 10 is not normal characters or marks. A barcode or QR code that can be linked with manufacturing information may be formed. In this specification, these bar codes and QR codes can also be handled as symbols.

[Embodiment 3]
Embodiment 3 is an embodiment in which concave portions for information characters are formed on the surface of a soreda resist by using a method other than stamping.

  That is, the method for manufacturing a wiring board according to the third embodiment includes a solder resist forming process for forming a solder resist on the substrate surface of the wiring board, and a process from the execution of the solder resist forming process to the completion of the outer shape processing. A symbol forming step of forming a symbol representing information on the wiring board on the surface of the solder resist, and the symbol forming step is performed by performing a cutting step of scraping the surface of the solder resist into the shape of the symbol to be formed . In this way, by scraping the surface of the solder resist, as in the case of the first embodiment, as shown in FIGS. 4 and 5, the concave characters 14 that are information of the wiring board 10 are formed on the surface of the solder resist 13. be able to.

  The cutting process for scraping the surface of the solder resist 13 may be performed in an arbitrary process after the solder resist formation process is performed and until the outer shape processing is completed (that is, until the final outer shape processing is performed). This increases the degree of freedom in the manufacturing process.

  Here, as described in the first embodiment, there are a great many cases of the external shape processing. In the third embodiment, the cutting process of scraping the surface of the solder resist can be performed in any process in such a wide variety of external shapes. However, depending on the content displayed on the solder resist, it may be necessary to perform before specific processing. For example, a product name may be used at any time, but in the case of an address mark indicating where a plurality of pieces are placed and manufactured in a processed workpiece, the piece is separated from the workpiece. It is necessary to display information on the surface of the solder resist before the work is separated from the workpiece into the kit (that is, a cutting process for scraping the surface of the solder resist is performed).

  Further, the depth at which the surface of the solder resist is scraped in the cutting process is set to a depth at which the surface of the outermost insulating layer 11 including the wiring pattern 12 (substrate surface of the wiring board) is not exposed. By limiting to such a depth, the possibility that the surface of the insulating layer 11 including the wiring pattern 12 is exposed can be reduced. That is, the performance of insulation of the conductor pattern layer and protection of the base material, which are the original purposes of the solder resist, are not impaired.

  Here, in the cutting process, the surface of the solder resist can be scraped off using an NC-controlled end mill processing device, a sand blasting device, or a liquid honing device. Thus, by using an end mill processing device, a sand blasting device, or a liquid honing device, it becomes possible to scrape even fine characters accurately.

  In addition, what is necessary is just to select suitably according to the method used for surface grinding whether the cutting process which scrapes off the surface of a soldering resist is performed by the semi-hardened state of a solid resist, or a completely hardened state.

  Further, as another method for producing a printed wiring board according to Embodiment 3, the cutting step is a step of forming a processing resist on the solder resist having an opening in the shape of a symbol displayed on the surface of the solder resist; A structure including a step of polishing an opening not covered with a processing resist by a mechanical polishing process such as sandblasting or liquid honing or a chemical polishing process using an alkaline solution, and a step of removing the processing resist after polishing. can do. This makes it possible to directly form a symbol on the surface of the solder resist without using NC-controlled sandblasting or end milling. In this way, by polishing the solder resist in the opening not covered with the processing resist by mechanical polishing processing such as sandblasting or liquid honing or chemical polishing processing with an alkaline solution, it is possible to accurately scrape even fine characters. It becomes possible.

[Embodiment 4]
In the fourth embodiment, as in the third embodiment, the thickness of the solder resist is basically changed to form a symbol as information on the wiring board on the surface of the solder resist. However, the thickness of the solder resist is changed. In this example, a technique different from that of the third embodiment is used.

  That is, the method for manufacturing a wiring board according to the fourth embodiment includes a solder resist forming step of forming a solder resist on the substrate surface of the wiring board, and the solder resist forming step forms a symbol representing information on the wiring board. A solder resist ink is applied to the surface of the wiring board by using a screen plate formed so that a symbol forming region for forming the symbol is formed and a permeation amount of the ink in the symbol forming region is limited as compared with other regions. It consists of a printing step for printing, a step for leveling the printed solder resist ink, and a step for curing the solder resist ink after leveling.

  According to the manufacturing method of the fourth embodiment, the solder resist is screen-printed using a screen plate in which the amount of ink transmitted in the symbol-shaped region is limited, and then the leveling is performed to form a symbol on the surface of the solder resist. is doing. In other words, simply by devising the shape of the screen plate, the conventional screen printing method can be applied as it is to form a symbol on the surface of the solder resist, so the manufacturing cost of the wiring board for forming the symbol on the surface of the solder resist Can be suppressed at low cost.

  In the fourth embodiment, the screen plate is formed by forming an emulsion layer on a stainless steel or Tetoron cocoon for screen printing (weaving the yarn material from the cocoon), and the emulsion is formed in the symbol shape region. By forming the layer into a dither pattern that is an independent dot or a collection of dots, the amount of ink transmitted can be limited. Thereby, a concave symbol can be easily and reliably formed on the surface of the solder resist.

  8A to 8D are explanatory views showing each step of the manufacturing method according to the fourth embodiment.

  That is, as shown in FIG. 8A, the screen plate 31 is positioned and placed on the surface of the insulating layer 11 on which the wiring pattern 12 is formed, and the solder resist ink 13 a is applied thereon using the squeegee 32. Apply evenly as it stretches. In the figure, a portion indicated by reference numeral 34 is a symbol-shaped region of the screen plate 31, and the emulsion layer 35 is formed in an independent dot or dither pattern.

  FIG. 8B is a diagram showing an ideal state immediately after the solder resist ink 13a is printed by the screen printing method. As described above, the concave character 15 portion of the solder resist 13 corresponding to the symbol shape region 34 of the screen plate 31 is basically the solder resist ink 13a extracted in the shape of the symbol, and within the extracted portion. The ink 13a1 is finely printed in a dot shape.

  However, in reality, the solder resist ink 13a has fluidity, and this is not an ideal state. It flows somewhat or the dots are small, so that the solder resist ink 13a bleeds, as shown in FIG. 8C. The dot-like ink 13a1 is in a smooth state 13b. In the fourth embodiment, the leveling of the resist ink 13a is performed until such a state is reached. Thereafter, by curing the resist ink 13 a, information on the wiring board to be displayed can be formed as concave characters (dent symbols) 15 on the surface of the solder resist 13.

  The degree of leveling and the amount of dents in the resist inks 13a and 13b can be controlled by the time and temperature required for leveling, the mesh of the screen plate 31, the dot size without emulsion, or the viscosity and thixotropy of the ink itself. In this leveling, at least a difference in thickness between the recessed character 15 and the other portion is maintained, and the surface of the substrate of the wiring board 10 is not exposed in the recessed character 15 portion, so that it functions as a resist. This is performed until the surface (surface protection, solder adhesion prevention, etc.) can be exhibited. As a specific example, for example, leveling is performed by holding for about 5 to 15 minutes at an arbitrary temperature within a temperature range from room temperature to about 50 degrees.

  Further, if the dot state of the ink 13a1 is positively left at the time of the leveling, as shown in FIG. 8D, a pattern 15a such as fine unevenness is formed on the surface of the concave character 15 itself formed on the surface of the solder resist 13. You can also make it easier to see.

  The screen plate may be a metal mask plate, and the symbol-shaped region 34 may be formed thicker or thinner than other regions to limit the amount of ink transmitted. Also in this case, the concave character 15 shown in FIG. 8C or FIG. 8D can be easily and reliably formed on the surface of the solder resist.

[Embodiment 5]
In the fifth embodiment, as in the fourth embodiment, the thickness of the solder resist is basically changed to form a symbol as information on the wiring board on the surface of the solder resist. And an embodiment using a resin film. Even when a photosensitive ink or resin film is used, a concave character can be formed on the surface of the solder resist by a process substantially similar to that of the fourth embodiment.

  In this case, the symbol shape portion of the photo tool used for exposure is shaded with fine independent dots or a dither pattern, or in the case of a resin film, the sensitivity of the symbol shape portion is controlled to be half. Tones should be used. As a result, the solder resist of the symbol-shaped portion can be formed thinner than the other portions, and the unevenness of the surface of the symbol (character) itself can be controlled.

  That is, the method for manufacturing a wiring board according to the fifth embodiment includes a solder resist forming step of forming a solder resist on the substrate surface of the wiring board, and the solder resist forming step is photosensitive on the substrate surface of the printed wiring board. A step of applying the solder resist, a step of exposing the applied solder resist using a photo tool, and a step of developing and post-curing after exposure, wherein the photo tool includes a printed wiring board. A symbol shape region for forming a symbol representing information is formed in a shape capable of changing the thickness of the solder resist with respect to another region.

  Hereinafter, the method for manufacturing the wiring board according to the fifth embodiment will be specifically described.

  9A to 9E are explanatory views (cross-sectional views) showing respective steps of the manufacturing method according to the fifth embodiment for manufacturing a wiring board using photosensitive ink or a resin film.

  FIG. 9A shows a state of the wiring board 10 in which the outermost wiring pattern 12 is formed on the outermost insulating layer 11.

  In FIG. 9B, a photosensitive resist is applied (or a resin film is placed) on the surface of the insulating layer 11 on which the wiring pattern 12 shown in FIG. 9A is formed, and a solder resist 13A is provided. Indicates the state.

  Thereafter, as shown in FIG. 9C, the phototool 40 in which the symbol-shaped region 44 is formed in a halftone or dither pattern such as independent dots is placed in alignment on the solder resist 13A and exposed from above. The process of performing is performed. As shown in FIG. 9C, an emulsion layer 45 is formed in an independent dot or dither pattern in the symbol shape region 44 of the phototool 40.

  However, the photo tool 40 is not such an independent dot or dither pattern, but is not shown, but the symbol-shaped region 44 is formed in a halftone with a lower or higher halftone than the other regions. The exposure may be performed using a photo tool. Whether to use a photo tool formed in a halftone whose symbol shape region 44 has a lower transparency than other parts or a photo tool formed in a high half tone, whether a positive type is used as a photosensitive solder resist Depending on whether the negative type is used, it may be appropriately selected. That is, in order to increase the light transmittance of the symbol shape region 44 portion, a photo tool formed in a halftone in which the transmittance of the symbol shape region 44 is higher than that of the other portions is used. In order to reduce the transmittance, a photo tool formed in a halftone in which the transmittance of the symbol-shaped region 44 is lower than that of other portions may be used.

  FIG. 9D is a diagram showing an ideal state of the solder resist 13A immediately after completion of the exposure process, and a concave character (dent symbol) 15 portion on the surface of the solder resist 13A corresponding to the symbol shape region 44 of the phototool 40. The solder resist 13A1 is finely formed in a dot shape.

  Thereafter, the solder resist 13A is completely cured through a development step and a post-cure step (heat aging for stabilizing the material by stress relaxation). As a result, as shown in FIG. 9E, information on the wiring board can be formed as concave characters (dent symbols) 15 on the surface of the solder resist 13.

  According to the fifth embodiment, the dent character 15 can be formed on the surface of the solder resist 13 by simply applying the photo tool 40 and applying the conventional photo printing method as it is, so that the dent character 15 can be formed on the surface of the solder resist 13. The manufacturing cost of the wiring board for forming the film can be reduced at a low cost.

[Embodiment 6]
As in the first to fifth embodiments, the sixth embodiment is basically an embodiment in which the thickness of the solder resist is changed to form a symbol that is information on the wiring board on the surface of the solder resist. 5 is an embodiment in which the symbol is formed by reducing the thickness of the solder resist, whereas Embodiment 6 is an embodiment in which the symbol is formed by increasing the thickness of the solder resist.

  That is, the method for manufacturing a wiring board according to the sixth embodiment includes a step of applying a solder resist to the substrate surface of the wiring board, a step of semi-drying or semi-curing the solder resist after application, and semi-drying or semi-curing. A surface of the solder resist, and a step of further applying a solder resist to a symbol-shaped region that forms a symbol representing information on the wiring board, and a step of curing the solder resist after coating, In the part formed by overlapping the solder resist, the color tone is different from the part not formed by overlapping.

  More specifically, as in the first embodiment, the solder resist ink is printed by screen printing on the substrate surface of the wiring board 10 that has been formed up to the wiring pattern 12 of the outermost layer as before, 13B is formed. This state is the same as in FIG. 2, and it goes without saying that printing is not performed on the mounting lands or terminal portions of the electronic components.

  Next, the solder resist ink is brought into a dry state (touched with a finger so as not to leave a trace).

  Next, a solder resist 13C is further applied by screen printing on the surface of the solder resist 13B where a symbol representing information on the wiring board 10 is to be formed. This state is shown in FIG.

  When a photosensitive resist is used as the upper layer solder resist 13C, the solder resist 13B is once formed, developed and cured, and then a layer of the photosensitive solder resist 13C is formed thereon. Then, after using a photo tool (not shown) to expose a portion for forming a symbol representing information on the wiring board 10, development and curing may be performed again.

  As a result, as shown in FIG. 11, convex symbols (for example, convex English letters E in English) 16 representing information on the wiring board 10 are formed on the surface of the solder resist 13B.

  According to the sixth embodiment, a solder resist of the same kind is further formed on the surface of the solder resist surface formed first, where the symbol representing the information on the wiring board 10 is formed, and a convex symbol (character ) Is formed. That is, it is a structure in which the same solder resist is formed in a double layer, and since it is not a combination of different materials such as solder resist and silk ink as in the past, problems such as ink repelling, fading, and peeling due to insufficient adhesion occur. There is no. Therefore, even if a slight impact is applied to the convex symbol part from the outside, there is no fear of easy chipping or peeling off, so that the symbol (character) part will change and become difficult to read even after many years of use. There is no worry.

  In addition, the wiring board manufactured using the manufacturing method of Embodiment 1-6 changes the thickness of a solder resist, a color tone, and a surface state, and the information of a wiring board is easily and clearly on the surface of a solder resist. Formed (displayed).

10 Printed wiring board (wiring board)
DESCRIPTION OF SYMBOLS 11 Insulating layer 12 Wiring pattern 13, 13A, 13B, 13D, 13D Solder resist 13a Solder resist ink 13a1 Dot ink 13b Ink smooth state 13A1 Solder resist (dot shape)
14, 15 dent character (dent symbol)
15a Pattern 16 Convex symbol (convex English letter)
20 Stamping jig (Pressure jig)
21 Tip 22 Symbol Shape 22a Border 24 Concave Pattern 31 Screen Plate 32 Squeegee 34 Symbol Shape Region 35 Emulsion Layer 40 Photo Tool 44 Symbol Shape Region 45 Emulsion Layer

Claims (23)

A method of manufacturing a printed wiring board,
In the process of forming the solder resist on the substrate surface of the printed wiring board, the method includes forming a symbol representing information of the printed wiring board on the surface of the solder resist by changing the thickness of the solder resist. A method for manufacturing a printed wiring board. It is a manufacturing method of the printed wiring board according to claim 1,
Applying a thermosetting solder resist to the surface of the substrate of the printed wiring board;
A step of semi-drying or semi-curing the solder resist after coating;
A pressurizing step of applying pressure to the surface of the solder resist that has been semi-dried or semi-cured with a pressurizing jig for forming a symbol representing information of the printed wiring board;
And a step of curing the solder resist after the pressurization. It is a manufacturing method of the printed wiring board according to claim 1,
Applying a photosensitive solder resist to the substrate surface of the printed wiring board;
Semi-exposure of the solder resist after coating;
A pressurizing step of pressurizing with a pressurizing jig for forming a symbol representing information of the printed wiring board on the surface of the solder resist that has been semi-exposed,
Reexposing the solder resist after pressurization;
And a step of curing the solder resist by developing and post-curing after re-exposure, and a method for producing a printed wiring board. It is a manufacturing method of the printed wiring board according to claim 1,
Applying a thermosetting solder resist to the surface of the substrate of the printed wiring board;
Drying or curing the solder resist after coating;
A pressurizing step of applying pressure to the surface of the dried or hardened solder resist with a pressurizing jig for forming a symbol representing the information of the printed wiring board. Method. It is a manufacturing method of the printed wiring board according to claim 1,
Applying a photosensitive solder resist to the substrate surface of the printed wiring board;
Exposing the solder resist after coating; and
A pressurizing step of pressurizing the exposed surface of the solder resist with a pressurizing jig for forming a symbol representing information of the printed wiring board;
And a step of curing the solder resist by performing development and post-cure after pressing, and a method for producing a printed wiring board. A method for manufacturing a printed wiring board according to any one of claims 2 to 5,
In the pressurizing step, pressurization is performed in a state in which a portion of the pressurizing jig that contacts the solder resist is heated. A method for manufacturing a printed wiring board according to any one of claims 2 to 5,
The method of manufacturing a printed wiring board, wherein the pressurizing jig is formed such that a reversal symbol obtained by reversing a symbol displayed on the surface of the solder resist is convex. A method for manufacturing a printed wiring board according to any one of claims 2 to 5,
The method of manufacturing a printed wiring board, wherein the pressurizing jig is formed such that an inverted symbol obtained by inverting a symbol to be displayed on the surface of the solder resist has a convex shape only at the edge. A method for manufacturing a printed wiring board according to claim 7 or claim 8,
The surface of the inversion symbol is unevenly formed in a fine parallel line shape, a fine random shape, or other textured shape, and the surface of the symbol portion formed on the surface of the solder resist after pressurization is fine streaks. A method for producing a printed wiring board, characterized in that the printed wiring board is formed into a concavo-convex shape, a fine random concavo-convex shape, or other texture. A method for manufacturing a printed wiring board according to any one of claims 2 to 9,
A method for manufacturing a printed wiring board, wherein the pressurizing jig is provided in an outer shape processing mold, and the pressing step is performed simultaneously with the outer shape processing. It is a manufacturing method of the printed wiring board according to claim 1,
A solder resist forming step of forming a solder resist on the surface of the substrate of the printed wiring board;
A symbol forming step of forming a symbol representing information of the printed wiring board on the surface of the solder resist in a step until the outer shape processing is completed after the solder resist forming step is performed;
The method of manufacturing a printed wiring board, wherein the symbol forming step is a cutting step of scraping the surface of the solder resist into a shape of the symbol to be formed. It is a manufacturing method of the printed wiring board according to claim 11,
The said cutting process is a process of forming a level | step difference in the depth which the base-material surface of the said printed wiring board containing a wiring pattern is not exposed, The manufacturing method of the printed wiring board characterized by the above-mentioned. It is a manufacturing method of the printed wiring board according to claim 11 or 12,
In the cutting process, the surface of the solder resist is scraped off using an NC-controlled end mill processing device, a sand blasting device, or a liquid honing device. It is a manufacturing method of the printed wiring board according to claim 11 or 12,
The cutting process includes
Forming a processing resist having an opening in the shape of a symbol displayed on the surface of the solder resist on the solder resist;
Polishing the solder resist in the opening not covered with the processing resist by a mechanical polishing process or a chemical polishing process;
And a step of removing the processing resist after polishing. It is a manufacturing method of the printed wiring board according to claim 1,
Provided with a solder resist forming step of forming a solder resist on the surface of the substrate of the printed wiring board,
The solder resist forming step includes
Using a screen plate formed so that a symbol-shaped region for forming a symbol representing information of the printed wiring board is provided, and the amount of ink permeation of the symbol-shaped region is limited from other regions, A printing step of printing a solder resist ink on the substrate surface of the printed wiring board;
Leveling the printed solder resist ink; and
And a step of curing the solder resist ink after leveling. It is a manufacturing method of the printed wiring board according to claim 15,
The screen plate is formed by forming an emulsion layer on a stainless steel or tetron cage for screen printing, and by forming the emulsion layer into independent dots or dither patterns in the symbol-shaped region, the amount of ink transmitted A method of manufacturing a printed wiring board, characterized in that It is a manufacturing method of the printed wiring board according to claim 15,
The method of manufacturing a printed wiring board, wherein the screen plate is a metal mask plate, and the amount of ink permeation is limited by forming the symbol-shaped region thicker or thinner than other regions. It is a manufacturing method of the printed wiring board according to claim 1,
Provided with a solder resist forming step of forming a solder resist on the surface of the substrate of the printed wiring board,
The solder resist forming step includes
Applying a photosensitive solder resist to the substrate surface of the printed wiring board;
Exposing the applied solder resist using a photo tool;
A step of performing development and post-cure after exposure,
In the phototool, a symbol-shaped region for forming a symbol representing information of the printed wiring board is formed in a shape capable of changing the thickness of the solder resist relative to other regions. A method for manufacturing a printed wiring board. It is a manufacturing method of the printed wiring board according to claim 18,
The method of manufacturing a printed wiring board, wherein the photo tool has the symbol-shaped region formed into fine dots or dither patterns. It is a manufacturing method of the printed wiring board according to claim 18,
The method for manufacturing a printed wiring board, wherein the phototool is formed in a halftone in which the transparency of the symbol-shaped region is lower than that in other regions or a higher halftone. It is a manufacturing method of the printed wiring board according to claim 1,
Applying a solder resist to the surface of the substrate of the printed wiring board;
A step of semi-drying or semi-curing the solder resist after coating;
A step of further applying a solder resist to a symbol-shaped region that is a semi-dried or semi-cured surface of the solder resist and forms a symbol representing information of the printed wiring board;
And a step of curing the solder resist after coating. It is a manufacturing method of the printed wiring board according to claim 21,
A method for producing a printed wiring board, wherein a portion where the solder resist is overlapped is different from a portion where the color tone is not overlapped.   A printed wiring board manufactured using the method for manufacturing a printed wiring board according to any one of claims 1 to 22.

Images